CN116787623A - Silicon wafer cutting fluid recovery system and method - Google Patents

Abstract

The application relates to a silicon wafer cutting fluid recovery system and a method. The silicon wafer cutting fluid recovery system comprises a control unit, a wastewater filter pressing unit, a water quality adjusting unit and a clear fluid recycling unit, wherein the water quality adjusting unit comprises a clear fluid tank, a water supplementing module and a new cutting fluid supplementing module, wherein the water supplementing module and the new cutting fluid supplementing module are used for respectively conveying pure water and new cutting fluid to the clear fluid tank; the waste water filter-pressing unit is used for conveying filter-pressing water formed after filter-pressing the cutting waste liquid to the clear liquid tank; the control unit comprises an acquisition module arranged in the clear liquid tank, and a control module in communication connection with the acquisition module, the waste water filter pressing unit, the water supplementing module and the new cutting liquid supplementing module, wherein the control module sequentially controls the water supplementing module, the new cutting liquid supplementing module and the waste water filter pressing unit to start and stop transfusion according to the liquid level of the liquid in the clear liquid tank acquired by the acquisition module; the clear liquid recycling unit is used for conveying clear liquid water prepared in the clear liquid tank to the cutting equipment. The three liquids are prepared into clear water according to the proportion and then are conveyed to cutting equipment, so that the proportion of components in the clear water after each cycle is consistent.

Description

Silicon wafer cutting fluid recovery system and method

Technical Field

The application relates to the technical field of monocrystalline silicon slicing, in particular to a silicon wafer cutting fluid recovery system and method.

Background

When the photovoltaic industry or the semiconductor industry carries out slicing operation on a silicon wafer, a large amount of cutting fluid waste water can be generated, the waste of the cutting fluid can be caused by direct discharge, and the environment pollution can be caused.

The current silicon wafer cutting fluid recovery process mainly comprises the following steps: and the clear liquid tank is used for supplying clear liquid water obtained by mixing the filter pressing water, the pure water and the new cutting liquid to the workshop for cutting and recycling.

However, the proportion of components in clear water formed by each cycle in the cycle process is difficult to be consistent, and the formation of clear water is easily influenced by the water consumption of workshops; when the water consumption of a workshop machine is small, the amount of the cutting waste liquid is small, so that the amount of the filter pressing water supplied to the clear liquid tank is reduced, the content of new cutting liquid in the finally formed clear liquid is relatively high, and the fluctuation of the cutting yield is easy to cause; when the water consumption of the workshop machine is large, the amount of the formed cutting waste liquid is large, so that the amount of the filter pressing water supplied to the clear liquid tank is increased, the content of the new cutting liquid in the finally formed clear liquid is relatively low, and the wire breakage rate is easy to rise.

Disclosure of Invention

Based on the above, it is necessary to provide a silicon wafer cutting fluid recovery system and method for solving the problem that the component ratio of clear water formed in each cycle is difficult to be consistent.

The silicon wafer cutting fluid recovery system comprises a control unit, a wastewater filter pressing unit, a water quality adjusting unit and a clear liquid recycling unit, wherein:

the waste water filter pressing unit is used for forming filter pressing water after waste water is cut in a filter pressing workshop and conveying the filter pressing water to the water quality adjusting unit;

the water quality adjusting unit comprises a clean liquid tank communicated with the wastewater filter pressing unit, a water supplementing module communicated with the clean liquid tank and a new cutting liquid supplementing module, wherein the water supplementing module is used for conveying pure water stored by the water supplementing module to the clean liquid tank, the new cutting liquid supplementing module is used for conveying new cutting liquid stored by the water supplementing module to the clean liquid tank, and the pure water, the new cutting liquid and the filter pressing water in the clean liquid tank are mixed to form clean liquid;

the control unit comprises a control module and an acquisition module arranged in the clear liquid tank, wherein the acquisition module is used for acquiring the liquid level of liquid in the clear liquid tank, the control module is in communication connection with the acquisition module, the waste water filter pressing unit, the water supplementing module and the new cutting liquid supplementing module, and the control module sequentially controls the water supplementing module, the new cutting liquid supplementing module and the waste water filter pressing unit to start and stop transfusion according to the liquid level;

one end of the clear liquid recycling unit is communicated with the clear liquid tank, and the other end of the clear liquid recycling unit is communicated with workshop cutting equipment and is used for conveying clear liquid water to the cutting equipment.

In one embodiment, the clear liquid recycling unit comprises a clear liquid inlet pipe, a buffer tank, a clear liquid return pipe and a water inlet pump, wherein two ends of the clear liquid inlet pipe are respectively communicated with the clear liquid tank and the buffer tank, two ends of the clear liquid return pipe are respectively communicated with the buffer tank and the cutting equipment, and the water inlet pump is arranged on the clear liquid inlet pipe.

In one embodiment, the control unit comprises an online detection module, the online detection module is arranged in the clean liquid tank and is in communication connection with the control module, the online detection module is used for monitoring the water quality index of the clean liquid water, and the control module controls the start and stop of the clean liquid recycling unit according to the water quality index after the waste water filter pressing unit stops transfusion.

In one embodiment, the wastewater filter-pressing unit comprises a wastewater collection tank, a filter-pressing module and a transmission module, wherein the wastewater collection tank, the filter-pressing module and the transmission module are sequentially communicated, the transmission module is communicated with the clear liquid tank and is in communication connection with the control module, the filter-pressing module is used for filter-pressing the wastewater after cutting the wastewater in the wastewater collection tank, and the transmission module is used for conveying the filter-pressing water in the filter-pressing module to the clear liquid tank.

In one embodiment, the filter pressing module comprises a first conveying pipe, a filter pressing tank and a filter press, wherein two ends of the first conveying pipe are respectively communicated with the waste liquid collecting tank and the filter pressing tank, and the filter press is arranged on the first conveying pipe.

In one embodiment, the filter pressing module further comprises a dirty water tank and a second conveying pipe, the dirty water tank is arranged between the waste liquid collecting tank and the filter press, two ends of the second conveying pipe are respectively communicated with the waste liquid collecting tank and the dirty water tank, and two ends of the first conveying pipe are respectively communicated with the dirty water tank and the filter pressing tank.

In one embodiment, the conveying module comprises a third conveying pipe and a first conveying pump, two ends of the third conveying pipe are respectively communicated with the filter pressing module and the clear liquid tank, and the first conveying pump is arranged on the third conveying pipe and is in communication connection with the control module.

In one embodiment, the water replenishing module comprises a pure water tank, a pure water pipe and a second delivery pump, wherein two ends of the pure water pipe are respectively communicated with the pure water tank and the clear liquid tank, and the second delivery pump is arranged on the pure water pipe and is in communication connection with the control module.

In one embodiment, the new cutting fluid supplementing module comprises a fluid supplementing tank, a fluid supplementing pipe and a third conveying pump, wherein two ends of the fluid supplementing pipe are respectively communicated with the fluid supplementing tank and the clear fluid tank, and the third conveying pump is arranged on the fluid supplementing pipe and is in communication connection with the control module.

According to the silicon wafer cutting fluid recovery system, the control module is arranged to control the water supplementing module to convey pure water according to the liquid level in the clean fluid tank fed back by the acquisition module, and then sequentially control the water infusion of the new cutting fluid supplementing module and the waste water filter pressing unit after the pure water level reaches a set value, so that the pure water, the filter pressing water and the new cutting fluid are configured according to the set proportion, and after the three are configured according to the set proportion to form clean fluid, the clean fluid is conveyed to the cutting equipment by the clean fluid recycling unit. Through the arrangement, the pure water, the new cutting fluid and the filter pressing water in the prior art are continuously and dynamically input to the cutting equipment, the three fluids are configured according to the set proportion to form clear water and then are conveyed to the cutting equipment, and the consistency of the proportion of three components in the clear water after each circulation is realized conveniently.

The application also provides a recovery method of the silicon wafer cutting fluid recovery system, which comprises the following steps:

the acquisition module acquires the liquid level of the liquid in the clear liquid tank and transmits the liquid level to the control module;

the control module sequentially controls the water supplementing module, the new cutting fluid supplementing module and the wastewater filter pressing unit according to the liquid level to convey the pure water, the new cutting fluid and the filter pressing water stored by the control module to the clear liquid tank according to preset amounts in a one-to-one correspondence manner;

and the clear liquid recycling unit conveys clear liquid water formed by mixing the pure water, the new cutting liquid and the filter pressing water in the clear liquid tank to the cutting equipment.

According to the recovery method based on the silicon wafer cutting fluid recovery system, the step S1 is performed, the collection module collects the liquid level of the liquid in the clean liquid tank and transmits the liquid level to the control module; the control module in the step S2 is convenient to control the water supplementing module to convey pure water to the clear liquid tank according to the liquid level, and control the new cutting liquid supplementing module to convey new cutting liquid to the clear liquid tank according to the preset amount after the pure water level reaches a set value, and then control the waste water filter pressing unit to convey filter pressing water to the clear liquid tank according to the preset amount, so that the pure water, the filter pressing water and the new cutting liquid are configured according to the set proportion; and then, the clear liquid recycling unit is utilized to prepare the pure water, the filter-pressed water and the new cutting fluid in the clear liquid tank according to a set proportion to form clear liquid water, and the clear liquid water is conveyed to the cutting equipment. Through the arrangement, the pure water, the new cutting fluid and the filter pressing water in the prior art are continuously and dynamically input to the cutting equipment, the three fluids are configured according to the set proportion to form clear water and then are conveyed to the cutting equipment, and the consistency of the proportion of three components in the clear water after each circulation is realized conveniently.

Drawings

FIG. 1 is a schematic diagram of a silicon wafer cutting fluid recovery system provided by the application.

Fig. 2 is a schematic diagram of a recovery method based on a silicon wafer cutting fluid recovery system according to the present application.

Wherein:

10. a silicon wafer cutting fluid recovery system; 20. a workshop;

100. a waste water filter pressing unit; 110. a waste liquid collecting tank; 120. a filter pressing module; 121. a first transfer tube; 122. a filter pressing tank; 123. a filter press; 124. a dirty water tank; 125. a second transfer tube; 130. a transfer module; 131. a third transfer tube;

200. a water quality adjusting unit; 210. a clear liquid tank; 220. a water supplementing module; 221. a pure water tank; 222. a pure water pipe; 230. a new cutting fluid replenishment module; 231. a liquid supplementing tank; 232. a fluid supplementing pipe;

300. clear liquid recycling unit; 310. a clear liquid inlet pipe; 320. a buffer tank; 330. and a clear liquid return pipe.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1, fig. 1 shows a schematic diagram of a silicon wafer cutting fluid recovery system 10 according to an embodiment of the present application, where the silicon wafer cutting fluid recovery system 10 according to an embodiment of the present application includes a control unit, a wastewater filter pressing unit 100, a water quality adjusting unit 200, and a clear liquid recycling unit 300, which are sequentially connected, wherein:

the waste water filter-pressing unit 100 is used for forming filter-pressing water after cutting waste liquid in a filter-pressing workshop and conveying the filter-pressing water to the water quality adjusting unit 200, when the device is specifically arranged, the cutting waste liquid generated after the cutting equipment of the workshop 20 is used is conveyed to the waste water filter-pressing unit 100 through a pipeline, the waste water filter-pressing unit 100 is used for filter-pressing the cutting waste liquid to realize solid-liquid separation of silicon powder and liquid, and the separated filter-pressing water is conveyed to the water quality adjusting unit 200;

the water quality adjusting unit 200 comprises a clear liquid tank 210 communicated with the wastewater filter pressing unit 100, a water supplementing module 220 communicated with the clear liquid tank 210 and a new cutting liquid supplementing module 230, wherein the water supplementing module 220 is used for conveying pure water stored in the water supplementing module to the clear liquid tank 210, the new cutting liquid supplementing module 230 is used for conveying new cutting liquid stored in the water supplementing module to the clear liquid tank 210, and pure water, new cutting liquid and filter pressing water in the clear liquid tank 210 are mixed to form clear liquid water; in a specific setting, the wastewater filter-pressing unit 100 conveys filter-pressing water to the clear liquid tank 210, and through the setting, the filter-pressing water conveyed to the clear liquid tank 210 and pure water are diluted and mixed with the new cutting liquid conveyed to the clear liquid tank 210 to form clear liquid water;

the control unit comprises a control module and an acquisition module arranged in the clean liquid tank 210, wherein the acquisition module is used for acquiring the liquid level of the liquid in the clean liquid tank 210, the control module is in communication connection with the acquisition module, the waste water filter pressing unit 100, the water supplementing module 220 and the new cutting liquid supplementing module 230, and the control module sequentially controls the water supplementing module 220, the new cutting liquid supplementing module 230 and the waste water filter pressing unit 100 to start and stop transfusion according to the liquid level; in a specific operation, a first preset value, a second preset value and a third preset value are set in the control module, wherein the first preset value is a liquid level value required by supplementing pure water, the second preset value is a total value of supplementing pure water and supplementing new cutting fluid, the third preset value is a total value required by supplementing pure water, supplementing new cutting fluid and supplementing filter pressing water, the clear liquid tank 210 is a space-time priority control water supplementing module 220 for delivering pure water to the clear liquid tank 210 and judging whether the input amount of the pure water reaches the first preset value according to the liquid level fed back by the acquisition module, and stopping inputting the pure water when the first preset value is reached; then controlling the new cutting fluid supplementing module 230 to deliver new cutting fluid to the clear fluid tank 210, judging whether the fluid in the tank reaches a second preset value according to the fluid level fed back by the collecting module, and stopping inputting the new cutting fluid when the fluid reaches the second preset value; controlling the wastewater filter-pressing unit 100 to convey filter-pressing water to the clear liquid tank 210, judging whether the liquid in the tank reaches a third preset value according to the liquid level fed back by the acquisition module, and stopping inputting the filter-pressing water when the liquid reaches the third preset value, so that the three components of pure water, filter-pressing water and new cutting liquid are configured according to the set proportion;

one end of the clear liquid recycling unit 300 is communicated with the clear liquid tank 210, the other end of the clear liquid recycling unit 300 is communicated with the cutting equipment of the workshop 20, and the clear liquid recycling unit 300 is used for conveying the clear liquid water prepared in the clear liquid tank 210 to the cutting equipment. In a specific setting, after the pure water, the press filtration water and the new cutting fluid in the clean fluid tank 210 are configured according to a set proportion to form clean fluid, the clean fluid recycling unit 300 conveys the clean fluid to the cutting device.

According to the silicon wafer cutting fluid recovery system 10, the control module is arranged to control the water supplementing module 220 to convey pure water according to the liquid level in the clear fluid tank 210 fed back by the collecting module, and sequentially control the new cutting fluid supplementing module 230 and the waste water filter pressing unit 100 to convey after the pure water level reaches a set value, so that the pure water, the filter pressing water and the new cutting fluid are configured according to a set proportion, clear fluid is formed by the three configurations according to the set proportion, and then the clear fluid is conveyed to the cutting equipment by the clear fluid recycling unit 300. Through the arrangement, the pure water, the new cutting fluid and the filter pressing water in the prior art are continuously and dynamically input to the cutting equipment, the three fluids are configured according to the set proportion to form clear water and then are conveyed to the cutting equipment, and the consistency of the proportion of three components in the clear water after each circulation is realized conveniently.

In order to ensure that the proportion of the clear water input to the cutting device is consistent, the silicon wafer cutting fluid system still keeps dynamic circulation, the workshop 20 is not required to stop cutting after each circulation until the clear water is restarted, in a preferred embodiment, the clear water recycling unit 300 is used for storing the clear water conveyed from the clear water tank 210 and conveying the clear water to the cutting device, the clear water is directly conveyed from the clear water tank 210 to the cutting device and is firstly conveyed to the clear water recycling unit 300 for caching, and then the clear water cached by the clear water recycling unit 300 is conveyed to the cutting device, so that the clear water recycling unit 300 is ensured to have enough clear water, and the clear water is not influenced by the continuous blending of the clear water. In particular, the clear liquid recycling unit 300 includes a clear liquid inlet pipe 310, a buffer tank 320, a clear liquid return pipe 330 and a water inlet pump, wherein two ends of the clear liquid inlet pipe 310 are respectively communicated with the clear liquid tank 210 and the buffer tank 320, two ends of the clear liquid return pipe 330 are respectively communicated with the buffer tank 320 and a cutting device, and the water inlet pump is arranged on the clear liquid inlet pipe 310. The buffer tank 320 serves to buffer the clear water transferred from the clear water tank 210 when specifically provided.

Through the above arrangement, after the first circulation forms the clear liquid water in the clear liquid tank 210, the water inlet pump is turned on to convey the clear liquid water to the buffer tank 320 for storage by the clear liquid water inlet pipe 310, and the clear liquid water in the buffer tank 320 is conveyed to the cutting device through the clear liquid return pipe 330, and meanwhile, the second water quality allocation is performed in the clear liquid tank 210, so that the new clear liquid water is formed in the clear liquid tank 210 before the clear liquid water in the buffer tank 320 is conveyed, and the dynamic circulation of the slice cutting liquid system is realized. In a specific operation, the water inlet pump may be manually turned on and manually turned off after all clear water is delivered to the buffer tank 320, or the water inlet pump may be in communication connection with the control module, where the control module starts and stops the water inlet pump according to a preset time after stopping the delivery of the filter-pressing water by the wastewater filter-pressing unit 100.

In order to ensure that the clear water prepared by the water quality adjusting unit 200 meets the water quality requirement, in a preferred embodiment, the control unit includes an online detection module, the online detection module is disposed in the clear water tank 210 and is in communication connection with the control module, the online detection module is used for monitoring the water quality index of the clear water, and the control module controls the start and stop of the clear water recycling unit 300 according to the water quality index after the waste water filter pressing unit 100 stops transfusion. When the online detection module is specifically arranged, the online detection module comprises a liquid surface tension meter, a Chemical Oxygen Demand (COD) meter and a liquid concentration agent which are in communication connection with the control module, the meter, the concentration and the COD indexes of clear liquid water are measured through the liquid surface tension meter, the Chemical Oxygen Demand (COD) meter and the liquid concentration agent and fed back to the control module, the control module is in communication connection with the water inlet pump, and when the control module judges that the water quality index meets the requirement, the water inlet pump is controlled to be started and the water inlet pump is closed at set time; meanwhile, the indexes are displayed in real time through the display screen for a worker to check, so that the worker can manually close the water inlet pump when finding out the indexes, and can perform relevant adjustment on the clear water in the clear water tank 210 until the requirements are met, and the worker can manually open the water inlet pump after knowing that the indexes meet the requirements.

In order to more conveniently realize the purpose of filtering and pressing the cutting waste liquid and conveying the filter-pressing water by the waste water filter-pressing unit 100, in a preferred embodiment, the waste water filter-pressing unit 100 comprises a waste liquid collecting tank 110, a filter-pressing module 120 and a conveying module 130 which are sequentially communicated, the conveying module 130 is communicated with a clear liquid tank 210 and is in communication connection with a control module, the filter-pressing module 120 is used for forming the filter-pressing water after the filter-pressing workshop conveys the cutting waste liquid into the waste liquid collecting tank 110, and the conveying module 130 is used for conveying the filter-pressing water in the filter-pressing module 120 to the clear liquid tank 210. When specifically provided, the waste collection tank 110 is in communication with the plant 20 cutting equipment via tubing and is used to collect cutting waste.

In order to form the press water more conveniently, specifically, the press module 120 includes a first conveying pipe 121, a press tank 122 and a press filter 123, two ends of the first conveying pipe 121 are respectively communicated with the waste liquid collecting tank 110 and the press tank 122, and the press filter 123 is disposed on the first conveying pipe 121. When specifically setting, the filter-pressing tank 122 is used for storing filter-pressing water, through the setting, the cutting waste liquid in the waste liquid collecting tank 110 is firstly conveyed to the filter press 123 by the first conveying pipe 121, the separation of silicon material and liquid in the cutting waste liquid is realized through the filter press 123, and the separated liquid is conveyed to the filter-pressing tank 122 along the first conveying pipe 121 to form filter-pressing water.

In order to facilitate the filter pressing of the cutting waste liquid, more specifically, the filter pressing module 120 further includes a dirty water tank 124 and a second conveying pipe 125, the dirty water tank 124 is disposed between the waste liquid collecting tank 110 and the filter press 123, two ends of the second conveying pipe 125 are respectively communicated with the waste liquid collecting tank 110 and the dirty water tank 124, and two ends of the first conveying pipe 121 are respectively communicated with the dirty water tank 124 and the filter pressing tank 122. When specifically arranged, the filter press 123 is arranged on the first conveying pipe 121, and filter aid is added into the dirty water tank 124 to improve the subsequent filter pressing efficiency. Through the above arrangement, the second transfer pipe 125 transfers the cutting waste liquid in the waste liquid collecting tank 110 to the dirty water tank 124, the cutting waste liquid becomes clean under the action of the filter aid in the dirty water tank 124, and then the cutting waste liquid reaches the filter press 123 through the first transfer pipe 121 to be press-filtered and form press-filtered water, and the formed press-filtered water flows into the press-filtered tank 122 along the first transfer pipe 121.

In order to more conveniently realize that the conveying module 130 conveys the press-filtered water to the clear liquid tank 210, specifically, the conveying module 130 includes a third conveying pipe 131 and a first conveying pump, two ends of the third conveying pipe 131 are respectively communicated with the press-filtering module 120 and the clear liquid tank 210, and the first conveying pump is disposed in the third conveying pipe 131 and is in communication connection with the control module. When specifically configured, the third transfer tube 131 communicates with the pressure filtration tank 122 in the pressure filtration module 120. Through the above arrangement, the first transfer pump is started to pump the filter-pressing water in the filter-pressing tank 122 into the clean liquid tank 210 through the third transfer pipe 131, and the first transfer pump is turned off after reaching the preset liquid level.

In order to conveniently realize that the water replenishing module 220 delivers pure water to the clean water tank 210, in a preferred embodiment, the water replenishing module 220 includes a pure water tank 221, a pure water pipe 222, and a second delivery pump, wherein two ends of the pure water pipe 222 are respectively communicated with the pure water tank 221 and the clean water tank 210, and the second delivery pump is disposed in the pure water pipe 222 and is in communication connection with the control module. When the setting is specifically made, the pure water tank 221 is used for storing pure water, by which the second transfer pump is started to pump pure water in the pure water tank 221 into the clear liquid tank 210 through the pure water pipe 222, and after reaching the preset liquid level, the second transfer pump is turned off.

In order to more conveniently realize that the new cutting fluid module conveys the new cutting fluid to the clean fluid tank 210, in a preferred embodiment, the new cutting fluid supplementing module 230 comprises a fluid supplementing tank 231, a fluid supplementing pipe 232 and a third conveying pump, wherein two ends of the fluid supplementing pipe 232 are respectively communicated with the fluid supplementing tank 231 and the clean fluid tank 210, and the third conveying pump is arranged on the fluid supplementing pipe 232 and is in communication connection with the control module. With the above arrangement, the third transfer pump is started to pump the new cutting fluid in the fluid replacement tank 231 into the fluid replacement tank 210 through the fluid replacement pipe 232, and the third transfer pump is turned off after the preset fluid level is reached. When the cutting fluid filling device is specifically arranged, the fluid filling tank 231 is used for storing new cutting fluid, the fluid filling pipe 232 can be combined with the pure water pipe 222 into a T-shaped pipe, the lower side of the T-shaped pipe is communicated with the clean water tank 210, the left end and the right end of the upper side of the T-shaped pipe are respectively communicated with the pure water tank 221 and the fluid filling tank 231, and the second conveying pump and the third conveying pump are respectively correspondingly arranged at the left end and the right end of the upper side of the T-shaped pipe.

The application also provides a recovery method of the silicon wafer cutting fluid recovery system 10 adopting any embodiment, which comprises the following steps:

step S1, a collection module collects the liquid level of the liquid in the liquid-solution tank 210 and transmits the liquid level to a control module, wherein the collection module is a liquid level meter, and can be an optical fiber water level meter, a glass tube water level meter and a glass tube water level meter for displaying a liquid level value when the device is specifically arranged;

step S2, the control module sequentially controls the water supplementing module 220, the new cutting fluid supplementing module 230 and the wastewater filter pressing unit 100 according to the liquid level to convey the pure water, the new cutting fluid and the filter pressing water stored by the control module to the clear liquid tank 210 according to the preset quantity, and as will be appreciated, the pure water is preferably input into the clear liquid tank 210, then the new cutting fluid is input, and the filter pressing water is input to more fully dilute the new cutting fluid, so that the new cutting fluid is uniformly mixed with the pure water and the filter pressing water, but the mixing sequence is not limited to the above mode, and the sequence of inputting the pure water, the new cutting fluid and the filter pressing water into the clear liquid tank 210 can be arbitrary;

step S3, the clear liquid recycling unit 300 conveys clear liquid water formed by mixing pure water, new cutting fluid and filter pressing water in the clear liquid tank 210 to the cutting device, so that the recycling of the silicon wafer cutting fluid is realized more conveniently.

It should be noted that, when the collection module is a liquid level meter with sensing function such as an optical fiber water level meter, the control module may be a PLC controller, and the control module firstly controls the second delivery pump to work according to the liquid level fed back by the optical fiber water level meter, and delivers pure water to the clear liquid tank 210; after the pure water reaches the set liquid level, controlling the second conveying pump to be closed and opening the third conveying pump, and conveying new cutting liquid to the clear liquid tank 210; after the new cutting fluid reaches the set liquid level, controlling the third delivery pump to be closed and opening the first delivery pump, and delivering filter-press water to the clear fluid tank 210; after the pressure filtration water reaches a set liquid level, the first conveying pump is controlled to be closed; judging whether the index fed back by the online detection module accords with a preset value at the moment, and turning on the water inlet pump when the index accords with the preset value.

When the acquisition module is a liquid level meter such as a glass tube water level meter for displaying a liquid level value, water quality allocation is realized by means of manual mode, and the setting of the control module is canceled. Firstly, manually opening a second delivery pump, delivering pure water to the clear liquid tank 210, and closing the second delivery pump after manually observing that the pure water reaches a required liquid level; then the third conveying pump is manually turned on, new cutting fluid is conveyed to the clear fluid tank 210, and the third conveying pump is turned off after the new cutting fluid is manually observed to reach the required liquid level; then the first conveying pump is started, the filter-press water is conveyed to the clear liquid tank 210, and the first conveying pump is closed after the filter-press water is observed manually to reach the required liquid level; and then judging whether the clear water accords with a preset value according to the index displayed by the online detection module, manually opening the water inlet pump when the clear water accords with the preset value, and manually adjusting the clear water when the clear water does not accord with the preset index value. In order to ensure the accuracy of manually preparing clear water, the third conveying pipe 131, the pure water pipe 222 and the liquid supplementing pipe 232 are all provided with liquid flow monitors, so that the relevant pumps can be conveniently started and stopped according to the accurate data displayed by the liquid flow monitors. When specifically set up, the shape of clear liquid jar 210 generally sets up to structures such as cuboid, cylinder, and the volume of convenient clear liquid jar 210 is calculated, also is convenient for calculate pure water, new cutting fluid and filter-pressing water' S addition volume, actual addition liquid volume (T) =bottom area (S) ×liquid level (H).

In the recovery method based on the silicon wafer cutting fluid recovery system 10, the collection module collects the liquid level of the liquid in the clean liquid tank 210 and transmits the liquid level to the control module in step S1; the control module in step S2 is convenient to control the water supplementing module 220 to deliver pure water to the clear liquid tank 210 according to the liquid level, and control the new cutting liquid supplementing module 230 to deliver new cutting liquid to the clear liquid tank 210 according to the preset amount after the pure water level reaches the set value, and then control the wastewater press filtration unit 100 to deliver press filtration water to the clear liquid tank 210 according to the preset amount, so as to realize the configuration of pure water, press filtration water and new cutting liquid according to the set proportion; and then, the clear water recycling unit 300 is utilized to prepare the pure water, the filter-pressed water and the new cutting fluid in the clear water tank 210 according to a set proportion to form clear water, and the clear water is conveyed to the cutting equipment. Through the arrangement, the pure water, the new cutting fluid and the filter pressing water in the prior art are continuously and dynamically input to the cutting equipment, the three fluids are configured according to the set proportion to form clear water and then are conveyed to the cutting equipment, and the consistency of the proportion of three components in the clear water after each circulation is realized conveniently.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (10)

1. The silicon wafer cutting fluid recovery system is characterized by comprising a control unit, a wastewater filter pressing unit, a water quality adjusting unit and a clear liquid recycling unit, wherein:

the waste water filter pressing unit is used for forming filter pressing water after waste water is cut in a filter pressing workshop and conveying the filter pressing water to the water quality adjusting unit;

the water quality adjusting unit comprises a clean liquid tank communicated with the wastewater filter pressing unit, a water supplementing module communicated with the clean liquid tank and a new cutting liquid supplementing module, wherein the water supplementing module is used for conveying pure water stored by the water supplementing module to the clean liquid tank, the new cutting liquid supplementing module is used for conveying new cutting liquid stored by the water supplementing module to the clean liquid tank, and the pure water, the new cutting liquid and the filter pressing water in the clean liquid tank are mixed to form clean liquid;

the control unit comprises a control module and an acquisition module arranged in the clear liquid tank, wherein the acquisition module is used for acquiring the liquid level of liquid in the clear liquid tank, the control module is in communication connection with the acquisition module, the waste water filter pressing unit, the water supplementing module and the new cutting liquid supplementing module, and the control module sequentially controls the water supplementing module, the new cutting liquid supplementing module and the waste water filter pressing unit to start and stop transfusion according to the liquid level;

one end of the clear liquid recycling unit is communicated with the clear liquid tank, and the other end of the clear liquid recycling unit is communicated with workshop cutting equipment and is used for conveying clear liquid water to the cutting equipment.

2. The silicon wafer cutting fluid recovery system according to claim 1, wherein the clear fluid recycling unit comprises a clear fluid inlet pipe, a buffer tank, a clear fluid return pipe and a water inlet pump, two ends of the clear fluid inlet pipe are respectively communicated with the clear fluid tank and the buffer tank, two ends of the clear fluid return pipe are respectively communicated with the buffer tank and the cutting equipment, and the water inlet pump is arranged on the clear fluid inlet pipe.

3. The silicon wafer cutting fluid recovery system according to claim 1, wherein the control unit comprises an online detection module, the online detection module is arranged in the clean fluid tank and is in communication connection with the control module, the online detection module is used for monitoring a water quality index of the clean fluid water, and the control module controls the start and stop of the clean fluid recycling unit according to the water quality index after the waste water filter pressing unit stops transfusion.

4. The silicon wafer cutting fluid recovery system of claim 1, wherein the wastewater filter-pressing unit comprises a waste fluid collection tank, a filter-pressing module and a transmission module which are sequentially communicated, wherein the transmission module is communicated with the clear fluid tank and is in communication connection with the control module, the filter-pressing module is used for filter-pressing the cutting waste fluid transferred from the workshop to the waste fluid collection tank to form filter-pressing water, and the transmission module is used for conveying the filter-pressing water in the filter-pressing module to the clear fluid tank.

5. The silicon wafer cutting fluid recovery system of claim 4, wherein the filter pressing module comprises a first conveying pipe, a filter pressing tank and a filter pressing machine, wherein two ends of the first conveying pipe are respectively communicated with the waste liquid collecting tank and the filter pressing tank, and the filter pressing machine is arranged on the first conveying pipe.

6. The silicon wafer cutting fluid recovery system of claim 5, wherein the filter pressing module further comprises a dirty water tank and a second conveying pipe, the dirty water tank is arranged between the waste liquid collecting tank and the filter press, two ends of the second conveying pipe are respectively communicated with the waste liquid collecting tank and the dirty water tank, and two ends of the first conveying pipe are respectively communicated with the dirty water tank and the filter pressing tank.

7. The silicon wafer cutting fluid recovery system of claim 4, wherein the transfer module comprises a third transfer tube and a first transfer pump, two ends of the third transfer tube are respectively communicated with the filter pressing module and the clear liquid tank, and the first transfer pump is arranged in the third transfer tube and is in communication connection with the control module.

8. The silicon wafer cutting fluid recovery system according to claim 1, wherein the water replenishing module comprises a pure water tank, a pure water pipe and a second delivery pump, two ends of the pure water pipe are respectively communicated with the pure water tank and the clear liquid tank, and the second delivery pump is arranged in the pure water pipe and is in communication connection with the control module.

9. The silicon wafer cutting fluid recovery system according to claim 1, wherein the new cutting fluid supplementing module comprises a fluid supplementing tank, a fluid supplementing pipe and a third conveying pump, two ends of the fluid supplementing pipe are respectively communicated with the fluid supplementing tank and the clear liquid tank, and the third conveying pump is arranged on the fluid supplementing pipe and is in communication connection with the control module.

10. A recovery method using the silicon wafer cutting fluid recovery system according to any one of claims 1 to 9, comprising the steps of:

the acquisition module acquires the liquid level of the liquid in the clear liquid tank and transmits the liquid level to the control module;

the control module sequentially controls the water supplementing module, the new cutting fluid supplementing module and the wastewater filter pressing unit according to the liquid level to convey the pure water, the new cutting fluid and the filter pressing water stored by the control module to the clear liquid tank according to preset amounts in a one-to-one correspondence manner;

and the clear liquid recycling unit conveys clear liquid water formed by mixing the pure water, the new cutting liquid and the filter pressing water in the clear liquid tank to the cutting equipment.