CN116779479B - Leveling device and method for semiconductor tablet - Google Patents
Leveling device and method for semiconductor tablet Download PDFInfo
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- CN116779479B CN116779479B CN202310697223.7A CN202310697223A CN116779479B CN 116779479 B CN116779479 B CN 116779479B CN 202310697223 A CN202310697223 A CN 202310697223A CN 116779479 B CN116779479 B CN 116779479B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 230000009471 action Effects 0.000 claims abstract description 13
- 230000005484 gravity Effects 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 6
- 238000007664 blowing Methods 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 30
- 230000008602 contraction Effects 0.000 claims description 8
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The present invention relates to the field of semiconductor webs. The invention discloses a leveling device for a semiconductor tablet, which comprises a bottom frame, wherein a limiting sliding frame is fixedly connected to the bottom surface of the inner wall of the bottom frame, a leveling mechanism is fixedly connected to the upper side of the inner wall of the limiting sliding frame, and an unfolding mechanism is arranged on the leveling mechanism. The invention consists of a leveling mechanism, an unfolding mechanism and a receiving mechanism. According to the leveling device and the leveling method for the semiconductor material sheet, the sliding sleeve is driven to move downwards in the sliding groove of the limiting sliding frame through extension of the micro air cylinder, the plurality of first hinge plates are driven to deflect and open simultaneously, and in the deflection process of the first hinge plates, the air outlet of the micro air pump is always in a downward state under the action of gravity of the micro air pump, and blowing is carried out to blow and level the surface of the material sheet.
Description
Technical Field
The invention relates to the field of semiconductor webs, in particular to a leveling device and a leveling method for a semiconductor web.
Background
In the field of automatic optical inspection, a wafer is usually mounted on a carrier, and then a vacuum is applied to the carrier to suck the wafer onto the carrier through air holes on the carrier.
However, after the wafer is held by the air holes, warpage is often generated at the edge of the web, so that the web image shot during image detection is often distorted, and therefore, a leveling device for the semiconductor web is needed.
Disclosure of Invention
The present invention is directed to a leveling device and a leveling method for a semiconductor web, so as to solve the problems set forth in the background art. In order to achieve the above purpose, the present invention provides the following technical solutions: the leveling device for the semiconductor material sheet comprises a bottom frame, wherein a limiting sliding frame is fixedly connected to the bottom surface of the inner wall of the bottom frame, a leveling mechanism is fixedly connected to the upper side of the inner wall of the limiting sliding frame, and an unfolding mechanism is arranged on the leveling mechanism;
the device is characterized in that an adsorption platform is arranged on the inner wall of the limiting sliding frame, a material receiving mechanism is arranged at the bottom of the side face of the adsorption platform, and the material receiving mechanism is arranged on the bottom face of the inner wall of the underframe.
Preferably, the leveling mechanism comprises a micro cylinder fixed on the top surface of the inner wall of the limit sliding frame, a sliding sleeve is fixedly sleeved on the outer side of the telescopic end of the micro cylinder, and two ends of the sliding sleeve respectively slide in sliding grooves on the opposite sides of two vertical rods of the limit sliding frame;
the sliding sleeve is characterized in that a first hinge plate is hinged to the side face of the sliding sleeve, the first hinge plate is T-shaped, a second hinge plate is hinged to the side face of the first hinge plate, an outer sleeve is hinged to one end, far away from the first hinge plate, of the second hinge plate, a connecting rod is fixedly connected to the outer side of the outer sleeve, and one end, far away from the outer sleeve, of the connecting rod is fixed to the outer side of the miniature cylinder.
Preferably, the unfolding mechanism comprises a spring expansion plate hinged on a second hinged plate, one end of the spring expansion plate penetrates through a groove formed in the end part of the first hinged plate and is hinged with a first spring expansion rod, two limit posts are fixedly connected in the groove, the lower limit post is overlapped with the first spring expansion rod, one end of the first spring expansion rod, far away from the spring expansion plate, is fixedly connected with a universal ball head, a deflection plate is sleeved on the universal ball head, one end of the deflection plate is hinged on the first hinged plate, and a spring contraction rod is hinged between the deflection plate and the first hinged plate;
wedge blocks are fixedly connected to the front side and the rear side of one end of the spring expansion plate, a second spring expansion rod is abutted to the front side and the rear side of one end of the spring expansion plate, an outer sleeve of the second spring expansion rod penetrates through a groove at the end part of the first hinge plate, a third spring expansion rod is hinged to the end face of an inner rod of the second spring expansion rod, a clamping plate is fixedly connected to one end of the third spring expansion rod, a limiting spring expansion rod is fixedly connected to one end of the clamping plate, and one end of the limiting spring expansion rod is an inclined plane;
the clamping plate is hinged to the outer side of the second spring telescopic rod, a clamping frame is fixedly connected to the inner portion of the clamping plate, the clamping frame is fixed to the deflection plate, and a miniature air pump is hinged to the lower end of the deflection plate.
Preferably, the suction platform is provided with an air pump, a trigger switch on the air pump is arranged on the top surface of the suction platform, a multi-way pipe is connected to an air inlet pipe of the air pump, and the multi-way pipe is arranged on the suction platform.
Preferably, the material receiving mechanism comprises two limiting frames which are respectively fixed on the front side and the rear side of the adsorption platform, wherein an L-shaped push rod is connected in a sliding manner in the limiting frames, the L-shaped push rod is connected in a limiting sliding frame in a sliding manner, the lower end of the L-shaped push rod is fixedly connected with a return spring telescopic rod, and the return spring telescopic rod is fixed in the limiting sliding frame;
and a pull rod is hinged to the bottom surface of the limiting frame, and a spring is arranged between the pull rod and the limiting frame.
Preferably, the material receiving mechanism further comprises a shaft wheel rotatably connected to the underframe, a plurality of baffles are fixedly connected to the outer side of the shaft wheel shaft, inner ring teeth are fixedly connected to the front end and the rear end of the shaft wheel, and the inner ring teeth are abutted to one end of the pull rod.
Preferably, the pull rod is L-shaped.
Preferably, the leveling method of the leveling device for the semiconductor material sheet comprises the following steps:
s1: when the device is used for leveling the material sheets, the material sheets are firstly conveyed to an adsorption platform, then the material sheets are fixed on the adsorption platform through the air suction of the air extractor and the cooperation of the multi-way pipe, then the sliding sleeve is driven to move downwards in the sliding groove of the limiting sliding frame through the extension of the micro air cylinder, the plurality of first hinge plates are driven to deflect and open simultaneously, and in the deflection process of the first hinge plates, the air outlet of the micro air pump is always in a downward state under the action of self gravity and blows air to level the surface of the material sheets;
s2: when the first hinge plate deflects, the second hinge plate is synchronously driven to deflect, so that the spring expansion plate stretches, when the spring expansion plate stretches to the maximum length, the first hinge plate continuously deflects to drive one end of the second spring expansion rod on the spring expansion plate to abut against the wedge block, the first spring expansion rod synchronously bears stress and contracts, at the moment, the inner rod of the second spring expansion rod slides in the outer sleeve of the inner rod and drives the third spring expansion rod and the clamping plate to synchronously deflect, so that the limiting spring expansion rod is separated from the clamping frame, at the moment, the deflection plate deflects and opens under the thrust of the first spring expansion rod, the distance between two micro air pumps arranged on the same first hinge plate is increased, and the plurality of micro air pumps are ensured to blow and smooth the material sheet more uniformly;
s3: when the first hinged plate deflects and abuts against a switch of the air extractor, the air extractor stops sucking air, the micro air pump is synchronously closed, and then the micro air cylinder continues to extend to drive the sliding sleeve to move downwards and abut against the L-shaped push rod, so that the L-shaped push rod moves downwards to drive the adsorption platform to deflect and incline, the flattened material sheets are caused to slide between gaps of a plurality of baffles under the action of gravity of the material sheets, and the adsorption platform deflects to push the pull rod to slide in the inner ring teeth, and when the micro air cylinder contracts and resets, the pull rod pulls the shaft wheel to deflect a certain angle, so that the subsequent material sheets continue to be conveyed into the gaps of the plurality of baffles;
when the micro cylinder contracts and resets, the first hinged plate and the second hinged plate synchronously reset and drive the spring expansion plate to contract, the second spring expansion link is driven to reset after being separated from the wedge block, the third spring expansion link is driven to synchronously reset with the clamping plate, the deflection plate is driven to reset under the action of the restoring force of the contraction of the spring expansion link, the clamping frame is driven to abut against the inclined plane at one end of the limiting spring expansion link to enable the inclined plane to contract and then be clamped on the limiting spring expansion link, and the integral resetting of the device is completed.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the sliding sleeve is driven to move downwards in the chute of the limiting sliding frame by extending the micro air cylinder, the plurality of first hinge plates are driven to deflect and open simultaneously, and in the deflection process of the first hinge plates, the air outlet of the micro air pump is always in a downward state under the action of self gravity, and blowing is carried out to blow the surface of the material sheet.
According to the invention, the first hinge plate deflects to synchronously drive the second hinge plate to deflect, so that the spring expansion plate stretches, the first hinge plate continuously deflects to drive one end of the second spring expansion rod to abut against the wedge-shaped block, the first spring expansion rod synchronously bears stress and contracts, at the moment, the inner rod of the second spring expansion rod slides in the outer sleeve and drives the third spring expansion rod and the clamping plate to synchronously deflect, so that the limiting spring expansion rod and the clamping frame are separated, at the moment, the deflection plate deflects and opens under the thrust of the first spring expansion rod, the distance between two micro air pumps arranged on the same first hinge plate is increased, and the plurality of micro air pumps are ensured to blow and smooth the material sheet more uniformly.
According to the invention, after the first hinged plate deflects to be abutted against the switch of the air extractor, the air extractor stops sucking air, the micro air pump is synchronously closed, and then the micro air cylinder continues to extend to drive the sliding sleeve to move downwards and abut against the L-shaped push rod, so that the L-shaped push rod moves downwards to drive the adsorption platform to deflect and incline, the flattened material sheet slides between the gaps of the plurality of baffles under the action of self gravity, the pull rod is pushed to slide in the inner ring teeth when the adsorption platform deflects, and when the micro air cylinder contracts and resets, the pull rod pulls the shaft wheel to deflect for a certain angle, so that the subsequent material sheet is continuously conveyed into the gaps of the plurality of baffles.
In the invention, when the mini cylinder 31 is contracted and reset, the first hinge plate 33 and the second hinge plate 34 are synchronously reset and drive the spring expansion plate to contract, drive the second spring expansion rod to be separated from the wedge block and reset, drive the third spring expansion rod to synchronously reset with the clamping plate, and drive the deflection plate to reset under the action of the contraction reset force of the spring contraction rod, drive the clamping frame to abut against the inclined plane at one end of the limiting spring expansion rod to be contracted and then clamped on the limiting spring expansion rod, thus completing the integral reset of the device.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a partial perspective view of the present invention;
FIG. 3 is a schematic view of a partial perspective structure of the present invention;
FIG. 4 is a schematic perspective view of a first hinge plate and the like according to the present invention;
FIG. 5 is a schematic perspective view of a spring expansion plate and other structures according to the present invention;
FIG. 6 is a schematic perspective view of a deflector plate and like structure according to the present invention;
FIG. 7 is a schematic perspective view of a wedge block and like structure according to the present invention;
fig. 8 is a sectional view showing a three-dimensional structure of a second spring expansion link and the like according to the present invention.
In the figure: 1. a chassis; 2. limiting sliding frame; 3. a leveling mechanism; 31. a micro cylinder; 32. a sliding sleeve; 33. a first hinge plate; 34. a second hinge plate; 35. an outer sleeve; 36. a connecting rod; 4. a deployment mechanism; 41. a spring expansion plate; 42. a groove; 43. a first spring telescoping rod; 44. universal ball head; 45. a deflector plate; 46. a spring retraction lever; 47. wedge blocks; 48. a second spring telescoping rod; 49. a third spring telescoping rod; 410. a clamping plate; 411. a limit spring telescopic rod; 412. a clamping frame; 413. a micro air pump; 5. an adsorption platform; 6. a receiving mechanism; 61. a limit frame; 62. an L-shaped push rod; 63. a return spring telescoping rod; 64. a pull rod; 65. a spring; 66. a reel; 67. a baffle; 68. inner ring teeth; 7. an air extractor; 8. a multi-way pipe.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are obtained by a worker of ordinary skill in the art without creative efforts, are within the protection scope of the present invention based on the embodiments of the present invention.
Referring to fig. 1 to 8, the present invention provides a technical solution: the leveling device for the semiconductor material sheet comprises a bottom frame 1, wherein a limiting sliding frame 2 is fixedly connected to the bottom surface of the inner wall of the bottom frame 1, a leveling mechanism 3 is fixedly connected to the upper side of the inner wall of the limiting sliding frame 2, and an unfolding mechanism 4 is arranged on the leveling mechanism 3;
an adsorption platform 5 is arranged on the inner wall of the limit sliding frame 2, a material receiving mechanism 6 is arranged at the bottom of the side surface of the adsorption platform 5, and the material receiving mechanism 6 is arranged on the bottom surface of the inner wall of the underframe 1.
In this embodiment, as shown in fig. 1, 2, 3, 4, 5 and 7, the leveling mechanism 3 includes a micro cylinder 31 fixed on the top surface of the inner wall of the limit carriage 2, a sliding sleeve 32 is fixedly sleeved on the outer side of the telescopic end of the micro cylinder 31, and two ends of the sliding sleeve 32 slide in the sliding grooves on two opposite sides of the two vertical rods of the limit carriage 2 respectively;
the sliding sleeve 32 is hinged with a first hinge plate 33 on the side surface, the first hinge plate 33 is T-shaped, the side surface of the first hinge plate 33 is hinged with a second hinge plate 34, one end of the second hinge plate 34 far away from the first hinge plate 33 is hinged with an outer sleeve 35, the outer side of the outer sleeve 35 is fixedly connected with a connecting rod 36, and one end of the connecting rod 36 far away from the outer sleeve 35 is fixed on the outer side of the micro cylinder 31.
In this embodiment, as shown in fig. 1, 5, 6, 7 and 8, the deployment mechanism 4 includes a spring expansion plate 41 hinged on the second hinge plate 34, one end of the spring expansion plate 41 passes through a groove 42 formed at the end of the first hinge plate 33 and is hinged with a first spring expansion rod 43, two limit posts are fixedly connected in the groove 42, the lower limit post is overlapped with the first spring expansion rod 43, one end of the first spring expansion rod 43 far away from the spring expansion plate 41 is fixedly connected with a universal ball head 44, a deflection plate 45 is sleeved on the universal ball head 44, one end of the deflection plate 45 is hinged on the first hinge plate 33, and a spring contraction rod 46 is hinged between the deflection plate 45 and the first hinge plate 33;
wedge blocks 47 are fixedly connected to the front side and the rear side of one end of the spring expansion plate 41, second spring expansion rods 48 are abutted to the front side and the rear side of one end of the spring expansion plate 41, outer sleeves of the second spring expansion rods 48 penetrate through grooves 42 at the end parts of the first hinge plates 33, third spring expansion rods 49 are hinged to the end faces of inner rods of the second spring expansion rods 48, clamping plates 410 are fixedly connected to one ends of the third spring expansion rods 49, limiting spring expansion rods 411 are fixedly connected to one ends of the clamping plates 410, and one ends of the limiting spring expansion rods 411 are inclined surfaces;
the cardboard 410 articulates on the outside of second spring telescopic link 48, and the inside fixedly connected with card frame 412 of cardboard 410, and card frame 412 is fixed on deflector plate 45, and deflector plate 45's lower extreme articulates has miniature air pump 413, and miniature air pump 413's gas outlet slightly inclines, guarantees that the air current that miniature air pump 413 blown out flows to the edge of tablet, better flattening the tablet.
In this embodiment, as shown in fig. 1 and 2, an air pump 7 is installed on the adsorption platform 5, a trigger switch on the air pump 7 is disposed on the top surface of the adsorption platform 5, a multi-way pipe 8 is connected to an air inlet pipe of the air pump 7, and the multi-way pipe 8 is disposed on the adsorption platform 5.
In this embodiment, as shown in fig. 1, 2 and 3, the material receiving mechanism 6 includes two limiting frames 61 respectively fixed on the front and rear sides of the adsorption platform 5, an L-shaped push rod 62 is slidably connected in the limiting frames 61, the L-shaped push rod 62 is slidably connected in the limiting carriage 2, the lower end of the L-shaped push rod 62 is fixedly connected with a return spring telescopic rod 63, and the return spring telescopic rod 63 is fixed in the limiting carriage 2;
a pull rod 64 is hinged on the bottom surface of the limit frame 61, and a spring 65 is arranged between the pull rod 64 and the limit frame 61.
In this embodiment, as shown in fig. 1, 2 and 3, the material receiving mechanism 6 further includes a shaft wheel 66 rotatably connected to the chassis 1, a plurality of baffles 67 are fixedly connected to the outer side of the shaft wheel 66, inner ring teeth 68 are fixedly connected to the front and rear ends of the shaft wheel 66, and the inner ring teeth 68 abut against one end of the pull rod 64.
In this embodiment, as shown in fig. 1 and 2, the tie rod 64 has an L-shape.
The leveling method and the leveling device have the following advantages: the leveling method of the leveling device for the semiconductor material sheet comprises the following working processes:
as shown in fig. 1, 2, 3, 4, 5, 6, 7, 8:
s1: when the device is used for leveling the material sheets, the material sheets are firstly conveyed to the adsorption platform 5, then the material sheets are fixed on the adsorption platform 5 through the air suction of the air extractor 7 and the cooperation of the multi-way pipe 8, then the sliding sleeve 32 is driven to move downwards in the chute of the limit sliding frame 2 through the extension of the micro air cylinder 31, the first hinge plates 33 are driven to deflect and open simultaneously, and in the deflection process of the first hinge plates 33, the air outlet of the micro air pump 413 is always in a downward state under the action of self gravity, and the air blowing is carried out to blow the surface of the material sheets, so that dust is removed;
s2: when the first hinge plate 33 deflects, the second hinge plate 34 is synchronously driven to deflect, so that the spring expansion plate 41 stretches, when the spring expansion plate 41 stretches to the maximum length, the first hinge plate 33 continuously deflects to drive one end of the second spring expansion rod 48 on the first hinge plate to abut against the wedge-shaped block 47, the first spring expansion rod 43 synchronously bears stress and contracts, at the moment, the inner rod of the second spring expansion rod 48 slides in the outer sleeve of the inner rod and drives the third spring expansion rod 49 and the clamping plate 410 to synchronously deflect, so that the limiting spring expansion rod 411 and the clamping frame 412 are separated, at the moment, the deflection plate 45 deflects and opens under the thrust of the first spring expansion rod 43, the distance between two micro air pumps 413 arranged on the same first hinge plate 33 is increased, and the plurality of micro air pumps 413 are ensured to blow and smooth a material sheet more uniformly;
s3: when the first hinged plate 33 deflects to abut against the switch of the air extractor 7, the air extractor 7 stops sucking air, the micro air pump 413 is synchronously closed, then the micro air cylinder 31 continues to extend to drive the sliding sleeve 32 to move downwards and abut against the L-shaped push rod 62, so that the L-shaped push rod 62 moves downwards to drive the adsorption platform 5 to deflect and incline, the flattened material sheets slide between the gaps of the plurality of baffles 67 under the action of self gravity, the pull rods 64 are pushed to slide in the inner ring teeth 68 when the adsorption platform 5 deflects, and when the micro air cylinder 31 contracts and resets, the pull rods 64 pull the shaft wheels 66 to deflect a certain angle, so that the subsequent material sheets continue to be conveyed into the gaps of the plurality of baffles 67, the device is higher in automation, and the collection of the material sheets is more convenient;
when the micro cylinder 31 is contracted and reset, the first hinged plate 33 and the second hinged plate 34 are synchronously reset and drive the spring expansion plate 41 to contract, the second spring expansion rod 48 is driven to be separated from the wedge block 47 and reset, the third spring expansion rod 49 and the clamping plate 410 are synchronously reset, the deflection plate 45 is driven to reset under the action of the contraction reset force of the spring expansion rod 46 by the deflection plate 45, the clamping frame 412 is driven to abut against the inclined plane at one end of the limiting spring expansion rod 411 to enable the inclined plane to be contracted and then clamped on the limiting spring expansion rod 411, and the integral reset of the device is completed.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. Leveling device for semiconductor webs, comprising a chassis (1), characterized in that: the device is characterized in that a limiting sliding frame (2) is fixedly connected to the bottom surface of the inner wall of the underframe (1), a leveling mechanism (3) is fixedly connected to the upper side of the inner wall of the limiting sliding frame (2), and an unfolding mechanism (4) is arranged on the leveling mechanism (3);
an adsorption platform (5) is arranged on the inner wall of the limit sliding frame (2), a material receiving mechanism (6) is arranged at the bottom of the side surface of the adsorption platform (5), and the material receiving mechanism (6) is arranged on the bottom surface of the inner wall of the underframe (1);
the leveling mechanism (3) comprises a micro cylinder (31) fixed on the top surface of the inner wall of the limit sliding frame (2), a sliding sleeve (32) is fixedly sleeved on the outer side of the telescopic end of the micro cylinder (31), and two ends of the sliding sleeve (32) respectively slide in sliding grooves on two opposite sides of the two vertical rods of the limit sliding frame (2);
the side of the sliding sleeve (32) is hinged with a first hinge plate (33), the first hinge plate (33) is T-shaped, the side of the first hinge plate (33) is hinged with a second hinge plate (34), one end of the second hinge plate (34) far away from the first hinge plate (33) is hinged with an outer sleeve (35), the outer side of the outer sleeve (35) is fixedly connected with a connecting rod (36), and one end of the connecting rod (36) far away from the outer sleeve (35) is fixed on the outer side of the miniature cylinder (31);
the unfolding mechanism (4) comprises a spring expansion plate (41) hinged to a second hinged plate (34), one end of the spring expansion plate (41) penetrates through a groove (42) formed in the end portion of a first hinged plate (33) and is hinged to a first spring expansion rod (43), two limit posts are fixedly connected in the groove (42), the lower limit post is overlapped with the first spring expansion rod (43), a universal ball head (44) is fixedly connected to one end, far away from the spring expansion plate (41), of the first spring expansion rod (43), a deflection plate (45) is sleeved on the universal ball head (44), one end of the deflection plate (45) is hinged to the first hinged plate (33), and a spring contraction rod (46) is hinged between the deflection plate (45) and the first hinged plate (33);
wedge blocks (47) are fixedly connected to the front side and the rear side of one end of the spring expansion plate (41), second spring expansion rods (48) are abutted to the front side and the rear side of one end of the spring expansion plate (41), outer sleeves of the second spring expansion rods (48) penetrate through grooves (42) in the end parts of the first hinge plates (33), third spring expansion rods (49) are hinged to the end faces of inner rods of the second spring expansion rods (48), clamping plates (410) are fixedly connected to one ends of the third spring expansion rods (49), limiting spring expansion rods (411) are fixedly connected to one ends of the clamping plates (410), and one ends of the limiting spring expansion rods (411) are inclined surfaces;
the clamping plate (410) is hinged to the outer side of the second spring telescopic rod (48), a clamping frame (412) is fixedly connected to the inside of the clamping plate (410), the clamping frame (412) is fixed to the deflection plate (45), and a micro air pump (413) is hinged to the lower end of the deflection plate (45).
2. A semiconductor web leveling device in accordance with claim 1 wherein: install air pump (7) on adsorption platform (5), trigger switch on air pump (7) sets up on the top surface of adsorption platform (5), be connected with multi-way pipe (8) in the intake pipe of air pump (7), and multi-way pipe (8) set up on adsorption platform (5).
3. A semiconductor web leveling device in accordance with claim 1 wherein: the material receiving mechanism (6) comprises two limiting frames (61) which are respectively fixed on the front side and the rear side of the adsorption platform (5), an L-shaped push rod (62) is connected in a sliding mode in the limiting frames (61), the L-shaped push rod (62) is connected in the limiting sliding frame (2) in a sliding mode, a return spring telescopic rod (63) is fixedly connected to the lower end of the L-shaped push rod (62), and the return spring telescopic rod (63) is fixed in the limiting sliding frame (2);
a pull rod (64) is hinged to the bottom surface of the limiting frame (61), and a spring (65) is arranged between the pull rod (64) and the limiting frame (61).
4. A semiconductor web leveling device in accordance with claim 1 wherein: the material receiving mechanism (6) further comprises a shaft wheel (66) which is rotatably connected to the underframe (1), a plurality of baffles (67) are fixedly connected to the outer side of the shaft wheel (66), inner ring teeth (68) are fixedly connected to the front end and the rear end of the shaft wheel (66), and the inner ring teeth (68) are abutted to one end of the pull rod (64).
5. A semiconductor web leveling device in accordance with claim 3 wherein: the pull rod (64) is L-shaped.
6. A method of planarizing a semiconductor web with a planarizing apparatus, comprising the steps of:
s1: when the device is used for leveling the material sheets, the material sheets are firstly conveyed to an adsorption platform (5), then the material sheets are fixed on the adsorption platform (5) through the air suction of the air extractor (7) and the cooperation of a multi-way pipe (8), then the sliding sleeve (32) is driven to move downwards in a chute of the limit sliding frame (2) through the extension of the micro cylinder (31), a plurality of first hinge plates (33) are driven to deflect and open simultaneously, and in the deflection process of the first hinge plates (33), the air outlet of the micro air pump (413) is always in a downward state under the action of self gravity and blows air to level the surface of the material sheets;
s2: when the first hinge plate (33) deflects, the second hinge plate (34) is synchronously driven to deflect, so that the spring expansion plate (41) stretches, when the spring expansion plate (41) stretches to the maximum length, the first hinge plate (33) continuously deflects to drive one end of a second spring expansion rod (48) on the first hinge plate to abut against a wedge block (47), the first spring expansion rod (43) is synchronously stressed and contracted, at the moment, an inner rod of the second spring expansion rod (48) slides in an outer sleeve of the inner rod and drives a third spring expansion rod (49) and a clamping plate (410) to synchronously deflect, so that a limiting spring expansion rod (411) and the clamping frame (412) are separated, at the moment, the deflection plate (45) deflects and opens under the thrust of the first spring expansion rod (43), the distance between two micro air pumps (413) arranged on the same first hinge plate (33) is increased, and more uniform air blowing on the material sheets is ensured;
s3: when the first hinged plate (33) deflects to be abutted against a switch of the air extractor (7), the air extractor (7) stops sucking air, the micro air pump (413) is synchronously closed, then the micro air cylinder (31) continues to extend to drive the sliding sleeve (32) to move downwards and abut against the L-shaped push rod (62), so that the L-shaped push rod (62) moves downwards to drive the adsorption platform (5) to deflect and incline, the flattened material sheet slides between gaps of the plurality of baffles (67) under the action of self gravity, the pull rod (64) is pushed to slide in the inner ring teeth (68) when the adsorption platform (5) deflects, and when the micro air cylinder (31) contracts and resets, the pull rod (64) pulls the shaft wheel (66) to deflect a certain angle, so that the subsequent material sheet continues to be conveyed into the gaps of the plurality of baffles (67);
when the micro cylinder (31) is contracted and reset, the first hinge plate (33) and the second hinge plate (34) are synchronously reset and drive the spring expansion plate (41) to be contracted, the second spring expansion rod (48) and the wedge block (47) are driven to be separated and reset, the third spring expansion rod (49) and the clamping plate (410) are driven to be synchronously reset, the deflection plate (45) is driven to be reset under the action of the contraction reset force of the spring expansion rod (46), and the clamping frame (412) is driven to abut against the inclined plane at one end of the limiting spring expansion rod (411) to enable the inclined plane to be contracted and then clamped on the limiting spring expansion rod (411), so that the integral reset of the device is completed.
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Denomination of invention: A leveling device and method for semiconductor chips Granted publication date: 20240322 Pledgee: Zhejiang Haining rural commercial bank Limited by Share Ltd. North Branch Pledgor: Zhejiang Jingci Semiconductor Co.,Ltd. Registration number: Y2024980027571 |
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