CN116777190A - Engineering design method and device for eddy current displacement sensor - Google Patents
Engineering design method and device for eddy current displacement sensor Download PDFInfo
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Abstract
The embodiment of the invention provides an engineering design method of an eddy current displacement sensor, which comprises the following steps: acquiring a bill of materials of the eddy current displacement sensor; wherein the bill of materials includes the manufacturing relation among the supplies that need in the production process; constructing a hierarchical structure among materials according to the manufacturing relation; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material; decoupling the first intermediate layer material and the bottom layer material; reconstructing a hierarchical structure among materials according to the manufacturing relationship among the materials after decoupling; and optimizing the production flow of each material in the reconstructed hierarchical structure to finish the engineering design of the eddy current displacement sensor. According to the scheme, mutual restriction among materials in each hierarchical structure is avoided, the production efficiency of the eddy current displacement sensor is remarkably improved, and the development period is shortened.
Description
Technical Field
The invention belongs to the technical field of complete machine engineering design of eddy current products, and particularly relates to an engineering design method and device of an eddy current displacement sensor.
Background
The electric vortex displacement sensor is a non-contact displacement sensor and is mainly used for measuring the relative gesture between a star platform and a load platform.
The engineering of the product is a process of transition from a principle model machine to model application products and transition from single-piece product development to product production of a certain scale, and the product can be produced in batches after the engineering design is finished.
However, in the prior art, the engineering design method of the eddy current displacement sensor makes the modules at the same level of the eddy current displacement sensor product mutually restricted, so that the production efficiency of the product is low, and the requirement of mass production is difficult to meet. Accordingly, in view of the above-mentioned problems, it is necessary to provide a method and an apparatus for engineering an eddy current displacement sensor, which improve the engineering production efficiency of the eddy current displacement sensor.
Disclosure of Invention
The invention provides an engineering design method and device of an eddy current displacement sensor, and the design method can obviously improve the engineering production efficiency of the eddy current displacement sensor.
In a first aspect, a method for engineering an eddy current displacement sensor includes:
acquiring a bill of materials of the eddy current displacement sensor; wherein the bill of materials includes the manufacturing relation among the supplies that need in the production process;
constructing a hierarchical structure among materials according to the manufacturing relation; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material;
decoupling the first intermediate layer material and the bottom layer material;
reconstructing a hierarchical structure among materials according to the manufacturing relationship among the materials after decoupling;
and optimizing the production flow of each material in the reconstructed hierarchical structure to finish the engineering design of the eddy current displacement sensor.
Preferably, the top material is an eddy current displacement sensor;
the first interlayer material comprises a first circuit box material, a second circuit box material, a case material and an eddy current probe material;
the bottom layer materials are sub-modules of each first middle layer material; the first circuit box material comprises a PCB (printed circuit board), a first component and a first frame, the second circuit box material comprises a PCB, a second component and a second frame, the case material comprises a bottom plate, a cover plate, a shielding plate, a first frame and a second frame, and the eddy current probe material comprises a probe body and an electric connector.
Preferably, after optimizing the production flow of each material in the reconstructed hierarchical structure, the method further includes: based on the model of the probe body, the first circuit box material and the second circuit box material are subjected to personalized design.
Preferably, the decoupling the first intermediate layer material and the bottom layer material includes:
adding a third frame material into sub-materials of the first circuit box material and the second circuit box material respectively, and replacing a first frame and a second frame in the first circuit box material and the second circuit box material by using the third frame material to finish the assembly of the first circuit box material and the second circuit box material;
adding a second middle layer material between the top layer material and the first middle layer material, wherein the second middle layer material is used for replacing a third frame material in the first circuit box material and the second circuit box material;
after the chassis modules in the first middle layer material are assembled, the second middle layer material is utilized to replace the first circuit box material and the third frame material in the first circuit box material with a first frame and a second frame respectively, so that decoupling of the first middle layer material and the bottom layer material is completed.
Preferably, the new hierarchical structure comprises a top layer material, a second middle layer material, a first middle layer material and a bottom layer material from top to bottom in sequence.
Preferably, the optimizing the production flow of each material in the reconstructed hierarchical structure includes:
and carrying out production deduction on each bill of materials, and optimizing the production flow of each bill of materials according to the circulation relation of each material in the production deduction process.
Preferably, after optimizing the production flow of each material reconstructed into the hierarchical structure, the method further comprises: splitting the technical file of each bill of materials according to the optimized production flow:
dividing the optimized production flow into a plurality of space nodes, and splitting the technical file of each bill of materials into a plurality of assembly technical files according to the space nodes; wherein each assembly technical file corresponds to each material.
In a second aspect, an embodiment of the present invention further provides an engineering apparatus for designing an eddy current displacement sensor, including:
the bill of materials acquisition unit is used for acquiring a bill of materials of the eddy current displacement sensor product;
the hierarchical structure construction unit is used for constructing a hierarchical structure among materials according to the manufacturing relation; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material;
the decoupling unit is used for decoupling the first middle layer material and the bottom layer material;
a hierarchical structure reconstruction unit for reconstructing a hierarchical structure between the materials according to the manufacturing relationship between the decoupled materials;
and the optimizing unit is used for optimizing the production flow of each material reconstructed into the hierarchical structure so as to finish the engineering design of the eddy current displacement sensor.
In a third aspect, an embodiment of the present invention further provides an electronic device, including a memory and a processor, where the memory stores a computer program, and when the processor executes the computer program, the method described in any embodiment of the present specification is implemented.
In a fourth aspect, embodiments of the present invention also provide a computer-readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform a method according to any of the embodiments of the present specification.
Compared with the prior art, the invention has the following beneficial effects:
the embodiment of the invention provides an engineering design method and device for an eddy current displacement sensor, which comprises the steps of firstly obtaining a bill of materials of the eddy current displacement sensor, constructing a hierarchical structure among materials according to manufacturing relations among the materials, then decoupling a first middle-layer material and a bottom-layer material, reconstructing the hierarchical structure among the materials according to the manufacturing relations among the materials after decoupling, and finally optimizing the production flow of each material in the reconstructed hierarchical structure to finish the engineering design of the eddy current displacement sensor. According to the scheme, the first middle-layer material and the first bottom-layer material are decoupled, the hierarchical structure is reconstructed for each material after decoupling, and the production flow of each material in the hierarchical structure is optimized, so that the mutual restriction among the materials in each hierarchical structure is avoided, the production efficiency of the eddy current displacement sensor is obviously improved, and the development period is shortened.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of an engineering design of an eddy current displacement sensor according to one embodiment of the invention;
FIG. 2 is an engineering design drawing of a complete machine of an eddy current displacement sensor in the prior art;
FIG. 3 is an engineering design diagram of a complete machine of an eddy current displacement sensor according to one embodiment of the invention;
FIG. 4 is an engineering design diagram of a complete machine of an eddy current displacement sensor according to another embodiment of the invention;
FIG. 5 is a schematic diagram of an assembly structure of a circuit box material of an eddy current displacement sensor according to one embodiment of the invention;
FIG. 6 is a schematic diagram illustrating a split structure of a material related document of an eddy current displacement sensor according to an embodiment of the present invention;
FIG. 7 is a hardware architecture diagram of an electronic device according to an embodiment of the present invention;
FIG. 8 is a block diagram of an apparatus for engineering an eddy current displacement sensor according to one embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
As shown in fig. 2, the eddy current displacement sensing complete machine in the prior art generally consists of a main circuit board assembly, a backup circuit board assembly, a case and an eddy current probe; the circuit assembly consists of a PCB, components and a frame, the chassis consists of a frame, a shielding plate, a bottom plate and a cover plate, and the vortex probe consists of a probe body and an electric connector. Frame materials exist in three materials of the main circuit board assembly, the backup circuit board assembly and the vortex chassis, and after all materials in the chassis are matched in the engineering production process, the main circuit board assembly and the backup circuit board assembly can be assembled, so that production flows of the three material modules of the main circuit board assembly, the backup circuit board assembly and the vortex chassis are mutually restricted in the same hierarchical structure, the production efficiency of the eddy current displacement sensor is low, and mass production is difficult.
In order to solve the technical problems, the inventor provides an engineering design method of an eddy current displacement sensor based on a PLM system, wherein a hierarchical structure among materials is firstly constructed according to a manufacturing relation among material sheets of the eddy current displacement sensor, then decoupling is carried out on a first middle layer material and a bottom layer material, the hierarchical structure among the materials is reconstructed according to the manufacturing relation among the materials after decoupling, and finally, the production flow of each material in the reconstructed hierarchical structure is optimized, so that mutual restriction among the materials in the same hierarchical structure is avoided, and the production efficiency of the eddy current displacement sensor is improved.
Specific implementations of the above concepts are described below.
As shown in fig. 1, an embodiment of the present invention provides an engineering design method of an eddy current displacement sensor, including:
step 100: acquiring a bill of materials of the eddy current displacement sensor; wherein the bill of materials includes the manufacturing relation among the supplies that need in the production process;
step 102: constructing a hierarchical structure among materials according to the manufacturing relation; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material;
step 104: decoupling the first intermediate layer material and the bottom layer material;
step 106: reconstructing a hierarchical structure among materials according to the manufacturing relationship among the materials after decoupling;
step 108: and optimizing the production flow of each material in the reconstructed hierarchical structure to finish the engineering design of the eddy current displacement sensor.
In the embodiment of the invention, a hierarchical structure among materials is built according to manufacturing relations among the materials by firstly acquiring a bill of materials of the eddy current displacement sensor, then decoupling is carried out on a first middle layer material and a bottom layer material in the hierarchical structure, the hierarchical structure among the materials is reconstructed according to the manufacturing relations among the materials after decoupling, and finally, the production flow of each material in the reconstructed hierarchical structure is optimized to finish the engineering design of the eddy current displacement sensor. According to the scheme, the first middle-layer material and the first bottom-layer material are decoupled, the hierarchical structure is reconstructed for each material after decoupling, and the production flow of each material in the hierarchical structure is optimized, so that the mutual restriction among the materials in each hierarchical structure is avoided, the production efficiency of the eddy current displacement sensor is obviously improved, and the development period is shortened.
The manner in which the individual steps shown in fig. 1 are performed is described below.
For step 100:
as shown in fig. 3, firstly, a bill of materials of the eddy current displacement sensor is obtained, the bill of materials includes materials required in the production process of the eddy current displacement sensor and manufacturing relations among the materials, in this embodiment, the bill of materials of the eddy current displacement sensor includes the eddy current displacement sensor, and a first circuit box material, a second circuit box material, a case material and an eddy current probe material which form the eddy current displacement sensor, wherein the first circuit box material includes a PCB board, a first component and a first frame, the second circuit box material includes a PCB board, a second component and a second frame, the case material includes a bottom board, a cover board, a shielding board, a first frame and a second frame, and the eddy current probe material includes a probe body and an electrical connector.
For step 102:
in some preferred embodiments, the topper material is an eddy current displacement sensor;
the first interlayer material comprises a first circuit box material, a second circuit box material, a case material and an eddy current probe material;
the bottom layer materials are sub-modules of each first middle layer material; the first circuit box material comprises a PCB (printed circuit board), a first component and a first frame, the second circuit box material comprises a PCB, a second component and a second frame, the case material comprises a bottom plate, a cover plate, a shielding plate, a first frame and a second frame, and the eddy current probe material comprises a probe body and an electric connector.
In this embodiment, according to the manufacturing relationship between material sheets in the eddy current displacement sensor, a hierarchical structure between materials is constructed, as shown in fig. 2, the hierarchical structure sequentially includes, from top to bottom, four modules forming the eddy current displacement sensor, a first middle layer material, that is, four material modules forming the eddy current displacement sensor, that is, a first circuit box material, a second circuit box material, a case material and an eddy current probe material, and a bottom layer material, that is, a sub-module of the four modules in the first middle layer material, where the first circuit box material includes a PCB board, a first component and a first frame, the second circuit box material includes a PCB board, a second component and a second frame, the case material includes a bottom board, a cover board, a shielding board, a first frame and a second frame, and the eddy current probe material includes a probe body and an electrical connector. In the figure, in the same hierarchical structure, the first circuit box material and the second circuit box material both comprise frame materials, however, the frame materials need to be put into the first circuit box material and the second circuit box material for use after the processing of the chassis material is completed, in the production process, if the chassis material is not processed for a certain reason, the production flow of the first circuit box material and the second circuit box material can not be performed, so that the development progress of products is greatly affected, and the production efficiency is low.
For step 104:
in some preferred embodiments, the decoupling the first interlayer material and the underlayer material comprises:
adding a third frame material into sub-materials of the first circuit box material and the second circuit box material respectively, and replacing a first frame and a second frame in the first circuit box material and the second circuit box material by using the third frame material to finish the assembly of the first circuit box material and the second circuit box material;
adding a second middle layer material between the top layer material and the first middle layer material, wherein the second middle layer material is used for replacing a third frame material in the first circuit box material and the second circuit box material;
after the chassis materials in the first middle layer materials are assembled, the second middle layer materials are utilized to replace the first circuit box materials and the third frame materials in the first circuit box materials with first frames and second frames respectively, and decoupling of the first middle layer materials and the bottom layer materials is completed.
As shown in fig. 3, in order to realize decoupling of frame materials in the first circuit box material, the second circuit box material and the chassis material in the embodiment, a new frame, namely a third frame material, is added in a sub-module corresponding to the first circuit box material and the second circuit box material in the bottom layer material, and the third frame material is a process frame of an electric auxiliary part, so that mutual restriction among materials in the first middle layer material can be avoided, and synchronous production processes of the first circuit box material, the second circuit box material and the chassis material are ensured; secondly, adding a second intermediate layer material between the top layer material and the first intermediate layer material, wherein the second intermediate layer material comprises a first circuit box material, a second circuit box material and a case material, and meanwhile comprises a plurality of components convenient for replacing frame materials; therefore, the chassis materials do not restrict the electric installation process of the first circuit box materials and the second circuit box any more, the development period is shortened, and the production efficiency is improved.
In this embodiment, since new materials are added after decoupling, the manufacturing relationship between the materials is changed, so that the hierarchical structure between the materials after decoupling needs to be re-integrated, and the re-integrated relationship is shown in fig. 3, where the new hierarchical structure sequentially includes a top layer material, a second middle layer material, a first middle layer material, and a bottom layer material from top to bottom.
For step 106:
in some preferred embodiments, the optimizing the production flow of each item in the reconstructed hierarchical structure includes:
and carrying out production deduction on each bill of materials, and optimizing the production flow of each bill of materials according to the circulation relation of each material in the production deduction process.
In this embodiment, after the hierarchical structure reforming between the materials is completed, production deduction needs to be performed on each material, and the production flow is optimized according to the circulation relationship of each material in the production deduction. Taking the newly added second intermediate layer material in this embodiment as an example, the circulation relationship between the second intermediate layer material and the upper and lower layer materials is: after the first circuit box material and the second circuit box material are electrically assembled, the electrically assembled circuit box material flows to the second intermediate layer material, the third frame in the first circuit box material and the second circuit box material is replaced by the first frame and the second frame in the case material, single-channel assembly is carried out on the first frame and the second frame, after the assembly is completed, the circuit box material flows to the top layer material (namely the electric vortex circuit whole machine material) continuously for carrying out a subsequent adjustment testing link. And carrying out production deduction on the material of the second intermediate layer: the second intermediate layer material is used for changing the frame in first circuit box material and the second circuit box material, as shown in fig. 5, the front of the single-channel frame of the circuit box material is two electric connectors for power and communication, the back is 4 tuner, if the assembly link (i.e. the first assembly link) when the circuit box material uses the third frame is all electric-assembled, the subsequent frame can not be changed, therefore, the tuner is not electric-assembled when the first electric-assembled link, and the tuner electric-assembly is performed after the frame is changed in the single-channel assembly link. Therefore, the production flow of the second interlayer material is optimized as follows: and dismantling the process frame (namely the third frame), assembling the formal frame (namely the first frame and the second frame), and assembling the tuner and the electric tuner.
In some preferred embodiments, after optimizing the production flow of each item of the reconstructed hierarchical structure, it further comprises: splitting the technical file of each bill of materials according to the optimized production flow;
dividing the optimized production flow into a plurality of space nodes, and dividing the technical file of each material into a plurality of technical files according to the space nodes; wherein each technical file corresponds to each material.
In the embodiment, different from the prior art that the related files in the production process of the eddy current displacement sensor all adopt a whole assembly technology file, the eddy current displacement sensor is divided into a plurality of space nodes according to the production flow, each material and each space node comprise the corresponding assembly technology file, and the related files in the production process of the eddy current displacement sensor are split and recombined according to the dimension of the material and are distributed according to the space nodes. As shown in fig. 6, the second interlayer material and the upper and lower layer materials are still taken as examples: the electric installation of the tuner is needed to be carried out on the circuit box materials in the production flow of the second middle layer, the electric installation technical requirement in the flow before the optimization is not carried out is all electric installation on the circuit box materials, the electric installation technical requirement is required to be split into two parts according to a new material hierarchy, the electric installation technical requirement of the circuit box materials is not welded with the tuner, the frame of the second middle layer materials is required to be replaced, and the assembly technical requirement is also required to be split into two parts according to the material according to the new material hierarchy.
In some preferred embodiments, after optimizing the production flow of each material in the reconstructed hierarchical structure, the method further comprises: based on the model of the probe body, the first circuit box material and the second circuit box material are subjected to personalized design.
In this embodiment, based on different displacement measurement requirements, probe bodies of different types, such as a D15 type, a D10A type and the like, are required to be adopted, and the different types of probes also have different resistance-capacitance devices of the components in the corresponding first circuit box material and second circuit box material, so, in order to meet the flexibility of module multiplexing and model configuration, as shown in fig. 4, the first circuit box material and the second circuit box material are individually designed, and by putting the same parts into a virtual piece standard component package and different virtual piece configuration component packages in the first circuit box material and the second circuit box material corresponding to the probe bodies of different types, the virtual piece configuration component packages are put into a small number of resistance-capacitance devices due to the difference of the probe types; meanwhile, the model power supply has two paths (+12V, -12V) and three paths (+12V, -12V and +5V) of requirements, so that the states of the PCB and the components are two. Therefore, the chassis, the virtual part standard component package, the PCB, the chassis lower part, the connector, the first circuit box material and the first circuit box material are designed to be universal basic modules, and the probe body, the first circuit box material configuration package and the second circuit box material configuration package are designed to be model configuration modules. Compared with the existing engineering design method, the universal basic module solves the problems of module reusability and batch production of the whole machine product, the model configuration module can be custom designed, and can be used as an optional piece to solve the problems of the configurationability of the whole machine product in the product family and the flexible response of the user demand, so that the manufacturing cost is saved, and the engineering design difficulty among the multiple model differences is solved.
As shown in fig. 7 and 8, an embodiment of the present invention provides an engineering design device for an eddy current displacement sensor. The apparatus embodiments may be implemented by software, or may be implemented by hardware or a combination of hardware and software. In terms of hardware, as shown in fig. 7, a hardware architecture diagram of an electronic device where an engineering design apparatus for an eddy current displacement sensor provided in an embodiment of the present invention is located, in addition to a processor, a memory, a network interface, and a nonvolatile memory shown in fig. 8, the electronic device where the apparatus is located in the embodiment may generally include other hardware, such as a forwarding chip responsible for processing a message, and so on. For example, as shown in fig. 8, the device in a logic sense is formed by reading a corresponding computer program in a nonvolatile memory into a memory by a CPU of an electronic device where the device is located.
As shown in fig. 8, an engineering design device of an eddy current displacement sensor provided in this embodiment includes:
a bill of materials acquisition unit 801 for acquiring a bill of materials of the eddy current displacement sensor product;
a hierarchical structure construction unit 802, configured to construct a hierarchical structure between materials according to the manufacturing relationship; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material;
a decoupling unit 803, configured to decouple the first intermediate layer material and the bottom layer material;
a hierarchy reconstruction unit 804 that reconstructs a hierarchy between materials according to the manufacturing relationship between the decoupled materials;
and the optimizing unit 805 is configured to optimize a production flow of each material reconstructed into the hierarchical structure, so as to complete engineering design of the eddy current displacement sensor.
In one embodiment of the present invention, in the hierarchical structure building unit 802, the top material is an eddy current displacement sensor;
the first interlayer material comprises a first circuit box material, a second circuit box material, a case material and an eddy current probe material;
the bottom layer materials are sub-modules of each first middle layer material; the first circuit box material comprises a PCB (printed circuit board), a first component and a first frame, the second circuit box material comprises a PCB, a second component and a second frame, the case material comprises a bottom plate, a cover plate, a shielding plate, a first frame and a second frame, and the eddy current probe material comprises a probe body and an electric connector.
In one embodiment of the present invention, the decoupling unit 803 is configured to perform the following operations:
adding a third frame material into sub-materials of the first circuit box material and the second circuit box material respectively, and replacing a first frame and a second frame in the first circuit box material and the second circuit box material by using the third frame material to finish the assembly of the first circuit box material and the second circuit box material;
adding a second middle layer material between the top layer material and the first middle layer material, wherein the second middle layer material is used for replacing a third frame material in the first circuit box material and the second circuit box material;
after the chassis modules in the first middle layer material are assembled, the second middle layer material is utilized to replace the first circuit box material and the third frame material in the first circuit box material with a first frame and a second frame respectively, so that decoupling of the first middle layer material and the bottom layer material is completed.
In one embodiment of the present invention, in the hierarchy reconstruction unit 804, the new hierarchy includes, in order from top to bottom, a top layer material, a second middle layer material, a first middle layer material, and a bottom layer material.
In one embodiment of the present invention, the optimizing unit 805 is configured to perform the following operations:
and carrying out production deduction on each bill of materials, and optimizing the production flow of each bill of materials according to the circulation relation of each material in the production deduction process.
In one embodiment of the present invention, the engineering apparatus for an eddy current displacement sensor further comprises:
and the personalized design unit is used for carrying out personalized design on the first circuit box material and the second circuit box material based on the model of the probe body.
In one embodiment of the present invention, the engineering apparatus for an eddy current displacement sensor further comprises:
the file splitting unit is used for splitting the technical file of each bill of materials according to the optimized production flow;
dividing the optimized production flow into a plurality of space nodes, and splitting the technical file of each bill of materials into a plurality of assembly technical files according to the space nodes; wherein each assembly technical file corresponds to each material.
It should be understood that the structure illustrated in the embodiments of the present invention does not constitute a specific limitation on the engineering design of an eddy current displacement sensor. In other embodiments of the invention, an engineered device for an eddy current displacement sensor may include more or fewer components than shown, or certain components may be combined, certain components may be split, or different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.
The content of information interaction and execution process between the modules in the device is based on the same conception as the embodiment of the method of the present invention, and specific content can be referred to the description in the embodiment of the method of the present invention, which is not repeated here.
The embodiment of the invention also provides electronic equipment, which comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the engineering design method of the eddy current displacement sensor in any embodiment of the invention when executing the computer program.
The embodiment of the invention also provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and the computer program when executed by a processor causes the processor to execute the engineering design method of the eddy current displacement sensor in any one embodiment of the invention.
Specifically, a system or apparatus provided with a storage medium on which a software program code realizing the functions of any of the above embodiments is stored, and a computer (or CPU or MPU) of the system or apparatus may be caused to read out and execute the program code stored in the storage medium.
In this case, the program code itself read from the storage medium may realize the functions of any of the above-described embodiments, and thus the program code and the storage medium storing the program code form part of the present invention.
Examples of the storage medium for providing the program code include a floppy disk, a hard disk, a magneto-optical disk, an optical disk (e.g., CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a nonvolatile memory card, and a ROM. Alternatively, the program code may be downloaded from a server computer by a communication network.
Further, it should be apparent that the functions of any of the above-described embodiments may be implemented not only by executing the program code read out by the computer, but also by causing an operating system or the like operating on the computer to perform part or all of the actual operations based on the instructions of the program code.
Further, it is understood that the program code read out by the storage medium is written into a memory provided in an expansion board inserted into a computer or into a memory provided in an expansion module connected to the computer, and then a CPU or the like mounted on the expansion board or the expansion module is caused to perform part and all of actual operations based on instructions of the program code, thereby realizing the functions of any of the above embodiments.
It is noted that relational terms such as first and second, and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of additional identical elements in a process, method, article or apparatus that comprises the element.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An engineering design method of an eddy current displacement sensor is characterized by comprising the following steps:
acquiring a bill of materials of the eddy current displacement sensor; wherein the bill of materials includes the manufacturing relation among the supplies that need in the production process;
constructing a hierarchical structure among materials according to the manufacturing relation; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material;
decoupling the first intermediate layer material and the bottom layer material;
reconstructing a hierarchical structure among materials according to the manufacturing relationship among the materials after decoupling;
and optimizing the production flow of each material in the reconstructed hierarchical structure to finish the engineering design of the eddy current displacement sensor.
2. The engineering design method according to claim 1, wherein,
the top material is an eddy current displacement sensor;
the first interlayer material comprises a first circuit box material, a second circuit box material, a case material and an eddy current probe material;
the bottom layer materials are sub-modules of each first middle layer material; the first circuit box material comprises a PCB (printed circuit board), a first component and a first frame, the second circuit box material comprises a PCB, a second component and a second frame, the case material comprises a bottom plate, a cover plate, a shielding plate, a first frame and a second frame, and the eddy current probe material comprises a probe body and an electric connector.
3. The engineering design method according to claim 2, wherein,
after optimizing the production flow of each material in the reconstructed hierarchical structure, the method further comprises the following steps: based on the model of the probe body, the first circuit box material and the second circuit box material are subjected to personalized design.
4. The engineering design method according to claim 2, wherein,
the decoupling the first intermediate layer material and the bottom layer material comprises:
adding a third frame material into sub-materials of the first circuit box material and the second circuit box material respectively, and replacing a first frame and a second frame in the first circuit box material and the second circuit box material by using the third frame material to finish the assembly of the first circuit box material and the second circuit box material;
adding a second middle layer material between the top layer material and the first middle layer material, wherein the second middle layer material is used for replacing a third frame material in the first circuit box material and the second circuit box material;
after the chassis materials in the first middle layer materials are assembled, the second middle layer materials are utilized to replace the first circuit box materials and the third frame materials in the first circuit box materials with first frames and second frames respectively, and decoupling of the first middle layer materials and the bottom layer materials is completed.
5. The engineering design method of claim 4, wherein,
the new hierarchical structure sequentially comprises a top layer material, a second middle layer material, a first middle layer material and a bottom layer material from top to bottom.
6. The engineering design method according to claim 1, wherein,
the optimizing the production flow of each material in the reconstructed hierarchical structure comprises the following steps:
and carrying out production deduction on each bill of materials, and optimizing the production flow of each bill of materials according to the circulation relation of each material in the production deduction process.
7. The engineering design method according to claim 1, wherein,
after optimizing the production flow of each material reconstructing the hierarchical structure, the method further comprises the following steps: splitting the technical file of each bill of materials according to the optimized production flow;
dividing the optimized production flow into a plurality of space nodes, and splitting the technical file of each bill of materials into a plurality of assembly technical files according to the space nodes; wherein each assembly technical file corresponds to each material.
8. An apparatus for engineering an eddy current displacement sensor, comprising:
the bill of materials acquisition unit is used for acquiring a bill of materials of the eddy current displacement sensor product; wherein the bill of materials includes the manufacturing relation among the supplies that need in the production process;
the hierarchical structure construction unit is used for constructing a hierarchical structure among materials according to the manufacturing relation; the hierarchical structure comprises a top layer material, a first middle layer material and a bottom layer material;
the decoupling unit is used for decoupling the first middle layer material and the bottom layer material;
a hierarchical structure reconstruction unit for reconstructing a hierarchical structure between the materials according to the manufacturing relationship between the decoupled materials;
and the optimizing unit is used for optimizing the production flow of each material reconstructed into the hierarchical structure so as to finish the engineering design of the eddy current displacement sensor.
9. An electronic device comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the method of any of claims 1-7 when the computer program is executed.
10. A computer readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform the method of any of claims 1-7.
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