CN116759361A - Linear module and semiconductor device - Google Patents
Linear module and semiconductor device Download PDFInfo
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- CN116759361A CN116759361A CN202311051592.5A CN202311051592A CN116759361A CN 116759361 A CN116759361 A CN 116759361A CN 202311051592 A CN202311051592 A CN 202311051592A CN 116759361 A CN116759361 A CN 116759361A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000003754 machining Methods 0.000 abstract description 3
- 230000009191 jumping Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bearings For Parts Moving Linearly (AREA)
Abstract
The present application relates to a linear module and a semiconductor device, the linear module comprising: a mounting seat provided with a guide part lengthwise along a first direction; a guide member movably installed on the guide portion in a first direction; the moving piece can controllably move along a first direction relative to the mounting seat; the guide piece is flexibly connected with the moving piece to absorb relative movement between the moving piece and the guide piece along a second direction, and the second direction is intersected with the first direction. According to the linear module, due to certain machining precision or assembly precision errors of the guide part, when the guide part moves along the guide part, certain relative movement can be generated on the relative movement part in the second direction. And the relative motion on the second direction is absorbed through the flexible connection of the guide piece and the moving piece, so that the motion working condition of the moving piece is not influenced, the working condition before the guide piece jumps is still kept, the stability of the output linear motion of the moving piece is maintained, and the stability of the integral work of the linear module is ensured.
Description
Technical Field
The present application relates to the field of semiconductor technology, and in particular, to a linear module and a semiconductor device.
Background
The linear module is also called as a linear module, a rectangular robot, a linear sliding table and the like, and can realize linear and curvilinear motion of the load through the combination of the units, so that the automation of light load is more flexible and the positioning is more accurate. The linear module has the characteristics of linear movement, high single movement speed and high repeated positioning precision, so that the linear module is widely applied to various devices, and the time and efficiency of development of an automatic production line and automatic devices can be effectively reduced.
In the working process of the linear module, due to certain assembly errors between the guide rail and the sliding block of the linear module, when the sliding block of the linear module moves to certain positions on the guide rail, the phenomenon that the sliding block is not matched with the guide rail can occur, so that the linear module is enabled to have sharp high-frequency abnormal noise, and the performance of the linear module is affected.
Disclosure of Invention
Based on the above, it is necessary to provide a linear module and a semiconductor device for solving the problem that the linear module has a mismatch between the slider and the rail.
A linear module, comprising:
a mounting seat provided with a guide part extending longitudinally along a first direction;
a guide member movably mounted on the guide portion in the first direction;
and the moving piece is flexibly connected with the guide piece in a second direction intersecting the first direction, and is configured to be capable of relatively moving along the mounting seat in the first direction.
In one embodiment, the linear module further comprises a cushioning member, the cushioning member being deformable along the second direction;
the moving member and the guide member are flexibly connected via the buffer member.
In one embodiment, the buffer member has two ends disposed opposite to each other along a third direction, wherein one end is fixedly connected with the moving member, the other end is fixedly connected with the guiding member, and the third direction, the first direction and the second direction intersect each other two by two and are not coplanar.
In one embodiment, the moving member includes a moving body and a moving mounting block which are fixedly connected, the moving body and the moving mounting block are respectively disposed on two opposite sides of the buffer member in the second direction, and jointly clamp the buffer member.
In one embodiment, the guide member comprises a guide body and a guide mounting block which are fixedly connected, and the guide body is movably mounted on the guide part along the first direction;
the guide body and the guide mounting block are respectively arranged on two opposite sides of the buffer piece in the second direction and jointly clamp the buffer piece.
In one embodiment, the guide body is provided with a guide groove penetrating along the first direction, and the guide part protrudes out of the surface of the mounting seat and is coupled to the guide groove in a relatively movable manner in the first direction.
In one embodiment, the guide parts comprise a plurality of guide parts, all the guide parts are arranged on the mounting seat at intervals along the second direction, and each guide part is provided with the guide piece;
and in the adjacent two guide parts, the guide piece on at least one guide part is flexibly connected with the moving piece in the second direction.
In one embodiment, the linear module further comprises a stator and a rotor, wherein the stator is fixedly installed on the installation seat and is positioned between two adjacent guide parts;
one side of the rotor is used for being induced by the stator and capable of moving along the first direction, and the other end of the rotor is fixedly connected with the moving part.
In one embodiment, the guide part is provided with a plurality of guide parts, and all the guide parts are flexibly connected with the moving part in the second direction.
A semiconductor device comprising a linear module as claimed in any one of the preceding claims.
When the linear module is actually applied, due to certain machining precision or assembly precision errors of the guide part, certain relative motion can be generated in the second direction relative to the moving part when the guide part moves along the guide part. And the relative motion on the second direction is absorbed through the flexible connection of the guide piece and the moving piece, so that the motion working condition of the moving piece is not influenced, the working condition before the guide piece jumps is still kept, the stability of the output linear motion of the moving piece is maintained, and the stability of the integral work of the linear module is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a linear module according to some embodiments of the application.
Fig. 2 is an enlarged view of embodiment a of fig. 1.
Fig. 3 is a side view of the linear module of the embodiment of fig. 1.
Reference numerals illustrate:
a mounting base 10; a guide 11;
a guide 20; a guide body 21; a guide mounting block 22; a guide groove 23; a first connection hole 24;
a mover 30; a moving body 31; a motion mounting block 32; a first mounting hole 33;
a buffer member 40; a stator 41; a mover 42;
a first direction X; a second direction Y; and a third direction Z.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.
The current linear module can carry out debugging process before use to guarantee that the motion precision of slider satisfies work production demand. But in the debugging process of the linear module, the small-range travel of the sliding block on the guide rail can be debugged, for example, 5 mm-10 mm, the motion precision of the debugged sliding block is high enough, the motion time is short, abnormal sounds are avoided, and the production and working requirements can be met.
However, the above mode is only suitable for short-stroke high-frequency motion, if the stroke of the sliding block is longer, and exceeds the debugging stroke range, as the parallelism and the jumping amount of different positions of the guide rails are different, the parallelism refers to the parallelism between two guide rails, the jumping amount refers to the dimensional accuracy error of the guide rails, the two errors can cause the sliding block to be unable to be completely matched with the guide rails, the sliding block and the guide rails generate friction, sharp high-frequency abnormal sounds are generated, and meanwhile, the friction between the sliding block and the guide rails also can influence the motion performance of the sliding block, and the performance of the linear module is also influenced.
For this purpose, referring to fig. 1, a linear module according to an embodiment of the present application includes a mounting base 10, a moving member 30, a guiding member 20 and a buffering member 40.
The mount 10 has a guide portion 11 extending lengthwise in a first direction X, the guide member 20 being movably mounted on the guide portion 11 in the first direction X, and the moving member 30 being configured to be movable relative to the mount 10 in the first direction X. In the second direction Y, which is opposite to the first direction X, the guide member 20 is flexibly connected with the moving member 30, so that in the first direction X, the moving member 30 can drive the guide member 20 to move together, so that the movement of the moving member 30 is guided and limited by the movement of the guide member 20 on the guide portion 11, and the moving member 30 is prevented from swinging away from the first direction X in the movement process, so that the moving member 30 can normally output linear movement to the outside.
In the second direction Y, the guiding element 20 is flexibly connected with the moving element 30, so as to absorb the relative movement between the moving element 30 and the guiding element 20 along the second direction Y, that is, if the guiding element 20 generates the relative movement with respect to the moving element 30 along the second direction Y, the movement of the moving element 30 is not affected by the flexible connection between the guiding element 20 and the moving element 30, so that the normal operation of the moving element 30 is ensured.
In actual use, the guide member 20 moves along the guide portion 11 with a certain relative movement in the second direction Y with respect to the moving member 30 due to a certain machining precision or assembly precision error of the guide portion 11. And the guide piece 20 is flexibly connected with the moving piece 30 in the second direction Y to absorb the relative movement in the second direction Y, so that the movement working condition of the moving piece 30 is not influenced, the working condition before the guide piece 20 jumps is still kept, the stability of the linear movement output by the moving piece 30 is maintained, and the stability of the integral work of the linear module is ensured.
Optionally, the linear module of the present application is a linear motor module, i.e. the electric energy is directly converted into mechanical energy of linear motion by the magnet and the coil windings, without any intermediate conversion mechanism. Specifically, the linear motor module includes a stator 41 and a mover 42, one of the stator 41 and the mover 42 having a magnet mounted therein and the other having a coil winding mounted therein. The stator 41 is fixedly mounted on the mounting seat 10 and extends lengthwise along the first direction X, one side of the mover 42 is mounted close to the stator 41, and the other side is fixedly connected with the moving member 30, so that the mover 42 is suspended above the stator 41 by the moving member 30, and when the interior of the coil winding is electrified, the mover 42 can move along the first direction X relative to the stator 41 by electromagnetic induction, and the moving member 30 is driven to move along the first direction X.
The linear module of the present application may be a module for outputting linear motion, such as a synchronous belt module or a screw module, and is not limited herein.
In some embodiments of the present application, the linear module further includes a buffer member 40, the buffer member 40 being deformable in the second direction Y, the moving member 30 and the guide member 20 being flexibly connected via the buffer member 40. Thus, when the guide member 20 moves relative to the moving member 30, the buffer member 40 is deformed by the guide member 20, so as to absorb the relative movement of the guide member 20 in the second direction Y, so as to maintain the stability of the movement of the moving member 30 in the first direction X.
In some embodiments, the buffer member 40 has two opposite ends disposed along the third direction Z, wherein one end is fixedly connected to the moving member 30, the other end is fixedly connected to the buffer member 40, and the third direction Z, the first direction X and the second direction Y intersect each other two by two and are not coplanar. When the guide member 20 moves relatively to the moving member 30, the guide member 20 drives one end of the buffer member 40 to move, and at this time, the buffer member 40 generates a certain bending deformation, so that the other end of the buffer member 40 still maintains in a normal working condition, and thus the moving member 30 connected with the other end of the buffer member 40 is not affected by the guide member 20, and the movement stability of the moving member 30 in the first direction X is ensured.
Optionally, the buffer member 40 is made of metal, so as to absorb the relative motion between the guide member 20 and the moving member 30 by deforming the metal, while the buffer member 40 is rectangular or trapezoidal in shape, and the ratio of the length of the buffer member 40 in the first direction X to the thickness of the buffer member 40 in the second direction Y is more than 20 times, i.e. the buffer member 40 is a thin metal sheet, so that the buffer member 40 has good toughness, so as to facilitate absorbing the relative motion between the guide member 20 and the moving member 30. In other embodiments, the cushioning member 40 may be a non-metal member, such as rubber, plastic, or other material having a certain elastic force, which is not limited herein.
In some embodiments, the moving member 30 includes a moving body 31 and a moving mounting block 32 that are fixedly connected, and the moving body 31 and the moving mounting block 32 are respectively disposed on opposite sides of the buffer member 40 in the second direction Y, and jointly clamp the buffer member 40. Further, the guide member 20 includes a guide body 21 and a guide mounting block 22 fixedly connected, the guide body 21 is movably mounted on the guide portion 11 along the first direction X, and the guide body 21 and the guide mounting block 22 are respectively disposed at opposite sides of the buffer member 40 in the second direction Y and jointly clamp the buffer member 40.
In this way, both ends of the buffer member 40 in the third direction Z are respectively pressed against the moving member 30 and the guide member 20, and when the guide member 20 and the moving member 30 are relatively moved, bending deformation is generated through a portion where the buffer member 40 is not pressed, that is, the middle portion of the buffer member 40, to absorb the relative movement of the guide member 20 and the moving member 30.
Specifically, one end of the buffer member 40 is provided with a plurality of first fixing holes in a penetrating manner, the other end of the buffer member is provided with a plurality of second fixing holes in a penetrating manner, the moving body 31 is provided with a plurality of first mounting holes 33, the moving mounting block 32 is provided with a plurality of second mounting holes, and all the first fixing holes, all the first mounting holes 33 and all the second mounting holes are in one-to-one correspondence. Further, the linear module further includes a plurality of fasteners, which may be screws, bolts, etc., and penetrate through the first mounting hole 33, the first fixing hole and the second mounting hole in sequence, and fixedly connect the moving body 31, the buffer 40 and the moving mounting block 32.
Further, a plurality of first connecting holes 24 are formed in the guide body 21, a plurality of second connecting holes are formed in the guide mounting block 22, all the first connecting holes 24, all the second mounting holes and all the second connecting holes are in one-to-one correspondence, and the fasteners sequentially penetrate through the first connecting holes 24, the second mounting holes and the second connecting holes and fixedly connect the guide body 21, the buffer piece 40 and the guide mounting block 22.
In particular, in the embodiment, the guide 11 protrudes from the surface of the mount 10, so as to form a sliding rail for sliding the guide 20 on the surface of the mount 10. Meanwhile, the guide body 21 is provided with a guide groove 23 penetrating along the first direction X, and the guide portion 11 is coupled to the guide groove 23 in a manner of relatively moving along the first direction X, so that the guide body 21 can move on the guide portion 11 through the guide groove 23.
It should be noted that, the shape of the guiding body 21 may be correspondingly set according to the shape of the guiding portion 11, for example, in other embodiments, the guiding portion 11 may also be a groove concavely formed on the surface of the mounting base 10 and elongated along the first direction X, the guiding body 21 is inserted into the groove, and the guiding body 21 can slide in the groove, so that the moving member 30 may be guided and limited by the movement of the groove and the guiding body 21, which is not limited herein.
In some embodiments of the present application, in order to ensure different movement conditions of the moving element 30, the guiding portion 11 guides and limits the moving element 30, where the guiding portion 11 includes a plurality of guiding portions 11, all guiding portions 11 are arranged on the mounting base 10 at intervals along the second direction Y, each guiding portion 11 is provided with a guiding element 20, and all guiding elements 20 are connected to the moving element 30, so that the movement of the moving element 30 is guided and limited by the plurality of guiding portions 11 and the plurality of guiding elements 20 at the same time, so as to further improve the stability of the moving element 30 during movement.
In which there is a parallelism error between the plurality of guide parts 11 due to an installation error of the plurality of guide parts 11, for which reason, in the adjacent two guide parts 11, the guide 20 on one of the guide parts 11 is flexibly connected with the moving member 30 in the second direction Y, the guide 20 on the other guide part 11 is rigidly connected with the moving member 30, i.e., the guide 20 on one of the guide parts 11 is connected with the moving member 30 through the buffer member 40, and the guide 20 on the other guide part 11 is directly connected with the moving member 30. In this way, if there is a parallelism error between two adjacent guide portions 11, when the guide member 20 on one guide portion 11 approaches or moves away from the guide member 20 on the other guide portion 11, that is, the two guide members 20 generate a relative motion in the second direction Y, since one guide member 20 is fixedly connected with the moving member 30, the relative motion can be absorbed by the buffer member 40 connected with the other guide member 20, so that the motion stability of the moving member 30 in the first direction X is ensured.
Further, in other embodiments, the guiding elements 20 on two adjacent guiding portions 11 are each flexibly connected to the moving element 30 in the second direction Y, i.e. the guiding element 20 on each guiding portion 11 is connected to the moving element 30 by the buffer element 40. When a parallelism error exists between two adjacent guide parts 11, and the guide piece 20 on one guide part 11 generates relative motion relative to the guide piece 20 on the other guide part 11, the guide piece 20 on the guide part 11 can directly absorb the relative motion through the buffer piece 40 and cannot be transmitted to the moving piece 30, so that the motion stability of the moving piece 30 in the first direction X is ensured.
It should be noted that, if the guiding elements 20 on the two adjacent guiding portions 11 are flexibly connected with the moving element 30 in the second direction Y, the moving element 30 may swing in the second direction Y during the movement, for example, when the second direction Y is parallel to the gravity direction, and the guiding elements 20 and the moving element 30 are all disposed on the side surfaces of the mounting base 10, the upper and lower ends of the moving element 30 are flexibly connected with the guiding elements 20, and the moving element 30 may swing up and down under the action of gravity. If the guide 11 and the moving member 30 are both laid on the mounting base 10 and the second direction Y is perpendicular to the gravity direction, the probability of the moving member 30 swinging is reduced. Therefore, in the two adjacent guide portions 11, the guide member 20 on at least one guide portion 11 is flexibly connected to the moving member 30, and may be specifically selected according to actual use conditions, which is not limited herein.
In some embodiments, in order to ensure the guiding and limiting effects of the guiding element 20 and the guiding part 11 on the moving element 30, when the linear module of the present application is a linear motor module, the stator 41 of the linear motor module is installed between two adjacent guiding parts 11, so that both ends of the stator 41 in the second direction Y can be guided and limited by the two guiding parts 11 and the corresponding guiding element 20, and the stability of the movement of the stator 41 along the first direction X is ensured.
In the embodiment of the present application, each guide portion 11 is provided with a plurality of guide members 20, all guide members 20 on one of the two adjacent guide portions 11 are flexibly connected with the moving member 30 in the second direction Y, and all guide members 20 on the other guide portion can be flexibly connected or rigidly connected with the moving member 30 according to practical working conditions. In the actual use process, since the jumping amounts of the guide part 11 at different positions are inconsistent, if there is only one guide piece 20 on the guide part 11, the guide piece 20 will encounter two jumping amounts on the guide part 11 at the same time, and even if the guide piece 20 is flexibly connected with the moving piece 30, the two jumping amounts may still cause friction between the guide piece 20 and the guide part 11, so as to affect the stability of the movement of the stator 41 along the first direction X.
By providing a plurality of guide members 20 on the guide portion 11, each guide member 20 can absorb a runout amount on the guide portion 11 through the buffer member 40 connected with the guide member 20, and even if the runout amounts of the guide portion 11 at different positions are inconsistent, each runout can be absorbed through the plurality of guide members 20, so that the stability of the movement of the stator 41 along the first direction X is further ensured.
The embodiment of the application also provides a semiconductor device, which comprises the linear module in any embodiment. In semiconductor devices, it is often required that the linear die set output continuous high-precision high-frequency motion, and thus there is a high requirement for the stability of the linear die set output motion. Therefore, the guide member 20 and the moving member 30 of the linear module are flexibly connected to absorb the relative movement of the guide member 20 and the moving member 30 in the second direction Y, so that the movement condition of the moving member 30 is not affected, the condition before the guide member 20 jumps is still maintained, the stability of the linear movement output by the moving member 30 is maintained, and the continuous high-precision high-frequency movement output by the linear module is ensured.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
1. A linear module, the linear module comprising:
a mounting base (10) having a guide portion (11) extending longitudinally in a first direction (X);
a guide (20) mounted on the guide portion (11) so as to be movable in the first direction (X);
-a moving member (30), in a second direction (Y) intersecting the first direction (X), the moving member (30) being flexibly connected to the guide member (20), and the moving member (30) being configured to be movable in the first direction (X) relative to and along the mounting (10).
2. The linear module according to claim 1, characterized in that it further comprises a buffer (40), said buffer (40) being deformable along said second direction (Y);
the moving part (30) and the guide part (20) are flexibly connected via the buffer part (40).
3. The linear module according to claim 2, characterized in that the buffer member (40) has two ends disposed opposite to each other along a third direction (Z), one of which is fixedly connected to the moving member (30) and the other of which is fixedly connected to the guide member (20), the third direction (Z), the first direction (X) and the second direction (Y) intersecting each other in pairs and not being coplanar.
4. Linear module according to claim 2, characterized in that the moving part (30) comprises a moving body (31) and a moving mounting block (32) which are fixedly connected, the moving body (31) and the moving mounting block (32) being arranged on opposite sides of the buffer part (40) in the second direction (Y) respectively and jointly clamping the buffer part (40).
5. Linear module according to claim 2, characterized in that the guide (20) comprises a guide body (21) and a guide mounting block (22) fixedly connected, the guide body (21) being movably mounted on the guide portion (11) along the first direction (X);
the guide body (21) and the guide mounting block (22) are respectively arranged on two opposite sides of the buffer piece (40) in the second direction (Y), and jointly clamp the buffer piece (40).
6. The linear module according to claim 5, wherein the guide body (21) is provided with a guide groove (23) penetrating along the first direction (X), and the guide portion (11) protrudes from the surface of the mounting base (10) and is coupled to the guide groove (23) in a manner capable of relatively moving in the first direction (X).
7. Linear module according to claim 1, characterized in that said guide (11) comprises a plurality of guide parts (11), all of which guide parts (11) are arranged on said mounting base (10) at intervals along said second direction (Y), each guide part (11) being fitted with said guide element (20);
in two adjacent guide parts (11), the guide piece (20) on at least one guide part (11) is flexibly connected with the moving piece (30) in the second direction (Y).
8. The linear module according to claim 7, characterized in that it further comprises a stator (41) and a mover (42), said stator (41) being fixedly mounted to said mounting seat (10) and being located between two adjacent guide portions (11);
one side of the rotor (42) is used for being induced by the stator (41) and capable of moving along the first direction (X), and the other end of the rotor (42) is fixedly connected with the moving part (30).
9. Linear module according to claim 1, characterized in that the guide part (11) is provided with a plurality of the guide elements (20), all of the guide elements (20) being flexibly connected to the moving element (30) in the second direction (Y).
10. A semiconductor device comprising a linear module as claimed in any one of claims 1-9.
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| CN202311051592.5A CN116759361B (en) | 2023-08-21 | 2023-08-21 | Linear module and semiconductor device |
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| CN202311051592.5A CN116759361B (en) | 2023-08-21 | 2023-08-21 | Linear module and semiconductor device |
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| CN116759361A true CN116759361A (en) | 2023-09-15 |
| CN116759361B CN116759361B (en) | 2024-03-22 |
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| CN112259488A (en) * | 2020-12-22 | 2021-01-22 | 上海隐冠半导体技术有限公司 | Micro-motion platform and motion device |
| CN215072094U (en) * | 2021-04-07 | 2021-12-07 | 微纳精密科技(东莞)有限公司 | Linear module and processing equipment |
| WO2022006993A1 (en) * | 2020-07-08 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Moving mechanism and electronic device |
| WO2022028260A1 (en) * | 2020-08-05 | 2022-02-10 | 佛山市华道超精科技有限公司 | Air-floating guide rail type switchable rigid-flexible coupling motion platform |
| CN114613721A (en) * | 2022-05-10 | 2022-06-10 | 上海隐冠半导体技术有限公司 | Motion platform and motion device |
| CN217114356U (en) * | 2021-12-03 | 2022-08-02 | 上海隐冠半导体技术有限公司 | Bearing plate assembly and motion positioning device with same |
| CN116054527A (en) * | 2023-04-03 | 2023-05-02 | 东莞联鹏智能装备有限公司 | Linear motor and semiconductor preparation system |
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2023
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022006993A1 (en) * | 2020-07-08 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Moving mechanism and electronic device |
| WO2022028260A1 (en) * | 2020-08-05 | 2022-02-10 | 佛山市华道超精科技有限公司 | Air-floating guide rail type switchable rigid-flexible coupling motion platform |
| CN112259488A (en) * | 2020-12-22 | 2021-01-22 | 上海隐冠半导体技术有限公司 | Micro-motion platform and motion device |
| CN215072094U (en) * | 2021-04-07 | 2021-12-07 | 微纳精密科技(东莞)有限公司 | Linear module and processing equipment |
| CN217114356U (en) * | 2021-12-03 | 2022-08-02 | 上海隐冠半导体技术有限公司 | Bearing plate assembly and motion positioning device with same |
| CN114613721A (en) * | 2022-05-10 | 2022-06-10 | 上海隐冠半导体技术有限公司 | Motion platform and motion device |
| CN116054527A (en) * | 2023-04-03 | 2023-05-02 | 东莞联鹏智能装备有限公司 | Linear motor and semiconductor preparation system |
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| CN116759361B (en) | 2024-03-22 |
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