CN116754627A - Bioelectrode manufacturing method, bioelectrode and biosensing device - Google Patents
Bioelectrode manufacturing method, bioelectrode and biosensing device Download PDFInfo
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- 238000010586 diagram Methods 0.000 description 10
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- 210000003625 skull Anatomy 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
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Abstract
The application discloses a bioelectrode manufacturing method, a bioelectrode and a biosensing device, wherein the manufacturing method comprises the following steps: s1, preparing a substrate, wherein a plurality of contact pads are arranged on the substrate; s2, bonding one end of a bonding wire with one of the contact pads on the substrate by using bonding equipment; the bonding equipment comprises a riving knife and a bonding wire passing through the riving knife; s3, moving the chopper to a preset position, and chopping the bonding wire at the position; s4, moving the riving knife to the relative position of the other contact pad; repeating the steps S2 to S4 until the bonding with the bonding wire is completed by the preset number of contact pads on the substrate. The bioelectrode manufactured by the manufacturing method can effectively improve the electrode density and simultaneously consider the connectivity between the electrode and the reading circuit.
Description
Technical Field
The present application relates to the field of bioelectrodes, and in particular, to a bioelectrode manufacturing method, a bioelectrode, and a biosensing device.
Background
The bioelectrode is an electrode which takes biological materials as sensitive elements and realizes the recognition function by means of specific affinity among substances in organisms. The sensor has the characteristics of no damage to a test system and no color influence of electroanalytical chemistry, and is widely applied to the fields of medical treatment, industrial production, environmental monitoring and the like.
Current bioelectrodes are, for example, the Utah Array (Utah electrode Array) which consists of 100 (10×10) microneedles with a pitch of 400 μm. The microneedles were about 1.2mm in height, seated on a substrate having a thickness of about 0.12mm, and the needles were machined by mechanical cutting in combination with chemical etching, each microneedle tip exposing an electrode recording spot and being plated with a metal (e.g., iridium oxide) having a thickness of about 10-30 μm, with the remainder of the needle being insulated with Parylene (Parylene). Each electrode is insulated from the adjacent electrode by a glass groove surrounding the base. An insulating gold wire having a diameter of about 25 μm was bonded to the back pad of the substrate by means of pressure bonding, and then all 100 leads were packaged in a single bundle, and the other ends of the leads were connected to an electrode cap which can be fixed to the skull. The Utah electrode array has lighter weight, thinner substrate and flexible lead, and the implanted electrode can float on the surface of the cerebral cortex to allow the skull of the experimental subject to be closed, so that the electrode array is a batch of implanted nerve electrodes which can be used for signal recording in the cerebral cortex of human beings.
Also such as a microwire electrode array, which increases electrode density by dense insulated wire sets. But the connectivity between the electrodes and the readout circuitry is greatly sacrificed, so that a large number of electrodes cannot be read out; it is also difficult to attempt to achieve high yield chip interconnects by selecting appropriate materials and processes.
The above disclosure of background art is only for aiding in understanding the inventive concept and technical solution of the present application, and it does not necessarily belong to the prior art of the present patent application, nor does it necessarily give technical teaching; the above background should not be used to assess the novelty and creativity of the present application in the event that no clear evidence indicates that such is already disclosed prior to the filing date of the present patent application.
Disclosure of Invention
The application aims to provide a bioelectrode manufacturing method, which enables the manufactured bioelectrode to have both electrode reading performance and electrode density.
In order to achieve the above purpose, the application adopts the following technical scheme:
a method for manufacturing a bioelectrode, comprising the following steps:
s1, preparing a substrate, wherein a plurality of contact pads are arranged on the substrate;
s2, bonding one end of a bonding wire with one of the contact pads on the substrate by using bonding equipment; the bonding equipment comprises a riving knife and a bonding wire passing through the riving knife;
s3, moving the chopper to a preset position, and chopping the bonding wire at the preset position;
s4, moving the riving knife to the relative position of the other contact pad;
repeating the steps S2 to S4 until the bonding with the bonding wire is completed by the preset number of contact pads on the substrate.
Further, any one or a combination of the foregoing aspects, step S1 includes:
preparing a plurality of readout circuits and an input port and an output port thereof on a lower substrate, wherein the input port is connected with one or more contact pads, and the output port forms an output pin of the readout circuits;
preparing an upper substrate on the lower substrate;
a metal layer is deposited on the upper surface of the upper substrate to form a plurality of contact pads arranged in a distributed manner, each contact pad being configured to be electrically connected to an inlet port of one or more readout circuits by at least one via process.
Further, according to any one or a combination of the foregoing technical solutions, the readout circuit is prepared in the substrate by using a CMOS process, and the readout circuit receives an input signal collected through an electrode or/and a contact pad, conditions the input signal, and sends the conditioned input signal to the conversion circuit module or the data processing module, and processes and transmits the conditioned signal.
Further, any one or a combination of the foregoing aspects, step S1 includes:
depositing a metal layer on the front surface of the substrate to form a plurality of contact pads which are distributed;
electrically connecting each contact pad with a landing pad on a substrate, comprising: preparing a wire on the surface of the substrate, and enabling two ends of the wire to be respectively connected with a contact pad and a transfer pad, or performing at least two times of via operation on the substrate, wherein one end of a first via is connected with a contact pad, and one end of a last via is connected with a transfer pad;
the landing pad is configured to connect with a readout circuit external to the substrate.
Further, in any one or a combination of the foregoing aspects, the operation of connecting one end of the wire to a transfer pad on the substrate includes:
connecting an end of the wire to a transfer pad formed at a front edge position of the substrate; alternatively, the end of the wire is extended to a landing pad formed at the back side of the substrate by a TSV process, and the landing pad formed may be connected to a readout circuit outside the substrate by wire bonding, flip chip bonding, or hybrid bonding.
Further, the operations of depositing a metal layer according to any one or a combination of the foregoing embodiments include:
and forming the contact pads on the substrate by adopting a top metal or RDL layer of the CMOS process.
Further, in any one or a combination of the foregoing embodiments, the contact pads are distributed in an array, a wire diameter range of the bonding wire is 10 to 100 μm, and a center-to-center distance range of two adjacent contact pads is 11 μm to 1.41 cm.
Further, in any one or a combination of the foregoing aspects, after the bonding with the bonding wire is completed by the contact pad, the method further includes:
insulating and fixing one end part of the bonding wire, which is close to the contact pad, of the contact pad;
and/or sharpening and coating the other end of the bonding wire far away from the contact pad;
and/or wrapping the bonding wire by using a soluble reinforcing agent, wherein the bonding wire is a metal wire, an alloy wire or a wire made of a biological dielectric material.
According to another aspect of the present application, there is provided a bioelectrode manufacturing method including the steps of:
m1, preparing a substrate, wherein a contact pad is arranged on the substrate;
m2, bonding one end of a bonding wire with the contact pad by using bonding equipment; the bonding equipment comprises a riving knife and a bonding wire passing through the riving knife;
and M3, moving the chopper to a preset position, and chopping the bonding wire at the preset position.
According to another aspect of the present application, there is provided a bioelectrode, characterized by being manufactured by the manufacturing method as described above, comprising:
a substrate provided with contact pads;
a bonding wire having one end bonded to the contact pad and the other end extending in a direction away from the contact pad;
wherein the contact pads are capable of being electrically connected to one or more readout circuits.
Further, in any one or a combination of the foregoing aspects, the number of the contact pads is a plurality of, and the bonding wires are in one-to-one correspondence with the contact pads;
different bonding wires may have the same or different heights, lengths, and diameters, and/or different bonding wires may have the same or different materials.
According to a further aspect of the application there is provided a biosensing device comprising a readout circuit and a bioelectrode as described above.
Further, in combination with any one or more of the preceding claims, the readout circuitry is configured to be disposed on a substrate of the bioelectrode using a CMOS process and in a substructure of a contact pad on the substrate;
the contact pads are connected with the readout circuits in a one-to-one correspondence manner, or a plurality of contact pads are connected with the same readout circuit, or one contact pad is connected with a plurality of readout circuits;
the contact pads are arranged at positions which are opposite to the upper and lower positions of the read-out circuit in a one-to-one correspondence manner, or the contact pads and the read-out circuit are arranged in a staggered manner.
Further, according to any one or a combination of the above-mentioned technical solutions, the wires between the different contact pads and the readout circuit are made of different materials; and/or the read-out leads of different read-out circuits are made of different materials.
The technical scheme provided by the application has the following beneficial effects:
a. the contact pads are compactly distributed on the substrate, bonding wires are bonded on the pads as electrode needles through a bonding process, and the electrode density is effectively improved;
b. different from the traditional mode of connecting the read-out circuit by the wiring on the surface of the substrate, the wiring mode saves the wiring area, further improves the electrode density and improves the connection reliability of the bonding pad and the read-out circuit.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a flow chart of a method for fabricating a bioelectrode according to an exemplary embodiment of the present application;
fig. 2 is a side cross-sectional view of a substrate provided with contact pads fabricated using a CMOS process according to an exemplary embodiment of the present application;
FIG. 3 is a schematic diagram of the contact pads and the readout circuitry of FIG. 2 disposed vertically opposite each other;
FIG. 4 is a schematic flow chart of a bonding wire of a contact pad according to an exemplary embodiment of the present application, wherein the sub-graph (a) of FIG. 4 is a schematic diagram of an operation step of bonding a lower end of the bonding wire onto the contact pad, the sub-graph (b) of FIG. 4 is a schematic diagram of an operation step of moving a chopper to a predetermined position, the sub-graph (c) of FIG. 4 is a schematic diagram of an operation step of chopping the bonding wire at a predetermined position, and the sub-graph (d) of FIG. 4 is a schematic diagram of the bonding wire and the contact pad after the chopper is moved elsewhere;
FIG. 5 is a schematic diagram of a contact pad and a sensing circuit not disposed in a top-to-bottom relationship according to an exemplary embodiment of the present application;
fig. 6 is a side cross-sectional view of a substrate with contact pads arranged corresponding to fig. 5;
FIG. 7 is a schematic diagram of a bonding process for bonding wire ends to a front surface of a substrate via bond pads according to an exemplary embodiment of the present application;
FIG. 8 is a schematic diagram of a first wire routing scheme of FIG. 7;
FIG. 9 is a schematic diagram of a second wire routing scheme of FIG. 7;
fig. 10 is a schematic diagram of a trace for bonding wires on a back surface of a substrate according to an exemplary embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or device.
The Utah electrode array is limited by the electrode preparation process, and the distance between the micro-needles is about 400 mu m, so that the electrode density is difficult to improve, namely, the number of read channels in unit area is small, and the signal acquisition effect of a cell dense area is limited; on the other hand, the lead at each microneedle of the Utah electrode array is led out from one side of the electrode array, and therefore, if the Utah electrode array is once too large in scale, its reliability may not meet the needs of the user.
In one embodiment of the present application, there is provided a bioelectrode manufacturing method, as shown in fig. 1, including the steps of:
s1, preparing a substrate, wherein a plurality of contact pads are arranged on the substrate.
Specifically, a CMOS process is used to grow a plurality of readout circuits on a silicon substrate, the readout circuits 5 have an input port and an output port, the input port is connected to one or more contact pads, the output port forms an output pin of the readout circuit, that is, the output port is configured to be connected to a corresponding signal processing module, and the signal processing module outputs the processed signal to the outside of the substrate (chip);
then preparing an upper substrate on the upper layer, wherein the upper substrate is provided with a plurality of metal layers, and the adjacent metal layers are connected through a via hole process; and depositing a metal layer on the upper surface of the upper substrate, and forming a plurality of contact pads 2 distributed on the substrate by using a top metal or RDL layer in a CMOS process. To this end, the contact pad 2 is formed on the upper surface of the upper substrate and connected to the readout circuitry 5 of the lower layer through at least one via process, as shown in fig. 2.
In the embodiment shown in fig. 2, the readout circuitry 5 is configured to be arranged on the substrate of the bioelectrode using a CMOS process and in the underlying structure of the contact pads 2 on the substrate; the contact pads 2 are arranged in a one-to-one correspondence at positions vertically opposite to the readout circuits 5, as schematically shown in fig. 3.
The contact pads are distributed in an array, the wire diameter of the bonding wire can be 10 mu m, 25 mu m or 100 mu m, and when the wire diameter of the bonding wire is 10 mu m, the center-to-center distance between two adjacent contact pads can be shortened to be smaller than the allowable value (for example, 11 mu m); when the wire diameter of the bonding wire is 25 mu m, the center-to-center distance between two adjacent contact pads can be shortened to 75 mu m; when the wire diameter of the bonding wire is 100 μm, the center-to-center spacing between adjacent two contact pads can be shortened to 200 μm or 1.41. 1.41 cm.
S2, referring to a sub-graph (a) in FIG. 4, bonding one end of the bonding wire 1 with one of the contact pads 2 on the substrate in a ball bonding or wedge bonding mode by using bonding equipment; the bonding equipment comprises a riving knife 3 and a bonding wire 1 penetrating through the riving knife 3.
S3, referring to the sub-graph (b) in FIG. 4, the chopper 3 can be moved to any direction, but is not limited to the vertically upward direction in the sub-graph (b), for example, the chopper can be moved to a preset position in a manner of leftwards, rightwards, upwards and downwards, and the like, and referring to the sub-graph (c) in FIG. 4, the chopper 3 is clamped at the preset position to chop the bonding wire 1, so that the bonding wire bonded on the bonding wire has a preset length, and the bonding wire bonded with the bonding wire is shown as the sub-graph (d) in FIG. 4, which is a unit of a bioelectrode;
s4, moving the riving knife 3 to the relative position of the other contact pad;
repeating the steps S2 to S4 until the bonding with the bonding wire is completed by the preset number of contact pads on the substrate.
In one embodiment of the present application, the contact pads 2 are not arranged in a one-to-one correspondence to positions vertically opposite to the readout circuitry 5, as shown in fig. 5, and one or more contact pads 2 are connected to the corresponding readout circuitry 5 by at least one via process, respectively, as shown in fig. 6.
In addition to the CMOS process described above to prepare a substrate, a substrate without readout circuitry can be prepared in the following manner:
depositing a metal layer on the front surface of the substrate, and photoetching or etching the metal layer to form a plurality of contact pads which are distributed;
electrically connecting each contact pad with a preset transfer pad 6 on the substrate, including: preparing a wire 4 on the surface of the substrate, and enabling two ends of the wire 4 to be respectively connected with a contact pad 2 and a transfer pad 6, or performing at least two times of via operation on the substrate, wherein one end of a first via is connected with the contact pad 2, and one end of a last via is connected with the transfer pad 6; the landing pads 6 are configured to be connected to one or more readout circuits external to the substrate. For example, the landing pads 6 are connected to an external readout circuit by a packaging process, it can be seen in fig. 7 that different contact pads 2 in the same row are routed to the landing pads 6 in different ways and paths, the landing pads 6 may be disposed at the edge of the substrate, for example, a portion of the wires 4 to which the contact pads 2 are connected extend to the edge at the upper surface of the substrate (as shown in fig. 7), and another portion of the contact pads 2 are electrically connected to the landing pads 6 by an interlayer via process (shown in dashed lines in fig. 7) below the surface of the substrate (as shown in fig. 9), and may even be routed from layers of different heights in batches, respectively, and finally back to the landing pads 6 on the surface. Thus, the wire 4 is not affected by the limitation of the number of contact pads to extend to the position connected with the readout circuit, and the electrode density can be improved due to the reduced area of the area where the wiring is to be reserved on the surface of the substrate.
In one embodiment, instead of routing to the upper surface edge landing pad 6 for post-packaging, the other end of the wire is secured in place on the back side of the substrate using a TSV process and a new landing pad is formed, as shown in fig. 10 (wire 4 is not shown, with one end connected to contact pad 2 and the other end connected to the sensing circuit by wire bonding).
With continued reference to fig. 1, after the contact pads have completed bonding with the bonding wires, further comprising:
insulating and fixing one end part of the bonding wire, which is close to the contact pad, of the contact pad;
sharpening and coating the other end of the bonding wire far away from the contact pad;
the bonding wire is wrapped with a soluble reinforcing agent, and is a metal wire, an alloy wire or a wire made of a biological dielectric material.
In another embodiment of the present application, only one contact pad is provided on the substrate, and the bonding operation of a single contact pad and the bonding wire is the same, and the repeated operations of step S4 and steps S2 to S4 are omitted compared with the above embodiment. As for the readout circuitry fabricated inside the substrate, or the manner in which the contact pad 2 on the substrate is electrically connected to the transfer pad 6 on the substrate is the same as in the above embodiment, and will not be described again.
In one embodiment of the present application, there is provided a bioelectrode manufactured using the manufacturing method as described above, the bioelectrode including:
a substrate provided with contact pads;
a bonding wire having one end bonded to the contact pad and the other end extendable away from the contact pad;
wherein the contact pads are capable of being electrically connected to one or more readout circuits.
In one embodiment, the number of the contact pads is a plurality, and the bonding wires are in one-to-one correspondence with the contact pads;
different bonding wires may be of the same or different materials. Different bonding wires have the same or different heights, lengths and diameters, and a three-dimensional electrode array can be realized on a chip by programming the height of each electrode. This method can control the height of each electrode according to different positions or different functions to achieve different stimulation and sensing effects.
The location of the bonding wire may include, but is not limited to, the following implementations: the first mode is a mode of wire bonding around the chip, the second mode is a mode of wire bonding of pads formulated by a two-dimensional array of the chip, and the third mode is that the two-dimensional array can have different heights based on the second mode, so that a three-dimensional array format can be formed.
In one embodiment of the present application, a biosensing device is provided, including a readout circuit and a bioelectrode as described above, where the contact pads and the readout circuit may be connected in a one-to-one correspondence, or a plurality of contact pads are connected to the same readout circuit, or one contact pad is connected to a plurality of readout circuits; the contact pads may be disposed opposite the read-out circuit up and down, or may be disposed in a staggered arrangement. Different materials are selected according to actual needs to manufacture wires between different contact pads and a readout circuit; different materials can be selected according to actual needs to manufacture the read-out leads of different read-out circuits.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely illustrative of the embodiments of this application and it will be appreciated by those skilled in the art that variations and modifications may be made without departing from the principles of the application, and it is intended to cover all modifications and variations as fall within the scope of the application.
Claims (14)
1. The manufacturing method of the bioelectrode is characterized by comprising the following steps of:
s1, preparing a substrate, wherein a plurality of contact pads are arranged on the substrate;
s2, bonding one end of a bonding wire with one of the contact pads on the substrate by using bonding equipment; the bonding equipment comprises a riving knife and a bonding wire passing through the riving knife;
s3, moving the chopper to a preset position, and chopping the bonding wire at the preset position;
s4, moving the riving knife to the relative position of the other contact pad;
repeating the steps S2 to S4 until the bonding with the bonding wire is completed by the preset number of contact pads on the substrate.
2. The method of manufacturing a bioelectrode according to claim 1, wherein step S1 includes:
preparing a plurality of readout circuits and an input port and an output port thereof on a lower substrate, wherein the input port is connected with one or more contact pads, and the output port forms an output pin of the readout circuits;
preparing an upper substrate on the lower substrate;
a metal layer is deposited on the upper surface of the upper substrate to form a plurality of contact pads arranged in a distributed manner, each contact pad being configured to be electrically connected to an inlet port of one or more readout circuits by at least one via process.
3. The method according to claim 2, wherein the readout circuitry is fabricated in the substrate using a CMOS process, receives an input signal collected via an electrode and/or a contact pad, conditions the input signal, and sends the conditioned signal to a conversion circuit module or a data processing module, which processes the conditioned signal and transmits the conditioned signal.
4. The method of manufacturing a bioelectrode according to claim 1, wherein step S1 includes:
depositing a metal layer on the front surface of the substrate to form a plurality of contact pads which are distributed;
electrically connecting each contact pad with a predetermined transfer pad on the substrate, comprising: preparing a wire on the surface of the substrate, and enabling two ends of the wire to be respectively connected with a contact pad and a transfer pad, or performing at least two times of via operation on the substrate, wherein one end of a first via is connected with a contact pad, and one end of a last via is connected with a transfer pad;
the landing pad is configured to connect with a readout circuit external to the substrate.
5. The method of fabricating a bioelectrode according to claim 4, wherein the operation of connecting one end of said wire to a landing pad on said substrate includes:
connecting an end of the wire to a transfer pad formed at a front edge position of the substrate; alternatively, the end of the wire is extended to a landing pad formed at the back side of the substrate by a TSV process, and the landing pad formed may be connected to a readout circuit outside the substrate by wire bonding, flip chip bonding, or hybrid bonding.
6. The method of any one of claims 2 to 5, wherein the depositing a metal layer comprises:
and forming the contact pads on the substrate by adopting a top metal or RDL layer of the CMOS process.
7. The method of manufacturing a bioelectrode according to claim 6, wherein said contact pads are arranged in an array, the wire diameter of said bonding wire ranges from 10 to 100 μm, and the center-to-center spacing between two adjacent contact pads ranges from 11 μm to 1.41 cm.
8. The method of manufacturing a bioelectrode according to claim 1, further comprising, after the contact pad completes bonding with a bonding wire:
insulating and fixing one end part of the bonding wire, which is close to the contact pad, of the contact pad;
and/or sharpening and coating the other end of the bonding wire far away from the contact pad;
and/or wrapping the bonding wire by using a soluble reinforcing agent, wherein the bonding wire is a metal wire, an alloy wire or a wire made of a biological dielectric material.
9. The manufacturing method of the bioelectrode is characterized by comprising the following steps of:
m1, preparing a substrate, wherein a contact pad is arranged on the substrate;
m2, bonding one end of a bonding wire with the contact pad by using bonding equipment; the bonding equipment comprises a riving knife and a bonding wire passing through the riving knife;
and M3, moving the chopper to a preset position, and chopping the bonding wire at the preset position.
10. Bioelectrode, characterized in that it is manufactured by the manufacturing method according to any of claims 1 to 9, comprising:
a substrate provided with contact pads;
a bonding wire having one end bonded to the contact pad and the other end extending in a direction away from the contact pad;
wherein the contact pads are capable of being electrically connected to one or more readout circuits.
11. The bioelectrode according to claim 10, wherein the number of said contact pads is plural, and said bonding wires are in one-to-one correspondence with said contact pads;
different bonding wires may have the same or different heights, lengths, and diameters, and/or different bonding wires may have the same or different materials.
12. A biosensor device comprising a readout circuit and a bioelectrode as claimed in claim 10 or 11.
13. The biosensing device of claim 12, wherein said readout circuitry is configured to be disposed on a substrate of said bioelectrode using CMOS technology and in a substructure of contact pads on the substrate;
the contact pads are connected with the readout circuits in a one-to-one correspondence manner, or a plurality of contact pads are connected with the same readout circuit, or one contact pad is connected with a plurality of readout circuits;
the contact pads are arranged at positions which are opposite to the upper and lower positions of the read-out circuit in a one-to-one correspondence manner, or the contact pads and the read-out circuit are arranged in a staggered manner.
14. The biosensing device of claim 13, wherein wires between different contact pads and readout circuitry are of different materials; and/or the read-out leads of different read-out circuits are made of different materials.
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