CN114642436A - Flexible neural electrode packaging structure, preparation method and equipment - Google Patents
Flexible neural electrode packaging structure, preparation method and equipment Download PDFInfo
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- CN114642436A CN114642436A CN202210161336.0A CN202210161336A CN114642436A CN 114642436 A CN114642436 A CN 114642436A CN 202210161336 A CN202210161336 A CN 202210161336A CN 114642436 A CN114642436 A CN 114642436A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
- A61B5/293—Invasive
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/369—Electroencephalography [EEG]
- A61B5/386—Accessories or supplementary instruments therefor
Abstract
The invention relates to the technical field of brain-computer interfaces, in particular to a flexible neural electrode packaging structure, a manufacturing method and equipment. The method comprises the following steps: at least two planar flexible neural electrode arrays arranged in a stack; the planar flexible neural electrode array comprises a substrate and a packaging substrate; the front surface of the base is connected with the front surface of the packaging substrate; the projection of the packaging substrate on the horizontal plane is at least partially not coincident with the projection of the substrate on the horizontal plane; at least part of the edge of the back surface of the packaging substrate is connected with at least part of the edge of the front surface of the other packaging substrate. According to the flexible neural electrode packaging structure, planar flexible neural electrodes are integrated, and a 3D stacked and packaged flexible neural electrode array covered in a large area is realized. The two-dimensional flexible neural electrode array is integrated in a three-dimensional packaging mode to obtain an integrated 3D flexible neural electrode array, and the method can be used for realizing high-density and high-spatial-resolution neural signal acquisition of a brain region.
Description
Technical Field
The invention relates to the technical field of brain-computer interfaces, in particular to a flexible neural electrode packaging structure, a manufacturing method and equipment.
Background
The brain-computer interface is a technology for connecting the brain with external equipment to realize information interaction, and has important research significance for exploring brain science and diagnosis and treatment of brain diseases. The nerve electrode is a core component of a brain-computer interface and can be divided into an invasive type and a non-invasive type. Compared with a non-invasive nerve electrode (such as a head-wearing electroencephalogram cap), the noninvasive nerve electrode indirectly acquires a weak electroencephalogram signal through the brain scalp, and the invasive electrode directly contacts with nerve tissues, so that high-precision and high-sensitivity neuron information can be acquired, and the wide attention of researchers is attracted.
Invasive neural electrodes can be subdivided into rigid and flexible electrodes, depending on the material. Among them, the most representative of rigid electrodes is utah electrode. Based on a mature micro-electro-mechanical processing technology, a three-dimensional array electrode with high density can be prepared. However, rigid electrodes are not suitable for long-term implantation because their mechanical strength is not matched with brain tissue, which is likely to cause brain damage and induce inflammatory reaction. The flexible nerve electrode has good biocompatibility and is considered to be the development direction of the future invasive nerve electrode. However, the development of flexible electrodes is currently limited by a lower degree of integration. Particularly, because the processing of the flexible electrode depends on a planar processing technology, electrode sites on the nerve electrode only have one-dimensional distribution or two-dimensional distribution, and the high-density three-dimensional space resolution nerve signal acquisition cannot be realized.
Disclosure of Invention
The invention aims to solve the technical problem of insufficient spatial resolution caused by adopting a planar array for most of the existing flexible neural electrodes.
In order to solve the above technical problem, in a first aspect, an embodiment of the present application discloses a flexible neural electrode package structure, including:
at least two planar flexible neural electrode arrays arranged in a stack;
the planar flexible neural electrode array comprises a substrate and a packaging substrate; the front surface of the base is connected with the front surface of the packaging substrate;
the projection of the packaging substrate on the horizontal plane is at least partially not coincident with the projection of the substrate on the horizontal plane;
at least part of the edge of the back surface of the packaging substrate is connected with at least part of the edge of the front surface of the other packaging substrate.
Furthermore, welding points penetrating through the packaging substrate are arranged at the edge of the packaging substrate;
the welding points in one packaging substrate are connected with the welding points in the other packaging substrate through welding.
Further, one of the package substrates is connected to the other of the package substrates by gluing.
In a second aspect, an embodiment of the present application discloses a flexible neural electrode package structure, including:
at least two planar flexible neural electrode arrays arranged in a stack;
the planar flexible neural electrode array comprises a substrate and a packaging substrate; the front surface of the base is connected with the front surface of the packaging substrate;
the reverse side of the packaging substrate is connected with the reverse side of the substrate in the other planar flexible neural electrode array.
Further, the reverse surface of the packaging substrate is connected with the reverse surface of the substrate in the other planar flexible neural electrode array through gluing.
In a third aspect, an embodiment of the application discloses a preparation method of a flexible neural electrode packaging structure, including:
acquiring a first planar flexible neural electrode array; the first planar flexible neural electrode array comprises a first substrate and a first packaging substrate, and the front surface of the first packaging substrate is connected with the front surface of the first substrate;
obtaining a second planar flexible neural electrode array; the second planar flexible neural electrode array comprises a second substrate and a second packaging substrate, and the front surface of the second packaging substrate is connected with the front surface of the second substrate;
connecting the first planar flexible neural electrode array with the second planar flexible neural electrode array in a stacked manner; at least part of the edge of the back surface of the first packaging substrate is connected with at least part of the edge of the front surface of the second packaging substrate; or the reverse side of the first packaging substrate is connected with the reverse side of the second substrate.
Further, after the stacking and connecting the first planar flexible neural electrode array and the second planar flexible neural electrode array, the method further comprises:
and stacking and connecting a preset number of second planar flexible neural electrode arrays on the reverse side of the second substrate.
In a fourth aspect, an embodiment of the application discloses a method for manufacturing a flexible neural electrode packaging structure, including:
acquiring a first planar flexible neural electrode array; the first planar flexible neural electrode array comprises a first substrate and a first packaging substrate, and the front surface of the first packaging substrate is connected with the front surface of the first substrate;
preparing a second planar flexible neural electrode array on the reverse side of the first substrate; the second planar flexible neural electrode array comprises a second substrate and a second packaging substrate, and the front surface of the second packaging substrate is connected with the front surface of the second substrate; at least part of the edge of the back surface of the first packaging substrate is connected with at least part of the edge of the front surface of the second packaging substrate; or the reverse side of the second packaging substrate is connected with the reverse side of the first substrate.
Further, after the preparing the second planar flexible neural electrode array on the reverse side of the first substrate, the method further comprises:
preparing a preset number of the second planar flexible neural electrode arrays on the reverse side of the second substrate.
In a fifth aspect, the present application discloses an electronic device, which includes the flexible neural electrode package structure described above.
By adopting the technical scheme, the flexible neural electrode packaging structure, the preparation method and the equipment have the following beneficial effects:
according to the flexible neural electrode packaging structure, the planar flexible neural electrodes are integrated, and the 3D stacked and packaged flexible neural electrode array covered in a large area is realized. The two-dimensional flexible neural electrode array is integrated in a three-dimensional packaging mode to obtain an integrated 3D flexible neural electrode array, and the method can be used for realizing high-density and high-spatial-resolution neural signal acquisition of a brain region.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a flexible neural electrode package structure provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a planar flexible neural electrode array provided in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a package substrate according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a stacked structure of two planar flexible neural electrode arrays according to an embodiment of the present application;
fig. 6 is a schematic flow chart of a method for manufacturing a flexible neural electrode package structure according to an embodiment of the present disclosure;
fig. 7 is a schematic flow chart of a manufacturing method of another flexible neural electrode package structure provided in an embodiment of the present application.
The following is a supplementary description of the drawings:
1-a substrate; 110-a support substrate; 120-a flexible neuroelectrode layer; 121-pad part; 122-a flexible probe portion; 2-packaging the substrate.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the present application. In the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The existing flexible nerve electrode generally has one to a plurality of flexible probes, and the structure of the flexible nerve electrode is a two-dimensional structure on a plane. The electrode structure is difficult to realize high-density three-dimensional resolution neural signal acquisition. In view of this, embodiments of the present application provide a flexible neural electrode package structure, which performs three-dimensional packaging on a two-dimensional flexible neural electrode, so as to obtain a 3D stacked and packaged flexible neural electrode array capable of realizing large-area coverage.
The embodiment of the present application discloses a flexible neural electrode packaging structure, fig. 1 is a schematic diagram of a flexible neural electrode packaging structure provided by the embodiment of the present application, as shown in fig. 1, including: at least two planar flexible neural electrode arrays arranged in a stack.
Fig. 2 is a schematic structural diagram of a planar flexible neural electrode array provided in an embodiment of the present application, and as shown in fig. 2, the planar flexible neural electrode array includes a substrate 1 and a packaging substrate 2. The front surface of the base 1 is connected to the front surface of the package substrate 2.
Fig. 3 is a schematic structural diagram of a substrate 1 provided in an embodiment of the present application, and as shown in fig. 3, the substrate 1 includes a supporting substrate 110 and a flexible neural electrode layer 120 disposed on the supporting substrate 110. Alternatively, the support substrate 110 may be a substrate made of silicon, silicon oxide, silicon carbide, silicon nitride, glass, ruby, sapphire, or the like. The flexible neuroelectrode layer 120 includes a pad portion 121 and a flexible probe portion 122 connected to the support substrate 110. The flexible probe portion 122 may include one to a plurality of flexible probes. One end of the flexible probe is connected to the pad part 121. The flexible probe comprises a plurality of electrode points and is implanted into the brain to collect neuron signals. The flexible probe comprises a flexible supporting layer and a metal electrode, and the metal electrode is arranged in the flexible supporting layer. The flexible supporting layer is provided with an electrode hole, and the metal electrode is exposed out of the flexible supporting layer through the electrode hole to form an electrode point. Optionally, the material of the flexible supporting layer is polyimide, SU8 photoresist, or the like. The pad part 121 is provided with pads corresponding to the electrode points one to one.
Fig. 4 is a schematic structural diagram of a package substrate 2 according to an embodiment of the present disclosure, and as shown in fig. 4, the package substrate 2 includes a cover plate and solder joints disposed on the cover plate. The welding spots are arranged on the front surface of the cover plate. Alternatively, the material of the package substrate 2 may be an organic polymer material. Such as Bismaleimide Triazine (BT) resin. BT resins can be divided into CCL-H810, CCl-H870, CCL-HL950 and the like. The dielectric constant of BT resin is 3.5-4.51MHz, the dielectric loss is 0.001-0.0051MHz, and the glass transition temperature is 180-230 ℃. The distribution mode of the welding spots on the cover plate is the same as that of the welding spots in the substrate 1, and the welding spots are in one-to-one correspondence. When the package substrate 2 is connected with the substrate 1, the welding points in the package substrate 2 are correspondingly connected with the welding points in the substrate 1.
In an embodiment of the present application, the flexible neural electrode package structure includes two to more planar flexible neural electrode arrays. Two to a plurality of planar flexible neural electrode arrays are sequentially connected in a laminated manner. In order to facilitate description of the connection manner between the planar flexible neural electrode arrays, the connection manner between the planar flexible neural electrode arrays is described below by taking the flexible neural electrode packaging structure including two planar flexible neural electrode arrays as an example. The person skilled in the art can know the connection mode between the planar flexible neural electrode arrays when the flexible neural electrode packaging structure comprises a plurality of planar flexible neural electrode arrays on the premise of not performing creative work according to the connection mode between the two planar flexible neural electrode arrays.
In an embodiment of the present application, the flexible neural electrode package structure includes a first planar flexible neural electrode array and a second planar flexible neural electrode array. The first planar flexible neural array includes a first substrate and a first package substrate. The second planar flexible neural array includes a second base and a second package substrate.
As an alternative implementation manner, fig. 5 is a schematic diagram of a stacked structure of two planar flexible neural electrode arrays according to an embodiment of the present application, as shown in fig. 5, a first planar flexible neural electrode array and a second planar flexible neural electrode array are stacked, and a first package substrate is connected to a second package substrate. In this embodiment, the projection of the package substrate 2 on the horizontal plane does not at least partially coincide with the projection of the base 1 on the horizontal plane. That is, the outline of the package substrate 2 is greater than the outline of the substrate 1, so that after the first planar flexible neural electrode array and the second planar flexible neural electrode array are stacked, the edge of the first package substrate corresponds to the edge of the second package substrate, and no other structural isolation exists between the first package substrate and the second package substrate. At least part of the edge of the back surface of the first packaging substrate is connected with at least part of the edge of the front surface of the second packaging substrate. Optionally, the first package substrate and the second package substrate are connected by soldering. Specifically, the edge of the first package substrate is provided with a welding point penetrating through the package substrate 2, the edge of the second package substrate is also provided with a welding point penetrating through the package substrate 2 at the same position, and the welding point in the first package substrate is connected with the welding point in the second package substrate through welding. Optionally, the first package substrate and the second package substrate may be connected by gluing. Specifically, the edge of the first package substrate and the edge of the second package substrate may be directly connected by an adhesive, or the edge of the first package substrate and the edge of the second package substrate may be connected by a connector.
In another alternative embodiment, the first planar flexible neural electrode array and the second planar flexible neural electrode array are stacked, and the first package substrate is connected to the second substrate. In this embodiment, the reverse surface of the first package substrate is connected to the reverse surface of the second substrate. Optionally, the reverse surface of the first package substrate is connected to the reverse surface of the second substrate by gluing.
The flexible neural electrode packaging structure obtains the integrated 3D flexible electrode array by the two-dimensional flexible electrode array in a three-dimensional packaging integration mode, can be used for realizing the neural signal acquisition of high-density high-spatial resolution of a brain region, thereby improving the dimensionality of neural signal detection, effectively acquiring a wider range of neural signals, and providing a reliable method for high-throughput neural signal coding and decoding and brain information analysis.
The embodiment of the application also provides a preparation method of the flexible neural electrode packaging structure, and in the preparation method, the flexible neural electrode packaging structure is obtained by directly obtaining the plurality of planar flexible neural electrode arrays and then connecting the plurality of planar flexible neural electrode arrays one by one. Specifically, fig. 6 is a schematic flow chart of a method for manufacturing a flexible neural electrode package structure according to an embodiment of the present application, and as shown in fig. 6, the method includes:
s601: a first planar flexible neural electrode array is obtained.
In an embodiment of the present application, a first planar flexible neural electrode array includes a first base and a first package substrate. The first base includes a first support substrate 110 and a flexible neuroelectrode layer 120 disposed on the first support substrate 110. The flexible neuroelectrode layer 120 includes a pad portion 121 and a flexible probe portion 122 connected to the support substrate 110. The back surface of the pad part 121 is connected to the first support substrate 110, the front surface of the pad part 121 is provided with pads, and the front surface of the first package substrate is provided with pads corresponding to the pads on the pad part 121. The pads on the first package substrate are connected to the pads on the pad part 121 by soldering.
In the embodiment of the application, the planar flexible neural electrode array can be prepared by the following method: a flexible polymer substrate matched with the mechanical property of brain tissue is prepared on a supporting substrate 110, an imaged metal conducting layer is prepared on the flexible polymer substrate through the processes of photoetching, metal sputtering, metal evaporation and the like, the imaged metal conducting layer comprises microelectrode points, conducting wires and a back-end pad, and each microelectrode point corresponds to a welding point in the back-end pad one by one and is connected with the welding point through a metal conducting wire. And then preparing a flexible polymer substrate on the metal conductive layer. The preparation of the flexible neuroelectrode layer 120 is completed by releasing the device front end flexible probe portion 122. The packaging substrate 2 is prepared from a polymer material, and the packaging substrate 2 is provided with a bonding pad, which has the same distribution and size as the bonding pad in the flexible neural electrode layer 120, and is used for interconnecting the packaging substrate 2 and the flexible neural electrode layer 120. Micro solder balls matched with the size of the bonding pads are planted on the packaging substrate 2 in a laser ball planting mode. And connecting the bonding pad in the flexible neural electrode layer 120 with the micro solder ball on the packaging substrate 2 by a flip-chip bonding process to complete the packaging of the single planar flexible neural electrode array.
S603: a second planar flexible neural electrode array is obtained.
In an embodiment of the present application, the second planar flexible neural electrode array includes a second base and a second package substrate. The second base includes a second support substrate 110 and a flexible neuroelectrode layer 120 disposed on the second support substrate 110. The flexible neuroelectrode layer 120 includes a pad portion 121 and a flexible probe portion 122 connected to the support substrate 110. The back surface of the pad part 121 is connected to the second support substrate 110, the front surface of the pad part 121 is provided with pads, and the front surface of the second package substrate is provided with pads corresponding to the pads on the pad part 121. The pads on the second package substrate are solder-connected to the pads on the pad part 121.
In the embodiment of the application, the first planar flexible neural electrode array and the second planar flexible neural electrode array can be prepared by the method.
S605: and connecting the first planar flexible neural electrode array and the second planar flexible neural electrode array in a stacking way.
In the embodiment of the present application, when the first planar flexible neural electrode array and the second planar flexible neural electrode array are stacked and connected, in an optional implementation manner, at least part of the edge of the back surface of the first packaging substrate is connected with at least part of the edge of the front surface of the second packaging substrate. In this embodiment, when the package substrate 2 in the planar flexible neural electrode array is prepared, the area of the package substrate 2 is larger than the area of the support substrate 110 after the preparation. After the first planar flexible neural electrode array and the second planar flexible neural electrode array are stacked, the edge of the first packaging substrate corresponds to the edge of the second packaging substrate, and no other structural isolation exists between the first packaging substrate and the second packaging substrate. In this embodiment, the first package substrate and the second package substrate are connected by soldering. Specifically, when the package substrate 2 is prepared, a solder joint penetrating through the package substrate 2 is prepared at the edge of the package substrate 2. Therefore, the welding point at the edge of the first packaging substrate is connected with the welding point at the edge of the second packaging substrate through welding. In this embodiment, the first package substrate and the second package substrate may be connected by gluing. Specifically, the edge of the first package substrate and the edge of the second package substrate may be directly connected by an adhesive, or the edge of the first package substrate and the edge of the second package substrate may be connected by a connector. In another alternative embodiment, the opposite side of the first package substrate is attached to the opposite side of the second substrate. Optionally, the reverse surface of the first package substrate is connected to the reverse surface of the second substrate by gluing.
In an embodiment of the present application, the flexible neural electrode package structure includes two to more planar flexible neural electrode arrays. When the flexible neural electrode packaging structure comprises a plurality of planar flexible neural electrode arrays, after the connection between the first planar flexible neural electrode array and the second planar flexible neural electrode array is completed, more planar flexible neural electrode arrays can be connected to the second planar flexible neural electrode array. Specifically, the first planar flexible neural electrode array and the second planar flexible neural electrode array further include, after being stacked and connected: and stacking and connecting a preset number of second planar flexible neural electrode arrays on the reverse side of the second substrate.
The embodiment of the application also provides a preparation method of the flexible neural electrode packaging structure, and in the preparation method, the flexible neural electrode packaging structure is obtained by adopting a mode of sequentially preparing a plurality of planar flexible neural electrode arrays on a first planar flexible neural electrode array. Specifically, fig. 7 is a schematic flow chart of a manufacturing method of another flexible neural electrode encapsulation structure provided in the embodiment of the present application, and as shown in fig. 7, the manufacturing method includes:
s701: a first planar flexible neural electrode array is obtained.
In an embodiment of the present application, a first planar flexible neural electrode array includes a first base and a first package substrate. The first base includes a first support substrate 110 and a flexible neuroelectrode layer 120 disposed on the first support substrate 110. The flexible neuroelectrode layer 120 includes a pad portion 121 and a flexible probe portion 122 connected to the support substrate 110. The back surface of the pad part 121 is connected to the first support substrate 110, the front surface of the pad part 121 is provided with pads, and the front surface of the first package substrate is provided with pads corresponding to the pads on the pad part 121. The pads on the first package substrate are connected to the pads on the pad part 121 by soldering.
In the embodiment of the application, the planar flexible neural electrode array can be prepared by the following method: a flexible polymer substrate matched with the mechanical property of brain tissue is prepared on a supporting substrate 110, an imaged metal conducting layer is prepared on the flexible polymer substrate through the processes of photoetching, metal sputtering, metal evaporation and the like, the imaged metal conducting layer comprises microelectrode points, conducting wires and a back-end pad, and each microelectrode point corresponds to a welding point in the back-end pad one by one and is connected with the welding point through a metal conducting wire. And then preparing a flexible polymer substrate on the metal conductive layer. The preparation of the flexible neuroelectrode layer 120 is completed by releasing the device front end flexible probe portion 122. The packaging substrate 2 is prepared from a polymer material, and the packaging substrate 2 is provided with a bonding pad, which has the same distribution and size as the bonding pad in the flexible neural electrode layer 120, and is used for interconnecting the packaging substrate 2 and the flexible neural electrode layer 120. Micro solder balls matched with the size of the bonding pads are planted on the packaging substrate 2 in a laser ball planting mode. And connecting the bonding pad in the flexible neural electrode layer 120 with the micro solder ball on the packaging substrate 2 by a flip-chip bonding process to complete the packaging of the single planar flexible neural electrode array.
S703: a second planar flexible neural electrode array is prepared on the reverse side of the first substrate.
In the embodiment of the application, when the second planar flexible neural electrode array is prepared on the reverse surface of the first substrate, the second packaging substrate is prepared on the reverse surface of the first substrate. In an alternative embodiment, at least part of the edge of the back side of the first package substrate is connected to at least part of the edge of the front side of the second package substrate. In this embodiment, when the first package substrate in the first planar flexible neural electrode array is prepared, the area of the first package substrate is larger than that of the first support substrate 110 after the preparation. When the second package substrate is prepared on the reverse side of the first support substrate 110, the area of the second package substrate is larger than that of the first support substrate 110, so that the edge of the first package substrate corresponds to the edge of the second package substrate, and no other structural isolation exists between the two. In this embodiment, the first package substrate and the second package substrate are connected by soldering. Specifically, when the package substrate 2 is prepared, a solder joint penetrating through the package substrate 2 is prepared at the edge of the package substrate 2. Therefore, the welding point at the edge of the first packaging substrate is connected with the welding point at the edge of the second packaging substrate through welding. In this embodiment, the first package substrate and the second package substrate may also be connected by gluing. Specifically, the edge of the first package substrate and the edge of the second package substrate may be directly connected by an adhesive, or the edge of the first package substrate and the edge of the second package substrate may be connected by a connector. In another alternative embodiment, the reverse side of the first package substrate is attached to the reverse side of the second substrate. Optionally, the reverse surface of the second package substrate is connected to the reverse surface of the first supporting substrate 110 by gluing.
In an embodiment of the present application, the flexible neural electrode package structure includes two to more planar flexible neural electrode arrays. When the flexible neural electrode packaging structure comprises a plurality of planar flexible neural electrode arrays, after the preparation of the second planar flexible neural electrode array by the first planar flexible neural electrode array is completed, more planar flexible neural electrode arrays can be prepared on the second planar flexible neural electrode array. Specifically, after the second planar flexible neural electrode array is prepared on the reverse side of the first substrate, the method further comprises the following steps: a predetermined number of second planar flexible neural electrode arrays are prepared on the reverse side of the second substrate.
An embodiment of the present application provides an electronic device, including the flexible neural electrode package structure described above.
In the embodiment of the present application, the electronic device may include, but is not limited to, an implantable neurostimulator, an implantable neuro-recorder, an implantable stimulation-recorder, and the like. Specifically, taking the brain organ as an example, the electronic device may be a cranial nerve stimulator, a cranial nerve recorder, a cranial nerve stimulation-recorder, or the like.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A flexible neural electrode package structure, comprising:
at least two planar flexible neural electrode arrays arranged in a stack;
the planar flexible neural electrode array comprises a substrate (1) and a packaging substrate (2); the front surface of the base (1) is connected with the front surface of the packaging substrate (2);
the projection of the packaging substrate (2) on the horizontal plane is at least partially not coincident with the projection of the substrate (1) on the horizontal plane;
at least part of the edge of the back surface of the packaging substrate (2) is connected with at least part of the edge of the front surface of the other packaging substrate (2).
2. The flexible neural electrode package structure of claim 1, wherein the edge of the package substrate (2) is provided with a solder joint penetrating through the package substrate (2);
the welding points in one packaging substrate (2) are connected with the welding points in the other packaging substrate (2) through welding.
3. The flexible neural electrode package structure of claim 1, wherein one of the package substrates (2) is bonded to the other of the package substrates (2) by gluing.
4. A flexible neural electrode package structure, comprising:
at least two planar flexible neural electrode arrays arranged in a stack;
the planar flexible neural electrode array comprises a substrate (1) and a packaging substrate (2); the front surface of the base (1) is connected with the front surface of the packaging substrate (2);
the reverse side of the packaging substrate (2) is connected with the reverse side of the substrate (1) in the other planar flexible neural electrode array.
5. The flexible neural electrode packaging structure of claim 4, wherein the reverse surface of the packaging substrate (2) is connected with the reverse surface of the substrate (1) in the other planar flexible neural electrode array by gluing.
6. A preparation method of a flexible nerve electrode packaging structure is characterized by comprising the following steps:
acquiring a first planar flexible neural electrode array; the first planar flexible neural electrode array comprises a first substrate and a first packaging substrate, and the front surface of the first packaging substrate is connected with the front surface of the first substrate;
obtaining a second planar flexible neural electrode array; the second planar flexible neural electrode array comprises a second substrate and a second packaging substrate, and the front surface of the second packaging substrate is connected with the front surface of the second substrate;
connecting the first planar flexible neural electrode array with the second planar flexible neural electrode array in a stacked configuration; at least part of the edge of the back surface of the first packaging substrate is connected with at least part of the edge of the front surface of the second packaging substrate; or the reverse side of the first packaging substrate is connected with the reverse side of the second substrate.
7. The method for preparing according to claim 6, wherein after connecting the first planar flexible neural electrode array and the second planar flexible neural electrode array in a stacked manner, the method further comprises:
and stacking and connecting a preset number of second planar flexible neural electrode arrays on the reverse side of the second substrate.
8. A preparation method of a flexible nerve electrode packaging structure is characterized by comprising the following steps:
acquiring a first planar flexible neural electrode array; the first planar flexible neural electrode array comprises a first substrate and a first packaging substrate, and the front surface of the first packaging substrate is connected with the front surface of the first substrate;
preparing a second planar flexible neural electrode array on the reverse side of the first substrate; the second planar flexible neural electrode array comprises a second substrate and a second packaging substrate, and the front surface of the second packaging substrate is connected with the front surface of the second substrate; at least part of the edge of the back surface of the first packaging substrate is connected with at least part of the edge of the front surface of the second packaging substrate; or the reverse side of the second packaging substrate is connected with the reverse side of the first substrate.
9. The method for preparing according to claim 8, wherein after preparing the second planar flexible neural electrode array on the reverse side of the first substrate, further comprising:
preparing a preset number of the second planar flexible neural electrode arrays on the reverse side of the second substrate.
10. An electronic device comprising the flexible neural electrode package of any one of claims 1-3 or 4-5.
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| CN115568858A (en) * | 2022-09-07 | 2023-01-06 | 上海脑虎科技有限公司 | Neural electrode device and method for preparing neural electrode device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115568858A (en) * | 2022-09-07 | 2023-01-06 | 上海脑虎科技有限公司 | Neural electrode device and method for preparing neural electrode device |
| CN115568858B (en) * | 2022-09-07 | 2023-07-11 | 上海脑虎科技有限公司 | Neural electrode device and method for preparing same |
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