CN116751549B - Adhesive composition for chip and application thereof - Google Patents

Adhesive composition for chip and application thereof Download PDF

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Publication number
CN116751549B
CN116751549B CN202310723507.9A CN202310723507A CN116751549B CN 116751549 B CN116751549 B CN 116751549B CN 202310723507 A CN202310723507 A CN 202310723507A CN 116751549 B CN116751549 B CN 116751549B
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Prior art keywords
chip
parts
layer
adhesive composition
epoxy resin
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CN202310723507.9A
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Chinese (zh)
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CN116751549A (en
Inventor
伍得
王�义
廖述杭
苏峻兴
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Wuhan Sanxuan Technology Co ltd
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Wuhan Sanxuan Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The application relates to a chip adhesive composition and application thereof, belonging to the technical field of chip packaging; the components of the composition comprise epoxy resin, reactive diluent and auxiliary agent; wherein the epoxy resin comprises at least three epoxy functional groups and the reactive diluent comprises 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate; the viscosity is reduced by using 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate as a reactive diluent, so that the whole composition has better fluidity, thereby facilitating the preparation of the underfill layer. Meanwhile, the substance does not greatly affect the basic performance of the epoxy resin condensate, and the substance is matched with epoxy resin with a multi-epoxy functional group for use, so that the characteristics of the epoxy resin with the multi-epoxy functional group are fully exerted, the whole composition can be used for preparing an underfill layer and a mold seal layer, and the one-time preparation of the underfill layer and the mold seal layer is realized.

Description

Adhesive composition for chip and application thereof
Technical Field
The application relates to the technical field of chip packaging, in particular to a chip adhesive composition and application thereof.
Background
In order to protect and seal the chip, the bottom of the IC needs to be underfilled, i.e. an underfill layer is disposed between the IC and the package substrate, and flip-chip packaging, i.e. a packaging layer is wrapped outside the IC and the underfill layer, during the preparation of the chip. The underfill and flip chip packages are different in their placement and function, so the selection of the glue is different, and the underfill and flip chip packages are usually performed by two kinds of glue respectively, and finally the preparation of the identification layer is performed, as shown in fig. 1.
Disclosure of Invention
The application provides a chip adhesive composition and application thereof, so that the preparation of an underfill layer and a packaging layer is realized by adopting the adhesive, the respective corresponding performance requirements are met, the preparation steps of a chip are reduced, and the preparation efficiency is improved.
In a first aspect, the present application provides a chip adhesive composition comprising the components of an epoxy resin, a reactive diluent, and an adjuvant; wherein the epoxy resin comprises at least three epoxy functional groups and the reactive diluent comprises 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate.
As an alternative embodiment, the epoxy resin comprises triglycidyl para-aminophenol.
As an alternative embodiment, the auxiliary agents include curing agents, accelerators, fillers and coupling agents.
As an alternative embodiment, the curing agent comprises hexahydrophthalic anhydride; and/or
The accelerator comprises N, N-dimethylbenzylamine; and/or
The filler comprises silica; and/or
The coupling agent comprises at least one of KBM-403 and gamma-glycidyl ether oxypropyl trimethoxysilane.
As an alternative embodiment, the auxiliary agent further comprises: a colorant; the colorant comprises carbon black.
In a second aspect, the present application provides a chip adhesive composition, where the composition includes, in parts by weight: triglycidyl para-aminophenol: 5-20 parts of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate: 0.5-2.5 parts of curing agent: 10-30 parts of accelerator 0.1-0.5 part of filler: 50-80 parts of coupling agent: 0.1 to 1 part and 0.1 to 0.5 part of coloring agent.
As an alternative embodiment, the composition comprises the following components in parts by weight: triglycidyl para-aminophenol: 8-15 parts of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate: 1.1 to 2.1 parts of curing agent: 13-23 parts of accelerator 0.2-0.4 part of filler: 60-70 parts of coupling agent: 0.3 to 0.7 part and 0.2 to 0.4 part of coloring agent.
In a third aspect, the present application provides a method for manufacturing a chip, the method including: obtaining a chip body, wherein the chip body comprises a packaging substrate and an IC (integrated circuit), and the IC is connected to the packaging substrate; and simultaneously preparing an underfill layer and a mold seal layer on the chip body by adopting the adhesive composition for chips in the first aspect or the second aspect to obtain the chips.
As an alternative embodiment, the method further comprises: the identification is directly carried out on the die seal layer of the chip.
In a fourth aspect, the present application provides a chip comprising a chip body, an underfill layer, and a mold seal layer; the chip body comprises a packaging substrate and an IC, and the IC is connected with the packaging substrate; the underfill layer is arranged between the IC and the packaging substrate, the die-sealing layer wraps the IC and the underfill layer, and the components of the underfill layer and the die-sealing layer are the adhesive composition for chips according to any one of claims 1 to 6.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
according to the adhesive composition for chips, the viscosity is reduced by adopting 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate as a reactive diluent, so that the whole composition has good fluidity, and the preparation of an underfill layer is conveniently realized. Meanwhile, the substance does not greatly affect the basic performance of the epoxy resin condensate, and the substance is matched with epoxy resin with a polyepoxy functional group for use, so that the characteristics of low viscosity, high purity, high stability, excellent mechanical performance, heat resistance and high storage modulus of the epoxy resin with the polyepoxy functional group are fully exerted, the whole composition can be used for preparing an underfill layer and a mold seal layer, the one-time preparation of the underfill layer and the mold seal layer is realized, the respective corresponding performance requirements are met, the preparation steps of a chip are further reduced, and the preparation efficiency is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic diagram of a prior art chip preparation process;
fig. 2 is a schematic diagram of a chip preparation flow provided in an embodiment of the present application;
fig. 3 is a flow chart of a method provided by an embodiment of the present application.
Reference numerals: 1-chip body, 11-IC, 12-package substrate, 2-underfill layer, 3-mold seal layer, 4-presentation layer.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
Unless specifically indicated otherwise, the various raw materials, reagents, instruments, equipment, and the like used in this application are commercially available or may be prepared by existing methods.
The embodiment of the application provides a chip adhesive composition, which comprises the following components of epoxy resin, reactive diluent and auxiliary agent; wherein the epoxy resin comprises at least three epoxy functional groups and the reactive diluent comprises 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate.
3, 4-epoxy cyclohexylmethyl-3, 4-epoxy cyclohexylformate is alicyclic epoxy resin, is commonly used as an epoxy resin reactive diluent, has good dilution effect, does not generate bubbles or seepage, and has high surface smoothness; the basic properties of the epoxy resin cured product such as shrinkage, heat distortion temperature, impact strength and tensile strength of the cured product are not affected. The 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate is obtainable by means of preparation or commercially available, for example as Syna Epoxy S-06E from Nannong New material Co.
In some embodiments, the epoxy resin includes triglycidyl para-aminophenol.
The triglycidyl para-aminophenol is a trifunctional, low-viscosity epoxy resin, has high purity, low viscosity and high stability, can be cured by using amines and anhydrides as curing agents, has high curing speed, has excellent mechanical properties and heat resistance, and has excellent solvent resistance and corrosion resistance. The triglycidyl group may be obtained by means of preparation or commercially available, for example as Syna Epoxy S-510 from Nannong New Nannochemical Inc.
In some embodiments, the adjuvants include curing agents, accelerators, fillers, coupling agents, and colorants. The curing agent comprises hexahydrophthalic anhydride, is used for curing epoxy resin, can be obtained in a preparation mode or obtained in a commercially available mode, and can be a B1008 product of Puyang electronic materials Co., ltd; the accelerator comprises N, N-dimethylbenzylamine; the filler comprises silicon dioxide, and is used as a filler, so that the thermal expansion coefficient is reduced, and the water absorption rate is reduced; the coupling agent comprises at least one of KBM-403 and gamma-glycidyl ether oxypropyl trimethoxy silane, and is used for promoting the compatibility of inorganic filler and epoxy resin; the colorant comprises carbon black, which effects a dyeing of the entire gum.
In some embodiments, the components of the composition include, in parts by weight: triglycidyl para-aminophenol: 5-20 parts of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate: 0.5-2.5 parts of curing agent: 10-30 parts of accelerator 0.1-0.5 part of filler: 50-80 parts of coupling agent: 0.1 to 1 part and 0.1 to 0.5 part of coloring agent.
Triglycidyl para-aminophenol has excellent heat resistance, and controlling the mass fraction of triglycidyl para-aminophenol to 5 to 20 parts enables the whole composition to achieve a suitable CTE and storage modulus, and an excessively large value adversely affects the storage modulus to be too high and an excessively small value adversely affects the CTE to be too high.
Controlling the mass fraction of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate to be 0.5-2.5 parts can enable the viscosity of the composition to be in a proper range, so that the whole composition can be suitable for mold sealing and bottom filling, and the adverse effect of the excessive value is that the viscosity is too low, the mold sealing is not facilitated, and the adverse effect of the excessive value is that the viscosity is too high, and the bottom filling is not facilitated.
The curing agent is controlled to be 10-30 parts by mass so as to be capable of being completely cured with the epoxy resin, and the adverse effect of the excessive value is that the curing agent is excessive, the performance of the composition is reduced, and the adverse effect of the excessively small value is that the epoxy resin is not completely cured, and the performance of the composition is reduced.
The control of the accelerator in the amount of 0.1 to 0.5 parts by mass is to control the reaction rate of the accelerator composition, and the adverse effect of the excessive value is that the reaction rate of the composition is too high, the use time is shortened, and the adverse effect of the excessively small value is that the reaction rate of the composition is too low, so that the composition needs to be cured for a long time.
The filler is controlled to be 50-80 parts by mass in order to adjust the proper CTE and storage modulus, and the adverse effect of the excessive value is that the storage modulus is too high, and the adverse effect of the excessively small value is that the CTE is too high.
The coupling agent is controlled to be 0.1-1 part by mass for improving the compatibility of the resin and the filler, and the adverse effect of the excessive value is that the performance of the composition is reduced, and the adverse effect of the insufficient value is that the compatibility is not improved.
Further, the composition comprises the following components in parts by weight: triglycidyl para-aminophenol: 8-15 parts of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate: 1.1 to 2.1 parts of curing agent: 13-23 parts of accelerator 0.2-0.4 part of filler: 60-70 parts of coupling agent: 0.3 to 0.7 part and 0.2 to 0.4 part of coloring agent.
The chip adhesive composition can be prepared by mixing the components according to the component proportions, grinding the components to a jelly by a three-roller grinder, and carrying out vacuum defoaming.
As shown in fig. 2 and 3, based on a general inventive concept, an embodiment of the present application further provides a method for manufacturing a chip, where the method includes:
s1, obtaining a chip body, wherein the chip body comprises a packaging substrate and an IC (integrated circuit), and the IC is connected with the packaging substrate;
s2, preparing the bottom filling layer and the mold sealing layer of the chip body by adopting the adhesive composition for chips, so as to obtain the chips.
Because the adhesive composition for chips is used for preparing the mold seal layer, the surface after curing has better flatness, and in some embodiments, the method further comprises the following steps: the identification is directly carried out on the die seal layer of the chip. The identification can be directly made, so that the step of making the identification after attaching the back protective film can be reduced.
Based on one general inventive concept, embodiments of the present application also provide a chip including a chip body, an underfill layer, and a mold seal layer; the chip body comprises a packaging substrate and an IC, and the IC is connected with the packaging substrate; the bottom filling layer is arranged between the IC and the packaging substrate, the die sealing layer wraps the IC and the bottom filling layer, and the components of the bottom filling layer and the die sealing layer are the chip adhesive composition provided above.
The present application is further illustrated below in conjunction with specific examples. It should be understood that these examples are illustrative only of the present application and are not intended to limit the scope of the present application. The experimental procedures, which are not specified in the following examples, are generally determined according to national standards. If the corresponding national standard does not exist, the method is carried out according to the general international standard, the conventional condition or the condition recommended by the manufacturer.
Examples 1 to 4 and comparative examples 1 to 2
The adhesive composition for chips comprises the following components in parts by weight:
the adhesive compositions for chips provided in examples 1 to 4 and comparative examples 1 to 2 were subjected to viscosity (rotational viscosity), CTE1, storage modulus and warpage tests, and the specific test procedures were as follows:
method for testing viscosity (rotational viscosity): the sample was thermostated at 25℃and the gum solution was placed in a 6R sleeve of a viscometer using a Brookfield viscometer, the SC4-14 spindle was selected, the speed of the viscometer was adjusted to 20rpm, and the viscosity number was read after 4 minutes.
CTE1 test method: the glue solution was cured at 150℃for 1 hour to prepare 6 x 6cm samples of 1.2mm thickness, which were placed on a thermomechanical analyzer (TMA) test bench, measured according to a 10℃per minute temperature program, and the CTE values before the glass transition temperature were read.
Storage modulus: the glue solution is solidified for 1 hour at 150 ℃ to prepare a spline with the thickness of 1.2mm and the thickness of 6cm, and the spline is measured by a dynamic thermo-mechanical analyzer according to a heating program of 10 ℃/min, and the storage modulus at 25 ℃ is read.
The warping test method comprises the following steps: the glue solution is evenly coated on a glass slide, baked for 1 hour at 150 ℃, and taken out after natural cooling. The resin remaining around the slide was removed, one side of the slide was fixed, and the distance by which the slide was tilted was measured with a ruler, and this distance was recorded as warp.
The test results are shown in the following table:
from the table, the adhesive composition for chips provided by the embodiment of the application has proper viscosity, is favorable for bottom filling, meets the requirement of adhesive for a bottom filling layer, and is favorable for the definition of direct representation. Meanwhile, the high storage modulus meets the performance requirement of the mold sealing layer, has lower warpage, and is beneficial to the subsequent process steps of chip preparation.
Various embodiments of the present application may exist in a range format; it should be understood that the description in a range format is merely for convenience and brevity and should not be interpreted as a rigid limitation on the scope of the application. It is therefore to be understood that the range description has specifically disclosed all possible sub-ranges and individual values within that range. For example, it should be considered that a description of a range from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3,4, 5, and 6, wherever applicable. In addition, whenever a numerical range is referred to herein, it is meant to include any reference number (fractional or integer) within the indicated range.
In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used specifically to refer to the orientation of the drawing in the figures. In addition, in the description of the present application, the terms "include", "comprise", "comprising" and the like mean "including but not limited to". Relational terms such as "first" and "second", and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Herein, "and/or" describing an association relationship of an association object means that there may be three relationships, for example, a and/or B, may mean: a alone, a and B together, and B alone. Wherein A, B may be singular or plural. Herein, "at least one" means one or more, and "a plurality" means two or more. "at least one", "at least one" or the like refer to any combination of these items, including any combination of single item(s) or plural items(s). For example, "at least one (individual) of a, b, or c," or "at least one (individual) of a, b, and c," may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple, respectively.
The foregoing is merely a specific embodiment of the application to enable one skilled in the art to understand or practice the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. The adhesive composition for the chip is characterized by comprising the following components in parts by weight:
triglycidyl para-aminophenol: 5-20 parts of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate: 0.5-2.5 parts of curing agent: 10-30 parts of an accelerator, 0.1-0.5 part of a filler: 50-80 parts of a coupling agent: 0.1 to 1 part and 0.1 to 0.5 part of coloring agent.
2. The adhesive composition for chips as defined in claim 1, wherein the composition comprises the following components in parts by weight:
triglycidyl para-aminophenol: 8-15 parts of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate: 1.1-2.1 parts of a curing agent: 13-23 parts of an accelerator, 0.2-0.4 part of a filler: 60-70 parts of a coupling agent: 0.3 to 0.7 part and 0.2 to 0.4 part of coloring agent.
3. The adhesive composition for chips as defined in claim 1, wherein the curing agent comprises hexahydrophthalic anhydride; and/or
The accelerator comprises N, N-dimethylbenzylamine; and/or
The filler comprises silica; and/or
The coupling agent comprises at least one of KBM-403 and gamma-glycidyl ether oxypropyl trimethoxysilane.
4. The adhesive composition for chips of claim 1, wherein the colorant comprises carbon black.
5. A method of manufacturing a chip, the method comprising:
obtaining a chip body, wherein the chip body comprises a packaging substrate and an IC (integrated circuit), and the IC is connected to the packaging substrate;
the chip body is prepared by simultaneously preparing an underfill layer and a mold seal layer using the adhesive composition for chip according to any one of claims 1 to 4.
6. The method of manufacturing a chip of claim 5, further comprising: the identification is directly carried out on the die seal layer of the chip.
7. A chip, characterized in that the chip comprises a chip body, an underfill layer and a mold seal layer; the chip body comprises a packaging substrate and an IC, and the IC is connected with the packaging substrate; the underfill layer is arranged between the IC and the packaging substrate, the die-sealing layer wraps the IC and the underfill layer, and the components of the underfill layer and the die-sealing layer are the adhesive composition for chips according to any one of claims 1 to 4.
CN202310723507.9A 2023-06-19 2023-06-19 Adhesive composition for chip and application thereof Active CN116751549B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111826105A (en) * 2020-06-11 2020-10-27 北京康美特科技股份有限公司 Packaging adhesive for LED and use method and application thereof
CN113150730A (en) * 2021-05-13 2021-07-23 湖北三选科技有限公司 Protective adhesive for wafer cutting
CN115772374A (en) * 2022-12-20 2023-03-10 武汉市三选科技有限公司 Liquid mold sealing adhesive and preparation method thereof
CN115975569A (en) * 2023-02-23 2023-04-18 深圳市汉思新材料科技有限公司 Packaging adhesive for system-in-package and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111826105A (en) * 2020-06-11 2020-10-27 北京康美特科技股份有限公司 Packaging adhesive for LED and use method and application thereof
CN113150730A (en) * 2021-05-13 2021-07-23 湖北三选科技有限公司 Protective adhesive for wafer cutting
CN115772374A (en) * 2022-12-20 2023-03-10 武汉市三选科技有限公司 Liquid mold sealing adhesive and preparation method thereof
CN115975569A (en) * 2023-02-23 2023-04-18 深圳市汉思新材料科技有限公司 Packaging adhesive for system-in-package and preparation method thereof

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