CN115975569A - Packaging adhesive for system-in-package and preparation method thereof - Google Patents
Packaging adhesive for system-in-package and preparation method thereof Download PDFInfo
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- CN115975569A CN115975569A CN202310155819.4A CN202310155819A CN115975569A CN 115975569 A CN115975569 A CN 115975569A CN 202310155819 A CN202310155819 A CN 202310155819A CN 115975569 A CN115975569 A CN 115975569A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention discloses a packaging adhesive for system-in-package and a preparation method thereof, wherein the packaging adhesive for system-in-package comprises 3wt% -10 wt% of organic resin, 0.05wt% -5 wt% of toughening agent, 3wt% -10 wt% of curing agent, 0.05wt% -2 wt% of curing accelerator, 75wt% -90 wt% of inorganic filler and 0.05wt% -2 wt% of coupling agent. By combining the contents of the test example, the packaging adhesive for system-in-package comprises 75-90 wt% of inorganic filler, has low viscosity (less than or equal to 80 Pa.S), good processing formability, low thermal expansion coefficient (less than or equal to 15 ppm/DEG C), low water absorption rate (less than or equal to 0.32%), high glass transition temperature (more than or equal to 180 ℃) after curing, and excellent mechanical property and impact resistance, and can meet the requirements of high-density microelectronic package and system-in-package.
Description
Technical Field
The invention relates to the field of adhesives, in particular to a packaging adhesive for system-level packaging and a preparation method thereof.
Background
System In Package (SiP) is a high-density integration technology for integrating different active chips and passive devices into one package to form a system or subsystem, which can effectively reduce the size of products, realize high-density integration and volume miniaturization, and simultaneously can reduce the cost and meet various performance requirements and complex heterogeneous integration requirements. With the increasing requirements of the system on performance, power consumption and density, siP starts to use 2.5D/3D/wafer-level advanced packaging technology more, and together with the recent popular chiplet (core particles, circuits with different functions are made into separate small chips) technology, the advanced packaging technology using 3D-IC as a lead has achieved a good balance between SoC and PCB, which has become one of the hot spot technologies generally concerned by the industry at present, and will play an important role in the fields of wireless communication, automotive electronics, medical electronics, artificial intelligence, military electronics, and the like.
However, as a new direction of development of integrated circuits in the later molarity era, the system-in-package technology currently faces a series of challenges, such as regulation of multiple physical fields, coordination of multiple properties, fusion of multiple materials, and the like, and due to the difference of expansion coefficients of different devices and chips, a heterogeneous interface dynamics and an adhesion mechanism need to be established, and high-reliability heterogeneous integration is realized through interface regulation and fusion, which puts higher requirements on the packaging adhesive.
The traditional solid epoxy plastic package material is solid, is mainly formed by heating and injection molding, needs high temperature and certain pressure, has certain impact and influence on welding spots of multiple chips and devices, and cannot meet the requirement of system-level packaging. US6117953 discloses a preparation method of a liquid epoxy encapsulating material for a semiconductor, the liquid epoxy encapsulating material is composed of bisphenol A type epoxy, alicyclic epoxy and epoxy resin thereof, an anhydride curing agent and the like, the glass transition temperature of a cured resin is in the range of 150-160 ℃, the warping degree is less than 85um, but the water absorption rate is relatively large (0.79-0.92%), and the humidity and heat resistance is poor. US 5439977 discloses an epoxy encapsulant which has good pot life and flowability, but the cured resin has low heat resistance and a glass transition temperature of only 100-110 ℃.
In view of the problems of the current packaging adhesives, it is urgently needed to develop a packaging adhesive with low expansion coefficient, low stress, low water absorption rate and high glass transition temperature, so that it is very important that electronic components can stably work in a normal temperature range.
Disclosure of Invention
Therefore, it is necessary to provide a system-in-package adhesive with low expansion coefficient, low stress, low water absorption rate and high glass transition temperature.
In addition, a preparation method of the packaging adhesive for system-in-package is also needed.
The packaging adhesive for system-level packaging comprises 3-10 wt% of organic resin, 0.05-5 wt% of toughening agent, 3-10 wt% of curing agent, 0.05-2 wt% of curing accelerator, 75-90 wt% of inorganic filler and 0.05-2 wt% of coupling agent.
In one embodiment, the organic resin is selected from at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate, 3-oxiranyl 7-oxabicyclo [4.1.0] heptane, bis ((3,4-epoxycyclohexyl) methyl) adipate, 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate, 1,4-cyclohexanedimethanol bis (3,4-epoxycyclohexanecarboxylate), triglycidyl p-aminophenol, 4,4' -bis (2,3-epoxypropoxy) biphenyl, hydantoin epoxy resin, bisphenol a type cyanate ester, bisphenol F type cyanate ester, bisphenol E type cyanate ester, bisphenol M type cyanate ester, dicyclopentadiene type cyanate ester, and phenolic type cyanate ester resin.
In one embodiment, the toughening agent is selected from at least one of silicone hybrid epoxy resins and epoxy oligomeric silsesquioxanes.
In one embodiment, the curing agent is selected from at least one of methyl hexahydrophthalic anhydride, modified methyl tetrahydrophthalic anhydride, methyl nadic anhydride, modified trimellitic anhydride, and alkenyl substituted succinic anhydride.
In one embodiment, the cure accelerator is selected from at least one of 1,8-diazabicycloundec-7-ene, 1,5-diaza-bicyclo [4.3.0] nonene, 5,6-dibutylamino-1,8-diaza-bicyclo [5.4.0] undecene-7, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenyl-4,5-bis (cyanoethylmethylene) imidazole, heptadecylimidazole, and 2,4-diamino-6[2 '-methylimidazole- (1') ] ethyl-S-triazine.
In one embodiment, the inorganic filler is selected from at least one of spherical silica and spherical alumina.
In one embodiment, the spherical alumina has a particle size of 0.5 μm to 20 μm.
In one embodiment, the spherical silica has a particle size of 0.1 μm to 10 μm.
In one embodiment, the coupling agent is selected from at least one of 3- (2,3-glycidoxy) propyltrimethoxysilane, (3-glycidoxypropyl) triethoxysilane, and 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, and gamma-anilinopropyltrimethoxysilane.
A preparation method of the packaging adhesive for system-in-package comprises the following steps:
stirring and mixing organic resin, a toughening agent, a curing accelerator, inorganic filler and a coupling agent to obtain an epoxy resin compound;
grinding the epoxy resin compound for three times after passing through three rollers, then stirring again, carrying out vacuum-pumping defoaming treatment, and finally filtering and discharging to obtain the required underfill adhesive for the packaged chip, wherein the underfill adhesive for the system-in-package comprises 3wt% -10 wt% of the organic resin, 0.05wt% -5 wt% of the toughening agent, 3wt% -10 wt% of the curing agent, 0.05wt% -2 wt% of the curing accelerator, 75wt% -90 wt% of the inorganic filler and 0.05wt% -2 wt% of the coupling agent.
With the content of the test example, the packaging adhesive for system-in-package of the invention comprises 75wt% -90 wt% of inorganic filler, has lower viscosity (less than or equal to 80 Pa.S), good processing formability, lower thermal expansion coefficient (less than or equal to 15 ppm/DEG C), low water absorption (less than or equal to 0.32%), high glass transition temperature (more than or equal to 180 ℃) after curing, and excellent mechanical property and impact resistance, and can meet the requirements of high-density microelectronic package and system-in-package.
In addition, the packaging adhesive for system-in-package adopts a modified anhydride curing system, so that the volatility of anhydride is obviously reduced, the lower viscosity of the system is kept, the high filling of inorganic powder is realized, and the thermal expansion coefficient of a liquid packaging material is effectively reduced; meanwhile, the organic silicon hybrid epoxy resin with low surface energy is introduced, so that the modulus and stress of a cured product are reduced, the water absorption of a system can be effectively reduced, the heat resistance of the system is remarkably improved, and the water absorption and stress of the system are reduced, so that the low-stress and humidity-heat-resistant liquid packaging material is obtained.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
The invention discloses a system-in-package packaging adhesive which comprises 3-10 wt% of organic resin, 0.05-5 wt% of toughening agent, 3-10 wt% of curing agent, 0.05-2 wt% of curing accelerator, 75-90 wt% of inorganic filler and 0.05-2 wt% of coupling agent.
With the contents of the test examples, the packaging adhesive for system-in-package of the invention comprises 75wt% -90 wt% of inorganic filler, has lower viscosity (less than or equal to 80 Pa.S), good processing formability, lower thermal expansion coefficient (less than or equal to 15 ppm/DEG C), low water absorption (less than or equal to 0.32%), high glass transition temperature (more than or equal to 180 ℃) after curing, and excellent mechanical property and impact resistance, and can meet the requirements of high-density microelectronic package and system-in-package.
Preferably, in the present embodiment, the organic resin is selected from at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate, 3-oxiranyl 7-oxabicyclo [4.1.0] heptane, bis ((3,4-epoxycyclohexyl) methyl) adipate, 4,5-epoxycyclohexane-1,2-diglycidyl phthalate, 1,4-cyclohexanedimethanol bis (3,4-epoxycyclohexanecarboxylic acid) ester, triglycidyl p-aminophenol, 4,4' -bis (2,3-epoxypropoxy) biphenyl, hydantoin epoxy resin, bisphenol a type cyanate ester, bisphenol F type cyanate ester, bisphenol E type cyanate ester, bisphenol M type cyanate ester, dicyclopentadiene type cyanate ester, and phenol type cyanate ester resin.
More preferably, in the present embodiment, the organic resin is at least one selected from the group consisting of liquid bisphenol a type epoxy resin, liquid bisphenol F type epoxy resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate, p-aminophenol type liquid epoxy resin, and bisphenol E type cyanate ester.
Preferably, in the present embodiment, the toughening agent is selected from at least one of silicone hybrid epoxy resin and epoxy oligomeric silsesquioxane.
The silicone Hybrid epoxy resin may be Brillouin MX962, nippon Xinyue X-40-2678, nippon Xinyue X-40-2669, nippon Xinyue X-40-2728, or Nippon Xinyue KR470, and the epoxy oligomeric silsesquioxane may be EP0409 from Hybrid Plastics, USA.
Among them, brillouin MX962 in Japan and EP0409 from the American Plastics company are preferred because of their core-shell structure having good heat resistance and impact resistance.
More preferably, in the present embodiment, the toughening agent is a mixture of 1: 0.8-3 of a mixture of silicone hybrid epoxy resin and epoxy oligomeric silsesquioxane.
Preferably, in the present embodiment, the content of the toughening agent is 0.1wt% to 3wt%.
In the present embodiment, the curing agent is preferably at least one selected from the group consisting of methyl hexahydrophthalic anhydride (S816, LD-GX 60), modified methyl tetrahydrophthalic anhydride JH-0611, methyl nadic anhydride JH-0630, modified trimellitic anhydride, and alkenyl-substituted succinic anhydride.
The modified anhydride curing agent has excellent moisture resistance and heat cycle resistance, and the modified methylhexahydrophthalic anhydride S816 and methyl nadic anhydride have better storage stability.
Preferably, in this embodiment, the cure accelerator is selected from at least one of 1,8-diazabicycloundecen-7-ene, 1,5-diaza-bicyclo [4.3.0] nonene, 5,6-dibutylamino-1,8-diaza-bicyclo [5.4.0] undecene-7, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenyl-4,5-bis (cyanoethylmethylene) imidazole, heptadecylimidazole, and 2,4-diamino-6[2 '-methylimidazole- (1') ] ethyl-S-triazine.
Preferably, in the present embodiment, the content of the curing accelerator is 0.05wt% to 2wt%.
More preferably, in the present embodiment, the content of the curing accelerator is 0.1wt% to 0.5wt%.
If the amount of the curing accelerator used is less than 0.05%, the curability tends to be poor in a short time; if the amount of the curing accelerator is more than 2%, the curing rate is too high, and it is difficult to obtain a molded article having a good shape.
Preferably, in the present embodiment, the inorganic filler is at least one selected from spherical silica and spherical alumina, the spherical alumina has a particle size of 0.5 to 20 μm, and the spherical silica has a particle size of 0.1 to 10 μm.
More preferably, in the present embodiment, the inorganic filler is present in a mass ratio of 0.9 to 1.5:1 of spherical silica and spherical alumina.
Particularly preferably, in the present embodiment, the spherical alumina is surface-modified spherical alumina, and has an average particle diameter of 1 to 10 μm; the spherical silicon dioxide is surface modified spherical silicon dioxide, and the average particle size is 0.8-5 mu m.
Specifically, the surface modification of the surface-modified spherical alumina and the surface-modified spherical silica employs a silane coupling agent, preferably a methoxy silane coupling agent, more preferably gamma- (2,3-glycidoxy) propyl trimethoxysilane.
Preferably, in this embodiment, the coupling agent is selected from at least one of 3- (2,3-glycidoxy) propyltrimethoxysilane, (3-glycidoxypropyl) triethoxysilane, and 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, and gamma-anilinopropyltrimethoxysilane.
Preferably, in the present embodiment, the content of the coupling agent is 0.05wt% to 2wt%.
More preferably, in the present embodiment, the content of the coupling agent is 0.5wt% to 1.5wt%.
If the content of the coupling agent is less than 0.1%, moldability and moisture resistance are deteriorated; if the content of the coupling agent is more than 2%, thixotropy is generated to some extent, and the fluidity of the system is deteriorated, and the adhesion is also lowered.
The packaging adhesive for system-in-package adopts a modified anhydride curing system, remarkably reduces the volatility of anhydride, maintains lower viscosity of the system, realizes high filling of inorganic powder, and effectively reduces the thermal expansion coefficient of a liquid packaging material; meanwhile, the organosilicon hybrid epoxy resin with low surface energy is introduced, so that the modulus and stress of a cured substance are reduced, the water absorption of a system can be effectively reduced, the heat resistance of the system is remarkably improved, and the water absorption and stress of the system are reduced, so that a low-stress and humidity-heat-resistant liquid packaging material is obtained.
The invention also discloses a preparation method of the packaging adhesive for system-in-package, which comprises the following steps:
stirring and mixing organic resin, a toughening agent, a curing accelerator, inorganic filler and a coupling agent to obtain an epoxy resin compound;
grinding the epoxy resin compound for three times after passing through three rollers, then stirring again, carrying out vacuum-pumping and defoaming treatment, and finally filtering and discharging to obtain the required underfill for the packaged chip.
The obtained system-in-package packaging adhesive comprises 3-10 wt% of organic resin, 0.05-5 wt% of toughening agent, 3-10 wt% of curing agent, 0.05-2 wt% of curing accelerator, 75-90 wt% of inorganic filler and 0.05-2 wt% of coupling agent.
The following are specific examples
Example 1
S1, adding 35g of bisphenol F epoxy resin YD8170, 20g of bisphenol A epoxy resin YD8125, 15g of 3, 4-epoxy cyclohexyl methyl 3,4-epoxy cyclohexyl formate CELLOXIDE2021P, 12g of toughening agent MX962, 60g of curing agent S816, 850g of spherical silicon dioxide SEC-4050, 5g of silane coupling agent KBM-403 (Japan shin-Etsu) and 3.0g of accelerator DBU into a reaction kettle, and stirring for 120min by using a stirrer with the rotating speed of 50rpm as a disperser and the rotating speed of 1200-1500 rpm;
and S2, taking out the mixture, putting the mixture into a three-roll grinder for grinding, transferring the mixture into a double-planet hybrid stirring kettle for stirring for 60min, vacuumizing and defoaming until the vacuum degree is less than-0.098 MPa, and finally filtering and discharging to obtain the system-level packaging adhesive 1.
Example 2
S1, adding 20g of 3, 4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate CELLOXIDE2021P (Japanese cellosolve), 40g of bisphenol E type cyanate ester, 8g of toughening agent MX962, 20g of curing agent methylnadic anhydride, 900g of spherical alumina AZ2-75 (New Ribose), 10g of silane coupling agent KBM-403 (Nippon Beacon) and 2g of accelerator DBU into a reaction kettle, and stirring for 120min by using a stirrer with the rotating speed of 50rpm and a disperser with the rotating speed of 1200-1500 rpm;
s2, taking out the mixture, putting the mixture into a three-roll grinder for grinding and mixing for three times, transferring the mixture into a double-planet hybrid stirring kettle for stirring for 60min, carrying out vacuumizing and defoaming treatment, wherein the vacuum degree is less than-0.098 MPa, and finally filtering and discharging to obtain the packaging adhesive 2 for system-in-package.
Example 3
S1, adding 30g CELLOXIDE2021P (Japanese xylonite), 53G bisphenol E type cyanate ester, 4G flexibilizer epoxy silsesquioxane EP0409, 30G curing agent methylnadic anhydride, 870G spherical silica SC-220G-SQ, 10G silane coupling agent KBM-403 (Japanese Xinyue) and 3G accelerant MZ-A into a reaction kettle, and stirring for 120min at a stirrer rotating speed of 50rpm and a disperser of 1200-1500 rpm;
and S2, taking out the mixture, grinding the mixture in a three-roll grinder, transferring the mixture to a double-planet hybrid stirring kettle, stirring the mixture for 60min, vacuumizing and defoaming the mixture until the vacuum degree is less than-0.098 MPa, and finally filtering and discharging the mixture to obtain the packaging adhesive 3 for system-in-package.
Example 4
S1, adding 40G of bisphenol F epoxy resin YD8170, 25G of triglycidyl p-aminophenol AG-90, 10G of flexibilizer epoxy silsesquioxane EP0409, 10G of flexibilizer X-40-2669, 75G of curing agent methyl nadic anhydride, 830G of spherical silicon oxide SC-220G-SQ, 7G of silane coupling agent KBM-403 (Japan shines), and 3G of accelerator MZ-A into a reaction kettle, and stirring for 120min by using a stirrer at a rotating speed of 50rpm and a 1200-1500 rpm disperser;
s2, taking out the mixture, putting the mixture into a three-roll grinder for grinding, transferring the mixture into a double-planet hybrid stirring kettle for stirring for 60min, vacuumizing and defoaming until the vacuum degree is less than-0.098 MPa, and finally filtering and discharging to obtain the packaging adhesive 4 for system-in-package.
Example 5
S1, adding 35G of bisphenol F epoxy resin YD8170, 15g of CELLOXIDE2021P (Japanese gross xylonite), 15G of triglycidyl p-aminophenol AG-90, 5G of flexibilizer epoxy silsesquioxane EP0409, 10G of flexibilizer MX962, 63G of curing agent S816, 450G of spherical silicon oxide SC-220G-SQ, 400G of spherical aluminum oxide ASFP-20, 5G of gamma-anilinopropyltrimethoxysilane and 2G of accelerant 2-phenylimidazole into a reaction kettle, and stirring for 120min at the rotating speed of a stirrer of 50rpm and the rotating speed of a disperser of 1200-1500 rpm;
and S2, taking out the mixture, grinding the mixture in a three-roll grinder, transferring the mixture to a double-planet hybrid stirring kettle, stirring the mixture for 60min, vacuumizing and defoaming the mixture until the vacuum degree is less than-0.098 MPa, and finally filtering and discharging the mixture to obtain the packaging adhesive 5 for system-in-package.
Comparative example 1
S1, adding 75G of bisphenol A diglycidyl ether YD8125, 15G of a toughening agent MX154, MH-700G (new Japan rationalization) 69G, 830G of spherical silicon dioxide SEC-4050, 10G of a silane coupling agent KBM-403 (Japan shines), and 1.0G of an accelerant 2E4MZ into a reaction kettle, and stirring for 120min at the rotating speed of a stirrer of 50rpm and the rotating speed of a disperser of 1200-1500 rpm;
and S2, taking out the epoxy resin compound, putting the epoxy resin compound into a three-roll grinder for grinding, transferring the epoxy resin compound into a double-planet hybrid stirring kettle, stirring for 60min, vacuumizing and defoaming until the vacuum degree is less than-0.098 MPa, and finally filtering and discharging to obtain the reference liquid packaging material 1.
Comparative example 2
S1, adding 60G of bisphenol F diglycidyl ether YD8170, 15g of CELLOXIDE2021P (Japanese xylonite), 15G of a toughening agent MX154, MH-700G (Xinri Ri chemical) 69G, 850G of spherical silica SC-220G-SQ, 10G of a silane coupling agent KBM-403 (Japan Beacon), and 1.0G of an accelerator 2E4MZ into a reaction kettle, and stirring for 120min at a stirrer rotating speed of 50rpm and a disperser of 200-300 rpm;
and S2, taking out the epoxy resin compound, putting the epoxy resin compound into a three-roll grinder for grinding, transferring the epoxy resin compound into a double-planet hybrid stirring kettle, stirring for 60min, vacuumizing and defoaming until the vacuum degree is less than-0.098 MPa, and finally filtering and discharging to obtain the reference liquid packaging material 2.
Test example
The performance of the system-in-package adhesives obtained in examples 1 to 5 and the reference liquid encapsulating materials obtained in comparative examples 1 to 2 were measured by the following tests, and table 1 was obtained.
And (3) viscosity testing: viscosity values measured using a Brookfield rotational viscometer at 25 deg.C, spindle # 52, 0.2mm gap, at 10 rpm.
And (3) testing the flowing time: two parallel glass plates were used, with a gap of 50 μm, and the time for the glue to flow to the 30mm position was recorded.
And (3) testing the bonding strength: dispensing 0.2mg of glue on FR-4, then pasting a 1mm silicon chip on the FR-4, standing for 5min at room temperature, curing, and testing thrust by using DAGE4000 after curing to obtain the bonding strength.
Glass transition temperature Tg test: and testing by adopting a DSC method, putting 10mg of a sample into equipment, controlling the temperature to be 25-300 ℃ and the temperature rise speed to be 10 ℃/min, and analyzing the obtained curve to obtain Tg data.
Coefficient of linear thermal expansion CTE test: according to the standard test (ASTM D696-79), a Hitachi TMA7300 device is adopted, the detection temperature range is 25-300 ℃, the heating rate is 5 ℃/min, the size of the pattern is as follows: phi 6mm and length 3mm.
Double 85 reliability test: testing according to the standard (GB/T5170.5-2008) using a moist heat weatherometer at a temperature of 85 ℃, humidity 85% RH for 1000h.
Cold and hot impact test: testing according to the standard (GB/T5170.5-2008), and utilizing a temperature cycle aging test box, wherein the temperature is-55 ℃/15min,125 ℃/15min and 700 times.
TABLE 1
As can be seen from Table 1, the system-in-package encapsulation pastes prepared in examples 1 to 5 have low viscosity (less than or equal to 80Pa · S), good processability, low thermal expansion coefficient (less than or equal to 15 ppm/DEG C), low water absorption (less than or equal to 0.32%), high glass transition temperature (more than or equal to 180 ℃) after curing, and excellent mechanical properties and impact resistance, and can meet the requirements of high-density microelectronic packaging and system-in-package.
In addition, the liquid encapsulation material prepared from the encapsulation adhesive modified anhydride curing agent for system-in-package prepared in embodiments 1 to 5 has better fluidity and lower volume shrinkage, so that the main modification volatility of the anhydride curing agent is reduced; in addition, due to the fact that the hybrid organic silicon epoxy resin is introduced, due to the fact that organic silicon has the characteristic of multiple functional groups, the cross-linking density of a cured product is improved, the material is endowed with higher glass transition temperature and temperature resistance, the water absorption of the system is obviously reduced, and the moisture-heat resistance and the temperature-shock resistance of the system are obviously improved; after 1000h of damp heat aging and 700 times of warm punching, the bonding surface is not cracked and peeled, and the device can still work normally.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The packaging adhesive for system-level packaging is characterized by comprising 3-10 wt% of organic resin, 0.05-5 wt% of toughening agent, 3-10 wt% of curing agent, 0.05-2 wt% of curing accelerator, 75-90 wt% of inorganic filler and 0.05-2 wt% of coupling agent.
2. The encapsulant for system-in-package according to claim 1, wherein the organic resin is selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl formate, 3-oxiranyl 7-oxabicyclo [4.1.0] heptane, bis ((3,4-epoxycyclohexyl) methyl) adipate, 4,5-epoxycyclohexane-1,2-diglycidylester dicarboxylate, 1,4-cyclohexanedimethanol bis (3,4-epoxycyclohexane carboxylate) ester, triglycidyl p-aminophenol, 4,4' -bis (2,3-epoxypropoxy) biphenyl, hydantoin epoxy resin, bisphenol A type cyanate ester, bisphenol F type cyanate ester, bisphenol E type cyanate ester, bisphenol M type cyanate ester, dicyclopentadiene type cyanate ester, and phenolic type cyanate ester resin.
3. The package adhesive for system-in-package according to claim 1, wherein the toughening agent is at least one selected from silicone hybrid epoxy resin and epoxy oligomeric silsesquioxane.
4. The package adhesive for system-in-package according to claim 1, wherein the curing agent is at least one selected from the group consisting of methyl hexahydrophthalic anhydride, modified methyl tetrahydrophthalic anhydride, methyl nadic anhydride, modified trimellitic anhydride, and alkenyl-substituted succinic anhydride.
5. The package adhesive for system-in-package according to claim 1, wherein the curing accelerator is at least one selected from the group consisting of 1,8-diazabicycloundec-7-ene, 1,5-diaza-bicyclo [4.3.0] nonene, 5,6-dibutylamino-1,8-diaza-bicyclo [5.4.0] undecene-7, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenyl-4,5-bis (cyanoethylmethylene) imidazole, heptadecylimidazole and 2,4-diamino-6[2 '-methylimidazole- (1') ] ethyl-S-triazine.
6. The package adhesive for system-in-package according to any one of claims 1 to 5, wherein the inorganic filler is at least one selected from spherical silica and spherical alumina.
7. The package adhesive for system-in-package according to claim 6, wherein the spherical alumina has a particle size of 0.5 μm to 20 μm.
8. The package adhesive for system-in-package according to claim 7, wherein the spherical silicon dioxide has a particle size of 0.1 μm to 10 μm.
9. The package adhesive for system-in-package according to claim 6, wherein the coupling agent is at least one selected from the group consisting of 3- (2,3-glycidoxy) propyltrimethoxysilane, (3-glycidoxypropyl) triethoxysilane, and 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-aminoethyl-3-aminopropyltriethoxysilane, and gamma-anilinopropyltrimethoxysilane.
10. A method for preparing the packaging adhesive for system-in-package according to any one of claims 1 to 9, comprising the steps of:
stirring and mixing organic resin, a toughening agent, a curing accelerator, inorganic filler and a coupling agent to obtain an epoxy resin compound;
grinding the epoxy resin compound for three times after passing through three rollers, then stirring again, carrying out vacuum-pumping defoaming treatment, and finally filtering and discharging to obtain the required underfill adhesive for the packaged chip, wherein the underfill adhesive for the system-in-package comprises 3wt% -10 wt% of the organic resin, 0.05wt% -5 wt% of the toughening agent, 3wt% -10 wt% of the curing agent, 0.05wt% -2 wt% of the curing accelerator, 75wt% -90 wt% of the inorganic filler and 0.05wt% -2 wt% of the coupling agent.
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| CN202310155819.4A CN115975569A (en) | 2023-02-23 | 2023-02-23 | Packaging adhesive for system-in-package and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116751549A (en) * | 2023-06-19 | 2023-09-15 | 武汉市三选科技有限公司 | Adhesive composition for chip and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116751549A (en) * | 2023-06-19 | 2023-09-15 | 武汉市三选科技有限公司 | Adhesive composition for chip and application thereof |
| CN116751549B (en) * | 2023-06-19 | 2024-01-26 | 武汉市三选科技有限公司 | Adhesive composition for chip and application thereof |
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