CN116744571A

CN116744571A - Placement method for accurately positioning placement of large components on target areas of a substrate and associated placement apparatus

Info

Publication number: CN116744571A
Application number: CN202310210773.1A
Authority: CN
Inventors: 赛-克里希纳·武帕拉; 阿帕纳·帕拉; 马里乌斯·克莱因
Original assignee: Ersa GmbH
Current assignee: Ersa GmbH
Priority date: 2022-03-08
Filing date: 2023-03-07
Publication date: 2023-09-12
Also published as: DE102022105380A1; US20230288913A1

Abstract

The present invention describes a placement method for accurately positioning placement of large components with pins on a substrate, in particular a target area of a printed circuit board, and a placement device for this purpose.

Description

Placement method for accurately positioning placement of large components on target areas of a substrate and associated placement apparatus

Technical Field

The present invention relates to a placement method for accurately positioning placement of a component having pins on a target area of a substrate, such as, in particular, a printed circuit board. The invention also relates to a placement device for placing such a component.

Background

The component is typically an electrical or electronic component such as a memory module, a microprocessor, an inverter, a Vertical Cavity Surface Emitting Laser (VCSEL) component, a photodiode, a microelectromechanical system (MEMS) component, or a chip-on-glass (chip-on-glass) component. The substrate on which the component is placed has contact points corresponding to the pins of the component, and during placement of the component on the substrate, accurate positional alignment is required in such a way that: each pin of the component contacts a contact point of its corresponding substrate.

The contact points are preferably conductive connections (pads) applied to the surface of the substrate. The components are placed on the substrate such that one pin in each case rests on the relevant pad and is attached there by means of reflow soldering (surface-mount technology (SMT)). The pins may also be contact pins. However, it is also conceivable to form the contact points as contacts around holes in the substrate, and then insert pins of the component into the holes to be in contact with the contact points (through-hole technology, THT).

A method for accurately positioning a placement element and a corresponding placement device are known from EP 2 989 872 B1.

It is known from EP 2 989 872 B1 to clamp the component and to guide the component by means of an image acquisition system which captures an image of the component. Another image acquisition system captures images of a target area on a substrate. An evaluation or control unit evaluates the image and determines a positional deviation, which is compensated before the component is placed on the substrate.

WO 97/02708 discloses a placement method in which the component is first clamped and moved into an area above the target area. The image acquisition system is then moved into the region between the clamped component and the target region in order to detect the component on the one hand and the target region on the other hand, both in the detection region of the image acquisition system. An image acquisition system can be used to generate a plurality of images, in particular corner regions of diagonal corners of a component or target region. Then, a positional deviation between the component and the target area is calculated from the acquired image, and is compensated before the component is placed on the target area.

Placement devices with the features of the preamble of the claimed content are known from the repair devices HR600XL sold by the applicant at the time of submission. In this case, a first image acquisition system arranged in a fixed or stable manner is disposed below the support surface, and the component is placed on the support surface to detect the pins. The second image acquisition system is arranged above the substrate and shoots a target area.

By means of the device, components having dimensions of up to about 60x 60mm extending parallel to the substrate can be clamped and placed. When the support surface and the target surface have been photographed, the detection area of the image acquisition system is able to photograph such a large area with a sufficiently high accuracy. Automatic placement of parts greater than 60x 60mm in size in an accurately positioned manner is problematic because large areas cannot be photographed with sufficient accuracy.

Nevertheless, to be able to align and place such large components, it is conceivable to use an image acquisition system with a larger detection area. However, this involves certain drawbacks, in particular a higher cost for hardware, since the higher resolution of the generated and processed image is associated with a larger detection area. Furthermore, complex adjustments are required to the software for the image acquisition system with larger detection area and higher resolution.

Disclosure of Invention

It is therefore an object of the present invention to provide a placement method and a placement device by means of which relatively large components can be aligned and placed in a simple manner and still in a functionally reliable manner.

This object is achieved by a placement method for accurately positioning a component comprising pins on a target area of a substrate according to the claimed subject matter. The method is performed here by placing a device.

Such placement apparatus comprises clamping means for clamping the substrate. In particular, the substrate may be a printed circuit board.

Furthermore, support surfaces extending in the x, y direction (i.e. parallel to the plane of the substrate) are provided for placing the component to be placed. The support surface is transparent, in particular made of glass, and is in particular arranged in a fixed or stable manner on the device. The surface can be designed as a light dome (light dome) which is illuminated in such a way that: the component is fully illuminated from below through the glass plate, i.e. from the side on which the pins are provided.

Furthermore, a first image acquisition system is provided, in particular, which is also arranged in a fixed manner for detecting pins of a component placed on a support surface. The illuminated pins from below can be detected using the first image acquisition system. Preferably, the image acquisition system is located below the support surface. The first image acquisition system can be designed as a camera, in particular a camera or a Charge Coupled (CCD) camera. Monochrome cameras have been shown to be advantageous here.

Further, a second image acquisition system is provided for detecting a contact point in a target area present on a target surface, the target surface extending in the x, y direction. In this case, too, the target surface extends parallel to the plane of the substrate. Preferably, the second image acquisition system is arranged movable with respect to the clamped substrate at least in the x, y direction, in particular in the z direction (i.e. perpendicular to a plane spanning the x and y directions). The second image acquisition system can be designed as a camera, in particular a camera or a CCD camera. Color cameras have been shown to be advantageous here.

Furthermore, a clamping unit is provided, which is designed for picking up a component, for moving the component in x, y and z directions, for rotating the component around the z direction, and for placing the component on the target area in a precisely positioned manner. In particular, the gripping unit comprises a movable vacuum suction tube which sucks the component for gripping by vacuum.

Furthermore, a control unit is provided, which is designed in particular for controlling the two image acquisition systems and the clamping unit and evaluating the images acquired by the image acquisition systems.

In this case, the first method according to the invention of the claimed content provides the following steps:

(a) A component that clamps a detection area of the first image acquisition system in the x and y directions that is larger than a detection area of the second image acquisition system in the support surface and/or the target surface;

(b) Placing the component on a support surface such that a predesignable region of the component having pins (hereinafter ROI component region, wherein ROI: region of interest (region of interest)) is located within a detection region of the first image acquisition system;

(c) Detecting pins of the component in the region of the component (ROI component region) using the first image acquisition system, and thereby determining items of pin detection information;

(d) Detecting a contact point in a region of a target region (ROI target region) corresponding to a predesignable region of the component using the second image acquisition system, and thereby determining an item of contact point detection information;

(e) Superposing the pin detection information and the contact point detection information, and determining deviation of the pin detection information and the contact point detection information;

(f) Determining a difference vector for moving the component in the x, y directions and a rotation angle for rotating the component about the z direction, thereby compensating for the deviation;

(g) Moving the member along the difference vector and rotating the member around the rotation angle; and

(h) The component is placed on a target area of the substrate using a clamping unit.

Thus, the first method according to the invention provides the advantage that: components having dimensions in the x and y directions that are larger than the detection area of the first image acquisition system and/or the detection area of the second image acquisition system can be placed in an accurately positioned manner. In this case the component can theoretically be of any desired size, since according to the method of the invention it is not necessary to bring the component completely into the detection area of the image acquisition system. With a first image acquisition system advantageously arranged below the support surface, it is sufficient to detect only one predesignable ROI component region (ROI: region of interest (region of interest)). In other words, only the ROI component region is photographed, not the entire component. In particular, the ROI component region can already be defined before the clamping component. Once the type of part to be clamped and placed is known, the ROI part region can be pre-specified or defined.

After the first image acquisition system has captured the ROI component region, items of pin detection information are determined therefrom. For example, the pin detection information can be reproduced on a screen, and the detected pin can be displayed.

Using the second image acquisition system, the contact point of a predesignable region (ROI target region) of the component is detected, the ROI target region corresponding to the ROI component region. The second image acquisition system, which is preferably arranged above the substrate, thus only captures the ROI target region of the target region, not the entire target region. Thus, the second image acquisition system can be designed such that its detection area is much smaller than the entire target area. Then, an item of contact point detection information is determined from the image acquired using the second image acquisition system. The contact point detection information can also be displayed on the screen, and in particular, the contact point within the ROI target region can be reproduced.

Unlike the HR600XL system sold by the applicant, the entire component is therefore not recorded (using the first image acquisition system) in each case, nor is the entire target region (using the second image acquisition system) recorded, but only the predesignable ROI component region and the ROI target region. The final dimensions of the component to be placed are here irrelevant to the target area; the key is that: the ROI component region and the ROI target region are selected to correspond to each other, and information acquired therefrom is processed.

By superimposing the pin detection information and the contact point detection information, it is therefore possible to determine the positional deviation between the target surface and the component located on the support surface using appropriate image evaluation software.

Further, the difference vector and the rotation angle can be determined so as to compensate for the positional deviation.

Further, the clamped member moves along the difference vector and rotates around the rotation angle, thereby compensating for the positional deviation.

Finally, the clamping unit can be used to accurately position the component on the target area of the substrate.

It has also been found that it is advantageous if the component has one or more corner regions, the ROI component region is a defined corner region of the component, and if the target region has a plurality of corner regions, it is advantageous if the predesignable ROI target region is a corner region of the target region corresponding to the corner region of the component. This has the advantage that: the corner regions are relatively easy to detect and are also discernable.

Furthermore, it is advantageous if the component is identified before, during or after clamping according to step (a), and if the predesignable ROI component region is automatically read out of the database. This has the advantage that: this process can be performed in a fully automated manner: a detection component that reads out the ROI component region and places the component on the support surface according to step (a) such that the ROI component region can be detected by the first image acquisition system.

In this case, the clamping according to step (a) can be performed manually or automatically.

Advantageously, the clamping according to step (a) is performed in such a way that: the component is clamped in or over the region of its geometric centre of gravity. This has the advantage that: the component can be clamped at a relatively small point (e.g., by vacuum), the component at least largely maintaining its orientation exhibiting a plane parallel to the support surface. Thus preventing the components from tilting or pivoting apart due to the eccentric clamping.

Furthermore, it is advantageous if the geometrical center of gravity of the individual components is determined based on the component size information and/or mechanically (e.g. by suitable means).

The above object is also achieved by a second placement method according to the invention having the features of the claimed content. This second method according to the invention provides the following steps:

(b) The component is placed on the support surface in such a way that: a predesignable region (ROI component region) of a component including a pin exists in a detection region of the first image acquisition system, and pins of the component in the region are detected using the first image acquisition system;

(c) Moving the component such that a second region adjacent to the first region is within a detection region of the first image acquisition system, and detecting pins of the component in the region using the first image acquisition system;

(d) Repeating steps (b) and (c) until most or all pins of the component are detected;

(e) Determining an item of pin detection information from the acquired image of the component;

(f) Detecting a contact point in a first region of a target region (ROI target region) corresponding to a predesignable first region of the component using a second image acquisition system;

(g) Moving the second image acquisition system to capture a second region of the target region adjacent to the first region and detecting a contact point within the region using the second image acquisition system;

(h) Repeating steps (f) and (g) until most or all of the contact points of the target area are detected;

(i) Determining an item of contact point detection information from the acquired image of the target area;

(j) Superposing the pin detection information and the contact point detection information, and determining deviation of the pin detection information and the pin detection information;

(k) Determining a difference vector for moving the component in the x, y directions and a rotation angle for rotating the component about the z direction, thereby compensating for the deviation;

(l) Moving the member along the difference vector and rotating the member around the rotation angle; and

(m) placing the component on the target area of the substrate using the clamping unit.

By repeating steps (b) and (c) in step (d) and steps (f) and (g) in step (h), a larger overall image can be created from each acquired image by one type of stitching using suitable image processing software. The larger overall image can then cover at least a majority of the pins of each component or a majority of the contact points of each target area, or all of the pins or all of the contact points. As has been described, by respective superimposition of the pin detection information and the contact point detection information, a deviation can be determined, and a rotation angle and a difference vector for compensating the deviation can be determined. Based on this information, the component can then be clamped, oriented and placed accordingly. According to the first method of the invention, components larger than the detection area of the first image acquisition system can also be oriented and placed in an accurately positioned manner using the second method according to the invention.

The object mentioned at the beginning is also achieved by a third method according to the invention having the features of the claimed content. The third method according to the invention comprises the steps of:

(b) Placing the component on a support surface such that a predesignable first region of the component including the pins is located within a detection region of the first image acquisition system;

(c) Detecting two or more predesignable feature pins using a first image acquisition system and thereby determining items of pin detection information;

(d) Detecting a contact point in the ROI target region corresponding to the feature pin using the second image acquisition system, and thereby determining an item of contact point detection information;

(e) Superposing the pin detection information and the contact point detection information, and determining deviation of the pin detection information and the pin detection information;

The third method according to the invention is particularly suitable for providing feature pins that can be detected by the first image acquisition system or feature contact points that can be detected by the second image acquisition system. In this case, it is conceivable to define and predefine in total two or more such predefinable pins and contact points, which are ultimately used by the image acquisition system for the respective position determination and position orientation. Thus, components that are larger than the detection area of the first image acquisition system can also be reliably oriented and placed.

The object mentioned at the beginning is also achieved by a placement device according to the claimed content. In particular, such a placement device is designed such that the control unit is configured to perform one of the methods according to the invention such that the component can be placed on the substrate while the component is larger than the detection area of the first image acquisition system in the support surface and/or larger than the detection area of the second image acquisition system in the target surface in x-and y-directions.

In such a placement device, the first image acquisition system is preferably arranged in a fixed or stable manner below the support surface, and the second image acquisition system is arranged above the substrate so as to be movable, in particular in the x, y and z directions.

Further advantageous is that: the clamping unit has clamping fingers movable in x, y and z directions and rotatable about the z direction as well, and the clamping fingers are configured to receive the component, rotate the component about the z direction, and place it on the target area.

Further advantageous is that: the first image acquisition system and the second image acquisition system are each formed by a separate camera. However, it is also possible to provide that both image acquisition systems are implemented in the same camera, and then a spectroscopic system, in particular a spectroscopic system comprising a periscope, can be provided for separating the detection areas.

Drawings

Further details and advantages of the invention are described in the following embodiments and are shown in the drawings.

Wherein:

fig. 1 shows a placement device according to the invention;

FIG. 2 is a detail of the placement device according to FIG. 1, including a support surface on which a component to be placed is located;

FIG. 3 is an enlarged detail view of the placement device according to FIG. 1, showing the substrate and target surface;

fig. 4, 5 and 6 show different method sequences according to the invention.

Detailed Description

Fig. 1 shows a placement device 10 by means of which placement device 10 a component with pins can be placed on a target area of a substrate, in particular a printed circuit board. With the placement apparatus 10, the placed components can also be soldered by a reflow soldering method.

The placement apparatus 10 comprises a clamping device 12 for clamping a substrate 14, as shown in fig. 3. A target area 16 is provided on the substrate 14, the target area 16 including a target surface 17 extending in the x, y directions. The target area 16 has a large number of relatively small contact points on which the component 18 can be placed in a precisely positioned manner, as shown in fig. 2.

In fig. 2, the component 18 is positioned on the support surface 20, with the pins of the component 18 resting on the support surface 20. The support surface 20 is made of glass and encloses the light domes 22 upwards. An illumination means 23 is provided in the light dome 22, which illuminates the light dome 22 and illuminates the component 18 or its pins. The light domes 22 are arranged together with the support surface 20 in a fixed manner on the placement device 10, as can be seen from fig. 1.

A first image acquisition system 24 in the form of a CCD monochrome camera is arranged in or on the bottom of the light dome 22. The image acquisition system located below the component 18 is represented by the dashed line in fig. 2. Pins of the component 18 in the detection area of the image acquisition system 24 can be detected by the first image acquisition system 24.

As shown in fig. 1, the placement apparatus 10 has a housing 26, with a second image acquisition system 28, a clamping unit 30 including clamping fingers 34, and a welding device 32 disposed on the housing 26. The gantry 26 is capable of moving along the x-direction guide. The image acquisition system 28, the clamping unit 30 and the welding device 32 are movable on the gantry 26 in a y-direction perpendicular thereto. In addition, the gripping fingers 34 of the gripping unit 30 are at least also capable of being lifted and lowered in a z-direction extending perpendicular to the x, y-directions.

The image acquisition system 28 is used to detect contact points present in the target area 16 shown in fig. 3.

In this case, the support surface 20 is preferably located in the same plane as the target surface 17. This has the advantage that the conversion of the images from the image acquisition systems 24, 28 can be performed relatively easily. However, it is also conceivable that the support surface 20 is located in a different plane than the target surface 17. The captured image then needs to be converted accordingly.

The clamping unit 30 comprising the clamping fingers 34 is used to pick up the component 18 and place it on the support plane 20. Furthermore, it serves to pick up the placed component 18 from the support surface 20 and move it towards the target area 16 in order to place it there in a precisely positioned manner. In this case, the clamping preferably takes place in the region of the geometric center of gravity of the component 18 or above the geometric center of gravity.

A control unit 36 is provided for controlling the two image acquisition systems 24 and 28, the clamping unit 30 and the welding unit 32. For communication with the control unit 36, input and output means 38 in the form of a display with a keyboard are provided.

As shown in fig. 2, the components shown here are larger than the detection area of the camera 24 present in the light dome 22. However, in order to be able to place such a large component 18 on the target area in an accurately positioned manner, the placement device 10 is configured to be able to perform different placement methods, the steps of which are shown in fig. 4, 5 and 6.

According to the first placement method, the following steps are performed, as shown in fig. 4:

(a) A clamping member 18 having dimensions in the x and y directions that are greater than the detection area of the first image acquisition system 24 in the support surface 20 and/or the detection area of the second image acquisition system 28 in the target surface 17;

(b) The component 18 is placed on the support surface 20 such that the pre-specifiable ROI component region 40 including the pins is located within the detection region of the first image acquisition system 24. According to fig. 4 (b), the ROI component region 40 taken by the image acquisition system 24 is pre-designated as the upper corner region 41 on the left side of the component 18;

(c) The pins of the component 18 in this ROI component region 40 are detected using the first image acquisition system 24, whereby items of pin detection information 42 are determined and said pin detection information 42 is displayed on the screen 38. The images acquired by the image acquisition system 24 are processed and displayed by suitable image processing software;

(d) The second image acquisition system 28 is used to detect contact points 48 in the ROI target region 44 corresponding to the ROI component region 40. Fig. 4 (d) shows a substrate having an ROI target region 44, the ROI target region 44 being formed by an upper corner region on the left side of the target region 16. Thereby, contact point detection information is created;

(e) The pin detection information and the contact point detection information are superimposed as shown in fig. 4 (d). Then determining deviation of the pin detection information and the contact point detection information;

(f) Determining a difference vector for moving the part 18 in the x, y directions and a rotation angle for rotating the part 18 around the z direction, thereby compensating for the deviation;

(g) Moving the clamped member 18 along the difference vector, and rotating the member 18 around the rotation angle; and

(h) The component 18 is placed on the target area 16 of the substrate 14 using the clamping unit 30.

According to the second placement method, the following steps are performed, as shown in fig. 5:

(a) A component 18 having dimensions in the x and y directions that are larger than the detection area of the first image acquisition system 24 in the support surface 20 and/or the detection area of the second image acquisition system 28 in the target surface 17;

(b) Placing the part 18 on the support surface 20 such that a pre-specifiable ROI part region with pins is located within a detection region of the first image acquisition system 24, and detecting pins of the part 18 in the ROI part region using the first image acquisition system 24;

(c) Moving the part 18 such that a ROI part region adjacent to the first ROI part region is located within a detection region of the first image acquisition system 24, and detecting pins of the part 18 in the ROI part region using the first image acquisition system 24;

(d) Repeating steps (b) and (c) until most or all of the pins of component 18 are detected;

(e) Determining an item of pin detection information from the acquired image of the component 18;

(f) Detecting a contact point in a first ROI target region, which corresponds to a predesignable first ROI component region, using the second image acquisition system 28;

(g) Moving the second image acquisition system 28 so as to take a second ROI target region adjacent to the first ROI target region, and detecting a contact point of the ROI target region using the second image acquisition system 28;

(h) Repeating steps (f) and (g) until most or all of the contact points of the target area 16 are detected;

(j) Superposing the pin detection information and the contact point detection information, and determining deviation of the pin detection information and the contact point detection information;

(k) Determining a difference vector for moving the member 18 in the x, y directions and a rotation angle for rotating the member 18 around the z direction, thereby compensating for the deviation;

(l) Moving the member 18 along the difference vector, and rotating the member 18 around the rotation angle; and

(m) placing the component 18 on the target area 16 of the substrate using a clamping unit.

According to a third placement method, the following steps are performed, as shown in fig. 5:

(b) Placing the component 18 on the support surface 20 such that the predesignable first region of the component 18 having pins is located within the detection region of the first image acquisition system 24;

(c) Detecting two or more predesignable feature pins using the first image acquisition system 24 and determining therefrom an item of pin detection information;

(d) Detecting a contact point in a region of a target region of the ROI target region corresponding to the feature pin using the second image acquisition system 28, and thereby determining an item of contact point detection information;

(f) Determining a difference vector for moving the member 18 in the x, y directions and a rotation angle for rotating the member 18 around the z direction, thereby compensating for the deviation;

(g) Moving the member 18 along the difference vector, and rotating the member 18 around the rotation angle; and

(h) The component 18 is placed on the target area of the substrate using the clamping unit 30.

As a result of the described method, it is thus possible to place the component 18 having a size significantly larger than the detection area of the first image acquisition system 24 in an accurately positioned manner. This has the advantage, inter alia, that existing devices can be used, which devices are to be arranged in accordance with the corresponding method of the invention.

Claims

1. A placement method for accurately positioning placement of a component (18) with pins on a target area (16) of a substrate (14), in particular a printed circuit board, the method being performed using a placement device (10), and the placement device (10) comprising:

clamping means (12) for clamping a substrate (14),

-a support surface (20), said support surface (20) extending in x, y direction for placing a component (18) to be placed,

a first image acquisition system (24) for detecting pins of a component (18) placed on the support surface (20),

a second image acquisition system (28) for detecting a contact point on the target area (16) present in a target surface (17), the target surface (17) extending in x, y directions,

-a clamping unit (30), the clamping unit (30) being configured for receiving the component (18) for moving the component (18) in x, y and z directions, for rotating the component (18) around the z direction and for placing the component (18) on the target area (16) in a precisely positioned manner, and

-a control unit (36), the control unit (36) being designed for controlling the image acquisition system (24, 28), evaluating images acquired by the image acquisition system (24, 28), and controlling the clamping unit (30),

characterized in that the method comprises the steps of:

(a) A component (18) clamped in x and y directions having a dimension larger than the detection area of the first image acquisition system (24) in the support surface (20) and/or the detection area of the second image acquisition system (28) in the target surface (17),

(b) -placing the component (18) on the support surface (20) such that a predesignable region of interest, ROI, component area (40) comprising pins is located within a detection area of the first image acquisition and capture system (24),

(c) Detecting pins of the component (18) in the ROI component area (40) using the first image acquisition system (24) and thereby determining items of pin detection information (42),

(d) Detecting a contact point in a ROI target region (44) corresponding to the ROI component region (40) using the second image acquisition system (28) and thereby determining an item of contact point detection information,

(e) Superimposing the pin detection information and the contact point detection information, and determining a deviation of the pin detection information and the contact point detection information,

(f) Determining a difference vector for moving the component (18) in the x, y direction and an angle of rotation for rotating the component (18) about the z direction, thereby compensating for the deviation,

(g) Moving the part (18) along the difference vector and rotating the part (18) about the angle of rotation, and

(h) -placing the component (18) on the target area (16) of the substrate (14) using the clamping unit (30).

2. The placement method according to claim 1, wherein the component (18) has one or more corner regions (41), wherein the pre-specifiable ROI component region (40) is a defined corner region (41) of the component (18), wherein the target region has a plurality of corner regions, and wherein the pre-specifiable ROI target region (44) is a corner region of the target region (16) corresponding to the corner region (40) of the component (18).

3. Placement method according to claim 1 or 2, wherein the component (18) is identified before, during or after clamping according to step (a), and wherein the pre-specifiable ROI component area (40) is automatically read out from a database.

4. A placement method according to claim 1, 2 or 3, wherein the clamping according to step (a) is performed manually.

5. The placement method according to any one of claims 1 to 4, wherein the clamping according to step (a) occurs in the region of or above the geometric center of gravity of the component (18).

6. Placement method according to claim 5, wherein the geometric center of gravity of each component (18) is determined and/or mechanically determined based on component size information.

7. The placement method according to the preamble of claim 1, claim 1 or any one of the preceding claims, characterized in that the method comprises the steps of:

(b) -placing the component (18) on the support surface (20) such that a pre-specifiable ROI component area (40) comprising pins is located within a detection region of the first image acquisition system (24), and-detecting pins of the component (18) in the ROI component area (40) using the first image acquisition system (24),

(c) Moving the component (18) such that a second ROI component region adjacent to the first ROI component region (40) is located within a detection region of the first image acquisition system (24) and detecting pins of the component (18) in the second ROI component region using the first image acquisition system (24),

(d) Repeating steps (b) and (c) until most or all pins of the component (18) are detected,

(e) Determining an item of pin detection information from the acquired image of the component (18),

(f) Detecting a contact point in a first ROI target region corresponding to the predesignable first ROI component region (40) using the second image acquisition system (28),

(g) Moving the second image acquisition system (28) so as to take a second ROI target region adjacent to the first ROI target region, and detecting a contact point of the ROI target region using the second image acquisition system (28),

(h) Repeating steps (f) and (g) until most or all of the contact points of the target area (16) are detected,

(i) Determining an item of contact point detection information from the acquired image of the target area,

(j) Superimposing the pin detection information and the contact point detection information, and determining a deviation of the pin detection information and the contact point detection information,

(k) Determining a difference vector for moving the component (18) in the x, y direction and an angle of rotation for rotating the component (18) about the z direction, thereby compensating for the deviation,

(l) Moving the part (18) along the difference vector and rotating the part (18) about the angle of rotation, and

(m) placing the component (18) on the target area (16) of the substrate using the clamping unit.

8. The method according to the preamble of claim 1, claim 1 or any of the preceding claims, characterized in that the method comprises the steps of:

(b) -placing the component (18) on the support surface (20) such that a predesignable first ROI component region comprising pins is located within a detection region of the first image acquisition system (24),

(c) Detecting two or more predesignable feature pins using the first image acquisition system (24) and determining therefrom an item of pin detection information,

(d) Detecting a contact point in the ROI target region corresponding to the feature pin using the second image acquisition system (28) and thereby determining an item of contact point detection information,

(h) -placing the component (18) on the target area of the substrate using the clamping unit (30).

9. Placement device (10) for accurately positioning a component (18) with pins on a target area (16) of a substrate (14), in particular a printed circuit board, comprising:

clamping means (12) for clamping a substrate (14),

a first image acquisition system (24) for detecting pins of a component (18) placed on the support surface (20) in a plane extending in the x, y direction,

a second image acquisition system (28) for detecting contact points present in a target area in a plane extending in the x, y direction,

-a clamping unit (30), the clamping unit (30) being configured for picking up the component (18), for rotating the component (18) around the z-direction, and for placing the component (18) on the target area (16) in a precisely positioned manner, and

-a control unit (36), the control unit (36) being designed for controlling the image acquisition system (24, 28), evaluating images taken by the image acquisition system (24, 28) and controlling the clamping unit (30),

-characterized in that the control unit (36) is designed for executing the placement method according to any of the preceding claims such that a component (18) can be placed on a substrate (14), the component (18) being larger in x-and y-directions than the detection area of the first image acquisition system (24) in the support surface (20) and/or the component (18) being larger in x-and y-directions than the detection area of the second image acquisition system (28) in the target surface (17).

10. The placement device (10) according to claim 9, wherein the first image acquisition system is arranged in a fixed manner below the support surface (20), and wherein the second image acquisition system (28) is arranged in a movable manner above the substrate (14).

11. Placement device (10) according to claim 9 or 10, wherein the clamping unit (30) has clamping fingers (34) movable in x, y and z directions and rotatable around the z direction, wherein the clamping fingers (34) are configured for picking up the component (18), rotating the component (18) around the z direction, and placing the component (18) on the target area (17).

12. The placement device (10) according to claim 9, 10 or 11, characterized in that the first image acquisition system (24) and the second image acquisition system (28) are provided by separate cameras, respectively.