CN116744552A - Can replace FPC's metal foil circuit board - Google Patents
Can replace FPC's metal foil circuit board Download PDFInfo
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- CN116744552A CN116744552A CN202310830276.1A CN202310830276A CN116744552A CN 116744552 A CN116744552 A CN 116744552A CN 202310830276 A CN202310830276 A CN 202310830276A CN 116744552 A CN116744552 A CN 116744552A
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- metal foil
- electric component
- power supply
- replacing
- fpc
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- 239000011888 foil Substances 0.000 title claims abstract description 245
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 241
- 239000002184 metal Substances 0.000 title claims abstract description 241
- 239000003292 glue Substances 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000005034 decoration Methods 0.000 description 4
- 238000000370 laser capture micro-dissection Methods 0.000 description 4
- 229920001690 polydopamine Polymers 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 241001417935 Platycephalidae Species 0.000 description 1
- 241001417523 Plesiopidae Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a metal foil circuit board capable of replacing FPC, which comprises a plurality of metal foil electric component groups, wherein each metal foil electric component group comprises a metal foil carrier plate and an electric component, each metal foil carrier plate comprises a positive metal foil, a negative metal foil and a plurality of metal foil bearing sheets, conductive pads are arranged between the positive metal foil, the negative metal foil and the metal foil bearing sheets in a non-contact manner, power supply pins of the electric component are fixedly welded in the conductive pads, the positive metal foil, the negative metal foil and the metal foil bearing sheets are communicated on a circuit through the electric component, packaging transparent glue for sealing and fixing is arranged among the positive metal foil, the negative metal foil, the metal foil bearing sheets and the electric component, the positive metal foil can be connected with a positive electrode of a power supply, and the negative metal foil can be connected with a negative electrode of the power supply. The beneficial effects of the application are as follows: the metal foil is used as a carrier of the electric component, and the electric component has the advantages of simple structure, low production cost, high production efficiency and good heat dissipation.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a metal foil circuit board capable of replacing FPC.
Background
The FPC, also called soft board or flexible circuit board, is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has the characteristics of high reliability, high wiring density, light weight and thin thickness, and is mainly used in products such as mobile phones, notebook computers, PDAs, digital cameras, LCM, lamp belts, displays, liquid crystal screens and the like.
The light strip welded on the strip-shaped flexible circuit board is called an FPC light strip, the FPC light strip is a light strip assembled by taking a flexible circuit board FPC as a carrier, because the FPC has flexibility and ultra-thin property, the application range is wider, the LEDs assembled on the FPC light strip are provided with a patch LED, a direct-insert LED and a flip-chip LED, the flip-chip LED is also called a COB, the patch LED has the sizes of 0603, 0805, 1206, 1210, 5050, 5060 and the like, and the colors are red, yellow, blue, green, white, yellow-green, purple, RGB seven colors and the like; the direct-insert LEDs comprise phi 3, phi 5, phi 6 and the like, have round heads and flat heads (commonly called straw hat lamps), have red, yellow, blue, green, white and the like, and the FPC lamp strip is mainly applied to places such as advertisement decoration, automobile decoration, home decoration and the like, and can also be applied to reflective vests and be used for some special purposes. The universal specification of the FPC light belt is 20cm long 8 LEDs, 30cm long 18 LEDs, 30cm long 24 LEDs, 50cm long 15 LEDs, 50cm long 24 LEDs, 50cm long 30 LEDs, 60cm and 80cm long, different users have different specifications, and the FPC light belt can be freely bent, folded and coiled in a three-dimensional space without breaking due to the fact that the FPC is soft, can be freely moved and stretched in the three-dimensional space, can be freely sheared, can be freely prolonged to emit light without being influenced, is suitable for being used in irregular places and places with small space, and is also suitable for being freely combined with various patterns in advertisement decoration due to the fact that the FPC light belt can be freely bent and coiled.
Similar to the FPC light band, the FPC used in products such as mobile phones, notebook computers, PDAs, digital cameras, LCM, displays, liquid crystal displays and the like is also used as a carrier, and the production method is that circuits are etched on flexible organic materials to form the carrier, then electric components are attached to the carrier and then packaged, for example, the FPC light band is formed by attaching LED chips to the carrier and then packaging the LED chips with transparent glue, and the FPC display is formed by attaching light-emitting components to the carrier and then packaging the light-emitting components with the transparent glue.
The etched circuit is narrower in line width due to the process, so that current limit is large, voltage drop is obvious, partial pressure among electric components is unbalanced, and for example, the head-to-tail brightness difference of LED chips on a lamp strip is large; and because the heat dispersion of the FPC material and the light-transmitting glue is relatively poor, electronic products using the FPC material as a carrier, such as FPC lamp strips, FPC displays, liquid crystal displays and the like, are also relatively easy to burn out the narrower circuit in the use process.
Disclosure of Invention
In order to solve the problems in the prior art, the application provides the metal foil circuit board capable of replacing the FPC, which uses the metal foil as a carrier of the electric component, has the advantages of simple structure, low production cost, high production efficiency and good heat dissipation, and solves the problems of uneven voltage division, poor heat dissipation and relatively narrow circuit and easy burning of the electric component caused by obvious voltage drop of the FPC circuit board in the prior art.
The application provides a metal foil circuit board capable of replacing FPC, which comprises a plurality of metal foil electric component groups connected in sequence, wherein each metal foil electric component group comprises a metal foil carrier plate and a plurality of electric components, each metal foil carrier plate comprises an anode metal foil, a cathode metal foil and a plurality of metal foil bearing sheets, the metal foil bearing sheets are arranged between the anode metal foil and the cathode metal foil in an array, the anode metal foil, the cathode metal foil and the metal foil bearing sheets are not contacted with each other, the anode metal foil is provided with a conductive bonding pad, the cathode metal foil is provided with a conductive bonding pad, the metal foil bearing sheets are provided with two conductive bonding pads, the power supply pins of the electric components are fixedly welded in the conductive bonding pads, the anode metal foil, the cathode metal foil and the metal foil bearing sheets are communicated on a circuit through the electric components, the anode metal foil, the cathode metal foil bearing sheets and the electric components are provided with glue for sealing and fixing, the anode metal foil can be connected with the cathode metal foil, and the cathode metal foil can be connected with the power supply when the power supply and the power supply is connected with the power supply.
According to the application, the metal foil carrier plate is further improved, and the complete metal foil is cut into the positive metal foil, the negative metal foil and a plurality of metal foil carrier plates in a laser cutting mode.
According to the application, the overall shape of the positive electrode metal foil and the negative electrode metal foil is L-shaped or strip-shaped, the width of the positive electrode metal foil is larger than 0.5mm, and the width of the negative electrode metal foil is larger than 0.5mm.
According to the application, the thicknesses of the positive electrode metal foil, the negative electrode metal foil and the metal foil carrier are all more than 0.03mm and less than 0.1mm.
According to the application, the anode metal foil, the cathode metal foil and the metal foil carrier are made of aluminum foil or copper foil.
The application is further improved, and a buffer protection resistor is also arranged in the metal foil electric component group and is connected with the electric component in series.
According to the application, the conductive bonding pad is a copper plating bonding pad, and the power supply pin is fixedly arranged on the conductive bonding pad in a tin soldering connection mode.
According to the application, the LED chips are adopted as the electric components, the number of the LED chips in the metal foil electric component group is 8, the number of the power supply pins of each LED chip is 2, and each power supply pin is fixedly welded in different conductive bonding pads.
According to the application, the positive electrode metal foil, the negative electrode metal foil and the metal foil carrier are all provided with a plurality of light transmission through holes, and the packaging light transmission glue is made of epoxy resin or silica gel containing fluorescent powder.
The application is further improved, and the positive electrode metal foil and the negative electrode metal foil are replaced by metal wires.
Compared with the prior art, the application has the beneficial effects that: the application provides a metal foil circuit board capable of replacing FPC, which uses metal foil as a carrier of electric components through the metal foil carrier board and the electric components which are matched with each other, has simple structure, and all the electric components directly use the metal foil as the circuit carrier for conducting electricity, and has wide circuit and minimum voltage drop effect, and uniform voltage division among the electric components; the circuit is directly formed by cutting the metal foil by laser without etching the circuit, and the positive metal foil, the negative metal foil and the metal foil bearing sheet form the circuit, so that the production cost is low; the anode metal foil, the cathode metal foil and the metal foil carrier can be provided with a plurality of light transmission through holes, and then are packaged by packaging light transmission glue, so that the heat dissipation effect can be enhanced, and the two sides of the metal foil LED lamp strip can emit light; the heat dispersion of the metal foil carrier plate is much better than that of FPC material, and the problems that in the prior art, the voltage drop of FPC circuit board is obvious, so that the voltage division of electric components is uneven, the heat dispersion is poor, and the circuit is relatively narrow and easy to burn are solved.
Drawings
In order to more clearly illustrate the application or the solutions of the prior art, a brief description will be given below of the drawings used in the description of the embodiments or the prior art, it being obvious that the drawings in the description below are some embodiments of the application and that other drawings can be obtained from them without the inventive effort of a person skilled in the art.
Fig. 1 is a block diagram of a metal foil electrical component group of a metal foil wiring board capable of replacing an FPC according to the present application.
In the figure, 1-metal foil carrier plate, 11-positive metal foil, 12-negative metal foil, 13-metal foil carrier sheet, 14-conductive pad, 2-electric component, 21-power supply pin.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In order to make the person skilled in the art better understand the solution of the present application, the technical solution of the embodiment of the present application will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, the metal foil circuit board capable of replacing FPC provided by the application comprises a plurality of metal foil electric component groups which are sequentially connected, wherein each metal foil electric component group comprises a metal foil carrier board 1 and a plurality of electric components 2, each metal foil carrier board 1 comprises a positive metal foil 11, a negative metal foil 12 and a plurality of metal foil bearing pieces 13, an array of metal foil bearing pieces 13 is arranged between the positive metal foil 11 and the negative metal foil 12, the positive metal foil 11, the negative metal foil 12 and the metal foil bearing pieces 13 are not contacted with each other, the positive metal foil 11 is provided with a conductive bonding pad, the negative metal foil 12 is provided with a conductive bonding pad, two conductive bonding pads are arranged on each metal foil bearing piece 13, a power supply pin 21 of each electric component 2 is fixedly welded in the conductive bonding pad 14, the positive metal foil 11, the negative metal foil 12 and the metal foil bearing pieces 13 are electrically connected through the electric components 2, the positive metal foil 11, the negative metal foil 12, the metal foil carrier 13 and the electric components 2 are provided with packaging transparent glue for sealing and fixing, the positive metal foil 11 can be connected with the positive electrode of a power supply, the negative metal foil 12 can be connected with the negative electrode of the power supply, in the embodiment, when the positive metal foil is connected with the positive electrode of the power supply and the negative metal foil is connected with the negative electrode of the power supply, the electric components, the metal foil carrier, the positive metal foil, the negative metal foil and the power supply form a closed circuit, the electric components can be electrified and run at the moment, wherein the metal foil is used as a carrier of the electric components, the structure is simple, all the electric components directly use the metal foil as a circuit carrier, the conducting circuit is wide, the influence of voltage drop is reduced to the minimum, the partial pressure of the electric components is uniform, for example, the brightness of the lamp beads of the metal foil LED lamp strip is uniform; and the heat dissipation performance of the metal foil carrier plate is much better than that of FPC material, and the price of the metal foil is much cheaper than that of the organic material of the strip-shaped flexible circuit board, so that the production cost is greatly reduced compared with that of FPC.
As shown in fig. 1, the metal foil carrier sheet 1 is cut from a complete metal foil into a positive metal foil 11, a negative metal foil 12 and a plurality of metal foil carrier sheets 13 by means of laser cutting. In this embodiment, the circuit of the metal foil circuit board capable of replacing FPC is a circuit formed by directly forming the positive metal foil, the negative metal foil and the metal foil carrier by laser cutting the metal foil without etching, and the production cost is low and the production efficiency is high.
As shown in fig. 1, the overall shapes of the positive electrode metal foil 11 and the negative electrode metal foil 12 are L-shaped or strip-shaped, the width of the positive electrode metal foil 11 is larger than 0.5mm, the width of the negative electrode metal foil 12 is larger than 0.5mm, and the thicknesses of the positive electrode metal foil 11, the negative electrode metal foil 12 and the metal foil carrier sheet 13 are larger than 0.03mm and smaller than 0.1mm; the positive electrode metal foil 11, the negative electrode metal foil 12, and the metal foil carrier sheet 13 are made of aluminum foil or copper foil. In the embodiment, the widths of the positive electrode metal foil and the negative electrode metal foil used for conducting are both larger than 0.5mm, compared with a circuit etched on a flexible organic material by using an FPC, the width is far wider, so that the current limit is small during conducting, the influence on the voltage drop of electric components is reduced to the minimum, the voltage division of the electric components is uniform, and the voltage drop problem of the electric components can be well solved when the electric components are applied to electronic products such as mobile phones, notebook computers, PDAs, digital cameras, LCM, displays and liquid crystal screens; when the aluminum foil is used, the surface of the aluminum foil can be rapidly and naturally oxidized to form an insulating aluminum oxide protective film, so that the service life of the aluminum foil LED lamp strip can be prolonged due to corrosion prevention, and the safety of the aluminum foil LED lamp strip can be improved.
As shown in fig. 1, a buffer protection resistor is further arranged in the metal foil electric component group, and the buffer protection resistor is connected with the electric component 2 in series. In this embodiment, the buffer protection resistor is used to protect the electrical components and prevent the electrical components from being burned out due to excessive or abnormal current.
As shown in fig. 1, the conductive pad 14 is a copper plated pad, and the power supply pin 21 is fixedly arranged on the conductive pad 14 in a manner of soldering connection; the electric component 2 is an LED chip, the number of the LED chips in the metal foil electric component group is 8, the number of power supply pins 21 of each LED chip is 2, each power supply pin 21 is fixedly welded in different conductive bonding pads 14, a plurality of light transmission through holes are formed in the positive metal foil 11, the negative metal foil 12 and the metal foil carrier 13, and the material for packaging light transmission glue is epoxy resin or silica gel containing fluorescent powder. In the embodiment, the LED chips are used as the electric components, 8 3V LED chips are arranged in each metal foil electric component group, the electric components conform to the market specification, and the electric components can work by directly using a 24V power supply, so that the electric components are convenient to use and popularize; the conductive bonding pad is a copper-plated bonding pad, namely copper is plated on the metal foil to serve as the conductive bonding pad, for example, copper is plated on the aluminum foil, if the conductive bonding pad is copper foil, the copper foil can be directly used as the conductive bonding pad, the power supply pin is directly welded in the conductive bonding pad in a soldering mode, the structure is stable and firm, the soldering mode is to adopt a die bonding machine for hot melting die bonding, the production efficiency is high, the operation is simple, the process step of tin dropping is omitted, and the welding quality is stable. And a plurality of light-transmitting through holes are formed in the positive metal foil, the negative metal foil and the metal foil bearing sheet, when the electric component is an LED chip, 360-degree two-sided light emission of the metal foil LED lamp strip can be realized, instead of only one side of the FPC lamp strip, so that the use experience of a user is greatly improved, and the LED chip can also be replaced by an LED lamp bead or an LED or other light-emitting electric components. The epoxy resin is a high molecular polymer, the molecular formula is (C11H 12O 3) n, the epoxy resin is a generic name of a polymer containing more than two epoxy groups in the molecule, the epoxy resin is a polycondensation product of epichlorohydrin and bisphenol A or polyalcohol, and due to the chemical activity of the epoxy groups, the epoxy resin can be subjected to ring opening by using various compounds containing active hydrogen, and is solidified and crosslinked to form a net-shaped structure, so that the epoxy resin is a thermosetting resin and has the characteristics of good light transmittance, dust prevention, water prevention and insulation. Silica gel (Silica; silica alias: silica gel is a high-activity adsorption material, belongs to amorphous substances, and has a chemical formula of mSiO2.nH2O; besides strong alkali and hydrofluoric acid, the silica gel does not react with any substance, is insoluble in water and any solvent, is nontoxic and odorless, has stable chemical property, forms different microporous structures due to different manufacturing methods, has the characteristics of difficult substitution of a plurality of other similar materials due to the chemical components and the physical structure of the silica gel, and has the advantages of high adsorption performance, good thermal stability, stable chemical property, higher mechanical strength and the like. In this embodiment, epoxy resin or silica gel containing fluorescent powder is used as the material of the packaging transparent glue, so that the service life and safety of the metal foil circuit board capable of replacing FPC can be improved, and meanwhile, the brightness of the metal foil LED lamp strip can be more uniform.
As shown in fig. 1, the positive electrode metal foil 11 and the negative electrode metal foil 12 are replaced with metal wires. In this embodiment, if the metal foil is applied to electronic products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs, displays, and liquid crystal displays, the positive metal foil and the negative metal foil of the metal foil can be replaced by metal wires, so that the metal foil can be applied to more application scenes, and the metal foil LED lamp strip is not limited.
From the above, the application provides a metal foil circuit board capable of replacing FPC, which uses metal foil as a carrier of electric components through the metal foil carrier board and the electric components matched with each other, has simple structure, and all the electric components directly use the metal foil as the circuit carrier, and is used for conducting wires, the influence of voltage drop is reduced to the minimum, and the partial pressure among the electric components is uniform; the circuit is directly formed by cutting the metal foil by laser without etching the circuit, and the positive metal foil, the negative metal foil and the metal foil bearing sheet form the circuit, so that the production cost is low; the anode metal foil, the cathode metal foil and the metal foil carrier can be provided with a plurality of light transmission through holes, and then are packaged by packaging light transmission glue, so that the heat dissipation effect can be enhanced, and the two sides of the metal foil LED lamp strip can emit light; the heat dispersion of the metal foil carrier plate is much better than that of FPC material, and the problems that in the prior art, the voltage drop of FPC circuit board is obvious, so that the voltage division of electric components is uneven, the heat dispersion is poor, and the circuit is relatively narrow and easy to burn are solved.
The above embodiments are preferred embodiments of the present application, and are not intended to limit the scope of the present application, which includes but is not limited to the embodiments, and equivalent modifications according to the present application are within the scope of the present application.
Claims (10)
1. A metal foil circuit board capable of replacing FPC, characterized in that: the metal foil electric component group comprises a metal foil carrier plate and a plurality of electric components, wherein the metal foil carrier plate comprises an anode metal foil, a cathode metal foil and a plurality of metal foil bearing sheets, the metal foil bearing sheet array is arranged between the anode metal foil and the cathode metal foil, the anode metal foil and the cathode metal foil bearing sheets are not contacted with each other, the anode metal foil is provided with a conductive bonding pad, the cathode metal foil is provided with a conductive bonding pad, the metal foil bearing sheets are provided with two conductive bonding pads, a power supply pin of the electric component is fixedly welded in the conductive bonding pad, the anode metal foil and the cathode metal foil are communicated with the electric components on a circuit through the electric component, a packaging transparent glue used for sealing and fixing is arranged between the anode metal foil and the cathode metal foil bearing sheets, the anode metal foil can be connected with a power supply anode, and the cathode metal foil can be connected with a power supply anode, and the electric component can be electrified when the anode metal foil and the cathode are connected with the power supply.
2. The metal foil wiring board capable of replacing FPC according to claim 1, wherein: the metal foil carrier plate is formed by cutting a complete metal foil into the positive metal foil, the negative metal foil and a plurality of metal foil carrier plates in a laser cutting mode.
3. The metal foil wiring board capable of replacing FPC according to claim 2, wherein: the overall shape of the positive electrode metal foil and the negative electrode metal foil is L-shaped or strip-shaped, the width of the positive electrode metal foil is larger than 0.5mm, and the width of the negative electrode metal foil is larger than 0.5mm.
4. A metal foil wiring board capable of replacing FPC according to claim 3, wherein: the thicknesses of the positive electrode metal foil, the negative electrode metal foil and the metal foil carrier are all more than 0.03mm and less than 0.1mm.
5. The metal foil wiring board capable of replacing FPC according to claim 4, wherein: the positive electrode metal foil, the negative electrode metal foil and the metal foil carrier are made of aluminum foil or copper foil.
6. The metal foil wiring board capable of replacing FPC according to claim 5, wherein: and a buffer protection resistor is further arranged in the metal foil electric component group, and the buffer protection resistor is connected with the electric component in series.
7. The metal foil wiring board capable of replacing FPC according to claim 6, wherein: the conductive bonding pad is a copper plating bonding pad, and the power supply pin is fixedly arranged on the conductive bonding pad in a tin soldering connection mode.
8. The metal foil wiring board capable of replacing FPC according to claim 7, wherein: the LED power supply device comprises a metal foil electric component group, wherein the metal foil electric component group is characterized in that the electric component group comprises LED chips, the number of the LED chips in the metal foil electric component group is 8, the number of power supply pins of each LED chip is 2, and each power supply pin is fixedly welded in different conductive bonding pads.
9. The metal foil wiring board capable of replacing FPC according to claim 8, wherein: the positive electrode metal foil, the negative electrode metal foil and the metal foil carrier are respectively provided with a plurality of light transmission through holes, and the packaging light transmission glue is made of epoxy resin or silica gel containing fluorescent powder.
10. The metal foil wiring board capable of replacing FPC according to claim 9, wherein: the positive electrode metal foil and the negative electrode metal foil are replaced by metal wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310830276.1A CN116744552A (en) | 2023-07-07 | 2023-07-07 | Can replace FPC's metal foil circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310830276.1A CN116744552A (en) | 2023-07-07 | 2023-07-07 | Can replace FPC's metal foil circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN116744552A true CN116744552A (en) | 2023-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310830276.1A Pending CN116744552A (en) | 2023-07-07 | 2023-07-07 | Can replace FPC's metal foil circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN116744552A (en) |
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- 2023-07-07 CN CN202310830276.1A patent/CN116744552A/en active Pending
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