CN116735923B - High temperature aging test socket adjusts structure - Google Patents
High temperature aging test socket adjusts structure Download PDFInfo
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- CN116735923B CN116735923B CN202310992865.XA CN202310992865A CN116735923B CN 116735923 B CN116735923 B CN 116735923B CN 202310992865 A CN202310992865 A CN 202310992865A CN 116735923 B CN116735923 B CN 116735923B
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- 238000012360 testing method Methods 0.000 title claims abstract description 50
- 230000032683 aging Effects 0.000 title claims abstract description 26
- 230000000903 blocking effect Effects 0.000 claims description 70
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
The invention relates to the technical field of chip high-temperature aging test, in particular to a high-temperature aging test socket adjusting structure, which comprises: the stop block and the stop ball are arranged on the upper cover, the stop ball is arranged on the swivel, the stop ball can rotate along with the swivel, the stop block is arranged on the path of the stop ball along with the swivel, the swivel stops rotating after the stop ball contacts with the stop block, a plurality of stop faces are arranged on one side of the stop block, which is close to the stop ball, along the axis direction of the swivel, so that the structure can be realized, the stop ball can be contacted with different stop faces by changing the position of the stop ball in the radial direction of the swivel, each stop face can limit the rotating angle of the swivel, so that the rotating angles of a plurality of swivel are limited, the chip packaged in different modes are suitable, and the quick adjustment can be realized.
Description
Technical Field
The invention relates to the technical field of high-temperature aging test of chips, in particular to a high-temperature aging test socket adjusting structure.
Background
The high-temperature aging test of the chip is to heat the chip to the working temperature or higher than the working temperature, test the tolerance and reliability of the chip, so that the fault of the chip is found in early stage, and the high-temperature aging test has important significance for monitoring the quality of products, screening high-quality chips and the like.
The test socket is a commonly used chip high temperature aging test tool, and the existing test socket mainly comprises: the chip pressing block is contacted with the upper surface of the chip through the bottom of the chip pressing block, the chip pressing block is heated, and the chip pressing block is lifted by rotating the swivel, so that the lower surface of the chip pressing block is attached to the chip; the height that the chip briquetting needs to descend is also different because of different packages of the existing chip, namely the angle that the swivel needs to rotate is different, as shown in fig. 11, the existing test socket can limit the biggest angle of swivel rotation when rotating the swivel through setting up the pin on the upper cover, thus adapt to the chip, but this structure still has following disadvantages:
because the scheme that the pin blocks the swivel from rotating is adopted, when different chips are adjusted, the position of the pin needs to be reset, and when the adjusting position of the pin does not have a pin hole, the pin needs to be perforated again, and the adjustment is inconvenient;
the number of chips that the socket can accommodate is limited by the number of pin holes, resulting in an inability to accommodate more chips.
Disclosure of Invention
Aiming at the technical defect that the existing test socket has poor adaptability to different packaged chips, the invention provides a high-temperature aging test socket adjusting structure and a high-temperature aging test socket adjusting method, which can realize rapid and convenient adjustment and can adapt to more packaged chips.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a high temperature aging test socket adjusting structure, the test socket includes: upper cover and swivel, the swivel swivelling joint on the upper cover, the regulation structure include: the stop block is arranged on the upper cover, the stop ball is arranged on the swivel, the stop ball can rotate along with the swivel, the stop block is arranged on a path of the stop ball along with the swivel, and the swivel stops rotating after the stop ball contacts with the stop block;
one side of the stop block, which is close to the stop ball, is provided with a plurality of stop surfaces along the axial direction of the swivel, the stop ball can move along the radial direction of the swivel, so that the stop ball can be contacted with different stop surfaces when rotating along with the swivel, and the setting of the stop surfaces meets the following conditions: when the baffle balls are sequentially contacted with different baffle surfaces from outside to inside, the rotating angle of the swivel is sequentially reduced;
the baffle faces are inclined faces, the baffle balls can move along the axial direction of the swivel, the baffle balls can contact with different height positions of any inclined face when rotating along with the swivel, and the inclined face setting of any baffle face meets the following requirements: when the baffle ball is contacted with different positions of the inclined plane from low to high in sequence, the rotating angle of the rotating ring is increased in sequence, and the bottom of the inclined plane positioned on the outer side is provided with an overlapping area with the top of the inclined plane positioned on the inner side.
Further, the outer end of the blocking ball is fixedly connected to an axial sliding block, the axial sliding block is arranged on a radial sliding block along the axial sliding of the swivel, and the radial sliding block is arranged on the swivel along the radial sliding of the swivel.
Further, an axial screw rod is arranged on the axial sliding block, the axial screw rod is rotationally connected to the radial sliding block, and one end of the axial screw rod is connected with an axial knob; the radial sliding block is provided with a radial screw rod, the radial screw rod is rotationally connected to the swivel, and one end of the radial screw rod is connected with a radial knob.
Further, the bottom of the axial knob is provided with an axial dial which is fixedly connected to the radial sliding block; the bottom of radial knob is provided with radial calibrated scale, and this radial calibrated scale fixed connection is on the swivel.
Further, the test socket further includes: the base is used for loading the test chip, the chip pressing block used for carrying out aging test on chip heating is arranged in the upper cover in a sliding mode, and the chip pressing block is connected with the swivel thread.
Compared with the prior art, the invention provides the high-temperature aging test socket adjusting structure and the test method, which have the following beneficial effects:
the first, the high temperature aging test socket adjusting structure of the invention comprises: the stop block and the stop ball are arranged on the upper cover, the stop ball is arranged on the swivel, the stop ball can rotate along with the swivel, the stop block is arranged on the path of the stop ball along with the swivel, the swivel stops rotating after the stop ball contacts with the stop block, a plurality of stop faces are arranged on one side of the stop block, which is close to the stop ball, along the axis direction of the swivel, so that the structure can be realized, the stop ball can be contacted with different stop faces by changing the position of the stop ball in the radial direction of the swivel, each stop face can limit the rotating angle of the swivel, so that the rotating angles of a plurality of swivel are limited, the chip packaged in different modes are suitable, and the quick adjustment can be realized.
According to the high-temperature aging test socket adjusting structure, the baffle surfaces are inclined surfaces, the baffle balls can move along the axial direction of the swivel, so that the baffle balls can be contacted with different heights of any inclined surface when rotating along with the swivel, and therefore, the structure can be realized, the baffle balls can be contacted with different heights of the same baffle surface by changing the position of the baffle balls in the axial direction of the swivel, and as the baffle surfaces are arranged into the inclined surfaces, when the baffle balls are contacted with the lowest point to the highest point of the same baffle surface in sequence, the rotating angle of the swivel is changed from small to large, so that the rotating angle of the swivel can be limited in any angle interval limited by the baffle surfaces, the angle intervals limited by the baffle surfaces are continuous, and therefore, more chips packaged in different directions are adapted, and the adjustment of any angle in the angle interval can be realized.
According to the adjusting method of the high-temperature aging test socket, the blocking surface, which is contacted with the stop block, of the blocking ball can be selected through adjusting the blocking ball along the radial direction of the rotating ring, after the blocking surface is selected, the rotating ring can rotate to the angle of the sum of a plurality of angle intervals corresponding to the blocking surface, and the exceeding part angle can be contacted with different heights of the selected blocking surface through adjusting the blocking ball along the axial direction of the rotating ring, so that the rotating ring can rotate the exceeding part angle on the basis of the angle of the sum of the plurality of angle intervals corresponding to the selected blocking surface, the rotating ring can rotate to correspond to any chip to be tested, and the rapid adjustment of the test socket for adapting to different packaging chips is realized.
Drawings
FIG. 1 is a schematic structural diagram of an adjusting structure of a high temperature burn-in test socket according to the present invention;
FIG. 2 is a schematic view of the adjusting structure shown in FIG. 1 after rotation;
FIG. 3 is a schematic view of the swivel angle of rotation as the check ball moves radially;
FIG. 4 is a schematic view of the stopper of FIG. 3 after being unfolded;
FIG. 5 is a side view of the stop of FIG. 4;
FIG. 6 is a schematic view of the swivel angle of rotation as the check ball moves axially;
FIG. 7 is a schematic view of the stopper of FIG. 6 after being unfolded;
FIG. 8 is a side view of the stop of FIG. 7;
FIG. 9 is a schematic view of the internal structure of the swivel;
FIG. 10 is a schematic diagram of a test socket;
FIG. 11 is a schematic view of a conventional adjusting structure;
FIG. 12 is a schematic diagram of the adjustment method of the present invention;
FIG. 13 is a flow chart of the adjustment method of the present invention.
Wherein: 1. an upper cover; 2. a swivel; 3. a stop block; 4. a blocking ball; 5. an axial slider; 6. a radial slide block; 7. an axial screw rod; 8. radial screw rods; 9. a base; 10. pressing a chip into a block; 11. and (5) a pin.
Detailed Description
The following description of the embodiments of the present invention will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Mode one
The following is a specific embodiment of a high temperature burn-in test socket adjustment structure.
Referring to fig. 1 and 2, the high temperature burn-in test socket adjusting structure disclosed in this embodiment includes: the rotary ring 2 is rotatably connected to the upper cover 1; the high-temperature aging test socket is adjusted by rotating the swivel 2, so that the upper cover 1 adapts to chips with different packages;
the adjusting structure comprises: the stop block 3 is arranged on the upper cover 1, the stop ball 4 is arranged on the swivel 2, the stop ball 4 can rotate along with the swivel 2, the stop block 3 is arranged on a path of the stop ball 4 along with the swivel 2, and the swivel 2 stops rotating after the stop ball 4 contacts with the stop block 3;
by arranging the stop block 3 on a moving path when the stop ball 4 rotates along with the swivel 2, when the upper cover 1 needs to be adjusted, the swivel 2 is rotated, the stop ball 4 rotates along with the swivel, and after the stop ball 4 contacts with the stop block 3, the swivel 2 is limited to rotate, so that the rotating angle of the swivel 2 is limited;
one side of dog 3 be close to the catch ball 4 is followed the axis direction of swivel 2 is provided with a plurality of face that keeps off, catch ball 4 can be followed the radial movement of swivel 2 makes catch ball 4 can be with different face contact that keeps off when rotating along with swivel 2, and a plurality of the setting of keeping off the face satisfies: when the baffle ball 4 is contacted with different baffle surfaces from outside to inside in sequence, the rotating angle of the swivel 2 is reduced in sequence;
as shown in fig. 3, fig. 4 and fig. 5, by changing the position of the blocking ball 4 in the radial direction of the swivel 2, the blocking ball 4 can be contacted with different blocking surfaces after rotating along with the swivel 2, each blocking surface can limit the rotating angle of one swivel 2, so as to limit the rotating angles of a plurality of swivel 2, thereby adapting to a plurality of chips with different packages, the adjusting mode is simple and convenient, and the quick adjustment can be realized;
when the blocking ball 4 is positioned at the starting point, the blocking ball 4 can contact with the position A of the first blocking surface at the innermost side after rotating along with the swivel 2, and at the moment, the blocking ball 4 rotates along with the swivel 2 by an angle a;
when the blocking ball 4 moves outwards along the radial direction of the swivel 2 by a distance m, the blocking ball 4 can contact with the position B of the second blocking surface after rotating along with the swivel 2, and at the moment, the blocking ball 4 rotates along with the swivel 2 by an angle B;
when the blocking ball 4 moves outwards along the radial direction of the swivel 2 by a distance n, the blocking ball 4 can contact with the position C of the third blocking surface after rotating along with the swivel 2, and at the moment, the blocking ball 4 rotates along with the swivel 2 by an angle C;
in this embodiment, three blocking surfaces are provided on the stop block 3, and by sequentially positioning the position of the blocking ball 4 in the radial direction of the swivel 2 at the start point, the distance m and the distance n, the blocking ball 4 sequentially contacts with the position a, the position B and the position C of the three stop blocks 3 after rotating along with the swivel 2, and further, the maximum rotating angle of the swivel 2 is defined as an angle a, an angle B and an angle C, so that three chips corresponding to the angle a, the angle B and the angle C are adapted.
To further increase the number of limiting the rotation angle of the swivel 2, thereby accommodating more chips;
the baffle surfaces are inclined surfaces, the baffle balls 4 can move along the axial direction of the swivel 2, so that the baffle balls 4 can contact with different height positions of any inclined surface when rotating along with the swivel 2, and the inclined surface setting of any baffle surface meets the following requirements: when the baffle ball 4 is contacted with different positions of the inclined plane from low to high in sequence, the rotating angle of the rotating ring 2 is increased in sequence, and the bottom of the inclined plane positioned on the outer side is provided with an overlapping area with the top of the inclined plane positioned on the inner side.
As shown in fig. 6, 7 and 8, by changing the position of the baffle ball 4 in the axial direction of the rotating ring 2, the baffle ball 4 can be contacted with different heights of the same baffle surface after rotating along with the rotating ring 2, and as the baffle surfaces are arranged into inclined surfaces, when the baffle ball 4 is contacted with the lowest point to the highest point of the same baffle surface in sequence, the rotating angle of the rotating ring 2 is increased from small to large, so that the rotating angle of the rotating ring 2 can be limited in any angle interval limited by the baffle surfaces, and as the bottom of the inclined surface positioned at the outer side is provided with an overlapping area with the top of the inclined surface positioned at the inner side, the angle intervals limited by a plurality of baffle surfaces are continuous, so that more chips packaged in different ways are suitable;
when the blocking ball 4 moves upwards along the axial direction of the swivel 2 by a distance o, the blocking ball 4 can contact with the position D of the blocking surface after rotating along with the swivel 2, and at the moment, the blocking ball 4 rotates along with the swivel 2 by an angle D;
when the blocking ball 4 moves upwards along the axial direction of the swivel 2 by a distance p, the blocking ball 4 can contact with the position E of the blocking surface after rotating along with the swivel 2, and at the moment, the blocking ball 4 rotates along with the swivel 2 by an angle E;
when the blocking ball 4 moves upwards along the axial direction of the swivel 2 by a distance q, the blocking ball 4 can contact with the position F of the blocking surface after rotating along with the swivel 2, and at the moment, the blocking ball 4 rotates along with the swivel 2 by an angle F;
when the radial position of the blocking ball 4 corresponds to the first blocking surface, the blocking ball 4 is moved to any axial distance, such as distance o, distance p and distance q, within the height range of the stop block 3, and the blocking ball 4 can be contacted with any position, such as position D, position E and position F, of the blocking surface, so that the rotating angle of the rotating ring 2 can be limited within any angle interval defined by the blocking surface, such as angle D, angle E and angle F, and therefore any chip corresponding to the angle interval can be accommodated;
to further increase the number of limiting the rotation angle of the swivel 2, thereby accommodating more chips;
the blocking surfaces of the stop block 3 are selected through radial position adjustment of the blocking ball 4, each blocking surface corresponds to one section of angle interval, the angle intervals of the blocking surfaces are continuous, and the axial position adjustment of the blocking ball 4 changes contact with different positions of the selected blocking surfaces, so that any angle in the angle interval corresponding to the selected blocking surface is selected, further, the selection of any angle in continuous angle intervals formed by the angle intervals of the blocking surfaces is realized, and more chips are adapted.
When the adjustment for adapting to a chip is performed, the radial position of the baffle ball 4 is adjusted, the angle interval containing the angle to be adjusted for the chip is selected, the axial position of the baffle ball 4 is adjusted, the angle corresponding to the angle to be adjusted for the chip in the angle interval is selected, and then the maximum rotating angle of the swivel 2 corresponds to the angle to be adjusted for the chip.
Specifically, as shown in fig. 9, the outer end of the blocking ball 4 is fixedly connected to an axial sliding block 5, the axial sliding block 5 is slidably disposed on a radial sliding block 6 along the axial direction of the swivel 2, and the radial sliding block 6 is slidably disposed on the swivel 2 along the radial direction of the swivel 2.
The axial sliding block 5 slides on the radial sliding block 6 to drive the blocking ball 4 to move, so that the axial movement of the blocking ball 4 is realized, and the radial sliding block 6 slides on the swivel 2 to drive the axial sliding block 5 and the blocking ball 4 to move, so that the radial movement of the blocking ball 4 is realized.
Specifically, an axial screw rod 7 is arranged on the axial sliding block 5, the axial screw rod 7 is rotationally connected to the radial sliding block 6, and one end of the axial screw rod 7 is connected with an axial knob; the radial sliding block 6 is provided with a radial screw rod 8, the radial screw rod 8 is rotationally connected to the swivel 2, and one end of the radial screw rod 8 is connected with a radial knob.
The axial screw rod 7 is rotated by rotating the axial knob, so that the axial sliding block 5 slides, the axial sliding block 5 slides on the radial sliding block 6, the radial screw rod 8 is rotated by rotating the radial knob, the radial sliding block 6 slides, and the radial sliding block 6 slides on the rotating ring 2;
specifically, the bottom of the axial knob is provided with an axial dial which is fixedly connected to the radial slide block 6; the bottom of the radial knob is provided with a radial dial which is fixedly connected to the swivel 2.
Through the axial position of the axial dial reality-stop-ball 4, through the radial position of the radial dial reality-stop-ball 4.
Specifically, the test socket further includes: base 9 and chip briquetting 10, base 9 be used for loading test chip, upper cover 1 inside slide be provided with be used for carrying out ageing test's chip briquetting 10 to the chip heating, chip briquetting 10 and swivel 2 threaded connection.
Referring to fig. 10, in this embodiment, the test socket is connected to an independent temperature control unit through an upper computer to monitor and control the load of the test socket, a heating rod is disposed inside the chip press 10, a temperature sensor and a temperature overheat protection switch are disposed inside the chip press 10, and a fan is disposed at the top of the chip press 10.
The heating rod is used for heating, the temperature sensor is used for monitoring the shell temperature of the surface of the chip, the temperature control unit is used for processing and controlling data, the normal operation of the test socket is guaranteed, the temperature overheat protection switch is loaded on the surface of the chip pressing block 10, the hardware thermal protection is provided for the test socket, the damage of devices caused by overhigh temperature of the environment of the chip is prevented, and the fan is used for realizing rapid cooling and auxiliary control of the environment temperature.
When the chip is loaded through the base 9 during use, after the base is buckled with the upper cover 1, a gap exists between the upper surface of the chip and the bottom of the chip pressing block 10, the chip pressing block 10 is enabled to descend until being attached to the upper surface of the chip by rotating the swivel 2, the swivel 2 is in threaded connection with the chip pressing block 10 due to the fact that the heights of different packaged chips are different, namely, the angles of different packaged chips which need to be swiveled by the swivel 2 are different, the contact positions of the baffle ball 4 and the stop block 3 are changed by adjusting the axial position and the radial position of the baffle ball 4, and therefore the maximum rotation angle of the swivel 2 is adjusted according to the chips, and different packaged chips are adapted.
As shown in fig. 11, the conventional adjusting structure is adapted to a chip by providing a pin 11 on the upper cover 1, and when the swivel 2 is rotated, the maximum angle of rotation of the swivel 2 can be limited, but the number of angles that the adjusting structure can define is small and cannot be changed. Compared with the existing adjusting structure, the adjusting structure disclosed by the embodiment can be adjusted at will in an angle interval, so that different packaging chips are adapted, and the adjusting structure has the advantages of being large in limited angle number and capable of being modified at any time.
Mode two
The following is a specific embodiment of the high temperature aging test socket adjusting method of the present invention, which can be implemented independently, and can be applied to the high temperature aging test socket adjusting structure disclosed in the first embodiment.
Referring to fig. 12 and 13, the high temperature burn-in socket adjustment method includes the steps of:
step a, determining the descending height of the chip pressing block 10;
the height from the bottom of the chip pressing block 10 to the upper surface of the chip to be tested on the base 9 is reduced by the height H when the chip pressing block 10 is at the highest point;
step b, determining the rotation angle of the swivel 2 according to the descending height of the chip pressing block 10;
by the formula:the rotation angle of the swivel 2 is obtained, wherein g is the rotation angle of the swivel 2, P is the screw pitch of the threaded connection part of the swivel 2 and the chip pressing block 10, and H is the chip pressing block10.
Step c, determining the contact point of the stop ball 4 and the stop block 3 according to the rotation angle of the swivel 2;
each baffle surface on the baffle 3 corresponds to an angle interval with an angle i, a plurality of angle intervals form a continuous angle interval, the continuous angle interval is compared with a rotating angle g to obtain a rotating angle g falling into a kth angle interval, a corresponding baffle surface is obtained according to the angle interval in which the rotating angle g falls, and the radial position of a contact point is obtained according to the distance l between the baffle surface and the circle center;
by moving the blocking ball 4 to the kth blocking surface, the swivel 2 can rotate by an angle ofThe remaining angle of the swivel 2 to be turned is +.>The remaining angle is achieved by moving the axial position of the stop ball 4, and the arc length corresponding to the remaining angle is calculated>Based on the angle u of the blocking surface, the axial position of the moving blocking ball 4 is calculated>Obtaining the axial position of the contact point;
step d, moving the blocking ball 4 along the radial direction of the swivel 2;
the blocking ball 4 is moved to the kth blocking surface position of the distance l from the circle center along the radial direction of the swivel 2;
and e, moving the blocking ball 4 along the axial direction of the swivel 2.
Moving the blocking ball 4 to a position at a distance t from the bottom of the stop block 3 along the axial direction of the swivel 2;
the maximum angle at which the swivel 2 is rotated is defined as angle g.
Through the adjustment to the radial direction of backing ball 4 along swivel 2, can select the fender face that backing ball 4 and dog 3 contacted, after selecting the fender face, swivel 2 can rotate to the angle of the summation of a plurality of angle intervals that correspond to this fender face, the partial angle that surpasses through the adjustment to the axial direction of backing ball 4 along swivel 2, can make backing ball 4 and the different high departments of selected fender face contact, make swivel 2 can rotate the partial angle that surpasses on the basis of the angle of the summation of a plurality of angle intervals that correspond by selected fender face, thereby the angle that makes swivel 2 can rotate corresponds with arbitrary chip to be tested, and then realize the quick adjustment of test socket to different encapsulation chips adaptation.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a high temperature aging test socket adjusts structure which characterized in that, test socket include: the upper cover (1) and the swivel (2), the swivel (2) is rotationally connected to the upper cover (1), the adjusting structure comprises a stop block (3) and a stop ball (4), the stop block (3) is arranged on the upper cover (1), the stop ball (4) is arranged on the swivel (2), the stop ball (4) can rotate along with the swivel (2), the stop block (3) is arranged on a path of the stop ball (4) along with the swivel (2), and the swivel (2) stops rotating after the stop ball (4) contacts with the stop block (3);
one side of dog (3) be close to check ball (4) is followed radial direction of swivel (2) is provided with a plurality of face that keeps off, check ball (4) can be followed radial movement of swivel (2), make check ball (4) can be with different face contact that keeps off when swivel (2) rotates, and a plurality of the setting of keeping off the face satisfies: when the baffle balls (4) are sequentially contacted with different baffle surfaces from outside to inside, the rotating angle of the swivel (2) is sequentially reduced;
the baffle faces are inclined faces, the baffle balls (4) can move along the axial direction of the swivel (2), the baffle balls (4) can contact with different height positions of any inclined face when rotating along with the swivel (2), and the inclined face setting of any baffle face meets the following requirements: when the baffle ball (4) is contacted with different positions of the inclined plane from low to high in sequence, the rotating angle of the rotating ring (2) is increased in sequence, and the bottom of the inclined plane positioned on the outer side is provided with an overlapping area with the top of the inclined plane positioned on the inner side.
2. The high-temperature aging test socket adjusting structure according to claim 1, wherein the outer end of the blocking ball (4) is fixedly connected to an axial sliding block (5), the axial sliding block (5) is arranged on a radial sliding block (6) along the axial sliding of the swivel (2), and the radial sliding block (6) is arranged on the swivel (2) along the radial sliding of the swivel (2).
3. The high-temperature aging test socket adjusting structure according to claim 2, wherein an axial screw rod (7) is arranged on the axial sliding block (5), the axial screw rod (7) is rotationally connected to the radial sliding block (6), and one end of the axial screw rod (7) is connected with an axial knob; radial lead screw (8) is arranged on the radial sliding block (6), the radial lead screw (8) is rotationally connected to the swivel (2), and one end of the radial lead screw (8) is connected with a radial knob.
4. A high temperature ageing test socket adjustment structure according to claim 3, wherein the bottom of the axial knob is provided with an axial dial fixedly connected to a radial slide (6); the bottom of the radial knob is provided with a radial dial which is fixedly connected to the swivel (2).
5. The high temperature burn-in test socket adjustment structure of any one of claims 1-4, wherein said test socket further comprises: base (9) and chip briquetting (10), base (9) be used for loading test chip, upper cover (1) inside slide and be provided with chip briquetting (10) that are used for carrying out ageing test to the chip heating, chip briquetting (10) and swivel (2) threaded connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310992865.XA CN116735923B (en) | 2023-08-08 | 2023-08-08 | High temperature aging test socket adjusts structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310992865.XA CN116735923B (en) | 2023-08-08 | 2023-08-08 | High temperature aging test socket adjusts structure |
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| CN116735923B true CN116735923B (en) | 2023-10-27 |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5865639A (en) * | 1996-06-25 | 1999-02-02 | Texas Instruments Incorporated | Burn-in test socket apparatus |
| CN104865422A (en) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第四十研究所 | Rotary hand wheel type ageing testing socket without insertion and extraction force |
| CN204694737U (en) * | 2015-06-12 | 2015-10-07 | 中国电子科技集团公司第四十研究所 | The test jack of rotation hand wheel formula ZIF ageing |
| CN206479617U (en) * | 2017-02-23 | 2017-09-08 | 宜特(上海)检测技术有限公司 | Open type wafer-level packaging chip ageing test socket |
| CN111417857A (en) * | 2018-10-10 | 2020-07-14 | 黄东源 | Socket device for semiconductor device test |
| CN113030523A (en) * | 2021-03-04 | 2021-06-25 | 西安微电子技术研究所 | Aging test socket for optical imaging micro-system module |
| KR20220001557A (en) * | 2020-06-29 | 2022-01-06 | (주)메리테크 | Wireless heating socket |
| CN218037175U (en) * | 2022-03-21 | 2022-12-13 | 苏州微缜电子科技有限公司 | Independent temperature control aging test seat |
| CN115754684A (en) * | 2023-01-06 | 2023-03-07 | 法特迪精密科技（苏州）有限公司 | Chip aging test board and key structure and test method thereof |
| CN115792309A (en) * | 2023-01-10 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | High-temperature aging test socket upper cover structure convenient for switching test of two kinds of packaged chips |
| CN115794526A (en) * | 2023-01-05 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | Control system and control method for chip high-temperature aging test socket |
| CN115856584A (en) * | 2023-01-05 | 2023-03-28 | 法特迪精密科技（苏州）有限公司 | Chip high-temperature aging test socket |
| CN115902591A (en) * | 2023-01-06 | 2023-04-04 | 法特迪精密科技（苏州）有限公司 | LGA and BGA package calibration high-temperature aging test socket upper cover structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7090522B2 (en) * | 2004-08-27 | 2006-08-15 | Aries Electronics, Inc. | Top loaded burn-in socket |
-
2023
- 2023-08-08 CN CN202310992865.XA patent/CN116735923B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5865639A (en) * | 1996-06-25 | 1999-02-02 | Texas Instruments Incorporated | Burn-in test socket apparatus |
| CN104865422A (en) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第四十研究所 | Rotary hand wheel type ageing testing socket without insertion and extraction force |
| CN204694737U (en) * | 2015-06-12 | 2015-10-07 | 中国电子科技集团公司第四十研究所 | The test jack of rotation hand wheel formula ZIF ageing |
| CN206479617U (en) * | 2017-02-23 | 2017-09-08 | 宜特(上海)检测技术有限公司 | Open type wafer-level packaging chip ageing test socket |
| CN111417857A (en) * | 2018-10-10 | 2020-07-14 | 黄东源 | Socket device for semiconductor device test |
| KR20220001557A (en) * | 2020-06-29 | 2022-01-06 | (주)메리테크 | Wireless heating socket |
| CN113030523A (en) * | 2021-03-04 | 2021-06-25 | 西安微电子技术研究所 | Aging test socket for optical imaging micro-system module |
| CN218037175U (en) * | 2022-03-21 | 2022-12-13 | 苏州微缜电子科技有限公司 | Independent temperature control aging test seat |
| CN115794526A (en) * | 2023-01-05 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | Control system and control method for chip high-temperature aging test socket |
| CN115856584A (en) * | 2023-01-05 | 2023-03-28 | 法特迪精密科技（苏州）有限公司 | Chip high-temperature aging test socket |
| CN115754684A (en) * | 2023-01-06 | 2023-03-07 | 法特迪精密科技（苏州）有限公司 | Chip aging test board and key structure and test method thereof |
| CN115902591A (en) * | 2023-01-06 | 2023-04-04 | 法特迪精密科技（苏州）有限公司 | LGA and BGA package calibration high-temperature aging test socket upper cover structure |
| CN115792309A (en) * | 2023-01-10 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | High-temperature aging test socket upper cover structure convenient for switching test of two kinds of packaged chips |
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| CN116735923A (en) | 2023-09-12 |
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