CN116727919A - Adhesive tape solder structure - Google Patents
Adhesive tape solder structure Download PDFInfo
- Publication number
- CN116727919A CN116727919A CN202310783734.0A CN202310783734A CN116727919A CN 116727919 A CN116727919 A CN 116727919A CN 202310783734 A CN202310783734 A CN 202310783734A CN 116727919 A CN116727919 A CN 116727919A
- Authority
- CN
- China
- Prior art keywords
- solder
- layer
- adhesive tape
- adhesive
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 99
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 56
- 239000010410 layer Substances 0.000 claims abstract description 65
- 239000011241 protective layer Substances 0.000 claims abstract description 44
- 239000000843 powder Substances 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- 239000000956 alloy Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920002799 BoPET Polymers 0.000 claims description 4
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005219 brazing Methods 0.000 abstract description 19
- 238000003860 storage Methods 0.000 abstract description 11
- 238000003466 welding Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to the technical field of brazing, in particular to a bonding tape solder structure, which comprises a bonding tape solder intermediate layer, a first bonding layer, a first protective layer and a second protective layer; the first bonding layer is formed on the first surface of the adhesive tape solder intermediate layer, the second protection layer is detachably bonded on the second surface of the adhesive tape solder intermediate layer, the first surface and the second surface are respectively one of the upper surface and the lower surface of the adhesive tape solder intermediate layer, the first protection layer is detachably bonded on the surface of the first bonding layer, and the first protection layer and the second protection layer are curled films. The adhesive tape solder structure has the advantages of simple design, more space saving in storage and more convenient use.
Description
Technical Field
The invention relates to the technical field of brazing, in particular to a sticky tape solder structure.
Background
In the technical field of brazing, a brazing foil is conventionally used for brazing operation, but the method has limitations, for example, after elements such as B, P, si are added into nickel-based brazing alloy to reduce the melting point of the brazing alloy, the brittleness of the nickel-based brazing alloy is increased along with the introduction of the melting reduction elements, and the nickel-based brazing alloy is difficult to manufacture into the foil, so that the melting reduction nickel-based brazing alloy can only be supplied in a form of brazing alloy powder, generally the brazing alloy powder is difficult to directly use, organic matters are required to be added into the brazing alloy powder, the brazing alloy is mixed and prepared into a brazing alloy paste, the adding form of the brazing alloy paste is mainly performed through screen printing, the pre-setting operation of the brazing alloy in the coating form is complex, the full-automatic operation is difficult to perform, the adding amount is required to be controlled through the pressing force of a screen during manual operation, the same coating force is difficult to ensure each time, the coating thickness of the brazing alloy is influenced, the using amount of the brazing alloy is influenced, and when the welding operation with high precision requirement is required due to complex structure, particularly the welding operation with the complex honeycomb structure and the welding alloy surface is not in a horizontal direction, and the condition of welding condition can not cause uneven coating or slump.
In order to solve the above problems, in the prior art, metal powder is generally combined with organic matters to form a sticky tape solder with larger viscosity, however, because the sticky tape solder has relatively larger viscosity at both sides, it is difficult to preset the sticky tape on the surface to be welded, and the sticky tape solder can only be manufactured into a two-dimensional plane form for storage and use due to the larger viscosity at both sides, and a large amount of storage space is required, and meanwhile, the sticky tape can be difficult to ensure to maintain the viscosity for a long time, and is inconvenient to use.
Disclosure of Invention
The technical problem solved by the invention is that the adhesive tape solder can only be manufactured into a two-dimensional plane form for storage and use due to the fact that the viscosity of two sides is large, a large amount of storage space is required to be occupied, meanwhile, the viscosity of the adhesive tape can be kept for a long time, and the adhesive tape is inconvenient to use.
In order to solve the technical problems, the invention adopts the following technical scheme:
a bonding tape solder structure comprises a bonding tape solder intermediate layer, a first bonding layer, a first protective layer and a second protective layer; the first bonding layer is formed on the first surface of the adhesive tape solder intermediate layer, the second protection layer is detachably bonded on the second surface of the adhesive tape solder intermediate layer, the first surface and the second surface are respectively one of the upper surface and the lower surface of the adhesive tape solder intermediate layer, the first protection layer is detachably bonded on the surface of the first bonding layer, and the first protection layer and the second protection layer are curled films.
Optionally, the first protective layer comprises release paper.
Optionally, the second protective layer includes a protective film and a second adhesive layer, and the protective film is bonded to the adhesive tape solder intermediate layer through the second adhesive layer.
Optionally, the second adhesive layer comprises a low adhesive.
Optionally, the protective film includes one of a PET film, an OPP film, and a PE film.
Optionally, the first tie layer comprises a pressure sensitive adhesive.
Optionally, the composition of the adhesive tape solder intermediate layer comprises solder powder and an organic binder, the composition of the organic binder comprises epoxy resin, ethylcellulose and ethanol, and the solder powder comprises one of high-entropy alloy powder, BNi-2 solder powder, high-silver solder powder and phosphor copper solder powder.
Optionally, the mass fraction of the solder powder in the adhesive tape solder intermediate layer is 97-99%.
Optionally, the solder powder includes four kinds of particles having different particle diameters, and the four kinds of particles having different particle diameters are arranged in order of increasing particle diameters in a weight ratio of (1-2): (1-2): (9-10): (24-26).
Alternatively, the four different size particles have a size of 1 μm, 5 μm, 15 μm and 50 μm, respectively.
Compared with the prior art, the adhesive tape solder structure designed by the invention can be curled into a ring shape for storage, and the first protective layer and the second protective layer can protect the adhesive tape solder intermediate layer during storage, so that the adhesive tape intermediate layer can maintain viscosity for a long time; when the adhesive tape is used, the first protective layer and the second protective layer are only required to be torn off from the surface of the adhesive tape solder intermediate layer, and the adhesive tape solder intermediate layer is adhered to the surface to be welded through the first adhesive layer, so that the adhesive tape solder intermediate layer is more convenient to use. In conclusion, the adhesive tape solder structure is simple in design, saves more space in storage and is more convenient to use.
Drawings
FIG. 1 is a schematic view of a solder structure of a tape according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of the solder adhesive after the first protective layer and the second protective layer are separated from the surface of the intermediate layer of solder adhesive according to the embodiment of the present invention;
fig. 3 is a physical view of a solder structure of a tape according to an embodiment of the present invention.
Reference numerals illustrate:
1. the adhesive tape solder intermediate layer 2, the first adhesive layer 3, the first protective layer 4, the second protective layer 401, the protective film 402 and the second adhesive layer.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
It should be noted that, without conflict, features in the embodiments of the present invention may be combined with each other. The terms "comprising," "including," "containing," and "having" are intended to be non-limiting, as other steps and other ingredients not affecting the result may be added. The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein.
As shown in fig. 1 and 2, an embodiment of the present invention provides a solder-bonded structure including a solder-bonded intermediate layer 1, a first adhesive layer 2, a first protective layer 3, and a second protective layer 4; the first adhesive layer 2 is formed on a first surface of the adhesive tape solder intermediate layer 1, the second protective layer 3 is detachably adhered to a second surface of the adhesive tape solder intermediate layer 1, the first surface and the second surface are respectively one of an upper surface and a lower surface of the adhesive tape solder intermediate layer 1, the first protective layer 3 is detachably adhered to a surface of the first adhesive layer 2, and the first protective layer 3 and the second protective layer 4 are respectively curled films.
Compared with the prior art, as shown in fig. 1 and 3, the adhesive tape solder structure designed by the invention can be curled into a ring shape for storage, and when in storage, the first protective layer 3 and the second protective layer 4 can protect the adhesive tape solder intermediate layer 1, and the adhesive tape intermediate layer 1 can maintain viscosity for a long time; when the adhesive tape is used, the first protective layer 3 and the second protective layer 4 are only required to be torn off from the surface of the adhesive tape solder intermediate layer 1, and the adhesive tape solder intermediate layer 1 is bonded on the surface to be welded through the first bonding layer 2, so that the adhesive tape solder intermediate layer is more convenient to use. In conclusion, the adhesive tape solder structure is simple in design, saves more space in storage and is more convenient to use.
Illustratively, as shown in fig. 1, the adhesive tape solder structure in the embodiment of the present invention includes an adhesive tape solder intermediate layer 1, a first adhesive layer 2, a first protective layer 3, and a second protective layer 4; the first adhesive layer 2 is formed on the lower surface of the adhesive tape solder intermediate layer 1, the second protective layer 3 is detachably bonded on the upper surface of the adhesive tape solder intermediate layer 1, the first protective layer 3 is detachably bonded on the lower surface of the first adhesive layer 2, and the first protective layer 3 and the second protective layer 4 are curled films.
In some embodiments of the present invention, the first protective layer 3 illustratively comprises release paper. The release paper is prepared by coating an organosilicon release agent on the surface layers of an environment-friendly PET film, a PE film and an OPP film, and can show extremely light and stable release force for various different organic pressure-sensitive adhesives, so that the adhesive tape solder is convenient to tear while being protected, and the convenience of using the adhesive tape solder is greatly improved.
In some embodiments of the present invention, the second protective layer 4 includes a protective film 401 and a second adhesive layer 402, and the protective film 401 is adhered to the adhesive solder intermediate layer 1 through the second adhesive layer 402. The second adhesive layer 402 comprises a low adhesive. The protective film 401 includes one of a PET film, an OPP film, and a PE film. Illustratively, the second protective layer 4 comprises a PE film and a low adhesion coating on the PE film. The PE film has relatively lower price, which is beneficial to saving the cost.
In some embodiments of the invention, the first adhesive layer 2 comprises a pressure sensitive adhesive.
Fig. 3 is a physical view of a solder structure of a tape according to an embodiment of the present invention, and it can be seen that the solder structure of the tape can be stored and used in the form of a double sided tape. In fig. 3, the white layer is release paper as the first protective layer 3, the gray layer is the adhesive solder intermediate layer 1, a layer of pressure-sensitive adhesive is formed on the surface of the adhesive solder intermediate layer 1, which is in contact with the release paper, the orange-yellow layer is the second protective layer 4, and the second protective layer 4 is a PE film coated with low adhesive.
In some embodiments of the present invention, the composition of the adhesive tape solder intermediate layer 1 includes a solder powder including one of a high entropy alloy powder, a BNi-2 solder powder, a high silver solder powder, a phosphor copper solder powder, and an organic binder including an epoxy resin, ethyl cellulose, and ethanol. The mass fraction of the solder powder in the adhesive tape solder intermediate layer 1 is 97-99%.
The addition of the organic adhesive can reduce the content of metal powder with substantial effect on welding in unit volume of welding flux, and the polymer adhesive is partially decomposed completely in the welding process, so that more holes can be formed to influence the density of welding seams, and the quality of the welding joints is greatly influenced, so that the yield of the welding joints is reduced, and the quality of welded finished products is difficult to control.
Based on the above consideration, in the embodiment of the present invention, the solder powder includes four kinds of particles having different particle diameters, the four kinds of particles having the particle diameters being arranged in order of increasing particle diameters in a weight ratio of (1-2): (1-2): (9-10): (24-26); the particle diameters of the four different-sized particles were 1 μm, 5 μm, 15 μm and 50 μm, respectively. The size grading design of the solder powder enables more metal powder particles to be adhered and accumulated in organic matters in unit volume, thereby greatly reducing the content of the organic matters, reducing the decomposition amount of the organic matters in the welding process and improving the performance of the welding structure. When the solder powder with the same particle size is pressed into the adhesive tape solder, the agglomeration phenomenon can be generated due to the fact that the particle sizes are the same, and in the pressing process of the solder powder with the size grading, gaps of the solder powder with large particles can be filled with the solder powder with small particles, so that the agglomeration condition is avoided, the content of the solder powder in the adhesive tape solder can be improved, and the porosity of a welding joint is reduced.
In addition, although the present invention is disclosed above, the scope of the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications will fall within the scope of the invention.
Claims (10)
1. The adhesive tape solder structure is characterized by comprising an adhesive tape solder intermediate layer (1), a first bonding layer (2), a first protective layer (3) and a second protective layer (4); the first bonding layer (2) is formed on the first surface of the adhesive tape solder intermediate layer (1), the second protective layer (3) is detachably bonded on the second surface of the adhesive tape solder intermediate layer (1), the first surface and the second surface are respectively one of the upper surface and the lower surface of the adhesive tape solder intermediate layer (1), the first protective layer (3) is detachably bonded on the surface of the first bonding layer (2), and the first protective layer (3) and the second protective layer (4) are curled films.
2. The adhesive tape solder structure according to claim 1, wherein the first protective layer (3) comprises release paper.
3. The adhesive tape solder structure according to claim 1, wherein the second protective layer (4) comprises a protective film (401) and a second adhesive layer (402), the protective film (401) being bonded to the adhesive tape solder intermediate layer (1) by the second adhesive layer (402).
4. A tape solder structure according to claim 3, wherein the second adhesive layer (402) comprises a low adhesive.
5. A tape solder structure according to claim 3, wherein the protective film (401) comprises one of a PET film, an OPP film, and a PE film.
6. The adhesive tape solder structure according to claim 1, wherein the first adhesive layer (2) comprises a pressure-sensitive adhesive.
7. The adhesive tape solder structure according to claim 1, wherein the composition of the adhesive tape solder intermediate layer (1) comprises a solder powder and an organic binder, the composition of the organic binder comprising an epoxy resin, ethylcellulose and ethanol, the solder powder comprising one of a high entropy alloy powder, a BNi-2 solder powder, a high silver solder powder, a phosphor copper solder powder.
8. The solder structure according to claim 7, wherein the mass fraction of the solder powder in the solder intermediate layer (1) is 97-99%.
9. The solder structure according to claim 7, wherein the solder powder comprises four kinds of particles having different particle diameters, the four kinds of particles having a weight ratio (1-2) in order of increasing particle diameters: (1-2): (9-10): (24-26).
10. The solder structure of claim 9, wherein the four different sized particles have a size of 1 μm, 5 μm, 15 μm, and 50 μm, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310783734.0A CN116727919A (en) | 2023-06-29 | 2023-06-29 | Adhesive tape solder structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310783734.0A CN116727919A (en) | 2023-06-29 | 2023-06-29 | Adhesive tape solder structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116727919A true CN116727919A (en) | 2023-09-12 |
Family
ID=87916719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310783734.0A Pending CN116727919A (en) | 2023-06-29 | 2023-06-29 | Adhesive tape solder structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116727919A (en) |
-
2023
- 2023-06-29 CN CN202310783734.0A patent/CN116727919A/en active Pending
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