CN116723647A - Component mounting method based on printing tin paste datum point - Google Patents
Component mounting method based on printing tin paste datum point Download PDFInfo
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- CN116723647A CN116723647A CN202310534233.9A CN202310534233A CN116723647A CN 116723647 A CN116723647 A CN 116723647A CN 202310534233 A CN202310534233 A CN 202310534233A CN 116723647 A CN116723647 A CN 116723647A
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- solder paste
- pad
- flexible board
- bonding pad
- datum
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- 238000000034 method Methods 0.000 title claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 201
- 238000004519 manufacturing process Methods 0.000 claims abstract description 49
- 238000005476 soldering Methods 0.000 claims abstract description 24
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 230000001788 irregular Effects 0.000 claims description 6
- 239000002699 waste material Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 description 12
- 230000002950 deficient Effects 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a component mounting method based on printing tin paste datum points, which comprises the following steps: providing a whole flexible board to be attached; wherein the entire compliance plate comprises a plurality of monolithic compliance plates; respectively manufacturing a first reference bonding pad and a second reference bonding pad on the whole flexible board; wherein, each single flexible board on the whole flexible board is provided with a second reference bonding pad; performing solder paste printing on the whole Zhang Rouban based on the first reference pads, and forming solder paste datum points on each second reference pad; and (3) respectively carrying out surface mounting on each single flexible plate based on the solder paste datum point on each single flexible plate to finish component surface mounting. The invention takes the solder paste datum point as a reference in the patch manufacturing process, can still ensure that the element can be aligned with the solder paste when the flexible plate is expanded and contracted, and adjusts the position of the element through the tension of the element bonding pad to the solder paste after reflow soldering, so that the element, the solder paste and the element bonding pad return to an aligned state, and the soldering is successful.
Description
Technical Field
The invention relates to the field of flexible circuit board manufacturing, in particular to a component mounting method based on printing tin paste datum points.
Background
The FPC is a flexible circuit board, which is also called a flexible circuit board or a flexible circuit board, and is called a flexible board for short; miniaturization of electronic products is a necessary development trend, and a considerable part of surface mounting of consumer products is performed by mounting SMDs (Surface Mounted Devices, i.e., surface mounted devices) on FPCs to complete the whole machine assembly due to the relationship of assembly space. FPC has been widely used in digital products such as calculators, mobile phones, digital cameras, digital video cameras, etc., and surface mounting of chip components (small-sized chips including resistor, capacitor, etc.) on FPC has become one of the trends of SMT technology (Surface Mount Technology, i.e., surface mount technology).
The surface mounting of chip components mainly comprises two processes of printing solder paste and mounting. At present, the requirements on the printed solder paste and the patch of the chip element are extremely high due to the problem of expansion and contraction of the jointed board of the flexible circuit board. Once the printed board has micro-deviation, the chip element attached with the micro-deviation has the risk of solder paste leakage, and finally the welding failure is caused, thereby reducing the welding yield of the whole wire body, increasing the rejection rate of the whole work sheet board, synchronously increasing the use cost of a factory and reducing the profit, and therefore, the solution to the problem is proposed to be urgent.
In the prior art, an F-point (reference Mark) is usually manufactured on a flexible board, and the chip element and the FPC are assembled based on the F-point. The pads of the F-point and chip components are molded together at the time of manufacture of the compliance plate, i.e., the F-point is actually a reference pad. When printing solder paste, the solder paste is printed with reference to the F point, and the bonding (i.e., chip attachment) is also performed with reference to the F point. However, in this process, the flexible board is expanded and contracted, which causes offset of solder paste printing, and the chip element can be aligned with the element bonding pad during the bonding, so that the relative offset of the solder paste and the chip element occurs, and defective products are caused during the reflow soldering.
Disclosure of Invention
In view of this, the present invention provides a component mounting method based on a reference point of printed solder paste, so as to solve the problem in the prior art that when solder paste and a chip are printed by using a reference pad as an F point, the solder paste and the chip component deviate due to expansion and contraction of a flexible board, resulting in high defective rate of mounting.
The invention provides a component mounting method based on printing solder paste datum points, which comprises the following steps:
providing a whole flexible board to be attached; wherein the whole flexible plate comprises a plurality of single flexible plates;
respectively manufacturing a first reference bonding pad and a second reference bonding pad on the whole flexible board; wherein each single flexible board on the whole flexible board is provided with the second reference bonding pad;
performing solder paste printing on the whole flexible board based on the first reference bonding pads, and forming solder paste datum points on each second reference bonding pad;
and respectively carrying out surface mounting on each single flexible plate based on the solder paste datum points on each single flexible plate to finish component surface mounting.
Optionally, each single flexible board is provided with a reference pad manufacturing area, and each reference pad manufacturing area is located in a waste area of the corresponding single flexible board;
the manufacturing of the first reference bonding pad and the second reference bonding pad on the whole flexible board respectively comprises the following steps:
manufacturing a first reference pad at a first appointed position of at least one reference pad manufacturing area of the whole flexible board;
and manufacturing the second reference pads at second designated positions of each reference pad manufacturing area of the whole flexible board.
Optionally, each single flexible board is further provided with a plurality of element pads for mounting elements;
the solder paste printing is performed on the whole flexible board based on the first reference bonding pads, and a solder paste datum point is formed on each second reference bonding pad, and the solder paste printing method comprises the following steps:
providing a printed steel mesh provided with a plurality of first openings and a plurality of second openings according to the second designated position of each second reference pad and the position of each element pad on the whole flexible board; the number of the first openings is the same as that of the second reference pads, and all the first openings are in one-to-one correspondence with all the second reference pads; the number of the second openings is the same as that of the element pads, and all the second openings are in one-to-one correspondence with all the element pads;
identifying the first reference bonding pad on the whole flexible board according to the first designated position corresponding to the first reference bonding pad;
and (3) taking the first reference bonding pad as a reference, printing the whole flexible board with solder paste by utilizing the printing steel mesh, forming corresponding element solder paste on each element bonding pad, and forming corresponding solder paste reference points on each second reference bonding pad.
Optionally, before the bonding is performed on each single flexible board separately based on the solder paste datum point on each single flexible board, the method further comprises:
acquiring reference position coordinates of the solder paste datum points on each single flexible plate, and acquiring element position coordinates of each element solder paste on each single flexible plate relative to the solder paste datum points;
and taking one single flexible plate as a block, and respectively constructing a block association relation table corresponding to each block on each block according to the reference position coordinates of the solder paste reference points on each single flexible plate, preset reference identification parameters and the element position coordinates of all the element solder pastes.
Optionally, the pasting is performed on each single flexible board based on the solder paste datum point on each single flexible board, and the pasting comprises the following steps:
identifying the solder paste datum point on each block according to each block association relation table;
providing a plurality of components to be pasted of each single soft board; on each single flexible board, the number of the elements to be pasted is the same as that of the element bonding pads, and all the elements to be pasted are in one-to-one correspondence with all the element bonding pads;
and on each block, taking the solder paste datum point as a reference, and attaching each element to be attached to the element solder paste formed by the corresponding element bonding pad according to the corresponding block association relation table.
Optionally, the preset reference identification parameter of each solder paste reference point includes a corresponding reference point shape and a corresponding reference point size; the reference point size of each solder paste reference point is smaller than the size of the corresponding second reference pad.
Optionally, the fiducial shape comprises any one of a regular shape or an irregular shape.
Optionally, the fiducial shape comprises a rectangle or a circle.
Optionally, the reference point size of the solder paste reference point is 1-2 mm, and/or the size of the second reference pad is 2-3 mm.
Optionally, after the bonding is performed on each single flexible board separately based on the solder paste datum point on each single flexible board, the method further includes:
and performing reflow soldering on all the single flexible boards after the mounting according to preset reflow soldering parameters to finish the mounting of the components.
The invention has the beneficial effects that: two kinds of reference pads, namely a first reference pad and a second reference pad, are manufactured on the whole flexible board, the first reference pad is used as a reference point for solder paste printing, and solder paste is printed based on the first reference pad, so that a solder paste printing flow of component mounting can be completed by taking the whole flexible board as a unit, and a solder paste reference point required by a subsequent patch can be synchronously manufactured on the second reference pad; the second reference bonding pad is used as a datum point of the patch, and because the second reference bonding pad is manufactured on each single flexible board, after the solder paste is printed, the patch is carried out based on the solder paste datum point formed on the second reference bonding pad on each single flexible board, so that the patch process of element mounting can be completed by taking the single flexible board as a unit, and the manufacturing precision of the patch is improved; the method of pasting the first reference bonding pad in the prior art can be replaced by pasting the first reference bonding pad with the solder paste reference point, so that when the flexible plate is expanded and contracted, the element can be still ensured to be aligned with the solder paste, and the phenomenon of welding failure such as cold joint and the like in the subsequent reflow soldering caused by the offset of the solder paste and the element can be avoided; when the flexible plate is expanded and contracted and the solder paste is offset, the element is still aligned with the solder paste through the patch, and after reflow soldering, the position of the element is adjusted through the tension of the element bonding pad to the solder paste, so that the element, the solder paste and the element bonding pad return to an aligned state, the welding is successful, the welding defect is further reduced, the welding yield of the whole wire body is improved, the defective rate of element mounting is reduced, and the use cost of factories is reduced.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and should not be construed as limiting the invention in any way, in which:
FIG. 1 is a flow chart of a component mounting method based on printing solder paste fiducial points according to an embodiment of the invention;
FIG. 2 is a top view of a model of the offset between the component pads and the component paste when the compliance board collapses in an embodiment of the invention;
FIG. 3 is a top plan view of a second fiducial pad and a solder paste fiducial printed thereon made in an embodiment of the invention;
FIG. 4 is a top view of a solder paste on a component to be soldered according to an embodiment of the invention;
fig. 5 is a top view of a model of the three components to be soldered, component solder paste and component pads in alignment after reflow soldering according to an embodiment of the present invention.
The reference numerals are described as follows:
1. the device comprises a component bonding pad 2, component solder paste 3, a second reference bonding pad 4, a solder paste reference point 5, a component to be pasted 6 and a single flexible board.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The embodiment provides a component mounting method based on printing solder paste datum points, as shown in fig. 1, which comprises the following steps:
s1: providing a whole flexible board to be attached; wherein the whole flexible plate comprises a plurality of single flexible plates;
s2: respectively manufacturing a first reference bonding pad and a second reference bonding pad on the whole flexible board; wherein each single flexible board on the whole flexible board is provided with the second reference bonding pad;
s3: performing solder paste printing on the whole flexible board based on the first reference bonding pads, and forming solder paste datum points on each second reference bonding pad;
s4: and respectively carrying out surface mounting on each single flexible plate based on the solder paste datum points on each single flexible plate to finish component surface mounting.
In this embodiment, two kinds of reference pads, namely, a first reference pad and a second reference pad, are manufactured on the whole flexible board, the first reference pad is used as a reference point for printing solder paste, and the solder paste is printed based on the first reference pad, so that the solder paste printing flow of component mounting can be completed by taking the whole flexible board as a unit, and the solder paste reference point required by subsequent mounting can be synchronously manufactured on the second reference pad; the second reference bonding pad is used as a datum point of the patch, and because the second reference bonding pad is manufactured on each single flexible board, after the solder paste is printed, the patch is carried out based on the solder paste datum point formed on the second reference bonding pad on each single flexible board, so that the patch process of element mounting can be completed by taking the single flexible board as a unit, and the manufacturing precision of the patch is improved; the method of pasting the first reference bonding pad in the prior art can be replaced by pasting the first reference bonding pad with the solder paste reference point, so that when the flexible plate is expanded and contracted, the element can be still ensured to be aligned with the solder paste, and the phenomenon of welding failure such as cold joint and the like in the subsequent reflow soldering caused by the offset of the solder paste and the element can be avoided; when the flexible plate is expanded and contracted and the solder paste is offset, the element is still aligned with the solder paste through the patch, and after reflow soldering, the position of the element is adjusted through the tension of the element bonding pad to the solder paste, so that the element, the solder paste and the element bonding pad return to an aligned state, the welding is successful, the welding defect is further reduced, the welding yield of the whole wire body is improved, the defective rate of element mounting is reduced, and the use cost of factories is reduced.
In this embodiment, the whole flexible board comprises a plurality of single flexible boards, and each single flexible board can be used for manufacturing 1pcs flexible board product, so that the mass production of flexible board products is facilitated through the whole flexible board.
In this embodiment, each single flexible board is provided with a reference pad manufacturing area, and each reference pad manufacturing area is located in a waste area of the corresponding single flexible board.
Each single flexible board is provided with a corresponding effective area, a circuit for realizing functions of the single flexible board is manufactured in the effective area, the area outside the effective area is a waste area, a reference pad manufacturing area is arranged in the waste area to manufacture the first reference pad and the second reference pad, the material of the flexible board can be used for respectively providing reference points required by subsequent solder paste printing and pasting, the material for manufacturing the reference pad is not required to be additionally provided, and the manufacturing process and the material cost can be saved.
And each single flexible board is also provided with a plurality of element bonding pads for mounting elements. The element bonding pads are all positioned in the effective area of the single soft board, are distributed on the effective area according to the specific circuit design of the soft board product, and are attached with elements to be attached (chip elements including resistors, capacitors and the like) in the follow-up attaching process, so that the single soft board normally realizes functions.
It should be appreciated that when the entire flexible board to be mounted is provided, each element pad has been previously distributed on each individual flexible board of the entire flexible board to be mounted according to a specific circuit design, and specific positions thereof have been previously set according to the specific circuit design.
Preferably, S2 comprises:
s21: manufacturing a first reference pad at a first appointed position of at least one reference pad manufacturing area of the whole flexible board;
s22: and manufacturing the second reference pads at second designated positions of each reference pad manufacturing area of the whole flexible board.
The first reference pad manufactured at the first appointed position of the at least one reference pad manufacturing area is convenient for the subsequent printing of the solder paste of the whole flexible board by taking the whole flexible board as a unit and taking the at least one first reference pad as a reference point, and on one hand, element solder paste on the element pad is formed for the subsequent welding of elements; on the other hand, a solder paste datum point on the second datum pad is formed and used as a datum point of the patch.
And through the second reference bonding pad at the second appointed position of the reference bonding pad manufacturing area of each single soft board, a solder paste datum point is conveniently formed on the bonding pad, and the subsequent implementation of the patch of each single soft board is conveniently realized by taking the solder paste datum point as a datum point in a unit of the single soft board.
The first appointed position of the first reference pad and the second appointed position of the second reference pad are designed in advance. The number of the first reference pads and the number of the second reference pads on each single flexible board are at least one, and the specific number can be selected according to practical situations. For example, the whole flexible board is generally rectangular, and a first reference pad is respectively manufactured on the reference pad manufacturing areas of the single flexible board at four corners of the whole flexible board, so that the number of the first reference pads of the whole flexible board is 4 and the first reference pads are distributed at the four corners of the whole flexible board; and then two second reference pads are respectively manufactured on the reference pad manufacturing area of each single soft board, so that the total number of the second reference pads on the whole soft board is 2n (n is the number of the single soft boards on the whole soft board).
Specifically, the shape of the first reference pad is a regular shape or an irregular shape, and the shape of the second reference pad is a regular shape or an irregular shape.
In actual production, for convenience in manufacturing, the first reference pad is usually in a regular shape, and in this embodiment, a circular shape, also called a circular pad, is used; the second reference pad is also generally regular in shape, and in this embodiment is rectangular, also known as rectangular pad. The two bonding pads are made of copper, and gold can be plated on the copper surface of the bonding pad in order to provide the accuracy of bonding pad identification.
After the first reference pad and the second reference pad are manufactured according to the steps S21 to S22, the size of each pad is measured by a secondary unit device, so as to ensure that the first reference pad and the second reference pad meet the requirements.
Preferably, S3 comprises:
s31: providing a printed steel mesh provided with a plurality of first openings and a plurality of second openings according to the second designated position of each second reference pad and the position of each element pad on the whole flexible board; the number of the first openings is the same as that of the second reference pads, and all the first openings are in one-to-one correspondence with all the second reference pads; the number of the second openings is the same as that of the element pads, and all the second openings are in one-to-one correspondence with all the element pads;
s32: identifying the first reference bonding pad on the whole flexible board according to the first designated position corresponding to the first reference bonding pad;
s33: and (3) taking the first reference bonding pad as a reference, printing the whole flexible board with solder paste by utilizing the printing steel mesh, forming corresponding element solder paste on each element bonding pad, and forming corresponding solder paste reference points on each second reference bonding pad.
Because the positions of the first reference bonding pad and the second reference bonding pad are both pre-designated, and the positions of the element bonding pads are also pre-designed according to specific product design, the printing steel mesh is provided according to the second designated positions of the second reference bonding pads and the positions of the element bonding pads, so that each first opening on the printing steel mesh corresponds to each second reference bonding pad one by one, each second opening on the printing steel mesh corresponds to each element bonding pad one by one, the accurate formation of solder paste datum points on each second reference bonding pad and the formation of element solder paste on each element bonding pad are facilitated, the realization of the element bonding pad is facilitated, and the manufacturing precision of the bonding pad is facilitated. After the printing steel mesh is provided, the whole flexible plate is grabbed and identified through the first appointed position of the first reference bonding pad, the first reference bonding pad is used as a reference point, and then the printing steel mesh is utilized to realize the solder paste printing of the whole flexible plate, so that the automation of the solder paste printing can be realized, and the manufacturing efficiency and the manufacturing precision of the solder paste printing can be effectively improved.
Specifically, the printed steel mesh of this example was square, and had an outer frame size of 736m×736m and a thickness of 0.08mm±0.005mm. In actual production, after the printed steel mesh is provided in S31, the size of each opening on the printed steel mesh is measured to ensure compliance with design requirements. After the printing of the solder paste is completed in S33, the size of each solder paste datum point is further measured, so that each solder paste datum point is ensured to meet the design requirement.
Specifically, each solder paste datum point is provided with a preset datum recognition parameter, so that recognition is conveniently carried out based on the parameters in subsequent pasting, and pasting automation is realized.
Preferably, before S4, the method further includes:
acquiring reference position coordinates of the solder paste datum points on each single flexible plate, and acquiring element position coordinates of each element solder paste on each single flexible plate relative to the solder paste datum points;
and taking one single flexible plate as a block, and respectively constructing a block association relation table corresponding to each block on each block according to the reference position coordinates of the solder paste reference points on each single flexible plate, preset reference identification parameters and the element position coordinates of all the element solder pastes.
The solder paste datum point is formed by taking the first datum pad as the datum point, and the datum position coordinates of the solder paste of each element relative to the solder paste datum point are obtained, so that the datum point can be conveniently converted into the solder paste datum point from the first datum pad in the follow-up process of pasting, and when the flexible board is expanded and contracted and the solder paste is offset, the element to be pasted can be aligned with the element solder paste, and the phenomenon that the element to be pasted is relatively offset with the element solder paste due to the expansion and contraction of the flexible board, so that defective products are caused can be avoided. After the reference position coordinates of the solder paste datum point and the element position coordinates of the solder paste of each element are obtained, each single soft board is used as a block, and the preset reference identification parameters of the solder paste datum point on each single soft board are combined to construct a block association relation table of each block, so that the related information of each block can be associated, the phenomenon that the identification among the blocks and the patch are disordered when the solder paste datum point is used as the reference for subsequent patch is avoided, and the patch manufacturing precision can be further improved.
And the corresponding relation among the reference position coordinates, the preset reference identification parameters and the element position coordinates of the element solder paste is established in each block association relation table. For example, when the number of second reference pads of the first monolithic compliance board is 2, the block association table corresponding to the first monolithic compliance board contains reference position coordinates (x 01 ，y 01 ) And (x) 02 ，y 02 ) Also comprises preset reference identification parameters (including reference point size and reference point shape) corresponding to the 2 solder paste reference points, such as (0.25 pi mm) 2 Circular) and (pi mm) 2 Circular) and also includes the component position coordinates (x) of the component solder paste formed on the component pads of the first monolithic compliance board 1 ，y 1 )、(x 2 ，y 2 )、……、(x m ，y m ) (where m is the total number of element pads). In the block association relation table corresponding to the first single soft board, reference position coordinates, preset reference identification parameters and element position coordinates of other block association relation tables do not exist. The information in the block association table of the other blocks is similar to the block association table corresponding to the first single soft board, and is not specifically described herein.
In actual production, each block is also respectively allocated with a unique block name, so that the identification and management of the blocks can be further facilitated. The block names may be named in any reasonable form, such as A, B, C, D named in english alphabets, etc., further such as 1, 2, 3, 4, etc., named in numerical form, further such as 0000, 0001, 0010, 0011, etc., named in binary coding form.
Preferably, S4 comprises:
s41: identifying the solder paste datum point on each block according to each block association relation table;
s42: providing a plurality of components to be pasted of each single soft board; on each single flexible board, the number of the elements to be pasted is the same as that of the element bonding pads, and all the elements to be pasted are in one-to-one correspondence with all the element bonding pads;
s43: and on each block, taking the solder paste datum point as a reference, and attaching each element to be attached to the element solder paste formed by the corresponding element bonding pad according to the corresponding block association relation table.
When the solder paste is pasted, each block is taken as a unit, a block association relation table is utilized to rapidly and accurately identify a solder paste datum point, so that the subsequent pasting is conveniently carried out on each block by taking the datum point as a datum, and the efficiency and the accuracy are high; the method comprises the steps of providing to-be-pasted elements corresponding to element bonding pads on each single flexible board one by one, and pasting by taking a solder paste datum point on each block as a datum point, so that the problems that in the prior art, when the flexible board is expanded and contracted and the solder paste is subjected to printing deviation, the elements cannot be aligned with the solder paste, and welding failure is caused during reflow soldering can be effectively solved; according to the embodiment, the solder paste datum point is used as a datum for pasting, no matter whether the solder paste is subjected to printing deviation due to expansion and contraction of the flexible plate or not, the element can be aligned with the element solder paste, after reflow soldering, the position of the element is adjusted through the tension of the element solder pad to the element solder paste, the element solder paste and the element solder pad can return to an aligned state, so that soldering is successful, further, soldering defects are effectively reduced, and the soldering yield of the whole wire body is greatly improved.
Preferably, in S4, after the mounting is performed on each of the monolithic compliance plates based on the solder paste datum point on each of the monolithic compliance plates, the method further includes:
s44: and performing reflow soldering on all the single flexible boards after the mounting according to preset reflow soldering parameters to finish the mounting of the components.
Through the reflow soldering, the position of the element can be adjusted through the tension of the element bonding pad to the element solder paste, so that the element, the element solder paste and the element bonding pad can return to an aligned state, and the soldering is successful.
The preset reflow parameters may be set and adjusted according to actual situations, and the specific operation method of reflow soldering is conventional operation, which is not described herein.
In this embodiment, when the flexible board is swelled, the element pad and the element solder paste are offset, as shown in fig. 2; in fig. 2, 1 is a component pad, 2 is a component solder paste, and 6 is a monolithic compliance plate. The second reference pad and the printed solder paste reference point are manufactured according to the component mounting method of the embodiment, and the top view surface structure of one of the obtained solder paste reference points is shown in fig. 3; in fig. 3, 3 is a second reference pad, and 4 is a solder paste reference point. After the component mounting method according to the present embodiment is performed, the component 5 to be mounted is aligned with the component solder paste 2, but is offset from the component pad 1, as shown in fig. 4. After reflow soldering, the process of returning the three components 5, the component solder paste 2 and the component pad 1 to the aligned state is shown in fig. 5. It should be understood that fig. 2, 4 and 5 only show the situation of one component 5 to be mounted on the single flexible board 6 during the mounting process, and in fact, there are a plurality of components to be mounted on the single flexible board, which are the same as the components to be mounted in the drawings, and are omitted from the drawings.
Specifically, the preset reference identification parameter of each solder paste reference point comprises a corresponding reference point shape and a corresponding reference point size; the reference point size of each solder paste reference point is smaller than the size of the corresponding second reference pad.
Through the preset reference identification parameters, the system (such as an SPI system, namely a solder paste inspection solder paste detection system) can conveniently identify the components, and the automation of component mounting is realized; the size of the solder paste datum point is smaller than that of the second datum pad, so that the solder paste can be prevented from being printed on the circuit of the flexible board, and the circuit function is prevented from being affected.
Specifically, the reference point shape includes any one of a regular shape or an irregular shape.
Specifically, the reference point shape includes a rectangle or a circle.
Specifically, the reference point size of the solder paste reference point is 1-2 mm.
Through the solder paste datum point with the shape and the size, a system can be conveniently and accurately and efficiently identified to realize element patch, and the layout of the flexible board is not affected because more space of the flexible board is not occupied. In actual production, for convenience of manufacture, the reference point shape is usually a regular shape, and the shape of the second reference pad is also a regular shape.
When the solder paste datum point is rectangular, the datum point size comprises the length and the width of the solder paste datum point, and the range of the length and the width is 1-2 mm; when the solder paste fiducial is circular, the fiducial size includes a diameter of the solder paste fiducial in the range of 1-2 mm.
When the solder paste datum point is of other regular shape or irregular shape, the datum point size can refer to the radial size and the transverse size of the solder paste datum point, and the range of the datum point size is 1-2 mm.
Specifically, the second reference pad has a size of 2-3 mm.
Through the second reference bonding pad with the size, the unilateral size of the second reference bonding pad is 0.5mm larger than that of the solder paste datum point, so that the second reference bonding pad is larger than the solder paste datum point, the solder paste datum point can be formed at the center position of the second reference bonding pad, the second reference bonding pad and the solder paste datum point are taken as references, the tension of the element bonding pad to the element solder paste can be adjusted after reflow soldering, and the element, the element solder paste and the element bonding pad can be in an aligned state.
The "single side" refers to dividing the solder paste datum point into two parts, wherein the left half part and the right half part (or the upper half part and the lower half part) of the solder paste datum point are single sides, and the size of the left half part and the size of the right half part (or the upper half part and the lower half part) are both the single side size of the solder paste datum point, and the sum of the single side sizes is the datum point size (the single side size of the second datum pad is the same as the single side size, and the details are not repeated here).
In this embodiment, when the solder paste datum point is rectangular, the length and width ranges are 1-2 mm, and the single-side dimension (including single-side length and single-side width) of the solder paste datum point is 0.5-1 mm; the second reference bonding pad is rectangular or circular, if the second reference bonding pad is rectangular, the single-side size of the second reference bonding pad comprises single-side length and single-side width which are respectively 0.5mm larger than the single-side size of the solder paste reference point, namely 1-1.5 mm, and the total length and the total width are respectively 2-3 mm; if the second reference pad is circular, the single-side size of the second reference pad comprises a radius which is 0.5mm larger than the single-side size of the solder paste reference point, namely 1-1.5 mm, and the diameter of the second reference pad is 2-3 mm. Other shapes of the solder paste datum points are the same as the above, and are not described here again.
Although embodiments of the present invention have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and variations are within the scope of the invention as defined by the appended claims.
Claims (10)
1. A component mounting method based on printed solder paste fiducial points, comprising:
providing a whole flexible board to be attached; wherein the whole flexible plate comprises a plurality of single flexible plates;
respectively manufacturing a first reference bonding pad and a second reference bonding pad on the whole flexible board; wherein each single flexible board on the whole flexible board is provided with the second reference bonding pad;
performing solder paste printing on the whole flexible board based on the first reference bonding pads, and forming solder paste datum points on each second reference bonding pad;
and respectively carrying out surface mounting on each single flexible plate based on the solder paste datum points on each single flexible plate to finish component surface mounting.
2. The component mounting method based on the printing solder paste datum point according to claim 1, wherein a datum pad fabrication area is arranged on each single flexible board, and each datum pad fabrication area is located in a waste area of the corresponding single flexible board;
the manufacturing of the first reference bonding pad and the second reference bonding pad on the whole flexible board respectively comprises the following steps:
manufacturing a first reference pad at a first appointed position of at least one reference pad manufacturing area of the whole flexible board;
and manufacturing the second reference pads at second designated positions of each reference pad manufacturing area of the whole flexible board.
3. The component mounting method based on the printing paste datum point as claimed in claim 2, wherein a plurality of component pads for mounting components are further provided on each of the single flexible boards;
the solder paste printing is performed on the whole flexible board based on the first reference bonding pads, and a solder paste datum point is formed on each second reference bonding pad, and the solder paste printing method comprises the following steps:
providing a printed steel mesh provided with a plurality of first openings and a plurality of second openings according to the second designated position of each second reference pad and the position of each element pad on the whole flexible board; the number of the first openings is the same as that of the second reference pads, and all the first openings are in one-to-one correspondence with all the second reference pads; the number of the second openings is the same as that of the element pads, and all the second openings are in one-to-one correspondence with all the element pads;
identifying the first reference bonding pad on the whole flexible board according to the first designated position corresponding to the first reference bonding pad;
and (3) taking the first reference bonding pad as a reference, printing the whole flexible board with solder paste by utilizing the printing steel mesh, forming corresponding element solder paste on each element bonding pad, and forming corresponding solder paste reference points on each second reference bonding pad.
4. The printed solder paste datum point based component placement method of claim 3, wherein the solder paste datum point based on each of the monolithic compliance plates further comprises, prior to individually placing the solder paste on each of the monolithic compliance plates:
acquiring reference position coordinates of the solder paste datum points on each single flexible plate, and acquiring element position coordinates of each element solder paste on each single flexible plate relative to the solder paste datum points;
and taking one single flexible plate as a block, and respectively constructing a block association relation table corresponding to each block on each block according to the reference position coordinates of the solder paste reference points on each single flexible plate, preset reference identification parameters and the element position coordinates of all the element solder pastes.
5. The method of component mounting based on printed solder paste fiducial as claimed in claim 4, wherein said individually mounting on each of said monolithic compliance plates based on said solder paste fiducial on each of said monolithic compliance plates comprises:
identifying the solder paste datum point on each block according to each block association relation table;
providing a plurality of components to be pasted of each single soft board; on each single flexible board, the number of the elements to be pasted is the same as that of the element bonding pads, and all the elements to be pasted are in one-to-one correspondence with all the element bonding pads;
and on each block, taking the solder paste datum point as a reference, and attaching each element to be attached to the element solder paste formed by the corresponding element bonding pad according to the corresponding block association relation table.
6. The printed solder paste fiducial-based component placement method of claim 4, wherein the preset fiducial identification parameters of each of the solder paste fiducial points each comprise a corresponding fiducial shape and a corresponding fiducial size; the reference point size of each solder paste reference point is smaller than the size of the corresponding second reference pad.
7. The printed solder paste fiducial-based component mounting method of claim 6, wherein the fiducial shape comprises any one of a regular shape or an irregular shape.
8. The printed solder paste fiducial-based component mounting method of claim 6, wherein the fiducial shape comprises a rectangle or a circle.
9. The component mounting method based on printed solder paste fiducial according to claim 8, wherein the fiducial size of the solder paste fiducial is 1-2 mm and/or the second fiducial pad size is 2-3 mm.
10. The printed solder paste datum point based component placement method of any one of claims 1 to 9, wherein the solder paste datum point based on each of the monolithic compliance plates, after individually placing the solder paste on each of the monolithic compliance plates, further comprises:
and performing reflow soldering on all the single flexible boards after the mounting according to preset reflow soldering parameters to finish the mounting of the components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310534233.9A CN116723647A (en) | 2023-05-12 | 2023-05-12 | Component mounting method based on printing tin paste datum point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310534233.9A CN116723647A (en) | 2023-05-12 | 2023-05-12 | Component mounting method based on printing tin paste datum point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116723647A true CN116723647A (en) | 2023-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310534233.9A Pending CN116723647A (en) | 2023-05-12 | 2023-05-12 | Component mounting method based on printing tin paste datum point |
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| Country | Link |
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| CN (1) | CN116723647A (en) |
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2023
- 2023-05-12 CN CN202310534233.9A patent/CN116723647A/en active Pending
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