CN116723381A

CN116723381A - Camera module and electronic equipment

Info

Publication number: CN116723381A
Application number: CN202211111075.8A
Authority: CN
Inventors: 崔佳轩; 毛春程; 马冬; 严斌
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-09-13
Filing date: 2022-09-13
Publication date: 2023-09-08
Anticipated expiration: 2042-09-13
Also published as: CN116723381B

Abstract

The embodiment of the application provides a camera shooting module and electronic equipment, wherein the camera shooting module comprises a shell, a prism assembly, a lens assembly, a photosensitive element and a bearing assembly; the shell comprises an upper cover and a base connected with the upper cover, an accommodating space is formed between the upper cover and the base, a first light transmission area is arranged on the upper cover, and the first light transmission area is arranged opposite to the lens; the prism component is arranged in the accommodating space and connected with the base, and the prism component is arranged corresponding to the first light transmission area; the lens component is arranged in the accommodating space and connected with the base, is positioned on the light emitting side of the prism component, and is provided with a second light transmission area along the length direction of the camera module; the photosensitive element is electrically connected with the bearing component, the bearing component is positioned on one side of the base, the bearing component is connected with the base and covers the second light transmission area, and the height of at least part of the structure of the bearing component is lower than the height of the shell along the height direction of the camera module.

Description

Camera module and electronic equipment

Technical Field

The present application relates to the field of electronic products, and in particular, to a camera module and an electronic device.

Background

The periscope type camera module is widely applied to electronic equipment such as mobile phones, tablet computers and the like due to the fact that the periscope type camera module has the advantages of being capable of achieving zooming and the like in the electronic equipment. In the related art, in order to ensure the normal operation of the periscope type camera module, the size of optical components such as a prism, a lens and the like in the periscope type camera module is larger, so that the overall size of the periscope type camera module along the thickness direction of the electronic equipment is larger. In addition, periscope type camera module installs in electronic equipment, periscope type camera module sets up in the below of camera decoration in electronic equipment more, in order to prevent that camera decoration from interfering with periscope type camera module, needs to reserve sufficient accommodation space in electronic equipment is inside for periscope type camera module is higher along the space occupancy in the thickness direction of electronic equipment, is unfavorable for frivolous the thinning of electronic equipment.

Disclosure of Invention

The embodiment of the application aims to provide a camera module and electronic equipment, so that the space occupation rate of the camera module along the thickness direction of the electronic equipment is reduced, and the light and thin degree of the electronic equipment is improved. The specific technical scheme is as follows:

an embodiment of a first aspect of the present application provides a camera module, where the camera module is applied to an electronic device, the electronic device includes a device housing, a lens, and a decoration, where the decoration is disposed in the device housing, and the decoration is disposed at a side outside the device housing and connected to the lens, and the camera module includes:

The module comprises a module shell, a lens and a lens, wherein the module shell comprises an upper cover and a base connected with the upper cover, an accommodating space is formed between the upper cover and the base, a first light transmission area is arranged on the upper cover, and the first light transmission area is arranged opposite to the lens;

the prism assembly is arranged in the accommodating space and connected with the base, and the light incident side of the prism assembly is arranged corresponding to the first light transmission area;

the lens assembly is arranged in the accommodating space and connected with the base, the lens assembly is positioned on the light emitting side of the prism assembly, a second light transmission area is arranged on one side of the base along the length direction of the camera module, and the lens assembly is arranged closer to the second light transmission area than the prism assembly;

the light-sensitive element is electrically connected with the bearing component, the bearing component is positioned on one side of the base, which is provided with the second light-transmitting area, the bearing component is connected with the base and covers the second light-transmitting area, and the height of at least part of the structure of the bearing component is lower than the height of the module shell in the height direction of the camera module.

In some embodiments, the bearing assembly includes a frame and a first circuit board, the frame is connected with the base, the first circuit board is located at a side of the frame away from the base and is connected with the frame, and the photosensitive element is integrated on the first circuit board;

a first concave part is arranged on one side, close to the decoration, of the frame body along the height direction, and penetrates through the frame body along the length direction;

along the height direction, one side of the first circuit board, which is close to the decoration, is provided with a second concave part, the first concave part is correspondingly arranged with the second concave part, and along the length direction, the second concave part penetrates through the first circuit board and is communicated with the first concave part.

In some embodiments, the first circuit board includes a first portion, one side of the first portion is bent to form a second portion, the first portion covers the second light-transmitting region, the second portion extends along the length direction, the photosensitive element is disposed on the first portion, and the first recess is located on one side of the first portion away from the second portion.

In some embodiments, a connector is disposed on a side of the second portion away from the first portion, the connector being configured to electrically connect with a motherboard of the electronic device.

and in the height direction, the height of the first circuit board is lower than that of the module shell, and the height of the frame body is lower than that of the module shell.

In some embodiments, a third recess is provided on a side of the base away from the decoration, the third recess extends to a side of the base close to the bearing component, and at least a partial area of a side surface of the bearing component away from the decoration is flush with a bottom of the third recess along the height direction.

In some embodiments, the third recess penetrates the base along the width direction of the camera module.

In some embodiments, the prism assembly includes a prism and a prism support, the prism being secured to the prism support;

the side of the prism support, which is far away from the decoration, is provided with a fourth concave part, the side of the base, which is far away from the decoration, is provided with a fifth concave part, and the position and the shape of the fifth concave part correspond to those of the fourth concave part.

In some embodiments, the camera module further includes a second circuit board and a driving mechanism, the driving mechanism is electrically connected with the second circuit board, and the second circuit board is used for being electrically connected with a main board of the electronic device;

the driving mechanism is arranged on the base, is electrically connected with the lens assembly and is used for driving the lens assembly to move along the length direction; and/or the driving mechanism is electrically connected with the prism assembly and is used for driving the prism assembly to move along the length direction.

In some embodiments, the carrier assembly further comprises:

the first bonding layer is positioned between the frame body and the base, and the base is bonded and connected with the frame body through the first bonding layer;

the second bonding layer is positioned between the frame body and the first circuit board, and the frame body is bonded and connected with the first circuit board through the second bonding layer.

In some embodiments, the camera module further comprises a blue glass filter, the blue glass filter is located between the frame and the base, and the blue glass filter covers the second light-transmitting region.

An embodiment of a second aspect of the present application provides an electronic device, where the electronic device includes a motherboard and any one of the above-mentioned camera modules, and the camera module is electrically connected to the motherboard.

The embodiment of the application has the beneficial effects that:

in the camera module and the electronic device provided by the embodiment of the application, the camera module is applied to the electronic device, the electronic device comprises a device shell, a lens and a decoration piece, the decoration piece is arranged in the device shell in a penetrating way, namely one side of the decoration piece is arranged in the device shell, and the other side of the decoration piece extends out of the device shell and is used for bearing and installing the lens. The camera module is arranged in the equipment shell, and when the camera module is arranged in the equipment shell, the camera module is arranged below the decoration. The camera module comprises a module shell, wherein an accommodating space is formed in the module shell, the prism assembly and the camera module are arranged in the accommodating space, the prism assembly and a first light transmission area on the module shell are arranged oppositely, and the lens assembly is arranged on the light emitting side of the prism assembly. When the camera shooting module is installed in the electronic equipment, the first light transmission area is arranged opposite to the lens, so that light outside the electronic equipment can enter the prism assembly through the lens and the first light transmission area, then enter the lens assembly after being reflected by the prism assembly, finally reach the photosensitive element on the bearing assembly through the second light transmission area, and the photosensitive element converts optical signals into electric signals and transmits the electric signals to the main board of the electronic equipment. In the camera module provided by the embodiment of the application, when the camera module is installed in the electronic equipment, the camera module is positioned below the decoration, and because the height of at least part of the structure of the bearing component in the camera module is smaller than that of the module shell, compared with the module shell, an accommodating space formed by the height difference is arranged above the bearing component, and part of the structure of the decoration can be arranged in the bearing component.

Of course, it is not necessary for any one product or method of practicing the application to achieve all of the advantages set forth above at the same time. The foregoing description is only an overview of the present application, and is intended to be implemented in accordance with the teachings of the present application in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present application more readily apparent.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of an image capturing module according to some embodiments of the present application;

FIG. 2 is a block diagram illustrating removal of an upper cover from a camera module according to some embodiments of the present application;

FIG. 3 is a block diagram of an upper cover in an image capturing module according to some embodiments of the present application;

FIG. 4 is a block diagram of a base of a camera module according to some embodiments of the present application;

FIG. 5a is a schematic diagram illustrating a camera module mounted on an electronic device according to some embodiments of the present application;

FIG. 5b is a second schematic diagram illustrating a camera module mounted on an electronic device according to some embodiments of the present application;

FIG. 6 is an enlarged view of area F of FIG. 5 a;

FIG. 7 is a block diagram of a load bearing assembly according to some embodiments of the application;

FIG. 8 is a block diagram of a first circuit board according to some embodiments of the application;

FIG. 9 is a block diagram of a frame of an image capturing module according to some embodiments of the present application;

FIG. 10 is a third schematic diagram illustrating a camera module mounted on an electronic device according to some embodiments of the present application;

FIG. 11 is a fourth schematic diagram illustrating a camera module mounted on an electronic device according to some embodiments of the present application;

fig. 12 is an enlarged view of a region G in fig. 11;

FIG. 13 is a fifth schematic diagram illustrating an image capturing module mounted to an electronic device according to some embodiments of the present application;

fig. 14 is an enlarged view of region H of fig. 13;

fig. 15 is a block diagram of a prism assembly in an image capturing module according to some embodiments of the present application.

Detailed Description

Embodiments of the technical scheme of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present application, and thus are merely examples, and are not intended to limit the scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of embodiments of the present application, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" means two or more (including two), and similarly, "plural sets" means two or more (including two), and "plural sheets" means two or more (including two).

In the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. refer to the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the embodiments of the present application and for simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like should be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.

At present, shooting functions in electronic devices such as mobile phones and tablet computers have become key selling points of the electronic devices, and a shooting module is an important component for realizing the shooting functions of the electronic devices. The electronic equipment comprises an equipment shell and a lens decoration piece arranged on the equipment shell, wherein the lens decoration piece is used for bearing and installing a lens. When the lens decoration piece is arranged on the equipment shell, the lens decoration piece penetrates through the equipment shell, namely, a part of structure of the lens decoration piece is fixed inside the equipment, and the part of structure penetrates through the equipment shell and is arranged outside the equipment. In the related art, in order to make the camera shooting module not interfere with the lens decoration, the camera shooting module is arranged below the lens decoration, and in order to ensure that the camera shooting module can work normally, optical properties of a prism component, a lens component and the like in the camera shooting module are required to be ensured, and the sizes of the prism component and the lens component are larger, so that the thickness of the camera shooting module is larger, the electronic equipment is required to reserve larger space for the camera shooting module and the lens decoration along the thickness direction of the electronic equipment, and the space occupancy rate of the camera shooting module along the thickness direction of the electronic equipment is higher, so that the lightening and thinning of the electronic equipment are not facilitated.

The embodiment of the application provides a camera module and electronic equipment, which are described in detail below with reference to the accompanying drawings. The camera module comprises, but is not limited to, a periscope camera module and the like. The camera module can be applied to electronic equipment with photographing and shooting functions such as mobile phones, tablets and computers. For convenience of description, the following describes various embodiments of the present application by taking an electronic device as an example of a mobile phone.

An embodiment of a first aspect of the present application provides an image capturing module, which is applied to an electronic device, where the electronic device includes a device housing, a lens, and a decoration piece, the decoration piece is disposed through the device housing, and the decoration piece is disposed at a side outside the device housing and connected with the lens. As shown in fig. 1, 2, 3 and 4, the camera module 10 includes a module housing 1, a prism assembly 2, a lens assembly 3, a carrier assembly 4 and a photosensitive element 5. The module housing 1 includes an upper cover 11 and a base 12 connected to the upper cover 11, and an accommodating space is formed between the upper cover 11 and the base 12. As shown in fig. 4, the upper cover 11 is provided with a first light-transmitting area 111, and the first light-transmitting area 111 is disposed opposite to the lens. The prism assembly 2 is disposed in the accommodating space and connected to the base 12, and the light incident side of the prism assembly 2 is disposed corresponding to the first light-transmitting area 111. The lens component 2 is arranged in the accommodating space and is connected with the base 12, the lens component 3 is positioned on the light emitting side of the prism component 2, a second light transmitting area 121 is arranged on one side of the base 12 along the length direction of the camera module 10, and the lens component 3 is arranged closer to the second light transmitting area 121 than the prism component 2. The photosensitive element 5 is electrically connected with the bearing component 4, the bearing component 4 is located at one side of the base 12, the bearing component 4 is connected with the base 12 and covers the second light transmission area 121, and the height of at least part of the structure of the bearing component 4 is lower than the height of the module housing 1 along the height direction of the camera module 10.

In the embodiment of the present application, the height direction of the image capturing module 10 is defined as the Z direction, the length direction of the image capturing module 10 is defined as the Y direction, and the width direction of the image capturing module 10 is defined as the X direction, wherein any two of the X direction, the Y direction and the Z direction are perpendicular to each other. The Z direction may be a thickness direction of the mobile phone mounted with the camera module 10, the Y direction may be a length direction of the mobile phone mounted with the camera module 10, and the X direction may be a width direction of the mobile phone mounted with the camera module 10. In addition, for convenience of description, when the camera module 10 is installed inside the mobile phone, the direction facing the lens is defined as up, and the direction facing away from the lens is defined as down.

In the embodiment of the present application, as shown in fig. 5a, the mobile phone further includes a main board 50, and when the camera module 10 is installed in the mobile phone, the camera module 10 is disposed on the main board 50 and electrically connected to the main board 50.

In the embodiment of the present application, as shown in fig. 3, 5a and 5b, the upper surface of the upper cover 11 is provided with the first light-transmitting area 111, and when the camera module 10 is installed in the mobile phone, the first light-transmitting area 111 is opposite to the lens of the mobile phone, so that the light outside the mobile phone can enter the camera module 10 through the lens and the first light-transmitting area 111. Alternatively, the first light-transmitting region 111 may be a rectangular or circular through hole provided on the upper cover 11. Alternatively, the first light-transmitting region 111 may be obtained by replacing the material at the first light-transmitting region 111 on the upper cover 11 with a transparent material. Optionally, the upper cover 11 is attached to the base 12 by means including, but not limited to, adhesive, fastener attachment, and the like.

Alternatively, the material of the upper cover 11 includes, but is not limited to, copper, aluminum alloy, etc., and the material of the base 12 includes, but is not limited to, resin, plastic, etc.

In the embodiment of the application, the prism assembly 2 is disposed in the accommodating space, and the light incident side of the prism assembly 2 is opposite to the first light-transmitting area 111, that is, the orthographic projection of the first light-transmitting area 111 along the Z direction at least partially covers the orthographic projection of the prism assembly 2 along the Z direction, so that light can enter the prism assembly 2 through the first light-transmitting area 111. The light incident side of the prism assembly 2 is a side where ambient light enters the prism assembly 2 through the first light transmitting area, and the light emergent side of the prism assembly 2 is a side where the ambient light exits after being reflected by the prism assembly. The lens assembly 3 is located at the light emitting side of the prism assembly 2, and the prism assembly 2 is used for reflecting or refracting light, so as to change the transmission direction of the light, and the reflected or refracted light can smoothly enter the lens assembly 3. The base 12 is provided with a second light-transmitting area 121, the bearing component 4 is provided with a photosensitive element 5, and the bearing component 4 is connected with one side of the base 12 provided with the second light-transmitting area 121 and covers the second light-transmitting area 121, so that light processed by the lens component 3 can smoothly reach the photosensitive element 5, and the photosensitive element 5 converts a received light signal into an electric signal and transmits the electric signal to a main board of the mobile phone. The photosensitive element 5 includes, among others, a CMOS (Complementary Metal Oxide Semiconductor ) image processor, a CCD (Charge Coupled Device, charge coupled) image processor, or the like.

In the embodiment of the present application, as shown in fig. 1, 2, 5a and 6, the height of at least part of the structure of the carrying assembly 4 is lower than the height of the module housing 1 along the height direction of the camera module 10, and it is understood that the height of the upper surface of at least part of the parts or all the structure of the carrying assembly 4 is lower than the height of the upper surface of the module housing 1 along the Z direction. It is also understood that the height of a part or all of the upper surface of the overall structure of the carrier assembly 4 is lower than the height of the upper surface of the module housing 1 in the Z direction with the carrier assembly 4 as a whole.

In the image capturing module 10 provided in the embodiment of the present application, as shown in fig. 2 and 5a, when the image capturing module 10 is installed in a mobile phone, the image capturing module 10 is located below the decoration piece 40, and because the height of at least part of the structure of the carrying component 4 in the image capturing module 10 is smaller than the height of the module housing 1, compared with the module housing 1, an accommodating space formed by the height difference is formed above the carrying component 4, and part of the structure of the decoration piece 40 can be placed in the accommodating space above the carrying component 4, based on this, part of the accommodating space along the height direction can be shared by part of the structure of the decoration piece 40 and the image capturing module 10, so that the distance between the image capturing module 10 and the lower side of the decoration piece 40 along the height direction is reduced, the space occupation rate of the image capturing module 10 along the thickness direction of the electronic device is reduced, and the light and thin degree of the electronic device is improved.

In addition, as shown in fig. 5a and 5b, the decoration 40 is a hollow structure, the lens 30 is disposed in the hollow structure, and the hollow structure is used for making the decoration 40 not to block light, so that light can enter the interior of the mobile phone through the lens 30 and the decoration 40. Because the height of the bearing assembly 4 in the camera module 10 is smaller than the height of the module shell 1, the size of the upper side of the camera module 10 is smaller than the size of the hollow area in the decoration 40 along the Y direction, so that part of the structure of the camera module 10 can be embedded into the hollow structure of the decoration 40, the decoration 40 and the camera module 10 can share part of the accommodating space along the height direction, the distance between the camera module 10 and the lower side of the decoration 40 along the height direction is reduced, the space occupation rate of the camera module 10 along the thickness direction of the electronic equipment is reduced, and the light and thin degree of the electronic equipment is improved.

For example, as shown in fig. 5a, the dimension of the module case 1 along the Z direction is a, and the height difference between the carrier assembly 4 and the module case 1 is B, using the motherboard 50 in the mobile phone as a reference surface. If the height of the carrying component 4 is equal to the height of the module housing 1, the distance between the lower surface of the decoration piece 40 and the upper surface of the main board 50 is approximately equal to the size of the camera module 10, and the distance between the lower surface of the decoration piece 40 and the upper surface of the main board 50 is approximately a when the camera module 10 is installed in the mobile phone. Because of the height difference B between the carrier assembly 4 and the module housing 1, the distance between the lower surface of the decoration 40 and the upper surface of the motherboard 50 is approximately equal to a-B when the camera module 10 is installed in the mobile phone. Therefore, the height of at least part of the structure of the carrying assembly 4 in the camera module 10 is smaller than the height of the module housing 1, so that the distance between the camera module 10 and the lower side of the decoration 40 along the Z direction can be reduced by about B, thereby reducing the space occupation rate of the camera module 10 along the thickness direction of the electronic device and improving the light and thin degree of the electronic device.

In some embodiments, as shown in fig. 7 and 8, the carrying assembly 4 includes a frame 41 and a first circuit board 42, the frame 41 is connected to the base 12, the first circuit board 42 is located on a side of the frame 41 away from the base 12 and connected to the frame 41, and the photosensitive element 5 is integrated on the first circuit board 42. A first recess 411 is provided in the side of the frame 41 adjacent to the garnish 40 in the height direction, and the first recess 411 penetrates the frame 41 in the longitudinal direction. The first circuit board 42 is provided with a second recess 421 on a side thereof adjacent to the garnish 40 in the height direction, the first recess 411 is provided corresponding to the second recess 421, and the second recess 421 penetrates the first circuit board 42 in the length direction and communicates with the first recess 411.

In the embodiment of the present application, in the Y direction, one side surface of the frame 41 is connected to the first circuit board 42, and the other side surface is connected to the base 12. As shown in fig. 9, the frame 41 has a hollow structure, and the hollow area of the frame 41 corresponds to the second light-transmitting area 121, so that light can smoothly reach the photosensitive element 5 through the second light-transmitting area 121 and the hollow area of the frame 41. Alternatively, the frame 41 may be substantially rectangular. The first recess 411 is provided on the upper surface of the frame 41 and penetrates the frame 41 in the Y direction, and the first recess 411 is configured to make the height of a partial region of the upper surface of the frame 41 lower than the height of the module case 1. The second recess 421 is disposed on the first circuit board 42, and the second recess 421 may be a notch structure disposed on an upper side of the first circuit board 42, and the height of a partial area of the second recess on the upper surface of the first circuit board 42 is smaller than the height of the module housing 1. The shape, position and size of the second concave portion 421 are corresponding to those of the first concave portion 411, and the first concave portion 411 is communicated with the second concave portion 421, so that the first concave portion 411 and the second concave portion 421 together form an accommodating space, a part of the structure of the decoration piece 40 can be placed in the accommodating space, a part of the structure of the decoration piece 40 and the camera module 10 can share a part of the accommodating space along the height direction, the distance between the camera module 10 and the lower side of the decoration piece 40 along the height direction is reduced, the space occupation rate of the camera module 10 along the thickness direction of the electronic device is reduced, and the light and thin degree of the electronic device is improved.

In addition, by providing the first concave portion 411 on the first circuit board 42 to form the accommodating space, the size and the position of the first concave portion 411 can be adjusted according to the requirement, for example, the size and the position of the first concave portion 411 can be adjusted according to the arrangement number and the position of the electronic components on the first circuit board 42, so that the space occupation rate of the camera module 10 along the thickness direction of the electronic device can be reduced, and meanwhile, the influence of the first concave portion 411 on the arrangement mode and the arrangement space of the electronic components on the first circuit board 42 can be reduced.

Alternatively, the bottom surface of the first recess 411 is coplanar with the bottom surface of the second recess 421.

In some embodiments, the first circuit board 42 includes a first portion 422, one side of the first portion 422 is bent to form a second portion 423, the first portion 422 covers the second light-transmitting region 121, the second portion 423 extends along the length direction, the photosensitive element 5 is disposed on the first portion 422, and the first recess 421 is located on a side of the first portion 423 away from the second portion 423.

In the embodiment of the present application, as shown in fig. 8, the shape of the first portion 422 may be substantially rectangular, and the first concave portion 421 may be disposed at a corner point of a side of the first portion 422 away from the second portion 423, so as to facilitate processing of the first concave portion 421. In addition, the first recess 421 is disposed at a side corner point of the first portion 422 remote from the second portion 423, that is, the first recess 421 may be formed by cutting off a side corner point of the first portion 422 such that the first recess 421 forms an open accommodating space, facilitating the structural fit of the first recess 421 with a portion of the decoration 40.

In some embodiments, the side of the second portion 423 remote from the first portion 422 is provided with a connector 6, and the connector 6 is configured to electrically connect with the motherboard 50 of the electronic device.

In the embodiment of the application, the first portion 422 of the first circuit board 42 covers the second light-transmitting region 121, and the second portion 423 is bent in a direction away from the second light-transmitting region 121 and extends in the Y direction, so that the first circuit board 42 is disposed around the base 12, and the first circuit board 42 extends from a side of the base where the second light-transmitting region 121 is disposed to a side of the base 121 opposite to the second light-transmitting region 121, and is then electrically connected to the motherboard 50 through the connector 6. As shown in fig. 5a, the first circuit board 42 may be disposed perpendicular to the motherboard 50, so that the connection complexity of the first circuit board 42 and the motherboard 50 is reduced by the connector 6 and the motherboard 50, and the electrical connection stability of the first circuit board 42 and the motherboard 50 is increased.

In the embodiment of the present application, the position of the connector 6 may be set according to actual requirements, for example, according to the arrangement of electronic components on the motherboard 50. In one example, the connector 6 may be disposed on the side of the camera module 10 where the photosensitive element 5 is disposed, as shown in fig. 5a, so that the distance between the connector 6 and the photosensitive element 5 is reduced, facilitating connection of the connector 6 with the first circuit board 42 on which the photosensitive element 5 is mounted. In another example, the connector 6 may be provided on the side of the camera module 10 where the prism assembly 2 is provided, as shown in fig. 5 b. The wires connecting the connector 6 and the first circuit board 42 may be actual cables, or the wires may be formed by bending part of the structure of the first circuit board 42, so that the bending condition of the first circuit board 42 may be adjusted by the position of the connector 6.

Alternatively, as shown in fig. 8, a side of the second portion 423 away from the first portion 422 is bent along the X direction to form a third portion 424, the third portion 424 covers a side of the base 12 opposite to the second light-transmitting region 121, and the connector 6 is disposed on a side of the third portion 421 away from the second portion 422.

In some embodiments, the height of the first circuit board 42 is lower than the height of the module housing 1 in the height direction, and the height of the frame 41 is lower than the height of the module housing 1.

In the embodiment of the present application, the height of the entire area of the upper surface of the first circuit board 42 may be lower than the height of the upper surface of the module housing 1, and the height of the entire area of the upper surface of the frame 41 may be lower than the height of the upper surface of the module housing 1, so that the size of the accommodating space above the first circuit board 42 and the frame 41 along the X direction is equal to the size of the frame 41 and the first circuit board 42 along the X direction, and the size of the accommodating space above the first circuit board 42 and the frame 41 is increased. When a part of the structure of the decoration 40 is placed in the accommodation space above the first circuit board 42 and the frame 41, the probability of interference between the first circuit board 42 and the frame 41 and the decoration 40 is reduced.

Alternatively, the height of the upper surface of the frame 41 may be equal to the height of the upper surface of the first circuit board 42.

In some embodiments, as shown in fig. 4, 11 and 12, a third recess 122 is provided on a side of the base 12 away from the decoration 40, the third recess 122 extends to a side of the base 12 close to the carrying component 4, and at least a partial area of a surface of the carrying component 4 away from the decoration 40 is flush with a bottom of the third recess 122 along a height direction.

In the embodiment of the application, when the camera module 10 is disposed on the motherboard 50, the lower surface of the base 12 is disposed opposite to the motherboard 50. In the related art, the size of the gap between the lower surface of the camera module 10 and the motherboard 50 is close to 0 along the Z direction, and other electronic components cannot be disposed between the lower surface of the camera module 10 and the motherboard 50, resulting in space waste on the motherboard 50. In the embodiment of the application, the third recess 122 is disposed on the lower surface of the base 12, and at least part of the area of the lower surface of the integral structure of the bearing component 4 is flush with the bottom of the third recess 122, so that an accommodating space is formed between the third recess 122 and the main board 50, and at least part of the area of the lower surface of the bearing component 4 and the main board 50, so that an electronic component can be disposed on the main board 50 at the area corresponding to the accommodating space, and the electronic component is disposed in the accommodating space, so that the arrangement space of the electronic component on the main board 50 can be increased while the integral size of the camera module 10 and the main board 50 along the Z direction is not affected.

Optionally, the entire area of the side surface of the carrier assembly 4 away from the decoration member 40 is flush with the bottom of the third recess 122, thereby increasing the accommodation space between the lower surface of the carrier assembly 4 and the main board 50, and further increasing the arrangement space of the electronic components on the main board 50.

Alternatively, the third recess 122 penetrates the base in the width direction of the camera module 10, and the size of the third recess 122 in the X direction is increased, so that the accommodating space between the lower surface of the third recess 122 and the main board 50 is increased, and the arrangement space of the electronic components on the main board 50 is further increased.

In some embodiments, as shown in fig. 10, a first through hole 501 is formed on the main board 50, and the camera module 10 is disposed through the first through hole 501, so that the lower surface of the camera module 10 is located below the main board 50, and the upper surface of the camera module 10 is located above the main board 50. The camera module 10 is arranged on the main board 50 in a penetrating manner, so that the part of the structure of the camera module 10 and the main board 50 share the accommodating space in the Z direction, the space occupation rate of the camera module 10 and the main board 50 along the thickness direction of the electronic equipment can be reduced, and the light and thin degree of the electronic equipment is further improved.

In addition, as shown in fig. 10, a display device 60 and a flexible circuit board 70 for carrying the display device 60 are disposed under the main board 50. Among them, the display device 60 includes, but is not limited to, a display panel, piezoelectric ceramics, an antenna, and the like. When the camera module 10 is disposed through the main board 50, the accommodating space formed between the third recess 122 on the base 12 and the main board 50, and at least a portion of the area of the lower surface of the carrier assembly 4 and the main board 50 can also be used for accommodating the display device 60, so as to reduce the probability of interference between the camera module 10 and the display device 60. In addition, the display device 60 is disposed in the accommodating space formed between the third recess 122 and the main board 50, and at least a portion of the area of the lower surface of the carrier assembly 4 and the main board 50, so that the display device 60 shares a portion of the accommodating space with the base 12 and the carrier assembly 4 in the Z direction, which can reduce the space occupation rate of the whole camera module 10 and the display device 60 along the thickness direction of the electronic device, and further improve the light and thin degree of the electronic device.

For example, as shown in fig. 4 and 10, in the Z direction, the dimensions of the display device 60 and the flexible circuit board 70 are C1, the dimension of the escape gap between the display device 60 and the image pickup module 10 is C2, the thickness of the image pickup module 10 is a, and the depth of the third recess 122 is C3. If the third recess 122 is not provided on the base 12, when the camera module 10 is installed in the mobile phone, the distance between the lower surface of the base 12 and the lower surface of the flexible circuit board 70 is about c1+c2+a along the Z direction, and the distance between the lower surface of the base 12 and the lower surface of the flexible circuit board 70 is about c1+c2+a-C3 due to the third recess 122 provided on the base 12. Therefore, the third recess 122 is disposed on the lower surface of the base 12, and a part or all of the lower surface of the carrier 4 is flush with the bottom wall of the third recess 122, so that the distance between the camera module 10 and the lower surface of the flexible circuit board 70 along the Z direction can be reduced by about C3, thereby reducing the space occupation ratio of the whole camera module 10, the display device 60 and the flexible circuit board 70 along the thickness direction of the electronic device, and further improving the light and thin degree of the electronic device.

In some implementations, as shown in fig. 4, 13, 14, and 15, the prism assembly 2 includes a prism 21 and a prism support 22, the prism 21 being fixed to the prism support 22. The prism holder 22 has a fourth recess 221 on a side away from the decoration 40, and the base 12 has a fifth recess 123 on a side away from the decoration 40, the fifth recess 123 corresponding to the fourth recess 221 in position and shape.

In the embodiment of the application, the prism 21 is disposed corresponding to the first light-transmitting area 111 on the upper cover 11, and the prism 21 is used for changing the transmission direction of the light so as to transmit the light to the lens assembly 3. The prism support 22 is used for carrying and mounting the prism 21. The lower surface of the prism holder 22 is provided with a fourth recess 221, the lower surface of the base 12 is provided with a fifth recess 123, and the orthographic projection of the fourth recess 221 coincides with the orthographic projection of the fifth recess 123 in the Z direction. When the camera module 10 is disposed on the main board 50, an accommodating space is formed between the fourth recess 221 and the fifth recess 123 and the main board 50, so that an electronic component can be disposed on the main board 50 at a region corresponding to the accommodating space, and the electronic component is disposed in the accommodating space, so that the arrangement space of the electronic component on the main board 50 can be further increased while the overall size of the camera module 10 and the main board 50 along the Z direction is not affected.

Alternatively, the prism support 22 and the base 12 may be connected as a single structure, thereby reducing the structural complexity of the camera module 10. Based on this, the fourth recess 221 and the fifth recess 123 are also integrally formed.

In some embodiments, the camera module 10 further includes a second circuit board 7 and a driving mechanism 8, the driving mechanism 8 is electrically connected to the second circuit board 7, and the second circuit board 7 is used for being electrically connected to the motherboard 50 of the electronic device. The driving mechanism 8 is arranged on the base 12, the driving mechanism 8 is electrically connected with the lens assembly 3, and the driving mechanism 8 is used for driving the lens assembly 3 to move along the length direction; and/or a driving mechanism 8 is electrically connected with the prism assembly 2, and the driving mechanism 8 is used for driving the prism assembly 2 to move along the length direction.

In the embodiment of the present application, the driving mechanism 8 is used to drive the lens assembly 3 and/or the prism assembly 2 to move along the Y direction, so as to change the distance between the lens assembly 3 and the prism assembly 2, thereby implementing zooming of the lens module 10.

Alternatively, as shown in fig. 2, the driving mechanism 8 may include a plurality of electromagnetic coils 81 and a plurality of electromagnets 82 fixed to the base 12, where each electromagnetic coil 81 is connected to at least one electromagnet 82, the electromagnetic coils 81 are electrically connected to the second circuit board 7, and the second circuit board 7 is configured to provide power to the electromagnetic coils 81 to make the electromagnets 82 generate magnetism, so as to drive the lens assembly 3 and/or the prism assembly 2 to move along the Y direction.

In some embodiments, the carrier assembly 4 further includes a first adhesive layer 43 and a second adhesive layer 44. The first adhesive layer 43 is located between the frame 41 and the base 12, and the base 12 is adhesively connected to the frame 41 via the first adhesive layer 43. The second adhesive layer 44 is located between the frame 41 and the first circuit board 42, and the frame 41 is adhesively connected to the first circuit board 42 via the second adhesive layer 44.

In the embodiment of the present application, the first adhesive layer 43 covers a surface of the frame 41 near the base 12, and is used for connecting the base 12 and the frame 41. The second adhesive layer 44 covers a side surface of the frame 41 adjacent to the first circuit board 42, and is used for connecting the first circuit board 42 and the frame 41. Optionally, the first adhesive layer 43 and the second adhesive layer 44 are double-sided adhesive layers.

In some embodiments, the image capturing module 10 further includes a blue glass filter 9, the blue glass filter 9 is located between the frame 41 and the base 12, and the blue glass filter 9 covers the second light transmitting area 121. The blue glass filter 9 is used for filtering part of infrared rays and visible red light, so that the photosensitive element 5 can better convert received light into corresponding electric signals.

An embodiment of the second aspect of the present application provides an electronic device, as shown in fig. 5a, 5b and 10, including a main board 50 and the camera module 10 in any of the above embodiments.

In the embodiment of the application, the electronic device further comprises a device housing 20, a lens 30 and a decoration 40, wherein the decoration 40 is arranged on the device housing 20 in a penetrating way, and the decoration 40 is arranged on one side outside the device housing 20 and connected with the lens 30. Electronic devices include, but are not limited to, devices with camera modules such as cell phones, tablets, notebook computers, and the like.

In the electronic device provided by the embodiment of the application, the camera module 10 is located below the decoration piece 40, and since the height of at least part of the structure of the bearing component 4 in the camera module 10 is smaller than the height of the module housing 1, compared with the module housing 1, an accommodating space formed by the height difference is formed above the bearing component 4, and part of the structure of the decoration piece 40 can be placed in the accommodating space above the bearing component 4, therefore, part of the structure of the decoration piece 40 and the camera module 10 can share part of the accommodating space along the height direction, thereby reducing the distance between the camera module 10 and the lower side of the decoration piece 40 along the height direction, reducing the space occupation rate of the camera module 10 along the thickness direction of the electronic device, and improving the light and thin degree of the electronic device.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application, and are intended to be included within the scope of the appended claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims

1. The utility model provides a module of making a video recording, its characterized in that is applied to electronic equipment, electronic equipment includes equipment casing, lens and decoration, the decoration wears to locate equipment casing, the decoration is arranged in one side outside the equipment casing with the lens is connected, the module of making a video recording includes:

2. The camera module of claim 1, wherein the carrier assembly comprises a frame and a first circuit board, the frame is connected with the base, the first circuit board is located at one side of the frame away from the base and is connected with the frame, and the photosensitive element is integrated on the first circuit board;

3. The camera module of claim 2, wherein the first circuit board includes a first portion, a side of the first portion is bent to form a second portion, the first portion covers the second light-transmitting region, the second portion extends along the length direction, the photosensitive element is disposed on the first portion, and the first recess is located on a side of the first portion away from the second portion.

4. A camera module according to claim 3, wherein a connector is provided on a side of the second portion remote from the first portion, the connector being for electrical connection with a motherboard of the electronic device.

5. The camera module of claim 1, wherein the carrier assembly comprises a frame and a first circuit board, the frame is connected with the base, the first circuit board is located at one side of the frame away from the base and is connected with the frame, and the photosensitive element is integrated on the first circuit board;

6. The camera module according to claim 1, wherein a third recess is provided on a side of the base away from the garnish, the third recess extending to a side of the base near the carrier, and at least a partial area of a side surface of the carrier away from the garnish in the height direction is flush with a bottom of the third recess.

7. The camera module of claim 6, wherein the third recess extends through the base in a width direction of the camera module.

8. The camera module of claim 1, wherein the prism assembly comprises a prism and a prism support, the prism being secured to the prism support;

9. The camera module of claim 1, further comprising a second circuit board and a drive mechanism, the drive mechanism being electrically connected to the second circuit board, the second circuit board being configured to be electrically connected to a motherboard of the electronic device;

10. The camera module of claim 2 or 5, wherein the carrier assembly further comprises:

11. The camera module of claim 2 or 5, further comprising a blue glass filter sheet positioned between the frame and the base, the blue glass filter sheet covering the second light-transmitting region.

12. An electronic device, comprising a main board and the camera module of any one of claims 1 to 11, wherein the camera module is electrically connected to the main board.