CN116705886A - Preparation method of precoated photovoltaic solder strip, precoated photovoltaic solder strip and preparation device - Google Patents
Preparation method of precoated photovoltaic solder strip, precoated photovoltaic solder strip and preparation device Download PDFInfo
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- CN116705886A CN116705886A CN202310774007.8A CN202310774007A CN116705886A CN 116705886 A CN116705886 A CN 116705886A CN 202310774007 A CN202310774007 A CN 202310774007A CN 116705886 A CN116705886 A CN 116705886A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 83
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 230000004907 flux Effects 0.000 claims abstract description 137
- 238000005476 soldering Methods 0.000 claims abstract description 113
- 239000011248 coating agent Substances 0.000 claims abstract description 68
- 238000000576 coating method Methods 0.000 claims abstract description 68
- 238000003466 welding Methods 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 44
- 238000000137 annealing Methods 0.000 claims abstract description 39
- 238000001035 drying Methods 0.000 claims abstract description 38
- 239000000843 powder Substances 0.000 claims abstract description 34
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 238000004804 winding Methods 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims abstract description 15
- 239000010953 base metal Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000004513 sizing Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000005491 wire drawing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- 239000002912 waste gas Substances 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 12
- 230000006872 improvement Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000003213 activating effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000003490 calendering Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000009461 vacuum packaging Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- -1 snPb Chemical compound 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Condensed Matter Physics & Semiconductors (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
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- Sustainable Development (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a preparation method of a precoated photovoltaic solder strip, the precoated photovoltaic solder strip and a preparation device, wherein the preparation method comprises the following steps: s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire; s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire; s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod; s4: coating a second scaling powder on the tinned wire through a felt, and then drying at a low temperature to obtain a film-forming welding strip; s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage. The preparation method provided by the invention ensures that the soldering flux is not required to be smeared when the photovoltaic solder strip is welded in a component factory, reduces the generation amount of VOC waste gas, and avoids the problems of cold joint or air bubbles caused by insufficient soldering flux or excessive soldering flux when the photovoltaic solder strip is welded in the component factory by precisely controlling the smeared amount.
Description
Technical Field
The invention relates to the technical field of new photovoltaic energy, in particular to a preparation method of a precoated photovoltaic solder strip, the precoated photovoltaic solder strip and a preparation device.
Background
The photovoltaic solder strip is an important material in the welding process of the photovoltaic module, also called as a tin-coated copper strip, is divided into a bus strip and an interconnection strip according to functions, and is used for connecting the battery pieces of the photovoltaic module. The welding quality of the photovoltaic welding strip and the battery assembly directly influences the collection efficiency of the electric energy of the photovoltaic assembly, and further influences the power generation of the photovoltaic assembly.
The soldering flux is an auxiliary material for ensuring the smooth progress of the welding process, and has the main function of removing oxides on the surfaces of the welding strip and the welded substrate to achieve a certain cleanliness; meanwhile, the surface tension of the molten solder is reduced, and the welding performance is improved.
In the production process of a common photovoltaic solder strip, the effect of using soldering flux is to ensure that the tinning process is carried out smoothly. In the welding process of the photovoltaic module, the effect of the soldering flux is required to be smeared again, so that the welding strip and the silver plating layer of the battery are ensured to be welded smoothly. In the welding process of the welding strip of the assembly factory, the volatile components of the flux type soldering flux are required to be collected by a special ring mounting device, so that the production cost is increased. In addition, the scaling powder is easy to crystallize in the use process, and the scaling powder needs to be shut down and cleaned, so that the production efficiency is greatly influenced.
Therefore, a photovoltaic solder strip pre-coated with the soldering flux is produced, and the effective active components of the soldering flux are formed into a film and adhered on the surface of the solder strip for storage. No soldering flux is required to be smeared during welding of the assembly factory, the production of waste liquid and waste residue and the equipment maintenance and overhaul time are reduced, and the method has economic advantages.
Referring to the related patent, CN210497720U is a photovoltaic solder strip production device, which is only a common photovoltaic solder strip production device, and does not involve the function of pre-coating soldering flux. CN114406524a mentions that a water-based soldering flux is used for pre-coating a photovoltaic solder strip, and the concentration adjustment is used for controlling the pre-coating amount, which is inconvenient in practical application, and is difficult to meet the production requirements of different customer products.
Disclosure of Invention
In order to overcome the above drawbacks of the prior art, the present invention is directed to a method for manufacturing a pre-coated photovoltaic solder strip, and a manufacturing apparatus thereof, so as to effectively solve the above problems.
The technical scheme adopted for solving the technical problems is as follows:
a method of preparing a pre-coated photovoltaic solder strip, comprising:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
As a further improvement of the invention: in the step S4, when the tin-plated wire is smeared with the second scaling powder through the felt, the second scaling powder is accurately metered by a metering pump.
As a further improvement of the invention: the concentration of the first soldering flux is 5-8%; the concentration of the second soldering flux is 8-10%.
As a further improvement of the invention: in step S3 or step S4, the first soldering flux and the second soldering flux are soaked or dripped instead of being smeared.
As a further improvement of the invention: in the step S3, the high temperature is 205-215 ℃; in the step S4, the low-temperature drying temperature is 60-90 ℃; in the step S5, the mixture is stored in an environment with the temperature of less than 40 ℃ and the humidity of less than 70%RH.
As a further improvement of the invention: in the step S1, the method for processing the mold includes: the oxygen-free copper round parent metal is led into a small wire drawing machine through a paying-off device, and is stretched through a series of dies and then is processed through a sizing die.
As a further improvement of the invention: in the step S2, the annealing treatment method includes: and in an inert gas environment, the yield strength and the tensile strength of the wire rod are improved by adjusting the voltage of short-circuit annealing.
As a further improvement of the invention: in the step S2, the cooling method is to cool by water cooling and then wind blowing.
The precoated photovoltaic solder strip, wherein the preparation method of the precoated photovoltaic solder strip is applied, and the precoated photovoltaic solder strip comprises a base material, a tin plating layer and a precoated soldering flux layer from inside to outside.
A device for preparing a pre-coated photovoltaic solder strip, wherein the method for preparing a pre-coated photovoltaic solder strip according to any one of the above is applied, wherein the device for preparing comprises:
paying-off device: the method is used for paying off the oxygen-free copper round parent metal;
wire drawing device: the device comprises a first guide wheel for introducing a base material, a wire stretching module for stretching the base material and a sizing module for sizing;
annealing device: comprises a short-circuit annealing part for carrying out short-circuit annealing, a cooling part for carrying out cooling treatment, and a second guide wheel for pouring the wire into the hot-dip soldering flux device;
hot-dip soldering flux coating device: the first soldering flux is used for coating the first soldering flux;
hot tinning device: comprises a tin furnace for tinning, an air knife for leveling tinning layers and a third guide wheel for guiding wires into a pre-coating soldering flux device;
precoating scaling powder device: comprises a pre-coating soldering flux part for coating a second soldering flux and a low-temperature drying part for low-temperature drying;
wire winding device: comprising a spool and a guide wheel for taking up the wire.
Compared with the prior art, the invention has the beneficial effects that:
1. the preparation method provided by the invention ensures that no soldering flux is required to be smeared when the photovoltaic solder strip is welded in a component factory, reduces the amount of VOC waste gas, is beneficial to meeting the environmental protection requirement and is beneficial to the health of staff;
2. in the precoated photovoltaic solder strip provided by the invention, in the welding process of a component factory, the precoated soldering flux layer is heated and activated, so that the surface tension of solder is reduced, and molten solder wets and spreads on the battery piece coating to realize reliable welding;
3. the precoated photovoltaic solder strip provided by the invention has the advantages that the precoated soldering flux is controlled by the quantitative smearing device, the smearing quantity is accurately controlled, and the problems of insufficient soldering flux or excessive air bubbles caused by insufficient soldering flux in the process of welding in a component factory are avoided;
4. the precoated photovoltaic solder strip provided by the invention comprises a base material, a tin plating layer and a precoated soldering flux layer, and can be continuously produced by photovoltaic solder strip production equipment.
Drawings
FIG. 1 is a schematic of the workflow of the present invention.
Fig. 2 is a schematic diagram of the structural connection of the present invention.
FIG. 3 is a schematic view of a portion of the structure of a pre-coated flux of the present invention.
Fig. 4 is a schematic cross-sectional structure of a pre-coated photovoltaic solder strip of the present invention.
Reference numerals illustrate:
1-paying-off device; 2-wire drawing device; 21-a first guide wheel; 22-a wire stretching module; 23-sizing die; 3-annealing means; 31-short circuit annealing section; 32-a second guide wheel; 33-a cooling section; 4-hot-dip soldering flux coating device; 41-hot dip soldering flux application part; 5-hot tinning device; 51-tin furnace; 52-an air knife; 53-a third idler; 6-a pre-coating soldering flux device; 61-pre-coat the flux portion; 62-a low-temperature drying part; 611-felt; 612—a metering pump; 613-a soldering flux storage bin; 7-a wire winding device; 71-a spool; 72-fourth guide wheels; 100-substrate 100, 101-tin plating; 102-pre-coating a flux layer.
Detailed Description
The invention will now be further described with reference to the accompanying drawings and examples:
embodiment one:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In the embodiment, the oxygen-free copper round base metal is used as a raw material for preparing the pre-coated photovoltaic solder strip, and is subjected to die processing in the step S1 to be drawn, rolled and shaped, so that a wire with the external dimension consistent with that of the finished photovoltaic solder strip, namely a high-precision bare copper wire, is obtained. In step S2, the high-precision bare copper wire is annealed, that is, the voltage of short-circuit annealing is adjusted to make the wire increase its yield strength and tensile strength, and cooling and drying are performed after annealing to facilitate subsequent flux application. In step S3, the surface of the annealed wire is coated with the first scaling powder, the first scaling powder is a scaling powder with smaller concentration, the first scaling powder volatilizes fast, the subsequent tinning step is not affected, the purpose of coating the first scaling powder is to clean dirt and oxide layers on the surface of the wire, the annealed wire is tinned at high temperature, and the first scaling powder is coated on the surface before the annealing wire, so that the surface of the annealed wire is cleaner and better attached to the tinned layer 101, and then the surface of the tinned layer 101 is trimmed to obtain the tinned layer 101 with the required thickness. In step S4, the tin-plated wire after the tin plating step is coated with a second soldering flux through the felt 611, the second soldering flux is different from the first soldering flux in type, the second soldering flux is a soldering flux with higher concentration, namely, a soldering flux with higher film forming content, a precoating soldering flux layer 102 is formed on the surface of the coated second soldering flux wire, the layer has higher decomposition temperature and certain mechanical strength at normal temperature, and the layer is quickly decomposed when being used by a subsequent customer, thereby helping to finish welding, and the precoating soldering flux layer 102 can be further helped to be quickly formed by low-temperature drying. Finally, in step S5, the molded product is vacuum-preserved.
Embodiment two:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, in step S4, when the tin-plated wire is coated with the second flux through the felt 611, the second flux is accurately added by means of the metering pump 612.
Furthermore, through accurate control of the coating amount, the problem of insufficient soldering flux to cause cold joint or excessive soldering flux to cause bubbles during soldering in a component factory is avoided.
Specifically, in this embodiment, the solder strip after hot tinning needs to be coated in a second flux coating device with precisely controlled amount (i.e. a pre-coating flux device 6), unlike immersion or common coating, two felts 611 (or other similar functional materials) are used for clamping, and the clamping force is adjustable; with the metering pump 612, the flux is dripped from the inlet end and replenished from top to bottom. The advantage is that the high temperature brought by the wire rod at the inlet can avoid the solvent of the soldering flux to volatilize too fast, so that the soldering flux is crystallized; at the same time, the coating amount of the scaling powder is controlled by a metering pump 612 so that the scaling powder forms a film and is attached to the wire rod in an amount of 2-20 mg/cm 2 . It should be emphasized that the second soldering flux in step S4 and step S3 is different from the first soldering flux in the variety, and the second soldering flux in step S4 is used as a component of the pre-coated photovoltaic solder strip, and needs to be reserved to the client, so that the second soldering flux is completely decomposed and volatilized when being used by the client. The second soldering flux has higher content of film forming part, higher decomposition temperature and certain mechanical strength at normal temperature, can keep other effective components (activating agent and surfactant) on the wire rod, and is not easy to lose. And the metal surface is quickly decomposed during high-temperature welding, the released activating agent activates the metal surface, and the surface tension of the solder is reduced by the surfactant, so that the welding is smoothly finished.
Embodiment III:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, based on the first embodiment, the concentration of the first flux is set to 5 to 8%; the concentration of the second soldering flux is 8-10%.
Embodiment four:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, based on the first embodiment, in step S3 or step S4, the first soldering flux and the second soldering flux are soaked or dripped instead of being applied.
In this embodiment, in the step S3, after the annealed wire is cooled and dried by the device, the annealed wire is introduced into the device for applying the first scaling powder, the wire passes through the device to ensure sufficient contact with the scaling powder, and because the scaling powder is a liquid with very small surface tension, the scaling powder can be quickly wetted and spread on the surface of the wire, and the two first scaling powders are also liquids with low concentration, so that the first scaling powder plays a role in cleaning dirt and oxide layers on the surface of the wire, and the scaling powder can be added in a soaking or dripping manner.
In this embodiment, in the step S3, the wire after the cleaning and activation of the first flux is drawn into the molten tin bath, the hot tinning carry-over amount is 3 to 50 g/m, and the thickness of the tin plating layer 101 is trimmed by the air knife 52 to be 5 to 35 μm.
Fifth embodiment:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, in step S3, the high temperature is 205-215 ℃; in the step S4, the low-temperature drying temperature is 60-90 ℃; in the step S5, the mixture is stored in an environment with the temperature of less than 40 ℃ and the humidity of less than 70%RH.
In this embodiment, in step S4, the solder strip pre-coated with the second flux is further subjected to low-temperature drying by a low-temperature drying device (according to different flux types, the highest temperature should not decompose or volatilize the film forming component rapidly), and then is wound and taken off. In step S5, vacuum packaging is required after winding (i.e. winding and winding down the production line), and the vacuum packaging is stored in a constant temperature and constant humidity room, so that pollution, surface solder oxidation, pre-coating scaling powder decomposition and the like are prevented, and the use effect of a customer is affected.
Example six:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, based on the first embodiment, in the step S1, the method for processing the mold includes: the oxygen-free copper round parent metal is led into a small wire drawing machine through a paying-off device 1, and is stretched through a series of dies and then is processed through a sizing die 23. The paying-off device 1 is adopted, the large oxygen-free copper round base metal with fixed specification is butted to the drawing and calendaring device, after a series of dies are drawn or calendared to the required specification and size of the product, one sizing die 23 is used for shaping and outputting wires with the external dimensions consistent with those of the finished photovoltaic solder strip, so that the production of various specification photovoltaic solder strip products by copper rods of the base metal with one specification can be realized, and the stock quantity of raw materials is reduced.
Embodiment seven:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, based on the first embodiment, in the step S2, the annealing treatment method is as follows: and in an inert gas environment, the yield strength and the tensile strength of the wire rod are improved by adjusting the voltage of short-circuit annealing. The wire rod formed by drawing or calendaring can eliminate cold work hardening through the annealing device 3, reduce the yield strength of the wire rod to a reasonable range, and ensure that the final welding strip is suitable for a component welding process.
Example eight:
the embodiment provides a preparation method of a precoated photovoltaic solder strip shown in fig. 1, which comprises the following steps:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt 611, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
In this embodiment, in the first embodiment, in the step S2, the cooling method is to cool by water and then cool by wind blowing.
Example nine:
the present embodiment provides a device for preparing a pre-coated photovoltaic solder strip as shown in fig. 2-3, wherein the method for preparing a pre-coated photovoltaic solder strip according to any one of the above embodiments one to fifth is applied, and the device for preparing a pre-coated photovoltaic solder strip comprises:
pay-off device 1: the method is used for paying off the oxygen-free copper round parent metal;
wire drawing device 2: comprises a first guide wheel 21 for introducing a base material, a wire stretching module 22 for stretching the base material and a sizing module 23 for sizing; the first guide wheel 21, the wire stretching module 22 and the sizing module 23 are connected in sequence;
annealing device 3: comprises a short annealing part 31 for performing short annealing, a cooling part 33 for performing cooling treatment, and a second guide wheel 32 for pouring the wire into the hot-dip soldering flux device; the front end of the short-circuit annealing part 31 is connected with the sizing die 23, the rear end of the short-circuit annealing part 31 is connected with the cooling part 33, the cooling part 33 is connected with the second guide wheel 32, and the second guide wheel 32 is connected with the hot-dip soldering flux coating device 4;
hot-dip soldering flux coating device 4: the first soldering flux is used for coating the first soldering flux; the soldering flux is applied through the hot-dip soldering flux applying portion 41;
hot tinning device 5: comprises a tin furnace 51 for tinning, an air knife 52 for leveling the tinning layer 101 and a third guide wheel 53 for guiding the wire into the pre-coating flux device 6; one end of a tin furnace 51 is connected with the hot-dip soldering flux coating device 4, the other end of the tin furnace 51 is sequentially connected with an air knife 52 and a third guide wheel 53, and the third guide wheel 53 is connected with the pre-coating soldering flux device 6;
precoating flux device 6: comprises a pre-coating soldering flux part 61 for coating a second soldering flux and a low-temperature drying part 62 for low-temperature drying; the third guide wheel 53 is connected with the pre-coating soldering flux part 61, the pre-coating soldering flux part 61 is connected with the low temperature drying part 62, wherein the pre-coating soldering flux part 61 is provided with a soldering flux storage bin 613, a metering pump 612 and a felt 611, the three parts are sequentially connected, the second soldering flux in the soldering flux storage bin 613 is controlled by the metering pump 612, drips from the wire inlet end to the felt 611 from top to bottom and is automatically replenished, and the felt 611 clamps a wire by adopting two felts 611 with adjustable clamping force.
Wire winding device 7: including a spool 71 for take-up and a fourth guide wheel 72.
In this embodiment, as shown in fig. 3, the paying-off device 1, the wire drawing device 2, the annealing device 3, the hot-dip soldering flux applying device 4, the hot-dip soldering device 5, the pre-dip soldering flux applying device 6 and the wire collecting device 7 are sequentially connected, wherein the paying-off device 1 and the wire drawing device 2 are used for executing step S1 in the first embodiment, the annealing device 3 is used for executing step S2, the hot-dip soldering flux applying device and the hot-dip soldering device 5 are used for executing step S3, the pre-dip soldering flux applying device 6 is used for executing step S4, and the wire collecting device 7 is used for executing step S5.
Example ten:
the embodiment provides a method for preparing a precoated photovoltaic solder strip as shown in fig. 1-3, which further optimizes and improves the steps based on the devices in the first embodiment and the ninth embodiment, and comprises the following steps:
step one: taking an oxygen-free copper round parent metal with the diameter of 0.638mm, and introducing the oxygen-free copper round parent metal into a small wire drawing machine 2 through a rotary paying-off device 11. After passing through a series of wire stretching modules 22, passing through a sizing die 23 to obtain high-precision bare copper wires with the specification of 0.26;
step two: the wire with the specification phi of 0.26 is led into an annealing device 3, the yield strength of the wire reaches 68MPa by adjusting the voltage of a short-circuit annealing part 31, and meanwhile, the tensile strength is more than 150MPa, and the short-circuit annealing part 31 needs to be filled with inert gas for protection so as to prevent the oxidation of the wire;
step three: the annealed wires are led into a cooling part 33, and are led into a hot-dip soldering flux coating device 4 through a second guide wheel 32 after being cooled by water and blown and dried;
step four: in the hot-dip soldering flux applying apparatus 4, flux is used, the surface of the bare copper wire is coated and activated by the hot-dip soldering flux applying portion 41, and the concentration of the flux is selected to be 5-8%;
step five: the bare wire coated with the soldering flux enters a molten tin furnace 51, the temperature of a tin bath is set to 205-215 ℃, a tin plating layer 101 is trimmed by an air knife 52, and the thickness is controlled to be 10-20 microns;
step six: after tinning, the solder strip passes through a third guide wheel 53 and enters a pre-coating soldering flux device 6, in a pre-coating soldering flux part 61, the accurate addition is realized by a metering pump 612, soldering flux with the concentration of 8-10% is used, a felt 611 is coated, and then the soldering flux is dried at the temperature of 60-90 ℃ through a low-temperature drying part 62;
step seven: after the precoated soldering flux is dried and formed into a film, the film is introduced into a winding device through a fourth guide wheel 72 and is contained in an I-shaped spool 71;
step eight: the offline precoated photovoltaic solder strip needs to be vacuumized and packaged, and then stored in a warehouse at the temperature of <40 ℃ and in the RH of < 70%.
Example eleven:
the present embodiment provides a pre-coated photovoltaic solder strip as shown in fig. 4, wherein the method for preparing a pre-coated photovoltaic solder strip according to any one of the above embodiments one to eight and embodiment ten is applied, wherein the pre-coated photovoltaic solder strip sequentially comprises a substrate 100, a tin plating layer 101 and a pre-coated flux layer 102 from inside to outside.
In this embodiment, the photovoltaic solder strip of precoating can be produced by production facility continuous production, when the welding of subassembly factory, need not to paint scaling powder, reduces VOC waste gas production volume, is favorable to satisfying the environmental protection requirement, also is favorable to staff healthy. In the welding process of a component factory, the pre-coating soldering flux layer 102 is heated and activated, the surface tension of solder is reduced, molten solder wets and spreads on the battery piece coating, reliable welding is realized, the pre-coating soldering flux is controlled by a quantitative smearing device, the smearing quantity is accurately controlled, and the problems of insufficient soldering flux or excessive air bubbles during the welding of the component factory are avoided.
In this embodiment, the substrate 100 in the pre-coated photovoltaic solder strip is any of pure copper or an alloy thereof, and the shape may be a circle or other shapes. The thickness of the tin plating layer 101 is 5-35 micrometers; the amount of the pre-coating soldering flux layer 102 is%2～20)mg/cm 2 。
In this embodiment, the substrate 100 functions to conduct electricity. Tin coating 101 is primarily a binary or ternary alloy of tin (e.g., snPb, snBi, snAgBi, etc.), and acts as two: one is to protect the substrate 100 copper from oxidation and the other is to solder the grid lines on the panel of the photovoltaic cell. The pre-coating flux layer 102 is composed of a solvent, an activator, a surfactant, a viscosity-adjusting and film-forming part, and the like, and is an organic flux, and has the main functions of activating the contacted metal surface during high-temperature welding, reducing the surface tension, improving the wetting force, and enabling the solder (tin) to be welded smoothly.
The main functions of the invention are as follows: the method is applied to various photovoltaic solder strips, the preparation device, or the preparation method and the preparation device of the tin-coated solder strips, and the steps of coating the flux on the photovoltaic solder strips or the tin-coated solder strips can be avoided in welding by matching the corresponding treatment steps and environment setting through the two steps of coating the flux with different concentrations, so that the solder strips are more convenient and simple to use, waste liquid and waste residues generated in welding are reduced, and the equipment maintenance time is shortened.
In the description of the present invention, it should be noted that the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the term "connected" should be interpreted broadly, and for example, it may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In view of the above, after reading the present document, those skilled in the art should make various other corresponding changes without creative mental effort according to the technical scheme and the technical conception of the present invention, which are all within the scope of the present invention.
Claims (10)
1. The preparation method of the precoated photovoltaic solder strip is characterized by comprising the following steps of:
s1: processing the oxygen-free copper round base metal by a die to obtain a high-precision bare copper wire;
s2: cooling and drying the high-precision bare copper wire after annealing treatment to obtain an annealed wire;
s3: coating a first soldering flux on the surface of the annealed wire rod, then carrying out surface tin plating on the annealed wire rod at a high temperature, and carrying out surface finishing after tin plating to obtain a tin-plated wire rod;
s4: coating a second scaling powder on the tinned wire through a felt, and then drying at a low temperature to obtain a film-forming welding strip;
s5: and (5) winding the film-forming welding strip, taking off the film-forming welding strip, and vacuumizing for storage.
2. The method for preparing a precoated photovoltaic solder strip according to claim 1, wherein in step S4, when the tin-plated wire is coated with the second flux through the felt, the second flux is accurately added by means of a metering pump.
3. The method for preparing a precoated photovoltaic solder strip according to claim 1, wherein the concentration of the first soldering flux is 5-8%; the concentration of the second soldering flux is 8-10%.
4. The method of manufacturing a pre-coated photovoltaic solder strip according to claim 1, wherein in step S3 or step S4, the first flux and the second flux are applied instead by dipping or dripping.
5. The method for producing a pre-coated photovoltaic solder strip according to claim 1, wherein in the step S3, the high temperature is 205-215 ℃; in the step S4, the low-temperature drying temperature is 60-90 ℃; in the step S5, the mixture is stored in an environment with the temperature of less than 40 ℃ and the humidity of less than 70%RH.
6. The method for preparing a pre-coated photovoltaic solder strip according to claim 1, wherein in the step S1, the method for processing the mold is as follows: the oxygen-free copper round parent metal is led into a small wire drawing machine through a paying-off device, and is stretched through a series of dies and then is processed through a sizing die.
7. The method for preparing a pre-coated photovoltaic solder strip according to claim 1, wherein in the step S2, the annealing treatment method is as follows: and in an inert gas environment, the yield strength and the tensile strength of the wire rod are improved by adjusting the voltage of short-circuit annealing.
8. The method for preparing a pre-coated photovoltaic solder strip according to claim 1, wherein in the step S2, the cooling method is to cool by water and then by wind blowing.
9. A pre-coated photovoltaic solder strip, characterized in that a method for preparing a pre-coated photovoltaic solder strip according to any of the preceding claims 1 to 8 is applied, wherein the pre-coated photovoltaic solder strip comprises a substrate, a tin plating layer and a pre-coated soldering flux layer in order from inside to outside.
10. A device for preparing a pre-coated photovoltaic solder strip, characterized in that a method for preparing a pre-coated photovoltaic solder strip according to any of the preceding claims 1-8 is applied, wherein the preparation device comprises:
paying-off device: the method is used for paying off the oxygen-free copper round parent metal;
wire drawing device: the device comprises a first guide wheel for introducing a base material, a wire stretching module for stretching the base material and a sizing module for sizing;
annealing device: comprises a short-circuit annealing part for carrying out short-circuit annealing, a cooling part for carrying out cooling treatment, and a second guide wheel for pouring the wire into the hot-dip soldering flux device;
hot-dip soldering flux coating device: the first soldering flux is used for coating the first soldering flux;
hot tinning device: comprises a tin furnace for tinning, an air knife for leveling tinning layers and a third guide wheel for guiding wires into a pre-coating soldering flux device;
precoating scaling powder device: comprises a pre-coating soldering flux part for coating a second soldering flux and a low-temperature drying part for low-temperature drying;
wire winding device: comprising a spool for taking up the wire and a fourth guide wheel.
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|---|---|---|---|
| CN202310774007.8A CN116705886A (en) | 2023-06-28 | 2023-06-28 | Preparation method of precoated photovoltaic solder strip, precoated photovoltaic solder strip and preparation device |
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| CN202310774007.8A CN116705886A (en) | 2023-06-28 | 2023-06-28 | Preparation method of precoated photovoltaic solder strip, precoated photovoltaic solder strip and preparation device |
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