CN116669395A - Water cooling system for testing optical module - Google Patents

Abstract

The application provides a water cooling system for testing an optical module, and relates to the technical field of digital communication. The box body of the water cooling system is provided with a water inlet and a water outlet, the first water cooling loop is arranged in the box body and connected with the water inlet and the water outlet, the water cooling loop comprises at least one first heat exchange plate and a first driving part which are sequentially connected, and the first driving part is used for enabling cooling liquid to flow in the first water cooling loop. At least one group of semiconductor refrigeration sheets has a refrigeration surface in contact with at least one first heat exchange plate for exchanging heat with a cooling liquid in at least the first heat exchange plate. According to the technical scheme, the semiconductor refrigerating piece is used for refrigerating the cooling liquid in the first water cooling loop, compared with the water cooling machine, noise and vibration can be reduced, a more comfortable working environment is provided, and compared with the water cooling machine, the semiconductor refrigerating piece has a smaller size, so that the water cooling system has great flexibility and convenience.

Description

Water cooling system for testing optical module

Technical Field

The application relates to the technical field of digital communication, in particular to a water cooling system for testing an optical module.

Background

With the development of the information age, the data flow is increasingly huge, and in order to cope with the huge data flow, the processing capacity of the semiconductor device is also increasingly stronger, and the power of the semiconductor device corresponding to the processing capacity is also increasingly higher.

During the actual use of the semiconductor device, the overheating of the semiconductor device may greatly affect the performance of the semiconductor device. In the cooling mode of forced convection of the fan, the large cooling capacity is provided by simply relying on the high-power fan and the larger-sized cooling fins, which is limited by noise and the size of the cooling fins. This is not possible if the temperature of the semiconductor device needs to be controlled below zero.

In the burn-in process of semiconductor chips, in order to balance the power consumption of the semiconductor chips, the test temperature is controlled in a reasonable range, and more manufacturers begin to use cooling water to cool the test system of the semiconductor chips so as to take away waste heat. In the prior art, part of factories and workshops are provided with corresponding factory water pipelines, and the factory water can be utilized for radiating heat for the system. But the water temperature of the factory water is generally above 10 ℃. In some systems using TEC cooling plates to control the temperature, in order to control the temperature efficiently, especially at low temperature conditions, such as temperature conditions below-20 ℃, the water temperature of 10 ℃ cannot meet the requirement of the system for controlling the temperature efficiently. Furthermore, due to the high pressure of the service water, the design of the cooling waterway of the system will face great risks and challenges. Or a separate water cooler is used for radiating heat to the system. Although the water cooler can meet the preparation of low-temperature cooling liquid, vibration and noise of the compressor of the water cooler during working cannot meet special use environments, such as: quiet, smooth experimental/production conditions. And because of the sizes of the compressor and the evaporator, the sizes of the water cooling machines on the market are large, and the water cooling machines are used in laboratories or workshops and occupy more space.

Disclosure of Invention

An object of the present application is to provide a water cooling system for testing optical modules, which solves the technical problems of larger size and loud sound of water cooling equipment in the prior art.

Another object of the application is to meet the cooling requirements of sub-zero conditions.

According to the object of the present application, there is also provided a water cooling system for testing an optical module, comprising:

the box body is provided with a water inlet and a water outlet;

the first water cooling loop is arranged in the box body, is connected with the water inlet and the water outlet, and comprises at least one first heat exchange plate and a first driving part which are sequentially connected, wherein the first driving part is used for driving cooling liquid to flow in the first water cooling loop;

at least one group of semiconductor refrigerating sheets is provided with a refrigerating surface contacted with the at least one first heat exchange plate so as to exchange heat with the cooling liquid in the at least one first heat exchange plate.

Optionally, the method further comprises:

the second water cooling loop is arranged in the box body and comprises at least one second heat exchange plate and a second driving part which are sequentially connected, the heating surface of the at least one group of semiconductor refrigerating sheets is contacted with the at least one second heat exchange plate, and the second driving part is used for driving cooling liquid to flow in the second water cooling loop.

Optionally, the at least one second heat exchange plate and the at least one first heat exchange plate are stacked and staggered to form a water cooling module, and the top and the bottom of the water cooling module are both the second heat exchange plates.

Optionally, a group of semiconductor refrigeration sheets are respectively arranged between each first heat exchange plate and the second heat exchange plate of the upper layer and between each first heat exchange plate and the second heat exchange plate of the lower layer.

Optionally, the refrigerating surface of each group of the semiconductor refrigerating sheets covers one side of the first heat exchange plate contacted with the refrigerating surface of each group of the semiconductor refrigerating sheets covers one side of the second heat exchange plate contacted with the refrigerating surface of each group of the semiconductor refrigerating sheets.

Optionally, the second water cooling circuit further includes a heat dissipation wind row connected to the at least one second heat exchange plate and the second driving part, and the water cooling system further includes:

at least one cooling fan is arranged adjacent to the cooling air row to dissipate heat of the cooling liquid entering the cooling air row.

Optionally, the first heat exchange plate and/or the second heat exchange plate has a cooling liquid inlet and a cooling liquid outlet, and at least one channel communicating the cooling liquid inlet and the cooling liquid outlet is formed inside the first heat exchange plate and/or the second heat exchange plate, and the at least one channel is arranged in a curved shape.

Optionally, the number of the at least one channel is two, and two channels are arranged in parallel.

Optionally, the at least one channel is straight tubular or wavy.

Optionally, the method further comprises:

and the heat preservation part is wrapped on the outer side of the pipeline of the first water cooling loop and the outer side of the first driving part.

The box body of the water cooling system is provided with a water inlet and a water outlet, the first water cooling loop is arranged in the box body and connected with the water inlet and the water outlet, the water cooling loop comprises at least one first heat exchange plate and a first driving part which are sequentially connected, and the first driving part is used for enabling cooling liquid to flow in the first water cooling loop. At least one group of semiconductor refrigeration sheets has a refrigeration surface in contact with at least one first heat exchange plate for exchanging heat with a cooling liquid in at least the first heat exchange plate. According to the technical scheme, the semiconductor refrigerating piece is used for refrigerating the cooling liquid in the first water cooling loop, compared with the water cooling machine, noise and vibration can be reduced, a more comfortable working environment is provided, and compared with the water cooling machine, the semiconductor refrigerating piece has a smaller size, so that the water cooling system has great flexibility and convenience.

Further, the second water cooling loop comprises at least one second heat exchange plate and a second driving part which are sequentially connected, the heating surface of at least one group of semiconductor refrigerating sheets is contacted with the at least one second heat exchange plate, and the second driving part is used for driving cooling liquid to flow in the second water cooling loop. According to the embodiment, the second heat exchange plate is arranged to radiate heat on the heating surface of the semiconductor refrigeration piece, so that the temperature difference of the cooling surface and the heating surface of the semiconductor refrigeration piece can be reduced, the cooling surface of the semiconductor refrigeration piece is rapidly at minus-DEG C, and the cooling requirement of minus-DEG C is met.

The above, as well as additional objectives, advantages, and features of the present application will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present application when read in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the application will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:

FIG. 1 is a schematic block diagram of a water cooling system for light module testing according to one embodiment of the application;

FIG. 2 is a schematic block diagram of a first cooling circuit and a second cooling circuit in the water cooling system shown in FIG. 1;

FIG. 3 is a schematic block diagram of a water cooling module in the water cooling system of FIG. 2 at an angle;

FIG. 4 is a schematic block diagram of another angle of the water cooling module in the water cooling system shown in FIG. 2;

FIG. 5 is a schematic cross-sectional view of a water cooling module in the water cooling system shown in FIG. 2;

FIG. 6 is a schematic cross-sectional view of a first heat exchanger plate in the water cooling module shown in FIG. 2;

fig. 7 is a schematic cross-sectional view of a second heat exchange plate in the water cooling module shown in fig. 2.

Reference numerals:

100-water cooling system, 11-box, 12-water inlet, 13-water outlet, 20-first water cooling loop, 30-water cooling module, 40-second water cooling loop, 50-power supply unit, 60-radiator fan, 21-first driving part, 31-first heat exchange plate, 32-second heat exchange plate, 33-upper cover plate, 34-lower cover plate, 35-first pipeline, 36-semiconductor refrigerating sheet, 311-first outlet, 312-first inlet, 313-first channel, 321-second outlet, 323-second inlet, 322-third inlet, 324-third outlet, 325-second channel.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.

In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature, i.e. one or more such features. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. When a feature "comprises or includes" a feature or some of its coverage, this indicates that other features are not excluded and may further include other features, unless expressly stated otherwise.

Unless specifically stated and limited otherwise, the term "coupled" and the like are to be construed broadly and may be, for example, fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. Those of ordinary skill in the art will understand the specific meaning of the terms described above in the present application as the case may be.

Unless otherwise defined, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

Fig. 1 is a schematic block diagram of a water cooling system 100 for testing an optical module according to an embodiment of the present application, fig. 2 is a schematic block diagram of a first cooling circuit and a second cooling circuit in the water cooling system 100 shown in fig. 1, fig. 3 is a schematic block diagram of one angle of a water cooling module 30 in the water cooling system 100 shown in fig. 2, and fig. 4 is a schematic block diagram of another angle of the water cooling module 30 in the water cooling system 100 shown in fig. 2. As shown in fig. 1 to 4, in this embodiment, a water cooling system 100 for optical module testing includes a tank 11, a first water cooling circuit 20, and at least one set of semiconductor refrigeration sheets 36. Wherein the tank 11 has a water inlet 12 and a water outlet 13. The first water cooling circuit 20 is disposed in the tank 11 and connected to the water inlet 12 and the water outlet 13, and includes at least one first heat exchange plate 31 and a first driving member 21 sequentially connected, and the first driving member 21 is used for driving the coolant to flow in the first water cooling circuit 20. At least one group of semiconductor cooling fins 36 has a cooling surface in contact with at least one first heat exchange plate 31 for exchanging heat with the cooling liquid in at least the first heat exchange plate 31. Here, the water inlet 12 and the water outlet 13 of the case 11 are connected with the testing device of the optical module, so that the cooling liquid is supplied to the testing device of the optical module to cool the testing device of the optical module. The first driving part 21 is a water pump.

The embodiment uses the semiconductor refrigeration sheet 36 to cool the cooling liquid in the first water cooling circuit 20, can reduce noise and vibration compared with a water cooling machine, provides a more comfortable working environment, and has a smaller size compared with the water cooling machine, so that the water cooling system 100 has great flexibility and convenience.

In this embodiment, the water cooling system 100 further includes a second water cooling circuit 40 disposed in the tank 11, and the second water cooling circuit 40 includes at least one second heat exchange plate 32 and a second driving member sequentially connected, and the heating surfaces of at least one group of semiconductor refrigeration sheets 36 are in contact with the at least one second heat exchange plate 32, and the second driving member is used for driving the cooling liquid to flow in the second water cooling circuit 40. Here, the second water-cooling circuit 40 serves to dissipate heat from the semiconductor cooling fin 36, thereby taking away heat from the semiconductor cooling fin 36.

In this embodiment, by providing the second heat exchange plate 32 to dissipate heat of the heating surface of the semiconductor refrigeration sheet 36, the temperature difference of the cooling surface of the semiconductor refrigeration sheet 36 can be reduced, so that the cooling surface of the semiconductor refrigeration sheet 36 is rapidly at minus celsius, and the cooling requirement of the minus condition is satisfied. And the cooling liquid in the first water cooling circuit 20 and the second water cooling circuit 40 is isolated from the ambient air in this embodiment, heat exchange and condensation can be avoided.

Fig. 5 is a schematic cross-sectional view of the water cooling module 30 in the water cooling system 100 shown in fig. 2. As shown in fig. 5, and referring to fig. 3 and 4, in a preferred embodiment, at least one second heat exchange plate 32 is laminated and staggered with at least one first heat exchange plate 31 to form a water cooling module 30, with the top and bottom of the water cooling module 30 being the second heat exchange plates 32. Here, the stacked and staggered arrangement may be understood as that at least one second heat exchange plate 32 and at least one first heat exchange plate 31 are arranged in order from top to bottom, and the first heat exchange plates 31 and the second heat exchange plates 32 are arranged one by one with a space therebetween, which may save an arrangement space.

In this embodiment, the water cooling module 30 further includes an upper cover plate 33 and a lower cover plate 34, the upper cover plate 33 is disposed at the top of the water cooling module 30, and the lower cover plate 34 is disposed at the bottom of the water cooling module 30. The upper cover plate 33 and the lower cover plate 34 are connected by a plurality of bolts.

In this embodiment, the number of the at least one second heat exchange plates 32 is two, the number of the at least one first heat exchange plate 31 is one, and the two second heat exchange plates 32 are respectively arranged on the upper and lower sides of the first heat exchange plate 31 and are connected to each other. In other embodiments, the number of the second heat exchange plates 32 and the first heat exchange plates 31 may be set according to specific design requirements, for example, the number of the second heat exchange plates 32 may be set to three, the three second heat exchange plates 32 may be connected to each other, the number of the first heat exchange plates 31 may be set to two, and the two first heat exchange plates 31 may be connected to each other.

In this embodiment, a set of semiconductor cooling fins 36 is provided between each first heat exchange plate 31 and the second heat exchange plate 32 of the upper layer and between each first heat exchange plate and the second heat exchange plate 32 of the lower layer. It will be understood that if the number of the second heat exchange plates 32 is two and the number of the first heat exchange plates 31 is one, the number of the semiconductor cooling fins 36 is two, and the two semiconductor cooling fins 36 are disposed on the upper side and the lower side of the first heat exchange plates 31, respectively. If the number of the second heat exchange plates 32 is three and the number of the first heat exchange plates 31 is two, the number of the semiconductor refrigeration sheets 36 is four. That is, the number of groups of the semiconductor cooling fins 36 is determined according to the number of the first heat exchange plates 31, and two groups of the semiconductor cooling fins 36 are arranged for each of the first heat exchange plates 31. Here, the cooling surfaces of the semiconductor cooling plates 36 are all in contact with the first heat exchange plate 31, and the heating surfaces of the semiconductor cooling plates 36 are all in contact with the second heat exchange plate 32, so that the cooling surfaces of the semiconductor cooling plates 36 cool the cooling liquid in the first heat exchange plate 31, and the cooling liquid in the second heat exchange plate 32 cools the heating surfaces of the semiconductor cooling plates 36. Referring to fig. 5, the semiconductor cooling fin 36 located at the upper side of the first heat exchange plate 31 has a top portion as a heating surface and a bottom portion as a cooling surface. The top of the semiconductor refrigerating sheet 36 located at the lower side of the first heat exchange plate 31 is a refrigerating surface, and the bottom is a heating surface.

In this embodiment, the outer dimensions of the first heat exchanger plate 31 and the second heat exchanger plate 32 are identical, so that the first heat exchanger plate 31 and the second heat exchanger plate 32 can be arranged to overlap entirely. In this embodiment, the number of the semiconductor cooling fins 36 of each group is three, wherein three semiconductor cooling fins 36 of one group are sequentially arranged on the upper side of the first heat exchange plate 31, and three semiconductor cooling fins 36 of the other group are sequentially arranged on the lower side of the first heat exchange plate 31 to provide at least 300W of cooling capacity.

In this embodiment, the cooling surface of each group of semiconductor cooling fins 36 covers one side of the first heat exchange plate 31 with which it is in contact, and the heating surface of each group of semiconductor cooling fins 36 covers one side of the second heat exchange plate 32 with which it is in contact. It can be understood that the external dimension of each group of semiconductor refrigeration sheets 36 is consistent with the external dimension of the first heat exchange plate 31, so that the semiconductor refrigeration sheets 36 can be fully contacted with the first heat exchange plate 31 and the second heat exchange plate 32 to exchange heat between the cooling liquid in the first heat exchange plate 31 and the cooling liquid in the second heat exchange plate 32, thereby improving the heat exchange effect. In other embodiments, the number of semiconductor refrigeration tablets 36 per set may also be set according to specific design requirements. For example, the setting may be made according to the outer dimensions of the first heat exchange plate 31 and the second heat exchange plate 32. The larger the outer dimensions of the first heat exchange plate 31 and the second heat exchange plate 32, the larger the number of semiconductor cooling fins 36 per group, and the smaller the outer dimensions of the first heat exchange plate 31 and the second heat exchange plate 32, the smaller the number of semiconductor cooling fins 36 per group.

In this embodiment, the first heat exchange plate 31 has a first inlet 312 and a first outlet 311, wherein the first inlet 312 is connected to the water inlet 12 of the case 11, the first outlet 311 is connected to the first driving part 21, and the first driving part 21 is further connected to the water outlet 13 of the case 11, so as to form a first cooling circuit, so that the cooling liquid flowing out of the testing device of the optical module enters the first heat exchange plate 31 through the water inlet 12 and the first inlet 312, and returns to the testing device of the optical module from the first outlet 311, the water pump and the water outlet 13 after heat exchange is completed, so as to cool the testing device of the optical module. Here, the first inlet 312 and the first outlet 311 of the first heat exchange plate 31 are located at the same side of the first heat exchange plate 31, and the second inlet 323, the second outlet 321, the third inlet 322 and the fourth outlet of the second heat exchange plate 32 are located at the same side of the second heat exchange plate 32. In other embodiments, the arrangement positions of the first inlet 312 and the first outlet 311 of the first heat exchange plate 31 may also be set according to specific design requirements.

In this embodiment, the second water cooling circuit 40 further includes a heat dissipating air row connected to the at least one second heat exchange plate 32 and the second driving part, and the water cooling system 100 further includes at least one heat dissipating fan 60, and the at least one heat dissipating fan 60 is disposed adjacent to the heat dissipating air row to dissipate heat of the cooling liquid entering the heat dissipating air row. In this embodiment, the cooling fan 60 is used to dissipate the heat of the cooling liquid in the second water-cooling circuit 40, so that the heat dissipation speed can be increased, the heat of the heating surface of the semiconductor cooling fin 36 can be taken away as soon as possible, and the temperature difference between the cooling surface and the heating surface of the semiconductor cooling fin 36 is reduced. In this embodiment, the number of the heat radiation fans 60 is three, and the three heat radiation fans 60 are arranged along the extension length of the heat radiation wind row. Here, the heat radiation fan 60 may be set according to specific heat radiation requirements, for example, may be set according to the extension length of the heat radiation air row. The longer the extension length of the heat radiation air row is, the greater the number of the heat radiation fans 60 is, and the shorter the extension length of the heat radiation air row is, the smaller the number of the heat radiation fans 60 is.

In this embodiment, the second heat exchange plate 32 above the first heat exchange plate 31 has a third inlet 322 and a third outlet 324, and the second heat exchange plate 32 below the first heat exchange plate 31 has a second inlet 323 and a second outlet 321, wherein the third outlet 324 is connected with the second inlet 323 through the first pipe 35, the third inlet 322 is connected with the second driving part through the pipe, the second outlet 321 is connected with the heat radiation wind row through the pipe, and the second driving part is also connected with the heat radiation wind row through the pipe, thereby forming a second cooling circuit. Here, the second driving part is a water pump.

Fig. 6 is a schematic cross-sectional view of the first heat exchange plate 31 in the water cooling module 30 shown in fig. 2, and fig. 7 is a schematic cross-sectional view of the second heat exchange plate 32 in the water cooling module 30 shown in fig. 2. As shown in fig. 6 and 7, in this embodiment, the first heat exchange plate 31 and/or the second heat exchange plate 32 has a coolant inlet and a coolant outlet, and at least one passage communicating the coolant inlet and the coolant outlet is formed inside the first heat exchange plate 31 and/or the second heat exchange plate 32, and the at least one passage is arranged in a curved shape. This embodiment increases the heat exchange efficiency by enlarging the contact area of the first heat exchange plate 31 and/or the second heat exchange plate 32 with the coolant by providing at least one channel in a curved arrangement.

In this embodiment, the number of at least one channel is two, the two channels being arranged in parallel. In other embodiments, the number of channels may also be set according to specific design requirements, e.g., may be set to three or four, etc. The end of each channel is connected with the inlet, and the tail of each channel is connected with the outlet.

In this embodiment, at least one of the channels is straight tubular or wavy. If the channels are provided in a wave shape, the contact area between the cooling liquid and the first heat exchange plate 31 and/or the second heat exchange plate 32 and the cooling liquid can be further enlarged, and the heat exchange efficiency can be further improved. Here, the channels in the first heat exchanger plate 31 are first channels 313 and the channels in the second heat exchanger plate 32 are second channels 325. The number of bends of the first channels 313 in the first heat exchanger plate 31 is set according to the size of the first heat exchanger plate 31 and the number of bends of the second channels 325 in the second heat exchanger plate 32 is set according to the size of the second heat exchanger plate 32.

The traditional water-cooling heat exchange plate is designed into a deep hole machining mode and a plug mode, and the machining cost is certain, but the heat exchange area of the water-cooling plate and the cooling liquid is limited by the machining process, so that the heat exchange efficiency is low. According to the embodiment, the fin type heat exchange plate is adopted, so that the heat exchange plate and the cooling liquid exchange heat in a larger area, and the heat exchange efficiency is improved.

In a preferred embodiment, the water cooling system 100 further comprises a heat preservation member, which is wrapped around the outside of the pipe of the first water cooling circuit 20 and the outside of the first driving member 21. This embodiment has excellent low-temperature protection performance, preventing condensation of the coolant inside the water tank. According to the embodiment, the pipeline through which the cooling liquid flows and the water pump are completely wrapped through the heat preservation component, contact with an environment space is avoided, heat exchange between the cooling liquid and the environment is prevented, and water vapor in the environment air is guaranteed to condense on the surfaces of the pipeline and the water pump of the cooling liquid.

In this embodiment, the water cooling system 100 further includes a power supply device 50, and the power supply device 50 is disposed in the case 11 for supplying power to the first driving part 21, the second driving part, and the cooling fan 60.

The overall dimensions of the housing 11 in this embodiment are designed according to the minimum width and depth dimensions of a standard telecommunications cabinet, with a width of less than 450mm, a depth of less than 500mm, and a height of less than 4U/178mm. In particular, in some application scenarios built based on standard communication cabinets, this size has great flexibility and convenience.

Compared with a circulating water heat exchange unit which is simply cooled by air, the embodiment can rapidly provide cooling liquid with lower temperature, namely subzero cooling liquid, take away more heat on the testing device of the optical module, reduce the temperature difference of the cold and hot surfaces of the semiconductor refrigerating sheets 36, and enable the refrigerating surfaces of the semiconductor refrigerating sheets 36 to be rapidly at subzero ℃, so that the testing device of the optical module can reach the set temperature more rapidly and be stably maintained at the set temperature.

In this embodiment, the first water cooling circuit 20 and the second water cooling circuit 40 are independent, the first water cooling circuit 20 is in circuit with an external unit, so that heat in the external unit is transferred to the inside of the box 11 of the water cooling system 100, and the semiconductor refrigeration sheet 36 is used to cool the cooling liquid, so that the low-temperature cooling liquid cools the external unit, and the temperature is maintained within a certain range. The second water cooling circuit 40 performs forced air cooling on the heat dissipation air row through the heat dissipation fan 60, so that heat of the heating surface of the semiconductor refrigeration sheet 36 is continuously taken away.

By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the application have been shown and described herein in detail, many other variations or modifications of the application consistent with the principles of the application may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the application. Accordingly, the scope of the present application should be understood and deemed to cover all such other variations or modifications.

Claims (10)

1. A water cooling system for testing an optical module, comprising:

the box body is provided with a water inlet and a water outlet;

the first water cooling loop is arranged in the box body, is connected with the water inlet and the water outlet, and comprises at least one first heat exchange plate and a first driving part which are sequentially connected, wherein the first driving part is used for driving cooling liquid to flow in the first water cooling loop;

at least one group of semiconductor refrigerating sheets is provided with a refrigerating surface contacted with the at least one first heat exchange plate so as to exchange heat with the cooling liquid in the at least one first heat exchange plate.

2. The water cooling system of claim 1, further comprising:

the second water cooling loop is arranged in the box body and comprises at least one second heat exchange plate and a second driving part which are sequentially connected, the heating surface of the at least one group of semiconductor refrigerating sheets is contacted with the at least one second heat exchange plate, and the second driving part is used for driving cooling liquid to flow in the second water cooling loop.

3. The water cooling system of claim 2, wherein the water cooling system comprises a water cooling system,

the at least one second heat exchange plate and the at least one first heat exchange plate are stacked and staggered to form a water cooling module, and the top and the bottom of the water cooling module are both the second heat exchange plates.

4. A water cooling system according to claim 3, wherein,

and a group of semiconductor refrigerating sheets are respectively arranged between each first heat exchange plate and the second heat exchange plate of the upper layer and between each first heat exchange plate and the second heat exchange plate of the lower layer.

5. The water cooling system of claim 4, wherein the water cooling system comprises a water cooling system,

the refrigerating surface of each group of semiconductor refrigerating sheets covers one side of the first heat exchange plate contacted with the refrigerating surface of each group of semiconductor refrigerating sheets, and the heating surface of each group of semiconductor refrigerating sheets covers one side of the second heat exchange plate contacted with the refrigerating surface of each group of semiconductor refrigerating sheets.

6. The water cooling system of any one of claims 2-5, wherein the second water cooling circuit further comprises a heat dissipating row connected to the at least one second heat exchange plate and the second drive component, the water cooling system further comprising:

at least one cooling fan is arranged adjacent to the cooling air row to dissipate heat of the cooling liquid entering the cooling air row.

7. The water cooling system according to any one of claim 2 to 5, wherein,

the first heat exchange plate and/or the second heat exchange plate are/is provided with a cooling liquid inlet and a cooling liquid outlet, at least one channel which is communicated with the cooling liquid inlet and the cooling liquid outlet is formed in the first heat exchange plate and/or the second heat exchange plate, and the at least one channel is arranged in a bending mode.

8. The water cooling system of claim 7, wherein the water cooling system comprises a water cooling system,

the number of the at least one channel is two, and the two channels are arranged in parallel.

9. The water cooling system of claim 7, wherein the water cooling system comprises a water cooling system,

the at least one channel is straight tubular or wavy.

10. The water cooling system of any one of claims 2-5, further comprising:

and the heat preservation part is wrapped on the outer side of the pipeline of the first water cooling loop and the outer side of the first driving part.