CN116666274A - Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method - Google Patents

Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method Download PDF

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Publication number
CN116666274A
CN116666274A CN202310737236.2A CN202310737236A CN116666274A CN 116666274 A CN116666274 A CN 116666274A CN 202310737236 A CN202310737236 A CN 202310737236A CN 116666274 A CN116666274 A CN 116666274A
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CN
China
Prior art keywords
carrier
carrier disc
edge
recovery
recovery port
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310737236.2A
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Chinese (zh)
Inventor
李亮亮
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Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
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Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202310737236.2A priority Critical patent/CN116666274A/en
Publication of CN116666274A publication Critical patent/CN116666274A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The application provides wet-process monolithic silicon wafer cleaning equipment and a cleaning liquid recovery method. Wet process monolithic silicon wafer cleaning equipment includes: the carrier disc is used for carrying the silicon wafers to be cleaned; the nozzle is arranged towards the carrier disc and is used for providing cleaning liquid for the carrier disc; the recovery assembly comprises a plurality of mutually independent recovery ports, the recovery ports are arranged around the carrying disc, the recovery ports are sequentially arranged along the height direction of the wet single-wafer cleaning equipment, and the recovery ports are respectively used for recovering different cleaning liquids; the transmission assembly is in transmission connection with the carrier disc and is configured to drive the axis of the carrier disc to rotate at different rotating speeds so that the cleaning liquid has different speeds when being separated from the edge of the carrier disc. According to the embodiment of the application, the rotating speed of the carrier disc is adjusted, so that the cleaning liquid can have different speeds when being separated from the carrier disc, and further the cleaning liquid can have different drop points and flow to different recovery ports, so that the different cleaning liquids are respectively recovered, and the cost is reduced.

Description

Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method
Technical Field
The embodiment of the application relates to the technical field of semiconductors, in particular to wet-method monolithic silicon wafer cleaning equipment and a cleaning liquid recovery method.
Background
In the technical field of semiconductor manufacturing, wet single-chip cleaners are gradually replacing the conventional groove-type wet cleaners due to the high-quality defect removal effect of the wet single-chip cleaners. The single chip cleaning machine adopts a spray nozzle spraying process generally, and after the silicon wafer enters a process cavity, the spray nozzle starts to spray chemical liquid medicine. Different cleaning liquid formulas are required to be used in different processes, and HF (hydrofluoric acid) +O is the most common at present 3 W (ozone water) +upw (ultra pure water) and then spin-dried at high speed. Also APM (NH) 4 OH+H 2 O 2 +H 2 O, ammonia water+hydrogen peroxide+water) +HF+O 3 W+UPW cleaning mode. When the cleaning liquid is matched with different types of cleaning liquid for cleaning, the cleaning liquid can be sprayed at different intervals.
In the related art, a liquid outlet is generally arranged on different types of cleaning liquid, so that different types of cleaning liquid are mixed into the same liquid outlet pipeline, the proportion of the formed waste liquid components is complex due to the mode, the treatment difficulty is high, the recovery is difficult, and the waste is high.
Disclosure of Invention
The embodiment of the application provides wet-process single-wafer silicon wafer cleaning equipment and a cleaning liquid recovery method, which are used for solving the problems that the proportion of waste liquid components formed by the existing cleaning mode is complex, the treatment difficulty is high, the recovery is difficult, and the large waste is caused.
To solve the above problems, the present application is achieved as follows:
in a first aspect, an embodiment of the present application provides a wet monolithic silicon wafer cleaning apparatus, including:
the carrier disc is used for carrying the silicon wafers to be cleaned and is configured to be capable of rotating around the axis of the carrier disc;
a nozzle disposed toward the carrier tray, the nozzle for providing cleaning fluid to the carrier tray;
the recovery assembly comprises a plurality of mutually independent recovery ports, the recovery ports are arranged around the carrier plate, the recovery ports are sequentially arranged along the height direction of the wet single-chip silicon wafer cleaning equipment, and the recovery ports are respectively used for recovering different cleaning fluids.
In some embodiments, the recycling assembly further includes a baffle, an orthographic projection of a side of the baffle adjacent to the carrier plate on a plane of the carrier plate is located within a range of the carrier plate, and an upper surface of the baffle extends along a direction from an edge of the carrier plate to the recycling slot.
In some embodiments, the number of the recovery ports is three, and one end of the baffle adjacent to the recovery port extends to the middle recovery port.
In some embodiments, the guide plate comprises a plurality of guide units formed by mutually splicing, and the wet single-wafer cleaning equipment further comprises a driving device, wherein the guide units are connected with the driving device;
the driving device is used for driving the flow guiding units to move towards the direction close to the carrier disc so that the flow guiding units are spliced to form the flow guiding plate, or driving the flow guiding units to move towards the direction far away from the carrier disc so that the flow guiding units are separated from each other.
In some of these embodiments, the recovery assembly further comprises a pod disposed around the carrier disk, the pod having at least a pod position and a non-pod position;
when the guide cover is positioned at the guide position, the guide cover intersects with the plane of the carrier plate, and the first orthographic projection is positioned in the range of the second orthographic projection, wherein the first orthographic projection is the orthographic projection of the guide cover on the plane of the carrier plate, and the second orthographic projection is the orthographic projection of the recovery port corresponding to the guide cover on the plane of the carrier plate;
when the air guide sleeve is positioned at the non-guide position, the air guide sleeve is positioned above the plane where the carrier plate is positioned, or the first orthographic projection is positioned outside the range of the second orthographic projection.
In some of these embodiments, the recovery port includes oppositely disposed upper and lower sidewalls, the inner rim of the lower sidewall having a smaller diameter than the inner rim of the upper sidewall such that at least a portion of the lower sidewall is exposed to form a recovery zone.
In a second aspect, an embodiment of the present application provides a cleaning solution recovery method, which is applied to the wet monolithic silicon wafer cleaning apparatus in the first aspect, and the method includes:
under the condition that a first cleaning solution is required to be provided, controlling the carrier disc to rotate at a first rotating speed so that the first cleaning solution flows to a first recovery port after the edge of the carrier disc is separated from the carrier disc;
under the condition that a second cleaning solution is required to be provided, controlling the carrier disc to rotate at a second rotating speed so that the second cleaning solution flows to a second recovery port after the edge of the carrier disc is separated from the carrier disc;
wherein the first rotational speed and the second rotational speed are not equal.
In some of these embodiments, the first rotational speed n 0 Satisfy n 1 ≤n 0 ≤n 2 ；
Wherein n is 1 ＝L 1 /(t 1 *r)，n 2 ＝L 2 /(t 2 *r)，t 1 ＝(2H 1 /g) 1/2 ，t 2 ＝(2H 2 /g) 1/2 ，L 1 L is the distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface edge of the carrying disc in the horizontal direction 2 H is the distance between the inner ring edge of the upper side wall of the first recovery port and the upper surface edge of the carrying disc in the horizontal direction 1 H is the distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface edge of the carrying disc in the vertical direction 2 And g is the gravity acceleration, and r is the diameter of the carrier disc, wherein g is the distance between the edge of the inner ring of the upper side wall of the first recovery port and the edge of the upper surface of the carrier disc in the vertical direction.
In some of these embodiments, in case of application to the wet monolithic silicon wafer cleaning apparatus as described in the fourth aspect, the method comprises:
under the condition that a first cleaning solution needs to be provided, controlling the carrier disc to rotate at a first rotating speed so that the first cleaning solution flows to a first recovery port after the edge of the carrier disc is separated from the carrier disc;
under the condition that a second cleaning solution needs to be provided, controlling the flow guiding unit to move in a direction away from the carrier disc, and controlling the carrier disc to move at a second rotating speed so that the second cleaning solution flows to a second recovery port after being separated from the edge of the carrier disc;
under the condition that a third cleaning solution is required to be provided, controlling the flow guiding unit to move towards the direction close to the carrier disc and splice to form a flow guiding plate, wherein the flow guiding plate extends from the edge of the carrier disc to the third recovery port, and controlling the carrier disc to rotate at a third rotating speed so that the third cleaning solution flows to the third recovery port through the flow guiding plate after being separated from the edge of the carrier disc;
wherein the first rotational speed and the third rotational speed are not equal.
In some embodiments, the wet monolithic silicon wafer cleaning apparatus according to the fifth aspect, the method includes:
under the condition that a first cleaning liquid needs to be provided, controlling the air guide sleeve to move to a non-guide position, and controlling the carrier plate to rotate at a first rotating speed so that the first cleaning liquid flows to a first recovery port after being separated from the edge of the carrier plate;
under the condition that a second cleaning solution is required to be provided, controlling the air guide sleeve to move to the air guide position, and controlling the carrier disc to rotate at a first rotating speed so that the second cleaning solution flows to the air guide sleeve after being separated from the carrier disc at the edge of the carrier disc and flows to the second recovery port along the inner wall of the air guide sleeve;
when the third cleaning solution is required to be provided, controlling the carrier disc to rotate at a third rotating speed so that the third cleaning solution flows to the third recovery port through the guide plate after the edge of the carrier disc is separated from the carrier disc;
wherein the first rotational speed and the third rotational speed are not equal.
According to the embodiment of the application, the plurality of recovery ports are arranged, and when the embodiment is implemented, the rotating speed of the carrier disc is adjusted, so that the cleaning liquid has different speeds when being separated from the carrier disc, and therefore, the cleaning liquid has different drop points and flows to different recovery ports, and the recovery of different cleaning liquids is realized, and the cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a wet process monolithic silicon wafer cleaning apparatus according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of a cleaning solution recycling method according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a wet monolithic silicon wafer cleaning apparatus according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of another wet-process monolithic silicon wafer cleaning apparatus according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms "first," "second," and the like in embodiments of the present application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. Furthermore, the use of "and/or" in the present application means at least one of the connected objects, such as a and/or B and/or C, means 7 cases including a alone a, B alone, C alone, and both a and B, both B and C, both a and C, and both A, B and C.
It should be understood that the terms of high, low, up, down, etc. in this embodiment refer to directions when in the normal use posture.
The embodiment of the application provides wet-process monolithic silicon wafer cleaning equipment.
As shown in FIG. 1, in one embodiment, the wet monolithic wafer cleaning apparatus includes a carrier plate 101, a nozzle 102, and a recovery assembly.
The carrier plate 101 is used for carrying a silicon wafer to be cleaned, and generally, fixing members such as a suction cup are generally arranged on the carrier plate 101 to fix the silicon wafer 103 to be cleaned, and the bottom of the carrier plate 101 is connected with a transmission shaft, so that the carrier plate 101 can rotate around the axis of the carrier plate 101 under the driving of the transmission shaft.
The nozzles 102 are arranged towards the carrier plate 101, the nozzles 102 are used for providing cleaning liquid to the carrier plate 101, and it is to be understood that a plurality of different cleaning liquids need to be used in the cleaning process, and in order to avoid cross contamination of the different cleaning liquids, a plurality of nozzles 102 may be arranged, and different nozzles 102 are respectively used for providing different cleaning liquids.
The recovery assembly comprises a plurality of mutually independent recovery ports, the recovery ports are arranged around the carrier disc 101, the recovery ports are sequentially arranged along the height direction of the wet single-chip silicon wafer cleaning equipment, and the recovery ports are respectively used for recovering different cleaning liquids.
Exemplary, the cleaning fluid includes HF, O 3 In the case of W and UPW, three nozzles 102 and three recovery ports may be provided, and in practice, the nozzles 102 and recovery ports may be adjusted as neededThe number, which is not further defined and described in this embodiment.
The embodiment of the application provides a cleaning solution recovery method.
As shown in fig. 2, in one embodiment, the method includes:
step 201: in the case that the first cleaning solution needs to be provided, controlling the carrier plate 101 to rotate at a first rotation speed so that the first cleaning solution flows to the first recovery port 104 after the edge of the carrier plate 101 is separated from the carrier plate 101;
step 202: in the case where the second cleaning solution needs to be supplied, the carrier tray 101 is controlled to rotate at the second rotation speed, so that the second cleaning solution flows to the second recovery port 105 after the edge of the carrier tray 101 is separated from the carrier tray 101.
In some of these embodiments, the first rotational speed n 0 Satisfy n 1 ≤n 0 ≤n 2 ；
Wherein n is 1 ＝L 1 /(t 1 *r)，n 2 ＝L 2 /(t 2 *r)，t 1 ＝(2H 1 /g) 1/2 ，t 2 ＝(2H 2 /g) 1/2 ，L 1 L is the distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface edge of the carrying disc in the horizontal direction 2 H is the distance between the inner ring edge of the upper side wall of the first recovery port and the upper surface edge of the carrying disc in the horizontal direction 1 H is the distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface edge of the carrying disc in the vertical direction 2 G is the gravity acceleration, which is the distance between the inner ring edge of the upper side wall of the first recovery port and the upper surface edge of the carrying disc in the vertical direction.
After the cleaning solution is separated from the upper surface of the carrier plate, the cleaning solution can be understood as a horizontal throwing motion, in this embodiment, the time t required for the cleaning solution to move to the lower side wall of the first recovery port along the vertical direction is calculated according to the vertical distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface of the carrier plate 1 Then according to the time t 1 And an inner ring of the lower side wall of the first recovery portThe distance between the edge and the upper surface edge of the carrier plate enables the speed of the cleaning liquid when the cleaning liquid leaves the edge of the carrier plate to be calculated, the speed is equal to the linear speed of the edge of the carrier plate, and the angular speed of the carrier plate can be further determined to be omega according to the speed 1 And omega 1 ＝n 1 * r, thus, the rotation speed n corresponding to the carrying disc when the first cleaning liquid reaches the inner ring edge of the lower side wall of the first recovery port can be calculated 1 Similarly, the rotation speed n of the carrier plate corresponding to the position where the first cleaning liquid reaches the inner ring edge of the upper side wall of the first recovery port can be calculated 2 。
Further, the adjustment coefficient may be further set in consideration of factors such as air resistance, for example, n 0 Satisfy 1.1n 1 ≤n 0 ≤0.9n 2 The cleaning liquid can be ensured to fall within the range of the first recovery port.
Obviously, for other cleaning fluids and recovery ports, the corresponding carrier disc rotational speed can be calculated with reference to the above-described manner.
In an exemplary embodiment, the cleaning process for the silicon wafer 103 first requires the use of O 3 W is cleaned, at which time nozzle 102 provides O 3 W, wafer 103 rotation speed 800rpm, time 15 seconds, O 3 The W cleaning liquid is thrown from the center position to the edge and away from the edge of the silicon wafer 103 due to the centrifugal movement during the rotation of the silicon wafer 103, and flows toward the first recovery port 104.
Next, cleaning with HF is required, at which time the wafer 103 rotates at 200rpm for 15 seconds, and the HF cleaning solution is thrown from the center position to the edge and away from the edge of the wafer 103 due to centrifugal movement during the rotation of the wafer 103, and flows toward the second recovery port 105.
The two steps are repeated once, and then the wafer 103 is cleaned by UPW, the rotation speed of the wafer 103 is 500rpm, the time is 30 seconds, and UPW cleaning liquid is thrown from the center position to the edge and leaves the edge of the wafer 103 due to the centrifugal movement of the wafer 103 during the rotation process, and flows to the third recovery port 106.
Finally, the ejection of the cleaning liquid was stopped, the silicon wafer 103 was spun by high-speed rotation at a set speed of 1000rpm for 30 seconds.
In the above process, since the rotation speeds of the silicon wafer 103 are different, the speeds of the cleaning solution and the silicon wafer 103 are different when they are separated, and accordingly, the drop points are also different, and in the implementation, the rotation speeds of the silicon wafer 103 in each stage are correspondingly adjusted according to the positions of the different recovery ports, that is, the first rotation speed, the second rotation speed and the third rotation speed which are not equal are determined, so that the drop points of the cleaning solution can be adjusted, and the recovery of the cleaning solution is realized.
In some embodiments, the recycling assembly further includes a baffle 107, an orthographic projection of a side of the baffle 107 adjacent to the carrier plate 101 on a plane of the carrier plate 101 is located within a range of the carrier plate 101, and an upper surface of the baffle 107 extends from an edge of the carrier plate 101 to the recycling opening.
In this embodiment, in order to enhance the recovery effect of the cleaning liquid, a baffle 107 is further provided. The deflector 107 is used to adjust the flow direction of the cleaning liquid. It should be understood that, since the flow stability of the liquid may be affected by various factors, it may be difficult to accurately ensure the drop point of the liquid, in this embodiment, the baffle 107 is further provided to improve the flow guiding effect for the cleaning liquid, so that different cleaning liquids can more accurately flow into the corresponding recovery ports, and the recovery effect is improved.
In this embodiment, the baffle 107 is in a circular distribution, and has a cylindrical structure with a circular sidewall, and the diameter of the upper end of the baffle is smaller than that of the carrier plate 101, so as to ensure that the cleaning solution can drop onto the baffle 107 after dropping from the carrier plate 101 (i.e. dropping from the silicon wafer 103), and the diameter of the bottom of the baffle 107 is larger than the inner diameter of the third recovery port 106 and smaller than the outer diameter of the third recovery port 106, so that the liquid dropping from the baffle 107 can drop between the inner edge and the outer edge of the third recovery port 106, that is, the liquid dropping from the baffle 107 can be recovered by the third recovery port 106.
In some of these embodiments, the diameter of each recovery port decreases in a top-to-bottom direction. That is, the uppermost first recovery port 104 has the largest diameter, and correspondingly, the corresponding recovery rotational speed is also the largest. The diameter of the second recovery port 105 located at the lowermost position is the smallest, and the corresponding recovery rotational speed is also the smallest.
In some embodiments, the number of recovery ports is three, and the end of the baffle 107 near the recovery port extends to the recovery port located in the middle, i.e., toward the third recovery port 106 in the present embodiment.
In some of these embodiments, as shown in fig. 1, the recovery port includes oppositely disposed upper and lower sidewalls, the inner rim of the lower sidewall having a smaller diameter than the inner rim of the upper sidewall, such that at least a portion of the lower sidewall is exposed to form a recovery zone.
With continued reference to fig. 1, in order to enhance the recovery effect on the recovery liquid, the lower sidewall is gradually inclined downward along the direction away from the carrier plate 101, and meanwhile, each recovery port has a certain height difference in height, that is, each recovery port is not continuous in the height direction, but is arranged at intervals, which is helpful for enhancing the recovery effect on the cleaning liquid.
Specifically, when the first cleaning solution is recovered, the rotational speed of the carrier tray 101 is sufficiently large, so that the first cleaning solution flies to the inner wall of the housing above the first recovery port 104, and drops to the first recovery port 104 along the inner wall of the housing.
When the third cleaning liquid is recovered, a part of the third cleaning liquid, after being separated from the carrier tray 101, splashes and flows to the inner wall between the first recovery port 104 and the third recovery port 106, and drops to the third recovery port 106 along the inner wall.
It should be understood that, for the first recovery port 104 shown in the drawing, the diameter is the largest, and the recovery rotation speed of the corresponding carrier plate 101 (i.e., the rotation speed of the silicon wafer 103) is the largest, so that, as long as the first rotation speed is sufficiently large, it is ensured that the first cleaning liquid can be recovered by the first recovery port 104.
In this embodiment, the diameter of the second recovery port 105 is the smallest, so that the recovery range of the second recovery port 105 can be ensured not to be exceeded by the second cleaning liquid as long as the rotation speed of the carrier tray 101 is sufficiently small.
And the third recovery port 106 for recovering the third cleaning liquid is located between the first recovery port 104 and the second recovery port 105, and the corresponding rotational speed of the carrier tray 101 is located in a specific speed range, so that it may be inconvenient to control. As shown in fig. 3, in this embodiment, a deflector 107 corresponding to the third recovery port 106 is provided to ensure that the third cleaning solution can be recovered effectively.
In some embodiments, the guide plate 107 comprises a plurality of guide units formed by mutually splicing, and the wet single-wafer cleaning device further comprises a driving device, wherein the guide units are connected with the driving device; the driving device is used for driving the flow guiding units to move towards the direction close to the carrier disc 101 so that the flow guiding units are spliced to form the flow guiding plate 107, or driving the flow guiding units to move towards the direction far away from the carrier disc 101 so that the flow guiding units are separated from each other.
In some of these embodiments, the cleaning solution recovery method includes:
in the case that the first cleaning solution needs to be provided, controlling the carrier plate 101 to rotate at a first rotation speed so that the first cleaning solution flows to the first recovery port 104 after the edge of the carrier plate 101 is separated from the carrier plate 101;
in the case that the second cleaning solution needs to be provided, controlling the flow guiding unit to move in a direction away from the carrier disc 101, and controlling the carrier disc 101 to move at a second rotating speed so that the second cleaning solution flows to a second recovery port 105 after being separated from the edge of the carrier disc 101 and the carrier disc 101;
when the third cleaning solution needs to be provided, controlling the flow guiding unit to move towards the direction close to the carrier disc 101 and splice to form a flow guiding plate 107, wherein the flow guiding plate 107 extends from the edge of the carrier disc 101 to the third recovery port 106, and controlling the carrier disc 101 to rotate at a third rotation speed so that the third cleaning solution flows to the third recovery port 106 through the flow guiding plate 107 after being separated from the edge of the carrier disc 101;
wherein the first rotational speed and the third rotational speed are not equal.
It can be understood that when the third cleaning solution needs to be recovered, each flow guiding unit is controlled to be spliced to form the flow guiding plate 107, so that the flow guiding effect can be realized in the recovery process of the third cleaning solution, and when the third cleaning solution does not need to be recovered, each flow guiding unit is controlled to move to a position far away from the carrier disc 101, so that the interference caused by recovery of other cleaning solutions is avoided.
In other words, when the first cleaning liquid needs to be recovered, the first rotation speed of the carrier tray 101 is controlled to be sufficiently large, so that the first cleaning liquid can fly out a sufficient distance to be recovered by the first recovery port 104.
When the second cleaning liquid needs to be recovered, the second rotation speed of the carrier tray 101 is controlled to be sufficiently small so that the second cleaning liquid can be recovered by the second recovery port 105.
When the third cleaning solution needs to be recovered, the carrier plate 101 is controlled to rotate at the second rotation speed, and at this time, the second cleaning solution can drop onto the upper surface of the deflector 107 and flow to the second recovery port 105 along the upper surface of the deflector 107.
In this way, in the present embodiment, the rotation speed of the mounting tray 101 is controlled by the deflector 107, so that different cleaning liquids can be collected by the corresponding collection ports.
In some of these embodiments, the cleaning solution recovery method includes:
in the case that the first cleaning solution needs to be provided, controlling the air guide sleeve 108 to move to the non-guide position, and controlling the carrier plate 101 to rotate at a first rotation speed, so that the first cleaning solution flows to the first recovery port 104 after the edge of the carrier plate 101 is separated from the carrier plate 101;
in the case that the second cleaning solution needs to be provided, controlling the air guide sleeve 108 to move to the air guide position, and controlling the carrier plate 101 to rotate at a first rotation speed, so that the second cleaning solution flows to the air guide sleeve 108 after the edge of the carrier plate 101 is separated from the carrier plate 101, and flows to the second recovery port 105 along the inner wall of the air guide sleeve 108;
in the case that the third cleaning solution needs to be provided, the carrier plate 101 is controlled to rotate at the third rotation speed, so that the third cleaning solution flows to the third recovery port 106 through the deflector 107 after the edge of the carrier plate 101 is separated from the carrier plate 101. In this embodiment, the first rotation speed and the third rotation speed are not equal.
As shown in fig. 4, in the technical solution of this embodiment, the cleaning solutions are recovered by the aid of the air guide sleeve 108.
Specifically, the air guide sleeve 108 is disposed around the carrier disc 101, and the air guide sleeve 108 has at least an air guide position and a non-air guide position, and when the air guide sleeve 108 is in the air guide position, the planes of the air guide sleeve 108 and the carrier disc 101 intersect, and the first orthographic projection is located within the range of the second orthographic projection, wherein the first orthographic projection is the orthographic projection of the air guide sleeve 108 on the plane of the carrier disc 101, and the second orthographic projection is the orthographic projection of the recovery port corresponding to the air guide sleeve 108 on the plane of the carrier disc 101; when in the non-deflector position, the pod 108 is positioned above the plane of the carrier disk 101 or the first orthographic projection is positioned outside the range of the second orthographic projection.
It will be appreciated that when the pod 108 is in the pod position, the pod 108 is disposed around the carrier disc 101 such that when the carrier disc 101 rotates, the cleaning liquid flies out from the edge of the carrier disc 101 due to centrifugal movement, and can be blocked by the pod 108 and falls down along the pod 108, thereby enabling the cleaning liquid to have the same drop point when the carrier disc 101 is at different rotational speeds.
In this embodiment, when the first cleaning solution needs to be recovered, the rotation speed of the carrier tray 101 may be controlled to be sufficiently large, and when the second cleaning solution needs to be recovered, the rotation speed of the carrier tray 101 may be controlled to be sufficiently small.
When the third cleaning solution needs to be recovered, the rotation speed of the carrier plate 101 may be controlled to be relatively high, for example, the first speed may be set as described above, where the speed of the third cleaning solution exiting the carrier plate 101 is relatively high, but the third cleaning solution is retained along the air guide sleeve 108 and is recovered by the third recovery port 106 under the blocking of the air guide sleeve 108.
By arranging a plurality of recovery ports, the embodiment of the application can separate the cleaning liquid from the carrier plate 101 along different directions by adjusting the rotating speed of the carrier plate 101 when the embodiment of the application is implemented, so that the cleaning liquid flows to different recovery ports, thereby realizing the respective recovery of different cleaning liquids and being beneficial to reducing the cost.
While the foregoing is directed to the preferred embodiments of the present application, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.

Claims (10)

1. The wet method monolithic silicon wafer cleaning equipment is characterized by comprising the following steps:
the carrier disc is used for carrying the silicon wafers to be cleaned;
a nozzle disposed toward the carrier tray, the nozzle for providing cleaning fluid to the carrier tray;
the recovery assembly comprises a plurality of mutually independent recovery ports, the recovery ports are arranged around the carrier plate, the recovery ports are sequentially arranged along the height direction of the wet single-wafer cleaning equipment, and the recovery ports are respectively used for recovering different cleaning liquids;
the transmission assembly is in transmission connection with the carrier plate and is configured to drive the carrier plate to rotate around the axis of the carrier plate at different rotating speeds so that the cleaning liquid has different speeds when being separated from the edge of the carrier plate.
2. The wet single wafer cleaning apparatus according to claim 1, wherein the recovery assembly further comprises a baffle, an orthographic projection of a side of the baffle adjacent to the carrier plate on a plane of the carrier plate is located within a range of the carrier plate, and an upper surface of the baffle extends in a direction from an edge of the carrier plate to the recovery port.
3. The wet process single wafer cleaning apparatus according to claim 2, wherein the number of recovery ports is three or more, and one end of the baffle adjacent to the recovery port extends to the recovery port located in the middle.
4. A wet process single-chip silicon wafer cleaning apparatus according to claim 2 or 3, wherein the deflector comprises a plurality of deflector units spliced with each other, the wet process single-chip silicon wafer cleaning apparatus further comprises a driving device, and the deflector units are connected with the driving device;
the driving device is used for driving the flow guiding units to move towards the direction close to the carrier disc so that the flow guiding units are spliced to form the flow guiding plate, or driving the flow guiding units to move towards the direction far away from the carrier disc so that the flow guiding units are separated from each other.
5. The wet single wafer cleaning apparatus of claim 1, wherein the recovery assembly further comprises a pod disposed around the carrier plate, the pod having at least a pod position and a non-pod position;
when the guide cover is positioned at the guide position, the guide cover intersects with the plane of the carrier plate, and the first orthographic projection is positioned in the range of the second orthographic projection, wherein the first orthographic projection is the orthographic projection of the guide cover on the plane of the carrier plate, and the second orthographic projection is the orthographic projection of the recovery port corresponding to the guide cover on the plane of the carrier plate;
when the air guide sleeve is positioned at the non-guide position, the air guide sleeve is positioned above the plane where the carrier plate is positioned, or the first orthographic projection is positioned outside the range of the second orthographic projection.
6. The wet single wafer cleaning apparatus according to claim 1, wherein the recovery port comprises an upper sidewall and a lower sidewall disposed opposite to each other, and wherein a diameter of an inner circumferential edge of the lower sidewall is smaller than a diameter of an inner circumferential edge of the upper sidewall, such that at least a portion of the lower sidewall is exposed to form a recovery zone.
7. A cleaning liquid recovery method, characterized by being applied to the wet-process monolithic silicon wafer cleaning apparatus according to any one of claims 1 to 6, comprising:
under the condition that a first cleaning solution is required to be provided, controlling the carrier disc to rotate at a first rotating speed so that the first cleaning solution flows to a first recovery port after the edge of the carrier disc is separated from the carrier disc;
under the condition that a second cleaning solution is required to be provided, controlling the carrier disc to rotate at a second rotating speed so that the second cleaning solution flows to a second recovery port after the edge of the carrier disc is separated from the carrier disc;
wherein the first rotational speed and the second rotational speed are not equal.
8. The method of claim 7, wherein the first rotational speed n 0 Satisfy n 1 ≤n 0 ≤n 2 ；
Wherein n is 1 ＝L 1 /(t 1 *r)，n 2 ＝L 2 /(t 2 *r)，t 1 ＝(2H 1 /g) 1/2 ，t 2 ＝(2H 2 /g) 1/2 ，L 1 L is the distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface edge of the carrying disc in the horizontal direction 2 H is the distance between the inner ring edge of the upper side wall of the first recovery port and the upper surface edge of the carrying disc in the horizontal direction 1 H is the distance between the inner ring edge of the lower side wall of the first recovery port and the upper surface edge of the carrying disc in the vertical direction 2 And g is the gravity acceleration, and r is the diameter of the carrier disc, wherein g is the distance between the edge of the inner ring of the upper side wall of the first recovery port and the edge of the upper surface of the carrier disc in the vertical direction.
9. The method of claim 7, wherein the method, when applied to the wet monolithic silicon wafer cleaning apparatus of claim 4, comprises:
under the condition that a first cleaning solution needs to be provided, controlling the carrier disc to rotate at a first rotating speed so that the first cleaning solution flows to a first recovery port after the edge of the carrier disc is separated from the carrier disc;
under the condition that a second cleaning solution needs to be provided, controlling the flow guiding unit to move in a direction away from the carrier disc, and controlling the carrier disc to move at a second rotating speed so that the second cleaning solution flows to a second recovery port after being separated from the edge of the carrier disc;
under the condition that a third cleaning solution is required to be provided, controlling the flow guiding unit to move towards the direction close to the carrier disc and splice to form a flow guiding plate, wherein the flow guiding plate extends from the edge of the carrier disc to the third recovery port, and controlling the carrier disc to rotate at a third rotating speed so that the third cleaning solution flows to the third recovery port through the flow guiding plate after being separated from the edge of the carrier disc;
wherein the first rotational speed and the third rotational speed are not equal.
10. The method of claim 7, applied to the wet single wafer cleaning apparatus of claim 5, comprising:
under the condition that a first cleaning liquid needs to be provided, controlling the air guide sleeve to move to a non-guide position, and controlling the carrier plate to rotate at a first rotating speed so that the first cleaning liquid flows to a first recovery port after being separated from the edge of the carrier plate;
under the condition that a second cleaning solution is required to be provided, controlling the air guide sleeve to move to the air guide position, and controlling the carrier disc to rotate at a first rotating speed so that the second cleaning solution flows to the air guide sleeve after being separated from the carrier disc at the edge of the carrier disc and flows to the second recovery port along the inner wall of the air guide sleeve;
when the third cleaning solution is required to be provided, controlling the carrier disc to rotate at a third rotating speed so that the third cleaning solution flows to the third recovery port through the guide plate after the edge of the carrier disc is separated from the carrier disc;
wherein the first rotational speed and the third rotational speed are not equal.
CN202310737236.2A 2023-06-20 2023-06-20 Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method Pending CN116666274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310737236.2A CN116666274A (en) 2023-06-20 2023-06-20 Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310737236.2A CN116666274A (en) 2023-06-20 2023-06-20 Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method

Publications (1)

Publication Number Publication Date
CN116666274A true CN116666274A (en) 2023-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310737236.2A Pending CN116666274A (en) 2023-06-20 2023-06-20 Wet method single-chip silicon wafer cleaning equipment and cleaning liquid recovery method

Country Status (1)

Country Link
CN (1) CN116666274A (en)

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