CN116666254A - 包括超声波清洗单元的基板处理装置 - Google Patents
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Abstract
本发明涉及包括超声波清洗单元的基板处理装置,包括:吸盘底座,能够以旋转轴为中心进行旋转;吸盘销,设置在上述吸盘底座,用于固定基板;以及超声波清洗单元,设置在上述吸盘底座的上部,因此,可通过超声波均匀地清洗基板的背面。
Description
技术领域
本发明涉及包括超声波清洗单元的基板处理装置,更详细地,涉及使基板旋转并清洗基板的背面的包括超声波清洗单元的基板处理装置。
背景技术
通常,半导体设备通过将多种物质以薄膜形态蒸镀在基板上并对其进行图案化来制作,为此,需要蒸镀工序、光刻工序、蚀刻工序、清洗工序及干燥工序等多个步骤的不同工序。
其中,清洗工序和干燥工序为在去除存在上述基板上的异物或颗粒等之后进行干燥的工序,代表性地,通过在将基板制成在吸盘底座(旋转头部)上的状态下使其进行旋转并向基板的表面和/或背面供给处理液来进行。
通常,当上述吸盘底座旋转时,为了防止基板向吸盘底座的侧方向脱离,沿着上述吸盘底座的周围方向隔开设置多个吸盘销。
并且,根据现有技术的基板处理装置,在基板的上侧形成流体供给单元,从而向设置在旋转的吸盘底座的基板的表面喷射清洗液来清洗基板表面,在上述吸盘底座包括以不旋转的方式设置的背部喷嘴组件,从而通过背部喷嘴向基板的背面喷射清洗液或气体等物质来清洗或干燥基板的背面。
另一方面,过去,进行了利用超声波清洗单元的基板表面的清洗,在旋转的基板的背面侧用于设置超声波清洗单元的空间受到制约,不仅如此,还很难形成用于超声波清洗的清洗液的供给结构,从而,即使呈现出优秀的清洗效果,也很难将超声波清洗单元轻松适用于基板的背面清洗。
现有技术文献
专利文献
专利文献1:韩国授权专利公报第10-1145775号(2012年05月07日)
发明内容
本发明为了解决上述现有技术的问题而提出,本发明的目的在于,提供可通过超声波清洗单元清洗旋转的基板的背面的包括超声波清洗单元的基板处理装置。
为了实现上述目的,本发明包括超声波清洗单元的基板处理装置的特征在于,包括:吸盘底座,能够以旋转轴为中心进行旋转;吸盘销,设置在上述吸盘底座,用于固定基板;以及超声波清洗单元,设置在上述吸盘底座的上部,用于对基板的背面进行超声波清洗。
本发明的特征在于,上述超声波清洗单元包括:超声波清洗头部,当从俯视图观察时,形成以上述旋转轴为中心来沿着半径方向延伸的形状,在上部面形成有朝向基板的内部清洗流路;清洗液内部供给管,第一出口与上述超声波清洗头部连接,从而与上述内部清洗流路连通;以及清洗液外部供给管,配置在上述超声波清洗头部的外部,第二出口朝向基板。
本发明的特征在于,沿着上述基板的半径方向,在上述基板上,上述清洗液外部供给管朝向的位置比内部清洗流路朝向的位置远。
本发明的特征在于,在上述吸盘底座的中心,作为非旋转部的流体流动引导管沿着上下方向延伸设置,在上述流体流动引导管收容上述清洗液内部供给管和清洗液外部供给管。
本发明的特征在于,当从俯视图观察时,在上述内部清洗流路的附近,在超声波清洗头部的周围设置适配器,上述清洗液内部供给管通过上述适配器引出并与上述超声波清洗头部连接,上述清洗液外部供给管通过上述适配器引出并朝向上述基板的背面。
本发明的特征在于,当从俯视图观察时,上述内部清洗流路的排出口在基板的中心附近配置在上述超声波清洗头部的宽度方向中心,当从侧视图观察上述超声波清洗头部时,上述内部清洗流路朝向基板的背面沿着半径方向倾斜延伸。
本发明的特征在于,当从俯视图观察时,上述清洗液外部供给管的喷射方向以具有上述吸盘底座的旋转方向成分的方式倾斜配置,以相对于以上述旋转轴为中心的半径方向朝向上述超声波清洗头部。
本发明的特征在于,当从俯视图观察时,上述超声波清洗头部的宽度从上述旋转轴朝向上述半径方向逐渐变宽,并在预设位置中,从端部之间的位置开始恒定维持。
本发明的特征在于,在上述超声波清洗头部的内部,沿着长度方向设置板状的振子,当从横向剖视图观察时,一对上述振子倾斜展开,展开部分朝向上述基板。
本发明的特征在于,上述振子的宽度朝向基板的边缘逐渐变宽。
本发明的特征在于,还包括冷却用气体管,收容在上述流体流动引导管并沿着其长度方向延伸,与上述超声波清洗头部的内部连通。
根据具有上述结构的本发明,本发明包括:吸盘底座,能够以旋转轴为中心进行旋转;吸盘销,设置在上述吸盘底座,用于固定基板;以及超声波清洗单元,设置在上述吸盘底座的上部,用于对基板的背面进行超声波清洗,因此,可通过超声波均匀地清洗基板的背面。
并且,根据本发明,上述超声波清洗单元包括:超声波清洗头部,当从俯视图观察时,以上述旋转轴为中心,具有沿着半径方向延伸的形状,在上部面形成有朝向基板的内部清洗流路;清洗液内部供给管,第一出口与上述超声波清洗头部连接,从而与上述内部清洗流路连通;以及清洗液外部供给管,配置在上述超声波清洗头部的外部,第二出口朝向基板,通过上述清洗液内部供给管从内部清洗流路喷射的清洗液涂敷基板的中心附近,通过上述清洗液外部供给管喷射的清洗液涂敷基板的边缘附近,因此,清洗液涂敷到基板中的每个部分,从而实现稳定的清洗。
并且,根据本发明,在上述吸盘底座的中心,作为非旋转部的流体流动引导管沿着上下方向延伸设置,在上述流体流动引导管收容上述清洗液内部供给管和清洗液外部供给管,因此,可以轻松且顺畅地供给清洗液。
并且,根据本发明,当从俯视图观察时,在上述内部清洗流路的附近,在超声波清洗头部的周围设置适配器,上述清洗液内部供给管通过上述适配器引出并与上述超声波清洗头部连接,上述清洗液外部供给管通过上述适配器引出并朝向上述基板的背面,通过上述适配器,上述内部清洗液供给管和外部清洗液供给管可以不晃动地设置。
并且,根据本发明,当从俯视图观察时,上述内部清洗流路的排出口在基板的中心附近配置在上述超声波清洗头部的宽度方向中心,当从侧视图观察上述清洗头部时,上述内部清洗流路朝向基板的背面沿着半径方向倾斜延伸,所喷射的清洗液可从基板的中心部分沿着半径方向轻松扩张移动。
并且,根据本发明,当从俯视图观察时,上述清洗液外部供给管的喷射方向能够以具有上述吸盘底座的旋转方向成分的方式倾斜配置,以相对于以上述旋转轴为中心的半径方向朝向上述超声波清洗头部,随着基板的旋转,向基板的背面喷射的清洗液涂敷在超声波清洗头部的上部面并形成薄膜,通过超声波轻松清洗基板的外围部分。
并且,根据本发明,当从俯视图观察时,上述超声波清洗头部的宽度从上述旋转轴朝向上述半径方向逐渐变宽,在预设位置中,从端部之间的位置开始恒定维持,因此,可以将在设置超声波清洗头部的吸盘底座的收容槽底部中占据的面积最小化。
并且,根据本发明,在上述超声波清洗头部的内部,沿着长度方向设置板状的振子,当从横截面观察时,一对上述振子倾斜展开,展开部分以朝向上述基板的方式配置,从而,若同时向2个振子施加电输出,则负压将重叠,从而可以实现高输出,所输出的波形也均匀,从而进一步实现均匀地清洗。
并且,根据本发明,上述振子的宽度朝向基板的边缘,即,沿着基板的半径方向逐渐变宽,从而可以轻松清洗作为需要处理的面积的宽广的边缘部分,结果,可以整体均匀地清洗基板的背面。
附图说明
图1为简要示出本发明的基板处理装置的侧面剖视图。
图2为示出本发明的包括超声波清洗单元的基板处理装置的立体图。
图3为示出图2中的超声波清洗单元的立体图。
图4为经过图3中的清洗液内部供给管和清洗液外部供给管的横向剖视图。
图5为示出图3中的超声波清洗头部的结构的立体图。
图6为示出本发明的超声波清洗头部的结构的平面剖视图。
图7为图6中的A-A的剖视图。
图8为示出图5中的振子的结构的侧视图。
图9为图6中的B-B的剖视图。
具体实施方式
以下,参照附图,详细说明本发明的优选实施。
如图1和图2所示,本发明的包括超声波清洗单元的基板处理装置1000包括:吸盘底座100,能够以旋转轴A为中心进行旋转;吸盘销200,设置在上述吸盘底座100,用于固定基板W;流体供给单元400,用于向基板W供给用于基板的表面处理的处理液或处理气体;碗组装体500,以防止在工序中使用的药液及在进行工序时发生的烟雾(fume)向外部溅射或流出的方式收容;升降单元600,用于使上述吸盘底座100或碗组装体500向上下升降;以及超声波清洗单元300,设置在上述吸盘底座100的上部,用于基板的背面进行超声波清洗。
上述超声波清洗单元300通过如下方式进行清洗,即,激励如压电(piezo)的振子来产生振动或者通过水、清洗液的介质进行传递,以清洗旋转的基板W的背面。
为此,如图3、图4及图9所示,上述超声波清洗单元300包括:超声波清洗头部310,当从俯视图观察时,具有以上述旋转轴A为中心沿着基板W的半径方向延伸的形状,在上部面形成有朝向基板W的背面的内部清洗流路311的排出口311a;清洗液内部供给管320,第一出口与上述超声波清洗头部310连接,从而与上述内部清洗流路311连通;以及清洗液外部供给管330,配置在上述超声波清洗头部310的外部,第二出口朝向基板W的背面。
在此情况下,沿着上述基板W的半径方向,在上述基板W上,上述清洗液外部供给管330朝向的位置比内部清洗流路311的排出口311a朝向的位置远。
上述内部清洗流路311形成在上述超声波清洗头部310的内部,一端与上述清洗液内部供给管320连接,另一端向上述超声波清洗头部310的上部面露出并形成排出口。
上述清洗液内部供给管320可以与上述超声波清洗头部310的长度方向一端部,即,基板W的中心或旋转轴A附近的端部侧面连接。
通过上述清洗液内部供给管320和清洗液外部供给管330排出的清洗液填满在上述基板W与超声波清洗头部310的上部面之间,从而向上述基板W传递超声波振动。
根据上述结构,通过上述清洗液内部供给管320从内部清洗流路311喷射的清洗液涂敷基板W的中心C附近,通过上述清洗液外部供给管330喷射的清洗液涂敷到超出基板W的中心C附近的边缘附近,因此,清洗液涂敷在基板W的整个部分,从而实现完整的清洗。
即,在从上述内部清洗流路311喷射的清洗液补充通过上述清洗液外部供给管330喷射的清洗液来增加流动能量,由此,基板W的半径方向整体可以被清洗液覆盖。
在上述内部清洗流路311和清洗液外部供给管330同时喷射的情况下,有可能发生相互重叠的区域,但不存在因重叠的区域而导致清洗效果下降的情况。
优选地,在作为旋转部的上述吸盘底座100的中心,作为非旋转部的流体流动引导管340沿着上下方向延伸设置,在上述流体流动引导管340收容上述清洗液内部供给管320和清洗液外部供给管330并上下延伸,从而实现清洗液的轻松且顺畅地供给。
如图2至图7所示,优选地,当从俯视图观察时,在上述内部清洗流路311的附近,在超声波清洗头部310的周围设置适配器350,上述内部清洗液供给管320通过上述适配器350引出并与上述超声波清洗头部310连接,上述清洗液外部供给管330通过上述适配器350引出并朝向上述基板W背面,通过上述适配器350,上述内部清洗液供给管320和外部清洗液供给管330不晃动地设置。
上述适配器350可分离配置在作为旋转部的吸盘底座100的中心,从而可固定设置在构成非旋转部的圆形的设置板360上。
并且,如图所示,上述适配器350可以从作为上述清洗头部310的一部分的清洗头部310的底部390延伸并形成为一体。
当然,上述适配器350以可分离的状态与上述超声波清洗头部310结合。
如图6和图9所示,优选地,当从俯视图观察时,上述内部清洗流路311在基板W的中心附近配置在上述超声波清洗头部310的宽度方向中心,当从侧视图观察超声波清洗头部310时,上述内部清洗流路311朝向基板W的背面沿着半径方向倾斜延伸,由此,所喷射的清洗液从基板W的中心附近沿着半径方向轻松扩张。
并且,上述内部清洗流路311的排出口311a形成在上述超声波清洗头部310的上部面,上述内部清洗流路311以朝向上述基板W的方式倾斜形成,当从俯视图观察时,若构成在上述超声波清洗单元300的上部露出的内部清洗流路311的排出口的基板W的半径方向两端部中的至少一个位于以上述旋转轴A的中心或基板W的中心为基准的半径方向相反侧,则在超声波清洗单元300内部的内部清洗流路311的排出口中的喷射开始点位于以喷射方向为基准的旋转轴A的中心或基板W的中心的后方,从而实现完整的基板W清洗。
并且,如图2和图3所示,当从俯视图观察时,上述清洗液外部供给管330以具有上述吸盘底座100的旋转方向成分的方式倾斜配置,以相对于上述旋转轴A为中心的半径方向朝向上述超声波清洗头部310,从而具有上述基板W的旋转方向成分。
由此,随着基板W的旋转,向基板W的背面喷射的清洗液涂敷在超声波清洗头部310的上部面并形成薄膜,通过上述清洗液传递超声波振动,从而可以轻松清洗基板W的外围部分。
即,可通过上述内部清洗液供给管320,从基板W的中心附近朝向半径方向涂敷,通过上述外部清洗液供给管330,沿着基板的半径方向及旋转方向涂敷至基板W的边缘,因此,可以进一步均匀且有效地喷射基板W的整体区域。
并且,如图6所示,优选地,当从俯视图观察时,上述超声波清洗头部310的宽度从上述旋转轴A的朝向上述基板W的半径方向,即,朝向上述超声波清洗头部310的长度方向边缘逐渐变宽,并在预设位置中,从端部之间的位置开始恒定维持。
例如,从宽度A至宽度C,线性宽度可将增加,从宽度C至宽度D将维持恒定宽度。
由此,可以将超声波清洗头部310在后述的吸盘底座100的收容槽120底部占据的面积最小化。
当以上述基板W为中心径向等同分割上述基板W时,越接近基板的边缘,需要处理的面积越大,因此,上述超声波清洗头部310的宽度朝向半径方向逐渐扩大,以均匀地传递单位面积的负压。
另一方面,如图5至图8所示,优选地,在上述超声波清洗头部310的内部,沿着长度方向设置板状的振子370,当从横截面观察时,一对上述振子370倾斜地展开,展开部分以朝向上述基板W的方式配置。
根据这种结构,若向2个振子370同时施加电输出,则负压将重叠,由此可以实现高输出,所输出的波形也均匀,结果,进一步实现均匀的清洗。
优选地,一对上述振子370的展开角度为锐角。
若仅设置一个振子370,则负压的波形反弹,严重发生山和谷,从而破坏了真空的均匀性,且很难实现均匀的清洗。
尤其,如图8所示,上述振子370的宽度沿着基板W的边缘,即,基板W的半径方向逐渐变宽,从而可以轻松清洗作为需要处理的面积的宽广的边缘部分,结果,可以均匀地清洗整个基板W的背面。
根据这种结构,若电流在由上述板状的压电等构成的振子370流动,则在振子370发生晃动,这种晃动传递到构成清洗头部310的石英(quartz),超声波振动继续传递到在上述清洗头部310与基板W之间装满的清洗液(水等),从而实现基板W的超声波清洗。
在上述超声波清洗头部310的内部空间可设置用于支撑一对上述振子370的支撑本体315,在上述支撑本体315的上端形成横截面为锐角的支撑槽316。
并且,如图3和图4所示,本发明还包括冷却用气体管380,收容在上述流体流动引导管340并沿着其长度方向延伸,通过上述超声波清洗头部310的底部与内部连通,向超声波清洗头部310的内部供给N2气体等,由此可以通过冷却在上述振子370中产生的热量来防止因热量所引起的振子370过度变形。
另一方面,如图2所示,在上述吸盘底座100的上部面可形成收容槽120,从而可以收容上述超声波清洗单元300。
在此情况下,优选地,向上述基板W的表面或背面供给的清洗液或干燥液等药液流入到收容槽120,为了防止流入到上述收容槽120的药液的积累并向外部排出或循环,在上述收容槽120的底部或吸盘底座100的侧壁贯通形成排水孔123。
进而,优选地,在上述排水孔123形成在吸盘底座100的收容槽120底部的情况下,上述排水孔123与上述吸盘销200的设置收纳部110的内部边角相邻形成,由此,迅速排出向上述收容槽120流入的药液,同时,当吸盘底座100旋转时,通过离心力使药液轻松向上述收容槽底部122的排水孔123移动并排出。
未记述的附图标记900为旋转驱动吸盘底座100的马达。
本发明的实施例仅为例示性实施例,本技术领域的普通技术人员将理解,在所附发明要求保护范围内,多种变形及等同的其他实施例是可行的。
Claims (11)
1.一种包括超声波清洗单元的基板处理装置,其特征在于,包括:
吸盘底座,能够以旋转轴为中心进行旋转;
吸盘销,设置在上述吸盘底座,用于固定基板;以及
超声波清洗单元,设置在上述吸盘底座的上部,用于对基板的背面进行超声波清洗。
2.根据权利要求1所述的包括超声波清洗单元的基板处理装置,其特征在于,上述超声波清洗单元包括:
超声波清洗头部,当从俯视图观察时,形成以上述旋转轴为中心来沿着半径方向延伸的形状,在上部面形成有朝向基板的内部清洗流路;
清洗液内部供给管,第一出口与上述超声波清洗头部连接,从而与上述内部清洗流路连通;以及
清洗液外部供给管,配置在上述超声波清洗头部的外部,第二出口朝向基板。
3.根据权利要求2所述的包括超声波清洗单元的基板处理装置,其特征在于,沿着上述基板的半径方向,在上述基板上,上述清洗液外部供给管朝向的位置比内部清洗流路朝向的位置远。
4.根据权利要求3所述的包括超声波清洗单元的基板处理装置,其特征在于,在上述吸盘底座的中心,作为非旋转部的流体流动引导管沿着上下方向延伸设置,在上述流体流动引导管收容上述清洗液内部供给管和清洗液外部供给管,从而沿着上下方向延伸配置。
5.根据权利要求4所述的包括超声波清洗单元的基板处理装置,其特征在于,当从俯视图观察时,在上述内部清洗流路的附近,在超声波清洗头部的周围设置适配器,上述清洗液内部供给管通过上述适配器引出并与上述超声波清洗头部连接,上述清洗液外部供给管通过上述适配器引出并朝向上述基板的背面。
6.根据权利要求2所述的包括超声波清洗单元的基板处理装置,其特征在于,当从俯视图观察时,上述内部清洗流路的排出口在基板的中心附近配置在上述超声波清洗头部的宽度方向中心,当从侧视图观察上述超声波清洗头部时,上述内部清洗流路朝向基板的背面沿着半径方向倾斜延伸。
7.根据权利要求2所述的包括超声波清洗单元的基板处理装置,其特征在于,当从俯视图观察时,上述清洗液外部供给管的喷射方向以具有上述吸盘底座的旋转方向成分的方式倾斜配置,以相对于以上述旋转轴为中心的半径方向朝向上述超声波清洗头部。
8.根据权利要求2所述的包括超声波清洗单元的基板处理装置,其特征在于,当从俯视图观察时,上述超声波清洗头部的宽度从上述旋转轴朝向上述半径方向逐渐变宽,并在预设位置中,从端部之间的位置开始恒定维持。
9.根据权利要求1至8中任一项所述的包括超声波清洗单元的基板处理装置,其特征在于,在上述超声波清洗头部的内部,沿着长度方向设置板状的振子,当从横向剖视图观察时,一对上述振子倾斜展开,展开部分朝向上述基板。
10.根据权利要求9所述的包括超声波清洗单元的基板处理装置,其特征在于,上述振子的宽度朝向基板的边缘逐渐变宽。
11.根据权利要求4或5所述的包括超声波清洗单元的基板处理装置,其特征在于,还包括冷却用气体管,收容在上述流体流动引导管并沿着其长度方向延伸,与上述超声波清洗头部的内部连通。
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