CN116642452A - Wafer carrying mechanical arm flatness inspection tool and inspection method - Google Patents
Wafer carrying mechanical arm flatness inspection tool and inspection method Download PDFInfo
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- CN116642452A CN116642452A CN202310673286.9A CN202310673286A CN116642452A CN 116642452 A CN116642452 A CN 116642452A CN 202310673286 A CN202310673286 A CN 202310673286A CN 116642452 A CN116642452 A CN 116642452A
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- 238000007689 inspection Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 27
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010998 test method Methods 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a wafer carrying mechanical arm flatness inspection tool which comprises a base (1), a fixed positioning plate (2) for positioning a working end (801), a movable positioning plate (3) for positioning an assembly end (802), and a lifting assembly (4) which is arranged on the base (1) in an operating mode, wherein the movable positioning plate (3) is arranged on the lifting assembly (4), the fixed positioning plate (2) is arranged on the base (1), a first positioning groove matched with the working end (801) is formed in the upper end of the fixed positioning plate (2), a second positioning groove (301) matched with the assembly end (802) is formed in the upper end of the movable positioning plate (3), and the lifting assembly (4) drives the movable positioning plate (3) to lift so that the assembly end (802) abuts against the bottom surface of the second positioning groove (301). The invention also discloses a test method. The invention solves the technical problems of low inspection efficiency and poor inspection accuracy, and has high inspection efficiency and high inspection accuracy.
Description
Technical Field
The invention relates to the technical field of wafer processing equipment, in particular to a wafer carrying mechanical arm flatness inspection tool and an inspection method.
Background
In the semiconductor process, the wafer carrying mainly relies on the wafer carrying mechanical arm for carrying the wafer between the reaction cavity and the transmission cavity, and the wafer carrying between the wafer box and the wafer boat also mainly relies on the wafer carrying mechanical arm, wherein the flatness of the wafer carrying mechanical arm and the wafer releasing part is particularly important, and a three-coordinate measuring machine is required to be used for detecting the flatness of the working plane of the wafer carrying mechanical arm after the product processing is finished, so that products with unqualified flatness are removed, and the quality of the products to be discharged is ensured.
According to an existing inspection method, an assembly end of a wafer carrying mechanical arm is clamped to cause a working end contacting a wafer to be suspended, flatness measurement is carried out on the working end, and as the working end area is acted by the touch force measured by a measuring head of a contact three-coordinate measuring machine, the further the working end is away from the assembly end, the flatness is worse, flatness detection errors are biased, a lifting block pad is used below the assembly end of the wafer carrying mechanical arm in a traditional inspection process, the working end of the wafer carrying mechanical arm falls on a marble platform, but due to the fact that the specifications of the wafer carrying mechanical arm are various, after the processed product is processed, the same product has small difference in height due to the specification range, the dimension is different, inspection preparation is carried out for each measurement, time consumption is serious, and a large amount of manpower is occupied for inspection preparation. Therefore, a new technical solution is needed to solve the above technical problems.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a wafer carrying mechanical arm flatness inspection tool, which solves the technical problems of low inspection efficiency and poor inspection accuracy. Another object of the present invention is to provide an inspection method, which simplifies the inspection steps and improves the inspection efficiency.
In order to achieve the technical purpose and meet the technical requirements, the invention adopts the technical scheme that: the utility model provides a wafer transport robotic arm flatness inspection frock, its characterized in that, is in including base, the fixed locating plate that is used for the location work end, the movable locating plate that is used for the location assembly end, steerable setting are in lifting unit on the base, the movable locating plate sets up on the lifting unit, the fixed locating plate sets up on the base, fixed locating plate upper end be provided with work end assorted first constant head tank, movable locating plate upper end be provided with assembly end assorted second constant head tank, lifting unit drives the movable locating plate rises, makes assembly end with second constant head tank bottom surface supports and leans on.
As the preferable technical scheme, the base comprises a bottom plate and 2 side plates which are symmetrically arranged, wherein 2 side plates are respectively detachably arranged on two sides of the length direction of the bottom plate, and the fixed positioning plate is arranged between 2 side plates.
As the preferable technical scheme, the lifting component comprises a connecting rod which can be detached on the bottom plate, a rotary table which can be rotatably sleeved on the connecting rod, a transmission rod which is arranged at the upper end of the rotary table, a lifting sleeve which can be movably sleeved on the transmission rod, and a lifting plate which can be detachably arranged at the upper end of the lifting sleeve, wherein the movable positioning plate can be detachably arranged at the upper end of the lifting plate, and the connecting rod is inserted on the transmission rod.
As a preferable technical scheme, one side of each side plate, which faces the lifting plate, is provided with a guide block, and the lifting plate is in sliding connection with the guide block.
As an optimal technical scheme, the surface of the guide block facing the lifting plate is arc-shaped, a chute is arranged on one side of the lifting plate facing the guide block, and the guide block is embedded in the chute.
As a preferable technical scheme, the outer circumference side of the transmission rod is provided with external threads, and the inner circumference side of the lifting sleeve is provided with internal threads matched with the external threads.
As a preferable technical scheme, the connecting rod comprises a rod body and a positioning column which are sequentially connected into a whole structure from top to bottom, and the positioning column is fixedly connected with the bottom plate.
As the preferable technical scheme, lift sleeve upper end circumference evenly is provided with a plurality of screw holes, insert in the screw hole and be equipped with a plurality of first bolts, be provided with 1 at least mounting hole on the carousel, insert in the mounting hole and be equipped with the second bolt, the transfer line passes through the second bolt with the carousel is connected.
As the preferable technical scheme, the first positioning groove comprises a first groove section and a second groove section which are symmetrically arranged, and a third groove section which is integrally connected with the first groove section and the second groove section, wherein the width of the third groove section is larger than the sum of the widths of the first groove section and the second groove section, one ends of the first groove section and the second groove section are intersected with the third groove section, and the first positioning groove and the second positioning groove form a U-like structure, and the second positioning groove is in a circular arch shape.
The invention also provides an inspection method, which is characterized in that the inspection tool is used for carrying out flatness inspection on the wafer carrying mechanical arm, and the method comprises the following steps:
respectively installing 2 side plates on two sides of the bottom plate in the length direction;
a fixed positioning plate is arranged between the 2 side plates;
the lifting assembly is arranged at the upper end of the bottom plate, and the movable positioning plate is arranged on the lifting assembly;
the working end is placed in the first positioning groove, and the assembly end is aligned with the second positioning groove;
operating the lifting assembly to drive the movable positioning plate to rise to a position below the assembly end, then slowly operating the lifting assembly to finely adjust the height of the movable positioning plate, and stopping operating after the bottom surface of the assembly end is contacted with the bottom surface of the second positioning groove;
flatness of the working and mounting ends was checked using a three-coordinate measuring machine.
The beneficial effects of the invention are as follows:
1) The working end is placed in the first positioning groove to perform preliminary positioning, the movable positioning plate is located below the assembly end, the lifting plate is driven to lift through the operation lifting assembly, so that the height of the movable positioning plate is adjusted, the movable positioning plate slowly rises, the bottom surface of the assembly end is attached to the bottom surface of the second positioning groove, the height difference is formed between the fixed positioning plate and the movable positioning plate, the mechanical arm can be better positioned, the lifting block is not required to be adjusted repeatedly to adjust the height, the clamping device is not required to clamp, the inspection efficiency is high, and the inspection is more accurate.
2) Preferably, the base is simple in structure and easy to install and detach.
3) Preferably, the carousel drives the transfer line and rotates, and the transfer line rotates around the yoke lever, and rotation stability is good, and lift sleeve lifts along the transfer line, and further preferably, lift sleeve and transfer line threaded connection, screw thread transmission stability is good, and the transmission is accurate.
4) Preferably, the guide block improves the stability of the movement of the lifter plate.
5) Preferably, the first bolt and the second bolt are convenient to install and detach.
6) Preferably, the first positioning groove and the second positioning groove have good positioning effect, and high inspection accuracy is improved.
7) The flatness inspection method has the advantages of simple steps, easy operation, high inspection efficiency and accurate inspection result.
Drawings
Fig. 1 is a tooling structure diagram of one embodiment provided by the invention.
Fig. 2 is an exploded view of a tooling according to one embodiment of the present invention.
Fig. 3 is a diagram illustrating a wafer handling robot according to an embodiment of the present invention.
Fig. 4 is a wafer handling state diagram according to one embodiment of the present invention.
In fig. 1-4, 1, a base; 101. a bottom plate; 102. a side plate; 2. fixing a positioning plate; 201. a first trough section; 202. a second trough section; 203. a third trough section; 3. a movable positioning plate; 301. a second positioning groove; 4. a lifting assembly; 401. a coupling rod; 4011. a rod body; 4012. positioning columns; 402. a turntable; 403. a transmission rod; 404. lifting the sleeve; 405. a lifting plate; 5. a guide block; 6. a first bolt; 7. a second bolt; 8. a wafer handling robot; 801. a working end; 8011. a first mechanical finger; 8012. a second mechanical finger; 802. an assembly end; 803. a connection end; 9. and (3) a wafer.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the present invention, it should be understood that, if the terms "head", "tail", "top", "bottom", "left", "right", "front", "rear", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, they are merely for convenience in describing the present invention, and do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, so that the terms describing the positional relationships in the drawings are merely for exemplary illustration, and are not to be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those of ordinary skill in the art according to specific circumstances.
Referring to fig. 1-4, an embodiment of the present invention provides a wafer handling robot flatness inspection tool, which includes a base 1, a fixed positioning plate 2 for positioning a working end 801, a movable positioning plate 3 for positioning an assembling end 802, and a lifting assembly 4 operatively disposed on the base 1, wherein the movable positioning plate 3 is disposed on the lifting assembly 4, the fixed positioning plate 2 is disposed on the base 1, a first positioning slot matched with the working end 801 is disposed at an upper end of the fixed positioning plate 2, a second positioning slot 301 matched with the assembling end 802 is disposed at an upper end of the movable positioning plate 3, and the lifting assembly 4 drives the movable positioning plate 3 to lift, so that the assembling end 802 abuts against a bottom surface of the second positioning slot 301. The working end 801 is placed in the first positioning groove to perform preliminary positioning, the movable positioning plate 3 is located below the assembly end 802, the lifting plate 405 is driven to lift through the operation of the lifting assembly 4, so that the height of the movable positioning plate 3 is adjusted, the movable positioning plate 3 slowly rises, the bottom surface of the assembly end 802 is attached to the bottom surface of the second positioning groove 301, the height difference is formed between the fixed positioning plate 2 and the movable positioning plate 3, the wafer carrying mechanical arm 8 can be better positioned, the lifting block is not required to be repeatedly adjusted to adjust the height, the clamping device is not required to clamp, the inspection efficiency is high, and the inspection is more accurate.
As shown in fig. 1 to fig. 4, in some embodiments, the base 1 includes a bottom plate 101, 2 symmetrically disposed side plates 102,2, and two side plates 102 detachably disposed on two sides of the bottom plate 101 in a length direction, the fixed positioning plate 2 is disposed between the 2 side plates 102, and the fixed positioning plate 2 is connected to the side plates 102 by a mounting manner such as bolts, fastening pins or welding, and the fixed positioning plate 2 is mounted between the 2 side plates 102, which has a simple structure, low cost, light weight, and convenient installation and detachment.
As shown in fig. 1-4, in some embodiments, the lifting assembly 4 includes a coupling rod 401 detachably mounted on the base plate 101, a turntable 402 rotatably sleeved on the coupling rod 401, a transmission rod 403 mounted on the upper end of the turntable 402, a lifting sleeve 404 movably sleeved on the transmission rod 403, and a lifting plate 405 detachably mounted on the upper end of the lifting sleeve 404, the movable positioning plate 3 is detachably mounted on the upper end of the lifting plate 405, the coupling rod 401 is inserted on the transmission rod 403, further, an external thread is disposed on the outer circumferential side of the transmission rod 403, an internal thread matched with the external thread is disposed on the inner circumferential side of the lifting sleeve 404, the turntable 402 and the transmission rod 403 rotate around the coupling rod 401, the rotation stability is good, the transmission rod 403 rotates to play a role in transmission, thereby driving the lifting plate 405 to lift, and the lifting sleeve 404 and the transmission rod 403 adopt thread transmission, the thread transmission stability is good, and the transmission is accurate.
As shown in fig. 1 to fig. 4, in some embodiments, a guide block 5 is disposed on a side of each side plate 102 facing the lifting plate 405, the lifting plate 405 is slidably connected with the guide block 5, further, a surface of the guide block 5 facing the lifting plate 405 is arc-shaped, a sliding groove is disposed on a side of the lifting plate 405 facing the guide block 5, the guide blocks 5 are embedded in the sliding groove, and the sliding and lifting effects of the lifting plate 405 are good due to mutual matching and guiding between the arc-shaped surfaces.
As shown in fig. 1-4, in some embodiments, the connecting rod 401 includes a rod body 4011 and a positioning column 4012 sequentially connected from top to bottom to form an integral structure, the positioning column 4012 is fixedly connected with the bottom plate 101, and the positioning column 4012 facilitates positioning and installation of the connecting rod 401, and improves installation efficiency.
As shown in fig. 1 to fig. 4, in some embodiments, the circumference of the upper end of the lifting sleeve 404 is uniformly provided with a plurality of threaded holes, a plurality of first bolts 6 are inserted into the threaded holes, at least 1 mounting hole is formed in the turntable 402, a second bolt 7 is inserted into the mounting hole, and the transmission rod 403 is connected with the turntable 402 through the second bolt 7, so that all the transmission rods are detachably connected, and the installation and the disassembly are convenient, thereby improving the installation efficiency. The transmission rod 403 may also be connected to the turntable 402 by welding.
As shown in fig. 1 to fig. 4, in some embodiments, the first positioning groove includes a first groove section 201 and a second groove section 202 that are symmetrically arranged, and a third groove section 203 that is integrally connected with the first groove section 201 and the second groove section 202, where a width of the third groove section 203 is greater than a sum of widths of the first groove section 201 and the second groove section 202, one ends of the first groove section 201 and the second groove section 202 meet with the third groove section 203, and form a U-like structure, and the second positioning groove 301 is in a dome shape.
The wafer handling mechanical arm 8 comprises a working end 801, a connecting end 803 and an assembling end 802 which are sequentially connected, wherein the working end 801 comprises first mechanical fingers 801 which are symmetrically arranged; 8011 and second mechanical finger 8012, link 803 and assembly end 802, the tail end of first mechanical finger 8011 and second mechanical finger 8012 is the structure of upwards buckling, can carry out spacing to wafer 9, the front end of first mechanical finger 8011 and second finger meets in link 803, then link 803 upwards inclines, and be connected with assembly end 802, constitute step structure, first slot section 201 cooperates with first mechanical finger 8011, second slot section 202 cooperates with second mechanical finger 8012, third slot section 203 cooperates with link 803, assembly end 802 is dome-shaped, second constant head tank 301 cooperates with assembly end 802.
The arc matched with the wafer 9 is arranged at one end of the connecting part towards the wafer 9, the wafer 9 can be radially limited, the conveying stability is improved, the height difference is formed between the assembling end 802 and the working end 801, so that the flatness inspection is difficult, through repeated research of the inventor, the tool disclosed by the invention is designed, the movable positioning plate 3 is attached to the assembling end 802 by operating the lifting assembly 4, the problem of the height difference is not worried, the wafer conveying mechanical arm 8 is not damaged in a clamping mode without using a plurality of lifting blocks and clamping devices, the lifting assembly 4 can finely adjust the height of the movable positioning plate 3, the inspection result is more accurate, the wafer 9 cannot be damaged when the wafer conveying mechanical arm 8 conveys the wafer 9, the wafer 9 cannot fall down in the conveying process due to poor flatness, and the wafer 9 can be accurately conveyed to a designated position.
The invention also provides an inspection method, which uses the inspection tool to inspect the flatness of the wafer carrying mechanical arm 8, and comprises the following steps:
2 side plates 102 are respectively attached to both sides of the bottom plate 101 in the longitudinal direction;
a fixed positioning plate 2 is arranged between 2 side plates 102;
the lifting assembly 4 is arranged at the upper end of the bottom plate 101, and the movable positioning plate 3 is arranged on the lifting assembly 4;
placing working end 801 in the first positioning slot, and aligning fitting end 802 with the second positioning slot 301;
operating the lifting assembly 4 to drive the movable positioning plate 3 to rise to a position below the assembly end 802, then slowly operating the lifting assembly 4 to finely adjust the height of the movable positioning plate 3, and stopping operating when the bottom surface of the assembly end 802 contacts with the bottom surface of the second positioning groove 301;
flatness of the working end 801 and the mounting end 802 was checked using a three-coordinate measuring machine.
The whole method has simple steps and convenient operation, can rapidly and accurately position the wafer carrying mechanical arm 8, accurately adjust the height of the movable positioning plate 3, and improve the inspection precision and the inspection efficiency.
The above examples are provided for the purpose of clearly illustrating the invention and are not to be construed as limiting the invention, and other variants and modifications of the various forms may be made by those skilled in the art based on the description, which are not intended to be exhaustive of all embodiments, and obvious variants or modifications of the invention may be found within the scope of the invention.
Claims (10)
1. The utility model provides a wafer transport robotic arm flatness inspection frock, its characterized in that, is in including base (1), fixed locating plate (2) that are used for fixing a position work end (801), movable locating plate (3) that are used for fixing a position assembly end (802), steerable setting are in lifting unit (4) on base (1), movable locating plate (3) set up on lifting unit (4), fixed locating plate (2) set up on base (1), fixed locating plate (2) upper end be provided with work end (801) assorted first constant head tank, movable locating plate (3) upper end be provided with assembly end (802) assorted second constant head tank (301), lifting unit (4) drive movable locating plate (3) rise, make assembly end (802) with second constant head tank (301) bottom surface supports and leans on.
2. The wafer handling robot flatness inspection tool according to claim 1, wherein the base (1) comprises a bottom plate (101) and 2 symmetrically arranged side plates (102), the 2 side plates (102) are detachably arranged on two sides of the bottom plate (101) in the length direction, and the fixed positioning plate (2) is arranged between the 2 side plates (102).
3. The wafer handling robot flatness inspection tool according to claim 2, wherein the lifting assembly (4) comprises a coupling rod (401) detachably arranged on the bottom plate (101), a rotary table (402) rotatably sleeved on the coupling rod (401), a transmission rod (403) arranged at the upper end of the rotary table (402), a lifting sleeve (404) movably sleeved on the transmission rod (403), and a lifting plate (405) detachably arranged at the upper end of the lifting sleeve (404), wherein the movable positioning plate (3) is detachably arranged at the upper end of the lifting plate (405), and the coupling rod (401) is inserted on the transmission rod (403).
4. A wafer handling robot flatness inspection tool according to claim 3, wherein a guide block (5) is provided on a side of each side plate (102) facing the lifting plate (405), the lifting plate (405) being slidably connected to the guide block (5).
5. The wafer handling robot flatness inspection tool according to claim 4, wherein the surface of the guide block (5) facing the lifting plate (405) is arc-shaped, a chute is provided on one side of the lifting plate (405) facing the guide block (5), and the guide block (5) is embedded in the chute.
6. The wafer handling robot flatness inspection tool according to claim 3, wherein an outer peripheral side of the transmission rod (403) is provided with an external thread, and an inner peripheral side of the lifting sleeve (404) is provided with an internal thread matching the external thread.
7. The wafer handling robot flatness inspection tool according to claim 3, wherein the coupling rod (401) comprises a rod body (4011) and a positioning column (4012) which are sequentially connected into an integral structure from top to bottom, and the positioning column (4012) is fixedly connected with the bottom plate (101).
8. The wafer handling robot flatness inspection tool according to claim 3, wherein a plurality of threaded holes are uniformly formed in the circumference of the upper end of the lifting sleeve (404), a plurality of first bolts (6) are inserted into the threaded holes, at least 1 mounting hole is formed in the turntable (402), a second bolt (7) is inserted into the mounting hole, and the transmission rod (403) is connected with the turntable (402) through the second bolt (7).
9. The wafer handling robot flatness inspection tool according to claim 3, wherein the first positioning groove comprises a first groove section (201) and a second groove section (202) which are symmetrically arranged, and a third groove section (203) integrally connected with the first groove section (201) and the second groove section (202), the width of the third groove section (203) is larger than the sum of the widths of the first groove section (201) and the second groove section (202), one ends of the first groove section (201) and the second groove section (202) meet with the third groove section (203), and form a U-like structure, and the second positioning groove (301) is in a dome shape.
10. An inspection method characterized in that the wafer handling robot (8) is inspected for flatness using the inspection tool of claim 2, comprising the steps of:
2 side plates (102) are respectively arranged on two sides of the bottom plate (101) in the length direction;
a fixed positioning plate (2) is arranged between the 2 side plates (102);
the lifting assembly (4) is arranged at the upper end of the bottom plate (101), and the movable positioning plate (3) is arranged on the lifting assembly (4);
placing a working end (801) in the first positioning groove, and aligning an assembling end (802) with the second positioning groove (301);
operating the lifting assembly (4) to drive the movable positioning plate (3) to rise to a position below the assembly end (802), then slowly operating the lifting assembly (4) to finely adjust the height of the movable positioning plate (3), and stopping operating after the bottom surface of the assembly end (802) is contacted with the bottom surface of the second positioning groove (301);
the flatness of the working end (801) mounting end (802) is checked using a three-coordinate measuring machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310673286.9A CN116642452B (en) | 2023-06-08 | 2023-06-08 | Wafer carrying mechanical arm flatness inspection tool and inspection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310673286.9A CN116642452B (en) | 2023-06-08 | 2023-06-08 | Wafer carrying mechanical arm flatness inspection tool and inspection method |
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| CN116642452B CN116642452B (en) | 2024-03-05 |
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| CN112820660A (en) * | 2020-12-30 | 2021-05-18 | 无锡奇众电子科技有限公司 | Full-automatic wafer appearance inspection system |
| CN216348520U (en) * | 2021-09-09 | 2022-04-19 | 靖江先锋半导体科技有限公司 | Gas distributor flatness inspection tool and combined inspection tool |
| CN113858165A (en) * | 2021-09-27 | 2021-12-31 | 诠航科技有限公司 | Lifting device of hanger rail type inspection robot |
| KR20230046037A (en) * | 2021-09-29 | 2023-04-05 | (주)구일엔지니어링 | Wafer inspection system |
| CN114013717A (en) * | 2021-11-16 | 2022-02-08 | 苏州领裕电子科技有限公司 | Top-lifting cutting, waste shaking, detecting and variable-pitch blanking double-packaging integrated machine |
| CN216593076U (en) * | 2021-12-31 | 2022-05-24 | 霍山嘉远智能制造有限公司 | A fix a position frock fast for three-dimensional detects |
| CN217664790U (en) * | 2022-04-07 | 2022-10-28 | 成都领益科技有限公司 | Large-frame product top breaking, detecting and packaging equipment |
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