CN116598742A - Low-temperature coupler and application method thereof - Google Patents
Low-temperature coupler and application method thereof Download PDFInfo
- Publication number
- CN116598742A CN116598742A CN202310640202.1A CN202310640202A CN116598742A CN 116598742 A CN116598742 A CN 116598742A CN 202310640202 A CN202310640202 A CN 202310640202A CN 116598742 A CN116598742 A CN 116598742A
- Authority
- CN
- China
- Prior art keywords
- cavity
- signal
- direct current
- current part
- alternating current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract description 12
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 3
- 238000002955 isolation Methods 0.000 claims description 29
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 239000002096 quantum dot Substances 0.000 claims description 10
- 230000002194 synthesizing effect Effects 0.000 claims description 2
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 11
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 11
- 238000003786 synthesis reaction Methods 0.000 description 11
- 238000013461 design Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
Abstract
The application provides a low-temperature coupler and a use method thereof, wherein the low-temperature coupler comprises a cavity, a cover is covered at an opening of the cavity, a PCB (printed circuit board) is arranged in the cavity, and the PCB comprises an alternating current part and a direct current part; the alternating current part is provided with an alternating current functional module, and an input port of the alternating current part inputs a radio frequency signal and a pulse signal; the direct current part is provided with an intermediate frequency functional module and a low frequency pulse functional module which are connected with each other, and the intermediate frequency functional module and the low frequency pulse functional module are both provided with devices for inhibiting signal interference; the signal of the alternating current part and the signal of the direct current part are output through the same output port. The application can not only be compatible with 4-8GHz continuous microwave signals, but also be compatible with any wave pulse signal of 10MHz at the lowest, and inhibit serious deformation of the signals.
Description
The application discloses a low-temperature coupler and a use method thereof, wherein the application date is 2018, 7, 2, 201810707677.7.
Technical Field
The application relates to the technical field of couplers, in particular to a low-temperature coupler and a use method thereof.
Background
The manipulation of qubits depends on a high precision analog input signal. For superconducting qubits, the signals it relies on are largely divided into three categories, high frequency pulses (4-8 GHz band), intermediate frequency pulses (0.01-500 MHz band), and dc bias signals (< 1 kHz). When manipulating superconducting qubits, we need to apply these three types of pulse signals simultaneously, and also need to synthesize the above signals in one channel, and we usually use multiport coupling devices or modules to complete the synthesis of the signals. Considering the characteristics of the pulse signal, the coupling device or module must have an extremely high port impedance matching design while synthesizing the signal. The port impedance matching performance of passive multi-port coupled devices is generally poor and sometimes requires the use of complex active modules to achieve high quality signal synthesis.
The superconducting qubit works at the extremely low temperature of about 30mK, and before the three types of signals enter a quantum chip containing the superconducting qubit, the signals need to be optimized through completely different low-temperature circuits, so that the synthesis can be performed only at the extremely low temperature. However, the prior art fails to meet the following requirements for the following applications: the intermediate frequency pulse and direct current bias signal synthesis of the superconducting qubit is realized at extremely low temperature.
Firstly, the active multiport coupling module needs additional power supply and signal input, consumes huge power and cannot be used in an extremely low-temperature environment; and secondly, a passive multi-port coupling device capable of stably working in an extremely low temperature environment cannot achieve good port impedance matching, and serious deformation degradation can be generated on a medium-frequency pulse signal. More generally, the prior art cannot provide a technical solution that satisfies perfect synthesis of the intermediate frequency pulse signal and the dc bias signal.
Disclosure of Invention
The application aims to solve the technical problem that the prior art cannot meet the problem of realizing the synthesis of intermediate frequency pulse and direct current bias signal of superconducting quantum bits at extremely low temperature.
The application adopts the following technical means to solve the technical problems:
the low-temperature coupler comprises a cavity, wherein a cover is covered at an opening of the cavity, a PCB (printed circuit board) is arranged in the cavity, and the PCB comprises an alternating current part and a direct current part;
the alternating current part is provided with an alternating current functional module, and an input port of the alternating current part inputs a radio frequency signal and a pulse signal;
the direct current part is provided with an intermediate frequency functional module and a low frequency pulse functional module which are connected with each other, and the intermediate frequency functional module and the low frequency pulse functional module are both provided with devices for inhibiting signal interference;
the signal of the alternating current part and the signal of the direct current part are output through the same output port.
Further, the cavity is formed by enclosing the bottom and the side wall, the middle part of the cavity is connected with an isolation block, the isolation block divides the cavity into two communicated parts, namely a first signal cavity and a second signal cavity, and a direct current input port is formed in the side wall of the first signal cavity; the side wall of the second signal cavity is provided with an alternating current input port, the side wall is also provided with a mixed output port, and connectors are arranged at the direct current input port, the alternating current input port and the mixed output port;
the alternating current part input port of the PCB corresponds to the alternating current input port on the cavity; the direct current part signal input port of the PCB corresponds to the direct current input port on the cavity; and the output port of the PCB corresponds to the mixed output port on the cavity.
Further, a signal input port of the direct current part is connected with the low-frequency pulse functional module.
Further, the device for suppressing signal interference of the intermediate frequency functional module comprises a plurality of high-frequency inductors, and the device for suppressing signal interference of the low-frequency pulse functional module comprises a plurality of low-frequency inductors.
Further, the device for suppressing signal interference includes a plurality of resistive elements.
Further, the isolation blocks comprise a first isolation block and a second isolation block which are opposite and are arranged at intervals, and the first isolation block and the second isolation block are integrally formed with the side wall of the corresponding side.
Further, grooves are formed in the direct current input port, the alternating current input port and the mixed output port, through holes are formed in the middle of the grooves, the connector is fixedly connected with the grooves, and the needle core penetrates through the through holes.
Further, the PCB is attached and fixed to the bottom of the cavity through screws.
Further, the back of the cavity is connected with a fixed block, and the fixed block is provided with a connecting hole.
Further, the fixing block and the back of the cavity are integrally formed.
Further, a cover groove is formed in the end face of the side wall, the cover groove is matched with the outer edge of the cover, and the cover groove is connected with the cover through screw fastening.
Furthermore, the low-temperature coupler is made of red copper, the red copper has excellent heat conductivity, and when the low-temperature coupler works, generated heat is led out to the external environment through contact of the red copper.
The application also provides a using method of the low-temperature coupler, wherein the input port of the direct current part of the coupler is connected to a direct current source, and the input port of the alternating current part of the coupler is connected to an arbitrary waveform generator. The output port of the coupler is connected to the quantum chip, and the coupler and the quantum chip are both in an extremely low temperature environment with the temperature lower than 30mK in the dilution refrigerator; when in use, the direct current signal output by the direct current source and the pulse signal output by the AWG are simultaneously input into the coupler through the low-temperature circuit, and are combined and output to the quantum chip from the output port. The signal synthesis example shows that the synthesized signal can well retain the pulse component and the direct current component at the same time, so that the application method can meet the condition that the intermediate frequency pulse and the direct current bias signal of the superconducting quantum bit are synthesized at the extremely low temperature, which is required by the quantum chip.
The application has the following beneficial effects:
according to the application, the low-frequency pulse functional module and the intermediate-frequency functional module are arranged on the PCB, and the signal fluctuation is restrained within a certain range through the device for restraining the signal interference, so that the microwave device can be compatible with 4-8GHz continuous microwave signals, and meanwhile, can be compatible with any wave pulse signal of 10MHz at the lowest, and the isolation degree between ports is increased by utilizing the physical structure of the cavity. The microwave device can effectively reduce standing wave ratio among three ports, realize good impedance matching, greatly increase isolation among ports and inhibit serious deformation of signals. The microwave device has the advantages of simple circuit design, few types and numbers of selected electronic components, reduced design cost, convenient installation and reliable performance.
The application can stably work in an extremely low temperature environment below 30 mK; the power consumption is extremely low, and the heat cannot be generated; the working frequency band completely meets the perfect synthesis requirement of intermediate frequency pulse and direct current bias signal required by superconducting quantum bit; the port impedance is close to 50 ohms, the pulse waveform of the intermediate frequency pulse signal is not deteriorated, and the amplitude of the direct current bias signal is not uncontrollably reduced.
Drawings
FIG. 1 is a perspective view of a coupler according to an embodiment of the present application, with the cover not shown;
FIG. 2 is a perspective view of another angle of the coupler in an embodiment of the application;
FIG. 3 is a block diagram of a cover in an embodiment of the application;
fig. 4 is a functional schematic of a PCB board according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a method of using an embodiment of the application in the field of superconducting quantum chip measurement and control.
Detailed Description
For a further understanding and appreciation of the structural features and advantages achieved by the present application, reference should be made to the following detailed description of the preferred embodiments and accompanying drawings, in which:
a low-temperature coupler and a using method thereof are shown in figures 1-3, and comprises a cavity 1, a cover 2, a connector 3 and a PCB 4.
The cavity 1 is surrounded by the bottom 11 and the side wall 12, the middle part of the cavity 1 is connected with the isolation block 121, the isolation block 121 comprises a first isolation block 1211 and a second isolation block 1212 which are opposite and are arranged at intervals, and the first isolation block 1211 and the second isolation block 1212 are integrally formed with the side wall 12 on the corresponding side. The first isolation block 1211 and the second isolation block 1212 are separated by a distance, so that the isolation block 121 divides the interior of the cavity 1 into two communicating parts, namely a first signal cavity 13 and a second signal cavity 14, respectively, a direct current input port 15 is formed on the side wall of the first signal cavity 13, and an alternating current input port 16 and a mixed output port 17 are formed on the side wall of the second signal cavity 14. In this embodiment, as shown in fig. 1, the first signal cavity 13 is located at the left side of the isolation block 121, the second signal cavity 14 is located at the right side of the isolation block 121, the dc input port 15 is opened on the left side wall of the cavity, the ac input port 16 is opened on the upper side wall of the cavity, and the mixed output port 17 is located on the second signal cavity 14 and opened on the lower side wall of the cavity. The isolation block 121 may be provided to greatly enhance isolation between ports. Preferably, the back of the cavity 1 is integrally formed with a fixing block 19, and a plurality of connecting holes 191 are formed in the fixing block 19 for connecting the coupler with other components.
The end surface of the side wall 12 is provided with a cover groove 122, the outer edge of the cover 2 is matched with the cover groove 122, and the cover 2 is fastened and connected with the cover groove 122 through M2 screws.
The connectors 3 are mounted at the dc input port 15, the ac input port 16 and the hybrid output port 17, respectively. And the outer ports of the direct current input port 15, the alternating current input port 16 and the mixed output port 17 are respectively provided with a groove 18, the middle part of the groove 18 is provided with a through hole (not labeled in the figure), two sides of the connector 3 are fixedly connected with the groove 18 through screws, and the needle core 31 of the connector 3 passes through the through holes. In this embodiment, the connector 3 is an SMA connector.
The PCB 4 is arranged in the cavity 1 and is connected and attached to the bottom 11 through M2 screws, and the needle core 31 of the connector passes through the through hole and is positioned on the surface of the PCB 4; the PCB board 4 includes an ac part and a dc part. The surface of the PCB 4 is designed by bare copper, so that the PCB is attached to the bottom 11 of the cavity.
As shown in fig. 4, the ac part is provided with an ac functional module 41, and the ac part input port 411 corresponds to the ac input port 16 on the cavity 1, and the port inputs a radio frequency signal and a pulse signal; the ac part signal output port is a hybrid output port 17.
The dc portion is provided with an intermediate frequency function module 421 and a low frequency pulse function module 422, and the intermediate frequency function module 421 and the low frequency pulse function module 422 are provided with devices (not labeled in the figure) for suppressing signal interference. The signal input port 423 of the direct current part may be connected to the low frequency pulse function module 422 or the intermediate frequency function module 421. In this embodiment, the signal input port 423 of the dc part is connected to the low frequency pulse function module 422. Preferably, the device for suppressing signal interference of the intermediate frequency function module 421 includes a plurality of high frequency inductors, and the device for suppressing signal interference of the low frequency pulse function module 422 includes a plurality of low frequency inductors. In addition, the device for suppressing signal interference may further include a plurality of resistors (not shown). In this embodiment, 3 high-frequency inductors and 3 low-frequency inductors are respectively disposed, and the high-frequency inductors and the low-frequency inductors may be arranged arbitrarily. The direct current part signal input port 423 is a direct current input port 15 on the cavity 1 and is connected with a direct current signal input end; the direct current part signal output port is a mixed output port 17 on the cavity 1.
The radio frequency signal and the pulse signal flow into the alternating current functional module 41 from the alternating current part input port 411 and then flow to the mixed output port 17; the direct current signal flows from the direct current partial signal input port 423 into the low frequency pulse function module 422 and the intermediate frequency function module 421 in sequence, and then flows to the mixing input port 17, and the direct current partial signal and the alternating current partial signal are converged and flow out at the mixing output port 17.
The following are examples of signal synthesis: the intermediate frequency pulse signal t=10us, t=1us with a duty ratio of 10% is input from the ac part input port 411 through the ac functional module 41, the dc signal port 423 is input with a dc bias signal of current i=10ma, the 2 signals overlap at the node, the signal at the mixed output port 17 is t=10us, and the t=1us with a duty ratio of 10% overshoots by 2%.
The coupler comprises the following steps when being manufactured:
(1) Determining the size of the cavity 1, the first signal cavity 13, the second signal cavity 14 and the isolation block 121 according to the outline of the designed PCB 4; in order to ensure that the connector pin 31 can be positioned above the PCB 4, the depth of the cavity 1 is determined according to the specification of the connector 3 and the thickness of the PCB 4, and the depth of the recess 18 and the diameter of the through hole are reserved due to the insulating layer attached to the upper surface of the connector pin 31.
(2) Cleaning a machined part, placing the functional module of the PCB 4 in a corresponding signal cavity by horizontally placing the PCB 4 at the bottom of the cavity 1, adjusting the position of a screw hole of the PCB 4 to correspond to the position of the screw hole in the cavity, and fixing and attaching by using a screw.
(3) The connector 3 is used in the groove 18 on the side wall of the machined part, a connector flange (not shown) is positioned in the groove 18, meanwhile, an insulating sleeve of the connector 3 is positioned at a through hole of the groove, a needle core 31 of the connector 3 is positioned on the side wall of the cavity and positioned on the surface of the PCB 4, the connector 3 is fixed at the connector flange by using screws, and a signal port of the PCB and the needle core of the connector are welded together by using soldering tin.
(4) The cover is placed in the cover groove and fixed by using screws.
According to the embodiment, the low-frequency pulse functional module and the intermediate-frequency functional module are arranged on the PCB, and the signal fluctuation is restrained within a certain range through the device for restraining the signal interference, so that the microwave device can be compatible with 4-8GHz continuous microwave signals, meanwhile, can be compatible with any wave pulse signal of the lowest 10MHz, and the isolation degree between ports is increased by utilizing the physical structure of the cavity. The microwave device can effectively reduce standing wave ratio among three ports, realize good impedance matching, greatly increase isolation among ports and inhibit serious deformation of signals. The microwave device has the advantages of simple circuit design, few types and numbers of selected electronic components, reduced design cost, convenient installation and reliable performance.
The coupler provided by the embodiment can stably work in an extremely low-temperature environment below 30mK, and the used materials can bear the differences of expansion and contraction caused by temperature change, electrical conductivity, thermal conductivity, mechanical property and the like, and can stably work in an extremely low-temperature environment below 30 mK;
the DC offset signal coupling input end has extremely low power consumption, does not cause heating, has the insertion loss of 0.7dB from the DC offset signal coupling input end to the intermediate frequency pulse coupling input end, has the output frequency band of 4-8G, has the insertion loss of 1.8dB and has the voltage standing wave ratio of 1.3;
the working frequency band completely meets the perfect synthesis requirement of intermediate frequency pulse and direct current bias signal required by superconducting quantum bit, the input frequency band of 4-8G of the intermediate frequency pulse coupling input end and the voltage standing wave ratio of 1.5 can perfectly support the input of intermediate frequency pulse signal;
the impedance of the port is close to 50 ohms, the pulse waveform of the intermediate frequency pulse signal is not deteriorated, and the amplitude of the direct current bias signal is not uncontrollably reduced;
the used materials and the processing technology can not introduce any magnetic component pollutants, which is extremely important for the regulation and control of superconducting qubits, and the quality reduction of the superconducting qubits caused by the magnetic property of the coupler can be avoided;
the volume is small, the whole size is only 51.70x29.6x16.5mm, the integration is very easy, and the method can be used for the regulation and control engineering of a large-scale superconducting quantum bit chip.
Fig. 5 is a schematic diagram of a method for using the coupler in the field of measurement and control of superconducting quantum chips. The input port of the DC part of the coupler is connected to a DC source, and the input port of the AC part of the coupler is connected to an Arbitrary Waveform Generator (AWG). The output port of the coupler is connected to the quantum chip, and both the coupler and the quantum chip are in an extremely low temperature environment inside the dilution refrigerator down to below 30 mK. When in use, the direct current signal output by the direct current source and the pulse signal output by the AWG are simultaneously input into the coupler through the low-temperature circuit, and are combined and output to the quantum chip from the output port. The signal synthesis example shows that the synthesized signal can well retain the pulse component and the direct current component at the same time, so that the application method can meet the condition that the intermediate frequency pulse and the direct current bias signal of the superconducting quantum bit are synthesized at the extremely low temperature, which is required by the quantum chip.
The foregoing has shown and described the basic principles, principal features and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.
Claims (11)
1. A cryogenic coupler for superconducting qubits, comprising:
a DC part for connecting a DC source to provide a DC bias signal required by the qubit;
an alternating current part for connecting with an arbitrary waveform generator to provide an intermediate frequency signal required by the quantum bit;
the coupling part is connected with the direct current part and the alternating current part and is used for synthesizing the direct current bias signal and the intermediate frequency signal;
the device is characterized by also comprising a cavity;
the cavity comprises a first signal cavity and a second signal cavity which are isolated from each other but communicated with each other and are used for accommodating and isolating the alternating current part and the direct current part,
the direct current input port corresponding to the direct current part and the alternating current input port corresponding to the alternating current part are respectively arranged on the side walls of the first signal cavity and the second signal cavity;
the output port of the coupling portion is disposed on a sidewall of the second signal cavity.
2. The cryogenic coupler for superconducting qubits of claim 1 wherein: the cavity is isolated into a first signal cavity and a second signal cavity which are communicated with each other through an isolation block arranged in the cavity.
3. The cryogenic coupler for superconducting qubits of claim 2 wherein: the isolation block extends from the side wall of the cavity to the cavity and is integrally formed with the side wall of the cavity.
4. A cryogenic coupler for superconducting qubits according to claim 3, characterized in that: the isolation block comprises two sub isolation blocks which are oppositely arranged.
5. The cryogenic coupler for superconducting qubits of claim 1 wherein: connectors are arranged at the positions of the direct current input port corresponding to the direct current part, the alternating current input port corresponding to the alternating current part and the output port.
6. The cryogenic coupler for superconducting qubits of claim 5 wherein: the cavity is provided with a groove with a size matched with the connector at the joint of the cavity and the connector.
7. The cryogenic coupler for superconducting qubits of claim 1 wherein: the opening of the cavity is covered with a cover, and the joint of the cavity and the cover is provided with a cover groove with a size matched with that of the cover.
8. The cryogenic coupler for superconducting qubits of claim 1 wherein: the back of the cavity is provided with a fixed block, and the outer side of the fixed block is provided with a connecting hole mechanically connected with an external device.
9. The cryogenic coupler for superconducting qubits of claim 1 wherein: the direct current part comprises an intermediate frequency functional module and a low-frequency pulse functional module which are connected in series, and the intermediate frequency functional module and the low-frequency pulse functional module are both provided with devices for inhibiting signal interference.
10. The cryogenic coupler for superconducting qubits of claim 9, wherein: the device for suppressing signal interference in the intermediate frequency functional module comprises a plurality of high-frequency inductors, and the device for suppressing signal interference in the low-frequency pulse functional module comprises a plurality of low-frequency inductors.
11. Cryogenic coupler for superconducting qubits according to claim 1 or 9 or 10, characterized in that: the device for suppressing signal interference includes a plurality of resistive elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310640202.1A CN116598742A (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310640202.1A CN116598742A (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
| CN201810707677.7A CN108767404B (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810707677.7A Division CN108767404B (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116598742A true CN116598742A (en) | 2023-08-15 |
Family
ID=63975581
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810707677.7A Active CN108767404B (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
| CN202310640202.1A Pending CN116598742A (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810707677.7A Active CN108767404B (en) | 2018-07-02 | 2018-07-02 | Low-temperature coupler and application method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108767404B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109509951B (en) * | 2018-12-18 | 2024-04-05 | 本源量子计算科技（合肥）股份有限公司 | Bias-Tee device |
| CN109449552A (en) * | 2018-12-18 | 2019-03-08 | 合肥本源量子计算科技有限责任公司 | A kind of direct current signal and microwave signal synthesizer |
| CN109509717A (en) * | 2018-12-19 | 2019-03-22 | 合肥本源量子计算科技有限责任公司 | A kind of quantum chip stereo packaging system and packaging method |
| CN113054332B (en) * | 2019-12-27 | 2023-02-28 | 阿里巴巴集团控股有限公司 | Filter and quantum chip measurement and control system |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2389715B (en) * | 2002-05-13 | 2004-12-08 | Univ Cardiff | Method of combining signals and device therefor |
| US7401239B2 (en) * | 2004-09-03 | 2008-07-15 | Asoka Usa Corporation | Internal powerline power supply method and system |
| CN202663310U (en) * | 2012-02-13 | 2013-01-09 | 北京天地玛珂电液控制系统有限公司 | Flameproof and intrinsically-safe power supply device with coupler |
| CN202721252U (en) * | 2012-06-29 | 2013-02-06 | 合肥威科电子技术有限公司 | Direct current feed directional coupler |
| CN202817154U (en) * | 2012-08-31 | 2013-03-20 | 上海贝电实业（集团）股份有限公司 | Coupler with coupling terminal input with direct current signal, intermediate frequency signal and mobile-communication full frequency range signal |
| KR101619173B1 (en) * | 2014-05-09 | 2016-05-10 | 유승하 | Directional Coupler Having valiable Directors |
| CN105865632A (en) * | 2016-03-28 | 2016-08-17 | 浙江省计量科学研究院 | Portable blackbody metering furnace based on semiconductor and mini-sized water cooling and heat radiation technology |
| CN105789807A (en) * | 2016-04-06 | 2016-07-20 | 西安澳通电讯技术股份有限公司 | Intelligent cavity coupler with detection modules and manufacturing method thereof |
| CN206894325U (en) * | 2016-11-15 | 2018-01-16 | 伊戈尔电气股份有限公司 | A kind of control circuit of new low standby power loss |
| CN107860407A (en) * | 2017-10-24 | 2018-03-30 | 华中科技大学 | A kind of demodulation method and device of Michelson sonic transducer |
| CN208580835U (en) * | 2018-07-02 | 2019-03-05 | 合肥本源量子计算科技有限责任公司 | A kind of cryrogenic coupler |
-
2018
- 2018-07-02 CN CN201810707677.7A patent/CN108767404B/en active Active
- 2018-07-02 CN CN202310640202.1A patent/CN116598742A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN108767404B (en) | 2023-08-04 |
| CN108767404A (en) | 2018-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108767404B (en) | Low-temperature coupler and application method thereof | |
| JP7278034B2 (en) | Antenna Integrated Printed Wiring Board (“AIPWB”) | |
| CN110739537B (en) | High-density high-integration millimeter wave tile-type phase-controlled antenna T/R assembly | |
| Edwards et al. | Foundations for microstrip circuit design | |
| KR100511814B1 (en) | Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards | |
| US5668408A (en) | Pin grid array solution for microwave multi-chip modules | |
| US10541467B1 (en) | Integrated coaxial notch antenna feed | |
| WO2008148327A1 (en) | A single-board hardware device and radio-frequency blind-mated connecting device | |
| KR20210150578A (en) | Interlocking Modular Beamformer | |
| US20100020505A1 (en) | Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution | |
| JPH05204490A (en) | Device and method for electric transmission line interface | |
| WO1999053564A1 (en) | Orthogonal transition from coax to stripline for opposite sides of a stripline board | |
| CN208580835U (en) | A kind of cryrogenic coupler | |
| CN113484826B (en) | Integrated multifunctional power division switch network component based on vertical interconnection technology | |
| CN116321711A (en) | Transition structure for soldering-free connector and PCB coplanar waveguide | |
| US7423497B2 (en) | Device for coupling suspended stripline and NRD guides | |
| CN112165175B (en) | Complementary artificial impedance interface electromagnetic wave transmission line with high transmission efficiency | |
| US20210156889A1 (en) | High density waveguide assembly for millimeter and 5g applications | |
| CN112446494A (en) | Universal type dilution refrigerator multi-channel extensible signal measuring device | |
| Liang et al. | Application of digital PGA technology to K-band microcircuit and microwave subsystem packages | |
| Zongjie et al. | High density microwave interface interconnection based on elastic fuzz buttons | |
| Mueller | SMD-type 42 GHz waveguide filter | |
| CN106953150B (en) | Double-channel microstrip annular isolation assembly | |
| Phromloungsri et al. | Design high-directivity parallel-coupled lines using quadrupled inductive-compensated technique | |
| WO2022156385A1 (en) | Device for power dividing and phase shifting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |