CN113054332B - Filter and quantum chip measurement and control system - Google Patents
Filter and quantum chip measurement and control system Download PDFInfo
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- CN113054332B CN113054332B CN201911383547.3A CN201911383547A CN113054332B CN 113054332 B CN113054332 B CN 113054332B CN 201911383547 A CN201911383547 A CN 201911383547A CN 113054332 B CN113054332 B CN 113054332B
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- 238000005259 measurement Methods 0.000 title claims abstract description 104
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000004020 conductor Substances 0.000 claims abstract description 57
- 229920000642 polymer Polymers 0.000 claims abstract description 49
- 239000011358 absorbing material Substances 0.000 claims abstract description 35
- 239000013013 elastic material Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims 1
- 238000001914 filtration Methods 0.000 abstract description 24
- 230000000694 effects Effects 0.000 abstract description 17
- 230000002829 reductive effect Effects 0.000 abstract description 8
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 52
- 239000000843 powder Substances 0.000 description 33
- 239000010949 copper Substances 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 229910000859 α-Fe Inorganic materials 0.000 description 14
- 238000000034 method Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the application provides a filter and a quantum chip measurement and control system. The filter includes: a conductor and a ground body; a medium filling part is arranged between the conductor and the grounding body; the medium filling part is at least filled with electromagnetic wave absorbing materials; the electromagnetic wave-absorbing material at least comprises carbonyl iron powder and a low-temperature polymer. The quantum chip measurement and control system comprises a quantum chip, a measurement and control channel, a filter and a measurement and control instrument; one end of the measurement and control channel is connected with the quantum chip, and the other end of the measurement and control channel is connected with a measurement and control instrument; the filter is arranged on the measurement and control channel; through the application, the filtering effect of the filter can be improved, the size occupied by the electromagnetic wave-absorbing material can be reduced while the filtering effect is improved, the size of the filter can be further reduced, and the filter can be suitable for a quantum chip measurement and control system highly sensitive to a magnetic field.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a filter and quantum chip measurement and control system.
Background
In the quantum chip measurement and control system, a measurement and control channel between an external measurement and control instrument and a quantum chip needs to be established, so that the quantum chip cannot be completely isolated from the external environment, and external noise can reach the quantum chip through the measurement and control channel, thereby bringing interference to the quantum chip.
In one mode, an electromagnetic wave absorbing material can be arranged in the measurement and control channel, and the electromagnetic wave absorbing material can absorb high-frequency noise on the measurement and control channel.
Disclosure of Invention
The embodiment of the application shows a filter and a quantum chip measurement and control system.
In a first aspect, the present application shows a filter comprising:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a Cryogenic Polymer.
In an alternative implementation, the low temperature polymer includes a thermally conductive potting adhesive Stycast2850 or Stycast1266.
In an optional implementation manner, the volume ratio of the carbonyl iron powder to the low-temperature polymer in the electromagnetic wave-absorbing material is between 0.1 and 0.9.
In an alternative implementation manner, the volume ratio of the carbonyl iron powder to the low-temperature polymer in the electromagnetic wave-absorbing material is between 0.45.
In an alternative implementation, the conductor comprises an inner core of a coaxial wire;
the grounding body comprises a coaxial line shell;
the medium filling part includes a space between an outer shell of the coaxial line and an inner core of the coaxial line.
In an alternative implementation, the filter includes:
the form of the positional relationship between the conductor and the grounding body includes: coaxial, coplanar waveguide, stripline, and microstrip forms.
In an alternative implementation, the grounding body is a plastically-elastic material.
In an optional implementation, the filter further includes:
a first high-frequency signal connector and a second high-frequency signal connector;
the first high-frequency signal connector and the second high-frequency signal connector are respectively used for being connected with a measurement and control device in a measurement and control channel.
In an alternative implementation, the first high-frequency connector includes a first wire end and a first ground end, the first wire end is connected to one end of the conductor, and the first ground end is connected to one end of the ground body;
the second high-frequency connector includes a second wire end and a second ground end, the second wire end is connected to the other end of the conductor, and the second ground end is connected to the other end of the ground body.
In an alternative implementation, the first high frequency signal connector and the second high frequency signal connector include at least:
subminiature radio frequency connector A type SMA, subminiature radio frequency connector B type SMB, subminiature radio frequency connector push-plug type SMP and Nile-Kang Saiman bayonet BNC.
In a second aspect, the present application shows a quantum chip measurement and control system, the system comprising:
the device comprises a quantum chip, a measurement and control channel, a filter and a measurement and control instrument;
one end of the measurement and control channel is connected with the quantum chip, and the other end of the measurement and control channel is connected with the measurement and control instrument;
the filter is arranged on the measurement and control channel;
the filter includes:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a Cryogenic Polymer.
Compared with the prior art, the embodiment of the application has the following advantages:
in the present application, the filter band of the carbonyl iron powder is wide, and the filter band of ferrite powder such as manganese oxide (MnO) is wide. Therefore, carbonyl iron powder can absorb noise in more frequency bands than ferrite powder such as manganese oxide (MnO).
Secondly, the filtering capability of the carbonyl iron powder per unit volume or unit mass is high, and the filtering capability of the carbonyl iron powder per unit volume or unit mass is higher than that of the good metal conductor powder such as copper (Cu), so that the carbonyl iron powder per unit volume or unit mass can absorb more noise in each high frequency band than the good metal conductor powder such as copper (Cu). Therefore, the carbonyl iron powder has a better filtering effect than good metal conductor powder such as copper (Cu) and ferrite powder such as manganese oxide (MnO).
Secondly, because the carbonyl iron powder of unit volume or unit mass can absorb more noise in each high frequency band respectively, therefore, when reaching the same wave-absorbing effect, compare and need to use the quantity such as good metallic conductor powder such as copper (Cu), the quantity that uses the carbonyl iron powder can be less to can save the hardware cost and reduce the volume of wave filter, be more suitable for the limited quantum chip system of observing and controling in space. Alternatively, the filtering effect using carbonyl iron powder is better than using good metallic conductor powder such as copper (Cu) when the same volume is reached.
In addition, carbonyl iron powders are more suitable for quantum computing systems that are highly sensitive to magnetic fields, because they are less magnetic and much less magnetic than ferrite powders such as manganese oxide (MnO).
Drawings
Fig. 1 is a front view of a filter shown in accordance with an exemplary embodiment.
Fig. 2 is a cross-sectional view of a filter shown in accordance with an exemplary embodiment.
Fig. 3 is a front view of a filter shown in accordance with an exemplary embodiment.
Fig. 4 is a cross-sectional view of a filter shown in accordance with an exemplary embodiment.
Fig. 5 is a block diagram illustrating a structure of a quantum chip measurement and control system according to an exemplary embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
Since external noise can reach the quantum chip through the measurement and control channel and further can bring interference to the quantum chip, therefore, the electromagnetic wave absorbing material can be arranged in the measurement and control channel and can absorb external high-frequency noise.
Some electromagnetic wave absorbing materials in the prior art are not designed under an extremely low temperature condition, and have poor thermal conductivity, and under the condition that heat can also become noise of qubits, some electromagnetic wave absorbing materials in the prior art can not lead out the heat, and have poor thermal conductivity, that is, under the condition that thermal noise exists, thermal noise can not be filtered.
In another mode, a mixture of good metal conductor powder such as copper (Cu) and low-temperature polymer can be used as the electromagnetic wave absorbing material, but the mixture per unit volume has poor capability of absorbing noise of each high frequency band, which in turn leads to poor filtering effect.
In order to enable the filtering effect to at least meet the system requirements, more mixtures are required to be filled in the measurement and control channel, so that more mixtures can participate in the filtering work, thereby avoiding missing partial noise of each high frequency band and further improving the filtering effect.
However, the method is not suitable for a quantum chip measurement and control system with limited space because more mixture needs to be filled, and therefore, a larger volume needs to be occupied.
In another mode, a mixture including ferrite powder such as manganese oxide (MnO) and a low-temperature polymer can be used as the electromagnetic wave-absorbing material, but the filtering frequency band is narrow, and a part of high-frequency noise cannot be absorbed, that is, a part of high-frequency noise cannot be filtered, so that the filtering effect is poor.
In addition, the ferrite powder has larger magnetism, and is not suitable for a quantum chip measurement and control system highly sensitive to a magnetic field.
Therefore, in order to improve the filtering effect, reduce the volume occupied by the electromagnetic wave-absorbing material while improving the filtering effect, and in order to be applicable to a quantum chip measurement and control system highly sensitive to a magnetic field, the present application provides a filter, fig. 1 is a front view of a filter according to an exemplary embodiment, as shown in fig. 1, the filter includes:
The carbonyl iron powder is used for absorbing high-frequency noise, and the low-temperature polymer is used for guiding heat in the measurement and control channel in the conductor out of the filter under the condition of low temperature or extremely low temperature, namely guiding out of the measurement and control channel, so that the thermal noise is prevented from reaching the quantum chip measurement and control system, and the interference caused by the thermal noise on the measurement and control of a quantum bit in the quantum chip measurement and control system is avoided. Meanwhile, the low-temperature polymer also plays a role in filling and insulation.
The carbonyl iron powder and the low-temperature polymer in the medium filling part 03 can be uniformly distributed.
In the present application, the form of the positional relationship between the conductor 01 and the ground body 02 includes: the coaxial line type electromagnetic wave absorbing device comprises a coaxial line type, a coplanar waveguide type, a strip line type, a microstrip line type and the like, the form of the position relation between a conductor 01 and a grounding body 02 is not limited, and a medium filling part capable of filling electromagnetic wave absorbing materials is arranged between the conductor 01 and the grounding body 02.
Fig. 1 of the present application illustrates the coaxial line as the positional relationship between the conductor 01 and the grounding body 02, but does not limit the scope of the present application.
In the front view shown in fig. 1, the conductor 01 comprises an inner core of a coaxial line, the grounding body 02 comprises an outer shell of the coaxial line, and the dielectric filling 03 comprises a space between the outer shell and the inner core of the coaxial line.
Fig. 2 is a cross-sectional view of the filter, in which the conductor 01 is coaxial with the grounding body 02, and the diameter of the conductor 01 is smaller than that of the grounding body 02.
In the present application, the filter band of the carbonyl iron powder is wide, and the filter band of ferrite powder such as manganese oxide (MnO) is wide. Accordingly, carbonyl iron powder can absorb noise in more frequency bands than ferrite powder such as manganese oxide (MnO).
Secondly, the filtering ability per unit volume or unit mass of the carbonyl iron powder is high, and the filtering ability per unit volume or unit mass of the carbonyl iron powder is higher than that per unit volume or unit mass of the good metallic conductor powder such as copper (Cu), and thus, the carbonyl iron powder per unit volume or unit mass can absorb more noise in each high frequency band than the good metallic conductor powder such as copper (Cu). Therefore, the carbonyl iron powder has a better filtering effect than good metal conductor powder such as copper (Cu) and ferrite powder such as manganese oxide (MnO).
Secondly, because the carbonyl iron powder of unit volume or unit mass can absorb more noise in each high frequency band respectively, therefore, when reaching the same wave-absorbing effect, compare and need to use the quantity such as good metallic conductor powder such as copper (Cu), the quantity that uses the carbonyl iron powder can be less to can save the hardware cost and reduce the volume of wave filter, be more suitable for the limited quantum chip system of observing and controling in space. Alternatively, the filtering effect using carbonyl iron powder is better than using good metallic conductor powder such as copper (Cu) when the same volume is achieved.
In addition, carbonyl iron powders are more suitable for quantum computing systems that are highly sensitive to magnetic fields, because they are less magnetic and much less magnetic than ferrite powders such as manganese oxide (MnO).
In an alternative embodiment, the low temperature polymer comprises a thermally conductive potting adhesive Stycast2850 or Stycast1266. Of course, other types of low temperature polymers capable of conducting heat in the conductor out of the filter at low temperature and extremely low temperature also meet the requirement of the application, and the specific type of the low temperature polymer is not limited in the application.
In an alternative embodiment, the volume ratio of the carbonyl iron powder to the low-temperature polymer in the electromagnetic wave-absorbing material can be in a range from 0.1.
In an optional embodiment of the present application, in order to make the stopband attenuation of the filter higher and compromise the processability of the filter, that is, in order to balance the processability and filtering capability of the filter, the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave-absorbing material may be between 0.45.
If the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material of the medium filling part 03 is changed, the sum of the volume of the carbonyl iron powder and the volume of the low-temperature polymer in the electromagnetic wave absorbing material is changed.
The quantum chip measurement and control system can be respectively applied to different occasions, the requirements on noise filtering in different occasions are different, or the requirements on the transmission line characteristic impedance of a measurement and control channel are not only the same, or the requirements on cut-off frequency are different, or the requirements on stop band attenuation strength are different, and the like.
Therefore, the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material in the dielectric filling part 03, the diameter of the conductor, the diameter of the grounding body, the length of the conductor, the length of the grounding body, and/or the like can be dynamically adjusted according to actual requirements, so that the filter can meet corresponding requirements.
However, if the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material in the dielectric filling portion 03 is to be adjusted, the total volume of the carbonyl iron powder and the low-temperature polymer may be increased or decreased.
If the total volume of the carbonyl iron powder and the low-temperature polymer is increased, the space of the medium filling part 03 between the conductor 01 and the grounding body 02 may be insufficient, at this time, at least the grounding body 02 needs to be replaced to enlarge the space of the medium filling part 03 between the conductor 01 and the replaced grounding body 02, so that after the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave-absorbing material is adjusted, the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave-absorbing material can be accommodated in the space of the medium filling part 03 between the conductor 01 and the replaced grounding body 02.
If the total volume of the carbonyl iron powder and the low-temperature polymer is reduced, after the volume proportion between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave-absorbing material is adjusted, the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave-absorbing material cannot be filled in the space of the medium filling part 03 between the conductor 01 and the replaced grounding body 02, so that the low-temperature polymer cannot be in close contact with each other, the low-temperature polymer cannot be in close contact with the conductor, the low-temperature polymer cannot be in close contact with the grounding body, and the overall thermal conductivity of the filter can be reduced.
In order to avoid reducing the overall thermal conductivity of the filter, at least the grounding body 02 may be manually replaced to reduce the space of the dielectric filling part 03 between the conductor 01 and the replaced grounding body 02, so that the space of the ground-reduced dielectric filling part 03 may be adapted to the total volume of the carbonyl iron powder and the low-temperature polymer, that is, the carbonyl iron powder and the low-temperature polymer may be sufficiently filled in the space of the reduced dielectric filling part 03, thereby avoiding reducing the overall thermal conductivity of the filter.
However, in the case of increasing the total volume of the carbonyl iron powder and the low-temperature polymer and decreasing the total volume of the carbonyl iron powder and the low-temperature polymer, at least the grounding body 02 needs to be manually replaced, which not only causes troublesome manual operation, but also requires preparation of a plurality of types of grounding bodies 02 in advance, which results in high hardware cost.
Therefore, in order to reduce the complexity of manual operation and reduce the hardware cost, in another embodiment of the present application, the grounding body 02 is a plastic elastic material. For example, the shape of the grounding body can be molded and changed, and the grounding body 02 is made of an elastic material, so the space of the medium filling part 03 between the grounding body 02 and the conductor 01 can automatically change along with the change of the total volume of the carbonyl iron powder and the low-temperature polymer, that is, the grounding body 02 can adapt to various total volumes of the carbonyl iron powder and the low-temperature polymer, so that the grounding body 02 does not need to be manually replaced under the conditions of increasing the total volume of the carbonyl iron powder and the low-temperature polymer and reducing the total volume of the carbonyl iron powder and the low-temperature polymer, the complexity of manual operation can be reduced, and various grounding bodies 02 do not need to be prepared in advance, so the hardware cost can be reduced.
Wherein, observing and controling the passageway and often including a plurality of observing and controling the device, often serial connection in proper order between these observing and controling the device, in this application, can set up the filter between wherein two adjacent observing and controlling devices in observing and controlling the passageway, like this, the filter just need be connected respectively with two adjacent observing and controlling devices, for example, the one end of filter is connected with one observing and controlling device of two adjacent observing and controlling devices, and the other end of filter is connected with another observing and controlling device of two adjacent observing and controlling devices.
In order to enable one end of the filter to be connected to two adjacent measurement and control devices, respectively, referring to fig. 3 and 4, the filter further includes: a first high-frequency signal connector 04 and a second high-frequency signal connector 05; the first high-frequency signal connector 04 and the second high-frequency signal connector 05 are respectively used for being connected with a measurement and control device in a measurement and control channel.
Fig. 3 is a front view of the filter, and fig. 4 is a cross-sectional view of the filter.
The first high-frequency connector comprises a first lead end and a first grounding end, the first lead end is connected with one end of the conductor, and the first grounding end is connected with one end of the grounding body; the second high-frequency connector comprises a second lead end and a second grounding end, the second lead end is connected with the other end of the conductor, and the second grounding end is connected with the other end of the grounding body.
Wherein the first high-frequency signal connector and the second high-frequency signal connector at least comprise: SMA (Subminiature Version a, subminiature rf connector type a), SMB (Subminiature Version B), SMP (Subminiature Push-on), BNC (Bayonet Neill-excelman, niche-Kang Saiman Bayonet), and the like.
The application also provides a quantum chip measurement and control system, fig. 5 is a front view of the quantum chip measurement and control system shown according to an exemplary embodiment, as shown in fig. 5, the system includes:
the device comprises a quantum chip 11, a measurement and control channel 12, a filter 13 and a measurement and control instrument 14;
one end of the measurement and control channel 12 is connected with the quantum chip 11, and the other end of the measurement and control channel 12 is connected with the measurement and control instrument 14;
the filter 14 is arranged on the measurement and control channel 12;
the filter 14 includes:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and low-temperature Polymer (Cryogenic Polymer).
In the present application, the measurement and control instrument 14 is used to test the quantum chip 11, for example, when the measurement and control instrument 14 is required to test the quantum chip 11, the measurement and control instrument 14 may send a measurement and control instruction to the quantum chip 11 through the measurement and control channel 12, the quantum chip 11 receives the measurement and control instruction through the measurement and control channel 12, and then obtains a measurement and control signal according to the measurement and control instruction, where the measurement and control signal includes static data and dynamic operation data in the quantum chip 11, and the application is not limited to this. Then, the quantum chip 11 may send a measurement and control signal to the measurement and control instrument 14 through the measurement and control channel 12, and the measurement and control instrument 14 tests the quantum chip 11 based on the measurement and control signal.
External high-frequency noise may enter the quantum chip 11 through the measurement and control channel 12, and in order to avoid the external high-frequency noise from entering the quantum chip 11, the filter 14 may absorb the high-frequency noise in the measurement and control channel, so as to avoid the high-frequency noise from entering the quantum chip 11, and further avoid the external high-frequency noise from interfering with the quantum chip 11.
The carbonyl iron powder is used for absorbing high-frequency noise, and the low-temperature polymer is used for guiding heat in the measurement and control channel in the conductor out of the filter under the condition of low temperature or extremely low temperature, namely guiding out of the measurement and control channel, so that the thermal noise is prevented from reaching the quantum chip measurement and control system, and the interference caused by the thermal noise on the measurement and control of a quantum bit in the quantum chip measurement and control system is avoided. Meanwhile, the low-temperature polymer also plays a role in filling and insulation.
Wherein, carbonyl iron powder and low-temperature polymer in the medium filling part can be uniformly distributed.
In the present application, the filter band of the carbonyl iron powder is wide, and the filter band of ferrite powder such as manganese oxide (MnO) is wide. Accordingly, carbonyl iron powder can absorb noise in more frequency bands than ferrite powder such as manganese oxide (MnO).
Secondly, the filtering ability per unit volume or unit mass of the carbonyl iron powder is high, and the filtering ability per unit volume or unit mass of the carbonyl iron powder is higher than that per unit volume or unit mass of the good metallic conductor powder such as copper (Cu), and thus, the carbonyl iron powder per unit volume or unit mass can absorb more noise in each high frequency band than the good metallic conductor powder such as copper (Cu). Therefore, the carbonyl iron powder has a better filtering effect than good metal conductor powder such as copper (Cu) and ferrite powder such as manganese oxide (MnO).
Secondly, because the carbonyl iron powder of unit volume or unit mass can absorb more noise in each high frequency band respectively, therefore, when reaching the same wave-absorbing effect, compare and need to use the quantity such as good metallic conductor powder such as copper (Cu), the quantity that uses the carbonyl iron powder can be less to can save the hardware cost and reduce the volume of wave filter, be more suitable for the limited quantum chip system of observing and controling in space. Alternatively, the filtering effect using carbonyl iron powder is better than using good metallic conductor powder such as copper (Cu) when the same volume is achieved.
In addition, carbonyl iron powders are more suitable for quantum computing systems that are highly sensitive to magnetic fields, because they are less magnetic and much less magnetic than ferrite powders such as manganese oxide (MnO).
The embodiments in the present specification are all described in a progressive manner, and each embodiment focuses on differences from other embodiments, and portions that are the same and similar between the embodiments may be referred to each other.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or terminal apparatus that comprises the element.
The filter and the quantum chip measurement and control system provided by the application are introduced in detail, a specific example is applied in the text to explain the principle and the implementation mode of the application, and the description of the embodiment is only used for helping to understand the method and the core idea of the application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (7)
1. The quantum chip measurement and control system is characterized by comprising:
the device comprises a quantum chip, a measurement and control channel, a filter and a measurement and control instrument;
one end of the measurement and control channel is connected with the quantum chip, and the other end of the measurement and control channel is connected with the measurement and control instrument;
the filter is arranged on the measurement and control channel;
the filter includes:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a Cryogenic Polymer;
carbonyl iron powder and a Cryogenic Polymer in the medium filling part are uniformly distributed;
when the quantum chip is required to be tested by the measurement and control instrument, the measurement and control instrument sends a measurement and control instruction to the quantum chip through the measurement and control channel, the quantum chip receives the measurement and control instruction through the measurement and control channel and acquires a measurement and control signal according to the measurement and control instruction, the quantum chip sends the measurement and control signal to the measurement and control instrument through the measurement and control channel, and the measurement and control instrument tests the quantum chip based on the measurement and control signal;
the low-temperature polymer comprises heat-conducting pouring sealant Stycast2850 or Stycast1266;
the volume ratio of carbonyl iron powder to low-temperature polymer in the electromagnetic wave-absorbing material is 0.45.
2. The quantum chip measurement and control system of claim 1, wherein the conductor comprises an inner core of a coaxial wire;
the grounding body comprises a coaxial shell;
the medium filling part includes a space between an outer shell of the coaxial line and an inner core of the coaxial line.
3. The quantum chip measurement and control system of claim 1, wherein the filter comprises:
the form of the positional relationship between the conductor and the grounding body includes: coaxial, coplanar waveguide, stripline, and microstrip forms.
4. The quantum chip measurement and control system of claim 1, wherein the grounding body is a plastic elastic material.
5. The quantum chip measurement and control system of claim 1, wherein the filter further comprises:
a first high-frequency signal connector and a second high-frequency signal connector;
the first high-frequency signal connector and the second high-frequency signal connector are respectively used for being connected with a measurement and control device in a measurement and control channel.
6. The quantum chip measurement and control system of claim 5, wherein the first high frequency connector comprises a first wire end and a first ground end, the first wire end is connected with one end of the conductor, and the first ground end is connected with one end of the ground body;
the second high-frequency connector includes a second wire end and a second ground end, the second wire end is connected to the other end of the conductor, and the second ground end is connected to the other end of the ground body.
7. The quantum chip measurement and control system of claim 5, wherein the first and second high frequency signal connectors comprise at least:
subminiature radio frequency connector A type SMA, subminiature radio frequency connector B type SMB, subminiature radio frequency connector push-plug type SMP and Nile-Kang Saiman bayonet BNC.
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| CN202310316408.9A CN116487849A (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
| CN202310317052.0A CN116885417A (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
| CN201911383547.3A CN113054332B (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
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Citations (6)
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| CN202009367U (en) * | 2010-12-07 | 2011-10-12 | 刘晓东 | High frequency conduction wave filter |
| CN102513546A (en) * | 2011-12-22 | 2012-06-27 | 肇庆市羚光电子化学品材料科技有限公司 | Functional silver flake and preparation method thereof |
| CN203908698U (en) * | 2014-04-30 | 2014-10-29 | 上海出入境检验检疫局机电产品检测技术中心 | Anti-electromagnetic interference temperature sensing device |
| CN104892829A (en) * | 2015-05-21 | 2015-09-09 | 斯迪克新型材料（江苏）有限公司 | Wave-absorbing material for electromagnetic field shielding |
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| CN108767404A (en) * | 2018-07-02 | 2018-11-06 | 合肥本源量子计算科技有限责任公司 | A kind of cryrogenic coupler and its application method |
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2019
- 2019-12-27 CN CN201911383547.3A patent/CN113054332B/en active Active
- 2019-12-27 CN CN202310317052.0A patent/CN116885417A/en not_active Withdrawn
- 2019-12-27 CN CN202310316408.9A patent/CN116487849A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202009367U (en) * | 2010-12-07 | 2011-10-12 | 刘晓东 | High frequency conduction wave filter |
| CN102513546A (en) * | 2011-12-22 | 2012-06-27 | 肇庆市羚光电子化学品材料科技有限公司 | Functional silver flake and preparation method thereof |
| CN203908698U (en) * | 2014-04-30 | 2014-10-29 | 上海出入境检验检疫局机电产品检测技术中心 | Anti-electromagnetic interference temperature sensing device |
| CN104892829A (en) * | 2015-05-21 | 2015-09-09 | 斯迪克新型材料（江苏）有限公司 | Wave-absorbing material for electromagnetic field shielding |
| CN108641373A (en) * | 2018-05-16 | 2018-10-12 | 浙江禾为新材料科技有限公司 | A kind of high band heat conduction suction wave insulating materials |
| CN108767404A (en) * | 2018-07-02 | 2018-11-06 | 合肥本源量子计算科技有限责任公司 | A kind of cryrogenic coupler and its application method |
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| CN116487849A (en) | 2023-07-25 |
| CN116885417A (en) | 2023-10-13 |
| CN113054332A (en) | 2021-06-29 |
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