CN116885417A - Filter and quantum chip measurement and control system - Google Patents
Filter and quantum chip measurement and control system Download PDFInfo
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- CN116885417A CN116885417A CN202310317052.0A CN202310317052A CN116885417A CN 116885417 A CN116885417 A CN 116885417A CN 202310317052 A CN202310317052 A CN 202310317052A CN 116885417 A CN116885417 A CN 116885417A
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- 238000005259 measurement Methods 0.000 title claims abstract description 114
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 66
- 239000004020 conductor Substances 0.000 claims abstract description 58
- 229920000642 polymer Polymers 0.000 claims abstract description 55
- 239000011358 absorbing material Substances 0.000 claims abstract description 35
- 238000012360 testing method Methods 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000004382 potting Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 17
- 230000035945 sensitivity Effects 0.000 abstract 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 52
- 239000010949 copper Substances 0.000 description 32
- 239000000843 powder Substances 0.000 description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 229910000859 α-Fe Inorganic materials 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the application provides a filter and a quantum chip measurement and control system. The filter includes: a conductor and a ground body; a medium filling part is arranged between the conductor and the grounding body; the medium filling part is at least filled with electromagnetic wave absorbing materials; the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a low-temperature polymer. The quantum chip measurement and control system comprises a quantum chip, a measurement and control channel, a filter and a measurement and control instrument; one end of the measurement and control channel is connected with the quantum chip, and the other end is connected with a measurement and control instrument; the filter is arranged on the measurement and control channel; the application can improve the filtering effect of the filter, reduce the volume occupied by the electromagnetic wave-absorbing material while improving the filtering effect, further reduce the volume of the filter, and be suitable for a quantum chip measurement and control system with high sensitivity to magnetic fields.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a filter and a quantum chip measurement and control system.
Background
In a quantum chip measurement and control system, a measurement and control channel between an external measurement and control instrument and a quantum chip needs to be established, so that the quantum chip cannot be completely isolated from the external environment, and external noise can reach the quantum chip through the measurement and control channel, thereby causing interference to the quantum chip.
In one mode, an electromagnetic wave absorbing material may be disposed in the measurement and control channel, and the electromagnetic wave absorbing material may absorb high frequency noise on the measurement and control channel.
Disclosure of Invention
The embodiment of the application discloses a filter and a quantum chip measurement and control system.
In a first aspect, the present application shows a filter comprising:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a low-temperature polymer Cryogenic Polymer.
In an alternative implementation, the low temperature polymer includes a thermally conductive potting adhesive Stycast2850 or Stycast1266.
In an alternative implementation, the volume ratio between carbonyl iron powder and low-temperature polymer in the electromagnetic wave absorbing material is between 0.1:1 and 0.9:1.
In an alternative implementation, the volume ratio between carbonyl iron powder and cryogenic polymer in the electromagnetic wave absorbing material is between 0.45:1 and 0.75:1.
In an alternative implementation, the conductor comprises an inner core of a coaxial line;
the grounding body comprises a coaxial shell;
the dielectric filling portion includes a space between an outer shell of the coaxial line and an inner core of the coaxial line.
In an alternative implementation, the filter includes:
the form of the positional relationship between the conductor and the ground body includes: coaxial line form, coplanar waveguide form, strip line form, and microstrip line form.
In an alternative implementation, the grounding body is a plastic elastic material.
In an alternative implementation, the filter further includes:
a first high frequency signal connector and a second high frequency signal connector;
the first high-frequency signal connector and the second high-frequency signal connector are respectively used for being connected with a measurement and control device in the measurement and control channel.
In an alternative implementation, the first high frequency connector includes a first wire end and a first ground end, the first wire end being connected to one end of the conductor, the first ground end being connected to one end of the ground body;
the second high-frequency connector includes a second lead end connected with the other end of the conductor and a second ground end connected with the other end of the ground body.
In an alternative implementation, the first high frequency signal connector and the second high frequency signal connector at least include:
ultra-small rf connector type a SMA, ultra-small rf connector type B SMB, ultra-small rf connector push-insert SMP and denier-Kang Saiman bayonet BNC.
In a second aspect, the present application shows a quantum chip measurement and control system, the system comprising:
the device comprises a quantum chip, a measurement and control channel, a filter and a measurement and control instrument;
one end of the measurement and control channel is connected with the quantum chip, and the other end of the measurement and control channel is connected with the measurement and control instrument;
the filter is arranged on the measurement and control channel;
the filter includes:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a low-temperature polymer Cryogenic Polymer.
Compared with the prior art, the embodiment of the application has the following advantages:
in the present application, the filter frequency band of carbonyl iron powder is wider, and the filter frequency band of carbonyl iron powder is wider than that of ferrite powder such as manganese oxide (MnO). Therefore, carbonyl iron powder can absorb more noise in the frequency band than ferrite powder such as manganese oxide (MnO).
Second, the filter capacity per unit volume or unit mass of carbonyl iron powder is higher and higher than that of a powder including a good metal conductor such as copper (Cu), and therefore, the carbonyl iron powder can absorb more noise in various high frequency bands than the powder including the good metal conductor such as copper (Cu). Therefore, the carbonyl iron powder has a better filtering effect than a good metal conductor powder such as copper (Cu) and a ferrite powder such as manganese oxide (MnO).
Secondly, as the carbonyl iron powder in unit volume or unit mass can absorb more noise in each high frequency band respectively, when the same wave absorbing effect is achieved, compared with the quantity of good metal conductor powder such as copper (Cu) and the like, the quantity of the carbonyl iron powder can be reduced, so that the hardware cost can be saved, the volume of a filter can be reduced, and the method is more suitable for a quantum chip measurement and control system with limited space. Alternatively, when the same volume is reached, the filtering effect using carbonyl iron powder is better than using a good metal conductor powder such as copper (Cu).
In addition, carbonyl iron powder is more suitable for quantum computing systems that are highly sensitive to magnetic fields because it is less magnetic and much less magnetic than ferrite powder such as manganese oxide (MnO).
Drawings
Fig. 1 is a front view of a filter shown according to an exemplary embodiment.
Fig. 2 is a cross-sectional view of a filter according to an exemplary embodiment.
Fig. 3 is a front view of a filter shown according to an exemplary embodiment.
Fig. 4 is a cross-sectional view of a filter according to an exemplary embodiment.
Fig. 5 is a block diagram illustrating a quantum chip measurement and control system according to an exemplary embodiment.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description.
Because external noise can reach the quantum chip through the measurement and control channel and then can bring interference to the quantum chip, an electromagnetic wave-absorbing material can be arranged in the measurement and control channel and can absorb external high-frequency noise.
Some electromagnetic wave absorbing materials in the prior art are not designed for extremely low temperature conditions, have poor thermal conductivity, and cannot conduct heat out under the condition that heat can also become noise of quantum bits, and have poor thermal conductivity, namely, thermal noise cannot be filtered under the condition that thermal noise exists.
In another way, a mixture of a good metal conductor powder such as copper (Cu) and a low-temperature polymer may be used as the electromagnetic wave absorbing material, but the mixture per unit volume is poor in the ability to absorb noise of respective high frequency bands, respectively, resulting in poor filtering effect.
In order to enable the filtering effect to at least meet the system requirement, more mixtures need to be filled in the measurement and control channel so that more mixtures can participate in the filtering operation, thereby avoiding missing part of noise of each high frequency band and further improving the filtering effect.
However, this approach is not suitable for space-limited quantum chip measurement and control systems, since more of the mixture needs to be filled and therefore a larger volume is required.
In another way, a mixture including ferrite powder such as manganese oxide (MnO) and a low-temperature polymer may be used as the electromagnetic wave absorbing material, but the filtering frequency band thereof is narrow, and part of the high-frequency noise cannot be absorbed, that is, part of the high-frequency noise cannot be filtered, resulting in poor filtering effect.
In addition, ferrite powder has larger magnetism, and is not suitable for a quantum chip measurement and control system which is highly sensitive to a magnetic field.
Accordingly, in order to improve the filtering effect, to reduce the volume occupied by the electromagnetic wave absorbing material while improving the filtering effect, and to be applicable to a quantum chip measurement and control system highly sensitive to a magnetic field, the present application provides a filter, fig. 1 is a front view of a filter according to an exemplary embodiment, and as shown in fig. 1, the filter includes:
a conductor 01 and a grounding body 02; a medium filling part 03 is arranged between the conductor 01 and the grounding body 02; the medium filling part 03 is filled with at least electromagnetic wave absorbing material; the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a low-temperature polymer (Cryogenic Polymer).
The carbonyl iron powder is used for absorbing high-frequency noise, and the low-temperature polymer is used for guiding heat in the measurement and control channel in the conductor out of the filter, namely out of the measurement and control channel under the condition of low temperature or extremely low temperature, so that the thermal noise is prevented from reaching the quantum chip measurement and control system, and interference of the thermal noise on measurement and control of quantum bits in the quantum chip measurement and control system is avoided. At the same time, the low temperature polymer also plays a role in filling and insulating.
Wherein, carbonyl iron powder in the medium filling part 03 and the low-temperature polymer can be uniformly distributed.
In the present application, the form of the positional relationship between the conductor 01 and the grounding body 02 includes: the present application is not limited to the form of the positional relationship between the conductor 01 and the ground body 02, and may be configured to have a dielectric filling portion between the conductor 01 and the ground body 02, which is capable of filling an electromagnetic wave absorbing material.
Fig. 1 of the present application illustrates a coaxial line in the form of a positional relationship between a conductor 01 and a ground 02, but is not intended to limit the scope of the present application.
In the front view shown in fig. 1, the conductor 01 includes an inner core of the coaxial line, the ground body 02 includes an outer shell of the coaxial line, and the dielectric filling portion 03 includes a space between the outer shell of the coaxial line and the inner core of the coaxial line.
Fig. 2 is a cross-sectional view of the filter, where the conductor 01 is coaxial with the ground body 02, and the diameter of the conductor 01 is smaller than the diameter of the ground body 02.
In the present application, the filter frequency band of carbonyl iron powder is wider, and the filter frequency band of carbonyl iron powder is wider than that of ferrite powder such as manganese oxide (MnO). Therefore, carbonyl iron powder can absorb more frequency band noise than ferrite powder such as manganese oxide (MnO).
Second, the filter capacity per unit volume or unit mass of carbonyl iron powder is higher and higher than that of a powder including a good metal conductor such as copper (Cu), and therefore, the carbonyl iron powder can absorb more noise in various high frequency bands than the powder including the good metal conductor such as copper (Cu). Therefore, the carbonyl iron powder has a better filtering effect than a good metal conductor powder such as copper (Cu) and a ferrite powder such as manganese oxide (MnO).
Secondly, as the carbonyl iron powder in unit volume or unit mass can absorb more noise in each high frequency band respectively, when the same wave absorbing effect is achieved, compared with the quantity of good metal conductor powder such as copper (Cu) and the like, the quantity of the carbonyl iron powder can be reduced, so that the hardware cost can be saved, the volume of a filter can be reduced, and the method is more suitable for a quantum chip measurement and control system with limited space. Alternatively, when the same volume is reached, the filtering effect using carbonyl iron powder is better than using a good metal conductor powder such as copper (Cu).
In addition, carbonyl iron powder is more suitable for quantum computing systems that are highly sensitive to magnetic fields because it is less magnetic and much less magnetic than ferrite powder such as manganese oxide (MnO).
In an alternative embodiment, the low temperature polymer comprises a thermally conductive potting adhesive Stycast2850 or Stycast1266. Of course, other types of low-temperature polymers capable of conducting heat in the conductor out of the filter at low temperature and very low temperature are also satisfactory, and the specific type of low-temperature polymer is not limited by the present application.
In an alternative embodiment, the volume ratio between carbonyl iron powder and low-temperature polymer in the electromagnetic wave absorbing material may be between 0.1:1 and 0.9:1 according to the service tendency and design index of different filters.
In an alternative embodiment of the present application, in order to make the stopband attenuation of the filter higher and to compromise the workability of the filter, that is, to balance the workability and filtering capability of the filter, the volume ratio between carbonyl iron powder and low-temperature polymer in the electromagnetic wave absorbing material may be between 0.45:1 and 0.75:1.
Wherein, if the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material of the medium filling part 03 is changed, the sum of the volume of the carbonyl iron powder and the volume of the low-temperature polymer in the electromagnetic wave absorbing material is changed.
The quantum chip measurement and control system can be respectively applied to different occasions, and the requirements on noise filtering in different occasions are different, or the requirements on the characteristic impedance of the transmission line of the measurement and control channel are not only the same, or the requirements on the cut-off frequency are different, or the requirements on the attenuation intensity of the stop band are different, and the like.
Therefore, the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material in the medium filling part 03, the diameter of the conductor, the diameter of the grounding body, the length of the conductor and/or the length of the grounding body can be dynamically adjusted according to actual requirements, so that the filter can meet corresponding requirements.
However, if the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material in the medium filling portion 03 is to be adjusted, it is possible to increase the total volume of the carbonyl iron powder and the low-temperature polymer or to decrease the total volume of the carbonyl iron powder and the low-temperature polymer.
If the total volume of carbonyl iron powder and low-temperature polymer is increased, the space of the medium filling part 03 between the current conductor 01 and the grounding body 02 may be insufficient, and at this time, at least the grounding body 02 needs to be replaced to enlarge the space of the medium filling part 03 between the conductor 01 and the replaced grounding body 02, so that after the volume ratio between carbonyl iron powder and low-temperature polymer in the electromagnetic wave absorbing material is adjusted, both carbonyl iron powder and low-temperature polymer in the electromagnetic wave absorbing material can be contained in the space of the medium filling part 03 between the conductor 01 and the replaced grounding body 02.
If the total volume of the carbonyl iron powder and the low-temperature polymer is reduced, after the volume ratio between the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material is adjusted, the carbonyl iron powder and the low-temperature polymer in the electromagnetic wave absorbing material cannot be filled in the space of the medium filling part 03 between the conductor 01 and the replaced grounding body 02, so that the low-temperature polymer cannot be in close contact with each other, the low-temperature polymer cannot be in close contact with the conductor, and the low-temperature polymer cannot be in close contact with the grounding body, and further the overall heat conductivity of the filter is reduced.
In order to avoid lowering the thermal conductivity of the whole in the filter, the grounding body 02 may be at least manually replaced to reduce the space of the dielectric filling portion 03 between the conductor 01 and the replaced grounding body 02, so that the space of the dielectric filling portion 03 after the ground reduction may be adapted to the total volume of the carbonyl iron powder and the low-temperature polymer, that is, the carbonyl iron powder and the low-temperature polymer may be sufficiently filled in the space of the dielectric filling portion 03 after the reduction, whereby lowering of the thermal conductivity of the whole in the filter may be avoided.
However, in the case of increasing the total volume of the carbonyl iron powder and the low-temperature polymer and reducing the total volume of the carbonyl iron powder and the low-temperature polymer, at least the grounding body 02 needs to be manually replaced, which not only results in complicated manual operation, but also requires preparation of a plurality of grounding bodies 02 in advance, resulting in high hardware cost.
Therefore, in order to reduce the complexity of manual operation and reduce the hardware cost, in another embodiment of the present application, the grounding body 02 is made of a plastic elastic material. For example, the shape of the grounding body can be molded and changed, and since the grounding body 02 is an elastic material, the space of the dielectric filling portion 03 between the grounding body 02 and the conductor 01 can be automatically changed along with the change of the total volume of the carbonyl iron powder and the low-temperature polymer, that is, the grounding body 02 can adapt to various total volumes of the carbonyl iron powder and the low-temperature polymer, so that under the condition of increasing the total volume of the carbonyl iron powder and the low-temperature polymer and reducing the total volume of the carbonyl iron powder and the low-temperature polymer, the grounding body 02 does not need to be manually replaced, thus the complexity of manual operation can be reduced, and various grounding bodies 02 do not need to be prepared in advance, thereby the hardware cost can be reduced.
In the application, a filter can be arranged between two adjacent measurement and control devices in the measurement and control channel, thus, the filter needs to be respectively connected with the two adjacent measurement and control devices, for example, one end of the filter is connected with one measurement and control device of the two adjacent measurement and control devices, and the other end of the filter is connected with the other measurement and control device of the two adjacent measurement and control devices.
In order to enable one end of the filter to be connected to two adjacent measurement and control devices, respectively, see fig. 3 and 4, the filter further comprises: a first high-frequency signal connector 04 and a second high-frequency signal connector 05; the first high-frequency signal connector 04 and the second high-frequency signal connector 05 are respectively used for being connected with a measurement and control device in a measurement and control channel.
Fig. 3 is a front view of the filter, and fig. 4 is a cross-sectional view of the filter.
The first high-frequency connector comprises a first lead end and a first grounding end, wherein the first lead end is connected with one end of a conductor, and the first grounding end is connected with one end of a grounding body; the second high-frequency connector comprises a second lead end and a second grounding end, wherein the second lead end is connected with the other end of the conductor, and the second grounding end is connected with the other end of the grounding body.
Wherein the first high frequency signal connector and the second high frequency signal connector at least comprise: SMA (Subminiature Version A, microminiature rf connector type a), SMB (Subminiature Version B, microminiature rf connector type B), SMP (Subminiature Push-on, microminiature rf connector push-on), BNC (Bayonet new-conveerman, nieire-Kang Saiman Bayonet), and the like.
The present application also provides a quantum chip measurement and control system, and fig. 5 is a front view of a quantum chip measurement and control system according to an exemplary embodiment, as shown in fig. 5, the system includes:
the device comprises a quantum chip 11, a measurement and control channel 12, a filter 13 and a measurement and control instrument 14;
one end of the measurement and control channel 12 is connected with the quantum chip 11, and the other end of the measurement and control channel 12 is connected with the measurement and control instrument 14;
the filter 14 is arranged on the measurement and control channel 12;
the filter 14 includes:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a low-temperature polymer (Cryogenic Polymer).
In the present application, the measurement and control instrument 14 is used for testing the quantum chip 11, for example, when the measurement and control instrument 14 is required to test the quantum chip 11, the measurement and control instrument 14 can send a measurement and control instruction to the sub-chip 11 through the measurement and control channel 12, the quantum chip 11 receives the measurement and control instruction through the measurement and control channel 12, and then obtains a measurement and control signal according to the measurement and control instruction, wherein the measurement and control signal includes static data, dynamic operation data, etc. in the quantum chip 11, and the present application is not limited thereto. Then the quantum chip 11 can send a measurement and control signal to the measurement and control instrument 14 through the measurement and control channel 12, and the measurement and control instrument 14 tests the quantum chip 11 based on the measurement and control signal.
The external high-frequency noise may enter the quantum chip 11 through the measurement and control channel 12, so as to avoid the external high-frequency noise from entering the quantum chip 11, the filter 14 may absorb the high-frequency noise in the measurement and control channel, so as to avoid the high-frequency noise from entering the quantum chip 11, and further avoid the interference of the external high-frequency noise to the quantum chip 11.
The carbonyl iron powder is used for absorbing high-frequency noise, and the low-temperature polymer is used for guiding heat in the measurement and control channel in the conductor out of the filter, namely out of the measurement and control channel under the condition of low temperature or extremely low temperature, so that the thermal noise is prevented from reaching the quantum chip measurement and control system, and interference of the thermal noise on measurement and control of quantum bits in the quantum chip measurement and control system is avoided. At the same time, the low temperature polymer also plays a role in filling and insulating.
Wherein, carbonyl iron powder in the medium filling part and low-temperature polymer can be uniformly distributed.
In the present application, the filter frequency band of carbonyl iron powder is wider, and the filter frequency band of carbonyl iron powder is wider than that of ferrite powder such as manganese oxide (MnO). Therefore, carbonyl iron powder can absorb more frequency band noise than ferrite powder such as manganese oxide (MnO).
Second, the filter capacity per unit volume or unit mass of carbonyl iron powder is higher and higher than that of a powder including a good metal conductor such as copper (Cu), and therefore, the carbonyl iron powder can absorb more noise in various high frequency bands than the powder including the good metal conductor such as copper (Cu). Therefore, the carbonyl iron powder has a better filtering effect than a good metal conductor powder such as copper (Cu) and a ferrite powder such as manganese oxide (MnO).
Secondly, as the carbonyl iron powder in unit volume or unit mass can absorb more noise in each high frequency band respectively, when the same wave absorbing effect is achieved, compared with the quantity of good metal conductor powder such as copper (Cu) and the like, the quantity of the carbonyl iron powder can be reduced, so that the hardware cost can be saved, the volume of a filter can be reduced, and the method is more suitable for a quantum chip measurement and control system with limited space. Alternatively, when the same volume is reached, the filtering effect using carbonyl iron powder is better than using a good metal conductor powder such as copper (Cu).
In addition, carbonyl iron powder is more suitable for quantum computing systems that are highly sensitive to magnetic fields because it is less magnetic and much less magnetic than ferrite powder such as manganese oxide (MnO).
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the application.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.
The filter and the quantum chip measurement and control system provided by the application are described in detail, and specific examples are applied to illustrate the principle and the implementation of the application, and the description of the above examples is only used for helping to understand the method and the core idea of the application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (8)
1. A quantum chip measurement and control system, the system comprising:
the device comprises a quantum chip, a measurement and control channel, a filter and a measurement and control instrument;
one end of the measurement and control channel is connected with the quantum chip, and the other end of the measurement and control channel is connected with the measurement and control instrument;
the filter is arranged on the measurement and control channel;
the filter includes:
a conductor and a ground body;
a medium filling part is arranged between the conductor and the grounding body;
the medium filling part is at least filled with electromagnetic wave absorbing materials;
the electromagnetic wave absorbing material at least comprises carbonyl iron powder and a low-temperature polymer Cryogenic Polymer;
when the measurement and control instrument is required to test the quantum chip, the measurement and control instrument sends a measurement and control instruction to the quantum chip through the measurement and control channel, the quantum chip receives the measurement and control instruction through the measurement and control channel, acquires a measurement and control signal according to the measurement and control instruction, and sends the measurement and control signal to the measurement and control instrument through the measurement and control channel, and the measurement and control instrument tests the quantum chip based on the measurement and control signal;
the low temperature polymer includes: a low-temperature polymer capable of conducting heat in the conductor out of the filter at low temperature and extremely low temperature;
the volume ratio between carbonyl iron powder and low-temperature polymer in the electromagnetic wave-absorbing material is between 0.45:1 and 0.75:1; or the volume ratio between carbonyl iron powder and low-temperature polymer in the electromagnetic wave absorbing material is between 0.1:1 and 0.9:1.
2. The quantum chip measurement and control system of claim 1, wherein the low temperature polymer comprises a thermally conductive potting adhesive Stycast2850 or Stycast1266.
3. The quantum chip measurement and control system of claim 1, wherein the conductor comprises an inner core of a coaxial line;
the grounding body comprises a coaxial shell;
the dielectric filling portion includes a space between an outer shell of the coaxial line and an inner core of the coaxial line.
4. The quantum chip measurement and control system of claim 1, wherein the filter comprises:
the form of the positional relationship between the conductor and the ground body includes: coaxial line form, coplanar waveguide form, strip line form, and microstrip line form.
5. The quantum chip measurement and control system of claim 1, wherein the grounding body is a plastic elastic material.
6. The quantum chip measurement and control system of claim 1, wherein the filter further comprises:
a first high frequency signal connector and a second high frequency signal connector;
the first high-frequency signal connector and the second high-frequency signal connector are respectively used for being connected with a measurement and control device in the measurement and control channel.
7. The quantum chip measurement and control system of claim 6, wherein the first high frequency connector comprises a first wire end and a first ground end, the first wire end being connected to one end of the conductor, the first ground end being connected to one end of the ground body;
the second high-frequency connector includes a second lead end connected with the other end of the conductor and a second ground end connected with the other end of the ground body.
8. The quantum chip measurement and control system of claim 6, wherein the first high frequency signal connector and the second high frequency signal connector comprise at least:
ultra-small rf connector type a SMA, ultra-small rf connector type B SMB, ultra-small rf connector push-insert SMP and denier-Kang Saiman bayonet BNC.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310317052.0A CN116885417A (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
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| CN201911383547.3A CN113054332B (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
| CN202310317052.0A CN116885417A (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
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| CN202310317052.0A Withdrawn CN116885417A (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
| CN201911383547.3A Active CN113054332B (en) | 2019-12-27 | 2019-12-27 | Filter and quantum chip measurement and control system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202009367U (en) * | 2010-12-07 | 2011-10-12 | 刘晓东 | High frequency conduction wave filter |
| CN102513546B (en) * | 2011-12-22 | 2013-09-18 | 广东羚光新材料股份有限公司 | Functional silver flake and preparation method thereof |
| CN203908698U (en) * | 2014-04-30 | 2014-10-29 | 上海出入境检验检疫局机电产品检测技术中心 | Anti-electromagnetic interference temperature sensing device |
| CN104892829B (en) * | 2015-05-21 | 2017-12-12 | 斯迪克新型材料（江苏）有限公司 | For electromagnetic-field-shielded absorbing material |
| CN108641373A (en) * | 2018-05-16 | 2018-10-12 | 浙江禾为新材料科技有限公司 | A kind of high band heat conduction suction wave insulating materials |
| CN108767404B (en) * | 2018-07-02 | 2023-08-04 | 本源量子计算科技（合肥）股份有限公司 | Low-temperature coupler and application method thereof |
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2019
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| CN116487849A (en) | 2023-07-25 |
| CN113054332B (en) | 2023-02-28 |
| CN113054332A (en) | 2021-06-29 |
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