CN116598248B - Semiconductor wafer cleaning device - Google Patents
Semiconductor wafer cleaning device Download PDFInfo
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- CN116598248B CN116598248B CN202310524927.4A CN202310524927A CN116598248B CN 116598248 B CN116598248 B CN 116598248B CN 202310524927 A CN202310524927 A CN 202310524927A CN 116598248 B CN116598248 B CN 116598248B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 65
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 39
- 230000008093 supporting effect Effects 0.000 claims abstract description 25
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 abstract description 73
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to a semiconductor wafer cleaning device, which comprises a cleaning mechanism, a transverse moving platform and a guiding mechanism, wherein the cleaning mechanism comprises a support frame and two ultrasonic cleaning components, a sliding groove in the vertical direction is arranged on the support frame, the two ultrasonic cleaning components respectively comprise a sliding frame arranged in the sliding groove in a sliding way and an ultrasonic cleaning head arranged at the end part of the sliding frame, and the two ultrasonic cleaning heads are arranged up and down oppositely; the transverse moving platform is arranged on one side of the cleaning mechanism and can slide towards the cleaning mechanism, a rotary table assembly is arranged on the transverse moving platform, and the rotary table assembly is provided with a bearing surface for bearing wafers; the guide mechanism is arranged on the transverse moving platform, the guide mechanism is provided with two guide slopes which are oppositely arranged, the two guide slopes are respectively used for supporting the two sliding frames, so that the two sliding frames synchronously slide along opposite directions, and the semiconductor wafer cleaning device can ensure that the surface of a wafer is sufficiently cleaned and improve the cleaning effect.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a semiconductor wafer cleaning device.
Background
After chemical mechanical polishing, the surface of the semiconductor wafer may remain with various contaminants such as organic compounds, particles, and metal ions, and thus the surface of the wafer needs to be cleaned. At present, a wafer is generally placed on a turntable, impurities on the upper surface and the lower surface of the wafer are cleaned through an ultrasonic cleaning assembly, the ultrasonic cleaning assembly moves along the radial direction of the wafer to clean the wafer in rotation, but the ultrasonic cleaning assembly and the wafer are operated at constant speed due to different circumferences of different radiuses of the wafer, so that the cleaning of the surface of the wafer is uneven, and the cleaning effect is poor.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the application provides a semiconductor wafer cleaning device which can ensure the surface of a wafer to be sufficiently cleaned and improve the cleaning effect.
(II) technical scheme
To achieve the above object, an embodiment of the present application provides a semiconductor wafer cleaning apparatus, including: the cleaning mechanism comprises a support frame and two ultrasonic cleaning components, wherein a sliding groove in the vertical direction is formed in the support frame, the two ultrasonic cleaning components respectively comprise a sliding frame arranged in the sliding groove in a sliding manner and ultrasonic cleaning heads arranged at the end parts of the sliding frame, and the two ultrasonic cleaning heads are arranged up and down oppositely; the transverse moving platform is arranged on one side of the cleaning mechanism and can slide towards the cleaning mechanism, a rotary table assembly is arranged on the transverse moving platform, and the rotary table assembly is provided with a bearing surface for bearing wafers; and the guide mechanism is arranged on the transverse moving platform and is provided with two guide sloping surfaces which are oppositely arranged, and the two guide sloping surfaces are respectively used for supporting the two sliding frames so that the two sliding frames synchronously slide along opposite directions.
In one possible implementation manner, two elastic pieces are arranged in the sliding groove, one ends of the two elastic pieces are respectively connected with opposite sides of the two sliding frames, and the other ends of the two elastic pieces are respectively connected with two ends of the sliding groove.
In one possible implementation, the guiding mechanism includes: the fixing frame is arranged on the transverse moving platform, and is provided with an adjusting part and a hinge part which are respectively coplanar with the bearing surface of the turntable assembly; the adjusting component is arranged at the adjusting part of the fixing frame; one end of each guide plate is rotatably connected with the hinging part of the fixing frame, and the other end of each guide plate is respectively connected with the two ends of the adjusting component; wherein, the adjusting component is used for driving the two guide plates to rotate towards opposite directions.
In one possible implementation manner, the adjusting part of the fixing frame is provided with an adjusting plate, a sliding groove is arranged on the adjusting plate along the horizontal direction, a sliding block is arranged in the sliding groove in a sliding manner, and a through hole is formed in the sliding block along the vertical direction; the adjusting assembly includes: the adjusting threaded pipe penetrates through the through hole of the sliding block and is rotatably connected with the sliding block; and one ends of the two adjusting screws are respectively inserted into and screwed into two ends of the adjusting threaded pipe, the other ends of the two adjusting screws are respectively hinged with the opposite sides of the two guide plates, and the external threads of the two adjusting screws are opposite in screwing direction and equal in screw pitch.
In one possible implementation, the opposite sides of the two guide plates form guide slopes, and the opposite sides of the two sliding frames are provided with supporting wheels, which are abutted with the guide slopes of the guide plates.
In one possible implementation, the end of the guide plate adjacent to the hinge is provided with a limiting structure for limiting the support wheel to slide out of the guide ramp.
In one possible implementation, the limiting structure is one of a limiting post, a limiting block and a curved surface.
In one possible implementation, the turntable assembly, the guide mechanism and the support frame are arranged in sequence along the direction of movement of the traversing platform.
In one possible implementation, the turntable assembly includes: the base is arranged on the transverse moving platform; the support columns are arranged on the base and uniformly arranged around the center of the base; and the rotating parts are respectively arranged on the supporting columns and comprise a rotating motor and a riding wheel arranged at the power output end of the rotating motor.
In one possible implementation manner, the base is radially provided with a plurality of adjusting grooves along the base, the bottoms of the plurality of supporting columns are respectively provided with an adjusting block, and the adjusting blocks are slidably arranged in the adjusting grooves.
(III) beneficial effects
Compared with the prior art, the application provides a semiconductor wafer cleaning device, which has the following beneficial effects: this semiconductor wafer belt cleaning device bears the wafer and drives the wafer at the uniform velocity through the revolving stage subassembly and rotate, the sideslip platform moves towards wiper mechanism, two ultrasonic cleaning heads wash the marginal position of lower surface on can the wafer respectively, along with the removal of sideslip platform, ultrasonic cleaning head is close to the centre of a circle of wafer gradually to the cleaning position of wafer, two guide slope through guiding mechanism support two carriage respectively, make two carriage move in opposite directions, and then make the distance of ultrasonic cleaning head and wafer surface progressively grow along with the removal of wafer, can keep less cleaning distance when the ultrasonic cleaning head washs the department of great radius of wafer, can keep great cleaning distance when wasing the department of less radius of wafer, and then guarantee to the surface abundant washing of wafer, can not cause the damage to the surface of wafer moreover, improve the cleaning effect.
Drawings
Fig. 1 is a schematic perspective view of a semiconductor wafer cleaning apparatus according to an embodiment of the present application;
FIG. 2 is a schematic perspective view of another angle of FIG. 1;
fig. 3 is a schematic perspective view of a guiding mechanism according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a guiding mechanism and an ultrasonic cleaning assembly according to an embodiment of the present application;
fig. 5 is a schematic perspective view of a cleaning mechanism according to an embodiment of the present application;
fig. 6 shows a schematic structural diagram of a traversing platform, a turntable assembly, and a guiding mechanism according to an embodiment of the present application.
The reference numerals in the drawings:
a. a wafer;
1. a cleaning mechanism; 11. a support frame; 111. a sliding groove; 112. an elastic member; 12. an ultrasonic cleaning assembly; 121. a carriage; 1211. a support wheel; 122. ultrasonic cleaning of the head;
2. a traversing platform;
3. a turntable assembly; 31. a base; 311. an adjustment tank; 32. a support column; 321. an adjusting block; 33. a rotating member; 331. a rotating electric machine; 332. a riding wheel;
4. a guide mechanism; 41. a guide slope; 42. a fixing frame; 421. an adjusting section; 4211. an adjusting plate; 4212. a chute; 4213. a slide block; 422. a hinge part; 43. an adjustment assembly; 431. adjusting the threaded pipe; 432. adjusting a screw; 44. a guide plate; 441. and a limiting structure.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Fig. 1 is a schematic perspective view of a semiconductor wafer cleaning apparatus according to an embodiment of the present application; FIG. 2 is a schematic perspective view of another angle of FIG. 1; fig. 3 is a schematic perspective view of a guiding mechanism according to an embodiment of the present application; fig. 4 is a schematic structural diagram of a guiding mechanism and an ultrasonic cleaning assembly according to an embodiment of the present application; fig. 5 is a schematic perspective view of a cleaning mechanism according to an embodiment of the present application; fig. 6 shows a schematic structural diagram of a traversing platform, a turntable assembly, and a guiding mechanism according to an embodiment of the present application.
Referring to fig. 1 to 6, an embodiment of the present application provides a semiconductor wafer cleaning apparatus, including: a cleaning mechanism 1, a traversing platform 2 and a guiding mechanism 4.
The cleaning mechanism 1 comprises a supporting frame 11 and two ultrasonic cleaning components 12, wherein a sliding groove 111 in the vertical direction is formed in the supporting frame 11, the two ultrasonic cleaning components 12 respectively comprise a sliding frame 121 arranged in the sliding groove 111 in a sliding manner and ultrasonic cleaning heads 122 arranged at the end parts of the sliding frame 121, and the two ultrasonic cleaning heads 122 are arranged up and down oppositely.
The traversing platform 2 is arranged at one side of the cleaning mechanism 1 and can slide towards the cleaning mechanism 1, a turntable assembly 3 is arranged on the traversing platform 2, and the turntable assembly 3 is provided with a bearing surface for bearing the wafer a.
The guide mechanism 4 is disposed on the traversing platform 2, the guide mechanism 4 has two guide slopes 41 disposed opposite to each other, and the two guide slopes 41 are respectively used for supporting the two sliding frames 121 so that the two sliding frames 121 slide synchronously in opposite directions.
In the application, the turntable assembly 3 is used for bearing the wafer a and driving the wafer a to rotate at a constant speed, the traversing platform 2 moves towards the cleaning mechanism 1, the two ultrasonic cleaning heads 122 respectively clean the edge parts of the upper surface and the lower surface of the wafer a, along with the movement of the traversing platform 2, the cleaning parts of the wafer a are gradually close to the circle center of the wafer a, the two sliding frames 121 are respectively supported by the two guide slope surfaces 41 of the guide mechanism 4, so that the two sliding frames 121 move back to back, the distance between the ultrasonic cleaning heads 122 and the surface of the wafer a is gradually increased along with the movement of the wafer a, the ultrasonic cleaning heads 122 can keep a smaller cleaning distance when cleaning the wafer a at a larger radius, and can keep a larger cleaning distance when cleaning the wafer a at a smaller radius, thereby ensuring the surface of the wafer a to be sufficiently cleaned, and the surface of the wafer a is not damaged, and improving the cleaning effect.
Specifically, the mechanism of ultrasonic cleaning is to clean the surface of the object to be cleaned by the high-frequency vibration effect and the chemical reaction of the chemical cleaning agent.
In some embodiments, two elastic members 112 are disposed in the sliding groove 111, one ends of the two elastic members 112 are respectively connected to opposite sides of the two sliding frames 121, and the other ends of the two elastic members 112 are respectively connected to two ends of the sliding groove 111.
In the present application, two elastic members 112 are respectively elastically supported on opposite sides of two sliding frames 121, and two guiding slopes 41 matched with a guiding mechanism 4 are respectively supported on opposite sides of two sliding frames 121, so that the sliding of the two sliding frames 121 towards opposite directions is realized, specifically, the elastic members 112 are springs, when the guiding mechanism 4 moves towards the sliding frames 121, the sliding frames 121 are supported and pushed through the guiding slopes 41, so that the distance between the two sliding frames 121 becomes gradually larger, and when the guiding mechanism 4 moves away from the sliding frames 121, the two sliding frames 121 move towards each other under the elastic supporting action of the elastic members 112, and gradually return.
The wafer a is fully cleaned under different working conditions because the wafer a generates the conditions that the impurity distribution is more in center and gradually less in outward edge in the polishing process.
In some embodiments, the guide mechanism 4 comprises: a fixed frame 42, an adjusting assembly 43 and two guide plates 44.
The fixing frame 42 is disposed on the traversing platform 2, and an adjusting portion 421 and a hinge portion 422 are disposed on the fixing frame 42, where the adjusting portion 421 and the hinge portion 422 are coplanar with the bearing surface of the turntable assembly 3.
The adjusting unit 43 is provided at the adjusting portion 421 of the fixing frame 42.
One end of each of the two guide plates 44 is rotatably connected with the hinge part 422 of the fixing frame 42, and the other end of each of the two guide plates 44 is connected with both ends of the adjusting assembly 43.
Wherein the adjustment assembly 43 is used to drive the two guide plates 44 to rotate in opposite directions.
In the application, the two guide plates 44 are driven to rotate in opposite directions by the adjusting component 43, so that the included angle between the two guide plates 44 is changed, the change amplitude of the distance between the two ultrasonic cleaning heads 122 is adjusted, and the cleaning effect on the surface of the wafer a is further ensured. Specifically, the more impurities in the center of the wafer a, the smaller the included angle between the two guide plates 44 can be properly adjusted, so that the ultrasonic cleaning head 122 has a relatively closer cleaning distance when moving to the vicinity of the center of the wafer a; when the foreign matter in the center of the wafer a is small, the angle between the two guide plates 44 can be appropriately adjusted so that the ultrasonic cleaning head 122 has a relatively large cleaning distance when it is moved near the center of the wafer a.
In some embodiments, the adjusting portion 421 of the fixing frame 42 is provided with an adjusting plate 4211, a sliding groove 4212 is provided on the adjusting plate 4211 along the horizontal direction, a sliding block 4213 is provided in the sliding groove 4212 in a sliding manner, and a through hole is provided on the sliding block 4213 along the vertical direction; the adjustment assembly 43 includes: an adjusting screw pipe 431 penetrating through the penetration hole of the slider 4213 and rotatably connected with the slider 4213; and two adjusting screws 432, one ends of the two adjusting screws 432 are respectively inserted into and screwed into two ends of the adjusting threaded pipe 431, the other ends of the two adjusting screws 432 are respectively hinged with the opposite sides of the two guide plates 44, and the external threads of the two adjusting screws 432 are opposite in rotation direction and equal in screw pitch.
According to the application, the two adjusting screws 432 are synchronously screwed in or out by rotating the adjusting threaded pipe 431, so that the whole length of the adjusting assembly 43 is adjusted, the included angle between the two guide plates 44 is adjusted, the distance between the adjusting assembly 43 and the hinged end is changed when the adjusting assembly is adjusted, the adjusting assembly 43 can transversely move by sliding along the adjusting plate 4211 through the sliding block 4213, and the adjusting assembly 43 always keeps a vertical state in the transverse moving process.
In some embodiments, the opposite sides of the two guide plates 44 form guide slopes 41, and the opposite sides of the two carriages 121 are provided with support wheels 1211, the support wheels 1211 abutting the guide slopes 41 of the guide plates 44.
In the application, the end of the sliding frame 121 is provided with the supporting wheel 1211, and the sliding contact is converted into rolling contact by sliding the supporting wheel 1211 along the guide slope 41 of the guide plate 44, so that the contact friction force is reduced, and the guide plate 44 is convenient for supporting and pushing the sliding frame 121.
In some embodiments, the end of the guide plate 44 adjacent the hinge 422 is provided with a stop structure 441 for limiting the support wheel 1211 from sliding off the guide ramp 41.
In the present application, the supporting wheel 1211 is prevented from sliding out of the guide slope 41 by the limiting structure 441, and the supporting wheel 1211 stays at the limiting structure 441 at ordinary times, so that the stability of the carriage 121 can be ensured.
In some embodiments, the stop feature 441 is one of a stop post, a stop block, and a curved surface.
Specifically, the limiting structure 441 in the present application adopts a curved surface to prevent the supporting wheel 1211 from sliding continuously, and the supporting wheel 1211 can just stay in the recess of the curved surface, so as to ensure the stability of the sliding frame 121.
In some embodiments, the turntable assembly 3, the guide mechanism 4, and the support frame 11 are disposed in sequence along the direction of movement of the traversing platform 2.
In the application, the traversing mechanism drives the turntable assembly 3 and the guide mechanism 4 to move towards the supporting frame 11, the guide mechanism 4 supports the two sliding frames 121, and the distance between the two sliding frames 121 gradually increases along with the movement of the traversing mechanism.
In some embodiments, the turret assembly 3 comprises: a base 31 provided on the traversing platform 2; a plurality of support columns 32 disposed on the base 31, the plurality of support columns 32 being uniformly disposed around a center of the base 31; and a plurality of rotating members 33 respectively disposed on the plurality of support columns 32, wherein the rotating members 33 comprise a rotating motor 331 and a riding wheel 332 disposed at a power output end of the rotating motor 331.
In the present application, a wafer a is placed between a plurality of supporting rollers 332, specifically, the supporting rollers 332 are in boss structures, not only can support the wafer a, but also can position the wafer a, and the plurality of supporting rollers 332 are driven to rotate by a plurality of rotating motors 331, so as to realize rotation of the wafer a.
Specifically, the number of the rotating members 33 and the support columns 32 on the same horizontal plane of the plurality of idlers 332 is 4.
In some embodiments, the base 31 is provided with a plurality of adjusting grooves 311 along its radial direction, the bottoms of the plurality of support columns 32 are respectively provided with an adjusting block 321, and the adjusting blocks 321 are slidably disposed in the adjusting grooves 311.
In the application, the distance between the supporting column 32 and the center of the base 31 can be adjusted by sliding the adjusting block 321 in the adjusting groove 311, so that the radius of the wafer a can be adjusted by the plurality of rotating pieces 33, and wafers a with different sizes can be carried.
The semiconductor wafer cleaning device carries a wafer a through the turntable assembly 3 and drives the wafer a to rotate at a constant speed, the traversing platform 2 moves towards the cleaning mechanism 1, the two ultrasonic cleaning heads 122 respectively clean edge parts of the upper surface and the lower surface of the wafer a, along with the movement of the traversing platform 2, the cleaning parts of the wafer a are gradually close to the circle center of the wafer a by the ultrasonic cleaning heads 122, the two sliding frames 121 are respectively supported by the two guide slope surfaces 41 of the guide mechanism 4, the two sliding frames 121 move in opposite directions, the distance between the ultrasonic cleaning heads 122 and the surface of the wafer a is gradually increased along with the movement of the wafer a, the cleaning distance between the ultrasonic cleaning heads 122 can be kept smaller when the cleaning part of the wafer a with a larger radius is cleaned, the cleaning distance between the ultrasonic cleaning heads 122 can be kept larger when the cleaning part of the wafer a with a smaller radius is cleaned, the surface of the wafer a is further ensured to be sufficiently cleaned, the surface of the wafer a is not damaged, and the cleaning effect is improved.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
It should be readily understood that the terms "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest sense such that "on … …" means not only "directly on something", but also includes "on something" with intermediate features or layers therebetween, and "above … …" or "above … …" includes not only the meaning "on something" or "above" but also the meaning "above something" or "above" without intermediate features or layers therebetween (i.e., directly on something).
Further, spatially relative terms, such as "below," "beneath," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A semiconductor wafer cleaning apparatus, comprising:
the cleaning mechanism (1) comprises a supporting frame (11) and two ultrasonic cleaning assemblies (12), wherein a sliding groove (111) in the vertical direction is formed in the supporting frame (11), the two ultrasonic cleaning assemblies (12) respectively comprise a sliding frame (121) arranged in the sliding groove (111) in a sliding manner and ultrasonic cleaning heads (122) arranged at the end parts of the sliding frame (121), and the two ultrasonic cleaning heads (122) are arranged vertically oppositely;
the transverse moving platform (2) is arranged on one side of the cleaning mechanism (1) and can slide towards the cleaning mechanism (1), a rotary table assembly (3) is arranged on the transverse moving platform (2), and the rotary table assembly (3) is provided with a bearing surface for bearing a wafer; and
the guide mechanism (4) is arranged on the transverse moving platform (2), the guide mechanism (4) is provided with two guide slope surfaces (41) which are oppositely arranged, and the two guide slope surfaces (41) are respectively used for supporting the two sliding frames (121) so that the two sliding frames (121) can synchronously slide along opposite directions.
2. The semiconductor wafer cleaning device according to claim 1, wherein two elastic members (112) are disposed in the sliding groove (111), one ends of the two elastic members (112) are respectively connected to opposite sides of the two sliding frames (121), and the other ends of the two elastic members (112) are respectively connected to two ends of the sliding groove (111).
3. A semiconductor wafer cleaning apparatus according to claim 2, wherein the guide mechanism (4) comprises:
the fixing frame (42) is arranged on the transverse moving platform (2), an adjusting part (421) and a hinge part (422) are arranged on the fixing frame (42), and the adjusting part (421) and the hinge part (422) are respectively coplanar with the bearing surface of the turntable assembly (3);
an adjustment unit (43) provided at an adjustment portion (421) of the fixing frame (42); and
one end of each guide plate (44) is rotatably connected with the hinging part (422) of the fixing frame (42), and the other end of each guide plate (44) is respectively connected with two ends of the adjusting component (43);
wherein the adjusting assembly (43) is used for driving the two guide plates (44) to rotate towards opposite directions.
4. A semiconductor wafer cleaning device according to claim 3, wherein the adjusting portion (421) of the fixing frame (42) is provided with an adjusting plate (4211), a sliding groove (4212) is provided on the adjusting plate (4211) along a horizontal direction, a sliding block (4213) is provided in the sliding groove (4212) in a sliding manner, and a through hole is provided on the sliding block (4213) along a vertical direction; the adjustment assembly (43) comprises:
an adjusting threaded tube (431) which penetrates through the perforation of the sliding block (4213) and is rotatably connected with the sliding block (4213); and
the two adjusting screws (432), one ends of the two adjusting screws (432) are respectively inserted into and screwed into two ends of the adjusting threaded pipe (431), the other ends of the two adjusting screws (432) are respectively hinged to the opposite sides of the two guide plates (44), and the external threads of the two adjusting screws (432) are opposite in rotation direction and equal in screw pitch.
5. A semiconductor wafer cleaning device according to claim 3, wherein the opposite sides of the two guide plates (44) form the guide slope (41), and the opposite sides of the two carriages (121) are provided with support wheels (1211), the support wheels (1211) being in abutment with the guide slope (41) of the guide plates (44).
6. A semiconductor wafer cleaning device according to claim 5, characterized in that the end of the guide plate (44) adjacent to the hinge part (422) is provided with a limiting structure (441) for limiting the support wheel (1211) to slide out of the guide ramp (41).
7. The semiconductor wafer cleaning apparatus of claim 6, wherein the limit structure (441) is one of a limit post, a limit block, and a curved surface.
8. A semiconductor wafer cleaning apparatus according to claim 1, wherein the turntable assembly (3), the guide mechanism (4) and the support frame (11) are disposed in this order along the moving direction of the traverse table (2).
9. A semiconductor wafer cleaning device according to claim 1, characterized in that the turntable assembly (3) comprises:
a base (31) arranged on the traversing platform (2);
the support columns (32) are arranged on the base (31), and the support columns (32) are uniformly arranged around the center of the base (31); and
the rotating parts (33) are respectively arranged on the supporting columns (32), and each rotating part (33) comprises a rotating motor (331) and a riding wheel (332) arranged at the power output end of the rotating motor (331).
10. The semiconductor wafer cleaning device according to claim 9, wherein the base (31) is provided with a plurality of adjustment grooves (311) along a radial direction thereof, the bottoms of the plurality of support columns (32) are respectively provided with an adjustment block (321), and the adjustment blocks (321) are slidably disposed in the adjustment grooves (311).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310524927.4A CN116598248B (en) | 2023-05-11 | 2023-05-11 | Semiconductor wafer cleaning device |
Applications Claiming Priority (1)
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| JP2004363453A (en) * | 2003-06-06 | 2004-12-24 | Tokyo Seimitsu Co Ltd | Substrate washing apparatus |
| KR20080088191A (en) * | 2007-03-29 | 2008-10-02 | 세메스 주식회사 | Apparatus for treating substrate with nozzles and control method for nozzles thereof |
| CN204668283U (en) * | 2015-03-02 | 2015-09-23 | K.C.科技股份有限公司 | Chip processing device |
| CN109346427A (en) * | 2018-11-29 | 2019-02-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Cleaning device and semiconductor crystal wafer cleaning equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8458842B2 (en) * | 2011-05-10 | 2013-06-11 | Nanya Technology Corp. | Post-CMP wafer cleaning apparatus |
| KR20210009276A (en) * | 2019-07-16 | 2021-01-26 | 도쿄엘렉트론가부시키가이샤 | Processing liquid ejection nozzle, nozzle arm, substrate processing apparatus, and substrate processing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363453A (en) * | 2003-06-06 | 2004-12-24 | Tokyo Seimitsu Co Ltd | Substrate washing apparatus |
| KR20080088191A (en) * | 2007-03-29 | 2008-10-02 | 세메스 주식회사 | Apparatus for treating substrate with nozzles and control method for nozzles thereof |
| CN204668283U (en) * | 2015-03-02 | 2015-09-23 | K.C.科技股份有限公司 | Chip processing device |
| CN109346427A (en) * | 2018-11-29 | 2019-02-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Cleaning device and semiconductor crystal wafer cleaning equipment |
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