CN116598245A - Semiconductor wafer positioning device and semiconductor wafer processing positioning method - Google Patents
Semiconductor wafer positioning device and semiconductor wafer processing positioning method Download PDFInfo
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- CN116598245A CN116598245A CN202310702942.3A CN202310702942A CN116598245A CN 116598245 A CN116598245 A CN 116598245A CN 202310702942 A CN202310702942 A CN 202310702942A CN 116598245 A CN116598245 A CN 116598245A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000012545 processing Methods 0.000 title abstract description 18
- 238000007599 discharging Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 244000309464 bull Species 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semiconductor wafer positioning device and a semiconductor wafer processing positioning method, comprising a base, a hydraulic push rod, a moving part and a photomask sheet, wherein the hydraulic push rod is fixedly arranged at the upper end of the base, the moving part is fixedly arranged at the upper end of the hydraulic push rod, a rotating plate is rotatably arranged at the upper end of a bottom plate, a driving groove is formed in the upper end of the rotating plate, a driving motor is fixedly arranged at the upper end of the plate, and a driving wheel is fixedly arranged at the output end of the driving motor. According to the semiconductor wafer positioning device and the semiconductor wafer processing positioning method, the driving motor drives the driving wheel to rotate and the gear ring to rotate, the limiting piece moves in the process of approaching to the middle point of the fixing plate and positioning the placing plate and the wafer main body, the device can position the wafer main bodies with different sizes through the movement of the limiting piece, and the positioning accuracy and the using convenience of the device are effectively improved.
Description
Technical Field
The invention relates to the technical field of wafer positioning, in particular to a semiconductor wafer positioning device and a semiconductor wafer processing positioning method.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the wafer is circular in shape, so the wafer is called a wafer, the wafer can be manufactured into an element structure in the circuit after processing, the element structure in the circuit is generally smaller in size, the wafer needs to be processed and applied after being cut, a positioning device is needed in the process of processing the wafer, but certain use defects exist in the use process of the conventional positioning device, such as:
the invention discloses a semiconductor wafer positioning device and a semiconductor wafer processing and positioning method, wherein the device calculates data measured by a positioning sensor and a positioning sensor through a controller, so that the controller controls a moving assembly to operate, the moving assembly drives the positioning assembly to realize X, Y two-axis movement, and the center of the positioning assembly is aligned with the center of a photomask sheet;
in the above document, the device needs to place the wafer in the upper end of push pedal at the in-process of carrying out the location adjustment to the wafer, and the avris fixed mounting of push pedal has the supporting legs to spacing the upper end at the push pedal with the wafer, and wafer and supporting legs closely laminate, thereby adjust the position of accomplishing the wafer through the position to the push pedal, place the wafer that is less than the push pedal size behind the push pedal upper end, be difficult to make the wafer lie in the intermediate position of push pedal, carry out the location to the wafer through the push pedal again and lead to the location inaccuracy easily, influence the processing of wafer, there is inconvenience.
Aiming at the problems, innovative design is urgently needed on the basis of the original positioning device structure.
Disclosure of Invention
The invention aims to provide a semiconductor wafer positioning device and a semiconductor wafer processing positioning method, which are used for solving the problems that after a wafer smaller than the size of a push plate is placed at the upper end of the push plate, the wafer is difficult to be positioned in the middle of the push plate, positioning inaccuracy is easily caused by positioning the wafer through the push plate again, and processing of the wafer is influenced, and inconvenience exists.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a semiconductor wafer positioner and semiconductor wafer processing positioning method, includes base, hydraulic push rod, moving part and light shield piece, the upper end fixed mounting of base has hydraulic push rod, and hydraulic push rod's upper end fixed mounting has moving part to the lower extreme fixed mounting of moving part has the light shield piece, the upper end fixed mounting of base has the bottom plate, and the upper end fixed mounting of bottom plate has the fixed plate to the upper end of fixed plate has placed the board, and the wafer main part has been placed to the upper end of placing the board simultaneously, the upper end of bottom plate rotates and installs the revolving plate, and the upper end inside of revolving plate has seted up the drive slot to the inside slidable mounting of drive slot has the locating part, and the one side inside nested of locating part is close to the drive slot simultaneously has the ball, the upper end of locating part is located the inside of spout, and the spout is seted up in the inside of fixed plate, the upper end fixed mounting of board has the driving motor, and the output end fixed mounting of driving motor has the drive wheel, and the outside meshing of drive wheel is connected with the ring gear, and the fixed mounting is in the lower extreme inside of revolving plate simultaneously.
Preferably, the first pinion rack and the second pinion rack are installed respectively at both ends about the moving part, the inside rotation of base is installed bull stick and is rotated the piece, and the outside cover of bull stick is equipped with from the driving wheel to the front end fixed mounting of bull stick has first bevel gear, the side cover of digging of rotating the piece is equipped with the second bevel gear, and the second bevel gear is located the inside of base, can make bull stick and rotating the piece to carry out synchronous motion through the motion of first pinion rack and second pinion rack, and rotates the in-process that piece and bull stick moved and can carry out the centre gripping through the holder to place board and wafer main part to accomplish the automatic feeding and the automatic discharging's of this positioner process, and then effectually improved the convenience of this positioner processing.
Preferably, the one end fixed mounting that the second bevel gear was kept away from to the rotating member has electric putter, and electric putter's lower single end installs the diaphragm to the inside slidable mounting of diaphragm has the clamping part, and one side fixed mounting that the clamping part is close to diaphragm intermediate position simultaneously has the rack, the upper end fixed mounting of diaphragm has servo motor, and servo motor's output fixed mounting has the fifth wheel, is carrying out the in-process to electric putter and servo motor, can make diaphragm and clamping part up-and-down motion and carry out stable centre gripping and transport to placing board and wafer main part, the effectual convenience that improves the device to use.
Preferably, the fixed plate and the outer side of the rotating plate are in a circular structure in overlooking mode, the fixed plate and the limiting piece form a sliding structure through the sliding groove, four groups of sliding grooves and the limiting piece are distributed at equal angles relative to the middle point of the fixed plate, the fixed plate and the limiting piece form the sliding structure through the sliding groove, the limiting piece can move in the fixed plate through the sliding groove, and the limiting piece can limit and clamp the placing plate and the wafer main body in the moving process.
Preferably, the limiting part forms a sliding structure with the rotating plate through the ball and the driving groove, the limiting part is tightly attached to the driving groove, four groups of driving grooves are distributed at equal angles about the middle point of the rotating plate, meanwhile, the driving groove is in an arc-shaped structure in overlooking, the limiting part can enable the ball to roll in the process of moving in the driving groove through the ball and the driving groove, and therefore friction force suffered by the limiting part in the process of moving is effectively reduced.
Preferably, the first toothed plate and the second toothed plate are both connected with the driven wheel in a meshed manner, the driven wheel is fixedly connected with the rotating rod, two groups of driven wheels and the rotating rod are arranged in the base, the first toothed plate and the second toothed plate are both connected with the driven wheel in a meshed manner, so that the driven wheel can be driven to rotate in the moving process of the first toothed plate and the second toothed plate, and the rotating rod can be made to rotate.
Preferably, the first bevel gear is meshed with the second bevel gear, the second bevel gear is fixedly connected with the rotating piece, the first bevel gear and the second bevel gear are meshed and connected to enable the first bevel gear to drive the second bevel gear to rotate in the rotating process, and the second bevel gear can drive the rotating piece to rotate in the rotating process.
Preferably, the diaphragm is in sliding connection with two groups of clamping pieces, the two groups of clamping pieces are symmetrically arranged about the middle point of the diaphragm, the diaphragm and the rotating piece are arranged at two groups at the upper end of the base, and the diaphragm and the two groups of clamping pieces are in sliding connection so that the two groups of clamping pieces can carry out limit clamping on the placing plate and the wafer main body in the sliding process of the diaphragm, thereby effectively ensuring the clamping stability of the clamping piece on the wafer main body.
Preferably, the rack is engaged with the fifth wheel and is connected with the clamping piece in a penetrating way, the rack and the fifth wheel are engaged and connected to enable the fifth wheel to rotate in a process of driving the rack to slide, and the rack moves in the clamping piece in a process of sliding, so that stability of movement of the two groups of clamping pieces and the gear is guaranteed.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the semiconductor wafer positioning device and the semiconductor wafer processing positioning method, after the wafer main body and the placing plate are placed at the upper end of the fixing plate in the process of positioning the wafer main body, the driving motor drives the driving wheel to rotate and enables the gear ring to rotate, the gear ring can drive the rotating plate to rotate and enable the limiting piece to move in the driving groove in the process of rotating, the limiting piece is close to the middle point of the fixing plate and positions the placing plate and the wafer main body in the process of moving, and the device can position the wafer main bodies with different sizes through the movement of the limiting piece, so that the positioning accuracy and the using convenience of the device are effectively improved;
2. according to the semiconductor wafer positioning device and the semiconductor wafer processing positioning method, in the process of automatic feeding and discharging of the device, the moving piece drives the first toothed plate and the second toothed plate to move downwards, so that the left clamping piece is far away from the fixed plate after the wafer main body is put down, the moving piece moves upwards relatively after the wafer main body is cut by the photomask, at the moment, the right clamping piece rotates and clamps the wafer main body and the placing plate, and therefore the automatic feeding and discharging processes of the device are completed, and the using convenience of the device is effectively improved;
3. according to the semiconductor wafer positioning device and the semiconductor wafer processing positioning method, in the process of clamping the wafer main body by the device, the electric push rod can push the transverse plate to move downwards, then the servo motor can drive the connecting wheel to rotate and enable the racks to move, and in the process of moving the racks, the two clamping pieces can be mutually close to move and clamp the placing plate, so that the placing plate and the wafer main body can be moved to a required position, and the stability of clamping the placing plate and the wafer main body is effectively guaranteed through the movement of the two clamping pieces and the two groups of racks.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention in a front cross-section;
FIG. 2 is a schematic elevational view of the present invention;
FIG. 3 is a schematic view of a front cross-sectional structure of a fixing plate according to the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 3 according to the present invention;
FIG. 5 is a schematic top view of the fixing plate of the present invention;
FIG. 6 is a schematic top view of a rotor plate according to the present invention;
FIG. 7 is a schematic view of the bottom view of the rotating plate of the present invention;
FIG. 8 is a schematic top view of the driven wheel of the present invention;
FIG. 9 is a schematic diagram of the front view of the rotating member of the present invention;
FIG. 10 is a schematic view of the bottom view of the cross plate of the present invention;
FIG. 11 is a schematic view of the cross-sectional elevation view of the cross-plate of the present invention;
FIG. 12 is a schematic view of the left cross-sectional structure of the cross-plate of the present invention.
In the figure: 1. a base; 2. a hydraulic push rod; 3. a moving member; 4. a mask sheet; 5. a bottom plate; 6. a fixing plate; 7. placing a plate; 8. a wafer body; 9. a rotating plate; 10. a driving groove; 11. a limiting piece; 12. a ball; 13. a chute; 14. a gear ring; 15. a driving wheel; 16. a drive motor; 17. a first toothed plate; 18. a second toothed plate; 19. a rotating rod; 20. driven wheel; 21. a first bevel gear; 22. a rotating member; 23. a second bevel gear; 24. an electric push rod; 25. a cross plate; 26. a clamping member; 27. a rack; 28. a fifth wheel; 29. a servo motor.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-12, the present invention provides a technical solution: a semiconductor wafer positioning device and a semiconductor wafer processing positioning method comprise a base 1, a hydraulic push rod 2, a moving part 3, a photomask 4, a bottom plate 5, a fixed plate 6, a placing plate 7, a wafer main body 8, a rotating plate 9, a driving groove 10, a limiting part 11, balls 12, a sliding groove 13, a gear ring 14, a driving wheel 15, a driving motor 16, a first toothed plate 17, a second toothed plate 18, a rotating rod 19, a driven wheel 20, a first bevel gear 21, a rotating part 22, a second bevel gear 23, an electric push rod 24, a transverse plate 25, a clamping part 26, a rack 27, a connecting wheel 28 and a servo motor 29.
The upper end of the base 1 is fixedly provided with the hydraulic push rod 2, the upper end of the hydraulic push rod 2 is fixedly provided with the moving part 3, the lower end of the moving part 3 is fixedly provided with the photomask sheet 4, the upper end of the base 1 is fixedly provided with the bottom plate 5, the upper end of the bottom plate 5 is fixedly provided with the fixed plate 16, the upper end of the fixed plate 6 is provided with the placing plate 7, the upper end of the placing plate 7 is provided with the wafer main body 8, the upper end of the bottom plate 5 is rotationally provided with the rotating plate 9, the upper end of the rotating plate 9 is internally provided with the driving groove 10, the inside of the driving groove 10 is slidably provided with the limiting part 11, one side of the limiting part 11, which is close to the driving groove 10, is internally provided with the balls 12, the upper end of the limiting part 11 is positioned in the inside of the sliding groove 13, the sliding groove 13 is provided in the inside of the fixed plate 6, the upper end of the bottom plate 5 is fixedly provided with the driving motor 16, the output end of the driving motor 16 is fixedly provided with the driving wheel 15, the outer side of the driving wheel 15 is in meshed connection with the gear ring 14, the inner side of the lower end of the rotating plate 9 is fixedly provided with the gear ring 14, the fixed plate 6 and the outer side of the rotating plate 9 are in circular structure, the sliding plate 6 and the rotating plate 9 are in top view, the sliding groove 11 is in the sliding groove 11 and the sliding groove 11 is in the sliding groove 11, the sliding groove 11 and the limiting groove 11, the limiting groove 11 is in the sliding groove 11 and the limiting groove 10, the limiting groove 10 and the limiting groove 11 and the limiting groove 10 is in the sliding groove 11 and the limiting groove 11.
According to fig. 1-7, when the semiconductor wafer positioning device is used, the device is firstly placed at a position needing to work, in the process of positioning a wafer main body 8 by using the device, the placing plate 7 and the wafer main body 8 need to be placed at the upper end of a fixed plate 6 (the placing plate 7 and the wafer main body 8 have the same appearance and size), after the placement of the wafer main body 8 is completed, a driving motor 16 can work, in the process of working by the driving motor 16, a driving wheel 15 is driven to rotate, in the process of rotating by the driving wheel 15, a gear ring 14 is driven to rotate, in the process of rotating by the gear ring 14, a rotating plate 9 is driven to rotate, in the process of rotating by the rotating plate 9, a limiting piece 11 is driven to move by a driving groove 10, in the driving groove 10 and the inside of a sliding groove 13, and approaches the wafer main body 8, the limiting parts 11 slide in the driving grooves 10 through the balls 12 and reduce the friction force born by the limiting parts 11 in the moving process, the placing plate 7 and the wafer main body 8 are contacted and clamped in the moving process of the four groups of limiting parts 11, the placing plate 7 and the wafer main body 8 are limited at the right upper end of the fixing plate 6 by the limiting parts 11 in the process, the positioning process of the device on the wafer main body 8 is finished, the hydraulic push rod 2 is contracted and the moving parts 3 drive the photomask sheet 4 to move downwards, the wafer main body 8 can be processed after the photomask sheet 4 moves to a required position, the positioning process of the device on the wafer main body 8 is finished, the wafer main bodies 8 with different sizes can be positioned by the device through the movement of the limiting parts 11, and the accuracy of the device location and the convenience of using have been effectual improved.
The left and right ends of the moving part 3 are respectively provided with a first toothed plate 17 and a second toothed plate 18, the inside of the base 1 is rotatably provided with a rotating rod 19 and a rotating part 22, the outer side of the rotating rod 19 is sleeved with a driven wheel 20, the front end of the rotating rod 19 is fixedly provided with a first bevel gear 21, the digging side of the rotating part 22 is sleeved with a second bevel gear 23, the second bevel gear 23 is positioned in the inside of the base 1, the first toothed plate 17 and the second toothed plate 18 are both in meshed connection with the driven wheel 20, the driven wheel 20 is fixedly connected with the rotating rod 19, the inside of the base 1 is provided with two groups of driven wheels 20 and the rotating rod 19, the first bevel gear 21 is in meshed connection with the second bevel gear 23, and the second bevel gear 23 is fixedly connected with the rotating part 22.
According to fig. 1-2 and 8-9, before the device locates the wafer main body 8, the two sets of clamping pieces 26 are needed to place the plate 7 and the wafer main body 8 at the upper end of the fixed plate 6, during this process, the hydraulic push rod 2 is contracted and drives the first toothed plate 17 to move downwards through the moving piece 3, during the downward movement of the first toothed plate 17, the driven wheel 20 is driven to rotate, during the driving of the driven wheel 20, the first bevel gear 21 is driven to rotate through the rotating rod 19, during the rotation of the first bevel gear 21, the left rotating piece 22 is driven to rotate, at this time, the left transverse plate 25 is located at the right lower end of the photomask sheet 4 and the wafer main body 8 and the placing plate 7 are placed at the upper end of the fixed plate 6, during the rotation of the left rotating piece 22, the transverse plate 25 is rotated by one hundred eighty degrees, so that the transverse plate 25 rotates to the left side of the mask sheet 4 (the wafer main body 8 and the placing plate 7 are clamped from the positions, the automatic feeding process of the device is completed), the wafer main body 8 is processed through the mask sheet 4 after the moving part 3 moves downwards, the moving part 3 drives the second toothed plate 18 to move upwards after the processing is completed, the driven wheel 20 on the right side is rotated in the process of moving the second toothed plate 18 upwards, the first bevel gear 21 is driven to rotate through the rotating rod 19 in the process of rotating the driven wheel 20, the rotating part 22 is driven to rotate through the second bevel gear 23 in the process of rotating the first bevel gear 21, the rotating part 22 is rotated one hundred eighty degrees from the state of fig. 2, the transverse plate 25 is positioned at the upper end of the processed wafer main body 8, at this time, the placing plate 7 and the wafer main body 8 can be clamped from the upper end of the fixed plate 6 through the clamping piece 26, and in the process of the moving piece 3 moving downwards again, the right rotating piece 22 can drive the transverse plate 25 to rotate to the state shown in fig. 2, and the transverse plate is reciprocated in this way, so that the automatic feeding and discharging processes of the device are completed, and the using convenience of the device is effectively improved.
The one end that rotates piece 22 kept away from second bevel gear 23 fixed mounting has electric putter 24, and electric putter 24's lower single end installs diaphragm 25, and the inside slidable mounting of diaphragm 25 has clamping piece 26, the one side fixed mounting that clamping piece 26 is close to diaphragm 25 intermediate position has rack 27 simultaneously, servo motor 29 is fixed to the upper end of diaphragm 25, and servo motor 29's output fixed mounting has fifth wheel 28, diaphragm 25 and two sets of clamping piece 26 sliding connection, and two sets of clamping piece 26 set up about the mid point symmetry of diaphragm 25, and diaphragm 25 and rotation piece 22 are provided with two sets of at the upper end of base 1, rack 27 and fifth wheel 28 meshing are connected, and rack 27 and clamping piece 26 through connection.
According to fig. 8-12, before the clamping piece 26 clamps the wafer main body 8, the clamping piece 26 needs to be driven to move to the upper end of the wafer main body 8 by the rotating piece 22, at this time, the electric push rod 24 can be made to work, the electric push rod 24 can be made to stretch and push the transverse plate 25 to move downwards, the servo motor 29 can be made to work after the transverse plate 25 moves to a required position, the servo motor 29 can be driven to rotate the connecting wheel 28 in the working process, the two groups of racks 27 can be made to move in the rotating process of the connecting wheel 28, the two groups of racks 27 can be made to move close to each other in the moving process of the two groups of racks 27, the placing plate 7 can be clamped by the clamping piece 26 in the moving process, then the electric push rod 24 can be made to shrink and clamp the placing plate 7 and the wafer main body 8, the stability of the placing plate 7 and the wafer main body 8 can be effectively guaranteed by the movement of the two groups of racks 27, and the overall practicability is increased.
What is not described in detail in this specification is prior art known to those skilled in the art.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The semiconductor wafer positioning device comprises a base (1), a hydraulic push rod (2), a moving part (3) and a photomask (4), wherein the hydraulic push rod (2) is fixedly arranged at the upper end of the base (1), the moving part (3) is fixedly arranged at the upper end of the hydraulic push rod (2), and the photomask (4) is fixedly arranged at the lower end of the moving part (3);
the method is characterized in that: the upper end fixed mounting of base (1) has bottom plate (5), and the upper end fixed mounting of bottom plate (5) has fixed plate (6) to place board (7) have been placed to the upper end of fixed plate (6), place the upper end of board (7) simultaneously and placed wafer main part (8), rotating plate (9) are installed in the upper end rotation of bottom plate (5), and the inside drive slot (10) of having seted up of upper end of rotating plate (9) to the internally sliding of drive slot (10) installs locating part (11), and one side internal nesting that is close to drive slot (10) of locating part (11) installs ball (12) simultaneously, the upper end of locating part (11) is located the inside of spout (13), and the inside at fixed plate (6) is seted up to spout (13), the upper end fixed mounting of board (5) has driving motor (16), and driving motor (16) output fixed mounting has drive wheel (15) to the outside meshing of drive wheel (15) is connected with ring gear (14), and simultaneously ring gear (14) fixed mounting is inside the lower extreme of rotating plate (9).
2. A semiconductor wafer positioning apparatus according to claim 1, wherein: the left end and the right end of the moving part (3) are respectively provided with a first toothed plate (17) and a second toothed plate (18), the inside of the base (1) is rotationally provided with a rotating rod (19) and a rotating part (22), the outer side of the rotating rod (19) is sleeved with a driven wheel (20), the front end of the rotating rod (19) is fixedly provided with a first bevel gear (21), the digging side of the rotating part (22) is sleeved with a second bevel gear (23), and the second bevel gear (23) is located in the base (1).
3. A semiconductor wafer positioning apparatus according to claim 2, wherein: one end that rotates piece (22) kept away from second bevel gear (23) fixed mounting has electric putter (24), and the lower single end of electric putter (24) installs diaphragm (25) to the inside slidable mounting of diaphragm (25) has clamping piece (26), and one side fixed mounting that clamping piece (26) are close to diaphragm (25) intermediate position has rack (27) simultaneously, the upper end fixed mounting of diaphragm (25) has servo motor (29), and the output fixed mounting of servo motor (29) has fifth wheel (28).
4. A semiconductor wafer positioning apparatus according to claim 1, wherein: the outer sides of the fixed plate (6) and the rotating plate (9) are in a circular structure in overlooking mode, the fixed plate (6) and the limiting piece (11) form a sliding structure through the sliding groove (13), and the sliding groove (13) and the limiting piece (11) are distributed in four groups at equal angles relative to the middle point of the fixed plate (6).
5. A semiconductor wafer positioning apparatus according to claim 1, wherein: the limiting piece (11) and the rotating plate (9) form a sliding structure through the balls (12) and the driving groove (10), the limiting piece (11) is tightly attached to the driving groove (10), four groups of driving grooves (10) are distributed at equal angles relative to the middle point of the rotating plate (9), and meanwhile, the driving groove (10) is in an arc-shaped structure in overlooking mode.
6. A semiconductor wafer positioning apparatus according to claim 2, wherein: the first toothed plate (17) and the second toothed plate (18) are both connected with the driven wheel (20) in a meshed mode, the driven wheel (20) is fixedly connected with the rotating rod (19), and the driven wheel (20) and the rotating rod (19) are arranged in the base (1) in two groups.
7. A semiconductor wafer positioning apparatus according to claim 2, wherein: the first bevel gear (21) is connected with the second bevel gear (23) in a meshed mode, and the second bevel gear (23) is fixedly connected with the rotating piece (22).
8. A semiconductor wafer positioning apparatus according to claim 3, wherein: the transverse plate (25) is in sliding connection with the two groups of clamping pieces (26), the two groups of clamping pieces (26) are symmetrically arranged about the middle point of the transverse plate (25), and the transverse plate (25) and the rotating piece (22) are arranged at the upper end of the base (1).
9. A semiconductor wafer positioning apparatus according to claim 3, wherein: the rack (27) is meshed with the connecting wheel (28), and the rack (27) is connected with the clamping piece (26) in a penetrating way.
10. The method for positioning a semiconductor wafer in a semiconductor wafer positioning apparatus according to claim 1, wherein: the method comprises the following steps:
s1, in the process of limiting a wafer main body (8), a driving motor (16) drives a driving wheel (15) to rotate, so that a gear ring (14) and a rotating plate (9) rotate, then a limiting piece (11) can slide in a driving groove (10) and a sliding groove (13), and in the process of moving the limiting piece (11), a placing plate (7) and the wafer main body (8) are limited at the upper end of a fixing plate (6), so that the positioning process of the device is completed;
s2, in the process of downward movement of the moving part (3), the first toothed plate (17) moves downward and enables the rotating part (22) to rotate, so that the left transverse plate (25) rotates out of the lower end of the moving part (3), at the moment, the wafer main body (8) and the placing plate (7) can be placed at the upper end of the fixed plate (6), and in the process of upward movement of the second toothed plate (18) along with the moving part (3), the transverse plate (25) rotates to the lower end of the moving part (3) and clamps the wafer main body (8) and the placing plate (7) through the clamping part (26), and the automatic feeding and discharging processes of the device are completed;
s3, after the transverse plate moves to the upper end of the wafer main body (8), the electric push rod (24) can push the transverse plate (25) to move downwards, then the servo motor (29) drives the fifth wheel (28) to rotate, the rack (27) can drive the clamping piece (26) to move, and the clamping piece (26) can limit and clamp the placing plate (7) and the wafer main body (8) in the moving process, so that the clamping process of the device on the wafer main body (8) is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310702942.3A CN116598245A (en) | 2023-06-14 | 2023-06-14 | Semiconductor wafer positioning device and semiconductor wafer processing positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310702942.3A CN116598245A (en) | 2023-06-14 | 2023-06-14 | Semiconductor wafer positioning device and semiconductor wafer processing positioning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117153758A (en) * | 2023-10-30 | 2023-12-01 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153758A (en) * | 2023-10-30 | 2023-12-01 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
| CN117153758B (en) * | 2023-10-30 | 2023-12-22 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
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Application publication date: 20230815 |