CN116572149A - Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment - Google Patents

Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment Download PDF

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Publication number
CN116572149A
CN116572149A CN202310427706.5A CN202310427706A CN116572149A CN 116572149 A CN116572149 A CN 116572149A CN 202310427706 A CN202310427706 A CN 202310427706A CN 116572149 A CN116572149 A CN 116572149A
Authority
CN
China
Prior art keywords
workbench
block
adjusting
unit
support frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310427706.5A
Other languages
Chinese (zh)
Inventor
时泽健
徐枭宇
朱政挺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Zhonggui Electronic Technology Co ltd
Original Assignee
Hangzhou Zhonggui Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Zhonggui Electronic Technology Co ltd filed Critical Hangzhou Zhonggui Electronic Technology Co ltd
Priority to CN202310427706.5A priority Critical patent/CN116572149A/en
Publication of CN116572149A publication Critical patent/CN116572149A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/02—Bench grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a movable working device, comprising: the component unit is arranged at the top and/or the bottom; the support frame is connected with the component unit, and at least one side of the support frame forms a transfer window; the workbench unit is arranged on the support frame and provided with at least two supporting points, and at least comprises a workbench and an executing mechanism unit; the table unit may be detachable from the support frame from the transfer window. The invention also discloses CMP equipment. In the invention, if the workbench is required to be maintained, the actuating mechanism unit of any station can be disassembled in a movable mode, the support frame is separated from the transfer window, the support frame and all parts connected with the support frame are not required to be disassembled, the maintenance is convenient, the effect of corresponding multiple processes of a single machine can be realized through the replacement of the workbench unit, and the applicability is wider.

Description

Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment
Technical Field
The invention belongs to the field of semiconductor integrated circuit chip manufacturing, and particularly relates to a movable working device, CMP equipment and thinning equipment.
Background
Chemical mechanical polishing planarization (Chemical Mechanical Planarization, simply CMP) apparatus generally includes a semiconductor device front end module (EFEM), a cleaning unit, and a polishing unit. The EFEM mainly comprises a wafer box for storing wafers, a wafer conveying manipulator, an air purifying system and the like; the cleaning unit mainly comprises megasonic cleaning parts, rolling brush cleaning parts, drying parts, devices for conveying wafers between the parts and the like, wherein the number of the megasonic cleaning parts is different; the polishing unit generally includes a table, a polishing disk, a polishing head, a polishing arm, a dresser, a polishing liquid arm, and the like, each of which is arranged on the table in accordance with a processing position. A large amount of chemical liquid is used in the wafer polishing process, and the polishing workbench is usually coated with a corrosion-resistant coating on the surface of the metal plate so as to prolong the service life of the workbench. The corrosion-resistant coating gradually thins after long-term use until partial metal exposure occurs, so that the metal plate is exposed to the polishing solution to corrode, and the mechanical strength is reduced. The table needs to be removed and repainted. The work table is usually stationary in the polishing unit and is connected to the support frame of the apparatus, which means that the support frame and the components connected to the support frame need to be removed during maintenance of the work table. After reinstallation of the platen, it is necessary to perform a leveling operation on the polishing unit. Typically, more than one polishing element is present in a CMP apparatus, for example, an apparatus having 6 polishing elements. Each polishing element must be adjusted to a level that will ensure process uniformity for each region that would otherwise affect the processing quality of the wafer.
The fixed integral table has the following disadvantages: 1) The service life of the anti-corrosion coating is reduced after long-term use, so that the workbench and the support frame are required to be maintained, and the workbench, the support frame and all connected parts thereof are required to be removed and reinstalled for maintenance, so that the cost is excessive; meanwhile, as the service life of each workbench is different due to the use frequency and the different process working conditions, the maintenance time of each workbench is different, and the independent maintenance of the polishing unit at any station cannot be realized; 2) After maintenance, all polishing units need to be adjusted to the horizontal position, the horizontal position of each polishing unit is not completely consistent due to factors such as machining precision, manual installation and the like, the horizontal adjustment mode of the integral workbench is the integral horizontal adjustment (through adjusting the height of the foot), the CMP equipment with a 6-disc structure is particularly difficult and has low precision, the performance of a polishing system on the workbench is directly influenced, the polishing efficiency and polishing effect of each polishing unit are different due to long-time operation of the workbench, and the stable operation of the workbench and the polishing effect of a final wafer are directly influenced. The position of the whole equipment is adjusted to ensure that each polishing unit is positioned horizontally, so that the difficulty is high; 3) The workbench of the current CMP equipment is integral, so that the whole polishing unit is required to be disassembled when a part of polishing modules (a plate polishing table, a polishing arm and cross) of the polishing unit are maintained, the independent maintenance of any polishing modules cannot be achieved, and the integral workbench is too heavy to be used for the pumping work (the aluminum-beautifying material is adopted by the current workbench, the bearing and the weight of the workbench are considered, the total mass of a single polishing workbench is 150kg, the mass of a single polishing disc is 500kg, the mass of a single polishing arm is 300kg, the mass of a single pad trimmer is 100kg, and the mass of a single slurry liquid supply arm is 50kg.
At present, most of existing drawing structures are guide rail sliding block structures (drawing of the existing CMP equipment cannot be achieved), drawing single frames do not meet drawing of a workbench of the multi-disc CMP equipment, and because the drawing single frames have no level adjustment requirement and no level adjustment function, drawing is not easy to achieve. Meanwhile, the layout of the polishing units is integral, and the layout of the polishing units cannot be modified at will (because of the diversity of process requirements, the layout of each polishing unit in the polish can be modified, and meanwhile, if a new polishing function is required to be additionally added, the original integral workbench cannot be newly added.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the movable working device which is convenient to maintain and can cope with multiple processes by a single machine.
The technical scheme adopted for solving the technical problems is as follows: a mobile working device comprising:
the component unit is arranged at the top and/or the bottom;
the support frame is connected with the component unit, and at least one side of the support frame forms a transfer window;
the workbench unit is arranged on the support frame and provided with at least two supporting points, and at least comprises a workbench and an executing mechanism unit; the table unit may be detachable from the support frame from the transfer window.
In the invention, if the workbench is required to be maintained, the actuating mechanism unit of any station can be disassembled in a movable mode, the support frame is separated from the transfer window, the support frame and all parts connected with the support frame are not required to be disassembled, the maintenance is convenient, the effect of corresponding multiple processes of a single machine can be realized through the replacement of the workbench unit, and the applicability is wider.
Further, the workbench is of an integrated structure or is a plurality of partitioned workbench.
Further, the workbench is a plurality of block type workbench, the support frame is provided with a movable beam, and the block type workbench is erected on the movable beam.
Further, the workbench is a plurality of block type workbench and a supporting piece, the block type workbench is arranged on the supporting piece, and the supporting piece and the supporting frame are provided with at least two supporting points.
Further, the workbench is a plurality of block type workbench, and the block type workbench is mutually connected.
Further, the executing mechanism unit is a polishing unit and at least comprises a polishing disc, a polishing arm, a trimmer and a liquid supply arm; the workbench is a plurality of block type workbench, the polishing disc, the polishing arm, the trimmer and the liquid supply arm are respectively arranged on a single block type workbench, or two or more of the polishing disc, the polishing arm, the trimmer and the liquid supply arm are respectively arranged on a single block type workbench.
Further, the polishing unit also includes a groove reworking assembly disposed on the segmented table.
Further, the device also comprises an adjusting mechanism which is arranged below the workbench unit and at the position of the supporting point and is used for adjusting the level of the workbench.
Further, the adjusting mechanism is also used for adjusting the height of the workbench.
Further, the adjusting mechanism comprises an upper adjusting block which can be connected with the workbench, a lower adjusting block which is arranged at the supporting point, and a locking piece, wherein the contact surface of the upper adjusting block and the lower adjusting block is an inclined surface, and the locking piece respectively penetrates through the upper adjusting block and the lower adjusting block and locks the upper adjusting block and the lower adjusting block relatively.
Further, the upper adjusting block is provided with a connecting column capable of being inserted into the workbench and an internal threaded hole, and when the inclined planes of the upper adjusting block and the lower adjusting block slide to the target position, the locking piece penetrates through the lower adjusting block and is in threaded connection with the internal threaded hole.
Further, the adjusting mechanism comprises a limit column connected to the supporting point and an adjusting piece connected to the limit column, a limit hole for the limit column to extend in is formed in the lower surface of the workbench, the workbench is supported above the adjusting piece, and the adjusting piece can move up and down relative to the limit column.
Further, adjustment mechanism includes the base, rotates the first fork that connects in the base, rotates the second fork that links to each other to be X type with first fork, rotates the slider of connecting in second fork bottom, goes up supporting shoe, and the locating piece, the slider can offset with the locating piece, go up supporting shoe and link to each other with first fork and second fork, and go up the supporting shoe and be equipped with the travel slot that can supply first fork or second fork top horizontal slip.
Further, the adjusting mechanism is an air bag which is arranged at the supporting point, and the air quantity in the air bag can be changed to change the relative height of the workbench.
Furthermore, the adjusting mechanism is a mast type lifting structure.
Further, the component units are arranged at the top and the bottom, and an operation window is formed below the workbench unit and at the side of the support frame.
Further, the number of the supporting points is three or more.
Further, transfer windows are formed around the support frame.
The invention also discloses CMP equipment comprising the movable working device.
Further, the number of the movable working devices is multiple, and the movable working devices are connected through the frame.
The invention also discloses thinning equipment which comprises the movable working device.
The invention has the advantages that 1) if the workbench is required to be maintained, the connection between the adjusting mechanism and the workbench is removed, the actuating mechanism unit of any station can be removed in a movable mode, and the support frame and all parts connected with the support frame are not required to be removed; similarly, after the adjusting mechanism is installed, the adjusting mechanism is connected with the workbench again, and each polishing unit is positioned horizontally by adjusting the height of each adjusting mechanism; 2) The workbench unit can be separated from the support frame from the transfer window, so that the maintenance is convenient, the effect of corresponding multiple processes of a single machine can be realized through the replacement of the workbench unit, and the applicability is wider; 3) The adjusting mechanism is arranged at the position of the supporting point, and the height of each supporting point of the workbench is adjusted through adjusting the adjusting mechanism, so that the workbench is adjusted to be in a horizontal position; 4) When the workbench is a plurality of block type workbenches, the modules (taking a polishing unit as an example, the modules refer to a polishing disk, a polishing arm, a trimmer, a liquid supply arm and the like) in the execution mechanism unit can be flexibly arranged according to the process requirements, the layout is arbitrarily defined, the modules can be arbitrarily replaced, and meanwhile, the height of each module in the execution mechanism unit can be defined through an adjusting mechanism; 5) When the workbench is a plurality of block type workbench, the shape and the number of each block type workbench can be selected according to the process requirement, so that the required functions are realized; when a new function is needed, the block type workbench can be additionally and newly added for independent installation or replacement, when modules are needed to be reduced, the block type workbench can be independently removed, and the single block type workbench can be partially replaced after failure; 6) The installation efficiency is high, the disassembly and assembly workload of the workbench unit is reduced, only the workbench and the adjusting mechanism are required to be disassembled and installed, other supporting frames and other executing mechanism units are not required to be disassembled, and the executing mechanism units can be independently maintained without influencing the operation of other stations; 7) Compared with an integral workbench, the adjustable workbench has higher adjustment precision, the adjustment quantity of the adjusting mechanism is easier to control, and the position of the actuating mechanism unit can be finely adjusted by completing tiny adjustment; 8) The layout of the execution mechanism units and the heights of the execution mechanism units can be adjusted at will, so that more process requirements can be met.
Drawings
Fig. 1 is a perspective view of a movable working device according to a first embodiment of the present invention.
Fig. 2 is an enlarged view of the structure at a in fig. 1.
Fig. 3 is a schematic view of a split structure in the first embodiment of the present invention, in which the workbench and the actuator unit move out of the support frame from the transfer window.
Fig. 4 is a schematic diagram of a matching structure of a workbench and a part of a supporting frame in the first embodiment of the invention.
Fig. 5 is a schematic structural view of a CMP apparatus according to a first embodiment of the present invention, in which a plurality of movable working devices are connected by a frame.
Fig. 6 is a schematic structural diagram of a frame according to an embodiment of the invention.
Fig. 7 is a perspective view of a movable working device according to a second embodiment of the present invention.
Fig. 8 is an enlarged view of the structure at B in fig. 7.
Fig. 9 is a schematic diagram of a split structure in the second embodiment of the present invention, where the block-type workbench moves out of the support frame from the transfer window.
Fig. 10 is a schematic structural view of a CMP apparatus according to a second embodiment of the present invention, in which a plurality of movable working devices are connected by a frame.
Fig. 11 is a schematic diagram of a matching structure of a workbench and a part of a supporting frame in the second embodiment of the invention, wherein the workbench is a plurality of partitioned workbench, and the supporting frame is provided with a movable beam.
Fig. 12 is a schematic diagram of a matching structure of a plurality of block-type tables and a support in the second embodiment of the present invention.
Fig. 13 is a schematic structural view of a plurality of block-type tables placed on a supporting member according to a second embodiment of the present invention.
Fig. 14 is a schematic perspective view of an adjusting mechanism according to a third embodiment of the invention.
Fig. 15 is a schematic structural view of an upper adjusting block of an adjusting mechanism in a third embodiment of the present invention.
Fig. 16 is a schematic structural view of a lower adjusting block of the adjusting mechanism in the third embodiment of the present invention.
Fig. 17 is a schematic structural view of a locking member according to a third embodiment of the present invention.
Fig. 18 is a schematic perspective view of an adjusting mechanism according to a fourth embodiment of the invention.
Fig. 19 is a schematic three-dimensional structure of an adjusting mechanism in a fourth embodiment of the invention.
Fig. 20 is a partial schematic view of a matching structure of an adjusting mechanism and a supporting frame, and a workbench in the fifth embodiment of the invention.
The device comprises a 1-component unit, a 2-supporting frame, a 21-transferring window, a 22-operating window, a 3-workbench unit, a 30-supporting point, a 31-workbench, a 310-block workbench, a 32-actuator unit, a 321-polishing disk, a 322-polishing arm, a 323-trimmer, a 324-liquid supply arm, a 33-supporting piece, a 4-adjusting mechanism, a 41-upper adjusting block, a 411-connecting column, a 412-internal threaded hole, a 42-lower adjusting block, a 43-locking piece, a 44-limiting column, a 45-adjusting piece, a 461-base, a 462-first fork piece, a 471-second fork piece, a 472-sliding block, a 48-upper supporting block, a 481-stroke groove, a 49-positioning block, a 5-movable beam and a 6-frame.
Description of the embodiments
In order to make the present invention better understood by those skilled in the art, the following description will make clear and complete descriptions of the technical solutions of the embodiments of the present invention with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Examples
As shown in fig. 1 to 4, a movable working device includes a component unit 1, a supporting frame 2 connected to the component unit 1, a table unit 3 provided on the supporting frame 2, and an adjusting mechanism 4. The component unit 1 can be arranged at the top of the support frame 2, can be arranged at the bottom of the support frame 2, and can be arranged at the top and the bottom. At least two supporting points 30 are arranged between the workbench unit 3 and the support frame 2, the workbench unit 3 at least comprises a workbench 31 and an executing mechanism unit 32, the executing mechanism unit 32 is detachably connected to the workbench 31, at least one side of the support frame 2 forms a transferring window 21, and the workbench unit 3 can be separated from the support frame 2 from the transferring window 21. The adjusting mechanism 4 is provided below the table unit 3 at a position of the supporting point 30 for adjusting the level of the table 31.
In the present embodiment, the component units 1 are disposed at the top and bottom of the supporting frame 2, and the table unit 3 is disposed between the top component unit 1 and the bottom component unit 1 of the supporting frame 2. Thereby forming an operation window 22 below the table unit 3 and beside the support frame 2. Specifically, the top component unit 1 may be an electrical cabinet, and the bottom component unit 1 supplies power, water, and air to the actuator unit 32.
The number of the supporting points 30 is three or more, in this embodiment, the number of the supporting points 30 is four, and the workbench 31 is in an integrated structure, that is, the cross-sectional shape of the workbench 31 is adapted to the cross-sectional shape of the support frame 2, so that the workbench 31 can be supported and placed on the four supporting points 30 inside the support frame 2.
In this embodiment, the actuator unit 32 is a polishing unit, and at least includes a polishing disk 321, a polishing arm 322, a conditioner 323, and a liquid supply arm 324, where the polishing disk 321, the polishing arm 322, the conditioner 323, and the liquid supply arm 324 are detachably connected to a workbench 31 having a square cross section.
The transfer window 21 is a hollow window structure on the side of the support frame 2, and may be disposed around the support frame 2 or on multiple sides. The operation window 22 is also a hollow window structure on the side surface of the support frame 2, the transfer window 21 is located above the workbench 31, and the operation window 22 is located below the workbench 31. When the actuator unit 32 is a polishing unit, the gas and liquid required for the polishing unit below the table 31, as well as the motor, cylinder, and the like of the polishing unit are mainly maintained by the operation window 22.
As shown in fig. 3, when the module of the actuator unit 32 needs to be maintained or replaced, for example, when the polishing unit needs to be maintained or replaced, for example, the polishing disk 321 or the polishing arm 322 or the conditioner 323 or the liquid supply arm 324, the table 31 can be pulled out from the transfer window 21 of the support frame 1 for local maintenance or overall replacement.
The disassembly step of the invention is that firstly, the interface of the execution mechanism unit 32 and the component unit (PLD) 1 is disassembled; then, the transmission mechanism (motor, cylinder, etc.) of the actuator unit 32 is disassembled; then, the fixing part (screw) between the execution part and the workbench 31 in the execution mechanism unit 32 is disassembled; and finally, lifting out the particularly heavy modules (taking polishing units as examples, polishing arms and polishing discs) by using a lifting device, and eliminating the need for operating the support frame 2 and the component unit 1.
Examples
As shown in fig. 7 to 13, the present embodiment is different from the first embodiment in that the table 31 is a plurality of block tables 310, that is, the table having a cross-sectional shape adapted to the cross-sectional shape of the support frame 2 is divided into a plurality of blocks, and a plurality of parts of the actuator unit 32 are provided on the plurality of block tables 310.
Taking the actuator unit 32 as an example of the polishing unit, the polishing disk 321, the polishing arm 322, the dresser 323, and the liquid supply arm 324 are respectively provided on the individual block tables 310, that is, one module is provided for each block table 310. Alternatively, two or more of the polishing pad 321, the polishing arm 322, the dresser 323, and the liquid supply arm 324 are provided on a single block table 310, i.e., each block table 310 is provided with two or three modules.
When another module needs to be added to the actuator unit 32, the added module may be separately provided on the single block type table 310, and the structure of the entire table unit 3 may not need to be changed. And the plurality of block type workbenches 310 can be freely combined to adjust the arrangement of each functional module, and the functional modules can be replaced at will. Such as when the actuator unit 32 is a polishing unit, a groove re-work assembly may also be included and disposed on the segmented table 310.
In order to realize the support of the plurality of block-type work tables 310, the movable beam 5 is provided on the support frame 2, and the plurality of block-type work tables 310 may be erected on the movable beam 5. The movable beam 5 may have a net structure as shown in fig. 11, an X-shaped structure, or a beam column provided below, and the upper end of the beam column may be supported at a joint of the adjacent block type tables 310, and the lower end of the beam column may be supported at a position such as the ground.
At this time, the supporting point 30 may be provided on the movable beam 5, so that the adjusting mechanism 4 is provided on the movable beam 5. The number of the support points 30 is not less than three, as the case may be.
In order to facilitate the whole drawing of the table unit 3, as shown in fig. 12 and 13, the table 31 is a plurality of block tables 310 and a supporting member 33, the block tables 310 are placed on the supporting member 33, and at least two supporting points 30 are provided between the supporting member 33 and the supporting frame 2. Specifically, the ribs 331 are formed around the support 33, so as to prevent the plurality of block tables 310 from moving or even separating at will.
When maintenance is required, the block type work table 310 on which the module to be maintained is located may be taken out from the transfer window 21 according to the maintenance requirement, or the support 33 may be integrally pulled out, and then the module to be maintained may be taken out. The transfer windows 21 are arranged around the support frame 2, so that the direction of taking out the block workbench 310 is not limited, and the block workbench can translate on the xy plane or move in xyz three-position space, such as obliquely upwards (without avoiding problems) or just upwards, and the block workbench is configured according to space and maintenance requirements.
Specifically, for example, only a portion of the simple modules are maintained, and the block table 310 is directly disassembled, for example, if it is involved in disassembling a particular polishing module (the disassembly is performed on the premise that all other modules must be disassembled), then the polishing module that does not require maintenance needs to be disassembled.
Specifically, as shown in fig. 9, when the module of the actuator unit 32 needs to be maintained or replaced, for example, when the polishing unit needs to be maintained or replaced, for example, the polishing disk 321, the polishing arm 322, the trimmer 323, or the liquid supply arm 324, the block-type workbench 310 where the single module is located can be pulled out from the transfer window 21 of the support frame 1 for local maintenance or replacement.
Of course, a plurality of block tables 310 may be connected to each other to form a rigid body.
Other structures are the same as those of the first embodiment, and will not be described again.
Examples
The present embodiment specifically describes the structure of the adjustment mechanism 4 based on the first or second embodiments. The adjusting mechanism 4 is correspondingly arranged at the position of the supporting point 30, and is used for adjusting the level of the workbench 31 and also can be used for adjusting the height of the workbench 31.
As shown in fig. 14 to 17, the adjusting mechanism 4 includes an upper adjusting block 41 which can be connected to the table 31, a lower adjusting block 42 which is placed at the supporting point 30, and a locking member 43, the contact surfaces of the upper adjusting block 41 and the lower adjusting block 42 are inclined surfaces, and the locking member 43 passes through the upper adjusting block 41 and the lower adjusting block 42, respectively, and locks the two relatively.
Taking the direction shown in fig. 14 as an example, the upper adjusting block 41 is inclined from left to right, from bottom to top so that the thickness of the upper adjusting block 41 is reduced, and the lower adjusting block 42 is inclined from right to left, from top to bottom so that the thickness of the lower adjusting block 42 is reduced. The horizontal upper end surface of the upper adjusting block 41 is provided with a connecting column 411 which can be inserted into the lower surface of the workbench 31, and the upper adjusting block 41 is internally provided with an internal threaded hole 412; the lower adjusting block 42 is also provided with a slot 421, the position of the slot 421 corresponds to the position of the internal threaded hole 412, and when the inclined surfaces of the upper adjusting block 41 and the lower adjusting block 42 slide to the target position, the locking member 43 passes through the lower adjusting block 42, enters the slot 421 and is in threaded connection with the internal threaded hole 412, so as to realize fixed assembly.
When the horizontal height of the supporting point 30 needs to be adjusted by the adjusting mechanism 4, the adjustment of the entire height can be achieved by the contact area of the inclined surfaces of the upper adjusting block 41 and the lower adjusting block 42. In order to prevent the upper adjustment block 41 from slipping off the lower adjustment block 42, an anti-drop tip 422 is provided at the thicker end of the lower adjustment block 42. In this embodiment, the end of the locking member 43 has an end with an increased outer diameter, and the anti-drop tip 422 may also be used to lock the end of the locking member 43.
Examples
The present embodiment specifically describes the structure of the adjustment mechanism 4 based on the first or second embodiments. The adjusting mechanism 4 is correspondingly arranged at the position of the supporting point 30, and is used for adjusting the level of the workbench 31 and also can be used for adjusting the height of the workbench 31.
As shown in fig. 18 to 19, the adjusting mechanism 4 includes a base 461 disposed at the supporting point 30, a first fork 462 rotatably connected to the base 461, a second fork 471 rotatably connected to the first fork 462 and having an X shape, a slider 472 rotatably connected to a bottom end of the second fork 471, an upper supporting block 48, and a positioning block 49.
The rotation connection structure of the first fork 462 and the second fork 471 may be a hinge structure in the prior art, or may be another structure, which is not limited in particular. The base 461 forms a track, the sliding block 472 can slide in the track, the positioning block 49 can be detachably connected to the base 461, after the positioning block 49 is adjusted to a target position, the positioning block 49 is fixedly assembled with the base 461, and the sliding block 472 can abut against the positioning block 49, so that the relative positions of the first fork 462 and the second fork 471 are fixed, namely the included angles of the first fork 462 and the second fork 471 are relatively fixed, and at the moment, the relative height of the upper supporting block 48 positioned at the top of the second fork 471 is fixed. In this embodiment, one end of the upper supporting block 48 is rotatably connected to the second fork 471, the bottom of the upper supporting block 48 is provided with a travel slot 481, two sides of the top of the first fork 462 are provided with protruding columns 463, and the protruding columns 463 on both sides can slide horizontally in the travel slots 481 on both sides.
Of course, the above structure may be replaced by a structure in which two sides of the top of the second fork 471 are provided with protruding columns, and the top of the first fork 462 is rotatably connected with the upper supporting block 48, which is not limited in particular.
When the included angle between the first fork 462 and the second fork 471 is changed, the relative height of the upper supporting block 48 is changed, so as to adjust the relative height of the workbench 31. When the heights of the adjusting mechanisms 4 of the plurality of supporting points 30 are respectively and independently adjusted, the overall level adjustment of the workbench 31 can be realized.
Examples
The present embodiment specifically describes the structure of the adjustment mechanism 4 based on the first or second embodiments. The adjusting mechanism 4 is correspondingly arranged at the position of the supporting point 30, and is used for adjusting the level of the workbench 31 and also can be used for adjusting the height of the workbench 31.
As shown in fig. 20, the adjusting mechanism 4 includes a limiting post 44 connected to the supporting point 30, and an adjusting member 45 connected to the limiting post 44, a limiting hole 311 into which the limiting post 44 extends is formed on the lower surface of the table 31, and the table 31 is supported above the adjusting member 45, and the adjusting member 45 can move up and down relative to the limiting post 44.
Specifically, the limiting post 44 may be a screw vertically connected to the supporting point 30, the adjusting member 45 may be a nut screwed on the screw, the lower end of the screw is fixedly connected to the supporting point 30, the upper end of the screw is inserted into the limiting hole 311 on the lower surface of the workbench 31, and the axial length of the upper end of the screw extending into the limiting hole 311 is variable, so that the relative height of the workbench 31 can be adjusted, and the nut forms a supporting function on the workbench 31.
Specifically, the limiting post 44 may be a screw rod vertically connected to the supporting point 30, the adjusting member 45 may be a screw nut screwed on the screw rod, the lower end of the screw rod is fixedly connected to the supporting point 30, the upper end of the screw rod is inserted into the limiting hole 311 on the lower surface of the workbench 31, and the axial length of the upper end of the screw rod extending into the limiting hole 311 is variable, so that the relative height of the workbench 31 can be adjusted, and at this time, the screw nut forms a bearing function on the workbench 31.
When the heights of the adjusting mechanisms 4 of the plurality of supporting points 30 are respectively and independently adjusted, the overall level adjustment of the workbench 31 can be realized.
Examples
The present embodiment specifically describes the structure of the adjustment mechanism 4 based on the first or second embodiments. The adjusting mechanism 4 is correspondingly arranged at the position of the supporting point 30, and is used for adjusting the level of the workbench 31 and also can be used for adjusting the height of the workbench 31.
In the present embodiment, the adjusting mechanism 4 is an air bag provided at the supporting point 30, and the amount of air in the air bag is variable, thereby changing the relative height of the table 31. When the heights of the adjusting mechanisms 4 of the plurality of supporting points 30 are respectively and independently adjusted, the overall level adjustment of the workbench 31 can be realized.
Examples
The present embodiment specifically describes the structure of the adjustment mechanism 4 based on the first or second embodiments. The adjusting mechanism 4 is correspondingly arranged at the position of the supporting point 30, and is used for adjusting the level of the workbench 31 and also can be used for adjusting the height of the workbench 31.
In this embodiment, the adjusting mechanism 4 is a mast type lifting structure, which may be specifically implemented by a structure in the prior art, and will not be described again.
Examples
As shown in fig. 5, a CMP apparatus includes the movable working device according to any one of the first to sixth embodiments, and the actuator unit 32 is a polishing unit.
The number of the movable working devices is plural, specifically six, and the plural movable working devices are connected through the frame 6, as shown in fig. 6, that is, the six movable working devices are connected as a whole, which cannot individually adjust the level or the level height of the single movable working device.
Examples
A thinning apparatus includes the movable working device according to any one of the first to sixth embodiments, where the actuator unit 32 is a thinning unit.
Specifically, the actuator (mechanical arm) of the actuator unit 32 sticks the workpiece to the film, the power device sucks the film with the workpiece to the carrying mechanism by vacuum suction, the workpiece is ground by the actuator (grinding wheel), and then the formed material is transported to the cleaning by the transmission mechanism (cylinder, motor, belt wheel).
Examples
A stamping device comprising the movable working device according to any one of the first to sixth embodiments, wherein the actuator unit 32 is a stamping unit.
Specifically, the feeding mechanism of the actuator unit 32 sends raw materials to the lower part of the actuator (press) through a transmission mechanism (a cylinder, a motor and a belt wheel), and after the press is stamped and formed downwards, the formed materials are transported to be cleaned by the transmission mechanism.
Examples
A forging apparatus including the movable working apparatus according to any one of the above-described first to sixth embodiments, wherein the actuator unit 32 is a forging unit.
Specifically, the feeding mechanism of the actuating mechanism unit 32 sends raw materials to the lower part of the actuating mechanism (hammer head) through a transmission mechanism (air cylinder and motor), the actuating mechanism forges the raw materials downwards through up-and-down reciprocating motion, and after forging, the transmission mechanism conveys the formed materials.
Examples
An assembling apparatus includes the movable working device according to any one of the first to sixth embodiments, wherein the actuator unit 32 is an assembling unit.
Specifically, the actuator unit 32 takes the first workpiece holder to the first stage through the first transfer mechanism, simultaneously takes the second workpiece holder to the first stage through the second transfer mechanism, performs press fit assembly with the first workpiece, and transports the assembled finished product through the transmission mechanism. The foregoing detailed description is provided to illustrate the present invention and not to limit the invention, and any modifications and changes made to the present invention within the spirit of the present invention and the scope of the appended claims fall within the scope of the present invention.

Claims (21)

1. A mobile work device, comprising:
the component unit (1) is arranged at the top and/or the bottom;
the support frame (2) is connected with the component unit (1), and at least one side of the support frame forms a transfer window (21);
a workbench unit (3) which is arranged on the support frame (2) and provided with at least two support points (30) and at least comprises a workbench (31) and an actuating mechanism unit (32); the workbench unit (3) can be separated from the support frame (2) from the transfer window (21).
2. The mobile work device of claim 1 wherein: the workbench (31) is of an integral structure or is a plurality of partitioned workbenches (310).
3. The mobile work device of claim 2 wherein: the workbench (31) is a plurality of block type workbench (310), the support frame (2) is provided with a movable beam (5), and the block type workbench (310) is erected on the movable beam (5).
4. The mobile work device of claim 2 wherein: the workbench (31) is a plurality of block-type workbenches (310) and a bearing piece (33), the block-type workbenches (310) are arranged on the bearing piece (33), and the bearing piece (33) and the support frame (2) are provided with at least two supporting points (30).
5. The mobile work device of claim 2 wherein: the workbench (31) is a plurality of block type workbench (310), and the block type workbench (310) is connected with each other.
6. The mobile work device of claim 2 wherein: the actuator unit (32) is a polishing unit and at least comprises a polishing disc (321), a polishing arm (322), a trimmer (323) and a liquid supply arm (324); the workbench (31) is a plurality of block type workbench (310), the polishing disc (321), the polishing arm (322), the trimmer (323) and the liquid supply arm (324) are respectively arranged on a single block type workbench (310), or two or more of the polishing disc (321), the polishing arm (322), the trimmer (323) and the liquid supply arm (324) are respectively arranged on a single block type workbench (310).
7. The mobile work device of claim 6 wherein: the polishing unit also includes a groove re-work assembly disposed on a segmented table (310).
8. The mobile work device of claim 1 wherein: the device also comprises an adjusting mechanism (4) which is arranged below the workbench unit (3) and at the position of the supporting point (30) and is used for adjusting the level of the workbench (31).
9. The mobile work device of claim 8 wherein: the adjusting mechanism (4) is also used for adjusting the height of the workbench (31).
10. The mobile work device of claim 8 wherein: the adjusting mechanism (4) comprises an upper adjusting block (41) which can be connected with the workbench (31), a lower adjusting block (42) which is arranged at the supporting point (30) and a locking piece (43), wherein the contact surface of the upper adjusting block (41) and the lower adjusting block (42) is an inclined surface, and the locking piece (43) respectively penetrates through the upper adjusting block (41) and the lower adjusting block (42) and locks the upper adjusting block and the lower adjusting block relatively.
11. The mobile work device of claim 10 wherein: the upper adjusting block (41) is provided with a connecting column (411) which can be inserted into the workbench (31) and an internal threaded hole (412), when the inclined surfaces of the upper adjusting block (41) and the lower adjusting block (42) slide to the target position, the locking piece (43) passes through the lower adjusting block (42) and is in threaded connection with the internal threaded hole (412).
12. The mobile work device of claim 9 wherein: the adjusting mechanism (4) comprises a limit column (44) connected to the supporting point (30) and an adjusting piece (45) connected to the limit column (44), a limit hole (311) for the limit column (44) to extend in is formed in the lower surface of the workbench (31), the workbench (31) is supported above the adjusting piece (45), and the adjusting piece (45) can move up and down relative to the limit column (44).
13. The mobile work device of claim 8 wherein: the adjusting mechanism (4) comprises a base (461), a first fork piece (462) connected to the base (461) in a rotating mode, a second fork piece (471) connected with the first fork piece (462) in an X-shaped mode in a rotating mode, a sliding block (472) connected to the bottom end of the second fork piece (471) in a rotating mode, an upper supporting block (48) and a positioning block (49), the sliding block (472) can prop against the positioning block (49), the upper supporting block (48) is connected with the first fork piece (462) and the second fork piece (471), and a travel groove (481) capable of enabling the top end of the first fork piece (462) or the top end of the second fork piece (471) to horizontally slide is formed in the upper supporting block (48).
14. The mobile work device of claim 9 wherein: the adjusting mechanism (4) is an air bag which is arranged at the supporting point (30), and the air quantity in the air bag can be changed to change the relative height of the workbench (31).
15. The mobile work device of claim 9 wherein: the adjusting mechanism (4) is a mast type lifting structure.
16. The mobile work device of claim 1 wherein: the component unit (1) is arranged at the top and the bottom, and an operation window (22) is formed below the workbench unit (3) and beside the support frame (2).
17. The mobile work device of claim 1, wherein: the number of the supporting points (30) is three or more.
18. The mobile work device of claim 1, wherein: transfer windows (21) are formed around the support frame (2).
19. A CMP apparatus, characterized in that: comprising a mobile working device according to any one of claims 1-18.
20. The CMP apparatus as recited in claim 19, wherein: the number of the movable working devices is multiple, and the movable working devices are connected through the frame (6).
21. A thinning apparatus, characterized in that: comprising a mobile working device according to any one of claims 1-18.
CN202310427706.5A 2023-04-20 2023-04-20 Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment Pending CN116572149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310427706.5A CN116572149A (en) 2023-04-20 2023-04-20 Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310427706.5A CN116572149A (en) 2023-04-20 2023-04-20 Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment

Publications (1)

Publication Number Publication Date
CN116572149A true CN116572149A (en) 2023-08-11

Family

ID=87540385

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310427706.5A Pending CN116572149A (en) 2023-04-20 2023-04-20 Movable working device, CMP (chemical mechanical polishing) equipment and thinning equipment

Country Status (1)

Country Link
CN (1) CN116572149A (en)

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