CN116569243A - Support film, display module and electronic equipment - Google Patents
Support film, display module and electronic equipment Download PDFInfo
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- CN116569243A CN116569243A CN202080107713.1A CN202080107713A CN116569243A CN 116569243 A CN116569243 A CN 116569243A CN 202080107713 A CN202080107713 A CN 202080107713A CN 116569243 A CN116569243 A CN 116569243A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 360
- 239000002184 metal Substances 0.000 claims abstract description 360
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 16
- 239000012778 molding material Substances 0.000 claims description 13
- 239000010935 stainless steel Substances 0.000 claims description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims description 13
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 9
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 238000013329 compounding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 abstract description 91
- 239000010408 film Substances 0.000 description 110
- 239000007769 metal material Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002905 metal composite material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- General Physics & Mathematics (AREA)
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Abstract
The embodiment of the application provides a support film, a display module and electronic equipment, and the support film is used for being arranged below a display element of the display module to provide support for the display element through comprising a first metal layer and a second metal layer. The Young modulus of the first metal layer is higher than that of the second metal layer, and the high rigidity performance of the first metal layer and the high bending performance of the second metal layer are utilized, so that the support film has good bending performance while providing good rigid support, thereby ensuring that the display module has good bending performance and reliability, and meeting the requirements of the rigidity and bending performance of the display module.
Description
The application relates to the technical field of electronic equipment, in particular to a support film, a display module and electronic equipment.
With the gradual maturation of the flexible screen technology, the display mode of the electronic equipment is promoted to be changed greatly, one of which is the appearance of the electronic equipment such as a foldable mobile phone, a computer and the like, and taking the foldable mobile phone as an example, the mobile phone can be only the size of a traditional mobile phone after being folded, is convenient to carry, and can have the display size of a flat plate after being unfolded, so that the foldable device becomes one of products which are deeply touted by people.
At present, a metal material layer is arranged below the display screen to serve as a supporting film layer, and the supporting film layer is arranged below the whole display module and mainly plays a role of rigid support so as to improve the surface flatness and shock resistance of the display screen. In order to ensure the rigidity requirement of the display screen, the metal support film layer usually needs a certain thickness, the thicker the thickness is, the stronger the rigidity is, but the thicker the thickness is, the bending property of the screen is reduced, the more difficult the screen is to bend, in the prior art, the display screen has good bending performance by reducing the thickness of the support film layer, correspondingly, the rigidity of the screen is reduced, the rigidity requirement cannot be met, and the reliability of the screen is affected. Therefore, there is an urgent need for a film layer that has good bending properties while providing good rigid support, so that the display screen has good bending properties and reliability.
Disclosure of Invention
The application provides a support film, display module assembly and electronic equipment, when this support film can provide fine rigid support, have good bending property, solve current support film layer bending property better but the rigid support ability is relatively poor, influence the problem of screen reliability.
In a first aspect, the present application provides a support film for use in a foldable display module, including at least a first metal layer and a second metal layer;
the first metal layer and the second metal layer are arranged below the display element of the display module, and the Young modulus of the first metal layer is higher than that of the second metal layer.
Thus, the first metal layer and the second metal layer can play a supporting role on the display element, and the first metal layer with high Young modulus has higher rigidity, can ensure to provide enough rigid support for the display element such as a display screen and the like, and improves the surface flatness and the shock resistance of the display screen. The second metal layer with low Young's modulus has lower rigidity, larger stress capable of resisting, namely higher yield strength, and good bending performance, and the support film has good bending performance while providing good rigid support by utilizing the high rigidity performance of the first metal layer and the high bending performance of the second metal layer, so that the display module is ensured to have good bending performance and reliability, and the rigidity and bending performance requirements of the display module are met.
In a possible implementation manner of the first aspect, the first metal layer is configured to be disposed on a side of the second metal layer near a bending center of the display module.
Therefore, the first metal layer is stressed by compression when the display module is bent, and correspondingly, the second metal layer is stressed by pulling when the display module is bent. While the resistance of the metal layer to tensile stress is poor, i.e. tensile stress more easily causes damage to the metal material under the same stress. The first metal layer is arranged on one side of the second metal layer, which is close to the bending center of the display module, so that the first metal layer with high Young modulus is stressed by compression when the display module is bent, the second metal layer with low Young modulus is stressed by tension when the display module is bent, and the second metal layer with low Young modulus has better bending property, so that the resistance performance of the support film to stress when the display module is bent can be improved, the rigidity of the support film is ensured, the bending performance of the support film is further improved, and the support film is prevented from being damaged under the action of pressure generated in the bending process of the display module.
In a possible implementation manner of the first aspect, when the display element is folded in, the first metal layer is configured to be disposed between the second metal layer and the display element.
By arranging the first metal layer close to the display element, the second metal layer is located on a side of the first metal layer remote from the display element. Therefore, when the display module is bent, the first metal layer is subjected to compressive stress, the second metal layer is subjected to tensile stress, the first metal layer has high Young modulus and can provide enough support for the display element, the second metal layer has low Young modulus, the resistance of the support film to stress when the display module is bent can be improved, the rigidity of the support film is ensured, and meanwhile, the bending performance of the support film is further improved.
In a possible implementation manner of the first aspect, when the display element is folded in an outward manner, the second metal layer is configured to be disposed between the first metal layer and the display element.
By arranging the second metal layer close to the display element, the first metal layer is located at a side of the second metal layer remote from the display element. Therefore, when the display module is bent, the first metal layer is stressed by compression, the second metal layer is stressed by tension, the first metal layer with high Young modulus can provide enough support for the display element, and the second metal layer with low Young modulus can improve the resistance performance of the support film to stress when the display module is bent, and further improve the bending performance of the support film while ensuring the rigidity of the support film.
In a possible implementation manner of the first aspect, the semiconductor device further includes a dielectric layer, where the dielectric layer is located between the first metal layer and the second metal layer;
the forming material of the dielectric layer is metal or alloy with the Vickers hardness value of 20-400 HV.
The dielectric layer can serve as a transition layer between the first metal layer and the second metal layer, so that the first metal layer and the second metal layer can be connected, and the bonding fastness of the first metal layer and the second metal layer is improved.
In addition, the forming material of the dielectric layer is metal or alloy with low Vickers hardness, the metal characteristics are softer, the metal layer has better ductility, the contact area between the first metal layer and the second metal layer can be increased, the number of atoms bonded during the compounding of the first metal layer and the second metal layer is further increased, the compounding efficiency of the first metal layer and the second metal layer is improved, and the bonding fastness between the first metal layer and the second metal layer is ensured.
In a possible implementation manner of the first aspect, the molding material of the dielectric layer includes one or several of aluminum/aluminum alloy, copper/copper alloy or nickel/nickel alloy.
In a possible implementation manner of the first aspect, a through hole is provided on one of the first metal layer and the second metal layer, which is far from the display element, and the through hole extends from an end far from the display element toward an end near the display element.
Through seting up the through-hole on keeping away from display element's first metal level or second metal level, the setting of through-hole can be with first metal level or second metal level make the stress that receives scatter at the display module assembly is buckled, reduces the intensity of the stress that first metal level or second metal level received, and then promotes the bending property of backing film.
In addition, only set up the through-hole on keeping away from display element in first metal level and the second metal level, do not set up the through-hole on the other, can guarantee certain rigidity, when guaranteeing to support the membrane rigidity like this, promote the bending property of support the membrane. Meanwhile, a through hole is not formed in one part close to the display element, so that the influence of the through hole on the display effect of the display module can be avoided.
In one possible implementation manner of the first aspect, the first metal layer and the second metal layer form the support film by a metal composite method.
Compared with the bonding mode, the bonding layer does not exist at the connecting interface of the first metal layer and the second metal layer, separation caused by bending between the first metal layer and the bonding layer and between the second metal layer and the bonding layer in the bending process of the display element can be avoided, the bonding fastness between the first metal layer and the second metal layer is improved, the problem of bulge and the like caused by separation of the first metal layer and the second metal layer is avoided, and the display effect of the display module is improved.
In a possible implementation manner of the first aspect, the molding material of the first metal layer includes one or several of stainless steel, aluminum/aluminum alloy, titanium/copper alloy, copper/copper alloy or nickel/nickel alloy; the molding material of the second metal layer comprises one or more of stainless steel, aluminum/aluminum alloy, titanium/copper alloy, copper/copper alloy or nickel/nickel alloy.
In a possible implementation manner of the first aspect, the method may further include a plurality of third metal layers, where the third metal layers are located between the first metal layer and the second metal layer, and young's modulus of the third metal layers is located between young's modulus of the first metal layer and young's modulus of the second metal layer.
The rigidity of the support film can be further improved through the arrangement of the third metal layer, meanwhile, the resistance performance of the support film to stress when the display module is bent can be improved, and the bending performance of the support film is improved.
In a second aspect, the present application provides a display module, at least including a display element and any one of the support films described above;
the first metal layer and the second metal layer of the support film are located under the display element.
By including the support film, the support film includes a first metal layer and a second metal layer, such that the first metal layer and the second metal layer are configured to be disposed below the display module assembly to provide support for the display element. The Young modulus of the first metal layer is higher than that of the second metal layer, and the high rigidity performance of the first metal layer and the high bending performance of the second metal layer are utilized, so that the support film has good bending performance while providing good rigid support, thereby ensuring that the display module has good bending performance and reliability, and meeting the requirements of the rigidity and bending performance of the display module.
In a possible implementation manner of the second aspect, the first metal layer is located on a side of the second metal layer near a bending center of the display element.
Therefore, when the display module is bent, the first metal layer with high Young modulus is stressed by compression, the second metal layer with low Young modulus is stressed by tension, and the second metal layer with low Young modulus has better bending property, so that the resistance of the support film to the stress when the display module is bent can be improved, the rigidity of the support film is ensured, the bending property of the support film is further improved, and the support film is prevented from being damaged under the action of pressure generated in the bending process of the display module.
In a possible implementation manner of the second aspect, the display element is bent inwards, and the first metal layer is located between the second metal layer and the display element.
Thus, the display element can be bent inwards, the display element is positioned on one side of the electronic device, which has the minimum bending track, the first metal layer is arranged close to the display element, and the second metal layer is positioned on one side of the first metal layer, which is far away from the display element. When the display module is bent, the first metal layer is subjected to compressive stress, the second metal layer is subjected to tensile stress, and the first metal layer has high Young modulus and can provide enough support for the display element, and the second metal layer has low Young modulus and can improve the resistance of the support film to tensile stress when the display module is bent, so that the rigidity of the support film is ensured, and meanwhile, the bending performance of the support film is further improved.
In a possible implementation manner of the second aspect, the display element is bent outwards, and the second metal layer is located between the first metal layer and the display element.
Thus, the display element can be bent outwards, the display element is positioned on one side of the electronic device, which is the largest in bending track, the second metal layer is arranged close to the display element, and the first metal layer is positioned on one side of the second metal layer, which is far away from the display element. When the display module is bent, the first metal layer is stressed by compression, the second metal layer is stressed by tension, and the first metal layer has high Young modulus and can provide enough support for the display element, and the second metal layer has low Young modulus and can improve the resistance of the support film to tensile stress when the display module is bent, so that the rigidity of the support film is ensured, and meanwhile, the bending performance of the support film is further improved.
In a third aspect, the present application provides an electronic device, at least including any one of the support films described above, or at least including any one of the display modules described above.
By including a support film comprising a first metal layer and a second metal layer, the first metal layer and the second metal layer are configured to be disposed below the display module assembly display element to provide support for the display element. The Young modulus of the first metal layer is higher than that of the second metal layer, and the high rigidity performance of the first metal layer and the high bending performance of the second metal layer are utilized, so that the support film has good bending performance while providing good rigid support, the display module is guaranteed to have good bending performance and reliability, the rigidity and bending performance requirements of the display module are met, and the reliability and display effect of the electronic equipment are improved.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present application;
fig. 2 is a schematic diagram illustrating bending of a display module according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of another display module provided in an embodiment of the present application;
fig. 4 is a schematic diagram illustrating bending of another display module according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of a support film according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of another display module according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of another display module according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of another display module according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of another display module according to an embodiment of the present application.
Reference numerals illustrate:
100-a display module; 10-a support film; 11-a first metal layer;
12-a second metal layer; 13-a dielectric layer; 101-a through hole;
20-a display element; 30-a backing film layer; 40-a thin film encapsulation layer;
50-a touch layer; 60-polaroid; 70-cover plate.
The terminology used in the description section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.
With the advent of a flexible screen foldable terminal, the limit that the display ratio of the original hard screen is not more than 100% is broken through, and the information interaction effect can be improved by times through one-time simple folding, so that the flexible screen foldable terminal becomes one of products which are deeply cradled by people.
In the flexible folding screen, a metal material layer is arranged below the display element and is positioned below the whole display module, and the metal material layer mainly plays a role in providing rigid support so as to improve the flatness and shock resistance of the folding screen and avoid the phenomena of bulge, crease and the like of the folding screen in the folding process. To ensure that the metal material layer has better rigidity, it is necessary to increase the thickness of the metal material layer or increase the young's modulus of the metal material.
The thicker the metal material layer is, the harder it is to bend, and the metal material layer will receive tensile stress or compressive stress during bending, the higher the Young's modulus of the metal material is, the stress may cause the metal material layer to be damaged, and the bending characteristics of the material are poor. That is, the thicker the metal material layer or the higher the Young's modulus of the metal material, the more difficult the metal material layer is to bend, making the bending performance of the screen worse. To ensure the bending performance of the metal material layer, the prior art also disclosesThe bending property of the screen is ensured by thinning the metal material layer as much as possible, and the rigidity of the metal material layer is poor due to the contradiction between the rigidity and the bending property, so that the rigidity requirement of the screen can not be met, and the reliability of the screen is affected. As an example, the existing supporting film has a metal layer of 30 μm stainless steel, can meet the bending property of display screen, has a bending radius of no more than 3nm, but has a rigidity strength of 8-66N/mm 2 The rigidity requirement of the screen cannot be satisfied.
In order to solve the technical problem, the embodiment of the application provides a support film, a display module and an electronic device. The Young modulus of the first metal layer is higher than that of the second metal layer, and the high rigidity performance of the first metal layer and the high bending performance of the second metal layer are utilized, so that the support film has good bending performance while providing good rigid support, thereby ensuring that the display module has good bending performance and reliability, and meeting the requirements of the rigidity and bending performance of the display module.
The following describes in detail a support film, a display module and an electronic device provided in the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present application.
Referring to fig. 1, the embodiment of the present application provides a support film 10 for a foldable display module 100, that is, the support film 10 can be folded along with the folding of the display module 100. Specifically, the support film 10 at least includes a first metal layer 11 and a second metal layer 12, where the first metal layer 11 and the second metal layer 12 are disposed below the display element 20 of the display module 100, the display element 20 may be a display screen, and the first metal layer 11 and the second metal layer 12 may play a supporting role on the display element 20.
The young's modulus of the first metal layer 11 is higher than that of the second metal layer 12, that is, the molding material of the first metal layer 11 is a metal having a high young's modulus, the molding material of the second metal layer 12 is a metal having a low young's modulus, which is a physical quantity describing deformation resistance of the solid material, that is, the first metal layer 11 having a high young's modulus, which has a high rigidity, can ensure to provide a sufficient rigid support to the display element 20 such as a display screen, improving surface flatness and impact resistance of the display screen. Whereas the second metal layer 12, having a low young's modulus, has a lower stiffness, is more resistant to stresses, i.e. has a higher yield strength, and has good bending properties.
In this way, the support film 10 includes the first metal layer 11 with high young's modulus and the second metal layer 12 with low young's modulus, and the high rigidity performance of the first metal layer 11 and the high bending performance of the second metal layer 12 are utilized, so that the support film 10 provides good rigidity support and has good bending performance, thereby ensuring that the display module 100 has good bending performance and reliability, and meeting the rigidity and bending performance requirements of the display module 100.
The connection between the first metal layer 11 and the second metal layer may be adhesive, composite or other connection, for example, in one possible implementation, the first metal layer 11 and the second metal layer 12 may form the support film 10 by a metal composite method.
Specifically, the metal composite method may be a thermal composite method, or may be a method in which a metal material of the first metal layer 11 and a metal material of the second metal layer 12 are bonded under the action of pressure or the like. Bonding of atoms and atoms is performed in vacuum, for example, by using atoms at the interface of the first metal layer 11 and atoms at the interface of the second metal layer 12, so that the first metal layer 11 and the second metal layer 12 are bonded together. The interface between the first metal layer 11 and the second metal layer 12 is formed by combining the metal of the first metal layer 11 and the metal of the second metal layer 12, and the roughness of the cross section can be greater than 5nm.
Compared with the bonding mode, the bonding layer does not exist at the connection interface of the first metal layer 11 and the second metal layer 12 in the mode of connecting the first metal layer 11 and the second metal layer 12 through the metal compounding method, separation caused by bending between the first metal layer 11 and the bonding layer and between the second metal layer 12 and the bonding layer in the bending process of the display module 100 can be avoided, the bonding fastness between the first metal layer 11 and the second metal layer 12 is improved, the problem of bulge and the like caused by separation of the first metal layer 11 and the second metal layer 12 is avoided, and the display effect of the display module 100 is improved.
Fig. 2 is a schematic diagram of bending a display module according to an embodiment of the present application, fig. 3 is a schematic diagram of a structure of another display module according to an embodiment of the present application, and fig. 4 is a schematic diagram of bending another display module according to an embodiment of the present application.
Referring to fig. 2 and fig. 4, in the embodiment of the present application, the first metal layer 11 is disposed on a side of the second metal layer 12 near the bending center of the display module 100. The bending center of the display module 100 refers to an arc-like bending track generated by the display module 100 during the bending process, and the bending center is the center of the arc-like bending track. The first metal layer 11 is disposed on one side of the second metal layer 12 near the center of the bending track of the display module 100, where the first metal layer 11 receives compressive stress when the display module 100 is bent, and correspondingly, the second metal layer 12 receives tensile stress when the display module 100 is bent.
In the embodiment of the present application, the first metal layer 11 is disposed on the side of the second metal layer 12 near the bending center of the display module 100, so that the first metal layer 11 with high young's modulus receives a compressive stress (e.g. F1 in fig. 2) when the display module 100 is bent, the second metal layer 12 with low young's modulus receives a tensile stress (e.g. F2 in fig. 2) when the display module 100 is bent, and the second metal layer 12 with low young's modulus has better bending property, so that the resistance performance of the support film 10 to the tensile stress when the display module 100 is bent can be improved, the rigidity of the support film 10 is ensured, the bending performance of the support film 10 is further improved, and the support film 10 is ensured not to be damaged under the stress effect generated in the bending process of the display module 100.
In a possible implementation, as shown in fig. 2, the display element 20 is folded in such a way that the display element 20 is located at a side of the electronic device where the bending radius is smaller, and the first metal layer 11 is arranged between the second metal layer 12 and the display element 20.
As shown in connection with fig. 1 and 2, the first metal layer 11 is disposed close to the display element 20, and the second metal layer 12 is located on a side of the first metal layer 11 away from the display element 20. Thus, when the display module 100 is bent, as shown in fig. 2, the first metal layer 11 is subjected to compressive stress F1, the second metal layer 12 is subjected to tensile stress F2, and the first metal layer 11 has a high young's modulus, so that sufficient support can be provided for the display element 20, and the second metal layer 12 has a low young's modulus, so that the resistance performance of the support film 10 to tensile stress when the display module 100 is bent can be improved, the rigidity of the support film 10 is ensured, and the bending performance of the support film 10 is further improved.
In another possible implementation, as shown in fig. 3, the display element 20 may be folded in such a way that the display element 20 is located on the side of the electronic device where the bending radius is larger, and the second metal layer 12 is disposed between the first metal layer 11 and the display element 20.
As shown in connection with fig. 1 and 3, the second metal layer 12 is disposed close to the display element 20, and the first metal layer 11 is located on a side of the second metal layer 12 away from the display element 20. Thus, when the display module 100 is bent, as shown in fig. 4, the first metal layer 11 is subjected to compressive stress, the second metal layer 12 is subjected to tensile stress, the first metal layer 11 with high young's modulus can provide enough support for the display element 20, and the second metal layer 12 with low young's modulus can improve the resistance performance of the support film 10 to tensile stress when the display module 100 is bent, and further improve the bending performance of the support film 10 while ensuring the rigidity of the support film 10.
Fig. 5 is a schematic structural view of a support film according to an embodiment of the present application.
Referring to fig. 5, in this embodiment of the present application, the support film 10 further includes a dielectric layer 13, where the dielectric layer 13 is located between the first metal layer 11 and the second metal layer 12, and the dielectric layer 13 may be used as a transition layer between the first metal layer 11 and the second metal layer 12, and may function to connect the first metal layer 11 and the second metal layer 12, so as to improve the bonding fastness of the first metal layer 11 and the second metal layer 12.
The forming material of the dielectric layer 13 may be a metal or alloy with a vickers hardness value ranging from 20 HV to 400HV, that is, the dielectric layer has a lower vickers hardness value, and a metal or alloy with a lower vickers hardness value has softer metal characteristics and better ductility, so that the contact area between the first metal layer 11 and the second metal layer 12 can be increased, the number of atoms bonded during the compounding of the first metal layer 11 and the second metal layer 12 can be increased, the compounding efficiency of the first metal layer 11 and the second metal layer 12 can be improved, and the bonding firmness between the first metal layer 11 and the second metal layer 12 can be ensured.
The molding material of the dielectric layer 13 may be one or more of aluminum/aluminum alloy, copper/copper alloy or nickel/nickel alloy, and it is understood that the molding material of the dielectric layer 13 may also be other metals or alloys with low vickers hardness values.
Fig. 6 is a schematic structural diagram of another display module provided in an embodiment of the present application, fig. 7 is a schematic structural diagram of another display module provided in an embodiment of the present application, and fig. 8 is a schematic structural diagram of another display module provided in an embodiment of the present application.
In the embodiment of the present application, as shown in fig. 6, a through hole 101 is provided in one of the first metal layer 11 and the second metal layer 12 away from the display element 20, and the through hole 101 extends from one end away from the display element 20 toward one end close to the display element 20. The through hole 101 is formed in the first metal layer 11 or the second metal layer 12 far away from the display element 20, and the through hole 101 can bend the first metal layer 11 or the second metal layer 12 at the display module 100 to disperse the received stress, so that the strength of the stress received by the first metal layer 11 or the second metal layer 12 is reduced, and the bending performance of the support film 10 is further improved.
In addition, only one of the first metal layer 11 and the second metal layer 12 far from the display element 20 is provided with the through hole 101, and the other is not provided with the through hole 101, so that certain rigidity can be ensured, and the bending performance of the support film 10 is improved while the rigidity of the support film 10 is ensured. Meanwhile, the through hole 101 is not formed on one of the display elements 20, so that the display effect of the display module 100 is prevented from being affected by the through hole 101.
Specifically, as shown in fig. 6, the through hole 101 is formed in the second metal layer 12 when the display element 20 is folded inwards, and as shown in fig. 7, the through hole 101 is formed in the first metal layer 11 when the display element 20 is folded outwards.
In addition, it is understood that, as shown in fig. 8, when the first metal layer 11 or the second metal layer 12 is perforated, in fig. 8, the first metal layer 11 is perforated as an example, and the dielectric layer 13 may be still disposed between the first metal layer 11 and the second metal layer 12, so as to improve the bonding fastness between the first metal layer 11 and the second metal layer 12.
The through hole 101 on the first metal layer 11 or the second metal layer 12 may be formed by etching, laser, or other methods, or the through hole 101 may be formed by other methods.
The support film 10 may further include a plurality of third metal layers, the young's modulus of the third metal layers being between the young's modulus of the first metal layer 11 and the young's modulus of the second metal layer 12, i.e. the first metal layer 11 has the highest young's modulus, the second metal layer 12 has the lowest young's modulus, and the young's modulus of the third metal layers being between the two. When the third metal layer is plural, the Young's modulus of each third metal layer may be the same or different.
The third metal layer can further improve the rigidity of the support film 10, and can also improve the stress resistance of the support film 10 when the display module 100 is bent, and improve the bending performance of the support film 10.
When the display module 100 includes a plurality of third metal layers, the metal layers may be sequentially arranged according to the young's modulus, and the young's modulus of the metal layers gradually decreases from a side near the bending center of the display module 100 to a side far from the bending center of the display module 100.
Specifically, taking a third metal layer as an example, the first metal layer 11 with a higher young's modulus is disposed on a side close to the bending center of the display module 100, the second metal layer 12 with a low young's modulus is disposed on a side far from the bending center of the display module 100, and the third metal layer is disposed between the first metal layer 11 and the second metal layer 12. In this way, when the display module 100 is bent, the second metal layer 12 with low young's modulus is subjected to tensile stress, so that the resistance performance of the support film 10 to tensile stress when the display module 100 is bent can be improved, the rigidity of the support film 10 is ensured, and meanwhile, the bending performance of the support film 10 is further improved.
According to the support film 10 provided by the embodiment of the application, the first metal layer 11 and the second metal layer 12 are arranged below the display element 20 and are jointly used as the support film layer of the display element 20, the Young modulus of the first metal layer 11 is higher than that of the second metal layer 12, and the good rigidity of the first metal layer 11 with high Young modulus and the good bending performance of the second metal layer 12 with low Young modulus are utilized, so that the support film 10 has good bending performance while providing good rigid support.
Table 1 comparison of performances of a support film and an existing stainless steel gold support film layer provided in the examples of this application
Specifically, table 1 shows the performance comparison of the support film 10 provided in the present application and the existing stainless steel metal layer as the support film 10 layer, and it can be seen from table 1 that the rigidity of the existing stainless steel support film 10 is very high, but when the support film is bent under the equal thickness and bending radius, the bending range of the stainless steel is exceeded, that is, the bending can cause the damage of the stainless steel support film 10. In contrast, in the support film 10 provided in the embodiment of the present application, the first metal layer 11 is made of stainless steel, the second metal layer 12 is made of titanium/copper alloy, and compared with the existing support film 10 under the conditions of the same total thickness and bending radius, the support film can ensure higher rigidity, and meanwhile, the support film cannot exceed the bending range, i.e. has better bending performance while providing good rigid support.
In the embodiment of the present application, the molding material of the first metal layer 11 may include one or more of stainless steel, aluminum/aluminum alloy, titanium/copper alloy, copper/copper alloy, or nickel/nickel alloy. The molding material of the second metal layer 12 may include one or more of stainless steel, aluminum/aluminum alloy, titanium/copper alloy, copper/copper alloy, and nickel/nickel alloy, so that the young's modulus of the first metal layer 11 is higher than that of the second metal layer 12. It is understood that the molding material of the first metal layer 11 may be other metals or alloys having a high young's modulus, and the molding material of the second metal layer 12 may be other metals or alloys having a low young's modulus.
Fig. 9 is a schematic structural diagram of another display module according to an embodiment of the present application.
The embodiment of the application further provides a display module 100, which at least includes the display element 20 and any one of the support films 10. Referring to fig. 9, the support film 10 is positioned under the display element 20, and specifically, the first metal layer 11 and the second metal layer 12 of the support film 10 are positioned under the display element 20.
The display module 100 may further include a back film layer 30, a film packaging layer 40, a touch layer 50, a polarizer 60, and a cover plate 70. The back film layer 30 may be located between the support film 10 and the display element 20, the thin film encapsulation layer 40 is located on a side of the display element 20 away from the support film 10, the touch layer 50 is located on the thin film encapsulation layer 40, the polarizer 60 is located on the touch layer 50, and the cover plate 70 is disposed on the polarizer 60. I.e. the support film 10 is located at the bottom layer of the display module 100, and mainly plays a role of rigid support.
The support film 10 includes a first metal layer 11 and a second metal layer 12, where the first metal layer 11 is located on a side of the second metal layer 12 near a bending center of the display element 20. Specifically, the display element 20 may be folded inwards, that is, the electronic device is folded inwards, the display element 20 is located at the minimum track side of the electronic device, and the first metal layer 11 is located between the second metal layer 12 and the display element 20. The display element 20 may also be bent outwards, i.e. the electronic device is in the shape of a fold, the display element 20 being located on the side of the maximum trajectory of the fold of the electronic device, when the display element 20 is bent outwards, the second metal layer 12 being located between the first metal layer 11 and the display element 20.
Thus, when the display module 100 is bent, the first metal layer 11 with high young's modulus is stressed by compression, the second metal layer 12 with low young's modulus is stressed by pulling, and the second metal layer 12 with low young's modulus has better bending property, so that the resistance performance of the support film 10 to stress when the display module 100 is bent can be improved, the rigidity of the support film 10 is ensured, the bending performance of the support film 10 is further improved, and the support film 10 is ensured not to be damaged under the action of pressure generated in the bending process of the display module 100.
The dielectric layer 13 may also be disposed between the first metal layer 11 and the second metal layer 12, and the dielectric layer may serve as a transition layer to improve the bonding fastness of the first metal layer 11 and the second metal layer 12, and improve the reliability of the display module 100.
A through hole 101 may be formed in one of the first metal layer 11 and the second metal layer 12 away from the display element 20, so as to further improve bending performance of the display module 100.
The supporting film 10 of the display module 100 may also include a third metal layer, where the third metal layer may be located between the first metal layer and the second metal layer, and the young's modulus of the third metal layer is located between the young's modulus of the first metal layer 11 and the young's modulus of the second metal layer 12, so as to further improve the rigidity and bending performance of the display module 100.
The embodiment of the application also provides an electronic device, which at least comprises the support film 10 of any one of the above.
Alternatively, the electronic device at least includes any one of the display modules 100 described above.
The electronic device may include, but is not limited to, a foldable fixed terminal or mobile terminal such as a mobile phone, tablet computer, notebook computer, ultra-mobile personal computer, UMPC, handheld computer, touch-sensitive television, intercom, netbook, POS, personal digital assistant (personal digital assistant, PDA), wearable device, virtual reality device, etc.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
Claims (15)
- A support film for a foldable display module, comprising at least a first metal layer and a second metal layer;the first metal layer and the second metal layer are arranged below the display element of the display module, and the Young modulus of the first metal layer is higher than that of the second metal layer.
- The support film of claim 1, wherein the first metal layer is disposed on a side of the second metal layer near a bending center of the display module.
- The support film of claim 2, wherein the first metal layer is configured to be disposed between the second metal layer and the display element when the display element is folded in.
- The support film of claim 2, wherein the second metal layer is configured to be disposed between the first metal layer and the display element when the display element is folded in an outward manner.
- The support film of any of claims 1-4, further comprising a dielectric layer between the first metal layer and the second metal layer;the forming material of the dielectric layer is metal or alloy with the Vickers hardness value of 20-400 HV.
- The support film of claim 5, wherein the dielectric layer is formed of a material comprising one or more of aluminum/aluminum alloy, copper/copper alloy, or nickel/nickel alloy.
- The support film according to any one of claims 1 to 6, wherein a through hole is provided in one of the first metal layer and the second metal layer away from the display element, the through hole extending from an end away from the display element toward an end close to the display element.
- The support film of any one of claims 1-7, wherein the first metal layer and the second metal layer form the support film by a metal compounding process.
- The support film according to any one of claims 1 to 8, wherein the molding material of the first metal layer comprises one or more of stainless steel, aluminum/aluminum alloy, titanium/copper alloy, copper/copper alloy, or nickel/nickel alloy; the molding material of the second metal layer comprises one or more of stainless steel, aluminum/aluminum alloy, titanium/copper alloy, copper/copper alloy or nickel/nickel alloy.
- The support film of any of claims 2-9, further comprising a plurality of third metal layers, the third metal layers being located between the first metal layers and the second metal layers, the young's modulus of the third metal layers being located between the young's modulus of the first metal layers and the young's modulus of the second metal layers.
- A display module comprising at least a display element and a support film according to any one of claims 1 to 10;the first metal layer and the second metal layer of the support film are located under the display element.
- The display module of claim 11, wherein the first metal layer is located on a side of the second metal layer near a bending center of the display element.
- The display module of claim 12, wherein the display element is folded inward and the first metal layer is located between the second metal layer and the display element.
- The display module of claim 12, wherein the display element is bent outward and the second metal layer is located between the first metal layer and the display element.
- An electronic device comprising at least a support film according to any one of claims 1-10, or at least a display module according to any one of claims 11-14.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/134663 WO2022120598A1 (en) | 2020-12-08 | 2020-12-08 | Support film, display module, and electronic device |
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| Publication Number | Publication Date |
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| CN116569243A true CN116569243A (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202080107713.1A Pending CN116569243A (en) | 2020-12-08 | 2020-12-08 | Support film, display module and electronic equipment |
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| CN (1) | CN116569243A (en) |
| WO (1) | WO2022120598A1 (en) |
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| CN107146527B (en) * | 2017-04-27 | 2020-01-03 | 上海天马微电子有限公司 | Flexible display screen and flexible display device |
| CN109546009A (en) * | 2017-09-22 | 2019-03-29 | 昆山国显光电有限公司 | A kind of production method and its display panel of display panel |
| CN107578707B (en) * | 2017-10-20 | 2019-09-27 | 上海天马微电子有限公司 | Flexible display panels and display device |
| CN110853520B (en) * | 2019-11-28 | 2022-01-21 | 京东方科技集团股份有限公司 | Foldable support and display device |
| CN111081150B (en) * | 2019-12-31 | 2021-08-24 | 厦门天马微电子有限公司 | Support membrane and display device |
| CN111292621B (en) * | 2020-02-24 | 2021-12-24 | 京东方科技集团股份有限公司 | Display device, support film for display device, and electronic apparatus |
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- 2020-12-08 WO PCT/CN2020/134663 patent/WO2022120598A1/en active Application Filing
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