CN218679774U - Electromagnetic shielding cover, circuit board and electronic terminal equipment - Google Patents
Electromagnetic shielding cover, circuit board and electronic terminal equipment Download PDFInfo
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- CN218679774U CN218679774U CN202221642361.2U CN202221642361U CN218679774U CN 218679774 U CN218679774 U CN 218679774U CN 202221642361 U CN202221642361 U CN 202221642361U CN 218679774 U CN218679774 U CN 218679774U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model discloses an electromagnetic shielding cover, a circuit board and electronic terminal equipment, wherein the electromagnetic shielding cover comprises a black film layer, a metal layer and a glue film layer; the black film layer is arranged on one surface of the metal layer, and the adhesive film layer is arranged on the other surface of the metal layer; the tensile stress of the black film layer is 0.5-3kgf/mm 2 And the elastic modulus of the black film layer is 0-1000MPa. The embodiment of the utility model provides an electromagnetic shield cover, circuit board and electronic terminal equipment designs through tensile stress and elasticity modulus to in the black rete, solvesThe technical problem that the metal layer is easy to deform/break when the electromagnetic shielding cover is attached to the surface of the electronic component is solved, the elongation of the metal layer is effectively improved, and the shielding performance of the electromagnetic shielding cover is guaranteed.
Description
Technical Field
The utility model belongs to the technical field of the electronic technology and specifically relates to an electromagnetic shield cover, circuit board and electronic terminal equipment are related to.
Background
Electronic components in the electronic equipment can continuously emit useless electromagnetic wave signals under the working state, and the useless electromagnetic wave signals can influence the normal work of other adjacent electronic components to generate electromagnetic interference. At present, an electromagnetic shielding cover including a metal shielding layer is usually used to cover the electronic device therein, so as to suppress the outward leakage of unwanted electromagnetic waves and to shield the external electromagnetic wave noise from interfering with the operation of the internal circuit. In recent years, electronic devices have been increasingly miniaturized and thinned, and for example, microelectronic devices that are small in size, highly integrated, and have a high-density flexible printed circuit board built therein are often used as electronic components in smart mobile devices represented by mobile phones, which has made higher demands for processing and manufacturing of electronic devices.
The tight fit of the shielding case on the electronic component can greatly reduce the volume of the shielding case, however, the shielding case is required to have more excellent electrical and magnetic properties, and certain mechanical stress can be borne in the electromagnetic shielding case, so that the deformation and fracture phenomena generated when the electromagnetic shielding case is fitted on the electronic component are prevented.
At present, the problems of deformation and fracture of the electromagnetic shielding cover on the microelectronic device in the attaching process are less researched. How to guarantee the stability of electromagnetic shield cover in the laminating in-process, improve the percentage elongation of metal level, prevent the metal level fracture, guarantee subsequent shielding performance is the problem that the pendulum need solve in the face of this trade technical staff urgently.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electromagnetic shield cover, circuit board and electronic terminal equipment designs through tensile stress and elastic modulus to in the black rete, has solved and has laminated electromagnetic shield cover in electronic components when on the surface, leads to the cracked problem of metal level deformation easily, has effectively improved the percentage elongation of metal level, ensures electromagnetic shield cover's shielding performance.
In order to solve the above technical problem, an embodiment of the present invention provides an electromagnetic shielding cover, including a black film layer, a metal layer, and a glue film layer;
the black film layer is arranged on one surface of the metal layer, and the adhesive film layer is arranged on the other surface of the metal layer;
the tensile stress of the black film layer is 0.5-3kgf/mm 2 And the elastic modulus of the black film layer is 0-1000MPa.
Preferably, the tensile stress of the black film layer is 1.152-1.731kgf/mm2, and the elastic modulus of the black film layer is 308-679MPa.
Preferably, the thickness of the black film layer is 7-20 microns.
In one preferable embodiment, the black film layer contains conductive particles.
As one of the preferable schemes, the size of the conductive particles is 0.1-8 microns.
As one preferable scheme, the content of the conductive particles is 10% -50% of the black film layer.
As one preferable scheme, the metal material of the metal layer is one of copper, aluminum, nickel, titanium, chromium and silver; or the metal material is an alloy formed by at least two of copper, aluminum, nickel, titanium, chromium and silver.
Preferably, the metal layer has a thickness of 0.1 to 5 μm.
As one preferable scheme, the thickness of the adhesive film layer is 2-20 microns.
Another embodiment of the present invention provides a circuit board, which includes a circuit board body and the above-mentioned electromagnetic shielding case; the electromagnetic shielding cover is pressed with the circuit board body, and one surface of the adhesive film layer, which is far away from the metal layer, is electrically connected with the ground layer of the circuit board body.
Another embodiment of the present invention provides an electronic terminal device, including the circuit board as described above.
Compared with the prior art, the beneficial effects of the utility model embodiment lie in following in at least a bit:
(1) The electromagnetic shielding cover is tightly attached to the surface of the electronic component, so that the volume of the electronic equipment with the shielding cover is greatly reduced, and the development process of miniaturization and lightness of the electronic equipment is further promoted;
(2) The structure of the electromagnetic shielding cover is improved, the electromagnetic shielding cover comprises a black film layer, a metal layer and an adhesive film layer, the black film layer is arranged on the metal layer, and the tensile stress of the black film layer is 0.5-3kgf/mm 2 The elastic modulus of the black film layer is 0-1000MPa, so that the black film layer can effectively drive the metal layer to extend, and the elongation of the metal layer can reach 30% -90%, so that the phenomenon that the metal layer is broken at the step is effectively prevented, and the electromagnetic shielding performance of the metal shielding case is guaranteed;
(3) The black film layer, the metal layer and the adhesive film layer are matched with each other, wherein the black film layer can drive the extension of the lower metal layer under the limitation of specific tensile stress and elastic modulus, the physical strength of the electromagnetic shielding cover is ensured, and the tensile strength of the electromagnetic shielding cover can reach 2-5kgf/mm 2 。
Drawings
Fig. 1 is a schematic structural diagram of an electromagnetic shielding case according to an embodiment of the present invention;
fig. 2 is a schematic structural view of an electromagnetic shield according to embodiment 2 of the present invention;
reference numerals:
wherein, 1, a black film layer; 11. conductive particles; 2. a metal layer; 3. and (6) a film layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present application, the terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first," "second," "third," etc. may explicitly or implicitly include one or more of the features. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. As used herein, the terms "vertical," "horizontal," "left," "right," "up," "down," and the like are for illustrative purposes only and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description of the present application, it is to be noted that, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the present invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the present invention, and the specific meanings of the terms in the present application will be understood to those skilled in the art in a specific context.
An embodiment of the utility model provides an electromagnetic shield cover, specificReferring to fig. 1, fig. 1 is a schematic structural diagram of an electromagnetic shielding case according to an embodiment of the present invention, in which the electromagnetic shielding case includes a three-layer structure of a black film layer 1, a metal layer 2 and a glue film layer 3, the black film layer 1 is located at the topmost layer, and the tensile stress of the black film layer 1 is 0.5-3kgf/mm 2 The elastic modulus is 0-1000MPa; the metal layer 2 is positioned in the middle layer and is tightly matched with the black film layer 1, the metal layer 2 in the embodiment can be extended under the driving of the black film layer 1, and the elongation rate can reach 30% -90%, so that the phenomenon that the metal layer 2 is broken at a step is effectively prevented, and the electromagnetic shielding performance of the metal shielding case is guaranteed; the adhesive film layer 3 is located at the bottom side, and in the actual use process, the adhesive film layer 3 is tightly attached to the outer surface of the electronic component, and the actual external dimension of the adhesive film layer needs to be matched with the outer surface of the electronic component, which is not described in detail herein.
In the embodiment of the present invention, the inventors have found through a large number of tests and analyses that when the tensile stress of the black film layer 1 is 1.152-1.731kgf/mm 2 When the elastic modulus of the black film layer 1 is 308-679MPa, the elongation effect can be further improved, so that the electromagnetic shielding performance of the metal shielding case is better guaranteed. Of course, specific values of the tensile stress and the elastic modulus of the black film layer 1 need to be selected according to actual product design, and are not described herein again.
Two examples are listed below to discuss in detail the different embodiments of the present invention and to test these specific examples.
Example 1:
referring to fig. 1, in the electromagnetic shielding case of fig. 1, the tensile stress of the black film layer 1 is 1.152kgf/mm 2 The elastic modulus is 308MPa, and the thickness of the black film layer 1 is 7 microns; the metal layer 2 in the middle layer is soft board copper, and the thickness of the metal layer is 0.2 micrometer; the adhesive film layer 3 on the bottom layer is made of conductive adhesive, and the thickness of the adhesive film layer is 5 micrometers.
By detecting the performance of the metal layer of the electromagnetic shielding cover, the tensile rate of the metal layer reaches 30 percent under the drive of the black film layer, and the tensile strength of the whole electromagnetic shielding cover is 2kgf/mm 2 Thereby effectively preventing the metal layer from being broken at the step and ensuring the metal shieldingThe electromagnetic shielding performance of the shield ensures the physical strength of the electromagnetic shielding shield.
Example 2:
referring to fig. 2, fig. 2 is a schematic structural diagram of an electromagnetic shielding case according to embodiment 2 of the present invention, different from embodiment 1, the tensile stress of the black film layer 1 in this embodiment is 1.731kgf/mm 2 The elastic modulus is 679MPa, and the thickness of the black film layer 1 is 20 microns; the metal layer 2 positioned in the middle layer is made of aluminum, and the thickness of the metal layer is 5 micrometers; the glue film layer 3 at the bottom layer is pure conductive glue, and the thickness of the glue film layer is 20 micrometers.
In addition, in this embodiment, the black film layer 1 includes the conductive particles 11, and the black film layer 1 including the conductive particles 11 can further optimize the electromagnetic shielding effect (it should be noted that the black film layer without including the conductive particles can also achieve the technical effects of the present invention, for example, in embodiment 1, the conductive particles in embodiment 2 are only used as a preferred embodiment, and in practical application, the black film layer including the conductive particles or the black film layer without including the conductive particles can be selected according to product requirements and cost factors, and are not described herein.
By detecting the performance of the metal layer of the electromagnetic shielding cover, the tensile rate of the metal layer reaches 90% under the drive of the black film layer, and the tensile strength of the whole electromagnetic shielding cover is 5kgf/mm 2 Therefore, the phenomenon that the metal layer is broken at the step is effectively prevented, the electromagnetic shielding performance of the metal shielding cover is guaranteed, and the physical strength of the electromagnetic shielding cover is guaranteed.
In this embodiment, in order to improve the flexibility of the electromagnetic shielding case, the material of the black film layer 1 may be resin. For example, bisphenol A type epoxy resin, acrylic resin, polyester resin and the like are available. In addition, the resin used may be any one or a mixture of at least two selected from the group consisting of epoxy resin, cyanate resin, polyphenylene ether resin, polybutadiene resin, styrene-butadiene resin, bismaleimide-triazine resin (BT), bismaleimide resin, polytetrafluoroethylene resin, polyimide resin, phenol resin, acrylic resin, liquid crystal resin, benzoxazine resin, phenoxy resin, nitrile rubber, carboxyl-terminated nitrile rubber, and hydroxyl-terminated nitrile rubber, but not limited thereto, and all of the resin materials disclosed in the prior art may be used. Such as a mixture of an epoxy resin and a cyanate resin, a mixture of a polyphenylene ether resin and a polybutadiene resin, a mixture of a styrene-butadiene resin and a BT resin, a mixture of a polytetrafluoroethylene resin and a polyimide resin, a mixture of a phenol resin and an acrylic resin, a mixture of an epoxy resin, a cyanate resin and a polyphenylene ether resin, a polybutadiene resin, a mixture of a styrene-butadiene resin and a BT resin, and a mixture of a polytetrafluoroethylene resin, a polyimide resin, a phenol resin and an acrylic resin. That is, a mixture of two or more resins may be used.
It can be understood that, with embodiment 2, the black film layer 1 functions as an electromagnetic shield by the conductive particles 11 contained therein, and specifically, the conductive particles 11 are electrically connected to the ground layer of the electronic device, so that the interference charges can be effectively introduced into the ground layer of the electronic device. The conductive particles 11 may be one or more of graphene particles, metal particles, carbon nanotube particles, and ferrite particles. Wherein the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. The non-conductive material may be any one of silicon dioxide, titanium dioxide, aluminum oxide, titanic acid, or a mixture of at least two thereof. Of course, the conductive particles are not limited to the above materials.
In an alternative embodiment, in order to ensure the electromagnetic shielding effectiveness, the size of the conductive particles 11 is 0.1 to 8 micrometers, for example, 0.1 micrometer, 2 micrometers, 5.5 micrometers, 6.75 micrometers, 8 micrometers, etc. Of course, the specific size of the conductive particles 11 may be set according to actual use requirements, and will not be described herein.
In an alternative embodiment, in order to ensure the electromagnetic shielding effectiveness, the content of the conductive particles 11 is 10% to 50% of the black film layer 1, for example, 10%, 20%, 30%, 40%, 50%, and the like. Of course, the specific content of the conductive particles 11 may be set according to the actual use requirement, and will not be further described herein.
The thickness of the black film layer 1 affects the number of conductive particles 11 that can be filled and the overall thickness of the electromagnetic shield. In an alternative embodiment, in order to ensure the electromagnetic shielding effectiveness and prevent the electromagnetic shielding cover from being too thick as a whole, the thickness of the black film layer 1 in this embodiment is 7-20 micrometers, for example, 7 micrometers, 10.25 micrometers, 13.5 micrometers, 16.75 micrometers, 20 micrometers, and the like. Of course, the thickness of the black film layer 1 may be set according to the actual use requirement, and further details are not described herein.
In the embodiment of the present invention, the metal material of the metal layer 2 is one of copper, aluminum, nickel, titanium, chromium, and silver; or the metal material is an alloy formed by at least two of copper, aluminum, nickel, titanium, chromium and silver. Of course, the metal material of the metal layer 2 may be set according to actual use requirements, and further details are not described here.
The thickness of the metal layer 2 affects the electromagnetic shielding performance and the overall thickness of the electromagnetic shield. In an alternative embodiment, in order to ensure the electromagnetic shielding effectiveness and prevent the electromagnetic shielding cover from being too thick as a whole, the thickness of the metal layer 2 in this embodiment is 0.1-5 micrometers, and may be, for example, 0.1 micrometer, 1 micrometer, 3 micrometers, 3.5 micrometers, 5 micrometers, and the like. Of course, the thickness of the metal layer 2 may be set according to actual use requirements, and further details are not described herein.
Similarly, the thickness of the adhesive film layer 3 affects the electromagnetic shielding performance and the overall thickness of the electromagnetic shielding case. In an alternative embodiment, in order to ensure the electromagnetic shielding effectiveness and prevent the electromagnetic shielding cover from being too thick as a whole, the thickness of the adhesive film layer 3 in this embodiment is 2-20 micrometers, and may be, for example, 2 micrometers, 10 micrometers, 12 micrometers, 15 micrometers, 20 micrometers, and the like. Of course, the thickness of the adhesive film layer 3 may be set according to actual use requirements, and further description is not given here.
Another embodiment of the present invention provides a circuit board, which includes a circuit board body and the above-mentioned electromagnetic shielding case; the electromagnetic shielding cover is pressed with the circuit board body, and one surface of the adhesive film layer, which is far away from the metal layer, is electrically connected with the ground layer of the circuit board body.
Another embodiment of the present invention provides an electronic terminal device, including the circuit board as described above.
The embodiment of the utility model provides an electromagnetic shield cover, circuit board and electronic terminal equipment, beneficial effect lies in following at least a bit in:
(1) The electromagnetic shielding cover is tightly attached to the surface of the electronic component, so that the volume of the electronic equipment with the shielding cover is greatly reduced, and the development process of miniaturization and lightness of the electronic equipment is further promoted;
(2) The structure of the electromagnetic shielding cover is improved, the electromagnetic shielding cover comprises a black film layer, a metal layer and an adhesive film layer, the black film layer is arranged on the metal layer, and the tensile stress of the black film layer is 0.5-3kgf/mm 2 The elastic modulus of the black film layer is 0-1000MPa, so that the black film layer can effectively drive the metal layer to extend, and the elongation of the metal layer can reach 30% -90%, so that the phenomenon that the metal layer is broken at the step is effectively prevented, and the electromagnetic shielding performance of the metal shielding case is guaranteed;
(3) The black film layer, the metal layer and the adhesive film layer are matched with each other, wherein the black film layer is not subjected to specific tensile stress and elastic modulusOnly the extension of the lower metal layer can be driven, and the physical strength of the electromagnetic shielding cover is ensured, and the tensile strength can reach 2-5kgf/mm 2 。
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An electromagnetic shielding case is characterized by comprising a black film layer, a metal layer and an adhesive film layer;
the black film layer is arranged on one surface of the metal layer, and the adhesive film layer is arranged on the other surface of the metal layer;
the tensile stress of the black film layer is 0.5-3kgf/mm 2 And the elastic modulus of the black film layer is 0-1000MPa.
2. The electromagnetic shield of claim 1, wherein the tensile stress of the black film layer is 1.152-1.731kgf/mm 2 The elastic modulus of the black film layer is 308-679MPa.
3. The electromagnetic shield of claim 1, wherein the thickness of the black film layer is 7-20 microns.
4. The electromagnetic shield of claim 1, wherein the black film layer comprises conductive particles.
5. The electromagnetic shield of claim 4, wherein the conductive particles have a size of 0.1-8 microns.
6. The electromagnetic shield of claim 1, wherein the metallic material of the metallic layer is one of copper, aluminum, nickel, titanium, chromium, and silver.
7. The electromagnetic shield of claim 1, wherein the metal layer has a thickness of 0.1 to 5 microns.
8. The electromagnetic shield of claim 1, wherein the adhesive film layer has a thickness of 2-20 microns.
9. A circuit board comprising a circuit board body and an electromagnetic shield according to any one of claims 1 to 8; the electromagnetic shielding cover is pressed with the circuit board body, and one surface of the adhesive film layer, which is far away from the metal layer, is electrically connected with the ground layer of the circuit board body.
10. An electronic terminal device, characterized by comprising the wiring board of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221642361.2U CN218679774U (en) | 2022-06-28 | 2022-06-28 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221642361.2U CN218679774U (en) | 2022-06-28 | 2022-06-28 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
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| CN218679774U true CN218679774U (en) | 2023-03-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669410A (en) * | 2023-07-03 | 2023-08-29 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| CN116828833A (en) * | 2023-07-21 | 2023-09-29 | 广州方邦电子股份有限公司 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
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2022
- 2022-06-28 CN CN202221642361.2U patent/CN218679774U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669410A (en) * | 2023-07-03 | 2023-08-29 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| CN116669410B (en) * | 2023-07-03 | 2024-02-20 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| CN116828833A (en) * | 2023-07-21 | 2023-09-29 | 广州方邦电子股份有限公司 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
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