CN116564865A - Automatic rocking disc material taking and discharging mechanism for processing semiconductor chips - Google Patents
Automatic rocking disc material taking and discharging mechanism for processing semiconductor chips Download PDFInfo
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- CN116564865A CN116564865A CN202310766757.0A CN202310766757A CN116564865A CN 116564865 A CN116564865 A CN 116564865A CN 202310766757 A CN202310766757 A CN 202310766757A CN 116564865 A CN116564865 A CN 116564865A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 230000007246 mechanism Effects 0.000 title claims abstract description 43
- 238000007599 discharging Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 title claims description 15
- 230000017525 heat dissipation Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention belongs to the field of semiconductor chip processing, in particular to an automatic rocking disc taking and discharging mechanism for semiconductor chip processing, aiming at the problems that the existing semiconductor equipment chips are all arranged on blue films, and corresponding mechanisms are needed to be added if the speed is to be increased, the occupied space is large, the cost is high and the miniaturization of the equipment cannot be realized.
Description
Technical Field
The invention relates to the technical field of semiconductor chip processing, in particular to an automatic rocking disc material taking and discharging mechanism for semiconductor chip processing.
Background
And (3) a semiconductor chip: etching and wiring are performed on a semiconductor sheet to produce a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some bad circuit boards do not have to decompose it) and germanium. Semiconductors also resemble motor vehicles with a trend. In the seventies of the twentieth century, U.S. enterprises, intel, and the like, have been winded on the dynamic random access memory (D-RAM) market. However, because of the advent of large computers, the twentieth eighties of high performance D-RAM was required, and the fabrication of chips, the japanese company's forefront, was divided into 4 stages, raw material fabrication, single crystal growth and wafer fabrication, integrated circuit wafer production, and integrated circuit packaging.
In the prior art, the semiconductor device chip is arranged on the blue film, and if the speed is to be increased, a corresponding mechanism is needed, so that the mode occupies a larger space, the cost is higher, the miniaturization of the device cannot be realized, and therefore, the automatic rocking disc taking and discharging mechanism for processing the semiconductor chip is provided for solving the problems.
Disclosure of Invention
The invention aims to solve the defects that in the prior art, semiconductor equipment chips are all arranged on a blue film, and corresponding mechanisms are needed to be added if the speed is to be increased, the occupied space is large, the cost is high and the equipment miniaturization cannot be realized in the mode, and provides an automatic rocking disc material taking and discharging mechanism for processing the semiconductor chips.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides an automatic rocker of semiconductor chip processing usefulness gets feed mechanism, includes the platform subassembly, the platform subassembly is connected with the rocker subassembly, the platform subassembly includes lower axle moves the stator, be connected with lower axle guide rail on the lower axle moves the stator, be connected with magnetic grating strip and first magnetic grating chi on the lower axle moves the stator, be connected with first inductor piece on the lower axle moves the stator, be connected with lower axle slide on the lower axle moves the stator, be connected with X direction seat on the lower axle slide, be connected with the upper axle guide rail on the X direction seat, be connected with on the upper axle guide rail and move the stator, be connected with on the upper axle slide, be connected with the second inductor piece on the upper axle slide, the rocker subassembly includes the motor, the motor is connected with the shaft coupling, be connected with the motor cabinet on the motor cabinet, be connected with the backup pad on the backup pad, be connected with two fixed plates in the backup pad, be connected with four guiding axles in the backup pad.
Preferably, the second magnetic grating ruler is connected to the X-direction seat.
Preferably, the lower shaft sliding plate is connected with a first reading head mounting seat, and the lower shaft moving stator is connected with a first reading head.
Preferably, the lower shaft sliding plate is connected with a first sensor seat, and the first sensor seat is connected with a first sensor.
Preferably, the upper shaft guide rail is connected with a second reading head mounting seat, and the second reading head mounting seat is connected with a second reading head.
Preferably, the upper shaft sliding plate is connected with two support plates, and the two support plates are connected with the same support.
Preferably, the fixing plate is connected with a second sensor seat, the second sensor seat is connected with a second sensor, and the second sensor is connected with a third sensor sheet.
Preferably, the support plate is connected with a screw rod, the screw rod is connected with a motor, and the four guide shafts are connected with the same fixed bottom plate.
Preferably, the fixed bottom plate is connected with four linear bearings, the four linear bearings are connected with the same connecting plate, and the connecting plate is connected with a supporting plate.
Preferably, the support plate is connected with a rocking disc, the rocking disc is connected with four air cylinders, the support plate is connected with four stop blocks, and the rocking disc is connected with a fourth sensor.
In the invention, the automatic rocking disc material taking and discharging mechanism for processing the semiconductor chips has the beneficial effects that:
according to the scheme, the platform assembly moves upwards to provide power for moving in the X and Y axis directions, the rocking disc assembly moves up and down through the screw mechanism, and the platform assembly is matched with the rocking disc assembly, so that X, Y axial and up-and-down movement of the rocking disc is realized, and the purposes of optimizing the structure of the semiconductor mounting equipment, reducing the cost and improving the production efficiency are achieved.
The invention has the advantages of small occupied space and low cost in the use process, further realizing the miniaturization of equipment, along with simple structure and convenient use.
Drawings
Fig. 1 is a schematic diagram of a three-dimensional structure of an automatic tray-shaking material-taking and-placing mechanism for processing semiconductor chips;
fig. 2 is a schematic structural view of a platform assembly of an automatic tray picking and placing mechanism for processing semiconductor chips, which is provided by the invention;
fig. 3 is a schematic structural view of a tray assembly of an automatic tray picking and placing mechanism for processing semiconductor chips according to the present invention;
fig. 4 is a schematic structural view of a support of an automatic tray picking and placing mechanism for processing semiconductor chips, which is provided by the invention;
fig. 5 is a schematic diagram of a three-dimensional structure of an upper shaft slide plate of an automatic rocking disc material taking and placing mechanism for processing semiconductor chips.
Fig. 6 is a schematic structural diagram of an upper shaft guide rail of an automatic rocking disc pick-and-place mechanism for processing semiconductor chips.
Fig. 7 is a schematic diagram of a first sensor of an automatic tray picking and placing mechanism for processing semiconductor chips according to the present invention.
Fig. 8 is a schematic diagram of a structure of a lower shaft moving stator of an automatic rocking disc feeding mechanism for processing semiconductor chips.
Fig. 9 is a schematic diagram of a structure of a tray of an automatic tray picking and placing mechanism for processing semiconductor chips.
Fig. 10 is a schematic structural view of a pallet of an automatic tray picking and placing mechanism for processing semiconductor chips.
Fig. 11 is a schematic structural view of a connecting plate of an automatic tray picking and placing mechanism for processing semiconductor chips.
Fig. 12 is a schematic structural view of a fixing base plate of an automatic tray picking and placing mechanism for processing semiconductor chips.
Fig. 13 is a schematic structural view of a guide shaft of an automatic tray picking and placing mechanism for processing semiconductor chips.
Fig. 14 is a schematic diagram of a three-dimensional structure of a second sensor of an automatic tray picking and placing mechanism for processing semiconductor chips.
Fig. 15 is a schematic diagram of a three-dimensional structure of a motor of an automatic tray picking and placing mechanism for processing semiconductor chips.
In the figure: 1. a platform assembly; 2. a rocker plate assembly; 3. a lower shaft moving stator; 4. a lower shaft guide rail; 5. a first inductor; 6. a first sensor mount; 7. magnetic bars; 8. a first magnetic grid ruler; 9. a first sensor sheet; 10. a first reader; 11. a first read head mount; 12. an upper shaft moving stator; 13. an upper shaft guide rail; 14. a second magnetic grid ruler; 15. a second inductor piece; 16. a second readhead; 17. a second reading head mounting seat; 18. an upper shaft sliding plate; 19. a lower shaft sliding plate; 20. an X-direction seat; 21. a motor; 22. a coupling; 23. a second inductor; 24. a second sensor mount; 25. a motor base; 26. a support plate; 27. a third inductor tile; 28. a fixing plate; 29. a guide shaft; 30. a screw rod; 31. a linear bearing; 32. a connecting plate; 33. a supporting plate; 34. a cylinder; 35. a fourth inductor; 36. a stop block; 37. a rocking disc; 38. a fixed bottom plate; 39. a support plate; 40. and (5) a support.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Example 1
Referring to fig. 1-3, an automatic rocking disc material taking and placing mechanism for semiconductor chip processing comprises a platform assembly 1, wherein the platform assembly 1 provides power in the X and Y directions of a working box, the platform assembly 1 is connected with a rocking disc assembly 2, the rocking disc assembly 2 provides power in the up and down directions of the rocking disc, the platform assembly 1 comprises a lower shaft moving stator 3, the lower shaft moving stator 3 is connected with a lower shaft guide rail 4, the lower shaft moving stator 3 is connected with a magnetic grating strip 7 and a first magnetic grating ruler 8, the lower shaft moving stator 3 is connected with a first sensor sheet 9, the lower shaft moving stator 3 is connected with a lower shaft sliding plate 19, the lower shaft sliding plate 19 is connected with an X direction seat 20, the X direction seat 20 is connected with an upper shaft guide rail 13, the upper shaft guide rail 13 is connected with an upper shaft moving stator 12, the upper shaft sliding plate 18 is connected with a second sensor sheet 15, the lower shaft sliding plate 19 is driven by the lower shaft sliding plate 19 to move linearly in the Y direction, the upper shaft moving stator 12 is connected with a motor assembly X direction motor 21, the upper shaft guide seat 21 is connected with a support plate 26, the motor assembly is connected with a motor seat 25, and the motor seat 26 is connected with a support plate 25.
Referring to fig. 4-8, the second magnetic grating ruler 14 is connected to the x-direction seat 20, the first reading head mounting seat 11 is connected to the lower shaft sliding plate 19, the first reading head 10 is connected to the lower shaft moving stator 3, the first sensor seat 6 is connected to the lower shaft sliding plate 19, the first sensor seat 6 is connected to the first sensor 5, the second reading head mounting seat 17 is connected to the upper shaft guide rail 13, the second reading head 16 is connected to the second reading head mounting seat 17, the two support plates 39 are connected to the upper shaft sliding plate 18, and the same support 40 is connected to the two support plates 39.
Referring to fig. 9 to 15, a second sensor holder 24 is connected to a fixing plate 28, a second sensor 23 is connected to the second sensor holder 24, a third sensor piece 27 is connected to the second sensor 23, a lead screw 30 is connected to a support plate 26, the lead screw 30 is connected to a motor 21, the motor 21 drives the lead screw 30 to move up and down, the same fixing base plate 38 is connected to four guide shafts 29, four linear bearings 31 are connected to the fixing base plate 38, the same connecting plate 32 is connected to the four linear bearings 31, a supporting plate 33 is connected to the connecting plate 32, a rocking disc 37 is connected to the supporting plate 33, four air cylinders 34 are connected to the rocking disc 37, four stoppers 36 are connected to the supporting plate 33, and a fourth sensor 35 is connected to the rocking disc 37.
Example two
Referring to fig. 1-3, an automatic rocking disc material taking and placing mechanism for semiconductor chip processing comprises a platform assembly 1, wherein the platform assembly 1 provides power in the X and Y directions of a working box, the platform assembly 1 is connected with a rocking disc assembly 2, the rocking disc assembly 2 provides power in the up and down directions of the rocking disc, the platform assembly 1 comprises a lower shaft moving stator 3, the lower shaft moving stator 3 is connected with a lower shaft guide rail 4, the lower shaft moving stator 3 is connected with a magnetic grating strip 7 and a first magnetic grating ruler 8, the lower shaft moving stator 3 is connected with a first sensor sheet 9, the lower shaft moving stator 3 is connected with a lower shaft sliding plate 19, the lower shaft sliding plate 19 is connected with an X direction seat 20, the X direction seat 20 is connected with an upper shaft guide rail 13, the upper shaft guide rail 13 is connected with an upper shaft moving stator 12, the upper shaft sliding plate 18 is connected with a second sensor sheet 15, the lower shaft sliding plate 19 is driven by the lower shaft sliding plate 19 to move linearly in the Y direction, the upper shaft moving stator 12 is connected with a motor assembly X direction motor 21, the upper shaft guide seat 21 is connected with a support plate 26, the motor assembly is connected with a motor seat 25, and the motor seat 26 is connected with a support plate 25.
Referring to fig. 4-8, the second magnetic grating ruler 14 is connected to the x-direction seat 20, the first reading head mounting seat 11 is connected to the lower shaft sliding plate 19, the first reading head 10 is connected to the lower shaft moving stator 3, the first sensor seat 6 is connected to the lower shaft sliding plate 19, the first sensor seat 6 is connected to the first sensor 5, the second reading head mounting seat 17 is connected to the upper shaft guide rail 13, the second reading head 16 is connected to the second reading head mounting seat 17, two support plates 39 are connected to the upper shaft sliding plate 18, the same support seat 40 is connected to the two support plates 39, two symmetrical electric push rods are fixedly mounted at the top of the support seat 40, clamping plates are fixedly connected to output shafts of the two electric push rods, when the two electric push rods are started, the two electric push rods respectively drive the two clamping plates to be close to each other, and the two clamping plates can clamp and position the semiconductor chip, so that the semiconductor chip can be prevented from shifting when moving axially at X, Y.
Referring to fig. 9 to 15, a second sensor holder 24 is connected to a fixing plate 28, a second sensor 23 is connected to the second sensor holder 24, a third sensor piece 27 is connected to the second sensor 23, a lead screw 30 is connected to a support plate 26, the lead screw 30 is connected to a motor 21, the motor 21 drives the lead screw 30 to move up and down, the same fixing base plate 38 is connected to four guide shafts 29, four linear bearings 31 are connected to the fixing base plate 38, the same connecting plate 32 is connected to the four linear bearings 31, a supporting plate 33 is connected to the connecting plate 32, a rocking disc 37 is connected to the supporting plate 33, four air cylinders 34 are connected to the rocking disc 37, four stoppers 36 are connected to the supporting plate 33, and a fourth sensor 35 is connected to the rocking disc 37.
Example III
Referring to fig. 1-3, an automatic rocking disc material taking and placing mechanism for semiconductor chip processing comprises a platform assembly 1, wherein the platform assembly 1 provides power in the X and Y directions of a working box, the platform assembly 1 is connected with a rocking disc assembly 2, the rocking disc assembly 2 provides power in the up and down directions of the rocking disc, the platform assembly 1 comprises a lower shaft moving stator 3, the lower shaft moving stator 3 is connected with a lower shaft guide rail 4, the lower shaft moving stator 3 is connected with a magnetic grating strip 7 and a first magnetic grating ruler 8, the lower shaft moving stator 3 is connected with a first sensor sheet 9, the lower shaft moving stator 3 is connected with a lower shaft sliding plate 19, the lower shaft sliding plate 19 is connected with an X direction seat 20, the X direction seat 20 is connected with an upper shaft guide rail 13, the upper shaft guide rail 13 is connected with an upper shaft moving stator 12, the upper shaft sliding plate 18 is connected with a second sensor sheet 15, the lower shaft sliding plate 19 is driven by the lower shaft sliding plate 19 to move linearly in the Y direction, the upper shaft moving stator 12 is connected with a motor assembly X direction motor 21, the upper shaft guide seat 21 is connected with a support plate 26, the motor assembly is connected with a motor seat 25, and the motor seat 26 is connected with a support plate 25.
Referring to fig. 4-8, the second magnetic grating ruler 14 is connected to the x-direction seat 20, the first reading head mounting seat 11 is connected to the lower shaft sliding plate 19, the first reading head 10 is connected to the lower shaft moving stator 3, the first sensor seat 6 is connected to the lower shaft sliding plate 19, the first sensor seat 6 is connected to the first sensor 5, the second reading head mounting seat 17 is connected to the upper shaft guide rail 13, the second reading head 16 is connected to the second reading head mounting seat 17, the two support plates 39 are connected to the upper shaft sliding plate 18, the same support seat 40 is connected to the two support plates 39, the symmetrical two electric push rods are fixedly arranged at the top of the support seat 40, clamping plates are fixedly connected to output shafts of the two electric push rods, when the two electric push rods are started, the two electric push rods respectively drive the two clamping plates to be close to each other, so that the two clamping plates can clamp and position a semiconductor chip, the two clamping plates are prevented from shifting when the semiconductor chip moves axially at X, Y, a pressure sensor is fixedly arranged on the two clamping plates, a first controller is fixedly arranged on the support seat 40, the two controllers are connected to the two electric push rods, and the two electric push rods can be automatically controlled to be automatically clamped and automatically clamped by the two clamping plates when the two pressure sensors are in turn off, and the two power controllers are controlled to be automatically controlled, and the two force threshold values are respectively.
Referring to fig. 9 to 15, a second sensor holder 24 is connected to a fixing plate 28, a second sensor 23 is connected to the second sensor holder 24, a third sensor piece 27 is connected to the second sensor 23, a lead screw 30 is connected to a support plate 26, the lead screw 30 is connected to a motor 21, the motor 21 drives the lead screw 30 to move up and down, the same fixing base plate 38 is connected to four guide shafts 29, four linear bearings 31 are connected to the fixing base plate 38, the same connecting plate 32 is connected to the four linear bearings 31, a supporting plate 33 is connected to the connecting plate 32, a rocking disc 37 is connected to the supporting plate 33, four air cylinders 34 are connected to the rocking disc 37, four stoppers 36 are connected to the supporting plate 33, and a fourth sensor 35 is connected to the rocking disc 37.
Example IV
Referring to fig. 1-3, an automatic rocking disc material taking and placing mechanism for semiconductor chip processing comprises a platform assembly 1, wherein the platform assembly 1 provides power in the X and Y directions of a working box, the platform assembly 1 is connected with a rocking disc assembly 2, the rocking disc assembly 2 provides power in the up and down directions of the rocking disc, the platform assembly 1 comprises a lower shaft moving stator 3, the lower shaft moving stator 3 is connected with a lower shaft guide rail 4, the lower shaft moving stator 3 is connected with a magnetic grating strip 7 and a first magnetic grating ruler 8, the lower shaft moving stator 3 is connected with a first sensor sheet 9, the lower shaft moving stator 3 is connected with a lower shaft sliding plate 19, the lower shaft sliding plate 19 is connected with an X direction seat 20, the X direction seat 20 is connected with an upper shaft guide rail 13, the upper shaft guide rail 13 is connected with an upper shaft moving stator 12, the upper shaft sliding plate 18 is connected with a second sensor sheet 15, the lower shaft sliding plate 19 is driven by the lower shaft sliding plate 19 to move linearly in the Y direction, the upper shaft moving stator 12 is connected with a motor assembly X direction motor 21, the upper shaft guide seat 21 is connected with a support plate 26, the motor assembly is connected with a motor seat 25, and the motor seat 26 is connected with a support plate 25.
Referring to fig. 4-8, the second magnetic grating ruler 14 is connected to the x-direction seat 20, the first reading head mounting seat 11 is connected to the lower shaft sliding plate 19, the first reading head 10 is connected to the lower shaft moving stator 3, the first sensor seat 6 is connected to the lower shaft sliding plate 19, the first sensor seat 6 is connected to the first sensor 5, the second reading head mounting seat 17 is connected to the upper shaft guide rail 13, the second reading head 16 is connected to the second reading head mounting seat 17, the two support plates 39 are connected to the upper shaft sliding plate 18, the same support seat 40 is connected to the two support plates 39, the symmetrical two electric push rods are fixedly arranged at the top of the support seat 40, clamping plates are fixedly connected to output shafts of the two electric push rods, when the two electric push rods are started, the two electric push rods respectively drive the two clamping plates to be close to each other, so that the two clamping plates can clamp and position a semiconductor chip, the two clamping plates are prevented from shifting when the semiconductor chip moves axially at X, Y, a pressure sensor is fixedly arranged on the two clamping plates, a first controller is fixedly arranged on the support seat 40, the two controllers are connected to the two electric push rods, and the two electric push rods can be automatically controlled to be automatically clamped and automatically clamped by the two clamping plates when the two pressure sensors are in turn off, and the two power controllers are controlled to be automatically controlled, and the two force threshold values are respectively.
Referring to fig. 9-15, a second sensor seat 24 is connected to a fixing plate 28, a second sensor 23 is connected to the second sensor seat 24, a third sensor plate 27 is connected to the second sensor 23, a lead screw 30 is connected to a supporting plate 26, the lead screw 30 is connected to a motor 21, the motor 21 drives the lead screw 30 to move up and down, a protection cover is fixedly mounted at the bottom of the supporting plate 26 through bolts, the motor 21 is located in the protection cover, the protection cover can protect the motor 21, heat dissipation openings are formed in two sides of the protection cover, dust-proof plates are fixedly mounted in the two heat dissipation openings, a heat dissipation fan is fixedly mounted in the heat dissipation openings, when the heat dissipation fan is started, the heat dissipation fan can dissipate heat to the motor 21, a same fixing bottom plate 38 is connected to the four guide shafts 29, four linear bearings 31 are connected to the same connecting plate 32, a rocking disc 37 is connected to the connecting plate 33, four air cylinders 34 are connected to the rocking disc 37, four stop blocks 36 are connected to the rocking disc 37, and a fourth sensor 35 is connected to the rocking disc 37.
Example five
Referring to fig. 1-3, an automatic rocking disc material taking and placing mechanism for semiconductor chip processing comprises a platform assembly 1, wherein the platform assembly 1 provides power in the X and Y directions of a working box, the platform assembly 1 is connected with a rocking disc assembly 2, the rocking disc assembly 2 provides power in the up and down directions of the rocking disc, the platform assembly 1 comprises a lower shaft moving stator 3, the lower shaft moving stator 3 is connected with a lower shaft guide rail 4, the lower shaft moving stator 3 is connected with a magnetic grating strip 7 and a first magnetic grating ruler 8, the lower shaft moving stator 3 is connected with a first sensor sheet 9, the lower shaft moving stator 3 is connected with a lower shaft sliding plate 19, the lower shaft sliding plate 19 is connected with an X direction seat 20, the X direction seat 20 is connected with an upper shaft guide rail 13, the upper shaft guide rail 13 is connected with an upper shaft moving stator 12, the upper shaft sliding plate 18 is connected with a second sensor sheet 15, the lower shaft sliding plate 19 is driven by the lower shaft sliding plate 19 to move linearly in the Y direction, the upper shaft moving stator 12 is connected with a motor assembly X direction motor 21, the upper shaft guide seat 21 is connected with a support plate 26, the motor assembly is connected with a motor seat 25, and the motor seat 26 is connected with a support plate 25.
Referring to fig. 4-8, the second magnetic grating ruler 14 is connected to the x-direction seat 20, the first reading head mounting seat 11 is connected to the lower shaft sliding plate 19, the first reading head 10 is connected to the lower shaft moving stator 3, the first sensor seat 6 is connected to the lower shaft sliding plate 19, the first sensor seat 6 is connected to the first sensor 5, the second reading head mounting seat 17 is connected to the upper shaft guide rail 13, the second reading head 16 is connected to the second reading head mounting seat 17, the two support plates 39 are connected to the upper shaft sliding plate 18, the same support seat 40 is connected to the two support plates 39, the symmetrical two electric push rods are fixedly arranged at the top of the support seat 40, clamping plates are fixedly connected to output shafts of the two electric push rods, when the two electric push rods are started, the two electric push rods respectively drive the two clamping plates to be close to each other, so that the two clamping plates can clamp and position a semiconductor chip, the two clamping plates are prevented from shifting when the semiconductor chip moves axially at X, Y, a pressure sensor is fixedly arranged on the two clamping plates, a first controller is fixedly arranged on the support seat 40, the two controllers are connected to the two electric push rods, and the two electric push rods can be automatically controlled to be automatically clamped and automatically clamped by the two clamping plates when the two pressure sensors are in turn off, and the two power controllers are controlled to be automatically controlled, and the two force threshold values are respectively.
Referring to fig. 9-15, the second sensor base 24 is connected to the fixing plate 28, the second sensor base 24 is connected to the second sensor 23, the third sensor sheet 27 is connected to the second sensor base 23, the lead screw 30 is connected to the support plate 26, the lead screw 30 is connected to the motor 21, the motor 21 drives the lead screw 30 to move up and down, the bottom of the support plate 26 is fixedly provided with the protective cover through bolts, the motor 21 is located in the protective cover, the protective cover can protect the motor 21, both sides of the protective cover are provided with heat dissipation openings, the two heat dissipation openings are fixedly provided with dust-proof plates, the heat dissipation openings are internally fixedly provided with heat dissipation fans, when the heat dissipation fans are started, the heat dissipation fans can dissipate heat to the motor 21, the temperature sensor and the controller are fixedly installed in the protective cover, the temperature sensor, the controller and the heat dissipation fans are sequentially connected, the temperature sensor can detect real-time temperature of the motor 21, when the temperature of the motor 21 reaches a set threshold value, the temperature sensor sends instructions to the controller, the controller controls the heat dissipation fans to automatically perform heat dissipation according to the real-time temperature of the motor 21, the four guide shafts are fixedly connected with the four guide shafts 38, the four guide shafts are fixedly connected with the four support plates 33, the four guide plates are fixedly connected with the four support plates 32, the four guide plates are fixedly connected with the four support plates 33, the four guide plates are fixedly connected with the four support plates 32, and the four guide plates are fixedly connected with the four support plates 32, and are fixedly connected with the four support plates 33, and are connected with the four guide plates, and are connected with the four support plates, and are connected.
In this embodiment, when in use, through the setting of the upper and lower axial stators 3 and 12 of the platform assembly 1, the lower axial stator 3 drives the upper part of the lower axial sliding plate 19 to do Y-direction rectilinear motion, and the upper axial stator 12 part does X-direction rectilinear motion, so that the X-direction and Y-direction motion of the semiconductor device chip can be revealed, and meanwhile, through the setting of the screw mechanism on the rocking disc assembly 2, the motor 21 drives the screw 30 to do up-and-down motion, and the screw 30 drives the upper part of the fixed bottom plate 38 to vertically move, so that the up-and-down motion of the rocking disc 37 can be realized, the semiconductor chip mounting equipment is optimized, the manufacturing cost is reduced, and the production efficiency is effectively improved.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. An automatic rocking disc material taking and discharging mechanism for processing semiconductor chips comprises a platform assembly (1), the novel electric motor is characterized in that the platform assembly (1) is connected with the rocker assembly (2), the platform assembly (1) comprises a lower shaft moving stator (3), a lower shaft guide rail (4) is connected to the lower shaft moving stator (3), a magnetic grating strip (7) and a first magnetic grating ruler (8) are connected to the lower shaft moving stator (3), a first sensor sheet (9) is connected to the lower shaft moving stator (3), a lower shaft sliding plate (19) is connected to the lower shaft sliding plate (19), an X-direction seat (20) is connected to the lower shaft sliding plate (19), an upper shaft guide rail (13) is connected to the X-direction seat (20), an upper shaft sliding plate (18) is connected to the upper shaft guide rail (13), a second sensor sheet (15) is connected to the upper shaft sliding plate (18), the rocker assembly (2) comprises a motor (21), a coupler (22) is connected to the motor seat (25), a support plate (26) is connected to the motor seat (25), and two support plates (26) are connected to the support plate (26).
2. An automatic tray picking and placing mechanism for semiconductor chip processing according to claim 1, wherein the X-direction base (20) is connected with a second magnetic grating ruler (14).
3. The automatic rocking disc taking and discharging mechanism for semiconductor chip processing according to claim 2, wherein the lower shaft sliding plate (19) is connected with a first reading head mounting seat (11), and the lower shaft moving stator (3) is connected with a first reading head (10).
4. An automatic tray-shaking pick-and-place mechanism for semiconductor chip processing according to claim 3, wherein the lower shaft slide plate (19) is connected with a first sensor seat (6), and the first sensor seat (6) is connected with a first sensor (5).
5. The automatic rocking disc taking and discharging mechanism for semiconductor chip processing according to claim 4, wherein a second reading head mounting seat (17) is connected to the upper shaft guide rail (13), and a second reading head (16) is connected to the second reading head mounting seat (17).
6. The automatic tray-shaking material taking and placing mechanism for semiconductor chip processing according to claim 5, wherein two support plates (39) are connected to the upper shaft sliding plate (18), and the same support (40) is connected to the two support plates (39).
7. The automatic tray feeding and discharging mechanism for semiconductor chip processing according to claim 6, wherein a second sensor seat (24) is connected to the fixing plate (28), a second sensor (23) is connected to the second sensor seat (24), and a third sensor sheet (27) is connected to the second sensor (23).
8. The automatic tray-shaking material taking and placing mechanism for semiconductor chip processing according to claim 7, wherein the supporting plate (26) is connected with a screw rod (30), the screw rod (30) is connected with a motor (21), and the four guide shafts (29) are connected with the same fixed bottom plate (38).
9. The automatic tray-shaking material taking and placing mechanism for semiconductor chip processing according to claim 8, wherein four linear bearings (31) are connected to the fixed bottom plate (38), the same connecting plate (32) is connected to the four linear bearings (31), and a supporting plate (33) is connected to the connecting plate (32).
10. The automatic tray picking and placing mechanism for semiconductor chip processing according to claim 9, wherein a tray (37) is connected to the supporting plate (33), four cylinders (34) are connected to the tray (37), four stoppers (36) are connected to the supporting plate (33), and a fourth sensor (35) is connected to the tray (37).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310766757.0A CN116564865A (en) | 2023-06-27 | 2023-06-27 | Automatic rocking disc material taking and discharging mechanism for processing semiconductor chips |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310766757.0A CN116564865A (en) | 2023-06-27 | 2023-06-27 | Automatic rocking disc material taking and discharging mechanism for processing semiconductor chips |
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| Publication Number | Publication Date |
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| CN116564865A true CN116564865A (en) | 2023-08-08 |
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| CN202310766757.0A Pending CN116564865A (en) | 2023-06-27 | 2023-06-27 | Automatic rocking disc material taking and discharging mechanism for processing semiconductor chips |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090008630A (en) * | 2007-07-18 | 2009-01-22 | 한미반도체 주식회사 | Apparatus for extracting or inserting substrate plate for manufacturing semiconductor packages |
| CN108698772A (en) * | 2016-11-25 | 2018-10-23 | 苏州富强科技有限公司 | Fully automatic feeding assembly line |
| CN111739780A (en) * | 2020-07-29 | 2020-10-02 | 山东元旭光电股份有限公司 | Automatic sheet feeding machine |
| CN112490160A (en) * | 2020-12-23 | 2021-03-12 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN114743910A (en) * | 2022-03-29 | 2022-07-12 | 深圳新益昌科技股份有限公司 | Die bonding conveying mechanism and die bonding machine |
-
2023
- 2023-06-27 CN CN202310766757.0A patent/CN116564865A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090008630A (en) * | 2007-07-18 | 2009-01-22 | 한미반도체 주식회사 | Apparatus for extracting or inserting substrate plate for manufacturing semiconductor packages |
| CN108698772A (en) * | 2016-11-25 | 2018-10-23 | 苏州富强科技有限公司 | Fully automatic feeding assembly line |
| CN111739780A (en) * | 2020-07-29 | 2020-10-02 | 山东元旭光电股份有限公司 | Automatic sheet feeding machine |
| CN112490160A (en) * | 2020-12-23 | 2021-03-12 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN114743910A (en) * | 2022-03-29 | 2022-07-12 | 深圳新益昌科技股份有限公司 | Die bonding conveying mechanism and die bonding machine |
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