CN116559633A - Semiconductor chip high temperature test box - Google Patents
Semiconductor chip high temperature test box Download PDFInfo
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- CN116559633A CN116559633A CN202310833877.8A CN202310833877A CN116559633A CN 116559633 A CN116559633 A CN 116559633A CN 202310833877 A CN202310833877 A CN 202310833877A CN 116559633 A CN116559633 A CN 116559633A
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- 238000012360 testing method Methods 0.000 title claims abstract description 151
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims abstract description 198
- 230000001276 controlling effect Effects 0.000 claims abstract description 21
- 230000001105 regulatory effect Effects 0.000 claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims description 30
- 210000000078 claw Anatomy 0.000 claims description 23
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000005485 electric heating Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- 238000004321 preservation Methods 0.000 abstract description 5
- 230000000630 rising effect Effects 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a semiconductor chip high-temperature test box, which comprises a high-temperature test box, a heating and heat-preserving component, a chip clamping device and a temperature regulating and controlling component, wherein the heating and heat-preserving component, the chip clamping device and the temperature regulating and controlling component are arranged in the high-temperature test box; the heating and heat-preserving assembly comprises a first heating track, a second heating track, a guide rod and a handle; the first heating track is arranged on the bottom plate of the high-temperature test box, a plurality of guide rods are arranged, and the guide rods are vertically arranged on one side, far away from the bottom plate, of the first heating track; the second heating track is sleeved on the guide rod in a sliding way and is symmetrically arranged with the first heating track; the handle is arranged on one side of the second heating track far away from the first heating track; a limiting groove for placing a chip to be detected is formed in one side, close to the second heating track, of the first heating track; the side walls of the first heating track and the side walls of the second heating track are both wrapped with heat preservation layers; the pins of the chip to be detected leak out of the heating and heat-preserving component. The semiconductor chip high-temperature test box has the advantages of simple structure, small volume and high temperature rising speed.
Description
Technical Field
The invention relates to the technical field of semiconductor device packaging, in particular to a semiconductor chip high-temperature test box.
Background
With the development of the internet, semiconductor chips are increasingly used in life, the yield of the semiconductor chips is also increased, and various performances of the chips need to be tested in the production process of the semiconductor chips so as to meet the performance indexes of the chips.
Existing chip testing equipment generally tests chips in a high-temperature environment. For example: in a typical power semiconductor test, a power semiconductor chip from a previous process is placed in a high Wen Guidao of a high-temperature heating module of an automation device, the semiconductor chip is heated by using the high Wen Guidao, the temperature of a semiconductor device on a high-temperature track is raised to a predetermined temperature within a set time, and then an electrical performance test is performed on the semiconductor chip. The high-temperature heating module of the automatic equipment is large in volume, and the heating time is generally longer than 30 minutes; and when the semiconductor chip test is abnormal, the automatic test equipment cannot determine the reason of the abnormal problem, so that the semiconductor chip is not tested or killed.
Therefore, a high-temperature testing device with smaller volume and faster temperature rising speed is needed to perform secondary test verification on the semiconductor chip with the abnormality detected by the automatic testing equipment, so as to determine whether the semiconductor chip with the abnormality is erroneously detected by the automatic testing equipment or the semiconductor chip itself has the abnormality.
Disclosure of Invention
Compared with the existing high-temperature heating module of the automatic equipment, the high-temperature testing box for the semiconductor chip has the advantages of simple structure, small volume and high temperature rising speed.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the invention provides a semiconductor chip high-temperature test box, which comprises a high-temperature test box, a heating and heat-preserving component, a chip clamping device and a temperature regulating and controlling component, wherein the heating and heat-preserving component, the chip clamping device and the temperature regulating and controlling component are arranged in the high-temperature test box;
the heating and heat-preserving assembly comprises a first heating track, a second heating track, a guide rod and a handle; the first heating tracks are arranged on the bottom plate of the high-temperature test box, the guide rods are multiple, and the guide rods are vertically arranged on one side, far away from the bottom plate, of the first heating tracks; the second heating track is sleeved on the guide rod in a sliding way and is symmetrically arranged with the first heating track; the handle is arranged on one side of the second heating track away from the first heating track; a limiting groove for placing a chip to be detected is formed in one side, close to the second heating track, of the first heating track; the side wall of the first heating track and the side wall of the second heating track are both wrapped with heat insulation layers; pins of the chip to be detected leak out of the heating and heat-preserving component;
the chip clamping device is arranged on one side of the heating and heat-preserving component and used for clamping pins of the chip to be detected;
the temperature regulation and control assembly is used for collecting the actual temperature in the high-temperature test box, and controlling the temperature raising and preserving assembly to stop heating after the actual temperature is greater than or equal to a preset temperature.
In one possible implementation, the first heating track and the second heating track each include a metal mount and an electrical heating pad disposed on the metal mount;
the electric heating sheet is positioned at one side of the first heating track and one side of the second heating track, which are close to each other, and is used for heating the chip to be detected in a direct contact way.
In one possible implementation, the first heating track and the second heating track each comprise a zirconia ceramic layer disposed on a side of the first heating track and the second heating track that are adjacent to each other.
In one possible implementation, the chip holding device includes a test base, a mount, a conductive gripper, and a drive mechanism;
the test base is arranged on the bottom plate of the high-temperature test box and is parallel to the heating and heat-preserving component;
the plurality of mounting seats are arranged on one side, away from the bottom plate, of the test base at intervals along the length direction of the test base;
the conductive clamping claws are fixed on the mounting seat, are arranged towards the limiting grooves and are matched with the limiting grooves in number and position; the conductive clamping claw comprises an upper clamping claw and a lower clamping claw which are matched with each other, and a torsion spring, wherein the upper clamping claw and the lower clamping claw are connected through the torsion spring, and the upper clamping claw and the lower clamping claw are in a clamping state in a normal state;
the driving mechanism is arranged on the test base, connected with the upper clamping jaw and the lower clamping jaw and used for controlling the clamping or opening of the upper clamping jaw and the lower clamping jaw.
In one possible implementation, the driving mechanism includes a first support seat, an elbow clamp, a second support seat, a connecting rod, a first driving rod and a second driving rod;
the first supporting seat and the second supporting seat are both arranged on the test base, the elbow clamp is arranged at the top of the first supporting seat, the middle part of the connecting rod is rotationally connected with the top of the second supporting seat in the vertical direction, and one end of the connecting rod is positioned under the presser foot of the elbow clamp;
the first driving rod is connected with the upper clamping jaw, one end of the connecting rod, which is located under the presser foot of the elbow clamp, is connected with the first driving rod, the second driving rod is connected with the lower clamping jaw, the other end of the connecting rod is connected with the second driving rod, and the first driving rod and the second driving rod are controlled to move in opposite directions when the presser foot of the elbow clamp presses down one end of the connecting rod, which is located under the presser foot, so as to control the upper clamping jaw and the lower clamping jaw to clamp.
In one possible implementation manner, the two ends of the connecting rod are provided with U-shaped grooves, and the first driving rod and the second driving rod are rotationally connected with the connecting rod through the corresponding U-shaped grooves.
In one possible implementation manner, the upper clamping jaw and the lower clamping jaw each comprise a plurality of clamping fingers, the clamping fingers are arranged at equal intervals, and the number of the clamping fingers is matched with the number of pins of the chip to be detected.
In one possible implementation, the temperature regulation assembly includes a controller and a plurality of temperature sensors;
the temperature sensors are arranged at different positions in the high-temperature test box and are used for collecting the temperature in the high-temperature test box and uploading the collected actual temperature to the controller;
the controller is used for controlling the temperature raising and preserving assembly to stop heating after the actual temperature acquired by each temperature sensor is greater than the preset temperature;
the controller is also used for sending out prompt information after detecting that the actual temperature acquired by each temperature sensor is larger than the preset temperature.
In one possible implementation, the plurality of temperature sensors is 6, wherein:
the 4 temperature sensors are respectively arranged at the 4 bottom corners of the high-temperature test box;
1 temperature sensor is arranged at one half of the top of the first heating track along the length direction;
1 said temperature sensor is arranged at a quarter of the top of said first heating track along its length.
In one possible implementation, the high temperature test box further comprises a base, the high temperature test box is arranged above the base, and the controller is arranged inside the base;
the top of the high-temperature test box is provided with a buckle cover, and the top of the buckle cover is provided with a handle.
When the semiconductor chip high-temperature test box provided by the embodiment of the invention is used, the first heating track and the second heating track are used for heating the high-temperature test box, and after the actual temperature detected by the temperature regulating and controlling component is greater than the preset temperature, the second heating track is pulled upwards, so that the second heating track is separated from the first heating track; secondly, placing a plurality of chips to be detected in a plurality of limit grooves on a first heating track respectively, and putting down a second heating track to enable the bottom surface and the top surface of the chips to be detected to be in direct contact with the first heating track and the second heating track respectively for heating, and meanwhile, pins of the chips to be detected leak out of a heating and heat preserving assembly; thirdly, stably clamping pins of the chip to be detected through the chip clamping device, and waiting for a period of time to enable the temperature of the chip to be detected to reach a preset temperature; finally, after the temperature of the chip to be detected reaches the preset temperature, connecting a detection instrument to electrically detect the chip to be detected so as to determine whether the chip to be detected has abnormality. According to the heating and heat-preserving component of the semiconductor chip high-temperature test box, the chips to be detected clamped between the first heating track and the second heating track are directly heated through the first heating track and the second heating track which are arranged up and down, so that the heat transfer speed is high, and meanwhile, the first heating track and the second heating track are preserved through the heat-preserving layer, so that the heating speed of the semiconductor chip high-temperature test box to be detected is effectively improved; according to the invention, a plurality of chips to be detected can be tested at the same time by high Wen Dianxing, so that the test efficiency is improved; compared with the existing high-temperature heating module of the automatic equipment, the semiconductor chip high-temperature test box is simpler in structure and smaller in size.
Drawings
Fig. 1 is a schematic diagram of an internal structure of a semiconductor chip high-temperature test box according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a high-temperature test box of a semiconductor chip high-temperature test box according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating a use state of a semiconductor chip high-temperature testing box according to an embodiment of the present invention;
fig. 4 is a schematic diagram of the overall structure of a chip clamping device of a semiconductor chip high-temperature testing box according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a structure of a chip clamping device of a semiconductor chip high-temperature testing box according to an embodiment of the present invention except for a driving mechanism;
fig. 6 is a schematic structural diagram of a driving mechanism of a semiconductor chip high-temperature testing box according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a base of a semiconductor chip high-temperature testing box according to an embodiment of the present invention.
Reference numerals and description of the drawings:
1. a high temperature test box; 11. a buckle cover; 2. a temperature raising and preserving component; 21. a first heating track; 22. a second heating track; 23. a guide rod; 24. a handle; 25. a limit groove; 26. a heat preservation layer; 27. a metal mounting base; 28. an electric heating plate; 3. a chip clamping device; 31. a test base; 32. a mounting base; 33. a conductive gripper jaw; 331. an upper clamping jaw; 332. a lower jaw; 34. a driving mechanism; 341. a first support base; 342. an elbow clamp; 3421. a grip; 3422. a crank-link mechanism; 3423. a presser foot; 343. a second support base; 344. a connecting rod; 345. a first driving lever; 346. a second driving lever; 347. a U-shaped groove; 4. a base; 41. rectangular mounting holes; 5. a temperature regulation assembly; 6. a display screen; 7. and a chip to be detected.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more. In addition, the use of "based on" or "according to" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" or "according to" one or more of the stated conditions or values may in practice be based on additional conditions or beyond the stated values.
As shown in fig. 1-7, the embodiment of the invention provides a semiconductor chip high-temperature test box, which has a simple structure, a smaller volume and a high temperature rising speed compared with the existing high-temperature heating module of automatic equipment, and is suitable for manually carrying out secondary verification on defective chips detected by the existing automatic equipment so as to determine whether the tested defective chips are false detection of the automatic test equipment or the semiconductor chips are abnormal, thereby reducing the false detection rate in the chip production process and improving the chip production efficiency.
As shown in fig. 1, the semiconductor high-temperature test box comprises a high-temperature test box 1, and a temperature raising and maintaining assembly 2, a chip clamping device 3 and a temperature regulating assembly 5 which are arranged in the high-temperature test box 1.
The high-temperature test box 1 comprises a rectangular non-cover box body formed by welding a bottom plate and four side plates, and a cover body positioned at the opening of the non-cover box body, wherein the cover body can be directly placed at the top of the non-cover box body or hinged with one edge of the top of the non-cover box body.
The high-temperature test box 1 can be made of metal; the inside and/or the outside of the high temperature test box 1 can be wrapped with heat insulation cotton materials to insulate the high temperature test box 1.
As shown in fig. 2 and 3, the temperature raising and maintaining assembly 2 includes a first heating rail 21, a second heating rail 22, a guide bar 23, and a handle 24.
The first heating track 21 is arranged on the bottom plate of the high-temperature test box 1, a plurality of guide rods 23 are arranged vertically on one side, far away from the bottom plate, of the first heating track 21; the second heating track 22 is sleeved on the guide rod 23 in a sliding way and is symmetrically arranged with the first heating track 21; the handle 24 is arranged on the side of the second heating track 22 away from the first heating track 21; a limit groove 25 for placing the chip 7 to be detected is formed in one side of the first heating track 21, which is close to the second heating track 22; the side walls of the first heating track 21 and the side walls of the second heating track 22 are both wrapped with heat preservation layers 26; pins of the chip 7 to be detected leak out of the temperature raising and maintaining assembly 2.
Specifically, the chip 7 to be detected is a defective chip detected by an automatic test device in the chip production process.
The first heating track 21 and the second heating track 22 are both long strips, and the first heating track 21 is installed on the bottom plate of the high-temperature test box 1 and is parallel to the long side of the bottom plate.
The guide rods 23 are two vertical cylindrical rods symmetrically arranged on two sides of the top of the first heating track 21, round holes are correspondingly formed in positions, opposite to the cylindrical rods, of the second heating track 22, and the second heating track 22 is slidably arranged on the cylindrical rods through the round holes; the second heating rail 22 is limited by the guide rod 23, so that the second heating rail 22 and the first heating rail 21 are always symmetrically arranged.
The user may conveniently pull the second heating track 22 up or down by the handle 24. To prevent the handle 24 from overheating and scalding the user, an anti-scalding cotton pad can be wrapped outside the handle 24 or the user can be required to resort to clips, anti-scalding gloves and other tools.
The heat preservation 26 wraps the side wall of the first heating track 21 and the side wall of the second heating track 22, and is used for preserving heat of the first heating track 21 and the second heating track 22, reducing heat loss of the first heating track 21 and the second heating track 22, and guaranteeing accuracy of heating the chip 7 to be detected by the first heating track 21 and the second heating track 22.
The number of the limit grooves 25 can be one or more, that is, the semiconductor high-temperature test box can detect one chip 7 to be detected, or can detect a plurality of chips 7 to be detected simultaneously, and the number of the chips 7 to be detected for one-time performance detection is smaller than or equal to the number of the limit grooves 25.
In this embodiment, the number of the limiting grooves 25 is four, which are arranged at equal intervals along the longitudinal direction of the first heating track 21, that is, the semiconductor high-temperature test box of the present invention can perform high Wen Dianxing test on at most 4 chips 7 to be tested simultaneously.
The chip clamping device 3 is arranged on one side of the heating and heat-preserving component 2 and is used for clamping pins of the chip 7 to be detected.
In particular, the chip holding device 3 is arranged parallel to the long side of the first heating track 21,
the temperature regulating and controlling component 5 is used for collecting the actual temperature in the high-temperature test box 1, and controlling the temperature raising and preserving component 2 to stop heating after the actual temperature is greater than or equal to the preset temperature.
Specifically, the temperature control assembly 5 includes a signal acquisition part located in the high temperature test box 1 and a control and result output part located outside the high temperature test box 1, the actual temperature in the high temperature test box 1 is acquired in real time through the acquisition part, the acquired actual temperature is compared with a preset temperature through the control and result output part, and after the actual temperature is greater than the preset temperature, the temperature raising and heat preserving assembly 2 is controlled to stop heating. The control and result output part can also display the collected actual temperature or the comparison result.
When the semiconductor high-temperature test box provided by the embodiment of the invention is used, the first heating track 21 and the second heating track 22 are used for heating the high-temperature test box 1, and after the actual temperature detected by the temperature regulating and controlling component 5 is greater than the preset temperature, the second heating track 22 is pulled upwards, so that the second heating track 22 is separated from the first heating track 21; secondly, placing a plurality of chips 7 to be detected in a plurality of limit grooves 25 on a first heating track 21 respectively, and putting down a second heating track 22, so that the bottom surface and the top surface of the chips 7 to be detected are respectively in direct contact with the first heating track 21 and the second heating track 22 for heating, and pins of the chips 7 to be detected leak out of the heating and heat preserving assembly 2; thirdly, stably clamping pins of the chip 7 to be detected through the chip clamping device 3, and waiting for a period of time to enable the temperature of the chip 7 to be detected to reach a preset temperature; finally, after the temperature of the chip 7 to be detected reaches the preset temperature, the connection detection instrument performs electrical detection on the chip 7 to be detected to determine whether the chip 7 to be detected has an abnormality.
According to the heating and heat-preserving component 2 of the semiconductor high-temperature test box, the chip 7 to be detected, which is clamped between the first heating track 21 and the second heating track 22, is directly heated through the first heating track 21 and the second heating track 22 which are arranged up and down, so that the heat transfer speed is high, and meanwhile, the first heating track 21 and the second heating track 22 are preserved through the heat-preserving layer 26, so that the heating speed of the chip 7 to be detected in the semiconductor high-temperature test box is effectively improved; according to the invention, a plurality of chips 7 to be detected can be tested at the same time by high Wen Dianxing, so that the test efficiency is improved; compared with the existing high-temperature heating module of the automatic equipment, the semiconductor high-temperature test box is simpler in structure and smaller in volume.
The semiconductor high-temperature test box disclosed by the invention can manually perform secondary verification on defective chips detected by the existing automatic equipment so as to determine whether the tested defective chips are false detection of the automatic test equipment or the semiconductor chips are abnormal, so that the false detection rate in the chip production process is reduced, and the production efficiency of the chips is improved; the high Wen Dianxing detection can be directly and manually carried out on small batches of chips, the problem that the automatic equipment is stopped for a long time due to overlong early-stage debugging time of the existing automatic equipment is solved, and the production efficiency is improved.
Further, as shown in fig. 2 and 3, each of the first heating track 21 and the second heating track 22 includes a metal mounting base 27 and an electric heating plate 28, and the electric heating plate 28 is disposed on the metal mounting base 27;
the electric heating sheet 28 is located at one side of the first heating track 21 and the second heating track 22 close to each other, and is used for heating the chip 7 to be detected in a direct contact manner.
Specifically, the metal mounting base 27 is a steel fixing base.
Stainless steel is used in this embodiment; the bottom surface and the top surface of the chip 7 to be detected are in direct contact with the first heating track 21 and the second heating track 22, and the chip 7 to be detected can reach the preset temperature within 3 minutes by a direct contact type heating mode.
Further, an integral heating base is also provided at the bottom of the first heating track 21.
The whole heating base comprises the electric heating sheet 28 wrapped in the middle of two steel plates, the position of the first heating track 21 can be fixed through the whole heating base, the time for heating the high-temperature test box 1 to the preset temperature can be shortened, the chip clamping device 3 in the high-temperature test box 1 can reach the preset temperature, and when the conductive clamping claws are prevented from clamping the chip 7 to be detected without reaching the set temperature, the chip 7 to be detected is thermally conductive, so that the temperature of the chip 7 to be detected is not up to standard.
In this embodiment, the heating precision of the heating plate is not more than 1 degree celsius.
Further, the first heating track 21 and the second heating track 22 each include a zirconia ceramic layer disposed on a side of the first heating track 21 and the second heating track 22 that are adjacent to each other.
That is, the heating sheet is sandwiched between the zirconia ceramic layer and the metal mount 27, and the chip 7 to be inspected is in direct contact with the zirconia ceramic layer.
The good insulating property of zirconia can ensure that the problem of electric leakage can not appear in the testing process of the chip 7 to be detected so as to interfere with the testing precision.
As shown in fig. 2, 4, and 5, the chip holding apparatus 3 includes a test base 31, a mount 32, a conductive holding claw 33, and a driving mechanism 34.
Wherein, test base 31 sets up on the bottom plate of high temperature test box 1, and test base 31 is parallel with heating up heat preservation subassembly 2.
Specifically, the test base 31 is made of steel, the test base 31 can be welded or screwed on the bottom plate of the high-temperature test box 1, a sliding rail parallel to the long side of the first heating track 21 can be arranged on the bottom plate of the high-temperature test box 1, the test base 31 is slidably mounted on the bottom plate of the high-temperature test box 1, the position of the test base 31 is fixed by vertically penetrating through a bolt on the test base 31 and abutting against the bottom plate of the high-temperature test box 1, and the test base 31 can be slid along the sliding rail by loosening the bolt so as to adjust the distance between the test base 31 and the first heating track 21 according to requirements.
The mounting seats 32 are multiple, and the plurality of mounting seats 32 are arranged on one side, far away from the bottom plate, of the test base 31 at intervals along the length direction of the test base 31.
Specifically, the positions of the mounting seats 32 are matched with the positions of the limit grooves 25, and the number of the mounting seats 32 is not greater than the number of the limit grooves 25.
In the present embodiment, the number of the mounting seats 32 is 4, which are arranged at equal intervals.
The main body of the mounting seat 32 is made of zirconia material, and the mounting seat 32 is fixed on the test base 31 through screws.
The conductive clamping claw 33 is fixed on the mounting seat 32, and the conductive clamping claw 33 is arranged towards the limit grooves 25 and is matched with the limit grooves 25 in number and position.
Wherein the conductive clamping jaw 33 comprises an upper jaw 331 and a lower jaw 332, which are co-operating with each other, and a torsion spring.
The upper jaw 331 and the lower jaw 332 are connected by a torsion spring, and the upper jaw 331 and the lower jaw 332 are normally in a clamped state.
Specifically, the root parts of the upper clamping jaw 331 and the lower clamping jaw 332 are respectively provided with a mounting screw hole, and the upper clamping jaw 331 and the lower clamping jaw 332 are fixed on the mounting seat 32 in a matched manner through the mounting screw holes and screws.
Further, the conductive clamping jaw 33 is made of copper alloy, and the tip positions of the upper clamping jaw 331 and the lower clamping jaw 332 are used for contacting with the pin of the chip 7 to be detected, so that contacts made of tungsten and copper are welded at the tip positions of the upper clamping jaw 331 and the lower clamping jaw 332, and the contact effect between the conductive clamping jaw 33 and the pin of the chip 7 to be detected can be improved through the contacts made of tungsten and copper.
The distance between two adjacent conductive holding claws 33 is greater than or equal to 1 cm, ensuring a safe distance between the two conductive holding claws 33.
A drive mechanism 34 is mounted on the test base 31 and is connected to the upper and lower jaws 331, 332 for controlling the clamping or spreading of the upper and lower jaws 331, 332.
Because the torsion spring is arranged between the upper clamping jaw 331 and the lower clamping jaw 332, when the driving mechanism 34 does not work, the upper clamping jaw 331 and the lower clamping jaw 332 are in a clamping state under the action of the torsion spring, after the driving mechanism 34 applies back-to-back tension to the upper clamping jaw 331 and the lower clamping jaw 332, the upper clamping jaw 331 and the lower clamping jaw 332 are opened against the tension of the torsion spring, and once the driving mechanism 34 removes the force, the upper clamping jaw 331 and the lower clamping jaw 332 restore to the clamping state under the action of the torsion spring; after the driving mechanism 34 applies pressure to the upper jaw 331 and the lower jaw 332 toward each other, the upper jaw 331 and the lower jaw 332 press against each other, so that pins of the chip 7 to be inspected can be held more tightly.
In another embodiment of the present invention, the conductive clamping jaw 33 includes an upper clamping jaw 331, a lower clamping jaw 332 and a spring that cooperate with each other, and the upper clamping jaw 331 and the lower clamping jaw 332 are normally in an open state under the action of the spring.
The upper clamping jaw 331 and the lower clamping jaw 332 are closed and clamped by applying opposite force to the upper clamping jaw 331 and the lower clamping jaw 332 through the driving mechanism 34, so that the upper clamping jaw 331 and the lower clamping jaw 332 are buckled and clamp pins of the chip 7 to be detected.
Specifically, after the driving mechanism 34 applies opposing pressure to the upper jaw 331 and the lower jaw 332, the upper jaw 331 and the lower jaw 332 press against each other, clamping the pins of the chip 7 to be inspected; after the driving mechanism 34 removes the pressure, the upper jaw 331 and the lower jaw 332 open under the action of the spring, releasing the clamping of the chip 7 to be inspected.
Further, the upper clamping jaw 331 and the lower clamping jaw 332 each include a plurality of clamping fingers, the plurality of clamping fingers are arranged at equal intervals, and the number of the clamping fingers is matched with the number of pins of the chip 7 to be detected.
A certain gap is reserved between two adjacent clamping fingers, and the number of the clamping fingers in the upper clamping jaw 331 and the lower clamping jaw 332 is equal to that of pins of the chip 7 to be detected.
In this embodiment, each of the upper and lower clamping jaws 331, 332 includes 3 clamping fingers.
As shown in fig. 4 and 6, the driving mechanism 34 further includes a first supporting seat 341, an elbow clip 342, a second supporting seat 343, a connecting rod 344, a first driving rod 345, and a second driving rod 346.
Specifically, the number of the driving mechanisms 34 may be one or plural, and when the number of the driving mechanisms 34 is one, the plurality of conductive grippers 33 are controlled to be opened simultaneously by the driving mechanisms 34; when there are a plurality of driving mechanisms 34, the driving mechanisms 34 are disposed between two adjacent mounting seats 32, and two adjacent conductive clamping claws 33 are controlled to open or clamp simultaneously by one driving mechanism 34.
The toggle clamp 342 includes a grip 3421, a crank link mechanism 3422, and a presser foot 3423. In the practical application process, the handle 3421 is pressed downwards, and the crank connecting rod mechanism 3422 can drive the presser foot 3423 to move downwards; pushing the pressing handle 3421 upward can drive the presser foot 3423 to move upward by the crank link mechanism 3422.
The first and second supporting seats 341 and 343 are disposed on the test base 31. The toggle clamp 342 is disposed at the top of the first supporting seat 341, and the middle of the link 344 is rotatably connected to the top of the second supporting seat 343 in a vertical direction, and one end of the link 344 is located directly under the presser foot 3423 of the toggle clamp 342. Elbow clamp 342 is steel.
Specifically, the first supporting seat 341 and the second supporting seat 343 are welded on the test base 31, the elbow clamp 342 is detachably connected to the top of the first supporting seat 341, the connecting rod 344 is rotatably connected to the top of the second supporting seat 343, and after the handle 3421 is pressed downwards, the presser foot 3423 moves downwards to drive one end of the connecting rod 344 located right below the presser foot 3423 of the elbow clamp 342 to move downwards, and the other end moves upwards.
The first driving rod 345 is connected to the upper jaw 331, one end of the link 344 located right below the presser foot 3423 of the toggle clamp 342 is connected to the first driving rod 345, the second driving rod 346 is connected to the lower jaw 332, the other end of the link 344 is connected to the second driving rod 346, and the first driving rod 345 and the second driving rod 346 are controlled to move toward each other to control the clamping of the upper jaw 331 and the lower jaw 332 when the presser foot 3423 of the toggle clamp 342 presses down on one end of the link 344 located below the presser foot 3423.
Specifically, the link 344 has one end thereof located directly under the presser foot 3423 of the toggle clamp 342 moved downward and the other end moved upward to control the first and second driving levers 345 and 346 to move toward each other, thereby controlling the clamping of the upper and lower jaws 331 and 332.
The first driving lever 345 and the second driving lever 346 are hollow cylinders made of an alumina material mounted on the aluminum base 4.
Further, both ends of the connecting rod 344 are provided with U-shaped grooves 347, and the first driving rod 345 and the second driving rod 346 are rotatably connected with the connecting rod 344 through the corresponding U-shaped grooves 347.
The provision of the U-shaped slot 347 makes the connection of both ends of the link 344 with the first and second driving levers 345 and 346 simple and stable.
Further, the temperature regulation assembly 5 includes a controller and a plurality of temperature sensors.
Wherein, a plurality of temperature sensors set up in the inside different positions of high temperature test box 1 for gather the temperature in the high temperature test box 1, and upload the actual temperature who gathers to the controller.
The controller is used for controlling the heating and heat preserving component 2 to stop heating after the actual temperature acquired by each temperature sensor is larger than the preset temperature.
The controller is also used for controlling the temperature raising and preserving component 2 to heat when the actual temperature acquired by each temperature sensor is smaller than the preset temperature; and sending out prompt information after detecting that the actual temperature acquired by each temperature sensor is greater than the preset temperature.
Wherein, temperature regulation and control subassembly 5 still includes display screen 6, and display screen 6 is used for showing the actual temperature that a plurality of temperature sensors gathered.
The temperature regulation and control assembly 5 further comprises an alarm which sends out alarm information after the actual temperatures acquired by the temperature sensors are all larger than the preset temperature, and prompts a user that the temperature in the high-temperature test box 1 has reached the preset temperature.
Further, the number of the plurality of temperature sensors may be 6.
Wherein, 4 temperature sensors are respectively arranged at 4 bottom corners of the high-temperature test box 1;
1 temperature sensor is provided at a half of the top of the first heating track 21 in the length direction thereof;
the 1 temperature sensor is disposed at a quarter of the top of the first heating track 21 in the length direction thereof.
The actual temperatures at different positions in the high-temperature test box 1 can be detected by arranging the temperature sensors at the 4 bottom corners of the high-temperature test box 1, at one half of the top of the first heating track 21 along the length direction thereof and at one quarter of the top of the first heating track 21 along the length direction thereof, so that the accuracy of the actual temperatures in the high-temperature test box 1 is ensured, and the temperatures in the high-temperature test box 1 reach preset temperatures.
As shown in fig. 7, further, the high temperature test box 1 further comprises a base 4, the high temperature test box 1 is arranged above the base 4, and the controller is arranged inside the base 4.
Wherein, base 4 is welded into a box by a plurality of steel sheets, and high temperature test box 1 is fixed on base 4, and the controller setting is in base 4, and display screen 6 sets up on base 4.
The base 4 is used for fixing the top surface of the high-temperature test box 1, a rectangular mounting hole 41 is formed in the top surface of the high-temperature test box, and the heating and heat-preserving component 2 is mounted at the top of the rectangular mounting hole 41.
The top of the high temperature test box 1 is provided with a buckle cover 11, and the top of the buckle cover 11 is provided with a handle.
In this embodiment, for convenience of use, one side of the buckle cover 11 is hinged to one side of the top of the high temperature test box 1, and the top of the buckle cover 11 is provided with a handle for convenience of holding.
In this embodiment, the temperature to be reached when the chip 7 to be detected is 125 ℃.
The setting range of the preset temperature is 30-175 ℃, and the magnitude of the preset temperature can be adjusted through the temperature regulating and controlling assembly 5.
When the semiconductor high-temperature test box is used, a power supply is connected, and the high-temperature test box 1 is heated through the heating and heat preserving component 2; and the preset temperature of the controller is set to 125 ℃, and after the actual temperatures acquired by the 6 temperature sensors are all equal to 125 ℃, the temperature in the high-temperature test box 1 is indicated to reach the temperature required by the test of the semiconductor chips.
The buckle cover 11 of the high-temperature test box 1 is opened, the second heating track 22 is pulled upwards, the chip 7 to be tested is placed in the limit groove 25, and then the second heating track 22 is restored to the original position downwards.
The hand-operated pressing handle 3421 can drive the presser foot 3423 to move downwards through the crank connecting rod mechanism 3422, one end of the control connecting rod 344, which is positioned right below the presser foot 3423 of the elbow clamp 342, moves downwards, and the other end moves upwards to control the first driving rod 345 and the second driving rod 346 to move oppositely, so that the upper clamping jaw 331 and the lower clamping jaw 332 are controlled to clamp the pins of the chip 7 to be detected.
Closing the buckle cover 11, waiting for 3 minutes, enabling the temperature of the chip 7 to be detected to reach 125 ℃, and connecting an instrument for detecting the electrical property of the semiconductor chip for detection.
The semiconductor high-temperature test box has the advantages of simple structure, small volume and high temperature rising speed.
The present invention is not limited to the above embodiments, and any changes or substitutions within the technical scope of the present invention should be covered by the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. The semiconductor chip high-temperature test box is characterized by comprising a high-temperature test box, a heating and heat-preserving component, a chip clamping device and a temperature regulating and controlling component, wherein the heating and heat-preserving component, the chip clamping device and the temperature regulating and controlling component are arranged in the high-temperature test box;
the heating and heat-preserving assembly comprises a first heating track, a second heating track, a guide rod and a handle; the first heating tracks are arranged on the bottom plate of the high-temperature test box, the guide rods are multiple, and the guide rods are vertically arranged on one side, far away from the bottom plate, of the first heating tracks; the second heating track is sleeved on the guide rod in a sliding way and is symmetrically arranged with the first heating track; the handle is arranged on one side of the second heating track away from the first heating track; a limiting groove for placing a chip to be detected is formed in one side, close to the second heating track, of the first heating track; the side wall of the first heating track and the side wall of the second heating track are both wrapped with heat insulation layers; pins of the chip to be detected leak out of the heating and heat-preserving component;
the chip clamping device is arranged on one side of the heating and heat-preserving component and used for clamping pins of the chip to be detected;
the temperature regulation and control assembly is used for collecting the actual temperature in the high-temperature test box, and controlling the temperature raising and preserving assembly to stop heating after the actual temperature is greater than or equal to a preset temperature.
2. The semiconductor chip high temperature test box of claim 1, wherein the first heating track and the second heating track each comprise a metal mount and an electrical heater strip, the electrical heater strip being disposed on the metal mount;
the electric heating sheet is positioned at one side of the first heating track and one side of the second heating track, which are close to each other, and is used for heating the chip to be detected in a direct contact way.
3. The semiconductor chip high temperature test chamber of claim 2, wherein the first heating track and the second heating track each comprise a zirconia ceramic layer disposed on a side of the first heating track and the second heating track that are adjacent to each other.
4. A semiconductor chip high temperature test kit according to any one of claims 1-3, wherein the chip holding device comprises a test base, a mount, a conductive holding jaw, and a drive mechanism;
the test base is arranged on the bottom plate of the high-temperature test box and is parallel to the heating and heat-preserving component;
the plurality of mounting seats are arranged on one side, away from the bottom plate, of the test base at intervals along the length direction of the test base;
the conductive clamping claws are fixed on the mounting seat, are arranged towards the limiting grooves and are matched with the limiting grooves in number and position; the conductive clamping claw comprises an upper clamping claw and a lower clamping claw which are matched with each other, and a torsion spring, wherein the upper clamping claw and the lower clamping claw are connected through the torsion spring, and the upper clamping claw and the lower clamping claw are in a clamping state in a normal state;
the driving mechanism is arranged on the test base, connected with the upper clamping jaw and the lower clamping jaw and used for controlling the clamping or opening of the upper clamping jaw and the lower clamping jaw.
5. The semiconductor chip high temperature test chamber of claim 4, wherein the drive mechanism comprises a first support base, an elbow clamp, a second support base, a connecting rod, a first drive rod, and a second drive rod;
the first supporting seat and the second supporting seat are both arranged on the test base, the elbow clamp is arranged at the top of the first supporting seat, the middle part of the connecting rod is rotationally connected with the top of the second supporting seat in the vertical direction, and one end of the connecting rod is positioned under the presser foot of the elbow clamp;
the first driving rod is connected with the upper clamping jaw, one end of the connecting rod, which is located under the presser foot of the elbow clamp, is connected with the first driving rod, the second driving rod is connected with the lower clamping jaw, the other end of the connecting rod is connected with the second driving rod, and the first driving rod and the second driving rod are controlled to move oppositely or move back to control the upper clamping jaw and the lower clamping jaw to clamp or open when the presser foot of the elbow clamp presses down one end of the connecting rod, which is located under the presser foot.
6. The semiconductor chip high-temperature test box according to claim 5, wherein the two ends of the connecting rod are provided with U-shaped grooves, and the first driving rod and the second driving rod are rotatably connected with the connecting rod through the corresponding U-shaped grooves.
7. The semiconductor chip high temperature test box of claim 4, wherein the upper clamping jaw and the lower clamping jaw each comprise a plurality of clamping fingers, the plurality of clamping fingers are arranged at equal intervals, and the number of the clamping fingers is matched with the number of pins of the chip to be tested.
8. The semiconductor chip high temperature test box of claim 1, wherein the temperature regulation assembly comprises a controller and a plurality of temperature sensors;
the temperature sensors are arranged at different positions in the high-temperature test box and are used for collecting the temperature in the high-temperature test box and uploading the collected actual temperature to the controller;
the controller is used for controlling the temperature raising and preserving assembly to stop heating after the actual temperature acquired by each temperature sensor is greater than the preset temperature;
the controller is also used for sending out prompt information after detecting that the actual temperature acquired by each temperature sensor is larger than the preset temperature.
9. The semiconductor chip high temperature test chamber of claim 8, wherein a plurality of said temperature sensors is 6, wherein:
the 4 temperature sensors are respectively arranged at the 4 bottom corners of the high-temperature test box;
1 temperature sensor is arranged at one half of the top of the first heating track along the length direction;
1 said temperature sensor is arranged at a quarter of the top of said first heating track along its length.
10. The semiconductor chip high temperature test box of claim 8, further comprising a pedestal, the high temperature test box being disposed above the pedestal, the controller being disposed inside the pedestal;
the top of the high-temperature test box is provided with a buckle cover, and the top of the buckle cover is provided with a handle.
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| CN202310833877.8A CN116559633B (en) | 2023-07-10 | 2023-07-10 | Semiconductor chip high temperature test box |
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| CN202310833877.8A CN116559633B (en) | 2023-07-10 | 2023-07-10 | Semiconductor chip high temperature test box |
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Cited By (1)
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| CN116559633B (en) | 2023-09-29 |
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