CN116544144B - Wafer cleaning, drying and lifting mechanism with air injection function - Google Patents
Wafer cleaning, drying and lifting mechanism with air injection function Download PDFInfo
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- CN116544144B CN116544144B CN202310549654.9A CN202310549654A CN116544144B CN 116544144 B CN116544144 B CN 116544144B CN 202310549654 A CN202310549654 A CN 202310549654A CN 116544144 B CN116544144 B CN 116544144B
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- wafer
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- drying
- connecting rod
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- 238000001035 drying Methods 0.000 title claims abstract description 55
- 238000002347 injection Methods 0.000 title claims abstract description 37
- 239000007924 injection Substances 0.000 title claims abstract description 37
- 238000004140 cleaning Methods 0.000 title claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims description 101
- 210000001503 joint Anatomy 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to a wafer cleaning, drying and lifting mechanism with an air injection function, and belongs to the technical field of wafer manufacturing equipment. In the wafer cleaning and drying lifting mechanism with the air injection function, the power assembly drives the wafer basket supporting seat and the wafer supporting seat to do relative motion, the air injection port is arranged on the wafer supporting seat, when the wafer supporting seat is lifted to the topmost end and the wafer is placed in the cover body, the air injection port is positioned at a position which can be close to the wafer in the cover body, and the drying gas can be directly injected onto the wafer, so that the drying efficiency of the wafer and the drying effect under the same time are improved.
Description
Technical Field
The application belongs to the technical field of wafer manufacturing equipment, and particularly relates to a wafer cleaning, drying and lifting mechanism with an air injection function.
Background
The wafer drying apparatus may have various forms, and chinese patent documents CN213242515U and CN115295441a disclose a device capable of separating and drying a wafer in a tank, which is composed of a tank body and a lifting mechanism, wherein the lifting assembly is capable of lowering a wafer basket with the wafer into the tank body, and driving the wafer to be separated from the wafer basket and enter a cover body during drying, and then introducing a drying gas into the tank body for drying. However, in the existing wafer drying device, the drying gas is usually directly introduced into the tank body, and the drying gas can travel a long distance from the gas flow in the tank body to reach the wafer, so that the drying efficiency of the wafer is not high.
Disclosure of Invention
The application aims to solve the technical problems that: in order to solve the defects in the prior art, the wafer cleaning and drying lifting mechanism and the drying and cleaning equipment with the air injection function are provided, wherein the efficiency of the drying effect is higher.
The technical scheme adopted for solving the technical problems is as follows:
wafer washs dry elevating system with jet-propelled function includes:
the upright post is vertically arranged on the base, a sliding rail is arranged on the upright post, a first sliding block and a second sliding block are arranged on the sliding rail in a sliding manner, a connecting rod mechanism and a guide block are further arranged on one side of the upright post, and the connecting rod mechanism is connected with the first sliding block and the second sliding block;
the power assembly comprises a driving piece and a screw rod arranged on the upright post, the driving piece can drive the screw rod to rotate, the first sliding block is arranged on the screw rod, and when the screw rod rotates to drive the first sliding block to move, the first sliding block and the second sliding block move on the sliding rail under the limitation of the connecting rod mechanism and the guide block;
the wafer basket supporting seat is connected with the second sliding block through the first connecting rod and used for supporting and fixing the wafer basket;
the wafer supporting seat is connected with the first sliding block through a second connecting rod, the wafer supporting seat comprises a supporting rod connected with the second connecting rod, a supporting base arranged above the supporting rod, a jacking strip arranged in the middle of the supporting base, and a plurality of upward air nozzles are arranged on the supporting base;
the connecting block with the interface is arranged on the first sliding block, the connector is arranged on the opposite side of the upright post relative to the guide block, the second connecting rod and the support rod are of hollow structures, and when the first sliding block moves to the uppermost side, the connector can be in butt joint with the connecting block, so that a gas passage from the connector to the connecting block to the second connecting rod to the support rod and then to the gas spraying port is formed.
Preferably, the wafer cleaning and drying lifting mechanism with the air injection function of the application,
the second connecting rod comprises a horizontal part and a vertical part, a joint is arranged at the top of the second connecting rod, and the joint is connected with the connecting block through a pipeline.
Preferably, the wafer cleaning and drying lifting mechanism with the air injection function is characterized in that the air injection ports are arranged in two rows and are respectively positioned at two sides of the jacking strip.
Preferably, in the wafer cleaning and drying lifting mechanism with the air injection function, grooves for accommodating wafers are formed in the jacking strips, and the air injection ports are formed between the grooves.
Preferably, according to the wafer cleaning and drying lifting mechanism with the air injection function, two rows of air injection ports are arranged in a staggered mode.
Preferably, in the wafer cleaning and drying lifting mechanism with the air injection function, the connecting head is provided with the guide post and is matched with the guide hole on the connecting block.
Preferably, in the wafer cleaning and drying lifting mechanism with the air injection function, a position sensor is further arranged beside the connecting block to sense whether the connecting head is in butt joint with the connecting block or not.
Preferably, in the wafer cleaning and drying device of the present application, the wafer basket support seat and the wafer support seat are two arranged in parallel.
The beneficial effects of the application are as follows:
according to the wafer cleaning and drying lifting mechanism with the air injection function, the air injection port is arranged on the wafer supporting seat, when the wafer supporting seat is lifted to the top end and the wafer is placed in the cover body, the air injection port is positioned at a position which is close to the wafer in the cover body, and drying gas can be directly injected onto the wafer, so that the drying efficiency of the wafer and the drying effect under the same time are improved.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
Fig. 1 is a perspective view of a wafer cleaning and drying lifting mechanism with air injection in one direction according to an embodiment of the present application;
FIG. 2 is a perspective view of another direction of a wafer cleaning and drying lifting mechanism with air injection according to an embodiment of the present application;
FIG. 3 is a perspective view of a wafer basket support and wafer support in accordance with an embodiment of the present application;
FIG. 4 is a side view of a top-most wafer support in a jet-propelled wafer cleaning and drying lift mechanism according to an embodiment of the present application;
FIG. 5 is a schematic view of a wafer drying apparatus according to an embodiment of the present application;
the reference numerals in the figures are:
1. a column;
11. a slide rail;
111. a first slider;
112. a second slider;
131. a first link;
132. a second link;
133. a roller;
1110. a connecting block;
12. a guide block;
13. a link mechanism;
15. a connector;
2. a power assembly;
21. a screw;
221. a first pulley;
222. a second pulley;
231. a first connecting rod;
232. a second connecting rod;
2320. a joint;
2321. a horizontal portion;
2322. a vertical portion;
2324. a pipe;
3. a wafer basket support;
4. a wafer support;
41. a support rod;
42. a support base;
421. an air jet;
43. jacking the strip;
9. a base;
100. a tank body;
200. a cover body;
300. a water gas supply system;
400. a wafer lifting mechanism.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in a specific case.
The technical scheme of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Example 1
The present embodiment provides a wafer cleaning and drying lifting mechanism with an air injection function, as shown in fig. 1 and fig. 2, including:
the upright post 1 is vertically arranged on the base 9, a sliding rail 11 is arranged on the upright post 1, a first sliding block 111 and a second sliding block 112 are slidably arranged on the sliding rail 11, the first sliding block 111 is arranged on a screw rod 21, one side of the upright post 1 is also provided with a connecting rod mechanism 13 and a guide block 12, the connecting rod mechanism 13 is connected with the first sliding block 111 and the second sliding block 112 and is used for realizing linkage of the first sliding block 111 and the second sliding block 112, the guide block 12 is provided with a guide surface matched with a roller 133, and when the screw rod 21 rotates to drive the first sliding block 111 to move, the roller 133 moves on the guide surface and limits relative movement of the first sliding block 111 and the second sliding block 112;
the power assembly 2 comprises a driving piece (motor) and a screw 21 arranged on the upright 1, and the driving piece can drive the screw 21 to rotate; as shown in fig. 4, the power unit 2 is generally composed of a motor, a first pulley 221, and a second pulley 222 provided on the base 9, the first pulley 221 is provided coaxially with the motor, the second pulley 222 is provided coaxially with the screw 21, the first pulley 221 and the second pulley 222 are connected by a belt, which is not shown in the figure.
The wafer basket supporting seat 3 is connected with the second sliding block 112 through the first connecting rod 231 and is used for supporting and fixing the wafer basket;
the wafer supporting seat 4 is connected with the first slider 111 through a second connecting rod 232 as shown in fig. 3, the wafer supporting seat 4 comprises a supporting rod 41 connected with the second connecting rod 232, a supporting base 42 arranged above the supporting rod 41, a jacking strip 43 arranged in the middle of the supporting base 42, and a plurality of upward air nozzles 421 are arranged on the supporting base 42;
the first slider 111 is provided with a connecting block 1110 having an interface, the other side of the upright 1 opposite to the guide block 12 is provided with a connecting head 15, the second connecting rod 232 and the supporting rod 41 are hollow structures, and when the first slider 111 moves to the uppermost side, the connecting head 15 can be in butt joint with the connecting block 1110, so that a gas passage from the connecting head 15 to the connecting block 1110 to the second connecting rod 232 to the supporting rod 41 and then to the gas spraying port 421 is formed. Of course, the connection head 15 needs to be connected to the water and gas supply system of the apparatus to receive the gas.
In the wafer cleaning and drying lifting mechanism with the air injection function of the embodiment, the air injection port is arranged on the wafer supporting seat 4, and when the wafer supporting seat 4 is lifted to the top end and the wafer is placed in the cover body, the air injection port is positioned at a position which can be close to the wafer in the cover body, so that the drying efficiency of the wafer and the drying effect under the same time are improved.
The link mechanism 13 includes: the first connecting rod 131 and the second connecting rod 132, the connecting part of the first connecting rod 131 and the second connecting rod 132 is provided with a roller 133, the first connecting rod 131 is rotationally connected with the first sliding block 111, and the second connecting rod 132 is rotationally connected with the second sliding block 112; when the roller 133 moves on the guide surface, for example, from bottom to top, the movement process of the first slider 111 and the second slider 112 sequentially passes through the plurality of guide surfaces may be divided into the following steps: 1, the first slider 111 and the second slider 112 are coupled together to move vertically upward (in this case, the wafer basket support 3 and the wafer support 4 are coupled together). 2, the first slider 111 and the second slider 112 are separated, and in the separation process, the wafer support seat 4 gradually protrudes out of the wafer basket support seat 3, and the wafer support seat 4 jacks up the wafer and pushes up the wafer into the cover body 200.
The wafer basket supporting seat 3 and the wafer supporting seat 4 are respectively connected with the second sliding block 112 and the first sliding block 111 through Z-shaped connecting rods, two connecting rods of the wafer basket supporting seat 3 are arranged, and the connecting rods of the wafer supporting seat 4 are positioned between the connecting rods of the wafer basket supporting seat 3.
Further, the second connecting rod 232 includes a horizontal portion 2321 and a vertical portion 2322 that are hollow (the first connecting rod 231 is also a similar horizontal and vertical rod structure, but need not be hollow), the top of the second connecting rod 232 is provided with a joint 2320, the joint 2320 is connected to the connecting block 1110 through a pipe 2324, and it should be noted that the pipe 2324 is fixed, and there is no relative movement between the joint 2320 and the connecting block 1110.
Further, the air nozzles 421 are arranged in two rows, and are respectively located at two sides of the jack-up bar 43, so that the air flow has two rows.
Further, the jack-up bar 43 has grooves for accommodating wafers, and the air nozzles 421 are disposed between the grooves. Because each groove correspondingly accommodates one wafer, at this time, the gas sprayed out of the gas spraying ports 421 flows into the gaps between the wafers, and drying can be better performed.
Further, the two rows of air nozzles 421 are arranged in a staggered manner. That is, each row of the air nozzles 421 is disposed with a groove therebetween.
Further, the connector 15 has a guiding post thereon, and is matched with a guiding hole on the connecting block 1110. The outer protrusions, as seen in fig. 1, are guide posts that serve as guides to better align the connector 15 with the connector block 1110.
Further, a position sensor is provided beside the connection block 1110 to sense whether the connection head 15 is docked with the connection block 1110. As shown in fig. 1, a plurality of sensors are disposed on the upright 1 along the height direction, and each sensor senses the position of the first slider 111 or the second slider 112. The topmost sensor is to sense whether the first slider 111 is in place, and thus determine whether the connector 15 is in engagement with the connector block 1110.
The wafer basket supporting seat 3 and the wafer supporting seat 4 are two arranged in parallel, so that the processing of the two wafer baskets can be performed simultaneously.
Wafer drying apparatus having a wafer cleaning and drying lifting mechanism with an air-jet function, as shown in fig. 5, includes:
a tank body 100;
the cover 200 is disposed above the tank 100, and can reach or leave the opening of the tank 100 under the driving of the translation mechanism (the cover in fig. 5 has been moved to the opening side, and then the wafer basket can be placed into the tank 100 or removed from the tank 100 by a manipulator), and the inner wall of the cover 200 is provided with a wafer guide groove and can be matched with the wafer groove in the wafer basket;
a water-air supply system 300 for supplying cleaning water or drying gas to the tank 100;
a wafer lifting mechanism 400 for carrying a wafer basket and carrying the wafer into the tank 100, and ejecting the wafer into the cover 200 when drying;
the wafer lift mechanism 400 is a wafer cleaning and drying lift mechanism with a gas injection function as described in embodiment 1.
During drying, the water-gas supply system 300 realizes the drying effect by spraying the drying gas through the gas nozzles 421 through the gas passages from the connector 15 to the connecting block 1110 to the second connecting rod 232 to the support rod 41 and then to the gas nozzles 421. The top of the cover 200 is provided with an air suction port to suck the air from the inside.
With the above-described preferred embodiments according to the present application as a teaching, the worker skilled in the art could make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (8)
1. Wafer washs dry elevating system with jet-propelled function, its characterized in that includes:
the vertical column (1) is vertically arranged on the base (9), a sliding rail (11) is arranged on the vertical column (1), a first sliding block (111) and a second sliding block (112) are slidably arranged on the sliding rail (11), a connecting rod mechanism (13) and a guide block (12) are further arranged on one side of the vertical column (1), and the connecting rod mechanism (13) is connected with the first sliding block (111) and the second sliding block (112);
the power assembly (2) comprises a driving piece and a screw rod (21) arranged on the upright post (1), the driving piece can drive the screw rod (21) to rotate, the first sliding block (111) is arranged on the screw rod (21), and when the screw rod (21) rotates to drive the first sliding block (111) to move, the first sliding block (111) and the second sliding block (112) move on the sliding rail (11) under the limitation of the connecting rod mechanism (13) and the guide block (12);
the wafer basket supporting seat (3) is connected with the second sliding block (112) through the first connecting rod (231) and is used for supporting and fixing the wafer basket;
the wafer supporting seat (4) is connected with the first sliding block (111) through a second connecting rod (232), the wafer supporting seat (4) comprises a supporting rod (41) connected with the second connecting rod (232), a supporting base (42) arranged above the supporting rod (41), a jacking strip (43) arranged in the middle of the supporting base (42), and a plurality of upward air nozzles (421) are arranged on the supporting base (42);
be provided with connecting block (1110) that have the interface on first slider (111), stand (1) and the opposite side of guide block (12) are provided with connector (15), second connecting rod (232) and bracing piece (41) are hollow structure, when first slider (111) moved to the top, connector (15) can dock with connecting block (1110) to form connector (15) to connecting block (1110) to second connecting rod (232) to bracing piece (41) and then to the gas passageway of air jet (421).
2. The wafer cleaning and drying lifting mechanism with air injection function according to claim 1, wherein,
the second connecting rod (232) comprises a horizontal part (2321) and a vertical part (2322), a joint (2320) is arranged at the top of the second connecting rod (232), and the joint (2320) is connected with the connecting block (1110) through a pipeline (2324).
3. The wafer cleaning and drying lifting mechanism with the air injection function according to claim 2, wherein the air injection ports (421) are arranged in two rows and are respectively located at two sides of the jacking strip (43).
4. A wafer cleaning and drying lifting mechanism with an air injection function according to claim 3, wherein the jack-up strip (43) is provided with grooves for accommodating wafers, and the air injection port (421) is arranged between each groove.
5. The wafer cleaning and drying lifting mechanism with the air injection function according to claim 4, wherein two rows of air injection ports (421) are arranged in a staggered manner.
6. The wafer cleaning and drying lifting mechanism with the air injection function according to claim 1, wherein the connecting head (15) is provided with a guide post and is matched with a guide hole on the connecting block (1110).
7. The wafer cleaning and drying lifting mechanism with air injection function according to claim 1, wherein a position sensor is further arranged beside the connection block (1110) to sense whether the connection head (15) is in butt joint with the connection block (1110).
8. The wafer cleaning and drying lifting mechanism with the air injection function according to claim 1, wherein the wafer basket supporting seat (3) and the wafer supporting seat (4) are two arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310549654.9A CN116544144B (en) | 2023-05-16 | 2023-05-16 | Wafer cleaning, drying and lifting mechanism with air injection function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310549654.9A CN116544144B (en) | 2023-05-16 | 2023-05-16 | Wafer cleaning, drying and lifting mechanism with air injection function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116544144A CN116544144A (en) | 2023-08-04 |
| CN116544144B true CN116544144B (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310549654.9A Active CN116544144B (en) | 2023-05-16 | 2023-05-16 | Wafer cleaning, drying and lifting mechanism with air injection function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116544144B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031107A (en) * | 1998-05-07 | 2000-01-28 | Sony Corp | Device and method for drying semiconductor substrate |
| JP2008251657A (en) * | 2007-03-29 | 2008-10-16 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| CN111785663A (en) * | 2020-07-10 | 2020-10-16 | 华海清科股份有限公司 | Wafer post-processing system |
| CN215430548U (en) * | 2021-08-27 | 2022-01-07 | 重庆康佳光电技术研究院有限公司 | Cleaning equipment |
| CN115295441A (en) * | 2022-06-20 | 2022-11-04 | 江苏亚电科技有限公司 | Wafer drying and cleaning equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080066339A1 (en) * | 2006-09-14 | 2008-03-20 | Mike Wallis | Apparatus and method for drying a substrate |
-
2023
- 2023-05-16 CN CN202310549654.9A patent/CN116544144B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031107A (en) * | 1998-05-07 | 2000-01-28 | Sony Corp | Device and method for drying semiconductor substrate |
| JP2008251657A (en) * | 2007-03-29 | 2008-10-16 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| CN111785663A (en) * | 2020-07-10 | 2020-10-16 | 华海清科股份有限公司 | Wafer post-processing system |
| CN215430548U (en) * | 2021-08-27 | 2022-01-07 | 重庆康佳光电技术研究院有限公司 | Cleaning equipment |
| CN115295441A (en) * | 2022-06-20 | 2022-11-04 | 江苏亚电科技有限公司 | Wafer drying and cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116544144A (en) | 2023-08-04 |
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