CN1165428C - Mini projection head with driving circuit and its making method - Google Patents
Mini projection head with driving circuit and its making method Download PDFInfo
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- CN1165428C CN1165428C CNB011123575A CN01112357A CN1165428C CN 1165428 C CN1165428 C CN 1165428C CN B011123575 A CNB011123575 A CN B011123575A CN 01112357 A CN01112357 A CN 01112357A CN 1165428 C CN1165428 C CN 1165428C
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- Prior art keywords
- bubble
- drive circuit
- fluid
- projection head
- fluid cavity
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- 238000000034 method Methods 0.000 title abstract description 7
- 239000012530 fluid Substances 0.000 claims description 87
- 239000007921 spray Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 22
- 208000002925 dental caries Diseases 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910001362 Ta alloys Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229910018594 Si-Cu Inorganic materials 0.000 claims description 3
- 229910008465 Si—Cu Inorganic materials 0.000 claims description 3
- LRTTZMZPZHBOPO-UHFFFAOYSA-N [B].[B].[Hf] Chemical compound [B].[B].[Hf] LRTTZMZPZHBOPO-UHFFFAOYSA-N 0.000 claims description 3
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 230000005669 field effect Effects 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical group 0.000 claims 2
- 239000007788 liquid Substances 0.000 abstract description 17
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 8
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 56
- 238000005530 etching Methods 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012377 drug delivery Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- -1 Aluminum-Silicon-Copper Chemical compound 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVMHUALAQYRRBM-UHFFFAOYSA-N [P].[P] Chemical compound [P].[P] QVMHUALAQYRRBM-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000520 microinjection Methods 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/1437—Back shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micro-Organisms Or Cultivation Processes Thereof (AREA)
- Reciprocating Pumps (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
The present invention relates to a minitype jet head with a drive circuit and a making method thereof, which uses bubbles as a virtual air valve to jet liquid. The minitype jet head comprises one branch pipe, more than one liquid cavity, more than one pair of first bubble generating components and second bubble generating components, more than one jet hole, and one drive circuit, wherein the drive circuit is used for simultaneously controlling more than one pair of first bubble generating components and second bubble generating components to jet liquid corresponding to the inner part of the liquid cavity from the corresponding jet hole achieve the effect of jetting the liquid. Since the drive circuit and the bubble generating components are integrated on the same base plate, manufacturing process steps are decreased and the number of circuit elements and connecting wires is decreased.
Description
Technical field
The present invention relates to a kind of mini projection head (Microinject head), relate in particular to a kind of mini projection head that has drive circuit (Driving circuitry) and be formed in one.
Background technology
Now, liquid pearl injector is widely used in the printing of ink-jet printer, yet, liquid pearl injector also has numerous other may use, for example: fuel injection system (Fuel injection systems), cell classification (Cell sorting), drug delivery system (Drug delivery systems), direct spray printing photolithography (Direct print lithography) and micro-injection propulsion system (Micro jet propulsion systems) etc., the common ground of above-mentioned all application is that it all must one reliable (Reliable) and low cost, and the liquid pearl injector that the high-quality drop of high-frequency (Frequency) and high spatial resolution (Spatial resolution) can be provided.
Yet, have only several devices can individually penetrate the drop of shape unanimity, known at present and in the liquid pearl spraying system that is used, utilize heat drive bubble (Thermal driven bubble) in the mode that penetrates the liquid pearl because simple and cost is quite cheap, be in this device therefore than successful design always.
At U.S.Pat.No.6,102, once mentioned a liquid pearl injection apparatus with virtual air valve (Virtual valve) among the 530-" with bubble as the apparatus and method (Apparatus and method for using bubbles as virtual valvein microinjector to eject fluid) of the virtual air valve in the micro ejector " with atomizing of liquids, as shown in Figure 1, heater is looped around around the spray-hole, difference by heater resistance value, position at the close nozzle of fluid cavity when making heating produces one first bubble earlier, isolated fluid cavity of this first bubble and nozzle, and produce the function of similar air valve, can reduce to produce the effect of mutual interference mutually (Cross talk) with adjacent fluid chambers; Then produce second bubble, this second bubble makes fluid spray from spray orifice in order to push fluid, and is last, second bubble and with first bubble incorporation, by the combination of this two bubble to reach the generation that reduces satellite ink droplet (Satellite droplet).
In addition, at U.S.Pat.No.5,122, once mentioned a kind of ink gun structure (as shown in Figure 2) among the 812-" the hot ink jet printing head and the manufacture method (Thermal inkjet printhead having driver circuitry thereon andmethod for making the same) thereof that have drive circuit on it " with drive circuit, system with heating element heater and drive circuit integration and making on same substrate (Substrate), yet the required number of steps of its manufacturing process is still many, and also must form the thick film (Barrier layer) 130 that a thickness reaches 20～30 μ m according to its structure, a nozzle flat board (Orifice plate) 140 fit again on thick film, this kind practice can be because of the spatial resolution of build-up tolerance (Assembly tolerance) limits nozzle of necessity, in addition, the applying formality may not be compatible to IC manufacturing process, when array of microjets (Array) and drive circuit need be integrated into one to reduce distribution and to guarantee to encapsulate when tight, this inconsistent problem will more highlight, therefore, this manufacturing process is not only comparatively loaded down with trivial details, also higher relatively on the cost, so provide a kind of cost lower now, the manufacturing process step is less, and can reach the little liquid pearl injector head with driving circuit structure and become instant trend.
Summary of the invention
The main purpose of the present invention promptly is that a kind of mini projection head with drive circuit will be provided, system produces member and second bubble generation member in order to control a pair of first above bubble simultaneously, the fluid of an above fluid cavity inside is sprayed by spray orifice, to reach the effect of ejecting fluid by many spray orifices.
Another object of the present invention promptly is that a kind of preparation method with mini projection head of drive circuit will be provided, system is in order to be integrated in drive circuit and bubble generation member on the same substrate, the manufacturing process number of steps is less, and is the structure of a component and connection line negligible amounts.
According to an aspect of the present invention, a kind of mini projection head with drive circuit is provided, it comprises: the substrate that has a dielectric layer on it, this dielectric layer comprises one first position and one second position, wherein, on first position of this dielectric layer, be formed with one drive circuit, it comprises the more than one function element, and in second position of the part that overlaps with this second position of this substrate and this dielectric layer, be formed with a manifold and more than one fluid cavity, this manifold is connected with this fluid cavity, with accommodating fluid to this fluid cavity; Be formed on second position of this dielectric layer and cover a low-stress material layer of those fluid cavitys bottoms, have more than one spray orifice in this low-stress material layer, those spray orifices are connected above those fluid cavitys and with corresponding fluid cavity; And a plurality of bubble generators that are formed on this low-stress material layer and are connected with this drive circuit, wherein, this drive circuit transmits a signal respectively independently to other this bubble generator, and in order to drive these a plurality of bubble generators.
According to another aspect of the present invention, a kind of mini projection head with drive circuit is provided, it comprises: the substrate with first and second positions, this substrate has a dielectric layer on first position, on second position, has a sacrifice layer, wherein, on this dielectric layer, be formed with one drive circuit, it comprises the more than one function element, and in this second position of this substrate and this sacrifice layer, be formed with a manifold and more than one fluid cavity, this manifold is connected with this fluid cavity, with accommodating fluid to this fluid cavity; Be formed on this sacrifice layer and cover a low-stress material layer of those fluid cavitys bottom, have more than one spray orifice in this low-stress material layer, those spray orifices are connected above those fluid cavitys and with corresponding fluid cavity; And a plurality of bubble generators that are formed on this low-stress material layer and are connected with this drive circuit, wherein, this drive circuit transmits a signal respectively independently to other this bubble generator, and in order to drive these a plurality of bubble generators.
According to the disclosed mini projection head of the present invention with drive circuit, it comprises more than one fluid cavity, a manifold, more than one spray orifice, a pair of above bubble generator and one drive circuit, and wherein the bubble generator comprises one first bubble generation member and one second bubble generation member.
Wherein, manifold system is connected with fluid cavity, in order to accommodating fluid to fluid cavity; And more than one spray orifice is to be connected with corresponding fluid cavity.
And first bubble generation member is disposed near corresponding spray orifice with second bubble generation member system, and be positioned at the top of corresponding fluid cavity, when the fluid cavity of correspondence is full of fluid, first bubble produces member and produces one first bubble with as a virtual air valve in fluid cavity, after first bubble produces, second bubble produces member and produces one second bubble, is penetrated by spray orifice to cause the fluid in the fluid cavity.
In addition, drive circuit system comprises the more than one function element, and producing member with a pair of first above bubble generation member and second bubble is formed on the same substrate, drive circuit is in order to transmit a signal respectively independently to other bubble generator, and in order to driving a pair of above bubble generator, reach the effect of controlling a pair of above bubble generator simultaneously with this.
The disclosed preparation method according to the present invention with mini projection head of drive circuit, it comprises: a substrate is provided, on substrate, form drive circuit again, and drive circuit system comprises the more than one function element, forms sacrifice layer again on substrate, and does not cover drive circuit, or utilize when forming drive circuit, the dielectric materials layer of the superiors then, forms a low-stress material layer on sacrifice layer as sacrifice layer; Etching substrates and sacrifice layer are forming a manifold and more than one fluid cavity again, and manifold system is connected with fluid cavity, with accommodating fluid to fluid cavity.
Moreover, form a pair of first above bubble generation member and second bubble and produce member on the low-stress material layer, and be connected with drive circuit; Form more than one spray orifice at last, be between first bubble generation member and second bubble generation member of correspondence, and be communicated with corresponding fluid cavity, so can finish a mini projection head that has drive circuit and be formed in one with ejecting fluid.
Description of drawings
Fig. 1 is the three-dimensional structure diagram that prior art has the injection apparatus of virtual air valve function;
Fig. 2 is the section of structure that prior art has the ink gun of drive circuit; And
Fig. 3～9 are that the present invention makes the mini projection head step with drive circuit and the structural representation of mini projection head thereof, and wherein, Fig. 9 is the complete structure schematic diagram of the mini projection head of the present invention with drive circuit.
Figure 10～12 are that another embodiment of the present invention making has the mini projection head step of drive circuit and the structural representation of mini projection head thereof.
The symbol description of accompanying drawing
10 arrays, 12 micro ejectors
14 fluid cavitys, 16 manifolds
18 spray orifices, 20 primary heaters
22 secondary heaters, 24 common electrodes
26 fluids, 38 substrates
40 sacrifice layers, 42 low stress layer
44 conductive layers, 45,46 low temperature oxide layers
50 second positions, 51 dielectric layers
52 first positions, 101 thin oxide layers
102 silicon nitride layers, 105 polysilicon gates
107 drain electrodes of 106 source electrodes
130 thick films, 140 nozzle flat boards
The specific embodiment
At first, please refer to the structure shown in " Fig. 1 ", an array 10 arrays 10 that are a micro ejector 12 comprise a plurality of micro ejectors that adjoin each other 12, and each micro ejector comprises a fluid cavity (Chamber) 14, a manifold (Manifold) 16, a spray orifice (Orifice) 18, a primary heater 20 and a secondary heater 22.Primary heater 20 and secondary heater 22 are with (Inseries) electrode to community electrode (Common electrode) 24 that is connected in series.
Wherein, system fills up with fluid 26 in the fluid cavity 14, and fluid 26 can comprise but be not limited to following fluid: similar substances such as ink, gasoline, oils, chemicals (Chemicals), biological medicine solution (Biomedicalsolution) and water, and select for use which kind of fluid system to depend on specific application scenario.
Yet the present invention controls a pair of above primary heater 20 and secondary heater 22 simultaneously in order to reach, and can reach this purpose so need add one drive circuit again in mini projection head.
Shown in Fig. 3～5; desire is made in a substrate 38 with the array of microjets 10 of a tool drive circuit; on Silicon Wafer (Si wafer); at first; form a thin oxide layer 101 on substrate 38; then form a silicon nitride (SiNx) layer 102 on thin oxide layer (as shown in Figure 3); after silicon nitride 102 made exposure imaging; carry out etching (as shown in Figure 4); utilize the not protected thin oxide layer 101 of partial thermal oxidation method (Local oxidation) oxidation again, to form field oxide (Field oxide).So far a dielectric layer 51 (see figure 5)s of Xing Chenging include one first position 52 and one second position 50, first position 52 is the part that thin oxide layer 101 is covered by silicon nitride layer 102, and second position 50 then is by the formed field oxide of partial thermal oxidation method.This field oxide can be in follow-up manufacturing process in addition etching, to form fluid cavity 14.Afterwards, remove silicon nitride layer 102 again, blanket type cloth is planted boron ion (Blanket boronimplant) on first position 52 and second position 50 (as shown in Figure 5), to adjust the starting voltage (Threshold voltage) of drive circuit, form a polysilicon gate (Polysilicon gate) 105 again on first position 52, and impose ion cloth plant phosphorus (phosphorus) so far polysilicon gate 105 to reduce its resistance value, ion cloth is planted arsenic (Arsenic) ion in substrate 38 more at last, to form one source pole (Source) 106 and drain electrode (Drain) 107 adjacent gate, so far can on substrate 38, form more than one function element (as shown in Figure 6).
Please refer to Fig. 7, it lies in deposition one low stress layer (Low stresslayer) 42 on second position 50, as silicon nitride (SiNx) material, with the upper strata as fluid cavity 14.
Please refer to Fig. 8, next, use etching solution potassium hydroxide (KOH) from the back etched of substrate 38 to form manifold 16, as supplying with the main runner that fluid enters, then again second position 50 is removed with etching solution hydrofluoric acid (HF).Accurately control again and carry out the etching of another time with etching solution potassium hydroxide (KOH) under the etching period, in order to strengthen the degree of depth of fluid cavity 14, so fluid cavity 14 is connected with manifold 16 and fills up fluid; During carrying out this etching step, need give special heed to, because the shape of circular arc also can be attacked and can be etched into to the salient angle of fluid cavity 14 (Convex corner).
Deposited heater again, wherein heater includes primary heater 20 and secondary heater 22, and it is carried out design transfer (Patterning), for primary heater 20 and secondary heater 22, preferable material is aluminium tantalum alloy (Alloys of tantalum and aluminum), and other materials such as platinum (Platinum), hafnium boride (HfB2) etc. also can reach same function; In addition; in order to protect primary heater 20 and secondary heater 22 and to isolate this more than one function element; so on whole base plate 38, the scope that comprises grid 105, source electrode 106, drain electrode 107 and second position 50 deposits a low temperature oxide layer 45 again with as protective layer.
Then, on primary heater 20 and secondary heater 22, form conductive layer (Conductivelayer) 44, function element in order to conducting primary heater 20, secondary heater 22 and drive circuit, wherein, drive circuit system is in order to transmit a signal respectively independently to other heater (primary heater 20 and secondary heater 22), and, so can utilize the component of negligible amounts and the effect that connection line reaches same circuits control in order to drive a pair of above heater (primary heater 20 and secondary heater 22).For example: in the present embodiment, primary heater 20 is to be connected in series with secondary heater 22, drive circuit utilizes the mode of matrix (matrix) to control a plurality of bubble generators, for example the bubble generator of row is switched on simultaneously, another row then enters in order to difference transmission signal (or title information), reaches the function that can control other primary heater 20 and secondary heater 22 separately.Conductive layer 44 preferable materials then are as Al-Si-Cu alloy (Alloys of Aluminum-Silicon-Copper), aluminium (Aluminum), copper (Copper), gold (Gold) or tungsten metal materials such as (Tungsten); Then deposit again a low temperature oxide layer 46 on conductive layer 44 with as protective layer.
At last, please refer to Fig. 9, spray orifice 18 forms between primary heater 20 and secondary heater 22, if the live width of photolithography (Lithography) tolerable 3 μ m, then spray orifice 18 can be as small as 2 μ m approximately, and the spacing (Pitch) between spray orifice 18 and the contiguous spray orifice can be as small as 15 μ m approximately.So far, can form one-body molded and have the array of microjets of drive circuit, not only drive circuit and heater can be integrated on the same substrate, and not need to stick in addition the structure that the nozzle flat board can be finished whole mini projection head.
Below will introduce another embodiment of the present invention.Different with the foregoing description is that the manufacturing process system shown in the foregoing description Fig. 7,8,9 directly touches second position 50 shown in the needle drawing 6, to form fluid cavity 14.Present embodiment is second position 50 of first etching part then, and forms a sacrifice layer 40 in addition on the position of this etched part, carries out follow-up manufacturing process again on this sacrifice layer 40.Please refer to the manufacturing process that Figure 10, Figure 10 are hookup 6, earlier carry out second position 50 shown in Figure 6 partially-etched, and deposit an oxide layer in addition and do not cover on substrate 38 positions of drive circuit in this, with as after the sacrifice layer (Sacrificial layer) 40 of fluid cavity 14 (with reference to Figure 11), then deposit again a low stress layer 42 ', as the upper strata of fluid cavity 14.
Next please refer to Figure 11,12.Figure 11,12 is the Figure 10 that continues, and similar with Fig. 8,9 described manufacturing process.As shown in figure 11, at first, to form manifold 16 and fluid cavity 14, deposit the low temperature oxide layer 45 of primary heater 20, secondary heater 22 and tool protective effect again from back etched substrate 38 and sacrifice layer 40.Come again, form conductive layer 44 with conducting first, second heater 20,22 and drive circuit, and deposit another low temperature oxide layer 46 on conductive layer 44 with as protective layer.At last, as shown in figure 12, form spray orifice 18 between primary heater 20 and secondary heater 22, so also can finish one-body molded and have the array of microjets of drive circuit with photolithography.Certainly, above-described manufacturing process step can be adjusted the manufacturing process sequence of steps according to situation, is not limited to aforesaid order, also can form identical little liquid pearl injector head with drive circuit.
Disclosed according to the present invention have little liquid pearl injector head of drive circuit and preparation method thereof, and its effect is:
1. the little liquid pearl injection nozzle structure after a kind of improve is provided, can be applicable to as technology such as inkjet printing aspects;
2. a kind of integrated little liquid pearl injector head is provided, drive circuit and heater are integrated on the same substrate, and do not need to stick in addition the nozzle flat board and can finish overall structure;
3. it is less to finish the required manufacturing process number of steps of overall structure, can simplify required manufacturing process step; And
4. integrally-built component and connection line negligible amounts can reduce cost of manufacture, and can reach the effect of same circuits control.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to limit the present invention; any insider; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim scope person of defining.
Claims (16)
1. mini projection head with drive circuit, it comprises:
The substrate that has a dielectric layer on it, this dielectric layer comprises one first position and one second position, wherein, on first position of this dielectric layer, be formed with one drive circuit, it comprises the more than one function element, and be formed with a manifold and more than one fluid cavity in second position of the part that overlaps with this second position of this substrate and this dielectric layer, this manifold is connected with this fluid cavity, with accommodating fluid to this fluid cavity;
Be formed on second position of this dielectric layer and cover a low-stress material layer of those fluid cavitys bottoms, have more than one spray orifice in this low-stress material layer, those spray orifices are connected above those fluid cavitys and with corresponding fluid cavity; And
The a plurality of bubble generators that are formed on this low-stress material layer and are connected with this drive circuit,
Wherein, this drive circuit transmits a signal respectively independently to other this bubble generator, and in order to drive these a plurality of bubble generators.
2. the mini projection head that has drive circuit according to claim 1, wherein this function element is a transistor.
3. as having the mini projection head of drive circuit as described in the claim 2, wherein this transistor is a metal oxide semiconductcor field effect transistor.
4. the mini projection head that has drive circuit according to claim 1, wherein this bubble generator comprises one first bubble generation member and one second bubble generation member, around this first bubble produces member and this second bubble generation member is disposed at corresponding spray orifice, when this corresponding fluid cavity is full of fluid, this first bubble produces member and produces one first bubble with as a virtual air valve in this fluid cavity, after this first bubble produces, this second bubble produces member and produces one second bubble, is penetrated by this spray orifice to cause the fluid in this fluid cavity.
5. as having the mini projection head of drive circuit as described in the claim 4, wherein this first bubble produces member and comprises a primary heater, and this second bubble produces member and comprises a secondary heater.
6. as having the mini projection head of drive circuit as described in the claim 5, wherein this first bubble produces member and also comprises a conductive layer with this second bubble generation member.
7. as having the mini projection head of drive circuit as described in the claim 6, wherein the material of this conductive layer system is selected from any one in the group that aluminium, gold, copper, tungsten and Al-Si-Cu alloy constitute.
8. as having the mini projection head of drive circuit as described in the claim 5, wherein the material of this primary heater and this secondary heater system be selected from aluminium tantalum alloy, platinum, and group that hafnium boride constituted in any one.
9. mini projection head with drive circuit, it comprises:
Substrate with first and second positions, this substrate has a dielectric layer on first position, on second position, has a sacrifice layer, wherein, be formed with one drive circuit on this dielectric layer, it comprises the more than one function element, and is formed with a manifold and more than one fluid cavity in this second position of this substrate and this sacrifice layer, this manifold is connected with this fluid cavity, with accommodating fluid to this fluid cavity;
Be formed on this sacrifice layer and cover a low-stress material layer of those fluid cavitys bottom, have more than one spray orifice in this low-stress material layer, those spray orifices are connected above those fluid cavitys and with corresponding fluid cavity; And
The a plurality of bubble generators that are formed on this low-stress material layer and are connected with this drive circuit,
Wherein, this drive circuit transmits a signal respectively independently to other this bubble generator, and in order to drive these a plurality of bubble generators.
10. as having the mini projection head of drive circuit as described in the claim 9, wherein this function element is a transistor.
11. as having the mini projection head of drive circuit as described in the claim 10, wherein this transistor is a metal oxide semiconductcor field effect transistor.
12. as having the mini projection head of drive circuit as described in the claim 9, wherein this bubble generator comprises one first bubble generation member and one second bubble generation member, around this first bubble produces member and this second bubble generation member is disposed at corresponding spray orifice, when this corresponding fluid cavity is full of fluid, this first bubble produces member and produces one first bubble with as a virtual air valve in this fluid cavity, after this first bubble produces, this second bubble produces member and produces one second bubble, is penetrated by this spray orifice to cause the fluid in this fluid cavity.
13. as having the mini projection head of drive circuit as described in the claim 12, wherein this first bubble produces member and comprises a primary heater, and this second bubble produces member and comprises a secondary heater.
14. as having the mini projection head of drive circuit as described in the claim 13, wherein this first bubble produces member and also comprises a conductive layer with this second bubble generation member.
15. as having the mini projection head of drive circuit as described in the claim 14, wherein the material of this conductive layer system is selected from any one in the group that aluminium, gold, copper, tungsten and Al-Si-Cu alloy constitute.
16. as having the mini projection head of drive circuit as described in the claim 13, wherein the material of this primary heater and this secondary heater system be selected from aluminium tantalum alloy, platinum, and group that hafnium boride constituted in any one.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011123575A CN1165428C (en) | 2001-04-03 | 2001-04-03 | Mini projection head with driving circuit and its making method |
| EP01983414A EP1375149B1 (en) | 2001-04-03 | 2001-08-20 | Microinjector having drive circuit and method for making the same |
| PCT/CN2001/001230 WO2002081224A1 (en) | 2001-04-03 | 2001-08-20 | Microinjector having drive circuit and method for making the same |
| DE60130806T DE60130806T2 (en) | 2001-04-03 | 2001-08-20 | MICROINJECTION DEVICE WITH A CONTROL CIRCUIT AND METHOD FOR THE PRODUCTION THEREOF |
| AT01983414T ATE374693T1 (en) | 2001-04-03 | 2001-08-20 | MICROINJECTION DEVICE WITH CONTROL CIRCUIT AND METHOD FOR PRODUCING THE SAME |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011123575A CN1165428C (en) | 2001-04-03 | 2001-04-03 | Mini projection head with driving circuit and its making method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101237247A Division CN1526481A (en) | 2001-04-03 | 2001-04-03 | Manufacture of micro jetting head with drive circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1377734A CN1377734A (en) | 2002-11-06 |
| CN1165428C true CN1165428C (en) | 2004-09-08 |
Family
ID=4659270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011123575A Expired - Fee Related CN1165428C (en) | 2001-04-03 | 2001-04-03 | Mini projection head with driving circuit and its making method |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1375149B1 (en) |
| CN (1) | CN1165428C (en) |
| AT (1) | ATE374693T1 (en) |
| DE (1) | DE60130806T2 (en) |
| WO (1) | WO2002081224A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317736C (en) * | 2003-08-14 | 2007-05-23 | 明基电通股份有限公司 | Method for preparing monolithic fluid spraying appratus |
| CN106945202A (en) * | 2010-02-11 | 2017-07-14 | 谭永杰 | A kind of system and method for manufacturing microstructure |
| TWI763992B (en) * | 2019-05-06 | 2022-05-11 | 萬潤科技股份有限公司 | Liquid material extrusion device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695853A (en) * | 1986-12-12 | 1987-09-22 | Hewlett-Packard Company | Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture |
| EP0317171A3 (en) * | 1987-11-13 | 1990-07-18 | Hewlett-Packard Company | Integral thin film injection system for thermal ink jet heads and methods of operation |
| US4947192A (en) * | 1988-03-07 | 1990-08-07 | Xerox Corporation | Monolithic silicon integrated circuit chip for a thermal ink jet printer |
| ATE116599T1 (en) * | 1989-01-13 | 1995-01-15 | Canon Kk | RECORDING HEAD. |
| US5122812A (en) * | 1991-01-03 | 1992-06-16 | Hewlett-Packard Company | Thermal inkjet printhead having driver circuitry thereon and method for making the same |
| CN1274499C (en) * | 1998-01-23 | 2006-09-13 | 明碁电通股份有限公司 | Apparatus and method for using bubble as virtual valve in microinjector to eject fluid |
-
2001
- 2001-04-03 CN CNB011123575A patent/CN1165428C/en not_active Expired - Fee Related
- 2001-08-20 DE DE60130806T patent/DE60130806T2/en not_active Expired - Fee Related
- 2001-08-20 EP EP01983414A patent/EP1375149B1/en not_active Expired - Lifetime
- 2001-08-20 AT AT01983414T patent/ATE374693T1/en not_active IP Right Cessation
- 2001-08-20 WO PCT/CN2001/001230 patent/WO2002081224A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN1377734A (en) | 2002-11-06 |
| EP1375149A1 (en) | 2004-01-02 |
| WO2002081224A1 (en) | 2002-10-17 |
| DE60130806D1 (en) | 2007-11-15 |
| EP1375149A4 (en) | 2005-05-04 |
| ATE374693T1 (en) | 2007-10-15 |
| DE60130806T2 (en) | 2008-07-03 |
| EP1375149B1 (en) | 2007-10-03 |
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