CN116528465A - Lamination shape-preserving mode for solving HTCC ceramic lamination process - Google Patents
Lamination shape-preserving mode for solving HTCC ceramic lamination process Download PDFInfo
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- CN116528465A CN116528465A CN202310812820.XA CN202310812820A CN116528465A CN 116528465 A CN116528465 A CN 116528465A CN 202310812820 A CN202310812820 A CN 202310812820A CN 116528465 A CN116528465 A CN 116528465A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 71
- 238000003475 lamination Methods 0.000 title claims abstract description 50
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 18
- 229910052573 porcelain Inorganic materials 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 13
- 230000014759 maintenance of location Effects 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 abstract description 22
- 238000002955 isolation Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 4
- 235000017491 Bambusa tulda Nutrition 0.000 description 4
- 241001330002 Bambuseae Species 0.000 description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 4
- 239000011425 bamboo Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention provides a lamination shape-preserving mode for solving the problem of HTCC ceramic lamination in the field of semiconductor devices, which comprises a raw ceramic tape, wherein a concave is arranged on the surface of the raw ceramic tape, a preserving plate is arranged on the inner side of the raw ceramic tape and is connected with the concave in a sliding embedded manner, the side surface of the preserving plate is contacted with the concave on the surface of the raw ceramic tape, the top of the preserving plate is connected with a buffer pad, the strength of the preserving plate is close to that of ceramic in an inner cavity of the raw ceramic tape, the preserving plate can be matched with the buffer pad to fill the concave in the raw ceramic tape, so that the inner cavity of the ceramic is kept complete, deformation in the lamination process caused by direct lamination is avoided, meanwhile, the buffer pad is arranged, a layer of buffer isolation is formed between the preserving plate and the ceramic pressing material, the ceramic pressing material can be prevented from being directly contacted with the surface of the preserving plate, and the bottom layer slip of the ceramic pressing material is reduced.
Description
Technical Field
The application relates to the field of semiconductor devices, in particular to a lamination and shape retention mode for solving the problem of HTCC ceramic lamination.
Background
Compared with an LTCC ceramic substrate, because the sintering temperature is high, the HTCC cannot adopt low-melting-point metal materials such as gold, silver and copper, and refractory metal materials such as tungsten, molybdenum and manganese are needed, so that the HTCC substrate has the advantages of high structural strength, high heat conductivity, good chemical stability, high wiring density and the like, and is widely applied to the fields of high-reliability microelectronic integrated circuits, high-power micro-assembly circuits, vehicle-mounted high-power circuits and the like, however, in the production process of the HTCC ceramic substrate and the LTCC ceramic substrate, the HTCC ceramic substrate and the LTCC ceramic substrate are required to be subjected to tape casting, cutting, punching, hole filling printing, lamination, sintering and the like, and the difference is only the difference of sintering temperatures.
In the existing HTCC ceramic substrate lamination process, the corresponding operation is generally carried out by adopting a mode of directly laminating or modifying the size of a suspended structure, which is not beneficial to the product design of the ceramic substrate.
Therefore, we propose a lamination and shape-keeping mode for solving the problem of HTCC ceramic lamination, and the lamination deformation of the ceramic substrate can be avoided in the lamination process by putting a material with the compressive strength close to that of ceramic into the inner cavity of the green ceramic tape.
Disclosure of Invention
This application aim at improves the processing to current ceramic lamination structure, compare prior art and provide a laminating conformal mode of solving HTCC ceramic pressfitting process, including raw porcelain area, the surface of raw porcelain area is equipped with the sunken, the inboard of raw porcelain area has been arranged the conformal board, and the conformal board is connected with sunken slip gomphosis, the side surface of conformal board and the sunken contact on raw porcelain area surface, the top of conformal board is connected with the blotter, the intensity of conformal board is close to the intensity of ceramic in the raw porcelain area inner chamber, and can cooperate with the blotter, fill the sunken of raw porcelain area for ceramic inner chamber keeps intact, and then avoid the lamination in-process that direct lamination leads to take place the deformation, simultaneously, the setting of blotter, can also form one deck buffering isolation between the conformal board and the ceramic swager, the protection conformal board in the time of can also avoid ceramic swager direct and the surperficial emergence contact of conformal board, reduce the ceramic swager and take place the bottom accident of skidding.
Further, the cushion pad is buried in the middle of the cushion pad, the cushion pad is embedded in the cushion pad and is provided with an inflatable sleeve symmetrically arranged relative to the cushion pad, the surface of the inflatable sleeve is connected with a ventilation hose in a penetrating and sealing mode, and the tail end of the ventilation hose is connected with the surface of the cushion pad in a penetrating and sealing mode.
Further, the cross-sectional length of the surface recess of the raw porcelain belt is not smaller than that of the inflation sleeve, and the inflation sleeve is positioned below the end part of the surface recess of the raw porcelain belt.
Further, the cushion pad is made of wear-resistant rubber materials, and the conformal plate is made of pressure-resistant materials.
Further, the distance between the inflatable sleeve and the top surface of the cushion is less than one half the thickness of the cushion itself.
Further, the height value of the surface concave of the green porcelain belt is not smaller than the sum of the thickness values of the cushion pad and the conformal plate.
Optionally, the internally mounted of guarantor's board has an inflation slide section of thick bamboo, and the inside sliding connection who inflates the slide section of thick bamboo has sealed slide, and the top of sealed slide installs the positioning cylinder, and the top of positioning cylinder and the interior roof contact of guarantor's board, and the fixed surface of positioning cylinder is connected with the stay cord, and the tail end of stay cord runs through and extends to the below of guarantor's board, and the bottom of guarantor's board is connected with the sucking disc seat, and the sucking disc seat can be dismantled with the tail end of stay cord and be connected.
Optionally, the surface mounting of sucking disc seat has the registration arm, and the inner wall of registration arm is equipped with the screw thread, and the tail end connection of stay cord has the screw thread spare, and screw thread spare and registration arm phase-match.
Optionally, the inflatable sliding cylinder and the sealing sliding plate form a resistance cavity, the interior of the resistance cavity is filled with gas, and the air pressure in the resistance cavity is not less than the air pressure outside the retaining plate.
Optionally, the bottom coating of conformal board has mirror surface coating, and the sucking disc seat is two tip through connection's sucking disc constitution, and the medial surface coating of sucking disc seat has the light source structure, and the surface coating of sucking disc seat has shading coating.
Compared with the prior art, the advantage of this application lies in:
(1) The intensity of conformal board is close to the intensity of ceramic in the ceramic tape inner chamber, and can with the blotter cooperation, fills the sunken ceramic tape that will give birth to for ceramic inner chamber remains complete, and then takes place to warp in the lamination process that the direct lamination leads to, simultaneously, the setting of blotter can also form one deck buffering isolation between the conformal board and the ceramic swage, when protecting the conformal board, can also avoid the ceramic swage to directly take place to contact with the surface of conformal board, reduces the ceramic swage and takes place the bottom accident of skidding.
(2) When in lamination, the inflatable cushion plate positioned at the middle part of the cushion pad is extruded so as to enable the inflatable sleeve to bulge, and the gap between the cushion pad and the surface concave of the raw porcelain belt is supplemented to form interception, so that the ceramic pressing material is prevented from being displaced in lamination, and the shape retaining effect of the shape retaining plate is enhanced.
(3) When in lamination, the top end of the conformal plate is slightly deformed to drive the positioning cylinder to press down, and at the moment, the positioning cylinder has a tendency of driving the pull rope to pull the sucker seat to leave the surface of the operation table, so that the lamination acting force is subjected to the reaction force formed by the adsorption action between the sucker seat and the surface of the operation table and the air pressure action between the resistance cavities below the sliding sealing sliding plate, thereby reducing the lamination destructive action of the lamination action on the conformal plate and enhancing the compression resistance of the conformal plate.
(4) When the pressing action has overcome the adsorption action between the sucker seat and the surface of the operating platform, the pull rope drives the edge of the sucker seat to tilt, light rays emitted by the light source structure are not blocked by the shading coating any more, reflection and diffusion can be achieved through the mirror coating, people can check the fluorescence phenomenon below the protecting plate so as to adjust the air pressure or pressing acting force in the resistance cavity, and the excessive pressing acting force is avoided to damage the protecting plate.
Drawings
FIG. 1 is a schematic view of a green tape and conformal plate mounting structure of the present application;
FIG. 2 is a schematic view of the green tape and conformal sheet and cushion mounting structure of the present application;
FIG. 3 is a cross-sectional view of a cushion of the present application;
FIG. 4 is a schematic view of the operation of the cushion of the present application;
FIG. 5 is a schematic structural view of embodiment 2 of the present application;
FIG. 6 is a cross-sectional view of the conformal plate of example 2 of the present application;
FIG. 7 is an enlarged schematic view of the structure of FIG. 6A of the present application;
FIG. 8 is a schematic view of the installation structure of the pull rope, the positioning tube, the screw and the sucker seat of the present application;
FIG. 9 is a schematic view showing the working state of embodiment 2 of the present application;
fig. 10 is a schematic view showing an operation state of embodiment 3 of the present application.
The reference numerals in the figures illustrate:
1. a raw porcelain belt; 2. a conformal plate; 3. a cushion pad; 4. a mirror coating; 5. a sucker seat; 6. a light source structure; 31. an air-filling sleeve; 32. a ventilation hose; 33. an inflatable backing plate; 51. a pull rope; 52. an inflatable sliding cylinder; 53. a sealing slide plate; 54. a positioning tube; 511. a screw.
Detailed Description
The embodiments will be described in detail and throughout the specification with reference to the drawings, wherein, based on the embodiments in the application, all other embodiments obtained by persons skilled in the art without making creative efforts are within the scope of protection of the application.
Example 1:
the invention provides a lamination shape-preserving mode for solving the problem of HTCC ceramic lamination process, referring to fig. 1-2, the lamination shape-preserving mode comprises a raw ceramic tape 1, wherein the surface of the raw ceramic tape 1 is provided with a dent, a shape-preserving plate 2 is arranged on the inner side of the raw ceramic tape 1, the shape-preserving plate 2 is connected with the dent in a sliding embedded manner, the side surface of the shape-preserving plate 2 is contacted with the dent on the surface of the raw ceramic tape 1, the top of the shape-preserving plate 2 is connected with a buffer pad 3, the buffer pad 3 is made of wear-resistant rubber material, and the shape-preserving plate 2 is made of pressure-resistant material.
Specifically, the intensity of the conformal plate 2 is close to the intensity of the ceramic in the inner cavity of the green ceramic tape 1, and the concave in the green ceramic tape 1 can be filled, so that deformation is avoided in the lamination process caused by direct lamination, in the actual operation process, a layer of buffer isolation can be formed between the conformal plate 2 and the ceramic pressing material through the arrangement of the buffer pad 3, the conformal plate 2 is protected, meanwhile, the ceramic pressing material can be prevented from directly contacting with the surface of the conformal plate 2, and the possibility of bottom slipping accidents of the ceramic pressing material is reduced.
Referring to fig. 3-4, an inflatable cushion plate 33 is buried in a central position inside the cushion pad 3, an inflatable sleeve 31 symmetrically arranged about the inflatable cushion plate 33 is embedded in the cushion pad 3, a ventilation hose 32 is connected to the surface of the inflatable sleeve 31 in a penetrating and sealing manner, and the tail end of the ventilation hose 32 is connected to the surface of the inflatable cushion plate 33 in a penetrating and sealing manner.
Specifically, in order to enhance the filling effect of the cushion pad 3 on the surface recess of the green ceramic tape 1, the ceramic pressing material displaces inside the green ceramic tape 1 during pressing to further cause lamination deformation accidents, during pressing, the middle part of the cushion pad 3 is pressed under the pressing action, at the moment, the inflatable cushion plate 33 positioned at the middle part of the cushion pad 3 is extruded to further enable internal gas to be forced to be transferred into the inflatable sleeve 31 through the ventilation hose 32, the inflatable sleeve 31 bulges to drive the cushion pad 3 at the corresponding part of the cushion pad, and the gap between the cushion pad 3 and the surface recess of the green ceramic tape 1 is replenished to form interception, so that the ceramic pressing material is prevented from displacing during pressing, and the shape retaining effect of the shape retaining plate 2 is enhanced.
The cross-sectional length of the surface recess of the green porcelain tape 1 is not smaller than that of the air inflation sleeve 31, and the air inflation sleeve 31 is positioned below the end of the surface recess of the green porcelain tape 1.
Specifically, the air-filling sleeve 31 is located below the end of the recess near the open end, so that when the air-filling sleeve 31 bulges, the open end of the recess can be blocked, and the relatively smooth vertical side surface is maintained when the ceramic pressing material is pressed in the green ceramic tape 1.
The distance between the air-filled sheath 31 and the top surface of the cushion 3 is less than half the thickness of the cushion 3 itself.
Specifically, the top of the inflatable sleeve 31 is spaced a small distance from the top of the cushion pad 3, so that when the inflatable sleeve 31 bulges, the surface of the cushion pad 3 with quick action can bulge in a labor-saving manner, and a gap between the cushion pad 3 and the recess can be filled quickly.
The height value of the surface concave of the green porcelain belt 1 is not less than the sum of the thickness values of the cushion pad 3 and the conformal plate 2.
In particular, the recessed inner top wall is higher than the top of the cushion pad 3, so that there is a corresponding operating space when replacing the thicker retaining plate 2 to enhance the pressure resistance.
Example 2:
referring to fig. 5 to 9, wherein the same or corresponding parts as in embodiment 1 are designated by the same reference numerals as in embodiment 1, only the differences from embodiment 1 are described below for the sake of brevity. This embodiment 2 is different from embodiment 1 in that: the internally mounted of conformal plate 2 has the smooth section of thick bamboo 52 of aerifing, and the inside sliding connection who aerifys smooth section of thick bamboo 52 has sealed slide 53, and the top of sealed slide 53 is installed the location cylinder, and the top of location cylinder and the interior roof contact of conformal plate 2, and the fixed surface of location cylinder is connected with stay cord 51, and the tail end of stay cord 51 runs through and extends to the below of conformal plate 2, and the bottom of conformal plate 2 is connected with sucking disc seat 5, and sucking disc seat 5 can be dismantled with the tail end of stay cord 51 and be connected.
Specifically, when the protection plate 2 receives the pressfitting effort that the effort is greater than self intensity, probably damage takes place, therefore the compressive action of protection plate 2 needs to be strengthened, before the pressfitting begins, adsorb sucking disc seat 5 lower extreme at flat operation mesa, adsorb the top of sucking disc seat 5 in the bottom of protection plate 2, when the pressfitting, when the slight deformation takes place on protection plate 2 top, can drive the locating cylinder and push down, the locating cylinder drives stay cord 51 pulling sucking disc seat 5 and leaves operation mesa's surface this moment, the pressfitting effort that is applied to protection plate 2 surface receives the reaction force that the adsorption effect between sucking disc seat 5 and the operation panel surface and the atmospheric pressure effect formation between the resistance chamber of sliding seal slide 53 below, with this pressfitting destructive action to protection plate 2's pressfitting of reduction pressfitting effect, strengthen the compressive capacity of protection plate 2.
The surface mounting of sucking disc seat 5 has the locating tube 54, and the inner wall of locating tube 54 is equipped with the screw thread, and the tail end of stay cord 51 is connected with screw 511, and screw 511 and locating tube 54 phase-match.
Specifically, the cooperation of locating tube 54 and screw 511 can make stay cord 51 and screw 511 realize dismantling the connection, and convenient conformal plate 2 realizes dismantling the connection with sucking disc seat 5, and convenient conformal plate 2 and sucking disc seat 5 separately deposit for conformal plate 2 can be flat stack in order to reduce occupation space when packing is deposited.
The inflatable slide cylinder 52 and the sealing slide plate 53 form a resistance cavity, and the interior of the resistance cavity is filled with gas, and the air pressure in the resistance cavity is not less than the air pressure outside the retaining plate 2.
Specifically, the air pressure in the resistance cavity is greater than the air pressure outside the conformal plate 2, so that the air pressure resistance of the positioning cylinder when the positioning cylinder is pressed down under the pressing action is greater, and a good supporting and compression-resisting effect is achieved.
Example 3:
referring to fig. 10, wherein the same or corresponding parts as in embodiment 2 are designated by the same reference numerals as in embodiment 2, only the differences from embodiment 2 are described below for the sake of brevity. This embodiment 3 is different from embodiment 2 in that: the bottom of the conformal plate 2 is coated with a mirror coating 4, the sucker seat 5 is composed of suckers with two ends connected in a penetrating way, the inner side surface of the sucker seat 5 is coated with a light source structure 6, and the outer surface of the sucker seat 5 is coated with a shading coating.
Specifically, the light source structure is designed for a laser light source or a color lamp bulb and other light sources;
when the pressing action has overcome the adsorption action between the sucker seat 5 and the surface of the operation desk, the stay cord 51 drives the edge of the sucker seat 5 to lift, and then the part of the sucker seat 5 is pressed again to be adsorbed to the surface of the operation desk under the pressing action, but the light emitted by the light source structure 6 inside the lifted sucker seat 5 is not blocked by the shading coating, so that the reflection and diffusion of the mirror coating 4 can be realized, and people can conveniently check the fluorescence phenomenon below the conformal plate 2 so as to adjust the air pressure or the pressing action force in the resistance cavity, thereby avoiding the overlarge pressing action force from damaging the conformal plate 2.
The foregoing is merely a preferred embodiment of the present application, which is used in connection with the actual requirement, but the scope of the present application is not limited thereto.
Claims (9)
1. The utility model provides a solve lamination conformal mode of HTCC ceramic pressfitting process, includes raw porcelain area (1), its characterized in that, the surface of raw porcelain area (1) is equipped with sunken, the inboard of raw porcelain area (1) has been arranged and has been protected board (2), and is protected board (2) and sunken slip gomphosis and be connected, the side surface of protection board (2) is connected with the sunken contact on raw porcelain area (1) surface, the top of protection board (2) is connected with blotter (3), the inside location in middle of blotter (3) has buried inflatable backing plate (33), the inside of blotter (3) is inlayed and is installed and is inflated sleeve (31) about inflatable backing plate (33) symmetrical arrangement, the surface of inflated sleeve (31) runs through sealing connection has ventilation hose (32), the tail end of ventilation hose (32) runs through sealing connection with the surface of inflatable backing plate (33).
2. The lamination and shape retention method for solving the problem of HTCC ceramic lamination according to claim 1, wherein the cross-sectional length of the surface recess of the green ceramic tape (1) is not smaller than the cross-sectional length of the air-filled sleeve (31), and the air-filled sleeve (31) is located below the end of the surface recess of the green ceramic tape (1).
3. The lamination and shape retention method for solving the problem of HTCC ceramic lamination according to claim 1, wherein the cushion pad (3) is made of wear-resistant rubber material, and the shape retention plate (2) is made of pressure-resistant material.
4. The lamination shape retention method for solving HTCC ceramic lamination process according to claim 1, characterized in that the distance between the inflatable sleeve (31) and the top surface of the cushion pad (3) is less than half the thickness of the cushion pad (3) itself.
5. The lamination and shape retention method for solving the problem of HTCC ceramic lamination process according to claim 1, wherein the height value of the surface recess of the green ceramic tape (1) is not less than the sum of the thickness values of the cushion pad (3) and the shape retention plate (2).
6. The lamination conformal manner for solving the problem of the HTCC ceramic lamination process according to claim 1, wherein an inflatable sliding tube (52) is arranged in the conformal plate (2), a sealing sliding plate (53) is connected in the inflatable sliding tube (52) in a sliding manner, a positioning cylinder is arranged at the top of the sealing sliding plate (53), the top end of the positioning cylinder is in contact with the inner top wall of the conformal plate (2), a pull rope (51) is fixedly connected to the surface of the positioning cylinder, the tail end of the pull rope (51) penetrates through and extends to the lower side of the conformal plate (2), a sucker seat (5) is connected to the bottom of the conformal plate (2), and the sucker seat (5) is detachably connected with the tail end of the pull rope (51).
7. The lamination and shape retention method for solving the problem of HTCC ceramic lamination according to claim 6, wherein the surface of the suction cup seat (5) is provided with a positioning tube (54), the inner wall of the positioning tube (54) is provided with threads, the tail end of the pull rope (51) is connected with a threaded piece (511), and the threaded piece (511) is matched with the positioning tube (54).
8. The lamination and shape retention method for solving the problem of HTCC ceramic lamination according to claim 6, wherein the inflatable slide cylinder (52) and the sealing slide plate (53) form a resistance cavity, the interior of the resistance cavity is filled with gas, and the air pressure in the resistance cavity is not less than the air pressure outside the shape retention plate (2).
9. The lamination and shape retention mode for solving the problem of HTCC ceramic lamination according to claim 6, wherein the bottom of the shape retention plate (2) is coated with a mirror coating (4), the suction cup seat (5) is composed of suction cups with two ends connected in a penetrating manner, the inner side surface of the suction cup seat (5) is coated with a light source structure (6), and the outer surface of the suction cup seat (5) is coated with a shading coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310812820.XA CN116528465B (en) | 2023-07-05 | 2023-07-05 | Lamination shape-preserving mode for solving HTCC ceramic lamination process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310812820.XA CN116528465B (en) | 2023-07-05 | 2023-07-05 | Lamination shape-preserving mode for solving HTCC ceramic lamination process |
Publications (2)
Publication Number | Publication Date |
---|---|
CN116528465A true CN116528465A (en) | 2023-08-01 |
CN116528465B CN116528465B (en) | 2023-09-15 |
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Citations (8)
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JP2002254563A (en) * | 2000-12-27 | 2002-09-11 | Mitsui Chemicals Inc | Laminate |
US20040025855A1 (en) * | 2002-08-06 | 2004-02-12 | Hageman Diane E. | Ignition coil driver chip on printed circuit board for plughole coil housing |
JP2004122553A (en) * | 2002-10-02 | 2004-04-22 | Nichigo Morton Co Ltd | Method and apparatus for lamination |
CN104135830A (en) * | 2014-08-08 | 2014-11-05 | 中国电子科技集团公司第二十九研究所 | Method and device for filling raw ceramic through holes with metal paste |
CN104900780A (en) * | 2014-03-06 | 2015-09-09 | 刘胜 | LED roll-to-roll packaging module |
KR101957425B1 (en) * | 2017-09-04 | 2019-03-12 | 울산과학기술원 | Ceramic-laminate welding apparatus with hemispherical connection bracket |
CN112976666A (en) * | 2019-12-12 | 2021-06-18 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
CN115734522A (en) * | 2022-11-25 | 2023-03-03 | 中国振华集团云科电子有限公司 | Preparation method of multilayer ceramic circuit board with double-sided cavity structure |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002254563A (en) * | 2000-12-27 | 2002-09-11 | Mitsui Chemicals Inc | Laminate |
US20040025855A1 (en) * | 2002-08-06 | 2004-02-12 | Hageman Diane E. | Ignition coil driver chip on printed circuit board for plughole coil housing |
JP2004122553A (en) * | 2002-10-02 | 2004-04-22 | Nichigo Morton Co Ltd | Method and apparatus for lamination |
CN104900780A (en) * | 2014-03-06 | 2015-09-09 | 刘胜 | LED roll-to-roll packaging module |
CN104135830A (en) * | 2014-08-08 | 2014-11-05 | 中国电子科技集团公司第二十九研究所 | Method and device for filling raw ceramic through holes with metal paste |
KR101957425B1 (en) * | 2017-09-04 | 2019-03-12 | 울산과학기술원 | Ceramic-laminate welding apparatus with hemispherical connection bracket |
CN112976666A (en) * | 2019-12-12 | 2021-06-18 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
CN115734522A (en) * | 2022-11-25 | 2023-03-03 | 中国振华集团云科电子有限公司 | Preparation method of multilayer ceramic circuit board with double-sided cavity structure |
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