CN116507174A - Preparation method of pressure buffer structure and touch display module - Google Patents

Preparation method of pressure buffer structure and touch display module Download PDF

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Publication number
CN116507174A
CN116507174A CN202310341057.7A CN202310341057A CN116507174A CN 116507174 A CN116507174 A CN 116507174A CN 202310341057 A CN202310341057 A CN 202310341057A CN 116507174 A CN116507174 A CN 116507174A
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China
Prior art keywords
adhesive layer
bonded
layer
pressing
buffer
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CN202310341057.7A
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Chinese (zh)
Inventor
张志佳
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Bazhou Yungu Electronic Technology Co ltd
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Bazhou Yungu Electronic Technology Co ltd
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Priority to CN202310341057.7A priority Critical patent/CN116507174A/en
Publication of CN116507174A publication Critical patent/CN116507174A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Push-Button Switches (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Position Input By Displaying (AREA)

Abstract

The application provides a preparation method of this pressure buffer structure and touch-control display module assembly, this pressure buffer structure includes buffer layer and solidification glue film. The buffer layer is used for providing a contact surface contacted with the pressing head. The solidified glue layer and the buffer layer are laminated and can be arranged separately. The cured adhesive layer is used for providing a contact surface with the portion to be bonded. This application is through add the solidification glue film in this pressure buffer structure to cover to waiting to bond the portion after falling the solidification glue film from the buffer layer in this pressure bonding in-process, will wait to bond this pressure bonding process and the encapsulation process of portion and unite two into one, consequently reduced the use of encapsulation equipment, simplified touch-control display module assembly's preparation technology, also reduced the cost of manpower and encapsulation equipment.

Description

Preparation method of pressure buffer structure and touch display module
Technical Field
The application relates to the technical field of display, in particular to a preparation method of a local pressure buffer structure and a touch display module.
Background
In order to enhance the capability of resisting water vapor and salt fog of the touch display module, after bonding is performed on each to-be-bonded piece in the touch display module, the touch display module is generally required to be moved from a pressing device to a sealing device such as a coating machine, and the bonded bonding portion is encapsulated by the sealing device. However, the manufacturing process of the touch display module is complex and the manufacturing cost is high.
Disclosure of Invention
In view of this, the application provides a preparation method of this pressure buffer structure and touch-control display module assembly, through add the solidification glue film in this pressure buffer structure to make solidification glue film and buffer layer separation when carrying out this pressure bonding to each portion of waiting to bond in the touch-control display module assembly, and then utilize solidification glue film to wait to bond the portion and encapsulate, reduced the use of sealing equipment and use cost thereof, improved touch-control display module assembly's preparation efficiency.
The first aspect of the present application provides a present pressure buffer structure, the present pressure buffer structure includes buffer layer and solidification glue film. The buffer layer is used for providing a contact surface contacted with the pressing head. The solidified glue layer and the buffer layer are laminated and can be arranged separately. The cured adhesive layer is used for providing a contact surface with the portion to be bonded.
In the above scheme, the curing adhesive layer is additionally arranged in the pressing buffer structure and is configured to be laminated with the buffer layer and can be separately arranged, so that when the bonding part to be bonded in the touch display module is subjected to the pressing bonding, the curing adhesive layer is covered on the bonding part to be bonded after being separated from the buffer layer, namely, the bonding process and the sealing process of the bonding part to be bonded are combined into a whole, the bonding process of the bonding part to be bonded by using the sealing equipment after the bonding is avoided, the preparation efficiency of the touch display module is further improved, and the cost of manpower and the sealing equipment is reduced.
In a specific embodiment of the first aspect of the present application, the material of the cured glue layer comprises an ultraviolet light cured glue.
In a specific embodiment of the first aspect of the present application, the present compression buffer structure further comprises an adhesive layer. The adhesive layer is positioned between the buffer layer and the curing adhesive layer and is configured to bond the curing adhesive layer and the buffer layer. Therefore, the adhesive layer is used for bonding the curing adhesive layer and the buffer layer together, so that the direct contact between the curing adhesive layer and the buffer layer is avoided, and the acting force used for separating the curing adhesive layer from the buffer layer is reduced.
In a specific embodiment of the first aspect of the present application, the material of the adhesive layer comprises paraffin wax.
In a specific embodiment of the first aspect of the present application, the adhesion between the cured glue layer and the buffer layer is not greater than the adhesion between the cured glue layer and the portion to be bonded.
The second aspect of the present application provides a method for preparing a touch display module, which includes: providing a portion to be bonded; utilize this pressure head to this pressure buffer structure's of this first aspect buffer layer to deviate from the one side application pressure of solidification glue film to make solidification glue film drop and cover to wait to bond on the portion.
In a specific embodiment of the second aspect of the present application, the softening temperature of the cured adhesive layer is less than the present pressing temperature used when the present pressing head presses the portion to be bonded. The above-mentioned pressure head that utilizes this pressure head to the buffer layer in this pressure buffer structure of this application first aspect deviate from one side of solidification glue film and exert pressure to make solidification glue film drop and cover to wait to bond on the portion, include: utilize this pressure head to this pressure buffer structure in the application first aspect's buffer layer one side that deviates from the solidification glue film exerts pressure to make solidification glue film soften or drop and cover to waiting to bond on the portion after melting under this pressure temperature.
In a specific embodiment of the second aspect of the present application, the softening temperature ranges from 60 ℃ to 160 ℃.
In a specific embodiment of the second aspect of the present application, the present pressure temperature ranges from 110 ℃ to 230 ℃.
In a specific embodiment of the second aspect of the present application, the orthographic projection of the portion of the cured adhesive layer that falls off on the present pressing head coincides with the orthographic projection of the portion to be bonded on the present pressing head.
In a specific embodiment of the second aspect of the present application, the part of the cured adhesive layer that falls off coats the surface of the to-be-bonded part facing the side of the pressing head; or the part of the cured adhesive layer which falls off coats the surface of the side of the pressing head facing the to-be-bonded part, and coats the side surface adjacent to the surface of the side of the pressing head facing the to-be-bonded part.
In a specific embodiment of the second aspect of the present application, the applying a pressure to a side of the buffer layer in the present buffer structure facing away from the cured adhesive layer by using the present pressing head, so that the cured adhesive layer falls off and covers onto the to-be-bonded portion, includes: and applying pressure to one side, away from the curing adhesive layer, of the buffer layer in the pressing buffer structure by using the pressing head, so that the curing adhesive layer falls off and covers the to-be-bonded part by using the adhesive layer in the pressing buffer structure.
In a specific embodiment of the second aspect of the present application, the melting point of the adhesive layer is less than the present pressing temperature used when the present pressing head presses the portion to be bonded. Above-mentioned utilize this pressure head to the buffer layer in this pressure buffer structure deviate from the one side application pressure of solidification glue film to utilize the adhesion layer in this pressure buffer structure to make solidification glue film drop and cover to wait to bond on the portion, include: and applying pressure to one side, away from the solidified glue layer, of the buffer layer in the pressing buffer structure by using the pressing head, so that the solidified glue layer is driven to fall off together after the adhesive layer in the pressing buffer structure is melted and is covered on the to-be-bonded part.
In one embodiment of the second aspect of the present application, the adhesive layer has a melting point less than the softening temperature of the cured bondline.
In one embodiment of the second aspect of the present application, the melting point of the adhesive layer ranges from 50 ℃ to 70 ℃.
Drawings
Fig. 1 is a schematic plan view of a touch display module.
Fig. 2 is a schematic cross-sectional view of the touch display module shown in fig. 1 along the line M1-M2.
Fig. 3 is a schematic structural diagram of a pressing device according to an embodiment of the present application before pressing a touch display module.
Fig. 4 is a schematic structural diagram of the touch display module in the embodiment shown in fig. 3.
Fig. 5 is a schematic structural diagram of the pressing device in the embodiment shown in fig. 3.
Fig. 6 is a schematic structural diagram of the present pressure buffer structure in the embodiment shown in fig. 3.
Fig. 7 is a schematic structural diagram of a pressing device according to another embodiment of the present application before pressing a touch display module.
Fig. 8 is a schematic structural diagram of the present pressure buffer structure in the embodiment shown in fig. 7.
Fig. 9 is a flowchart illustrating a method for manufacturing a touch display module according to an embodiment of the disclosure.
Fig. 10 is a schematic structural diagram of the pressing device in the embodiment shown in fig. 3 after pressing the touch display module.
Fig. 11 is a schematic structural diagram of the pressing device in the embodiment shown in fig. 3 after pressing the touch display module.
Fig. 12 is a schematic structural diagram of the pressing device of the embodiment shown in fig. 7 after pressing the touch display module.
Fig. 13 is a schematic structural diagram of the pressing device of the embodiment shown in fig. 7 after pressing the touch display module.
Fig. 14 is a schematic structural diagram of the pressing device of the embodiment shown in fig. 7 after pressing the touch display module.
Fig. 15 is a flowchart illustrating a method for manufacturing a touch display module according to an embodiment of the disclosure.
Fig. 16 is a flowchart illustrating a method for manufacturing a touch display module according to another embodiment of the present application.
Fig. 17 is a flowchart illustrating a method for manufacturing a touch display module according to another embodiment of the present application.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the manufacturing process of the touch display module, at least one bonding process of a bonding process such as a chip, a bonding process of a circuit board, and a bonding process of a flip chip film is generally included. The bonding process of the Chip includes bonding of the Chip to a Glass substrate (Chip On Glass, COG, abbreviated as COG bonding), or bonding of the Chip to a Plastic substrate (Chip On Plastic, or Chip On Polyimide, COP, abbreviated as COP bonding). The bonding process of the circuit board comprises one or more of bonding of a flexible circuit board (Display Flexible Printed Circuit, DFPC) for display and a Glass substrate (DFPC On Glass, DFOG, for short, bonding of a flexible circuit board for display and a Film substrate (DFPC On Film, DFOF, for short, bonding of a DFOF), bonding of a flexible circuit board for touch (Touch Flexible Printed Circuit, TFPC) and a Glass substrate (TFPC On Glass, TFOG, for short, bonding of a TFOG), and bonding of a flexible circuit board for touch and a Film substrate (TFPC On Film, TFOF, for short, bonding of a TFOF). Bonding of Chip On Film (COF) includes bonding of a Chip On Film (COF) to a Glass substrate (COF On Glass, film On Glass), or bonding of a Chip On Film to a Film substrate (COF On Film, film On Film).
The bonding process typically includes a pre-press bonding process and a present press bonding process. The conditions such as temperature, pressure, or time used by the pre-press (also known as dummy pressure) bonding process are lower than those used by the present pressure (also known as main pressure) bonding process. The pre-press bonding process uses lower conditions than the present press bonding process to align and adhere the two pieces to be bonded together. The bonding pressing process is to fix the two to-be-bonded parts which are pre-pressed and aligned well under the condition of being higher than the pre-pressing pressure.
In order to enhance the water vapor and salt fog resistance of the touch display module, after bonding is performed on each to-be-bonded piece in the touch display module, the touch display module is generally required to be moved from a pressing device to a sealing device such as a coating machine, and the bonded bonding portion is encapsulated by the sealing device, so that the reliability of the touch display module is improved.
However, it has been found through careful study that, on one hand, after each bonding process of the touch display module, the touch display module needs to be moved from the pressing device to the sealing device multiple times, so that the complexity of the manufacturing process of the touch display module is increased, and on the other hand, the manufacturing cost of the touch display module is increased due to the need of using the sealing device.
For example, referring to fig. 1 and 2, the touch display module 10 includes a display module 11 and a touch module 12. The display module 11 includes a composite adhesive tape 11a, a Glass substrate 11b, a display functional layer 11c, an encapsulation Glass (Encap Glass) 11d, and a polarizer 11e, which are stacked, and the display module 11 further includes a driving chip 11f, a flip chip film 11g, and a flexible circuit board 11h for display. One end of the flip chip film 11g is bonded to the glass substrate 11b (corresponding to COF bonding), and the other end of the flip chip film 11g is bonded to the flexible circuit board 11h for display (corresponding to DFOF bonding). The touch module 12 includes a touch functional layer 12a and a cover 12b that are stacked, and the touch module 12 further includes a flexible circuit board 12c for touch. One end of the flexible circuit board 12c for touch is bonded to the encapsulation glass 11d (corresponding to TFOG bonding), and the other end of the flexible circuit board 12c for touch is bonded to the flexible circuit board 11h for display (corresponding to TFOF bonding). Thus, the touch display module 10 may be divided into a display area AA and a non-display area NA. The non-display area NA may include COF bonding area a, DFOF bonding area b, and TFOG bonding area c. The non-display area NA may also include a TFOF bonding area d. It should be noted that the TFOF bonding area d may also be located in the display area AA. When two to-be-bonded pieces are bonded, the two to-be-bonded pieces can be connected by adopting an anisotropic conductive adhesive film (Anisotropic Conductive Film, ACF) 1.
In the process of manufacturing the display module 11, COF bonding, DFOF bonding, and first encapsulation are typically sequentially included. The first sealing procedure comprises the steps of coating an uncured packaging adhesive layer on the surface of the bonding part positioned in the COF bonding area by using a sealing device, and coating the uncured packaging adhesive layer on the surface of the bonding part positioned in the DFOF bonding area by using the sealing device. In the process of manufacturing the touch module 12, TFOG bonding, TFOF bonding, and a second encapsulation process are typically sequentially included. The second sealing procedure comprises the steps of coating an uncured packaging adhesive layer on the surface of the bonding part positioned in the TFOG bonding region by using a sealing device, and coating the uncured packaging adhesive layer on the surface of the bonding part positioned in the TFOF bonding region by using the sealing device. It should be noted that the uncured encapsulation adhesive layer may be cured under the condition of ultraviolet light or heat, etc., and the cured encapsulation adhesive layer seals the bonding component, thereby avoiding the bonding component from being corroded by water, oxygen, etc. Automatic optical inspection (Automated Optical Inspection, AOI) and transcoding processes may also be included between the DFOF bonding and the first encapsulation process. The first glue sealing process and the TFOG bonding can also comprise processes of telecommunication inspection, appearance inspection and the like for the display module. And a Touch Panel (TP) test and other processes can be further included between the TFOF bonding and the second sealing process. The sealing process of the bonding part in two different bonding areas in the first sealing process or the second sealing process is independently carried out.
In order to solve at least one of the above problems, at least one embodiment of the present application provides a method for manufacturing a present press buffer structure and a touch display module, by improving and optimizing the present press buffer structure, a curing adhesive layer is added in the present press buffer structure, so that the curing adhesive layer is covered on a portion to be bonded after falling off from the buffer layer in the present press bonding process, and the present press bonding process and the sealing process of the portion to be bonded are combined into one, thereby reducing the use of sealing equipment, reducing the step of moving the bonded portion to the sealing equipment, reducing the cost of manpower and sealing equipment, and reducing the manufacturing cost of the touch display module.
The following describes a method for manufacturing the present pressure buffer structure and the touch display module in at least one embodiment of the present application with reference to the accompanying drawings. In addition, in the drawings, a space rectangular coordinate system is established by taking the buffer layer in the present buffer structure as a reference, so as to assist in explaining the position relationship of each structure in the present buffer structure, in the space rectangular coordinate system, the X axis and the Y axis are parallel to the plane of the buffer layer (or the plane of the touch display module), and the Z axis is perpendicular to the plane of the buffer layer. In addition, in the embodiment of the present application, the "thickness" is defined with reference to the buffer layer, for example, for an object located on one side of the buffer layer, the difference between the vertical distance from the end of the object farthest from the buffer layer to the buffer layer and the vertical distance from the end closest to the buffer layer is the thickness of the object.
Referring to fig. 3 and 4, the touch display module 100 includes a first to-be-bonded member 110 and a second to-be-bonded member 120. The overlapping portion of the first to-be-bonded member 110 and the second to-be-bonded member 120 constitutes a to-be-bonded portion a.
It should be noted that, the touch display module 100 includes a bonding region e, where the first to-be-bonded member 110 and the second to-be-bonded member 120 overlap in the bonding region e, and accordingly, the to-be-bonded portion a is formed by a portion of the first to-be-bonded member 110 located in the bonding region e and a portion of the second to-be-bonded member 120 located in the bonding region e. The bonding region e may be any one of the COF bonding region a, the DFOF bonding region b, the TFOG bonding region c, and the TFOF bonding region d in the touch display module 100 shown in fig. 2, or may be any one of the COG bonding region, the COP bonding region, the DFOG bonding region, and the TFOG bonding region, for example.
The touch display module 100 may have a hard screen structure as shown in fig. 1 and 2, or may have a flexible screen structure. The first to-be-bonded member 110 and the second to-be-bonded member 120 may be any two to-be-bonded members that need to be bonded in the touch display module 100, for example, one of the first to-be-bonded member 110 and the second to-be-bonded member 120 is a circuit board, a driving chip or a flip chip film, and the other of the first to-be-bonded member 110 and the second to-be-bonded member 120 is a glass substrate, a flexible substrate or a circuit board. The circuit board may be a flexible circuit board or a rigid circuit board.
Referring to fig. 3 and 5, the bonding device 200 is used for bonding the first to-be-bonded member 110 and the second to-be-bonded member 120 in the touch display module 100. The bonding apparatus 200 includes a ram member 210, and the bonding apparatus 200 may further include a support member 220. The ram member 210 includes the present ram 211. The ram member 210 is configured to apply pressure to a side of the portion to be bonded a that faces the ram member 210. The ram member 210 may also include a present ram buffer structure 212. It should be noted that the present pressure buffer structure 212 may not be a part of the pressing device 200, but may exist independently of the pressing device 200, for example, the pressure buffer structure 212 may be directly taken and used only when the pressing device 200 is used. The present press buffer structure 212 is configured to cover at least a surface of the present press head 211 facing the bonding portion a. The support member 220 is disposed opposite the ram member 210, and the support member 220 is configured to apply pressure to or carry the portion to be bonded a on a side of the portion to be bonded a facing away from the ram member 210. The present pressing buffer structure 212 is used for coating the present pressing head 211 in the pressing device 200. The bonding device 200 is used for bonding the first to-be-bonded member 110 and the second to-be-bonded member 120 in the touch display module 100. It should be noted that, the present pressing buffer structure 212 may cover a surface of the pressing head 211 facing the to-be-bonded portion a in the pressing device 200, or may further cover a side surface adjacent to the surface of the pressing head 211 facing the to-be-bonded portion a. In the bonding process, the pressing head 211 can be heated to the pressing temperature after being heated by the heating component, and the heat of the pressing temperature can be transferred to the pressing buffer structure 212 and the touch display module 100 through the pressing head 211, so that the first to-be-bonded piece 110 and the second to-be-bonded piece 120 after bonding are connected and fastened more. The heating element may be part of the bonding apparatus 200 or may be separate from the bonding apparatus 200. The heating element may be located at any position within the pressing device 200, for example, in some embodiments, the heating element may cover a surface of the pressing head 211 on a side facing away from the supporting element 220, and for example, in other embodiments, the heating element may cover a surface of the pressing head 211 on a side facing away from the supporting element 220 and a side adjacent to the surface, and for example, in still other embodiments, the heating element may be located within the supporting element 220.
Referring to fig. 3 and 6, the present compressive cushioning structure 212 includes a cushioning layer 2121 and a cured bondline 2122. The buffer layer 2121 serves to provide a contact surface with the present pressing head 211. The cured adhesive layer 2122 is laminated with the buffer layer 2121 and is detachably provided. The cured bond layer 2122 is used to provide a contact surface with the portion to be bonded a. In this way, the curing adhesive layer 2122 is additionally arranged in the present press buffer structure 212, so that the curing adhesive layer 2122 is covered on the to-be-bonded portion A after being separated from the buffer layer 2121 in the present press bonding process, that is, the present press bonding process and the sealing process of the to-be-bonded portion A are combined into one, the step of moving the bonded portion to the sealing equipment is reduced, the preparation efficiency of the touch display module 100 is improved, the use of the sealing equipment is reduced, and the cost of manpower and the sealing equipment is reduced.
It should be noted that, in the present bonding process, the buffer layer 2121 in the present pressing buffer structure 212 (may also be referred to as the present pressing buffer material) may give the present pressing head 211 a buffer force, so that the present pressing head 211 lightly contacts the to-be-bonded portion a, which avoids damage to the to-be-bonded portion a caused by too large impact force, and also avoids scalding the to-be-bonded portion a caused by too high temperature of the present pressing head 211. The highest service temperature of the buffer layer 2121 is greater than the present pressure temperature. The material of the buffer layer 2121 includes, but is not limited to, at least one of silicone and polytetrafluoroethylene (Poly tetra fluoroethylene, PTFE), for example, the buffer layer 2121 may be a silicone skin or teflon. Taking the buffer layer 2121 as a silica gel skin as an example, the silica gel skin is prepared by adding a high heat conduction material into a silica gel as a base material and then vulcanizing the base material, wherein the high temperature resistant range of the silica gel skin is 200-360 ℃, for example, 350 ℃. Taking the buffer layer 2121 as an example of teflon, the teflon material may include at least one of PTFE, fluorinated ethylene propylene copolymer (FEP), ethylene tetrafluoroethylene copolymer (ETFE), and perfluoroalkyl compound (PFA), and the teflon has a maximum use temperature ranging from 260 ℃ to 400 ℃, for example, the PTFE has a maximum use temperature of 300 ℃ and the FEP has a maximum use temperature of 200 ℃.
In some embodiments, referring to fig. 3, for example, an orthographic projection of a surface of the to-be-bonded portion a facing the to-be-bonded portion 211 on a surface of the to-be-bonded portion a facing the to-be-bonded portion 211 may coincide with an orthographic projection of a surface of the to-be-bonded portion a facing the to-be-bonded portion 211 on a surface of the to-be-bonded portion 211 facing the to-be-bonded portion a. In other embodiments, referring to fig. 9, for example, the orthographic projection of the surface of the to-be-bonded portion a facing the to-be-bonded portion 211 on the surface of the to-be-bonded portion a facing the to-be-bonded portion 211 may be located in the orthographic projection of the surface of the to-be-bonded portion a facing the to-be-bonded portion 211 on the surface of the to-be-bonded portion a facing the to-be-bonded portion 211.
The cured paste 2122 may be a cured encapsulant that is solid or solid at room temperature (e.g., 25 ℃). The material of the curing adhesive layer 2122 may include, but is not limited to, ultraviolet curing adhesive, thermosetting adhesive, chemical curing adhesive, etc., as long as the curing adhesive layer 2122 can fall off from the side of the buffer layer 2121 facing away from the pressing head 211 at the pressing temperature, and on this basis, the material of the curing adhesive layer 2122 is not specifically limited in the embodiment of the present application. For example, in at least one embodiment of the present application, the material of the cured glue layer 2122 includes uv-curable glue, and further, for example, the cured glue layer 2122 may be a glue layer formed by curing uncured uv-curable glue under uv light. In this way, the cured adhesive layer 2122 including the UV-curable adhesive may be non-tacky or less tacky at normal temperature (e.g., 25 ℃) and when the service temperature of the cured adhesive layer 2122 is greater than 60 ℃, the adhesive force between the cured adhesive layer 2122 including the UV-curable adhesive and the portion to be bonded A may reach 10N/mm 2 As described above, when the use temperature of the cured adhesive layer 2122 is higher than the softening temperature of the cured adhesive layer 2122, the cured adhesive layer 2122 including the uv curable adhesive may be softened but not melted into liquid, so that the softened cured adhesive layer 2122 may fall off along the outer edge of the present pressing head 211 and cover the portion to be bonded a (refer to fig. 12, 13 and 14). In addition, the cured paste layer 2122 including the UV curable paste has a relatively high tensile strength (e.g., a tensile strength greater than 58 kgf/cm) 2 ) And has a relatively strong hardness (for example, 40D to 70D), so that the curing adhesive layer 2122 including the ultraviolet curing adhesive can play a role in reinforcing while playing a role in packaging the portion a to be bonded.
The ultraviolet curing glue can be common ultraviolet curing glue, and the softening temperature of the common ultraviolet curing glue is about 100 ℃ (for example, 80 ℃ -120 ℃). The ultraviolet light curing adhesive can also be high temperature resistant ultraviolet light curing adhesive, and the softening temperature of the high temperature resistant ultraviolet light curing adhesive is about 150 ℃ (for example, 120 ℃ -160 ℃).
The buffer layer 2121 may or may not be in direct contact with the cured bondline 2122. The connection and structural design between the buffer layer 2121 and the cured adhesive layer 2122 are illustrated in connection with several embodiments.
For example, in some embodiments, if the buffer layer 2121 and the cured adhesive layer 2122 are in direct contact, a layer of uncured encapsulation adhesive layer may be formed on the surface of the buffer layer 2121 on the side facing away from the pressing head 211 by coating or spin coating, and then the uncured encapsulation adhesive layer is cured to form the cured adhesive layer 2122.
For another example, in other embodiments, referring to fig. 7 and 8, the present pressure buffer structure 213 is a modification of the present pressure buffer structure 212 described above, and is different from the present pressure buffer structure 212 described above in that the present pressure buffer structure 213 further includes an adhesive layer 2131. The adhesive layer 2131 is positioned between the buffer layer 2121 and the cured bondline 2122 and is configured to bond the cured bondline 2122 and the buffer layer 2121. In this way, the material of the adhesive layer 2131 may be coated or spin-coated to form the adhesive layer 2131 on the surface of the buffer layer 2121 on the side facing away from the pressing head 211, and the material of the cured adhesive layer 2122 may be coated or spin-coated to form an uncured encapsulating adhesive layer on the surface of the adhesive layer 2131 on the side facing away from the buffer layer 2121, and then the uncured encapsulating adhesive layer is cured to form the cured adhesive layer 2122, so that the cured adhesive layer 2122 and the buffer layer 2121 are bonded together by using the adhesive layer 2131, thereby avoiding the direct contact between the cured adhesive layer 2122 and the buffer layer 2121, and being beneficial to reducing the acting force used for separating the cured adhesive layer 2122 from the buffer layer 2121.
The thickness of the cured adhesive layer 2122 may be 30 μm to 70 μm, for example, 50 μm. The thickness of the adhesive layer 2131 may be less than the thickness of the cured adhesive layer 2122, for example, the thickness of the adhesive layer 2131 may be 5 μm to 15 μm, further 8 μm, 10 μm or 13 μm.
In the present pressure buffer structure provided in at least one embodiment of the present application, the material of the adhesive layer 2131 includes paraffin wax. Thus, the melting point of the adhesive layer 2131 including paraffin wax ranges from 60 ℃ to 64 ℃, so that the adhesive layer 2131 including paraffin wax can have tackiness before being melted, thereby bonding the cured adhesive layer 2122 and the buffer layer 2121 together with the adhesive layer 2131. The adhesive layer 2131, which includes paraffin wax, may be tack free after melting, thereby separating the cured bondline 2122 from the buffer layer 2121, which may facilitate reducing the force used to release the cured bondline 2122 from the buffer layer 2121.
It should be noted that the material of the adhesive layer 2131 includes, but is not limited to, paraffin, for example, the material of the adhesive layer 2131 may include any one or more of stearic acid, palm wax, and the like.
In at least one embodiment of the present application, the adhesion between the cured bondline 2122 and the buffer layer 2121 is not greater than the adhesion between the cured bondline 2122 and the portion to be bonded a. In this manner, the force used to release the cured bondline 2122 from the buffer layer 2121 is advantageously reduced.
It should be noted that, the adhesion between the cured adhesive layer 2122 and the buffer layer 2121 may refer to the adhesion between the cured adhesive layer 2122 and the buffer layer 2121 at the normal use temperature or the present pressure temperature of the present pressure buffer structure 212. The adhesive force between the cured adhesive layer 2122 and the buffer layer 2121 may be an adhesive force at a contact surface of the cured adhesive layer 2122 and the buffer layer 2121 in direct contact with each other, or may be an adhesive force at a contact surface of the adhesive layer 2131 and the buffer layer 2121 or an adhesive force at a contact surface of the cured adhesive layer 2122 and the adhesive layer 2131 in the presence of the adhesive layer 2131 between the cured adhesive layer 2122 and the buffer layer 2121.
The application further provides a preparation method of the touch display module, and referring to fig. 9, the preparation method comprises the following steps.
S110: and providing a portion to be bonded.
For example, referring to fig. 3 and 4, the first to-be-bonded member 110 and the second to-be-bonded member 120 may be pre-pressed, so that the first to-be-bonded member 110 and the second to-be-bonded member 120 are aligned and then adhered together. The portion of the first to-be-bonded member 110 that adheres to the second to-be-bonded member 120 and the portion of the second to-be-bonded member 120 that adheres to the first to-be-bonded member 110 may constitute to-be-bonded portion a. The first to-be-bonded member 110 and the second to-be-bonded member 120 may be any two to-be-bonded members in the touch display module 100.
S120: and applying pressure to one side, away from the curing adhesive layer, of the buffer layer in the pressing buffer structure by using the pressing head so as to enable the curing adhesive layer to fall off and cover the to-be-bonded part.
For example, referring to fig. 3, the first to-be-bonded member 110 and the second to-be-bonded member 120 that have been pre-pressed and aligned may be placed on the supporting member 220 in the bonding apparatus 200. The pressing head 211 may be fixed at a position opposite to the supporting member 220, or may be moved to a position opposite to the supporting member 220, so that the pressing head 211 is disposed opposite to the supporting member 220, and the portion to be bonded a is located between the pressing head 211 and the supporting member 220. The present press buffer structure 212 may be coated on the present press head 211 all the time, or before the present press bonding process, the present press buffer structure 212 may be moved onto the present press head 211, so that the present press buffer structure 212 coats the present press head 211. The present pressing head 211 coated with the present pressing buffer structure 212 may move to the surface of the to-be-bonded portion a facing one side of the present pressing head 211 along the negative direction of the Z axis and continuously apply pressure along the negative direction of the Z axis, so that the first to-be-bonded member 110 and the second to-be-bonded member 120 are connected more tightly, and after the present bonding process, when the present pressing head 211 moves along the positive direction of the Z axis, the cured adhesive layer 2122 may be fixed on the to-be-bonded portion a, thereby playing a role in packaging the to-be-bonded portion a.
It should be noted that the present pressure buffer structure may be the present pressure buffer structure 212 or 213 in the above embodiment, or may be an equivalent or obviously modified present pressure buffer structure based on the present pressure buffer structure 212 or 213 in the above embodiment.
The touch display module 100 can be applied to various electronic display products, and the various electronic display products can specifically include, but are not limited to, at least one of a mobile phone, a tablet computer, an electronic book reader, a player, a digital camera, a laptop, a car computer, a desktop computer, a set-top box, a smart television, and a wearable device.
Since any two to-be-bonded pieces in the touch display module 100 may be bonded by using the bonding device 200 in the above embodiment, and the bonding device 200 may use the present pressure buffer structure 212 or 213 in the above embodiment, a specific implementation of the preparation method may refer to the description in the related embodiment of the present pressure buffer structure 212 or 213, and at least all the above technical effects may be achieved, which is not described herein.
The cured adhesive layer 2122 may be peeled off at the present pressure temperature, or may be peeled off by softening or melting, and the manner in which the cured adhesive layer 2122 is peeled off from the buffer layer 2121 is not particularly limited in the embodiment of the present application. The manner in which the cured bondline 2122 is released from the buffer layer 2121 is illustrated below in connection with several embodiments.
For example, in some embodiments, the adhesion of the surface of the cured bondline 2122 facing the side of the buffer layer 2121 may be less than the adhesion of the surface of the cured bondline 2122 facing away from the side of the buffer layer 2121, such that the cured bondline 2122 may be easily peeled off from the buffer layer 2121 and over the portion to be bonded a during the present bonding process. For example, the surface roughness of the side of the cured glue layer 2122 facing the buffer layer 2121 may be smaller than the surface roughness of the side of the cured glue layer facing away from the buffer layer 2121, such that the adhesion between the cured glue layer 2122 and the buffer layer 2121 is smaller than the adhesion between the cured glue layer 2122 and the portion to be bonded a.
In at least one embodiment of the present application, the softening temperature of the cured adhesive layer 2122 is less than the pressing temperature used when the pressing head 211 presses the to-be-bonded portion a. Referring to fig. 15, the difference from the embodiment shown in fig. 9 is that step S121 is a specific implementation of step S120 in the embodiment shown in fig. 9.
S121: and applying pressure to one side, away from the solidified glue layer, of the buffer layer in the pressing buffer structure by using the pressing head, so that the solidified glue layer is softened or melted at the pressing temperature and then falls off and covers the to-be-bonded part.
For example, in the present bonding process, the cured adhesive layer 2122 can easily fall off from the buffer layer 2121 and cover the to-be-bonded portion a after softening at the present bonding temperature, and in addition, the softened cured adhesive layer 2122 has a certain fluidity, so that the softened cured adhesive layer 2122 easily flows to the side of the to-be-bonded portion a (refer to fig. 11, 13 and 14), and the softened cured adhesive layer 2122 returns to the cured state or the cured gel state after reducing the temperature, so that the cured adhesive layer 2122 covering the to-be-bonded portion a can play a role of protecting and packaging the surface of the to-be-bonded portion a facing the present bonding head 211 and the side adjacent to the surface of the to-be-bonded portion a facing the present bonding head 211.
The softening temperature is a temperature at which a certain deformation of a sample is measured under conditions such as a certain specified sample size, a temperature rising rate, and an external force application method.
In some embodiments, the softening temperature of the cured bondline 2122 ranges from 60 ℃ to 160 ℃. In this way, the present pressure temperature can be determined according to the softening temperature of the cured adhesive layer 2122 and the highest use temperature of the to-be-bonded portion a, and the lower the softening temperature of the cured adhesive layer 2122 is, the lower the present pressure temperature can be used to bond the to-be-bonded portion under the condition that the highest use temperature of the to-be-bonded portion is ensured to be smaller than the present pressure temperature, which is beneficial to reducing energy loss.
In some embodiments, the present pressure temperature ranges from 110 ℃ to 230 ℃. Therefore, under the condition that the highest using temperature of the to-be-bonded part and the softening temperature of the curing adhesive layer 2122 are smaller than the pressing temperature, the bonding can be performed on the to-be-bonded part at the proper pressing temperature, and damage to the to-be-bonded part or the curing adhesive layer in the bonding pressing process is avoided.
For another example, the melting point of the cured adhesive layer 2122 may be less than the present pressing temperature used when the present pressing head 211 presses the portion to be bonded a. In the present bonding process, the cured adhesive layer 2122 can be melted at the present bonding temperature and then cover the to-be-bonded portion a, and in addition, the melted cured adhesive layer 2122 has a certain fluidity, so that the melted cured adhesive layer 2122 easily flows to the side surface of the to-be-bonded portion a (refer to fig. 11, 13 and 14), and the cured adhesive layer 2122 returns to the cured state or cured adhesive state after the temperature is reduced, so that the cured adhesive layer 2122 covering the to-be-bonded portion a can play a role in protecting and packaging the surface of the to-be-bonded portion a facing the side of the present bonding head 211 and the side surface adjacent to the surface of the to-be-bonded portion a facing the side of the present bonding head 211.
Note that the melting point refers to the lowest temperature at which the substance melts, for example, the melting point of the solidified glue layer 2122 refers to the lowest temperature at which the solidified glue layer 2122 melts.
In at least one embodiment of the present application, the orthographic projection of the portion of the cured adhesive layer 2122 that falls off on the pressing head 211 coincides with the orthographic projection of the portion to be bonded a on the pressing head 211, so, when the cured adhesive layer 2122 softens or melts and falls off, the portion of the cured adhesive layer 2122 that contacts with the portion to be bonded a can fall off and cover the portion to be bonded a, thereby avoiding unnecessary adhesion between the cured adhesive layer 2122 and other structures in the touch display module due to the fact that the cured adhesive layer 2122 falls off more so that the cured adhesive layer 2122 flows to the portion that does not need to be packaged.
In at least one embodiment of the present application, the portion of the cured adhesive layer 2122 that falls off coats the surface of the portion to be bonded a facing the side of the pressing head 211, and referring to fig. 10 and 12, for example, this may enable the portion of the cured adhesive layer 2122 that falls off to play a role in packaging the surface of the portion to be bonded a facing the side of the pressing head 211.
In at least one embodiment of the present application, the portion of the cured adhesive layer 2122 that falls off coats the surface of the portion to be bonded a facing the side of the pressing head 211, and coats the side surface adjacent to the surface of the portion to be bonded a facing the side of the pressing head 211, and referring to fig. 11, 13 and 14, for example, the portion of the cured adhesive layer 2122 that falls off can be made to play a role in packaging the surface of the portion to be bonded a facing the side of the pressing head 211 and the adjacent side surface.
Referring to fig. 16, the difference from the embodiment shown in fig. 9 is that step S122 is a specific implementation of step S120 in the embodiment shown in fig. 9.
S122: and applying pressure to one side, away from the curing adhesive layer, of the buffer layer in the pressing buffer structure by using the pressing head, so that the curing adhesive layer falls off and covers the to-be-bonded part by using the adhesive layer in the pressing buffer structure.
For example, at the present pressure temperature, the adhesion between the adhesive layer 2131 and the buffer layer 2121 may be less than the adhesion between the cured adhesive layer 2122 and the adhesive layer 2131, which is advantageous in reducing the force used to release the adhesive layer 2131 and the cured adhesive layer 2122 from the buffer layer 2121. In some embodiments, during the present press bonding process, adhesive layer 2131 may be released from buffer layer 2121 along with cured adhesive layer 2122 and then cover on portion a to be bonded. The orthographic projection of the portion of the adhesive layer 2131 covering the portion to be bonded a on the first member to be bonded 110 may coincide with the orthographic projection of the portion of the cured adhesive layer 2122 covering the portion to be bonded a on the first member to be bonded 110 (refer to fig. 12). The orthographic projection of the portion of the cured adhesive layer 2122 that covers the portion to be bonded a on the first member to be bonded 110 may also be located within the orthographic projection of the portion of the adhesive layer 2131 that covers the portion to be bonded a on the first member to be bonded 110 (refer to fig. 13 and 14). In other embodiments, at least a portion of the adhesive layer 2131 may remain in the present press buffer structure 213 after the present press bonding process, and the cured adhesive layer 2122 may be detached from the adhesive layer 2131 and then cover the portion to be bonded a (see fig. 14). In still other embodiments, the adhesive layer 2131 may remain in the present press buffer structure 213 after the present press bonding process, and the cured glue layer 2122 may be released from the adhesive layer 2131 and then cover the portion to be bonded a.
For example, in at least one embodiment of the present application, the melting point of the adhesive layer 2131 is less than the pressing temperature used when the pressing head 211 presses the portion to be bonded a. Referring to fig. 17, the difference from the embodiment shown in fig. 16 is that step S1221 is a specific implementation of step S123 in the embodiment shown in fig. 16.
S1221: and applying pressure to one side, away from the solidified glue layer, of the buffer layer in the pressing buffer structure by using the pressing head, so that the solidified glue layer is driven to fall off together after the adhesive layer in the pressing buffer structure is melted and is covered on the to-be-bonded part.
In the embodiment of the application, the adhesive layer 2131 is melted at the temperature of the present pressure and then falls off from the buffer layer 2121, so that the adhesive layer 2131 can be utilized to drive the cured adhesive layer 2122 to fall off together and cover the to-be-bonded portion a, and adhesion when the cured adhesive layer 2122 is in direct contact with the buffer layer 2121 is avoided. The adhesive layer 2131 has a certain fluidity after being melted at the present pressing temperature, and thus the melted adhesive layer 2131 can flow to a side surface adjacent to a surface of the cured adhesive layer 2122 facing the present pressing head 211 side (refer to fig. 13 and 14) in addition to a surface of the cured adhesive layer 2122 facing the present pressing head 211 side, so that the adhesive layer 2131 can play a role of protecting and packaging a surface of the cured adhesive layer 2122 facing the present pressing head 211 side and a side surface adjacent to a surface of the cured adhesive layer 2122 facing the present pressing head 211 side.
The adhesive layer 2131 may be in a solid state gel form at normal temperature, that is, the adhesive layer 2131 may have tackiness at normal temperature, so that the cured adhesive layer 2122 and the buffer layer 2121 may be bonded together with the adhesive layer 2131 at normal temperature. In the bonding process, the adhesiveness of the adhesive layer 2131 after melting can be reduced or even be non-tacky, so that the melted portion of the adhesive layer 2131 is very easy to fall off from the buffer layer 2121, and the falling off of the adhesive layer 2131 can drive the falling off of the cured adhesive layer 2122.
In at least one embodiment of the present application, the melting point of the adhesive layer 2131 is less than the softening temperature or melting point of the cured bondline 2122. In this manner, the adhesive layer 2131 may be melted before the curing adhesive layer 2122 is softened or melted, so that the curing adhesive layer 2122 may be separated from the buffer layer 2121 before being softened or melted, and after the temperature is lowered, the curing adhesive layer 2122 may be recovered to the cured state preferentially to the adhesive layer 2131. In the process of separating the present pressing head 211 from the supporting member 220, the softened or melted portions of the cured adhesive layer 2122 may remain on the portion to be bonded a, the melted portions of the adhesive layer 2131 may remain on the portion to be bonded a (refer to fig. 12 and 13), and the melted portions of the adhesive layer 2131 may remain on the portion to be bonded a, and the other portion may remain on the buffer layer 2121 (refer to fig. 14).
In at least one embodiment of the present application, the melting point of the adhesive layer 2131 ranges from 50 ℃ to 70 ℃. In this manner, during the heating of the present pressure head by the heating member (the temperature is eventually raised to the present pressure temperature), the adhesive layer 2131 can be quickly melted and separated from the buffer layer 2121.
The combination of the features described in the present application is not limited to the combination described in the claims or the combination described in the specific embodiments, and all the features described in the present application may be freely combined or combined in any manner unless contradiction occurs between them.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the invention to the precise form disclosed, and any modifications, equivalents, and alternatives falling within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides a this pressure buffer structure which characterized in that includes:
the buffer layer is used for providing a contact surface contacted with the pressing head; and
and the curing adhesive layer is laminated with the buffer layer and can be arranged in a separated mode, wherein the curing adhesive layer is used for providing a contact surface with the part to be bonded.
2. The structure according to claim 1, wherein,
The material of the solidified glue layer comprises ultraviolet light solidified glue.
3. The present pressure buffer structure according to claim 1, further comprising:
an adhesive layer positioned between the buffer layer and the cured adhesive layer and configured to bond the cured adhesive layer and the buffer layer,
preferably, the material of the adhesive layer includes paraffin wax.
4. The present invention relates to a structure for buffering a pressure according to any one of claims 1 to 3,
the adhesive force between the cured adhesive layer and the buffer layer is not greater than the adhesive force between the cured adhesive layer and the to-be-bonded part.
5. The preparation method of the touch display module is characterized by comprising the following steps of:
providing a portion to be bonded;
applying pressure to one side, away from the cured adhesive layer, of the buffer layer in the pressing buffer structure according to any one of claims 1 to 4 by using the pressing head, so that the cured adhesive layer falls off and covers the to-be-bonded part.
6. The manufacturing method according to claim 5, wherein the softening temperature of the cured adhesive layer is lower than a present pressing temperature used when the present pressing head presses the to-be-bonded portion, wherein the applying pressure to the side of the buffer layer in the present pressing buffer structure facing away from the cured adhesive layer by the present pressing head to peel off the cured adhesive layer and cover the to-be-bonded portion, includes:
Applying pressure to one side of the buffer layer in the pressing buffer structure, which is far away from the solidified glue layer, by using the pressing head so that the solidified glue layer is softened or melted at the pressing temperature and then falls off and covers the to-be-bonded part,
preferably, the softening temperature ranges from 60 ℃ to 160 ℃,
preferably, the temperature of the present pressure ranges from 110 ℃ to 230 ℃.
7. The method according to claim 5, wherein,
and the orthographic projection of the part, which falls off in the cured adhesive layer, on the pressing head coincides with the orthographic projection of the part to be bonded on the pressing head.
8. The method according to claim 5, wherein,
the part of the cured adhesive layer which falls off coats the surface of the part to be bonded facing one side of the pressing head; or alternatively
And the part of the cured adhesive layer which falls off coats the surface of the part to be bonded facing one side of the pressing head, and coats the side surface adjacent to the surface of the part to be bonded facing one side of the pressing head.
9. The method according to claim 5, wherein applying pressure to a side of the buffer layer in the present buffer structure facing away from the cured adhesive layer by using the present pressure head to peel off the cured adhesive layer and cover the portion to be bonded, comprises:
And applying pressure to one side, away from the curing adhesive layer, of the buffer layer in the pressing buffer structure by using the pressing head, so that the curing adhesive layer falls off and covers the to-be-bonded part by using the adhesive layer in the pressing buffer structure.
10. The method according to claim 9, wherein the melting point of the adhesive layer is less than a pressing temperature used when the pressing head presses the to-be-bonded portion, wherein the applying pressure to a side of the buffer layer in the pressing buffer structure, which is away from the cured adhesive layer, by the pressing head, so as to peel off the cured adhesive layer by the adhesive layer in the pressing buffer structure and cover the to-be-bonded portion, includes:
applying pressure to one side of the buffer layer in the pressing buffer structure, which is far away from the solidified glue layer, by using the pressing head so that the solidified glue layer is driven to fall off together after the adhesive layer in the pressing buffer structure is melted and is covered on the to-be-bonded part,
preferably, the melting point of the adhesive layer is less than the softening temperature or melting point of the cured bondline,
preferably, the melting point of the adhesive layer ranges from 50 ℃ to 70 ℃.
CN202310341057.7A 2023-03-31 2023-03-31 Preparation method of pressure buffer structure and touch display module Pending CN116507174A (en)

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