CN116507041A - Chip mounter is used in production of accurate electronic components - Google Patents
Chip mounter is used in production of accurate electronic components Download PDFInfo
- Publication number
- CN116507041A CN116507041A CN202310769522.7A CN202310769522A CN116507041A CN 116507041 A CN116507041 A CN 116507041A CN 202310769522 A CN202310769522 A CN 202310769522A CN 116507041 A CN116507041 A CN 116507041A
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- led circuit
- chip mounter
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000003860 storage Methods 0.000 claims description 23
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 8
- 238000012937 correction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a chip mounter for producing precise electronic components, which comprises an operation main body, wherein the operation main body comprises a base, the bottom of the base is fixedly connected with a driving unit, and an output shaft of the driving unit is fixedly connected with a disc which is rotationally connected with the inside of the base; this chip mounter is used in accurate electronic components production can solve among the prior art effectively, when carrying out the paster to circular LED component, need place the LED circuit board on corresponding template in advance, then through transporting the platform, remove it to the preset position, after the paster finishes, transport the platform again with LED circuit board and template transport out, the LED circuit board after the manual work takes off the paster, put into new LED circuit board again, to circular LED circuit board, whole laminating process degree of automation is low, and the paster interval time of two sets of LED circuit boards is shorter, the workman can only stand and wait, extravagant labour's problem.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a chip mounter for producing precise electronic components.
Background
The LED chip mounter belongs to one of SMT chip mounters, is specially designed and customized SMT mounting equipment for the LED industry, and is used for realizing the assembly of a large number of LED circuit boards. The LED patch can be used for rapidly and accurately attaching the SMD to the PCB through the functions of suction, displacement, positioning, placement and the like.
At present, current chip mounter is when carrying out the paster to circular LED component, need place the LED circuit board in advance on corresponding template, then through transporting the platform, remove it to the preset position, vacuum equipment operation that the suction nozzle is connected, make suction nozzle department produce negative pressure and adsorb the LED paster, afterwards, a plurality of suction nozzles remove to LED circuit board top, at this moment, vacuum suction nozzle closes, the procedure operation of blowing simultaneously, place the LED paster in the position department that the LED circuit board corresponds, after the paster finishes, transport the platform again with LED circuit board and template transport out, the LED circuit board after the manual work is taken down the paster, put into new LED circuit board again, for circular LED circuit board, whole laminating process degree of automation is low, and the paster interval time of two sets of LED circuit boards is shorter, the workman can only stand and wait, extravagant labour.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention provides the chip mounter for producing the precise electronic components, which can effectively solve the problems that in the prior art, when a round LED element is subjected to chip mounting, an LED circuit board needs to be placed on a corresponding template in advance, then the LED circuit board is moved to a preset position through a transfer platform, after the chip mounting is finished, the LED circuit board and the template are transferred out by the transfer platform, the LED circuit board after the chip mounting is manually removed, a new LED circuit board is put in the transfer platform again, the automation degree of the whole bonding process is low aiming at the round LED circuit board, the chip mounting interval time of two groups of LED circuit boards is short, workers can only stand for waiting, and labor force is wasted.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
the invention provides a chip mounter for producing precise electronic components, comprising:
the operation main body comprises a base, a driving unit is fixedly connected to the bottom of the base, a disc which is rotationally connected with the inside of the base is fixedly connected to an output shaft of the driving unit, and a guide plate is rotationally connected to the outer surface of the disc;
the intermittent mechanism comprises a servo motor, the top of the servo motor is fixedly connected with the bottom of the base, an output shaft of the servo motor is fixedly connected with a rotating disc which is connected with the inside of the base in a rotating mode, the rotating disc is connected with a push rod in a rotating mode through a locating pin arranged on the upper surface of the rotating disc, and a reciprocating plate which is connected with the inner wall of the guide plate in a sliding mode is connected inside the push rod in a rotating mode through a rotating pin.
Further, the guide plate comprises a round frame, a transverse frame, a longitudinal frame and an arc plate, wherein the round frame, the transverse frame and the bottom of the longitudinal frame are fixedly connected with the top of the base through connecting plates, the outer surface of the transverse frame is fixedly communicated with the outer surface of the longitudinal frame, one side of the transverse frame, far away from the longitudinal frame, is fixedly communicated with the inner part of the round frame, and the outer surface of the arc plate is fixedly connected with the outer surface of the transverse frame.
Further, the round frame is sleeved on the circumferential outer surface of the disc, the bottom of the inner wall of the transverse frame and the upper surface of the disc are positioned on the same horizontal plane, and the outer surface of the reciprocating plate is in sliding connection with the inner wall of the longitudinal frame.
Further, the automatic feeding device also comprises a feeding mechanism, wherein the feeding mechanism comprises a supporting plate, the bottom of the supporting plate is fixedly connected with the top of the base, the outer surface of the supporting plate is fixedly connected with a storage tube through a bearing plate, and the inner wall of the storage tube is slidably connected with a plurality of groups of templates.
Further, a plurality of the templates are internally provided with grooves for placing external round LED circuit boards respectively, and one side, far away from the grooves, of the templates is provided with a magnetic plate.
Further, the outer surface of the longitudinal frame is fixedly connected with a pusher, the outer side of the pusher is fixedly connected with a wrapping block, and the inner side of the longitudinal frame is provided with a built-in groove which is attached to the outer surface of the wrapping block.
Further, a first magnetic member is arranged at the bottom of the inner wall of the transverse frame, and a second magnetic member is arranged at the bottom of the inner wall of the longitudinal frame.
Further, the first magnetic force piece and the second magnetic force piece comprise magnetic force strips and magnetic force blocks, and the magnetic force strips are arranged in two and symmetrically distributed by taking the magnetic force blocks as the center.
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
the invention is provided with a disc and a feeding mechanism, wherein the circular LED circuit boards are firstly loaded in grooves of templates, then the templates loaded with the circular LED circuit boards are firstly placed in a storage tube of the feeding mechanism one by one, the template at the lowest layer in the storage tube falls into the upper surface of the disc, a driving unit is started, an internal motor drives the disc to rotate around the inner side of a circular frame, the disc drives the templates at the upper surface to synchronously rotate clockwise by virtue of self friction force, the templates slide into a space formed by an arc plate and the circular frame and are firstly sent into a transverse frame, the scattered templates are orderly sequenced, and meanwhile, the template in the storage tube falls down (as long as the disc rotates, the template in the storage tube moves along with the rotation of the disc, and the template in the storage tube stops falling when the disc stops rotating). In the processing process, after all blanking of the template in the storage tube is finished, the disc continuously rotates slowly, the template on the upper surface of the disc continuously pushes the template in the transverse frame, the template in the transverse frame is guided to move forwards, and after all the template on the upper surface of the disc disappears, reloading is needed in the storage tube at the moment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a three-dimensional feeding mechanism according to an embodiment of the present invention;
FIG. 3 is a schematic view of the structure of FIG. 1 with a partial enlargement according to an embodiment of the present invention;
FIG. 4 is a schematic view of a three-dimensional multi-state structure according to an embodiment of the present invention;
FIG. 5 is a schematic view of the structure of FIG. 4 with a partial enlargement according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a three-dimensional separation of a template and a circular LED circuit board according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a three-dimensional separation multi-angle structure of a template and a circular LED circuit board according to an embodiment of the present invention.
Reference numerals in the drawings represent respectively: 1. an operation body; 11. a base; 12. driving a unit; 13. a disc; 14. a guide plate; 141. a round frame; 142. a transverse frame; 143. a vertical frame; 144. an arc plate; 1431. a pusher; 1432. wrapping the block; 1433. a built-in groove; 2. an intermittent mechanism; 21. a servo motor; 22. a rotating disc; 23. a push rod; 24. a shuttle plate; 3. a feeding mechanism; 31. a support plate; 32. a storage tube; 33. a template; 34. a groove; 35. a magnetic plate; 4. a first magnetic member; 5. a second magnetic member; 51. a magnetic bar; 52. and a magnetic block.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention is further described below with reference to examples.
Examples:
referring to fig. 1 to 7, the present invention provides a technical solution: a chip mounter for precision electronic component production includes:
the operation main body 1, the operation main body 1 comprises a base 11, a driving unit 12 is fixedly connected to the bottom of the base 11, a disc 13 which is rotationally connected with the inside of the base 11 is fixedly connected to an output shaft of the driving unit 12, and a guide plate 14 is rotationally connected to the outer surface of the disc 13;
intermittent mechanism 2, intermittent mechanism 2 includes servo motor 21, servo motor 21 top and base 11 bottom fixed connection, servo motor 21's output shaft fixed connection with the inside rotary disk 22 that rotates with base 11 to be connected, rotary disk 22 rotates through the locating pin that sets up its upper surface and is connected with push rod 23, push rod 23 inside through rotating the round pin rotation be connected with guide board 14 inner wall sliding connection's reciprocal board 24.
The guide board 14 comprises a round frame 141, a horizontal frame 142, a vertical frame 143 and an arc plate 144, wherein the bottom of the round frame 141, the bottom of the horizontal frame 142 and the bottom of the vertical frame 143 are fixedly connected with the top of the base 11 through connecting plates, the outer surface of the horizontal frame 142 is fixedly communicated with the outer surface of the vertical frame 143, one side, far away from the vertical frame 143, of the horizontal frame 142 is fixedly communicated with the inside of the round frame 141, and the outer surface of the arc plate 144 is fixedly connected with the outer surface of the horizontal frame 142. The driving unit 12 is started, the internal motor drives the disc 13 to rotate around the inner side of the round frame 141, the disc 13 drives the templates 33 on the upper surface to synchronously rotate clockwise by virtue of self friction force, and the templates 33 slide into the space surrounded by the arc plate 144 and the round frame 141 and are sent into the transverse frame 142 one by one to sequentially sort the scattered templates 33.
The round frame 141 is sleeved on the circumferential outer surface of the disc 13, the bottom of the inner wall of the transverse frame 142 and the upper surface of the disc 13 are positioned on the same horizontal plane, and the outer surface of the reciprocating plate 24 is in sliding connection with the inner wall of the longitudinal frame 143.
Still include feed mechanism 3, feed mechanism 3 includes backup pad 31, backup pad 31 bottom and base 11 top fixed connection, and backup pad 31 surface is through accepting board fixedly connected with storage tube 32, and storage tube 32 inner wall sliding connection has a plurality of groups of templates 33.
Grooves 34 for placing external round LED circuit boards are formed in the templates 33 respectively, and a magnetic plate 35 is arranged on one side, away from the grooves 34, of the templates 33.
The outer surface of the vertical frame 143 is fixedly connected with a pusher 1431, the outer side of the pusher 1431 is fixedly connected with a wrapping block 1432, and the inner side of the vertical frame 143 is provided with a built-in groove 1433 which is attached to the outer surface of the wrapping block 1432.
The bottom of the inner wall of the transverse frame 142 is provided with a first magnetic member 4, and the bottom of the inner wall of the longitudinal frame 143 is provided with a second magnetic member 5.
The first magnetic member 4 and the second magnetic member 5 each comprise a magnetic bar 51 and a magnetic block 52, and the magnetic bars 51 are arranged in two and are symmetrically distributed by taking the magnetic blocks 52 as the center. The first magnetic member 4 is composed of two magnetic strips 51 and a magnetic block 52, and is formed in an "eight" symmetrical shape, and the states of the magnetic plate 35 below the template 33 of the present invention are divided into two types: the first type is just that the magnetic plate 35 is located at one side of the moving direction, and the magnetic plates 35 are distributed with the magnetic strips 51 being central symmetry (the probability is very low), so that the direction and the positioning of the round LED circuit board can be automatically corrected, and the other states except the first state are all the second type.
Referring to fig. 1 to 7, when a conventional chip mounter performs chip mounting on a circular LED element, an LED circuit board needs to be placed on a corresponding template in advance, then the LED circuit board is moved to a predetermined position by a transfer platform, a suction nozzle places the LED chip on a position corresponding to the LED circuit board, after the chip mounting is completed, the transfer platform transfers the LED circuit board and the template out, the LED circuit board after the chip mounting is manually removed, a new LED circuit board is placed again, and the automation degree of the whole lamination process is low for the circular LED circuit board, and the chip mounting interval time of two groups of LED circuit boards is short, so that workers can only stand for waiting, thereby wasting labor force;
in order to overcome the defects, the invention designs the chip mounter for producing the precise electronic components.
Specifically, firstly, the circular LED circuit boards are loaded in the grooves 34 of the templates 33, secondly, the templates 33 loaded with the circular LED circuit boards are placed in the storage tubes 32 of the feeding mechanism 3 one by one, the templates 33 at the lowest layer in the storage tubes 32 fall on the upper surfaces of the discs 13 (the distance between the storage tubes 32 and the upper surfaces of the discs 13 is larger than the thickness of the templates 33), after the storage tubes 32 are loaded, the driving unit 12 is started, the discs 13 are driven to rotate around the inner sides of the circular frames 141 by the internal motors, the discs 13 are driven to rotate clockwise by virtue of self friction force, the templates 33 on the upper surfaces are driven to synchronously rotate, the templates 33 slide into the space surrounded by the arc plates 144 and the circular frames 141 and are sent into the transverse frames 142 one by one, the scattered templates 33 are sequentially ordered, and meanwhile, the templates 33 in the storage tubes 32 fall down (as long as the templates 33 in the storage tubes 32 move along with the rotation of the discs 13, the falling of the templates 33 in the storage tubes 32 stop when the rotation of the discs 13 stops. By utilizing the cooperation of the disc 13, the guide plate 14 and the feeding mechanism 3, batch automatic feeding of the round LED circuit board is realized in the processing process, compared with the traditional transfer platform, the LED circuit board and the template are transferred out, the LED circuit board after the patch is manually taken down is put into a new LED circuit board again, and the operation is repeated.
In the processing process, after the templates 33 in the storage tube 32 are completely blanked, the disc 13 continues to slowly rotate, the templates 33 on the upper surface of the disc 13 continuously push the templates 33 in the transverse frame 142, the templates 33 in the transverse frame 142 are guided to move forwards, and after the templates 33 on the upper surface of the disc 13 are completely disappeared, the storage tube 32 is required to be reloaded at the moment, and because the time interval of each loading is longer, workers have enough time to operate other devices, so that the labor cost is greatly reduced.
When the template 33 for loading the LED circuit board slides in the transverse frame 142, the direction of the LED circuit board cannot be determined (the angle direction of different round LED circuit boards is different, the reason is that the existing round LED circuit boards adopt templates and transfer platforms and cannot be conveyed by adopting conveying belts, and the directions of different LED circuit boards cannot be accurately corrected and positioned), so that the follow-up suction nozzle patch is affected.
When in use, the template 33 slides in the transverse frame 142 and preferentially passes through the first magnetic member 4, wherein the first magnetic member 4 consists of two magnetic strips 51 and one magnetic block 52 to form an eight-shaped symmetrical type, and the states of the magnetic plates 35 below the template 33 are divided into two types: the first is that the magnetic plate 35 is located at one side of the moving direction, and the magnetic plates 35 are symmetrically distributed at the center of the magnetic strip 51 (the probability is very low), and the other states except the first state are the second state;
automatic correction direction and positioning of circular LED circuit board:
in the first state, when the template 33 and the magnetic plate 35 move synchronously, the magnetic plate 35 slides between the adjacent magnetic strips 51 (here, the first magnetic member 4), and the attraction forces generated by the magnetic strips 51 at the two sides are consistent, so that the template 33 and the magnetic plate 35 keep unchanged and move forward slowly (the magnetic block 52 is positioned at the center, and the movement track of the template 33 and the magnetic plate 35 is not changed). After the template 33 and the magnetic plate 35 slide into the longitudinal frame 143, the magnetic plate 35 is positioned at one side of the right magnetic bar 51 on the second magnetic member 5, then the servo motor 21 on the intermittent mechanism 2 is started to drive the rotary disc 22 to rotate, and the reciprocating plate 24 is driven to move forward by the push rod 23 to push the template 33 and the magnetic plate 35 sliding into the longitudinal frame 143, the template 33 and the magnetic plate 35 slide along the inner wall of the longitudinal frame 143, the magnetic plate 35 starts to contact the right magnetic bar 51 on the second magnetic member 5, the template 33 and the magnetic plate 35 slowly move forward while rotating anticlockwise (due to the small contact area between the arc edge of the template 33 and the reciprocating plate 24, the right magnetic bar 51 performs magnetic correction on the direction of the template 33 and the magnetic plate 35) until after the magnetic plate 35 contacts the magnetic block 52 on the second magnetic member 5, the reciprocating plate 24 stops pushing, the pusher 1431 pushes the wrapping block 1432 to clamp the circumferential surface of the template 33, and finally the patch is performed.
In the second state, when the template 33 and the magnetic plate 35 move synchronously, the magnetic plate 35 slides between the magnetic bars 51 (here, the first magnetic member 4), the magnetic plate 35 contacts the magnetic bars 51 on the first magnetic member 4, under the action of the magnetic force, the template 33 and the magnetic plate 35 rotate while slowly moving rightward (because the contact of the arc area between the templates 33 is very small, the magnetic bars 51 perform magnetic correction rotation on the directions of the template 33 and the magnetic plate 35), until the magnetic plate 35 contacts the magnetic blocks 52 on the first magnetic member 4, the two are quickly attracted, at this time, the magnetic plate 35 is positioned at the side far from the moving direction (the coincidence is opposite to the first state), along with the pushing of the subsequent template 33, the corrected template 33 and the magnetic plate 35 slide into the longitudinal frame 143, the magnetic plate 35 is positioned at the left magnetic bar 51 side on the second magnetic member 5, then the servo motor 21 on the intermittent mechanism 2 is started to drive the rotary disk 22 to rotate, the reciprocating plate 24 is driven to move forwards by the push rod 23 to push the template 33 and the magnetic plate 35 which are slid into the longitudinal frame 143, the template 33 and the magnetic plate 35 slide along the inner wall of the longitudinal frame 143, the magnetic plate 35 starts to contact the left magnetic bar 51 on the second magnetic member 5, under the action of the magnetic force, the template 33 and the magnetic plate 35 slowly move forwards while rotating clockwise (because the contact area between the arc edge of the template 33 and the reciprocating plate 24 is very small, the left magnetic bar 51 performs magnetic correction on the direction of the template 33 and the magnetic plate 35) until the magnetic plate 35 is quickly attracted after contacting the magnetic block 52 on the second magnetic member 5, the reciprocating plate 24 stops pushing, the pusher 1431 pushes the wrapping block 1432 to clamp the circumferential surface of the template 33, and finally, attaching the suction nozzle.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; these modifications or substitutions do not depart from the essence of the corresponding technical solutions from the protection scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. A chip mounter is used in production of accurate electronic components, its characterized in that includes:
the operation main body (1), the operation main body (1) comprises a base (11), a driving unit (12) is fixedly connected to the bottom of the base (11), a disc (13) which is rotationally connected with the inside of the base (11) is fixedly connected to an output shaft of the driving unit (12), and a guide plate (14) is rotationally connected to the outer surface of the disc (13);
intermittent mechanism (2), intermittent mechanism (2) include servo motor (21), servo motor (21) top and base (11) bottom fixed connection, the output shaft fixedly connected with of servo motor (21) is with inside rotary disk (22) of rotating the connection of base (11), rotary disk (22) are connected with push rod (23) through the locating pin rotation that sets up its upper surface, push rod (23) are inside to be connected with through the rotation round pin rotation with guide board (14) inner wall sliding connection's reciprocating plate (24).
2. The chip mounter for precision electronic component production according to claim 1, wherein: guide board (14) are including circle frame (141), horizontal frame (142), indulge frame (143) and arc board (144), circle frame (141), horizontal frame (142) and indulge frame (143) bottom all through connecting plate and base (11) top fixed connection, horizontal frame (142) surface and indulge frame (143) surface fixed intercommunication, horizontal frame (142) are kept away from indulge frame (143) one side and the inside fixed intercommunication of circle frame (141), arc board (144) surface and horizontal frame (142) surface fixed connection.
3. The chip mounter for precision electronic component production according to claim 2, wherein: the round frame (141) is sleeved on the circumferential outer surface of the disc (13), the bottom of the inner wall of the transverse frame (142) and the upper surface of the disc (13) are positioned on the same horizontal plane, and the outer surface of the reciprocating plate (24) is in sliding connection with the inner wall of the longitudinal frame (143).
4. The chip mounter for precision electronic component production according to claim 1, wherein: still include feed mechanism (3), feed mechanism (3) include backup pad (31), backup pad (31) bottom and base (11) top fixed connection, backup pad (31) surface is through accepting board fixedly connected with storage tube (32), storage tube (32) inner wall sliding connection has a plurality of groups template (33).
5. The chip mounter for precision electronic component production according to claim 4, wherein: a plurality of templates (33) are internally provided with grooves (34) for placing external round LED circuit boards respectively, and one side, far away from the grooves (34), of each template (33) is provided with a magnetic plate (35).
6. The chip mounter for precision electronic component production according to claim 2, wherein: the outer surface of the longitudinal frame (143) is fixedly connected with a pusher (1431), the outer side of the pusher (1431) is fixedly connected with a wrapping block (1432), and the inner side of the longitudinal frame (143) is provided with a built-in groove (1433) attached to the outer surface of the wrapping block (1432).
7. The chip mounter for precision electronic component production according to claim 2, wherein: the bottom of the inner wall of the transverse frame (142) is provided with a first magnetic member (4), and the bottom of the inner wall of the longitudinal frame (143) is provided with a second magnetic member (5).
8. The chip mounter for precision electronic component production according to claim 7, wherein: the first magnetic force piece (4) and the second magnetic force piece (5) comprise magnetic force strips (51) and magnetic force blocks (52), and the magnetic force strips (51) are arranged in two and symmetrically distributed by taking the magnetic force blocks (52) as the center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310769522.7A CN116507041B (en) | 2023-06-28 | 2023-06-28 | Chip mounter is used in production of accurate electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310769522.7A CN116507041B (en) | 2023-06-28 | 2023-06-28 | Chip mounter is used in production of accurate electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116507041A true CN116507041A (en) | 2023-07-28 |
| CN116507041B CN116507041B (en) | 2023-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310769522.7A Active CN116507041B (en) | 2023-06-28 | 2023-06-28 | Chip mounter is used in production of accurate electronic components |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020040409A (en) * | 2000-11-24 | 2002-05-30 | 정문술 | Feeder for surface mounting device |
| CN111290394A (en) * | 2020-03-09 | 2020-06-16 | 广州安彤实业有限公司 | Automatic sheet material storage and management system |
| CN216357559U (en) * | 2021-11-16 | 2022-04-19 | 苏州迎安电子科技有限公司 | Paster frock of notebook keyboard circuit board paster technology |
| CN114449881A (en) * | 2020-11-01 | 2022-05-06 | 肖世涛 | Assembly method based on PCB surface-mounted electronic component device |
| CN217248490U (en) * | 2022-04-25 | 2022-08-23 | 诚淘(浙江)机械有限公司 | Reciprocating type pushing equipment is used to filling material |
-
2023
- 2023-06-28 CN CN202310769522.7A patent/CN116507041B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020040409A (en) * | 2000-11-24 | 2002-05-30 | 정문술 | Feeder for surface mounting device |
| CN111290394A (en) * | 2020-03-09 | 2020-06-16 | 广州安彤实业有限公司 | Automatic sheet material storage and management system |
| CN114449881A (en) * | 2020-11-01 | 2022-05-06 | 肖世涛 | Assembly method based on PCB surface-mounted electronic component device |
| CN216357559U (en) * | 2021-11-16 | 2022-04-19 | 苏州迎安电子科技有限公司 | Paster frock of notebook keyboard circuit board paster technology |
| CN217248490U (en) * | 2022-04-25 | 2022-08-23 | 诚淘(浙江)机械有限公司 | Reciprocating type pushing equipment is used to filling material |
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| Publication number | Publication date |
|---|---|
| CN116507041B (en) | 2023-10-17 |
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