CN116498939A - Water cooling device for ultra-high power solid-state light source - Google Patents
Water cooling device for ultra-high power solid-state light source Download PDFInfo
- Publication number
- CN116498939A CN116498939A CN202310633918.9A CN202310633918A CN116498939A CN 116498939 A CN116498939 A CN 116498939A CN 202310633918 A CN202310633918 A CN 202310633918A CN 116498939 A CN116498939 A CN 116498939A
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- Prior art keywords
- state light
- light source
- water
- solid
- ultra
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 238000001816 cooling Methods 0.000 title claims abstract description 47
- 239000000110 cooling liquid Substances 0.000 claims abstract description 28
- 239000000498 cooling water Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims description 22
- 238000005452 bending Methods 0.000 claims description 15
- 238000009826 distribution Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004880 explosion Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/57—Cooling arrangements using liquid coolants characterised by control arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a water cooling device for an ultra-high power solid-state light source, which comprises a solid-state light source, a water cooling plate, a cooling liquid pipeline and a water chiller; the solid-state light source is a heating source, the water chiller comprises a refrigerating system and a water pump, the refrigerating system is used for cooling water, and the cooling water is conveyed to the solid-state light source through a cooling liquid pipe by the water pump; the water cooling plate is used for conducting heat of the solid-state light source to cooling water. According to the scheme of the water cooling plate, the fins are arranged in the cooling liquid main flow channel, so that the contact area of the water cooling plate and cooling liquid is increased, the heat dissipation effect is improved, and the effective heat dissipation of the ultra-high-power solid-state light source is realized; on the other hand, the pressure drop of the system is prevented from being greatly increased, the overall heat dissipation performance of the system is improved, and the heat dissipation cost is reduced.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a water cooling device for an ultra-high power solid-state light source.
Background
The existing high-power solid-state light source mostly adopts the mode of aluminum profile fins and fans or heat pipe fins and fans (CN 210954582U) to dissipate heat, so that the noise of the fans is high during operation, meanwhile, the heat dissipation stability of the system is greatly influenced by the external environment, the solid performance is unstable, and the reliability of the system is reduced. Compared with water cooling, the fan has low heat dissipation efficiency, and cannot meet the heat dissipation requirement of the ultra-high power solid-state light source under the condition of limited area. Some solid-state light sources (CN 210668363U) can also adopt water cooling for heat dissipation, but the heat dissipation power requirement is not high, so that the flow channel design is simpler.
The water cooling heat dissipation mode is widely applied, is generally applied to heat dissipation of electronic devices such as a power battery (CN 108520988A, CN 212676374U), a laser (CN 209844198U), a high-power IGBT (CN 215527713U) and the like, has large volume and small relative heating density, and can meet the requirements by adopting a single-runner design scheme.
Some schemes (CN 215342568U) increase the contact area of the water cooling plate and the cooling liquid to improve the heat dissipation effect by adding the micro-channels, but the pressure drop of the cooling liquid can be greatly increased by bending the micro-channels for multiple times, the burden of a water cooler or a water pump is increased, and the scheme can only be suitable for the cooling liquid with low flow rate, and the overall heat dissipation efficiency is reduced.
Disclosure of Invention
The invention aims to solve the problems of the prior art and provide a water cooling device for an ultra-high power solid-state light source.
The technical solution for realizing the purpose of the invention is as follows: a water cooling device for an ultra-high power solid state light source comprises a solid state light source, a water cooling plate, a cooling liquid pipeline and a water chiller; the solid-state light source is a heating source, the water chiller comprises a refrigerating system and a water pump, the refrigerating system is used for cooling water, and the cooling water is conveyed to the solid-state light source through a cooling liquid pipe by the water pump; the water cooling plate is used for conducting heat of the solid-state light source to cooling water.
Further, the water cooling plate comprises an upper cover and a lower cover, a cooling liquid main runner is formed between the upper cover and the lower cover after the upper cover and the lower cover are installed and matched, an array type fin is arranged in the runner, and a fin distribution area corresponds to a solid-state light source installation area; the cooling liquid main runner is of an S-shaped bending structure.
Further, the solid-state light source and the array fins are respectively arranged on the upper surface and the lower surface of the upper cover; or the array fins and the solid-state light source are respectively arranged on the upper surface and the lower surface of the lower cover.
Further, a groove is formed in the upper surface of the upper cover or the lower surface of the lower cover, and the solid-state light source is installed in the groove.
Further, the distribution area of the array fins is larger than the size of the solid-state light source, and the fins positioned right below the solid-state light source are distributed more densely.
Further, the lower cover is of a hollow cavity structure with an opening at the upper part, and the upper cover is used as an end cover to cover the lower cover.
Further, the upper cover and the lower cover are rectangular structures with identical structures, and after the upper cover and the lower cover are installed and matched, two ends are respectively fixed through the left end cover and the right end cover.
Further, the bending part of the S-shaped bending structure is a round angle, and the radius of the round angle is the same as the width of the flow channel.
Further, the end faces of the fins are plane, arc-shaped or diamond-shaped.
Further, a sealing ring is arranged between the upper cover and the lower cover.
Further, the upper cover and the lower cover are made of metal materials with high heat conductivity.
Compared with the prior art, the invention has the remarkable advantages that: the fins are arranged in the cooling liquid main flow channel, so that on one hand, the contact area of the water cooling plate and the cooling liquid is increased, the heat dissipation effect is improved, and the effective heat dissipation of the ultra-high-power solid-state light source is realized; on the other hand, the pressure drop of the system is prevented from being greatly increased, the overall heat dissipation performance of the system is improved, and the heat dissipation cost is reduced.
The invention is described in further detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a water cooling apparatus for an ultra-high power solid state light source.
Fig. 2 is a view showing an overall structure of a water-cooled panel according to an embodiment, wherein (a) in fig. 2 is a view showing an explosion of the water-cooled panel according to fig. 1, and (c) in fig. 2 is a view showing an explosion of the water-cooled panel according to fig. 2.
FIG. 3 is a graph showing the simulation results of a water-cooled plate according to one embodiment, wherein (a) in FIG. 3 is a graph showing the temperature distribution of the water-cooled plate (ambient temperature: 25 ℃ C.), and (b) in FIG. 2 is a graph showing the flow rate of the cooling liquid in the flow channel (initial flow: 130L/min).
Fig. 4 is a top flow channel view of a water cooled plate in one embodiment.
Fig. 5 is a schematic diagram of the end surface shape of a water cooling plate fin in one embodiment, wherein (a) in fig. 5 is a plane, (b) in fig. 5 is an arc shape, and (c) in fig. 5 is a diamond shape.
FIG. 6 is a cross-sectional view of a water cooled panel in one embodiment.
Fig. 7 is a view showing an overall structure of a water-cooled panel according to an embodiment, wherein (a) in fig. 7 is a view showing an explosion of the water-cooled panel in fig. 1, and (c) in fig. 7 is a view showing an explosion of the water-cooled panel in fig. 2.
Fig. 8 is a view showing the construction of a water-cooled panel according to an embodiment, wherein (a) in fig. 8 is a view showing the whole construction of the water-cooled panel, and (b) in fig. 8 is an exploded view of the water-cooled panel.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In one embodiment, in conjunction with FIG. 1, there is provided a water cooling apparatus for an ultra-high power solid state light source, the apparatus comprising a solid state light source 1, a water cooling plate 2, a coolant pipe 3, and a chiller 4; the solid-state light source 1 is a heating source, the water chiller 4 comprises a refrigerating system and a water pump, the refrigerating system is used for cooling water, and the cooling water is conveyed to the solid-state light source through a cooling liquid pipe by the water pump; the water cooling plate 2 is used for conducting heat of the solid-state light source to cooling water.
The water cooling plate comprises an upper cover and a lower cover, a cooling liquid main runner is formed in the middle of the upper cover and the lower cover after the upper cover and the lower cover are installed and matched, an array type fin is arranged in the runner, and a fin distribution area corresponds to a solid-state light source installation area; the cooling liquid main runner is of an S-shaped bending structure.
The solid-state light source and the array fins are respectively arranged on the upper surface and the lower surface of the upper cover; or the array fins and the solid-state light source are respectively arranged on the upper surface and the lower surface of the lower cover. For example: the lower cover is of a hollow cavity structure with an opening at the upper part, and the upper cover is provided with array fins which are arranged and serve as an end cover to cover the lower cover. Or the upper cover is of a cavity structure with array fins, and the lower cover is used as an end cover to cover the upper cover.
The upper surface of the upper cover or the lower surface of the lower cover is provided with a groove, and the solid-state light source is arranged in the groove.
The distribution area of the array fins is larger than the size of the solid-state light source, and the fins positioned right below the solid-state light source are distributed more densely.
The bending part of the S-shaped bending structure is a round angle, and the radius of the round angle is the same as the width of the flow channel.
The end faces of the fins are plane, arc-shaped or diamond-shaped.
And a sealing ring is arranged between the upper cover and the lower cover.
The design of the water cooled panels is critical in the overall system. According to the external dimensions of the solid-state light source and the different heating power, the water cooling plate has different design schemes.
Further, in one embodiment, a water cooled plate exemplary embodiment 1 is shown in FIG. 2. The water cooling plate 2 comprises a lower cover 23 with a cavity structure and an upper cover 21 which is used as an end cover and is installed at an opening above the lower cover 23, a sealing ring 22 is arranged between the upper cover and the lower cover, a channel with an S-shaped bending structure is arranged in the cavity of the lower cover 23, the upper cover and the lower cover are installed and matched (the bulge is matched with the channel) to form a cooling liquid main channel, an array fin is arranged in the channel, and a fin distribution area corresponds to a solid-state light source installation area. The upper cover 21 is provided with a groove, the solid-state light source 1 is installed in the groove, and the array fins are fixedly installed on the lower surface of the upper cover 21, as shown in fig. 6, so that the light source is close to a cooling liquid flow channel as much as possible, and the thermal resistance between the heat source and cooling is reduced. Here, the fin height is determined by factors such as the heat generation power of the solid-state light source.
In this embodiment, the overall dimensions of the water-cooled panels are: 350mm 280mm 42mm, solid state light source area: 225mm x 210mm. The upper cover and the lower cover are made of aluminum alloy, the upper cover is generally made of aluminum profile through a stretching process, and the cavity of the lower cover is generally made of die-casting, so that mass production can be realized in low cost. The fin arrangement of the upper cover part is determined by the specification of the solid-state light source, and the fin distribution area is not smaller than the size of the solid-state light source. The height of the fins is determined by the heating power of the solid-state light source and other factors, in order to reduce the processing difficulty, the thickness of the fins is not less than 1.5mm, the distance is not less than 2.5mm, and the height of the fins is not more than 25mm.
The water cooling device is simulated by using a solidworks flow simulation, the flow rate of the water cooling device is set to be 130L/min, the solid state thermal power is 15kw, the ambient temperature is 25 ℃, and all surfaces are in good contact. The simulation result is shown in FIG. 3, the average temperature rise of the solid-state light source substrate is not more than 15.3 ℃, and the pressure drop of the water cooling plate is not more than 0.11MPa. The heat dissipation requirement of the solid-state light source can be met.
In this solution, as shown in fig. 4, the main flow channel of the water-cooled plate is preferably bent 3 times to form an M-shaped structure, where the bending is generally not more than 5 times, and excessive bending may cause excessive pressure drop of the system, but may rather cause poor heat dissipation effect. The structure treatment at the bending part is a round angle, the radius of the round angle is the same as the width of the runner, and the backflow of the cooling liquid at the semi-closed structure is avoided. The positions corresponding to the solid-state light sources in the main flow channels are distributed by dense teeth, the denser the distribution is, the better the heat dissipation effect is, the comprehensive processing difficulty is realized, the thickness of the fins is designed to be 1.5mm, and the distance is 2.5mm. The coolant flow rates at section 1, section 2 and section 3 in fig. 4 should be the same or similar to avoid backflow of the liquid in part of the flow channels.
As shown in FIG. 5, the end surfaces of the fins are changed from the common plane into circular arc or diamond, so that the resistance of the cooling liquid in flowing can be well reduced, the pressure drop can be reduced by about 10% through simulation, and meanwhile, the heat dissipation effect of the water cooling plate can not be obviously reduced.
According to the heat dissipation mode, on one hand, the fins are increased, the contact area of the cooling liquid and the water cooling plate is increased, the heat dissipation efficiency is improved, on the other hand, the pressure drop is not obviously increased, the operation load of the water cooling machine is reduced, and the heat dissipation cost of the whole system is reduced.
Further, in one embodiment, as shown in fig. 7, the water cooling plate exemplary scheme 2 includes a lower cover 61 with a cavity structure, and an upper cover 63 as an end cover mounted at an opening above the lower cover 61, and a sealing ring 62 is disposed between the upper cover and the lower cover. The difference between this solution and the solution 1 described above is that the fin structure is in the cavity of the lower cover instead of on the end cover, and the solid state light source is mounted in a recess in the lower surface of the lower cover. The processing mode is milling processing of a machine tool, and the material can be high heat conductivity materials such as red copper, aluminum alloy and the like.
Further, in one embodiment, exemplary water-cooled plate solution 3 is shown in fig. 8, and the water-cooled plate 5 includes 4 parts: an upper cover 51, a lower cover 52, a left cover 53 and a right cover 54. The upper cover 51 and the lower cover 52 are of identical rectangular structures, clamping grooves are correspondingly formed on the matched surfaces of the upper cover 51 and the lower cover 52, an S-shaped bending structure cooling liquid main runner is formed after installation and matching, and two ends of the cooling liquid main runner are fixed through the left cover 53 and the right cover 54 respectively. The 4 parts form an internal complete flow passage, the peripheral joints are sealed by sealing strips and filling sealant, and the internal flow parameters can be kept consistent with the scheme 1.
The array fins may be mounted in the grooves of the upper cover 51 or the lower cover 52, or may be partially mounted in the grooves of the upper cover 51 and partially mounted in the grooves of the lower cover 52.
Here, the four parts in the water-cooled plate structure can be processed by a machine tool milling method, and the processing method can adopt materials with better thermal conductivity such as red copper, aluminum alloy and the like, but has higher cost. In order to reduce the cost, the upper cover and the lower cover are manufactured by adopting an aluminum profile stretching process, and the left cover and the right cover can be manufactured by adopting a die casting mode so as to realize low-cost mass manufacturing.
The foregoing has outlined and described the basic principles, features, and advantages of the present invention. It will be understood by those skilled in the art that the foregoing embodiments are not intended to limit the invention, and the above embodiments and descriptions are meant to be illustrative only of the principles of the invention, and that various modifications, equivalent substitutions, improvements, etc. may be made within the spirit and scope of the invention without departing from the spirit and scope of the invention.
Claims (10)
1. The water cooling device for the ultra-high power solid-state light source is characterized by comprising the solid-state light source, a water cooling plate, a cooling liquid pipeline and a water chiller; the solid-state light source is a heating source, the water chiller comprises a refrigerating system and a water pump, the refrigerating system is used for cooling water, and the cooling water is conveyed to the solid-state light source through a cooling liquid pipe by the water pump; the water cooling plate is used for conducting heat of the solid-state light source to cooling water.
2. The water cooling device for the ultra-high power solid state light source according to claim 1, wherein the water cooling plate comprises an upper cover and a lower cover, a cooling liquid main runner is formed in the middle after the upper cover and the lower cover are installed and matched, an array fin is arranged in the runner, and a fin distribution area corresponds to a solid state light source installation area; the cooling liquid main runner is of an S-shaped bending structure.
3. The water cooling device for ultra-high power solid state light sources of claim 2, wherein the solid state light sources and the array fins are mounted on the upper and lower surfaces of the upper cover, respectively; or the array fins and the solid-state light source are respectively arranged on the upper surface and the lower surface of the lower cover.
4. The water cooling device for ultra-high power solid state light source as claimed in claim 2, wherein the upper surface of the upper cover or the lower surface of the lower cover is provided with a groove, and the solid state light source is installed in the groove.
5. The water cooling device for ultra-high power solid state light sources of claim 2, wherein the array of fins has a distribution area greater than the size of the solid state light source and the fins directly below the solid state light source are more densely distributed.
6. The water cooling device for ultra-high power solid state light sources of claim 2, wherein the lower cover is a hollow cavity structure with an upper opening, and the upper cover is covered on the lower cover as an end cover.
7. The water cooling device for the ultra-high power solid-state light source according to claim 2, wherein the upper cover and the lower cover are of rectangular structures with identical structures, and after the upper cover and the lower cover are mounted and matched, two ends of the upper cover and the lower cover are respectively fixed through a left end cover and a right end cover.
8. The water cooling device for an ultra-high power solid state light source according to claim 2, wherein the bending part of the S-shaped bending structure is a round angle, and the radius of the round angle is the same as the width of the flow channel.
9. The water cooling device for ultra-high power solid state light sources of claim 2, wherein the fin end faces are planar or circular arc or diamond.
10. The water cooling device for ultra-high power solid state light sources of claim 2, wherein a sealing ring is provided between the upper cover and the lower cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310633918.9A CN116498939A (en) | 2023-05-31 | 2023-05-31 | Water cooling device for ultra-high power solid-state light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310633918.9A CN116498939A (en) | 2023-05-31 | 2023-05-31 | Water cooling device for ultra-high power solid-state light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116498939A true CN116498939A (en) | 2023-07-28 |
Family
ID=87316609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310633918.9A Pending CN116498939A (en) | 2023-05-31 | 2023-05-31 | Water cooling device for ultra-high power solid-state light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116498939A (en) |
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2023
- 2023-05-31 CN CN202310633918.9A patent/CN116498939A/en active Pending
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