CN116476489A - Multilayer structure protection board with conductivity and preparation method thereof - Google Patents
Multilayer structure protection board with conductivity and preparation method thereof Download PDFInfo
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- CN116476489A CN116476489A CN202310218011.6A CN202310218011A CN116476489A CN 116476489 A CN116476489 A CN 116476489A CN 202310218011 A CN202310218011 A CN 202310218011A CN 116476489 A CN116476489 A CN 116476489A
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- graphene
- plate
- panel
- honeycomb inner
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- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 102
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 78
- 230000001681 protective effect Effects 0.000 claims abstract description 34
- -1 polypropylene Polymers 0.000 claims abstract description 26
- 239000004743 Polypropylene Substances 0.000 claims abstract description 24
- 229920001155 polypropylene Polymers 0.000 claims abstract description 24
- 238000002156 mixing Methods 0.000 claims abstract description 17
- 239000000178 monomer Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 14
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000002270 dispersing agent Substances 0.000 claims abstract description 9
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000011065 in-situ storage Methods 0.000 claims abstract description 3
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 8
- NNQDMQVWOWCVEM-UHFFFAOYSA-N 1-bromoprop-1-ene Chemical compound CC=CBr NNQDMQVWOWCVEM-UHFFFAOYSA-N 0.000 claims description 7
- XOHBENIMDRFUIH-UHFFFAOYSA-N 2-isocyanato-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)N=C=O XOHBENIMDRFUIH-UHFFFAOYSA-N 0.000 claims description 7
- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002174 Styrene-butadiene Substances 0.000 claims description 6
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 239000004816 latex Substances 0.000 claims description 6
- 229920000126 latex Polymers 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011115 styrene butadiene Substances 0.000 claims description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 6
- DYQFCTCUULUMTQ-UHFFFAOYSA-N 1-isocyanatooctane Chemical group CCCCCCCCN=C=O DYQFCTCUULUMTQ-UHFFFAOYSA-N 0.000 claims description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- UAUDZVJPLUQNMU-UHFFFAOYSA-N Erucasaeureamid Natural products CCCCCCCCC=CCCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 24
- 239000010410 layer Substances 0.000 description 14
- 230000003068 static effect Effects 0.000 description 11
- 238000001514 detection method Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005411 Van der Waals force Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004643 cyanate ester Substances 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- NEAPKZHDYMQZCB-UHFFFAOYSA-N N-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]ethyl]-2-oxo-3H-1,3-benzoxazole-6-carboxamide Chemical compound C1CN(CCN1CCNC(=O)C2=CC3=C(C=C2)NC(=O)O3)C4=CN=C(N=C4)NC5CC6=CC=CC=C6C5 NEAPKZHDYMQZCB-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012377 drug delivery Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/0089—Producing honeycomb structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
- B32B2250/242—All polymers belonging to those covered by group B32B27/32
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a multilayer structure protection plate with conductivity and a preparation method thereof, wherein the multilayer structure protection plate comprises a bottom plate, a panel and a honeycomb inner plate, and the bottom plate and the panel are made of graphene blending modified polypropylene materials; the honeycomb inner plate comprises polypropylene, talcum powder, dispersing agent and polymerized graphene; the honeycomb inner panel is located between the bottom panel and the face panel. The graphene blending modified polypropylene material has good dispersibility and conductivity, and the polymerized graphene is prepared by in-situ polymerization of reduced graphene oxide acrylic acid and polymerizable surface active monomers, and has good dispersibility and compatibility. The protective plate provided by the invention has strong overall conductivity, stable structure and uniform conductivity.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a multilayer structure protection plate with conductivity and a preparation method thereof.
Background
The static electricity can cause great harm to high-precision electronic products such as electronic components, precise instruments and the like, as the circuit of the integrated circuit components is continuously reduced, the circuit area is reduced, the voltage resistance is reduced, the static electricity impact resistance is weakened, and the static electric field and the static electricity current can cause great harm to the high-precision electronic products. Generally, the hazard of static electricity can be reduced by using highly conductive packaging during transportation and storage of these products.
Resin sheets (for example, PVC, PMMA, PETG, PC) are widely used in the fields of transportation, transparent protection of precision equipment, transparent partition of clean rooms, and the like, because of their excellent processability and electrical insulation properties. However, the common resin plate has high surface resistivity (> 10) 14 Ω/cm 2 ) Static electricity is easy to accumulate in the use process, and the bad results of static electricity dust collection, electronic product manufacturing yield reduction, even fire explosion and the like are generated, so that the resin plate is required to be subjected to antistatic treatment in the practical application process, and the surface resistivity of the resin plate is reduced to 10 6 ～10 8 Ω/cm 2 To reduce static charge build-up. The traditional antistatic plate is mainly formed by coating antistatic paint on the surface of a substrate. Graphene can be used to antistatic treat the sheet.
Graphene is a two-dimensional carbon nanomaterial in the form of a hexagonal honeycomb lattice composed of carbon atoms in sp2 hybridized orbitals. Graphene has excellent optical, electrical and mechanical properties. Because of the excellent conductivity, the graphene can form an electron channel in the fiber, and an advanced electron transport network can enable the fiber to have better conductivity, the graphene has important application prospects in the aspects of material science, micro-nano processing, energy sources, biomedicine, drug delivery and the like, and is considered as a revolutionary material in the future. Based on excellent conductivity and mechanical properties of graphene, the graphene is often applied to a conductive agent to enhance the conductivity of a material, thereby improving antistatic ability.
However, graphene in the prior art is often only sprayed on the surface of a material as a coating, the internal resistance of the material cannot be changed, and charges still can be accumulated to form static electricity under the condition of higher resistivity; the graphene layers are difficult to disperse in the polymer due to larger van der Waals force and fewer functional groups on the surface of the structure, and the compatibility is poor, so that the antistatic capability of the sprayed plate is uneven; and because the thin lamellar structure of graphene is easy to wrinkle, the stability is poor.
Therefore, there is a need for a protective plate having strong overall conductivity, stable structure, and uniform conductivity.
Disclosure of Invention
The invention aims to: aiming at the defects of the prior art, the invention aims to provide a multilayer structure protection plate with strong overall conductivity, stable structure and uniform conductivity and a preparation method thereof.
The technical scheme is as follows:
a multilayer structure protection plate with conductivity comprises a bottom plate, a panel and a honeycomb inner plate;
the bottom plate and the panel are made of graphene blending modified polypropylene materials;
the honeycomb inner plate comprises polypropylene, talcum powder, dispersing agent and polymerized graphene;
the honeycomb inner panel is located between the bottom panel and the face panel.
Further, the method further comprises the following steps:
the first bonding layer is arranged between the honeycomb inner plate and the bottom plate, and the bonding agent of the first bonding layer is selected from one of styrene-butadiene latex or UV glue.
And the second bonding layer is arranged between the honeycomb inner plate and the panel, and the bonding agent of the second bonding layer is selected from one of styrene-butadiene latex or UV glue.
Further, the preparation of the bottom plate and the panel comprises the following steps:
(1) Uniformly mixing the modified graphene and polypropylene in a mixer, and then placing the mixture into a reaction kettle;
(2) Heating the reaction kettle to melt polypropylene, vacuumizing, uniformly stirring and cooling;
(3) And (3) heating and pressurizing the product obtained in the step (2) to disperse in a mold, and cooling to obtain the bottom plate and the panel.
The bottom plate and the panel are uniformly blended in the polypropylene structure through the modified graphene, so that the plate has good electric conductivity and uniform and stable electric conductivity on the basis of keeping the original strength and other performances.
Further, the mass ratio of the modified graphene to the polypropylene is 1:15-25; the preparation of the modified graphene comprises the following steps:
(1) Ultrasonically dispersing reduced graphene oxide in N, N-dimethylformamide to obtain graphene dispersion liquid;
(2) Adding tert-octyl isocyanate into the graphene dispersion liquid, and reacting for 18-24 hours at 70-85 ℃ under the protection of protective gas;
(3) And (3) after the reaction is finished, repeatedly centrifuging and washing with N, N-dimethylformamide, and removing unreacted tert-octyl isocyanate to obtain the modified graphene.
The modified graphene carries out surface grafting modification on graphene through the cyanate ester group of the tertiary octyl isocyanate, and can greatly reduce Van der Waals force between graphene molecules through the multi-branched structure of the tertiary octyl isocyanate, so that the dispersion capability of the graphene and the compatibility with polymers are enhanced.
Further, the mass ratio of the reduced graphene oxide to the tert-octyl isocyanate is 1:8-12.
Further, the preparation of the honeycomb inner plate comprises the following steps:
(1) Preparing a polymerizable surface active monomer by bromopropene and N, N, N ', N' -tetraethyl ethylenediamine;
(2) Preparing polymerized graphene by in-situ polymerization of reduced graphene oxide, acrylic acid and a polymerizable surface active monomer;
(3) And mixing polypropylene, a filler, a dispersing agent and polymerized graphene, placing the mixture in a mold, heating, pressurizing and dispersing the mixture in the mold, cooling the mixture, and cutting the cooled mixture into honeycomb shapes to obtain the honeycomb inner plate.
Further, the polymerized graphene has a structure shown in the following formula A:
wherein m=80-100, n=40-60;
rGO represents reduced graphene oxide comprising the structural fragment:
the inner plate is mixed with the polymerized graphene, so that the inner plate is combined with the polymerized graphene to obtain excellent conductivity and dispersibility, the polymerized graphene is uniformly dispersed in the inner plate, the whole inner plate has excellent conductivity, and the conductivity is uniform and stable.
Further, the specific method of the step (1) is as follows: adding N, N, N ', N' -tetraethyl ethylenediamine and an alcohol solvent into a reactor, stirring and mixing uniformly, heating to 35-45 ℃ under the protection of nitrogen, slowly dropwise adding bromopropene for 2-3 hours, heating to 50-55 ℃ after the dropwise adding is finished, preserving heat and reacting for 18-24 hours, removing the solvent, and recrystallizing to obtain the polymerizable surface active monomer; the molar ratio of the N, N, N ', N' -tetraethyl ethylenediamine to the bromopropene is 1:2.2-2.4.
Further, the specific method of the step (2) is as follows: adding acrylic acid, polymerizable surface active monomer and initiator into a glove box filled with protective gas, mixing and stirring, standing for 20-24 hours to obtain a prepolymer solution, placing reduced graphene oxide into the prepolymer solution for 10-12 hours, heating to 70-80 ℃ in an oven, and reacting for 8-12 hours to obtain polymerized graphene; the mass ratio of the acrylic acid to the polymerizable surface active monomer to the reduced graphene oxide is (3-4): (6-8): 1, a step of; the initiator is azobisisobutyronitrile.
Further, in the step (3), the mass percentage of each component is as follows, based on 100% of the total mass:
70-80% of polypropylene
3-5% of dispersing agent
Polymerized graphene 5-8%
The balance being filler;
the dispersing agent is one of erucamide, oleamide or stearic acid;
the filler is selected from one of calcium carbonate, talcum powder or white carbon black.
The method for preparing the protective plate with the conductive multilayer structure according to any one of the above, comprising the following steps:
(1) Forming a first bonding layer on the lower surface of the honeycomb inner plate, contacting the first bonding layer with the bottom plate, and pressurizing and curing for 0.2-1.5 hours under the pressure of 0.05-0.2MPa, so as to bond the honeycomb inner plate with the bottom plate;
(2) Forming a second bonding layer on the upper surface of the honeycomb inner plate, contacting the second bonding layer with the panel, pressurizing and curing for 1.5-5 hours under the pressure of 0.05-0.2MPa, then releasing and curing for 8-15 hours, and combining the honeycomb inner plate with the panel to obtain the multi-layer structure protective plate with conductivity.
The beneficial effects are that:
(1) The inner plate mixed polymeric graphene of the protective plate with the conductive multilayer structure can enable the inner plate to be combined with the polymeric graphene to have excellent conductivity and dispersibility, enable the polymeric graphene to be uniformly dispersed in the inner plate, enable the whole inner plate to have excellent conductivity, and enable the conductivity to be uniform and stable.
(2) According to the protective plate with the conductive multilayer structure, the modified graphene is used, the surface of the graphene is subjected to grafting modification through the cyanate ester group of the tertiary octyl isocyanate, the Van der Waals force between graphene molecules can be greatly reduced through the multi-branched structure of the tertiary octyl isocyanate, and the dispersion capacity and the compatibility of the graphene with polymers are enhanced.
(3) The panel and the bottom plate of the protective plate with the conductive multilayer structure are made of the graphene blending modified polypropylene material, and the modified graphene is uniformly blended in the polypropylene structure, so that the plate has good conductive capacity and uniform and stable conductivity on the basis of keeping the original strength and other performances.
Detailed Description
The invention will be described below in connection with specific embodiments. The following examples are illustrative of the present invention and are not intended to limit the present invention. Other combinations and various modifications within the spirit of the invention may be made without departing from the spirit or scope of the invention.
Reduced graphene oxide was purchased from merck as 777684; ordinary graphene is purchased from merck 900561; the commercial conductive protective plate is made of CNT carbon nano tube reinforced PEEK raw materials purchased by the plastic Co., ltd; the rest reagents and equipment are conventional reagents and equipment in the technical field.
Preparation of modified graphene
The preparation method comprises the following steps:
(1) 1g of reduced graphene oxide is ultrasonically dispersed in 50ml of N, N-dimethylformamide to obtain graphene dispersion liquid;
(2) 10g of tert-octyl isocyanate is added into the graphene dispersion liquid, and the mixture reacts for 24 hours at 80 ℃ under the protection of protective gas;
(3) And (3) after the reaction is finished, repeatedly centrifuging and washing with N, N-dimethylformamide, and removing unreacted tert-octyl isocyanate to obtain the modified graphene.
Preparation of floor-1 and Panel-1
The preparation method comprises the following steps:
(1) Uniformly mixing 0.5g of modified graphene and 10g of polypropylene in a mixer, and then placing the mixture into a reaction kettle;
(2) Heating to melt polypropylene, vacuumizing, stirring uniformly, and cooling;
(3) And (3) heating and pressurizing the product obtained in the step (2) to disperse in a mold, and cooling to obtain the bottom plate and the panel.
Preparation of floor-2 and Panel-2
Substantially the same as the preparation of the base-1 and the face-1, except that 7.5g of polypropylene was used instead.
Preparation of floor-3 and Panel-3
Basically the same as the preparation of the bottom plate-1 and the face plate-1, except that the modified graphene is changed into the same amount of ordinary graphene.
Preparation of floor-4 and Panel-4
Substantially the same as the preparation of the bottom plate-1 and the top plate-1, except that the modified graphene was changed to an equivalent amount of reduced graphene oxide.
Preparation of honeycomb inner panel-1
(1) Adding 0.1mol of N, N, N ', N' -tetraethyl ethylenediamine and 50ml of ethanol into a reactor, stirring and mixing uniformly, heating to 40 ℃ under the protection of nitrogen, slowly dropwise adding 0.22mol of bromopropene for 3 hours, heating to 50 ℃ after the dropwise adding is finished, preserving heat and reacting for 24 hours, removing ethanol, and recrystallizing to obtain the polymerizable surface active monomer;
(2) Adding 0.3g of acrylic acid, 0.6g of polymerizable surface active monomer and 0.05g of azodiisobutyronitrile into a glove box filled with protective gas, mixing and stirring, standing for 24 hours to obtain a prepolymer solution, placing reduced graphene oxide into the prepolymer solution for 12 hours, heating to 80 ℃ in an oven, and reacting for 10 hours to obtain polymerized graphene;
(3) And mixing polypropylene, calcium carbonate, erucic acid amide and polymerized graphene, placing the mixture in a mould, heating, pressurizing and dispersing the mixture in the mould, cooling the mixture, and cutting the cooled mixture into honeycomb shapes to obtain the honeycomb inner plate.
The weight percentage of each component is as follows, based on 100% of the total weight:
polypropylene 75%
Erucamide 5%
Polymerized graphene 5%
The balance being calcium carbonate.
Preparation of honeycomb inner panel-2
Basically the same as the preparation of the inner plate-1, except that in the step (3), the total mass is 100%, and the components and the mass percentages thereof are as follows:
polypropylene 75%
Oleic acid amide 5%
Polymerized graphene 5%
The balance of talcum powder.
Preparation of honeycomb inner panel-3
Basically the same as the preparation of the inner plate-1, except that the step (1) and the step (2) are not performed, and the polymerized graphene is changed into the same amount of ordinary graphene.
Preparation of honeycomb inner panel-4
Substantially the same as the preparation of inner plate-1, except that step (1) was not performed, and the polymerizable surface-active monomer in step (2) was changed to an equivalent amount of acrylic acid.
Example 1
A protective plate having a multi-layered structure with conductivity is prepared by:
(1) Forming a styrene-butadiene latex first bonding layer on the lower surface of the honeycomb inner plate-1, contacting the first bonding layer with the bottom plate-1, and carrying out pressure curing for 1 hour under 0.2MPa to bond the honeycomb inner plate with the bottom plate;
(2) A styrene-butadiene latex second adhesive layer is formed on the upper surface of the honeycomb inner plate-1, the second adhesive layer is contacted with the panel-1, the pressure is applied and cured for 3 hours under 0.2MPa, then the pressure is released and cured for 12 hours, and the honeycomb inner plate is combined with the panel, so that the multi-layer structure protective plate with conductivity is manufactured.
Example 2
Substantially the same as in example 1, except that the honeycomb inner panel-1 was changed to the honeycomb inner panel-2.
Example 3
Substantially the same as in example 1, except that the floor-1 and the panel-1 are changed to the floor-2 and the panel-2.
Comparative example 1
Commercially available conductive protection plates.
Comparative example 2
Substantially the same as in example 1, except that the honeycomb inner panel-1 was changed to the honeycomb inner panel-3.
Comparative example 3
Substantially the same as in example 1, except that the honeycomb inner panel-1 was changed to the honeycomb inner panel-4.
Comparative example 4
Substantially as in example 1, except that the floor-1 and the panel-1 are changed to the floor-3 and the panel-3.
Comparative example 5
Substantially as in example 1, except that the floor-1 and the panel-1 are changed to the floor-4 and the panel-4.
Performance testing
Impact strength test: according to GB/T1043, the sample size is 80 x 10 x 4mm and the notch depth is one third of the sample thickness.
Static buffer coefficient test: according to the test method recommended in GB/T8168-2008, a method of applying a compressive load to a sample at a low speed is adopted to obtain a compressive stress-compressive strain curve of a buffer material, and the elastic specific energy and the buffer coefficient of the material are obtained by using the curve.
The products of examples 1-3 and comparative examples 1-5 were observed for appearance.
The test results are shown in the following table:
| appearance of | Notched impact Strength (KJ/m) 2 ) | Static buffer coefficient | |
| Example 1 | Uniform and smooth | 19.1 | 3.5 |
| Example 2 | Uniform and smooth | 18.7 | 3.3 |
| Example 3 | Uniform and smooth | 19.0 | 3.5 |
| Comparative example 1 | Uniform and smooth | 17.3 | 4.7 |
| Comparative example 2 | The inner plate has more bulges | 17.9 | 4.3 |
| Comparative example 3 | The inner plate has a small number of bulges | 18.2 | 3.9 |
| Comparative example 4 | The bottom plate and the panel have more bulges | 17.6 | 4.4 |
| Comparative example 5 | The bottom plate and the panel have more bulges | 17.9 | 4.3 |
As can be seen from comparison of the test results of examples 1-3 and comparative example 1, the protective plate with a conductive multilayer structure provided by the invention has a uniform and smooth surface and better impact resistance and buffering capacity.
According to comparison of the detection results of examples 1-3 and comparative example 2, the polymerized graphene added into the inner plate of the protective plate with the conductive multilayer structure provided by the invention has good dispersibility, can improve the compatibility of graphene and plastic materials, ensures that the surface of the plate is uniform and smooth, has uniform and stable components, and can improve the impact resistance and buffering capacity of the plate.
As can be seen from comparison of the detection results of examples 1 to 3 and comparative example 2, the polymeric graphene added to the inner plate of the protective plate having a conductive multilayer structure provided by the present invention can enhance the dispersibility and compatibility of graphene by polymerizing the surface active monomer.
According to comparison of the detection results of examples 1-3 and comparative examples 3-4, the base plate and the face plate of the protective plate with the conductive multilayer structure provided by the invention are blended with modified graphene, and the modified graphene has good dispersing capability and good compatibility with polymers.
Volume resistivity interval detection: the volume resistivity of 15 sites of the plate is randomly detected according to GB/T1406-2006, and the volume resistivity interval is recorded.
And (3) detecting a surface resistance value interval: and randomly detecting the resistance values of 15 sites on the surface of the plate according to GB/T1410-2006, and recording a resistance value interval.
The test results are shown in the following table:
| volume resistivity interval | Surface resistance value interval | |
| Example 1 | 8×10 4 ～2×10 5 | 6×10 4 ～1.5×10 5 |
| Example 2 | 7×10 4 ～2×10 5 | 7×10 4 ～1×10 5 |
| Example 3 | 8×10 4 ～1.8×10 5 | 7×10 4 ～1.3×10 5 |
| Comparative example 1 | 7×10 7 ～3×10 9 | 5×10 7 ～2×10 9 |
| Comparative example 2 | 2×10 7 ～7×10 8 | 1.5×10 7 ～5×10 8 |
| Comparative example 3 | 4×10 5 ～6×10 6 | 2.5×10 5 ～4×10 6 |
| Comparative example 4 | 8×10 6 ～7×10 8 | 5.5×10 6 ～6×10 8 |
| Comparative example 5 | 7×10 6 ～5×10 8 | 4×10 6 ～3×10 8 |
As can be seen from comparison of the test results of examples 1-3 and comparative example 1, the multi-layer structure with conductivity provided by the invention has lower resistance value and smaller resistance distribution interval, can meet the antistatic requirement of the protection plate, has uniform conductivity and better conductivity effect.
According to comparison of the detection results of the examples 1-3 and the comparative example 2, the polymerized graphene added into the inner plate of the protective plate with the conductive multilayer structure provided by the invention has good dispersibility, can improve the compatibility of graphene and plastic materials, ensures that the conductive components in the plate are uniformly distributed, and has stronger and more stable conductive capability.
As can be seen from comparison of the detection results of examples 1 to 3 and comparative example 2, the polymeric graphene added to the inner plate of the protective plate having a conductive multilayer structure provided by the present invention can enhance the dispersibility and compatibility of graphene by polymerizing the surface active monomer.
According to comparison of the detection results of examples 1-3 and comparative examples 3-4, the base plate and the panel of the protective plate with the conductive multilayer structure provided by the invention are blended with modified graphene, the modified graphene has good dispersing capability, and the modified graphene has good compatibility with polymers, so that the conductive capability and the stability of the plate are provided.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and to implement it, but not limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. A protective plate with a conductive multilayer structure, which is characterized by comprising a bottom plate, a panel and a honeycomb inner plate;
the bottom plate and the panel are made of graphene blending modified polypropylene materials;
the honeycomb inner plate comprises polypropylene, talcum powder, dispersing agent and polymerized graphene;
the honeycomb inner panel is located between the bottom panel and the face panel.
2. The protective plate having a multi-layer structure with conductivity according to claim 1, further comprising:
the first bonding layer is arranged between the honeycomb inner plate and the bottom plate, and the bonding agent of the first bonding layer is selected from one of styrene-butadiene latex or UV glue;
and the second bonding layer is arranged between the honeycomb inner plate and the panel, and the bonding agent of the second bonding layer is selected from one of styrene-butadiene latex or UV glue.
3. The protective plate of claim 1, wherein the fabrication of the base plate and the panel comprises the steps of:
(1) Uniformly mixing the modified graphene and polypropylene in a mixer, and then placing the mixture into a reaction kettle;
(2) Heating the reaction kettle to melt polypropylene, vacuumizing, uniformly stirring and cooling;
(3) And (3) heating and pressurizing the product obtained in the step (2) to disperse in a mold, and cooling to obtain the bottom plate and the panel.
4. A protective plate of a multilayer structure having conductivity according to claim 3, wherein the mass ratio of the modified graphene to the polypropylene is 1:15-25; the preparation of the modified graphene comprises the following steps:
(1) Ultrasonically dispersing reduced graphene oxide in N, N-dimethylformamide to obtain graphene dispersion liquid;
(2) Adding tert-octyl isocyanate into the graphene dispersion liquid, and reacting for 18-24 hours at 70-85 ℃ under the protection of protective gas;
(3) And (3) after the reaction is finished, repeatedly centrifuging and washing with N, N-dimethylformamide, and removing unreacted tert-octyl isocyanate to obtain the modified graphene.
5. The protective plate of claim 4, wherein the mass ratio of the reduced graphene oxide to the tertiary octyl isocyanate is 1:8-12.
6. The protective plate of a multilayer structure having conductivity according to claim 1, wherein the preparation of the honeycomb inner plate comprises the steps of:
(1) Preparing a polymerizable surface active monomer by bromopropene and N, N, N ', N' -tetraethyl ethylenediamine;
(2) Preparing polymerized graphene by in-situ polymerization of reduced graphene oxide, acrylic acid and a polymerizable surface active monomer;
(3) And mixing polypropylene, a filler, a dispersing agent and polymerized graphene, placing the mixture in a mold, heating, pressurizing and dispersing the mixture in the mold, cooling the mixture, and cutting the cooled mixture into honeycomb shapes to obtain the honeycomb inner plate.
7. The protective plate of claim 6, wherein the specific method of step (1) is as follows: adding N, N, N ', N' -tetraethyl ethylenediamine and an alcohol solvent into a reactor, stirring and mixing uniformly, heating to 35-45 ℃ under the protection of nitrogen, slowly dropwise adding bromopropene for 2-3 hours, heating to 50-55 ℃ after the dropwise adding is finished, preserving heat and reacting for 18-24 hours, removing the solvent, and recrystallizing to obtain the polymerizable surface active monomer; the molar ratio of the N, N, N ', N' -tetraethyl ethylenediamine to the bromopropene is 1:2.2-2.4.
8. The method of manufacturing a protective plate having a multi-layered structure according to claim 6, wherein the specific method of the step (2) is as follows: adding acrylic acid, polymerizable surface active monomer and initiator into a glove box filled with protective gas, mixing and stirring, standing for 20-24 hours to obtain a prepolymer solution, placing reduced graphene oxide into the prepolymer solution for 10-12 hours, heating to 70-80 ℃ in an oven, and reacting for 8-12 hours to obtain polymerized graphene; the mass ratio of the acrylic acid to the polymerizable surface active monomer to the reduced graphene oxide is (3-4): (6-8): 1, a step of; the initiator is azobisisobutyronitrile.
9. The method of producing a protective plate having a conductive multilayer structure according to claim 6, wherein in the step (3), the mass percentage of each component is as follows, based on 100% by mass of the total:
70-80% of polypropylene
3-5% of dispersing agent
Polymerized graphene 5-8%
The balance being filler;
the dispersing agent is one of erucamide, oleamide or stearic acid;
the filler is selected from one of calcium carbonate, talcum powder or white carbon black.
10. The method for manufacturing a protective plate having a multi-layered structure with conductivity according to any one of claims 1 to 9, comprising the steps of:
(1) Forming a first bonding layer on the lower surface of the honeycomb inner plate, contacting the first bonding layer with the bottom plate, and pressurizing and curing for 0.2-1.5 hours under the pressure of 0.05-0.2MPa, so as to bond the honeycomb inner plate with the bottom plate;
(2) Forming a second bonding layer on the upper surface of the honeycomb inner plate, contacting the second bonding layer with the panel, pressurizing and curing for 1.5-5 hours under the pressure of 0.05-0.2MPa, then releasing and curing for 8-15 hours, and combining the honeycomb inner plate with the panel to obtain the multi-layer structure protective plate with conductivity.
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