CN116465115A - Semiconductor refrigerating piece and beauty or physiotherapy instrument - Google Patents
Semiconductor refrigerating piece and beauty or physiotherapy instrument Download PDFInfo
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- CN116465115A CN116465115A CN202310459098.6A CN202310459098A CN116465115A CN 116465115 A CN116465115 A CN 116465115A CN 202310459098 A CN202310459098 A CN 202310459098A CN 116465115 A CN116465115 A CN 116465115A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 206
- 230000003796 beauty Effects 0.000 title claims abstract description 39
- 238000000554 physical therapy Methods 0.000 title claims abstract description 28
- 238000005057 refrigeration Methods 0.000 claims abstract description 106
- 230000008878 coupling Effects 0.000 claims abstract description 22
- 238000010168 coupling process Methods 0.000 claims abstract description 22
- 238000005859 coupling reaction Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 17
- 239000002537 cosmetic Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 210000003491 skin Anatomy 0.000 description 24
- 239000003570 air Substances 0.000 description 18
- 238000001816 cooling Methods 0.000 description 18
- 230000000694 effects Effects 0.000 description 8
- 238000009423 ventilation Methods 0.000 description 5
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
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- 239000012780 transparent material Substances 0.000 description 2
- 102000008186 Collagen Human genes 0.000 description 1
- 108010035532 Collagen Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
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- 239000012080 ambient air Substances 0.000 description 1
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- 238000005282 brightening Methods 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Heart & Thoracic Surgery (AREA)
- Vascular Medicine (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
The application relates to a semiconductor refrigeration piece and a beauty or physiotherapy instrument, wherein the semiconductor refrigeration piece comprises a semiconductor electric coupling layer and cold surfaces and hot surfaces at two ends of the semiconductor electric coupling layer; the semiconductor refrigerating piece is internally provided with a temperature sensor module; the temperature sensor module is used for detecting the temperature of the hot surface or the cold surface and transmitting temperature data to the main control unit so that the main control unit controls the power supply of the semiconductor refrigerating piece according to the temperature data. The end face of the head of the beauty or physiotherapy instrument forms a working face, and the working face is contacted with the skin to carry out beauty or physiotherapy treatment; the semiconductor refrigerating piece is arranged in the beauty treatment or physiotherapy instrument; the cold face of the semiconductor refrigeration piece is used as the working face; or the cold surface of the semiconductor refrigeration piece is attached to the inner side of the working surface so as to refrigerate the working surface; or the cold surface of the semiconductor refrigeration piece is connected with the working surface in a rapid cold conduction mode through the cold conduction piece so as to refrigerate the working surface.
Description
Technical Field
The application relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration piece and a beauty or physiotherapy instrument.
Background
Semiconductor refrigerators or thermoelectric refrigerators (Thermoelectric Cooler, TEC) or heat pumps or Peltier refrigerators (Peltier). The semiconductor is characterized in that p & n type two unique semiconductors are used, alternating p type and n type semiconductor particles are placed in thermal parallel with each other and are electrically connected in series to form a semiconductor electric coupling layer, one side of the semiconductor electric coupling layer is connected with a cooling substrate to form a cold surface, and the other side of the semiconductor electric coupling layer is connected with a heat conducting substrate to form a hot surface. When direct current flows through the junction of the semiconductor, resulting in a temperature difference, the cold face absorbs heat and then transfers the heat to the hot face through the semiconductor galvanic particles.
At present, part of beauty treatment instruments adopt a cold face of a semiconductor refrigeration piece as an end face contacted with skin (namely a beauty treatment working face) or refrigerate the end face, the end face is contacted with the skin, the refrigerated end face is provided by the semiconductor refrigeration piece, and an ice compress effect is provided for the contacted skin. In the beauty instrument in the prior art, the semiconductor refrigerating piece is attached to the conducted piece through an external NTC (temperature sensor) to detect the temperature, and the temperature data is received by the temperature sensor and then transmitted to the control circuit board to control the temperature area of the conducted piece. Because part of beauty instruments need accurate temperature control, for example, skin/collagen regeneration/skin tendering and the like need to control the temperature in a certain interval; the external NTC (temperature sensor) is used for detecting the temperature of the conducted piece, so that the accurate control of the temperature of the cold face/hot face/beauty working face can not be realized; the method is not beneficial to the space layout and assembly of the product, and causes larger space, inconvenient assembly and the like, thereby causing cost waste; the NTC is easy to damage during the lamination or the press attachment; and the temperature difference is relatively large due to the instability of the assembly.
Disclosure of Invention
The purpose of this application is to provide a semiconductor refrigeration spare, solves the defect in aspects such as control by temperature change and structure that the external NTC caused when current semiconductor refrigeration spare was applied to cosmetic product.
In order to solve the technical problems, the application provides a semiconductor refrigeration piece, which comprises a semiconductor electric coupling layer and cold surfaces and hot surfaces at two ends of the semiconductor electric coupling layer; the semiconductor refrigerating piece is internally provided with a temperature sensor module; the temperature sensor module is used for detecting the temperature of the hot surface or the cold surface and transmitting temperature data to the main control unit so that the main control unit controls the power supply of the semiconductor refrigerating piece according to the received temperature data.
In some embodiments, the temperature sensor die comprises positive and negative electrodes, the semiconductor refrigeration piece comprises positive and negative electrodes, and the positive and negative electrodes are connected with a main control unit or a control circuit board provided with the main control unit through an H bridge drive; the temperature sensor die is electrically or communicatively connected to the main control unit or a control circuit board provided with the main control unit to transmit temperature data.
In some embodiments, the temperature sensor die is disposed against an inner side of the hot or cold face.
In some embodiments, the cold surface and the hot surface are in shape adaptation, p-type and n-type semiconductor particles of the semiconductor electric couple layer are tiled on the inner side surfaces of the cold surface and the hot surface, and the whole cold surface of the semiconductor refrigerating piece forms whole-surface refrigeration or the whole hot surface forms whole-surface heating; the semiconductor electric coupling layer and the temperature sensor module are positioned between the cold surface and the hot surface.
In some embodiments, a through hole is formed on one side of the semiconductor refrigeration piece; or the cold surface and/or the hot surface of the semiconductor refrigeration piece are/is a transparent substrate, p-type and n-type semiconductor couple particles of the semiconductor couple layer are arranged in one side of the semiconductor refrigeration piece, and no p-type and n-type semiconductor couple particles are arranged in the other side of the semiconductor refrigeration piece to form a vacant area; forming a light emitting area corresponding to the vacant area, wherein the light emitting area is as follows: the cold surface and the hot surface are transparent substrates to form a light-emitting area, or one of the cold surface and the hot surface is the transparent substrate, the other is correspondingly formed with a through hole, and the cold surface and the hot surface are mutually matched to form the light-emitting area.
In some embodiments, the p-type and n-type semiconductor galvanic particulates of the semiconductor galvanic layer are arranged as an annular band, the p-type and n-type semiconductor galvanic particulates not being disposed within the central interior region forming a void region; the cold surface and/or the hot surface are/is arranged as through holes corresponding to the central inner area of the semiconductor electric coupling layer; or, one of the cold surface and/or the hot surface is the transparent substrate, the other is correspondingly provided with a through hole, and the cold surface and the hot surface are mutually matched to form a light emitting area.
In some embodiments, the cold and hot faces are substrates of thermally conductive material; the heat conducting material substrate is a ceramic material substrate, an aluminum substrate, a copper substrate or a transparent crystal substrate.
The application also provides a beauty or physiotherapy instrument, wherein the end face of the head part of the beauty or physiotherapy instrument forms a working face, and the working face is contacted with the skin to carry out beauty or physiotherapy treatment; the method is characterized in that: the semiconductor refrigerating piece in any embodiment is arranged in the beauty treatment or physiotherapy instrument; the cold face of the semiconductor refrigeration piece is used as the working face; or the cold surface of the semiconductor refrigeration piece is attached to the inner side of the working surface so as to refrigerate the working surface; or the cold surface of the semiconductor refrigeration piece is connected with the working surface in a rapid cold conduction mode through the cold conduction piece so as to refrigerate the working surface.
In some embodiments, the cosmetic or physiotherapy instrument includes a housing and a light source assembly, a power assembly, a control circuit board, and a heat dissipation assembly mounted within the housing; the positive electrode and the negative electrode of the semiconductor refrigeration piece and the built-in temperature sensor module are electrically connected with the control circuit board; the control circuit board is provided with a main control unit; the heat dissipation component is used for dissipating heat of a hot surface of the semiconductor refrigerating piece.
In some embodiments, the heat dissipating assembly comprises a fan comprising a thermally conductive housing; the hot surface of the semiconductor refrigeration piece is connected with the heat conduction shell in a heat conduction way; or the heat-conducting shell is directly used as the hot surface of the semiconductor refrigerating piece, and a hot end circuit is arranged on the outer wall of the heat-conducting shell and welded with the semiconductor electric couple layer; the cold face of the semiconductor refrigerating piece is connected with the working face through the cold conducting piece in a rapid cold conducting mode.
In some embodiments, the thermally conductive enclosure comprises one or a combination of several of a heat pipe or a super heat pipe or a VC temperature plate; the cold conducting piece is a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate.
The beneficial effects of this application are:
the semiconductor refrigerating piece is characterized in that a temperature sensor module is arranged in the semiconductor refrigerating piece and is attached to the hot face or the cold face of the semiconductor refrigerating piece to detect the temperature of the cold face or the hot face; the error and time of the intermediate temperature conducting piece are reduced, the temperature change of the refrigerating piece is accurately monitored in the first time, the temperature sensor module is electrically connected with the main control unit or the control circuit board, and the main control unit or the control circuit board controls the power supply of the semiconductor refrigerating piece through the received temperature data, so that the temperature is always kept in an expected temperature range. And the semiconductor refrigerating piece has simpler and more compact structure and can damage the temperature sensor module.
Drawings
Fig. 1 is an exploded schematic view of a semiconductor refrigeration unit according to a first embodiment of the present application.
Fig. 2 is a side view of a semiconductor refrigeration unit according to a first embodiment of the present application.
Fig. 3 is an exploded schematic view of a semiconductor refrigeration unit according to a second embodiment of the present application.
Fig. 4 is a side view of a semiconductor refrigeration unit according to a second embodiment of the present application.
Fig. 5 is an exploded schematic view of a semiconductor refrigeration unit according to a third embodiment of the present application.
Fig. 6 is a side view of a semiconductor refrigeration unit according to a third embodiment of the present application.
Fig. 7 is a control circuit diagram of a semiconductor refrigeration unit according to an embodiment of the present application.
Fig. 8 is a perspective view of an example cosmetic device employing the semiconductor refrigeration device of the present application.
Fig. 9 is an exploded view of the cosmetic instrument of fig. 8.
Fig. 10 is a perspective view of an example physiotherapy instrument employing the semiconductor refrigeration device of the present application.
Fig. 11 is a cross-sectional view of the physiotherapy instrument of fig. 10.
Fig. 12 is an exploded view of the physiotherapy instrument of fig. 10.
Fig. 13 is an exploded view of a heat dissipating assembly according to one embodiment of the present application.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is explicitly stated. It should also be appreciated that additional or alternative steps may be used.
Although the terms, second, third, etc. may be used herein to describe various components, elements, regions, layers and/or sections, these components, elements, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one component, member, region, layer or section from another region, layer or section. Terms such as "", "second", and other numerical terms do not imply a sequence or order when used herein unless clearly indicated by the context. Thus, a component, region, layer, or section discussed below could be termed a second component, region, layer, or section without departing from the teachings of the example embodiments.
For ease of description, spatially relative terms, such as "inner," "outer," "lower," "below," "upper," "above," "front," "back," and the like, may be used herein to describe one component or feature's relationship to another component or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "under" or "beneath" other elements or features would then be oriented "over" or "above" the other elements or features. Thus, the example term "below … …" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein interpreted accordingly.
Referring to fig. 1-7, an embodiment of the present application relates to a semiconductor refrigeration unit 10, which includes a middle semiconductor electric couple layer 12, and a hot surface 13 and a cold surface 11 at two ends, wherein a temperature sensor module 15 is built in the semiconductor refrigeration unit 10. The semiconductor electric couple layer 12 is formed by placing alternating p-type and n-type semiconductor particles in thermal parallel and electrically connecting them in series, and the hot surface 13 and the cold surface 11 formed at two ends of the p & n-type semiconductor particles are heat conductive material substrates, for example, may be heat conductive materials such as ceramics/aluminum/copper/transparent crystals. The temperature sensor module 15 may be an NTC sensor. In the present embodiment, the temperature sensor 15 is built in the semiconductor refrigeration unit 10. In some embodiments, the temperature sensor 15 is located on the middle semiconductor electric couple layer 12, and is attached to one of the hot surface 13/cold surface 11 of the refrigeration member 10, and directly detects the temperature of the cold surface 11/hot surface 13 of the refrigeration member.
Referring to fig. 1-2, a semiconductor refrigeration unit 10 of a first embodiment includes a middle semiconductor electric couple layer 12, and a hot surface 13 and a cold surface 11 at both ends thereof, and a temperature sensor module 15 is built in the semiconductor refrigeration unit 1. In this embodiment, the whole cold surface 11 of the semiconductor refrigeration member 10 forms whole refrigeration or the whole hot surface 13 forms whole heating, the semiconductor couple particles are tiled or basically tiled on the inner side surfaces of the cold surface 11 and the hot surface 13, the shapes of the cold surface 11 and the hot surface 13 are adapted, and the semiconductor couple layer 12 and the temperature sensor module 15 are located between the cold surface and the hot surface. The temperature sensor module 15 is attached to the hot side 13 or to the cold side 11. The anode and cathode 150 of the temperature sensor module 15 and the anode and cathode 120 of the semiconductor electric coupling layer 12 extend out of the semiconductor refrigerating element 10 to be electrically connected with a control circuit board or a main control unit.
Referring to the semiconductor refrigeration unit 10 of the second embodiment shown in fig. 3 to 4, the semiconductor refrigeration unit 1 includes a middle semiconductor electric couple layer 12, and a hot surface 13 and a cold surface 11 at both ends, and a temperature sensor module 15 is built in the semiconductor refrigeration unit 1. In this embodiment, a through hole 16 is reserved on one side of the semiconductor refrigeration component 10, and the through hole 16 can be used as a light emitting region 16, for example, when the semiconductor refrigeration component is applied to a photon beauty treatment instrument or a physiotherapy instrument. The through holes 16 may be formed after the substrates of the cold surface 11 or the hot surface 13 extend, or the corresponding through holes 16 may be formed on the extending sides of the two substrates of the cold surface 11 and the hot surface 13. The semiconductor refrigeration element 10 is internally provided with a cold surface corresponding to one side of the semiconductor electric coupling layer 12 as a refrigeration surface or a hot surface 13 at one side as a heating surface. The cold face 11 and the hot face 13 are matched in shape, and the semiconductor electric coupling layer 12 and the temperature sensor module 15 are located between the cold face and the hot face. In the drawing, the temperature sensor module 15 is attached to the hot surface 13, but may be attached to the cold surface 11. The anode and cathode 150 of the temperature sensor module 15 and the anode and cathode 120 of the semiconductor electric coupling layer 12 extend out of the semiconductor refrigerating element 10 to be electrically connected with a control circuit board or a main control unit.
Referring to the semiconductor refrigeration unit 10 of the third embodiment shown in fig. 5 to 6, the semiconductor refrigeration unit 10 includes a middle semiconductor electric couple layer 12, and a hot surface 13 and a cold surface 11 at both ends, and a temperature sensor module 15 is built in the semiconductor refrigeration unit 10. In this embodiment, the p & n type semiconductor couple particles of the semiconductor couple layer 12 inside the semiconductor refrigeration member 10 are arranged in an endless belt, and the p & n type semiconductor couple particles are not provided in the intermediate inner region to form a vacant region. The cold face 11/hot face 13 comprises an annular region corresponding to the semiconductor electric coupling layer 12. The middle area of the cold surface 11/hot surface 13 is a through hole; alternatively, one of the cold-side substrate and the hot-side substrate is correspondingly provided with a through hole, and the other substrate is a transparent substrate (such as transparent crystal); alternatively, as shown in fig. 6, the cold/hot side substrates are transparent substrates (e.g., transparent crystals); therefore, the hot surface, the cold surface and the middle semiconductor electric couple layer of the annular region are formed on the semiconductor refrigeration piece 10, and the through hole, the through hole/the transparent substrate or the transparent substrate region is formed in the blank region, so that the semiconductor refrigeration piece 10 can be used as the light emitting region 16, for example, when the semiconductor refrigeration piece 10 is applied to a photon beauty instrument or a physiotherapy instrument. The corresponding cold surface on one side of the annular semiconductor electric couple layer 12 of the semiconductor refrigeration piece 10 can form whole-surface refrigeration or the hot surface 13 on one side can form whole-surface heating. The cold face 11 and the hot face 13 are matched in shape, and the semiconductor electric coupling layer 12 and the temperature sensor module 15 are located between the cold face and the hot face. In the drawing, the temperature sensor module 15 is attached to the hot surface 13, but may be attached to the cold surface 11. The anode and cathode 150 of the temperature sensor module 15 and the anode and cathode 120 of the semiconductor electric coupling layer 12 extend out of the semiconductor refrigerating element 10 to be electrically connected with a control circuit board or a main control unit.
The positive and negative electrodes 120 and 150 of the semiconductor refrigeration piece 10 and the temperature sensor module 15 are electrically connected with a control circuit board or a main control unit to supply power; a main control unit is arranged on the control circuit board; the temperature sensor module 15 is electrically or communicatively connected to a control circuit board or a main control unit to transmit temperature data. Referring to fig. 6, the semiconductor refrigeration device 10 of the present application operates on the following principle: the semiconductor refrigeration piece 10 with the built-in temperature sensor module 15, wherein the temperature sensor module 15 detects the temperature data of the cold surface 11 or the hot surface 13 and transmits the temperature data to the main control unit on the control circuit board; the main control unit controls and outputs a control signal of the semiconductor refrigeration piece through temperature data analysis and the requirement of a preset temperature interval, so that the power supply action of the semiconductor refrigeration piece 10 is controlled, the characteristics of forward power supply refrigeration and reverse power supply heating of the semiconductor refrigeration piece are utilized, the forward power supply or the reverse power supply is driven by an H bridge to the semiconductor refrigeration piece 10, the working state of the semiconductor refrigeration piece 10 is adjusted, and the temperature is accurately and constantly in the expected temperature interval. An independent control circuit board can be arranged to control the work of the semiconductor refrigeration piece 10, and the independent control circuit board is electrically connected with the PCBA inside the electric appliance applying the semiconductor refrigeration piece 10; alternatively, the main control unit is integrated on the PCBA inside the appliance to which the semiconductor refrigeration unit 10 is applied.
The number of the temperature sensor modules 15 may be one or more according to the area and shape of the semiconductor refrigerating element.
The semiconductor refrigeration device 10 of the present application should be capable of cooling or heating inside an electrical appliance. The semiconductor cooling device 10 is applied to products for beauty treatment and physiotherapy with cooling or heating, such as photon beauty treatment, radio frequency, physiotherapy massage, etc. contacting with human body.
Referring to fig. 8 to 9, an example of the photon beauty treatment instrument 100 uses the cold surface 11 of the semiconductor refrigeration member 10 of the above embodiment as an end surface contacting with skin or for refrigerating the end surface, the semiconductor refrigeration member 10 is mounted behind the end surface of the head end of the beauty treatment instrument or the cold surface is directly used as an end surface, the end surface contacts with skin, and the refrigerated beauty treatment end surface is provided by the semiconductor refrigeration member to provide ice effect to the contacted skin. In a specific example, the photon beauty treatment instrument 100 includes a housing 6, and a heat dissipation assembly 2, a light source assembly 3, a power source assembly 4, a control circuit board 5, and the like within the housing 6. The control circuit board 5 is electrically connected with the light source assembly 3 and the power source assembly 4 to control the light source assembly to generate photons. The power supply assembly 4 is used for supplying power to the light source assembly 3. The head of the photon beauty instrument 100 is mounted with a semiconductor cooling member 10 as a beauty end face (working face) contacting with the skin or for cooling the beauty end face (working face) to provide an ice effect. The control circuit board 5 controls the power supply assembly 4 to start the light source assembly 3 to generate photons, and the photons penetrate the beautifying end face (working face) to treat the contacted skin. The housing 6 is provided with ventilation openings 60 serving as an air inlet and an air outlet. The heat dissipation assembly 2 mainly serves to dissipate heat of the semiconductor refrigeration device 10, and the heat dissipation assembly 2 includes, as an example, a heat pipe 21, a heat sink 23 connected to the heat pipe, and a fan 25. The heat pipe 21 is connected to the hot surface 13 of the cooling element 10, so that heat generated by the cooling element 10 is conducted to the radiator 23 for heat dissipation. Ambient air enters the surface of the radiator 23 of the shell 6 from the air vent (air inlet) 60 to take away the hot surface, and the hot air is discharged out of the shell from the air vent (air outlet) 60 by the power of the fan 25. Photons generated by the light source assembly 3 are transmitted to the semiconductor refrigerating element 10, and are emitted from a light emitting region 16 formed by a through hole of the refrigerating element 10 or a transparent substrate, so as to perform cosmetic treatment on the contacted skin. In this example, when the semiconductor refrigerator 10 has the light emitting region 16, the cold surface of the semiconductor refrigerator 10 may be directly used as the face-beautifying surface, or may be attached to the back surface of the face-beautifying surface, thereby refrigerating the face. When the semiconductor cooling element 10 does not have the light emitting region 16, the semiconductor cooling element 10 may be directly attached to the back of the cosmetic end face or connected to the cosmetic end face via a cooling element, thereby cooling the cosmetic end face.
The positive and negative electrodes 120 of the conductor refrigerating element 10 and the positive and negative electrodes 150 of the temperature sensor module 15 are connected with the control circuit board 5, the temperature of the cold surface or the hot surface of the semiconductor refrigerating element is detected by the built-in temperature sensor module 15, the temperature sensor module 15 is electrically connected with the control circuit board 5 to feed back temperature data, and the control circuit board 5 controls the power supply action of the positive and negative electrodes 120 of the semiconductor refrigerating element according to the temperature data analysis and the requirement of a preset temperature interval, so that the temperature of the cold surface 11 or the beauty end surface is always kept in the preset temperature interval.
Referring to fig. 10-12, an exemplary photon physiotherapy instrument employs semiconductor refrigeration 10 for refrigeration. In a specific example, taking the photon rf cosmetic apparatus 100 as an example, it includes an rf module, a light source assembly 3, a heat dissipation assembly 2, a control module, and a power supply assembly 4, where the modules are disposed in a housing 6. The photon beauty instrument integrates radio frequency and photon treatment, and photon auxiliary treatment is carried out on the skin by photons generated by the light source component while radio frequency current is generated by the radio frequency module to carry out radio frequency treatment on the skin; the radio frequency heats the dermis layer of the skin, and utilizes the penetrability of red light wave band (above 600 nm) in photons to heat the deep skin at the same time, thereby rapidly heating the skin area to be treated currently. Effectively improving the treatment speed. Meanwhile, yellow light and green light wave bands (480-600 nm) in photons are absorbed by the epidermis layer due to the fact that penetrability is weaker than that of red light, so that the effects of treatment improvement of the epidermis layer, spots and red blood filaments are achieved. Thereby achieving the effects of removing wrinkles, tightening, brightening, whitening and tendering skin.
The shell 6 is provided with a plurality of ventilation openings 60 as an air inlet and an air outlet of an air channel in the photon radio frequency beauty instrument 100, cold air enters from the ventilation openings (air inlet), heat in the beauty instrument (such as heat generated by a circuit board, a light source lamp, a hot end of a refrigerating piece or other heating elements) is taken away through the air channel, and finally the heat is discharged out of the shell through the ventilation openings (air outlets) in the shell. The head of the radio frequency beauty instrument 100 is spherical (not limited to spherical) and is provided with a light outlet, a light outlet panel 70 is arranged in the light outlet, and the light outlet is covered at the front end of the light outlet channel. The light emitting panel 70 may be a transparent material such as a light transmitting crystal, e.g., sapphire, etc., or the light emitting panel 70 may be a non-transparent material defining light emitting through holes, e.g., a metal material such as aluminum or copper, etc., a heat conductive material. The outer wall surface of the light emitting panel 70 is used as a working surface or an end surface, and can be contacted with skin, the radio frequency electrode 7 is arranged on the working surface 70, and the conductive column of the radio frequency electrode 71 is electrically connected with the control circuit board 5 in the radio frequency beauty instrument. The light source assembly 3 is arranged in the head, and a filter can be configured to obtain photons with a required wavelength. The light source assembly 3 comprises a light source lamp, which can be an IPL lamp tube, a halogen lamp or other light sources suitable for the functions of beauty or physiotherapy. The control module includes a control circuit board 5 for controlling the operation of the photon rf cosmetic instrument 100. The light source assembly 3 is electrically connected to the control circuit board 5. The control circuit board 5 is integrated with a control module, and is also provided with a DC power supply module, a flash control module and other related functional modules which are of the prior art and can be purchased in the market. The radio frequency module comprises several pairs of radio frequency electrodes 71 and a radio frequency circuit board 72, which radio frequency circuit board 72 may be integrated on the control circuit board 5 or be provided separately. The radio frequency circuit board 72 is provided with functional modules such as a control module, a DC power module, a radio frequency driving module, etc., which are available in the market. When the radio frequency circuit board 72 is independently arranged, the radio frequency circuit board 72 is electrically connected with the control circuit board 5, and the DC power supply module of the radio frequency circuit board 72 is powered by the power supply module on the control circuit board in a shunt mode. Several pairs of rf electrodes 71 are electrically connected to an rf circuit board 72, each pair comprising a positive electrode and a negative electrode. The electrode is strip-shaped or column-shaped or any suitable shape, is arranged on the working surface 70 to form a radio frequency electrode point, is contacted with skin, and can be overlapped with the light outlet or arranged at the periphery of the light outlet, and is arranged in more than one pair. The pairs of RF electrodes 71 are electrically connected to an internal RF circuit board 72. The rf circuit board 72 supplies the voltage required for the corresponding gear to the rf driving module by controlling the DC power module, the rf driving module converts the DC power voltage into a high-voltage sine wave through the step-up transformer to the output control module, and the output control module transmits the rf current to the skin of the user through the rf electrode 71 to perform rf treatment on the skin.
The power supply assembly 4 may include a plug-in interface electrically connected to the control circuit board and to an external power supply to provide power; the power supply assembly also comprises an energy storage capacitor or a battery; the energy storage capacitor or battery is electrically connected with the control circuit board 5 and the light source group 3.
Referring to fig. 13 in combination, the heat dissipating assembly 2 includes a fan module 25 and also includes a semiconductor refrigeration member 10 for cooling a work surface 70. The semiconductor refrigeration member 10 may adopt the structure of the first embodiment, the semiconductor electric coupling layer 12 and the temperature sensor module 15 are located between the hot surface 13 and the cold surface 11 at two ends, and the temperature sensor module 15 may be attached to the inner side of the hot surface 13 or the cold surface 11; the positive and negative electrodes 120 of the semiconductor refrigerating element and the positive and negative electrodes 150 of the temperature sensor module 15 are electrically connected with the control circuit board 5, the temperature sensor module 15 is electrically connected or in communication with the control circuit board 5, and the fan 25 is electrically connected with the control circuit board 5. The hot side 13 of the semiconductor cooler 10 is connected in a rapid thermally conductive manner to a thermally conductive housing 251 formed by a heat pipe or super heat pipe or VC. The heat conducting shell 251 formed by the hot surface 13 of the semiconductor refrigeration piece 10 and the heat pipe or the super heat conducting plate or the VC is mutually attached to be contacted and transferred or is mutually attached to be contacted and transferred through the heat conducting plate, or the heat conducting shell 251 formed by the hot surface 13 of the semiconductor refrigeration piece 10 and the heat pipe or the super heat conducting plate or the VC is respectively arranged at different parts of the fan housing and is mutually and rapidly conducted; or, the semiconductor refrigeration piece 10 and the heat conducting shell 251 formed by the heat pipe or the super heat conducting plate or the VC are of an integrated structure, a hot end circuit is arranged on the heat conducting shell 251 formed by the heat pipe or the super heat conducting plate or the VC, and the hot end circuit is welded and electrically connected with the semiconductor electric coupling layer 12 to directly serve as the hot surface 13.
The cold surface 11 of the semiconductor refrigeration unit 10 is in contact with the light emitting panel 70 of the photon rf cosmetic instrument 100, and is disposed, for example, at the periphery of the light emitting panel 70. Alternatively, the cold face 11 of the semiconductor refrigeration device 10 and the light-emitting panel 70 are connected to the light-emitting panel 70 through a cold guide (heat transfer element or heat conductive member) 73. The cold guide 73 is a heat transfer structure, and can quickly transfer the heat of the light emitting panel 70 to the semiconductor refrigerating member, so as to achieve the effect of refrigerating the working surface 70, thereby forming a cold compress or precooling effect on the skin surface in contact with the working surface.
One end of the cold guide 73 is connected to the cold surface 11 of the semiconductor refrigerator in a rapid heat transfer manner, and the other end is connected to the light emitting panel 70 in a rapid cold guide manner. The cold conducting member 73 is a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. Depending on the shape of the light-emitting panel 70 and the expected cooling effect, the end of the cold guide 73 contacting the light-emitting panel 70 may be designed as a ring shape or provided with a ring-shaped cold guide to closely contact the periphery of the light-emitting panel 70 so as to quickly absorb heat of the working surface 70 or the surrounding environment of the working surface 70. The light-emitting panel 70 is preferably made of a heat-conductive material, such as transparent crystal, metal material, or heat-conductive silica gel, and the material is transparent or has openings.
The heat surface 13 of the semiconductor refrigeration member 10 is disposed on the outer wall of the heat conducting shell 251 formed by the heat pipe or the super heat conducting plate or the VC, or the heat conducting shell 251 formed by the heat pipe or the super heat conducting plate or the VC is directly used as the heat surface of the semiconductor refrigeration member. And the heat pipe or super heat conducting plate or VC forms the heat conducting shell 251 with the heat radiating fins 252 on the inner wall to increase the heat radiating area, and the heat radiating fins 252 are positioned in the air flow passage inside the fan. The heat generated by the hot face 13 is quickly conducted to the cooling fins 252 through the heat conducting shell 251, and the air in the air flow channel of the fan takes away the heat of the heat conducting shell 251 and the cooling fins and is discharged from the ventilation opening (air outlet) of the fan. The cold face 11 of the semiconductor refrigeration member is connected to one end of the cold guide member 73, preferably with a maximum contact area or rapid thermal conduction, and the other end of the cold guide member is bent and connected to an annular cold guide member with a maximum contact area, and the light emitting panel 70 is connected to the annular cold guide member with a maximum contact area. The semiconductor refrigeration unit 10 gives rapid cooling of the light panel 70 by means of the cooling guide 73. The annular cold conducting piece is a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. Preferably, the cold guide 73 is an aluminum superconducting pipe or an aluminum superconducting plate. The fan 25 may be a blower that includes a fan housing 253 that defines a cavity therein and an impeller 250 mounted within the cavity.
In the above embodiments, the temperature sensor module (NTC) 15 is built in the semiconductor refrigeration unit 10 to detect the temperature of the cold surface 11 or the hot surface 13 of the semiconductor refrigeration unit, and the temperature data is transmitted to the control circuit board, and the main control unit on the control circuit board processes the temperature data to control the power supply of the positive and negative electrodes 120 of the semiconductor refrigeration unit, so as to adjust the working state of the semiconductor refrigeration unit, thereby realizing accurate and constant temperature within the expected temperature range and realizing accurate temperature control. The beauty instrument 100 using the semiconductor refrigeration member 10 can realize accurate control of the temperature of the working surface or end surface contacting with the skin, has a built-in temperature sensor module (NTC), has a simple structure, and can protect the temperature sensor module (NTC) from being damaged.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the present application as defined by the appended claims and their equivalents.
Claims (11)
1. A semiconductor refrigerating piece comprises a semiconductor electric coupling layer and cold and hot surfaces at two ends of the semiconductor electric coupling layer; the method is characterized in that: the semiconductor refrigerating piece is internally provided with a temperature sensor module; the temperature sensor module is used for detecting the temperature of the hot surface or the cold surface and transmitting temperature data to the main control unit so that the main control unit controls the power supply of the semiconductor refrigerating piece according to the received temperature data.
2. The semiconductor refrigeration piece according to claim 1, wherein: the temperature sensor die comprises positive and negative electrodes, the semiconductor refrigerating piece comprises positive and negative electrodes, and the positive and negative electrodes are connected with a main control unit or a control circuit board provided with the main control unit through an H-bridge drive; the temperature sensor die is electrically or communicatively connected to the main control unit or a control circuit board provided with the main control unit to transmit temperature data.
3. The semiconductor refrigeration piece according to claim 1, wherein: and the inner side surface of the temperature sensor die attached hot surface or cold surface is provided.
4. A semiconductor refrigeration component as recited in claim 3 wherein: the shapes of the cold surface and the hot surface are matched, p-type and n-type semiconductor particles of the semiconductor electric couple layer are horizontally paved on the inner side surfaces of the cold surface and the hot surface, and the whole cold surface of the semiconductor refrigerating piece forms whole-surface refrigeration or the whole hot surface forms whole-surface heating; the semiconductor electric coupling layer and the temperature sensor module are positioned between the cold surface and the hot surface.
5. A semiconductor refrigeration component as recited in claim 3 wherein:
a through hole is formed on one side of the semiconductor refrigeration piece; or alternatively, the process may be performed,
the cold face and/or the hot face of the semiconductor refrigerating piece are/is transparent substrates, p-type and n-type semiconductor couple particles of the semiconductor couple layer are arranged in one side of the semiconductor refrigerating piece, and p-type and n-type semiconductor couple particles are not arranged in the other side of the semiconductor refrigerating piece to form a vacant area; forming a light emitting area corresponding to the vacant area, wherein the light emitting area is as follows: the cold surface and the hot surface are transparent substrates to form a light-emitting area, or one of the cold surface and the hot surface is the transparent substrate, the other is correspondingly formed with a through hole, and the cold surface and the hot surface are mutually matched to form the light-emitting area.
6. A semiconductor refrigeration component as recited in claim 3 wherein:
the p-type semiconductor couple particles and the n-type semiconductor couple particles of the semiconductor couple layer are arranged into an annular belt, and the p-type semiconductor couple particles and the n-type semiconductor couple particles are not arranged in the central inner area to form a vacant area;
the cold surface and/or the hot surface are/is arranged as through holes corresponding to the central inner area of the semiconductor electric coupling layer; or, one of the cold surface and/or the hot surface is the transparent substrate, the other is correspondingly provided with a through hole, and the cold surface and the hot surface are mutually matched to form a light emitting area.
7. A semiconductor refrigeration component as claimed in any one of claims 1 to 6, wherein: the cold surface and the hot surface are heat conducting material substrates;
the heat conducting material substrate is a ceramic material substrate, an aluminum substrate, a copper substrate or a transparent crystal substrate.
8. A beauty or physiotherapy instrument, its head end surface forms the working face, the said working face contacts with skin to carry on the beauty or physiotherapy treatment; the method is characterized in that: a semiconductor refrigeration piece according to any one of claims 1 to 7 is arranged in the beauty treatment or physiotherapy instrument; the cold face of the semiconductor refrigeration piece is used as the working face; or the cold surface of the semiconductor refrigeration piece is attached to the inner side of the working surface so as to refrigerate the working surface; or the cold surface of the semiconductor refrigeration piece is connected with the working surface in a rapid cold conduction mode through the cold conduction piece so as to refrigerate the working surface.
9. The cosmetic or physiotherapy apparatus according to claim 8, wherein: the beauty or physiotherapy instrument comprises a shell, a light source assembly, a power assembly, a control circuit board and a heat dissipation assembly, wherein the light source assembly, the power assembly, the control circuit board and the heat dissipation assembly are arranged in the shell; the positive electrode and the negative electrode of the semiconductor refrigeration piece and the built-in temperature sensor module are electrically connected with the control circuit board; the control circuit board is provided with a main control unit; the heat dissipation component is used for dissipating heat of a hot surface of the semiconductor refrigerating piece.
10. The cosmetic or physiotherapy apparatus according to claim 8, wherein: the heat dissipation assembly includes a fan including a thermally conductive housing; the hot surface of the semiconductor refrigeration piece is connected with the heat conduction shell in a heat conduction way; or the heat-conducting shell is directly used as the hot surface of the semiconductor refrigerating piece, and a hot end circuit is arranged on the outer wall of the heat-conducting shell and welded with the semiconductor electric couple layer; the cold face of the semiconductor refrigerating piece is connected with the working face through the cold conducting piece in a rapid cold conducting mode.
11. The cosmetic or physiotherapy apparatus according to claim 10, wherein: the heat conducting shell comprises one or a combination of a plurality of heat pipes, super heat conducting plates or VC temperature equalizing plates; the cold conducting piece is a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211479338 | 2022-11-24 | ||
| CN2022114793380 | 2022-11-24 | ||
| CN202211619958 | 2022-12-15 | ||
| CN202211619958X | 2022-12-15 |
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| CN116465115A true CN116465115A (en) | 2023-07-21 |
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| CN202320911557.5U Active CN219713700U (en) | 2022-11-24 | 2023-04-17 | Semiconductor refrigerating piece and beauty or physiotherapy instrument |
| CN202310459098.6A Pending CN116465115A (en) | 2022-11-24 | 2023-04-17 | Semiconductor refrigerating piece and beauty or physiotherapy instrument |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202320911557.5U Active CN219713700U (en) | 2022-11-24 | 2023-04-17 | Semiconductor refrigerating piece and beauty or physiotherapy instrument |
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| CN116549858A (en) * | 2022-10-17 | 2023-08-08 | 深圳市予一电子科技有限公司 | Photon radio frequency beauty instrument |
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- 2023-04-17 CN CN202320911557.5U patent/CN219713700U/en active Active
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