CN116460935A - Cutting sequence method for maintaining connection maximization based on elimination of plate movement - Google Patents
Cutting sequence method for maintaining connection maximization based on elimination of plate movement Download PDFInfo
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- CN116460935A CN116460935A CN202310454862.0A CN202310454862A CN116460935A CN 116460935 A CN116460935 A CN 116460935A CN 202310454862 A CN202310454862 A CN 202310454862A CN 116460935 A CN116460935 A CN 116460935A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000008030 elimination Effects 0.000 title claims description 6
- 238000003379 elimination reaction Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000012545 processing Methods 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000003801 milling Methods 0.000 claims description 10
- 238000013461 design Methods 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000003754 machining Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27C—PLANING, DRILLING, MILLING, TURNING OR UNIVERSAL MACHINES FOR WOOD OR SIMILAR MATERIAL
- B27C5/00—Machines designed for producing special profiles or shaped work, e.g. by rotary cutters; Equipment therefor
- B27C5/02—Machines with table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27C—PLANING, DRILLING, MILLING, TURNING OR UNIVERSAL MACHINES FOR WOOD OR SIMILAR MATERIAL
- B27C5/00—Machines designed for producing special profiles or shaped work, e.g. by rotary cutters; Equipment therefor
- B27C5/02—Machines with table
- B27C5/04—Guide fences for work
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a method for keeping a connection maximized material cutting sequence based on eliminating plate movement, which comprises the steps of obtaining material cutting data of a substrate; performing jacking processing on the substrate based on the blanking data; and selecting a processing sequence and a cutting point based on the current connection condition of the plates on the substrate. The invention belongs to the technical field of plate processing, and particularly provides a cutting sequence method for improving the probability of running plates in the processing due to the fact that small-area plates lose connection with a substrate in the cutting process, improving the production quality of products and improving the processing quality and reliability, wherein the cutting sequence method is based on the maximization of connection maintenance and is used for eliminating plate movement.
Description
Technical Field
The invention belongs to the technical field of plate processing, and particularly relates to a connection-maintaining maximized material cutting sequence method based on elimination of plate movement.
Background
With the rapid development of the furniture industry, manufacturers often need to perform large-scale batch production, wherein plate cutting is an important ring in the plate processing technology, so that the plate cutting has higher and higher requirements on mechanical processing.
In conventional production of a plate, an engraving machine is generally used as a cutting device, a plate is cut from the substrate by taking the substrate as a unit and milling along the outline of the plate through a milling cutter of the cutting device, each time cutting needs to surround the outline of the plate, the data of the substrate subjected to path optimization and discharge contains a plurality of processing groups, each processing group contains at least one cutting path data, and after the processing groups are cut according to the cutting paths, a feeding pushing handle pushes the cut plate out to a workbench, or a worker manually receives the plate.
In the prior art, an operator needs to manually judge which plates need to be sawn continuously according to the discharging preview image of the substrate, so that the whole plate feeding process has more manual intervention and low treatment efficiency; in addition, in the cutting process of each plate, the connection with the original substrate material can not be ensured, the probability of the movement of the plate in the processing of the small-area plate (the plate moving phenomenon in the cutting process) can be greatly increased due to the loss of the connection with the substrate in the cutting process of each plate, as shown in fig. 2, the plate A is adjacent to the plate B, the parting line between the plate A and the plate B is a parting line, one side of the plate B can be lost to be connected with the substrate when the plate A is cut, if the lower knife point of the plate B is positioned on the edge of the lost connection, the milling cutter cuts a circle around the outline of the plate, and when the cutting is not finished, the plate B is lost to be connected with the substrate, the plate moving phenomenon occurs, so that the processing quality problem of the plate is easy to occur.
Disclosure of Invention
Aiming at the situation, the invention provides a cutting sequence method for solving the problems, which improves the probability of running boards in the process of processing due to the loss of connection with a substrate in the cutting process of a small-area board, improves the production quality of products, and improves the processing quality and reliability based on the maximization of connection maintenance based on the elimination of the movement of the board.
The technical scheme adopted by the invention is as follows: the invention discloses a connection-maintaining maximized material cutting sequence method based on elimination of plate movement, which comprises the following steps:
s1: acquiring cutting data of a substrate, wherein the cutting data is a set of processing group data;
s2: performing jacking processing on the substrate based on the blanking data, and milling plates with different sizes along the outer contour of the substrate;
s3: and selecting a processing sequence and a cutting point based on the current connection condition of the plates on the substrate.
Preferably, the cutting data includes a number of an expected plate, a length of the expected plate and a width of the expected plate, and the cutting path is obtained by planning the processing sequence and the cutting point of the substrate based on the cutting data.
In a preferred embodiment, the design of the substrate processing sequence includes the following specific steps:
step one: calculating all plates Ax [ x epsilon (1, 2, 3 …) ] which are not cut in the current substrate layout, searching for a right lower plate A1 of the unordered substrate, adding the right lower plate A1 as an initial plate into a cutting sequence, and setting a lower cutter point of the right lower plate A1 at a middle lower position of the plate A1 because all sides of the right lower plate A1 are not cut;
step two: searching for a plate A2 adjacent to the left of the plate A1, and setting the lower cutter point of the plate A2 at the middle lower position of the plate A2;
step three: if the plate A2 does not reach the leftmost side of the substrate, continuing to circularly search to the left side, and repeating the step two; if the plate A2 reaches the leftmost side of the substrate, no adjacent plate of the plate A2 is searched any more, and the next step is carried out;
step four: selecting the rightmost Fang Banjian A3 adjacent to the plate A2, and selecting the middle upper position of the plate A3 as a lower cutter point because the bottom edge of the plate A3 is cut and damaged by the right lower plate A1;
step five: searching for a plate A4 adjacent to the left of the plate A3, wherein the right side and the bottom side of the plate A4 are respectively damaged by the plate A3 and the plate A2, so that the middle upper position of the plate A4 is selected as a lower cutter point;
step six: and then repeating the third step and the fifth step until all the plates are added into the processing sequence, and ending.
As a further illustrative solution, in the second step, the plate A2 adjacent to the left of the plate A1 includes the plate A1 located at the upper side and the plate A2 located at the lower side, the lower plate is processed first, the processing sequence of the plate A2 and the plate A1 is sequentially added to the processing sequence, and since the plate A1 and the plate A2 are adjacent up and down, the middle lower position of the plate A2 is taken as the lower cutter point, and then the middle lower position of the plate A1 is taken as the lower cutter point.
Further, if the areas of the plate a1 and the plate a2 exceed a certain critical value, in order to improve the efficiency, the lower knife point may be sequentially formed from the middle upper position of the plate a2 to the middle lower position of the plate a 1.
In a preferred embodiment, the processing of the jacket material in the step S2 includes: it is necessary to arrange as many plates as possible on the substrate, and there is a space between adjacent plates and the plates cannot overlap.
As a further elaboration, the distance is slightly larger than the diameter of the milling cutter.
Further, before the step S1, the substrate needs to be adsorbed on a processing plane of the cutting device by a vacuum pump, and suction holes are uniformly formed on the processing plane.
In the preferred scheme, the suction force generated by the vacuum pump and the area of the substrate are in positive correlation, the substrate cannot move in the processing process when the suction force is large enough, and if the suction force is insufficient, the milling cutter can generate transverse moment on the substrate in milling, so that the displacement processing of the substrate fails; when the outer contour of one plate is not completely cut, the whole raw material uncut area provides adsorption force because the plate is still connected with the base plate.
According to the scheme, the method for maintaining the connection maximized cutting sequence based on eliminating the plate movement has the following beneficial effects:
1. the problem that in the prior art, connection with a substrate is kept in cutting of each plate in the process of cutting the plate is solved, the probability of running plates in the process of machining due to the fact that the connection between the small-area plate and the substrate is lost is improved, the production quality of products is improved, and finally the aims of reducing cost and enhancing efficiency of home production enterprises are fulfilled;
2. according to the method provided by the scheme, when the machining path is calculated, under the condition of following a certain direction, the connection condition of the plates during machining is fully considered, at least one side of the plate is still kept in a connection state with the base plate when the plate is cut off, and the quality and the reliability of machining are improved.
Drawings
FIG. 1 is a flow chart of a method for maximizing a hold connection based on eliminating plate movement;
FIG. 2 is a schematic diagram of a tool setting point at which a run-out phenomenon occurs during plate processing;
FIG. 3 is a distribution diagram of a plate on a substrate in example 1;
FIG. 4 is a first illustration of the processing of the sheet material of example 1;
FIG. 5 is a second illustration of the processing of the sheet material of example 1;
FIG. 6 is a third view of the processing of the sheet material of example 1;
fig. 7 is a drawing four during the processing of the sheet material in example 1.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, the method for maximizing the connection maintaining and cutting sequence based on eliminating the plate movement of the present invention comprises the following steps:
s0: the substrate is required to be adsorbed on a processing plane of the cutting equipment through a vacuum pump, suction holes are uniformly formed in the processing plane, suction force generated by the vacuum pump and the area of the substrate are in positive correlation, and the suction force can be large so that the substrate cannot move in the processing process;
s1: the method comprises the steps of obtaining cutting data of a substrate, wherein the cutting data are collection of processing group data, the cutting data comprise the number of an expected plate, the length of the expected plate and the width of the expected plate, and planning the processing sequence and the cutting point of the substrate based on the cutting data to obtain a cutting path;
s2: the substrate is subjected to jacking processing based on the blanking data, as many plates as possible need to be arranged on the substrate, and adjacent plates are spaced and cannot be overlapped, and in the preferable scheme, the spacing is slightly larger than the diameter of a milling cutter, and the plates with different sizes are milled along the outer contour of the substrate;
s3: and selecting a processing sequence and a cutting point based on the current connection condition of the plates on the substrate.
In embodiment 1, referring to fig. 3-7, a substrate is subjected to a nesting process, wherein as shown in fig. 3, 5 groups of plates, namely, a plate a, a plate B, a plate C, a plate D and a plate E, are preferably disposed on the substrate, wherein the plate a is located at the lower right side of the substrate, the plate B and the plate C are located at the left side of the same horizontal plane of the plate a, the plate C is located at the lower side, the plate B is located at the upper side, the plate D and the plate E are located at the upper horizontal plane of the plate a, the plate B and the plate C, and the plate D is located at the right end of the plate and above the plate a, and the whole algorithm process is described in this embodiment:
in the illustration, the filled plate represents the plate that has been added in the order, the dots represent the lower knife points, and the outer periphery of the filled plate represents the cutting path:
step one: calculating the lower right plate A as the initial plate to be added into the cutting sequence in all the plates which are not cut in the current layout diagram, and setting the lower knife point of the plate A at the middle lower position of the plate (as shown in figure 4) because all the edges of the plate A are not cut;
step two: searching for a plate adjacent to the left of the plate A, wherein the plate comprises a plate B/C on the left and a plate D/E on the upper side, and the plate B/C on the left is preferentially selected; because panel C is down, panel B is up, panels C, B are added sequentially into the sequence; because the plates B, C are adjacent to each other up and down, the lower cutting point of the plate C is selected as the middle and lower cutting point of the plate B (as shown in fig. 5) for improving efficiency;
step three: since panel B, C has reached the far left side of the base, no further searching for an adjacent panel of panel B, C is performed; restarting to find a plate from the plate ED in the non-addition order, wherein the plate in the lower right corner is the plate D; since the connection of one side of the panel D is broken by the cutting of the panel a, the upper and lower blade positions are selected (as shown in fig. 6);
step four: plate E is adjacent to plate D, plate E is added in sequence, and the two edge connection of plate E is broken by the contours of plate B and plate D, so the middle upper position is selected for down (as shown in fig. 7);
step five: all plates are added to the sequence and the algorithm ends.
According to the embodiment, after the scheme is applied, the running plate phenomenon is reduced by 95% in the processing process, the production quality of enterprises is greatly improved, and the reworking rate is reduced.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.
Claims (8)
1. A method of maintaining a connection maximization cut-out sequence based on elimination of plate movement, comprising the steps of:
s1: acquiring cutting data of a substrate, wherein the cutting data is a set of processing group data;
s2: performing jacking processing on the substrate based on the blanking data, and milling plates with different sizes along the outer contour of the substrate;
s3: and selecting a processing sequence and a cutting point based on the current connection condition of the plates on the substrate.
2. The method of maximizing a firing order of a hold connection based on eliminating plate movement of claim 1, wherein: the cutting data comprise the number of the expected plate, the length of the expected plate and the width of the expected plate, and the cutting path is obtained by planning the processing sequence and the cutting point of the substrate based on the cutting data.
3. The method of maximizing a firing order of a hold connection based on eliminating plate movement according to claim 2, wherein the design of the substrate processing order comprises the specific steps of:
step one: calculating all plates Ax, x epsilon positive integers 1, 2 and 3 … which are not cut in the current substrate layout, firstly searching a right lower plate A1 of an unordered substrate, taking the right lower plate A1 as an initial plate to be added into a cutting sequence, and setting a lower cutter point of the right lower plate A1 at a middle lower position of the plate A1 because all sides of the right lower plate A1 are not cut;
step two: searching for a plate A2 adjacent to the left of the plate A1, and setting the lower cutter point of the plate A2 at the middle lower position of the plate A2;
step three: if the plate A2 does not reach the leftmost side of the substrate, continuing to circularly search to the left side, and repeating the step two; if the plate A2 reaches the leftmost side of the substrate, no adjacent plate of the plate A2 is searched any more, and the next step is carried out;
step four: selecting the rightmost Fang Banjian A3 adjacent to the plate A2, and selecting the middle upper position of the plate A3 as a lower cutter point because the bottom edge of the plate A3 is cut and damaged by the right lower plate A1;
step five: searching for a plate A4 adjacent to the left of the plate A3, wherein the right side and the bottom side of the plate A4 are respectively damaged by the plate A3 and the plate A2, so that the middle upper position of the plate A4 is selected as a lower cutter point;
step six: and then repeating the third step and the fifth step until all the plates are added into the processing sequence, and ending.
4. A method of maximizing a hold-down sequence based on eliminating plate movement as defined in claim 3 wherein: in the second step, the plate A2 adjacent to the left of the plate A1 includes a plate A1 located at the upper side and a plate A2 located at the lower side, and the plate located at the lower side is processed first, so that the plates A2 and A1 are sequentially added into the processing sequence according to the sequence of the plates A1 and A2, and the middle lower position of the plate A2 is used as a lower cutter point, and then the middle lower position of the plate A1 is used as a lower cutter point because the plates A1 and A2 are adjacent up and down.
5. The method of maximizing a hold-down sequence based on eliminating plate movement of claim 4 wherein: the processing of the jacket material in the step S2 comprises the following steps: it is necessary to arrange as many plates as possible on the substrate, and there is a space between adjacent plates and the plates cannot overlap.
6. The method of maximizing a hold-down sequence based on eliminating plate movement of claim 5 wherein: the distance is greater than the diameter of the milling cutter.
7. The method of maximizing a firing order of a hold connection based on eliminating plate movement of claim 6 wherein: before the step S1, the substrate is required to be adsorbed on a processing plane of the cutting device by a vacuum pump, and suction holes are uniformly formed in the processing plane.
8. The method of maximizing a hold-down sequence based on eliminating plate movement of claim 7 wherein: the suction force generated by the vacuum pump is in positive correlation with the area of the substrate, and the suction force is large so that the substrate cannot move in the processing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310454862.0A CN116460935A (en) | 2023-04-25 | 2023-04-25 | Cutting sequence method for maintaining connection maximization based on elimination of plate movement |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310454862.0A CN116460935A (en) | 2023-04-25 | 2023-04-25 | Cutting sequence method for maintaining connection maximization based on elimination of plate movement |
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| CN202310454862.0A Pending CN116460935A (en) | 2023-04-25 | 2023-04-25 | Cutting sequence method for maintaining connection maximization based on elimination of plate movement |
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| CN115297992A (en) * | 2020-03-27 | 2022-11-04 | 三菱电机株式会社 | System and method for detecting and correcting laser cutting distortion |
| CN115555649A (en) * | 2022-09-23 | 2023-01-03 | 华中科技大学 | Steel plate cutting method and system based on dynamic boundary and considering thermal deformation |
| CN115555648A (en) * | 2022-09-22 | 2023-01-03 | 江南造船(集团)有限责任公司 | Numerical control cutting method, system, equipment and medium |
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2023
- 2023-04-25 CN CN202310454862.0A patent/CN116460935A/en active Pending
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| JP2008116996A (en) * | 2006-10-31 | 2008-05-22 | Mitsubishi Electric Corp | Manufacture support device, method for editing manufacture support data, program for supporting manufacture and machine tool and machining system |
| TW200912581A (en) * | 2007-07-10 | 2009-03-16 | Dainippon Screen Mfg | Scheduling method and information recording media for a substrate treating apparatus |
| US20160271718A1 (en) * | 2015-03-20 | 2016-09-22 | Matthew Fagan | Method and system for enhanced numerical control plasma cutting of parts from a workpiece |
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