CN218488531U - Circuit board cutting and edge grinding equipment suitable for different thicknesses - Google Patents

Abstract

The utility model relates to a circuit board cuts edging equipment suitable for different thickness, including a cutting device and an edging device. Wherein the cutting device comprises a first cutter and a second cutter, and the edge grinding device comprises an edge grinding cutter. The first cutter is matched with the second cutter, so that the circuit board can be cut firstly; the edge of the circuit board after cutting is ground by using an edge grinding tool with special design, so that the edge of the circuit board can be smooth and chamfered without burrs, and the edge quality is improved. The utility model discloses compare in prior art, use same cutter can process with the circuit board of different thickness, have the advantage of exempting from the tool changing, can reduce tool changing time extravagant by a wide margin, promote whole efficiency, productivity and use the rate.

Description

Circuit board cutting and edge grinding equipment suitable for different thicknesses

Technical Field

The utility model relates to a processing technology field of circuit board, especially can cut edging equipment with the circuit board that is applicable to different thickness of processing is accomplished with the circuit board of same cutter with regard to different thickness during the edging.

Background

The trace of the printed circuit board is seen in almost all electronic products; the production process of the printed circuit board is quite complicated, one of the processes needs to cut the edge of the printed circuit board, and the edge needs to be ground after cutting so as to remove rough burrs on the edge of the printed circuit board, thereby improving the quality and avoiding cutting hands.

The traditional equipment can set up a set of cutter in single board, and this set of cutter can be when relative rotation, and the circuit board that just sends into cuts, and utilizes and designs into the structure of central authorities' bulge point with the cutting edge, makes to cut and to grind the process of chamfer in the lump simultaneously. The traditional process is ideal in surface, can simultaneously perform two functions of cutting, edging and the like once, and has the defect that the cutter can only be specially used for a circuit board with a specific thickness in practice; when the same group of cutters needs to process circuit boards with different thicknesses subsequently, another group of cutters with different specifications needs to be replaced; however, it is not easy to replace the cutter, and the original cutter needs to be disassembled and returned first, and then another set of cutter needs to be assembled, and even the precision adjustment needs to be performed, which is very inconvenient and time consuming. Moreover, the process of replacing the cutter inevitably leads to operation stop, and derived problems are that the efficiency cannot be improved and the utilization rate is low; for manufacturers, high utilization is of paramount importance, representing the ratio of time actually used for production by the equipment during the day's operating hours, which can show the effect on equipment utilization due to loss of tool change or equipment failure; the existing equipment wastes a lot of time for changing cutters because circuit boards with different thicknesses need to be processed every day, and has great negative influence on the utilization rate. In order to process circuit boards with various thicknesses, manufacturers need to prepare various cutters with different specifications, which increases the cost and occupies much space for storage.

Obviously, the existing circuit board processing is still not perfect in terms of the structure of the cutting and edging equipment, and needs to be improved actually.

SUMMERY OF THE UTILITY MODEL

For improving the disappearance that the cutter must be changed with the circuit board of different thickness to current circuit board cutting edging equipment, the utility model discloses main aim at: the utility model provides a circuit board cuts edging equipment suitable for different thickness, this kind of equipment carries out the process of cutting of circuit board and edging process according to the preface respectively, causes same cutter can be suitable for the processing of the circuit board of different thickness to use simultaneously through special design.

To achieve the above purpose, the specific technical solution of the present invention is: this circuit board cuts edging equipment suitable for different thickness mainly is including a cutting device and an edging device at least.

In a preferred embodiment, the edge grinding device is adjacent to the edge of the cutting device.

In a preferred embodiment, the cutting device and the edge grinding device are in a continuous relationship in front and back in a production line.

In a preferred embodiment, the cutting device includes a first body, a first cutter and a second cutter are disposed on a side of the first body; the first body is internally provided with a power mechanism, so that the first cutter and the second cutter have the function of respectively rotating.

In a preferred embodiment, the first tool and the second tool are in a corresponding set of up and down relationship.

In a preferred embodiment, the first and second cutting tools are configured in a circular saw blade shape.

In a preferred embodiment, the edge of the first cutter is provided with a first blade.

In a preferred embodiment, the edge of the second cutter is provided with a second cutting edge.

In one preferred embodiment, the first tool can be adjusted in height by a first adjusting element located on the first body.

In one preferred embodiment, the second tool can be adjusted in height by a second adjusting element located on the first body.

In one preferred embodiment, the edge grinding device includes a second body, and an edge grinding tool is disposed in the second body.

In a preferred embodiment, the edge grinding tool is connected to a power device, and the power device can drive the edge grinding tool to rotate.

In a preferred embodiment, the power element is disposed on the second body.

In one preferred embodiment, the edge grinding device has a lifting function, and can adjust the height position according to the thickness of the circuit board, so that the center position of the edge grinding cutter can be opposite to the center positions of the circuit boards with different thicknesses.

In a preferred embodiment, the edge grinding tool is disposed in a flat configuration.

In a preferred embodiment, the edging tool comprises a plurality of edging blades.

In a preferred embodiment, the edge-grinding blade is provided with a recess, and the cross section of the recess is approximately in a ">" shape.

The beneficial effects of the utility model are that:

the utility model discloses can obtain to add man-hour corresponding to the circuit board of different thickness, need not change the advantage of cutter, effectively reduce because of the extravagant time of change cutter to raise the efficiency and the rate of utilization, and then can create the profit. And, through the utility model discloses a product, the producer need not prepare the cutter of multiple different specifications, can effectively reduce the cost of setting, sets up the space jointly sparingly.

Drawings

FIG. 1: is a three-dimensional appearance diagram of the utility model;

FIG. 2 is a schematic diagram: the schematic diagram of the circuit board cutting action of the utility model is shown;

FIG. 3: the schematic diagram of the operation of the edge grinding of the circuit board of the utility model is shown;

FIG. 4: do the utility model discloses an edging cutting edge carries out the action schematic diagram of circuit board edging.

In the figure: 1. a cutting device;

10. a first body;

11. a first cutter;

111. a first blade;

12. a second cutter;

121. a second blade;

13. a first adjustment element;

14. a second adjustment element;

2. an edge grinding device;

20. a second body;

21. a power element;

22. an edging cutter;

221. edging the blade;

222. a recess;

9. a circuit board.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1, a cutting and edge grinding apparatus for circuit boards with different thicknesses mainly includes a cutting device 1 and an edge grinding device 2, wherein the edge grinding device 2 is adjacent to the edge of the cutting device 1, and the cutting device 1 and the edge grinding device 2 are in a continuous relationship in a production line.

The cutting device 1 comprises a first body 10, a first cutter 11 and a second cutter 12 are arranged on the side edge of the first body 10; the first body 10 is provided with a power mechanism therein so that the first tool 11 and the second tool 12 have respective rotation functions. The first tool 11 and the second tool 12 are arranged in an up-and-down corresponding manner, and the first tool 11 and the second tool 12 are both in a circular saw blade-shaped structure; the first blade 111 is disposed at the edge of the first cutter 11, and the second blade 121 is disposed at the edge of the second cutter 12. The first cutter 11 can be adjusted in height by a first adjusting element 13 positioned on the first body 10; the second tool 12 can be adjusted in height by a second adjusting element 14 located on the first body 10.

The edge grinding device 2 comprises a second body 20, and an edge grinding tool 22 is arranged in the second body 20; the edge grinding tool 22 is connected to a power unit 21, and the power unit 21 can drive the edge grinding tool 22 to rotate; the power element 21 is disposed on the second body 20. The edge grinding device 2 has a lifting function, and can adjust the height position according to the thickness of the circuit board, so that the central position of the edge grinding cutter 22 can be opposite to the central position of the circuit boards with different thicknesses. The edge grinding tool 22 is disposed in a flat manner, the edge grinding tool 22 includes a plurality of edge grinding blades 221, a concave portion 222 is disposed in the edge grinding blades 221, and the cross section of the concave portion 222 is in a shape of ">" (please refer to fig. 4).

In the implementation of the present invention, as shown in fig. 2, a circuit board 9 is fed into the apparatus of the present invention, and the heights of the first cutter 11 and the second cutter 12 are respectively adjusted by the first adjusting element 13 and the second adjusting element 14 according to the thickness of the circuit board 9, so as to obtain the optimal distance between the first cutter 11 and the second cutter 12; then the cutting device 1 cuts the edge of the circuit board 9 by utilizing a first cutter 11 and a second cutter 12 which are arranged up and down in a rotating mode; after removing the excess portion, the circuit board 9 is sent to the edge grinding device 2, as shown in fig. 3. Rotating the flat edging tool 22, especially the center of the edging tool 22 is relative to the longitudinal center of the circuit board 9; because the edge grinding blade 221 is provided with the concave part 222, and the cross section of the concave part 222 is in a shape of a Chinese character 'ji', the edge of the circuit board 9 can be ground by utilizing the Chinese character 'ji' shaped concave part 222 with the opposite inclined surfaces up and down, and particularly, the upper and lower end corners of the edge can be chamfered. Because the edging cutter 22 of the present invention is provided with the concave portion 222 having a slightly ">" shaped cross section, and the two opposite predetermined inclined surfaces are utilized, the present invention can be applied to edge grinding of circuit boards 9 with various thicknesses, and is particularly suitable for processing thin circuit boards. Compare circuit board 9 of fig. 3 thick, circuit board 9 of fig. 4 is relatively thin, through the utility model discloses utilize single edging cutter 22, can be applicable to the thick plate and the sheet metal of different thickness, avoid the process of changing the cutter, the progress of the utility model is obvious with the advantage.

By using the utility model, although the original processing procedure is divided into two, the operation procedure is increased, and in fact, the whole processing time is compared with the shutdown time of frequently changing the cutter of the existing equipment, the utility model has better efficiency, and the utilization rate and the productivity can be greatly improved; in addition, the utility model does not need to be provided with a plurality of cutters with different specifications, and saves a lot of acquisition cost and space; furthermore, the utility model discloses same board can be processed with regard to thin extremely thin, thick extremely thick circuit board, and the thickness broad width more than the two-fold at least can be covered to its difference, very promotes throughput.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. The utility model provides a circuit board cuts edging equipment suitable for different thickness which characterized in that: the method comprises the following steps:

the cutting device comprises a first body, and a first cutter and a second cutter are arranged on the side edge of the first body;

an edge grinding device, which is adjacent to the edge of the cutting device; the edge grinding device comprises a second body, wherein an edge grinding cutter is arranged in the second body; the edge grinding cutter comprises a plurality of edge grinding cutting edges, and a concave part is arranged in each edge grinding cutting edge.

2. The circuit board cutting and edging machine suitable for different thicknesses according to claim 1, characterized in that: the cutting device and the edge grinding device are in a relative front-back continuous relation in a production line.

3. The circuit board cutting and edging machine suitable for different thicknesses according to claim 1, characterized in that: a power mechanism is arranged in the first body and drives the first cutter and the second cutter to rotate respectively.

4. The circuit board cutting and edging machine suitable for different thicknesses according to claim 1, characterized in that: the first tool and the second tool are correspondingly assembled up and down, and both the first tool and the second tool are in a circular saw blade-shaped structure.

5. The circuit board cutting and edging machine suitable for different thicknesses according to claim 1, characterized in that: the edge of the first cutter is provided with a first cutting edge, and the edge of the second cutter is provided with a second cutting edge.

6. A circuit board cutting edging apparatus suitable for different thicknesses according to claim 1, characterized in that: the first cutter is used for adjusting the height through a first adjusting element positioned on the first body; the second cutter is adjusted in height by a second adjusting element positioned on the first body.

7. The circuit board cutting and edging machine suitable for different thicknesses according to claim 1, characterized in that: the edge grinding tool is connected with a power element which drives the edge grinding tool to rotate, and the power element is arranged on the second body.

8. A circuit board cutting edging apparatus suitable for different thicknesses according to claim 1, characterized in that: the edge grinding cutter is arranged in a flat manner.

9. The circuit board cutting and edging machine suitable for different thicknesses according to claim 1, characterized in that: the cross section of the concave part is shaped like a Chinese character 'mi'.

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