TWM634070U - Circuit board cutting and edging equipment for different thicknesses - Google Patents

Circuit board cutting and edging equipment for different thicknesses Download PDF

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Publication number
TWM634070U
TWM634070U TW111207008U TW111207008U TWM634070U TW M634070 U TWM634070 U TW M634070U TW 111207008 U TW111207008 U TW 111207008U TW 111207008 U TW111207008 U TW 111207008U TW M634070 U TWM634070 U TW M634070U
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Taiwan
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edging
cutter
circuit board
cutting
different thicknesses
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TW111207008U
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Chinese (zh)
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游家亭
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捷惠自動機械股份有限公司
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Priority to TW111207008U priority Critical patent/TWM634070U/en
Publication of TWM634070U publication Critical patent/TWM634070U/en

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Abstract

本創作係有關於一種「適用於不同厚度之電路板裁切磨邊設備」,包括有一裁切裝置與一磨邊裝置。其中該裁切裝置包括有第一刀具與第二刀具,該磨邊裝置包括有磨邊刀具。利用第一刀具配合第二刀具,能就電路板先進行裁切;裁切後的電路板緣邊,再利用具有特殊設計的磨邊刀具進行研磨,即能使電路板緣邊具滑順倒角且無毛邊,藉以提升緣邊品質。本案相較於習知技術,使用同一刀具即能就不同厚度之電路板進行加工,具有免換刀之優點,俾大幅減少換刀時間浪費,提升整體效率、產能與稼動率。 This creation is about a "circuit board cutting and edging equipment suitable for different thicknesses", including a cutting device and an edging device. Wherein the cutting device includes a first cutter and a second cutter, and the edging device includes an edging cutter. Using the first cutter and the second cutter, the circuit board can be cut first; the edge of the circuit board after cutting can be ground with a specially designed edging cutter, which can make the edge of the circuit board smooth. Corners and no burrs to improve edge quality. Compared with the conventional technology, this case can process circuit boards of different thicknesses with the same tool, which has the advantage of eliminating tool change, so as to greatly reduce the waste of tool change time and improve overall efficiency, production capacity and utilization rate.

Description

適用於不同厚度之電路板裁切磨邊設備 Suitable for circuit board cutting and edging equipment with different thicknesses

本創作「適用於不同厚度之電路板裁切磨邊設備」,涉及一種電路板的加工技術,特別是磨邊時能以同一刀具就不同厚度之電路板完成加工之技術者。 This creation "applicable to circuit board cutting and edging equipment of different thicknesses" involves a circuit board processing technology, especially the technology that can complete the processing of circuit boards of different thicknesses with the same tool during edging.

幾乎所有電子產品中都會看見印刷電路板的蹤影;印刷電路板的產製工序相當繁瑣,其中一道工序須就印刷電路板的緣邊進行裁切,且在裁切後需再就緣邊進行研磨,以去除電路板緣邊的粗糙毛邊,藉以提升品質,避免割傷雙手。 Printed circuit boards can be seen in almost all electronic products; the production process of printed circuit boards is quite cumbersome, and one of the processes requires cutting the edges of printed circuit boards, and grinding the edges after cutting , to remove the rough burrs on the edge of the circuit board, so as to improve the quality and avoid cutting hands.

傳統設備,會在單一機臺中設置一組刀具,該組刀具能於相對旋動時,就送入的電路板進行裁切,且利用將刀刃設計成中央凸尖之結構,使裁切同時能夠一併進行磨倒角之工序。傳統工序表面上看似理想,一次即能同時執行裁切與磨邊等兩道作用,實際上該種刀具存在僅能專用於特定厚度電路板的缺點;當同組刀具後續要就不同厚度的電路板進行加工時,便需更換另一組不同規格的刀具;然更換刀具並非易事,需先將原有刀具拆卸、歸位,取出另一組刀具後進行裝配,甚至還需進行精準度調整, 極為不便,頗耗時間。再者,更換刀具的過程勢必導致作業停擺,衍生的問題就是效率無法提升,稼動率低;對於廠商而言,高稼動率極為重要,這代表在當天營運時間中實際開機設備用於生產的時間的比率,其能顯示因刀具更換或設備故障等損失產生相對於設備利用率的影響;習知設備每天因為須處理不同板厚的電路板,衍生須浪費許多時間在更換刀具,對於稼動率來說就造成極大的負面影響。且為了適用多種厚度的電路板加工,廠商須準備多種不同規格的刀具,徒增成本,收納也很佔空間。 In traditional equipment, a set of knives is installed in a single machine, and the set of knives can cut the incoming circuit board when it is rotated relatively. Carry out the process of chamfering at the same time. The traditional process seems to be ideal on the surface, and can perform two functions such as cutting and edging at the same time. In fact, this kind of tool has the disadvantage that it can only be used for circuit boards with a specific thickness; When the circuit board is being processed, another set of tools with different specifications needs to be replaced; however, changing the tools is not an easy task. The original tool needs to be disassembled and returned to its original position, and another set of tools needs to be taken out before assembly. Adjustment, Extremely inconvenient and time consuming. Furthermore, the process of tool replacement will inevitably lead to a stoppage of operations. The resulting problem is that the efficiency cannot be improved and the utilization rate is low. For manufacturers, a high utilization rate is extremely important, which means that the time during which the equipment is actually used for production during the operating hours of the day The ratio, which can show the impact of loss due to tool replacement or equipment failure relative to equipment utilization; conventional equipment has to deal with circuit boards of different thicknesses every day, and a lot of time has to be wasted in changing tools. For the utilization rate Said to have a huge negative impact. In addition, in order to be suitable for the processing of circuit boards of various thicknesses, manufacturers must prepare a variety of cutting tools of different specifications, which increases the cost and takes up a lot of space for storage.

顯見,現有電路板加工,就裁切與磨邊之設備結構來說仍不理想完善,實有改進的必要。 Obviously, the existing circuit board processing is still not ideal and perfect in terms of the equipment structure of cutting and edging, and there is a need for improvement.

創作人有鑑於此,特以研創成本案,期能藉本案之提出,俾改進現有之缺點;期使電路板加工工序中的裁切與磨邊設備之效能得以更臻完善且理想,符合實際需求。 In view of this, the creator specially developed this case, hoping to use this case to improve the existing shortcomings; to make the performance of the cutting and edging equipment in the circuit board processing process more perfect and ideal, in line with reality need.

為改善習知電路板裁切磨邊設備就不同厚度之電路板須更換刀具的缺失,本新型主要目的在於:提供一種「適用於不同厚度之電路板裁切磨邊設備」,該種設備係將電路板的裁切工序與磨邊工序分別依序進行,同時透過特殊設計致使同一刀具即能適合於不同厚度之電路板加工用。藉此,本案能獲致對應於不同厚度之電路板進行加工時,不須更換刀具之優點,有效減少因更換刀具所浪費的時間,以提升效率與稼動率,進而得以創造利潤。 In order to improve the lack of cutting and edging equipment for circuit boards with different thicknesses, the main purpose of this new model is to provide a "cutting and edging equipment suitable for different thicknesses of circuit boards". The cutting process and edge grinding process of the circuit board are carried out in sequence, and at the same time, the same tool is suitable for processing circuit boards of different thicknesses through special design. In this way, this case can obtain the advantage of not needing to change tools when processing circuit boards of different thicknesses, effectively reducing the time wasted by changing tools, improving efficiency and utilization rate, and creating profits.

本新型次要目的在於:提供一種「適用於不同厚度之電路板裁切磨邊設備」,該種設備係將電路板的裁切工序與磨邊工序分別依序進行,同時透過特殊設計致使同一刀具能適合於不同厚度之電路板加工用。藉此,廠商不需準備多種不同規格的刀具,能有效降低設置成本,連帶節省設置空間。 The secondary purpose of this new model is to provide a "circuit board cutting and edging equipment suitable for different thicknesses". The cutting tool is suitable for processing circuit boards of different thicknesses. In this way, the manufacturer does not need to prepare a variety of cutting tools with different specifications, which can effectively reduce the installation cost and save the installation space.

為達成上述目的,本案具體之主要手段為:該「適用於不同厚度之電路板裁切磨邊設備」,主要至少包括有一裁切裝置與一磨邊裝置。 In order to achieve the above purpose, the specific main means in this case are: the "circuit board cutting and edging equipment suitable for different thicknesses" mainly includes at least one cutting device and one edging device.

較佳的其中一種實施例,該磨邊裝置係鄰接於該裁切裝置旁緣。 In one preferred embodiment, the edging device is adjacent to the edge of the cutting device.

較佳的其中一種實施例,該裁切裝置與該磨邊裝置係於一產線中呈相對前、後之連續關係。 In one of the preferred embodiments, the cutting device and the edging device are in a continuous relationship of front and back in a production line.

較佳的其中一種實施例,該裁切裝置,包括有一第一本體,該第一本體之側邊配置有一第一刀具與一第二刀具;該第一本體內部配置有動力機構,藉以使該第一刀具與該第二刀具分別旋轉之功能。 In one of the preferred embodiments, the cutting device includes a first body, a first cutter and a second cutter are disposed on the side of the first body; a power mechanism is disposed inside the first body, so that The function of the first cutter and the second cutter rotating separately.

較佳的其中一種實施例,該第一刀具與該第二刀具係呈一上、一下之對應組置關係為佳。 In one of the preferred embodiments, it is preferable that the first cutter and the second cutter are in a corresponding arrangement relationship of one upper and one lower.

較佳的其中一種實施例,該第一刀具與該第二刀具,皆係呈圓鋸刀片狀結構。 In one preferred embodiment, both the first cutter and the second cutter are in the shape of circular saw blades.

較佳的其中一種實施例,該第一刀具之緣邊設置有一第一刀刃。 In one preferred embodiment, the edge of the first knife is provided with a first cutting edge.

較佳的其中一種實施例,該第二刀具之緣邊設置有一第二刀刃。 In one preferred embodiment, a second cutting edge is provided on the edge of the second knife.

較佳的其中一種實施例,該第一刀具能藉由一 位於第一本體之第一調整元件調變高度。 In one of the preferred embodiments, the first tool can be The height is adjusted by the first adjustment element located on the first body.

較佳的其中一種實施例,該第二刀具能藉由一位於第一本體之第二調整元件調變高度。 In one of the preferred embodiments, the height of the second cutter can be adjusted by a second adjustment element located on the first body.

較佳的其中一種實施例,該磨邊裝置包括有一第二本體,該第二本體中設置有一磨邊刀具。 In one preferred embodiment, the edging device includes a second body, and an edging tool is arranged in the second body.

較佳的其中一種實施例,該磨邊刀具連設有一動力元件,該動力元件能驅使該磨邊刀具進行旋動。 In one of the preferred embodiments, the edge grinding tool is connected with a power element, and the power element can drive the edge grinding tool to rotate.

較佳的其中一種實施例,該動力元件係設於該第二本體上。 In one preferred embodiment, the power element is arranged on the second body.

較佳的其中一種實施例,該磨邊裝置具升降作用,能依據電路板厚度調變高低位置,使磨邊刀具之中心位置能相對於不同厚度電路板的中心位置。 In one preferred embodiment, the edging device has a lifting function, which can adjust the height position according to the thickness of the circuit board, so that the center position of the edging tool can be relative to the center position of the circuit boards with different thicknesses.

較佳的其中一種實施例,該磨邊刀具係採平置狀設置。 In one of the preferred embodiments, the edge grinding tool is arranged in a flat shape.

較佳的其中一種實施例,該磨邊刀具中包括有複數磨邊刀刃。 In one of the preferred embodiments, the edging tool includes a plurality of edging blades.

較佳的其中一種實施例,該磨邊刀刃中,設置有凹部,該凹部之斷面略呈「>」字狀。 In one of the preferred embodiments, a concave portion is provided in the edge grinding blade, and the cross section of the concave portion is slightly “>”-shaped.

1:裁切裝置 1: Cutting device

10:第一本體 10: The first body

11:第一刀具 11: First Knife

111:第一刀刃 111: The first blade

12:第二刀具 12: Second knife

121:第二刀刃 121: Second Blade

13:第一調整元件 13: The first adjustment element

14:第二調整元件 14: Second adjustment element

2:磨邊裝置 2: Edging device

20:第二本體 20: Second body

21:動力元件 21: Power components

22:磨邊刀具 22: Edging tool

221:磨邊刀刃 221: edging blade

222:凹部 222: Concave

9:電路板 9: Circuit board

第一圖:係為本新型之立體外觀圖; The first picture: is the three-dimensional appearance of the new model;

第二圖:係為本新型進行電路板裁切之動作示意圖; The second picture: It is a schematic diagram of the action of cutting the circuit board of the new model;

第三圖:係為本新型進行電路板磨邊之動作示意圖; The third picture: It is a schematic diagram of the action of circuit board edge grinding for this new model;

第四圖:係為本新型之磨邊刀刃進行電路板磨邊之動作示 意圖。 Figure 4: It is a demonstration of the action of circuit board edge grinding for this new type of edge grinding blade intention.

茲謹就本創作「適用於不同厚度之電路板裁切磨邊設備」其結構組成,及所能產生的功效,配合圖式,舉一本案之較佳實施例詳細說明如下。 With regard to the structure and composition of this creation "cutting and edging equipment suitable for circuit boards of different thicknesses", as well as the functions it can produce, with the help of drawings, a preferred embodiment of this case is described in detail as follows.

首請參閱第一圖所示,本案「適用於不同厚度之電路板裁切磨邊設備」,主要至少包括有一裁切裝置1與一磨邊裝置2,該磨邊裝置2係鄰接於該裁切裝置1旁緣,該裁切裝置1與該磨邊裝置2係於一產線中呈相對前、後之連續關係。 First, please refer to the first picture, the case "applicable to circuit board cutting and edging equipment of different thicknesses" mainly includes at least one cutting device 1 and one edging device 2, and the edging device 2 is adjacent to the cutting device. The edge of the cutting device 1, the cutting device 1 and the edging device 2 are in a continuous relationship between the front and rear in a production line.

前述該裁切裝置1,包括有一第一本體10,該第一本體10之側邊配置有一第一刀具11與一第二刀具12;該第一本體10內部配置有動力機構得以使該第一刀具11與該第二刀具12分別旋轉之功能。該第一刀具11與該第二刀具12係呈一上、一下之對應組置關係,且該第一刀具11與該第二刀具12皆係呈圓鋸刀片狀結構;又該第一刀具11之緣邊設置有一第一刀刃111,且該第二刀具12之緣邊設置有一第二刀刃121。該第一刀具11能藉由一位於第一本體10之第一調整元件13調變高度;又該第二刀具12能藉由一位於第一本體10之第二調整元件14調變高度。 The aforementioned cutting device 1 includes a first body 10, and a first cutter 11 and a second cutter 12 are disposed on the side of the first body 10; a power mechanism is configured inside the first body 10 so that the first The function of the cutter 11 and the second cutter 12 rotating separately. The first cutter 11 and the second cutter 12 are in a corresponding arrangement relationship of one up and one down, and both the first cutter 11 and the second cutter 12 are circular saw blade-like structures; and the first cutter 11 The edge of the second knife 12 is provided with a first blade 111 , and the edge of the second knife 12 is provided with a second blade 121 . The height of the first cutter 11 can be adjusted by a first adjusting element 13 located on the first body 10 ; and the height of the second cutter 12 can be adjusted by a second adjusting element 14 located on the first body 10 .

前述該磨邊裝置2包括有一第二本體20,該第二本體20中設置有一磨邊刀具22;該磨邊刀具22連設有一動力元件21,該動力元件21能驅使該磨邊刀具22旋動;又該動力元件21係設於該第二本體20上。該磨邊裝置2具升降 作用,能依據電路板厚度調變高低位置,使磨邊刀具22之中心位置能相對於不同厚度電路板的中心位置。該磨邊刀具22係採平置狀設置,該磨邊刀具22中包括有複數磨邊刀刃221,該磨邊刀刃221中設置有一凹部222,該凹部222之斷面略呈「>」字狀(請配合參考第四圖)。 The aforementioned edging device 2 includes a second body 20, and an edging tool 22 is arranged in the second body 20; the edging tool 22 is connected with a power element 21, and the power element 21 can drive the edging tool 22 to rotate and the power element 21 is set on the second body 20 . The edging device has 2 lifts Function, the height position can be adjusted according to the thickness of the circuit board, so that the center position of the edging tool 22 can be relative to the center position of the circuit boards with different thicknesses. The edging tool 22 is set in a flat shape. The edging tool 22 includes a plurality of edging blades 221. A concave portion 222 is arranged in the edging blade 221. The cross section of the concave portion 222 is slightly in the shape of a ">" (Please refer to the fourth picture).

本案實施時,如第二圖,將一電路板9送入本案之設備,依據電路板9之厚度,藉由第一調整元件13與第二調整元件14分別調整第一刀具11與第二刀具12之高度,以取得第一刀具11與第二刀具12間的最適間距;而後該裁切裝置1將利用其上下配置之第一刀具11與第二刀具12藉原地旋轉方式相對於電路板9緣邊進行裁切;經去除多餘的部份後,再將電路板9送至磨邊裝置2處,如第三圖。令該平置狀的磨邊刀具22旋動,特別是該磨邊刀具22之中心位置須相對於該電路板9的縱向中心位置處;由於該磨邊刀刃221中設置有一凹部222,該凹部222之斷面略呈「>」字狀,因此利用該具有上下相對斜面之「>」字狀凹部222即能就電路板9緣邊進行研磨,特別是能就該緣邊之上、下兩端角產生倒角。由於本案之磨邊刀具22中設有斷面略呈「>」字狀的凹部222,利用其兩相對預設之斜面,因此能適用於處理各種不同厚度之電路板9緣邊研磨,尤其適合於薄板電路板之加工。對比第三圖之電路板9較厚、第四圖之電路板9相對較薄,藉由本案利用單一磨邊刀具22,即能適用於不同厚度之厚板與薄板,免除更換刀具之工序,本案進步性與優點顯而易見。 During the implementation of this case, as shown in the second figure, a circuit board 9 is sent into the equipment of this case, and the first cutter 11 and the second cutter are respectively adjusted by the first adjustment element 13 and the second adjustment element 14 according to the thickness of the circuit board 9 12 to obtain the optimum distance between the first cutter 11 and the second cutter 12; then the cutting device 1 will use its upper and lower first cutter 11 and second cutter 12 to rotate relative to the circuit board 9 edges are cut; After removing the excess part, the circuit board 9 is sent to the edging device 2, as shown in the third figure. Make the flat edge grinding tool 22 rotate, especially the center position of the edge grinding tool 22 must be relative to the longitudinal center position of the circuit board 9; The cross section of 222 is slightly ">" shape, so the edge of circuit board 9 can be ground by using the ">" shape concave portion 222 with relative slopes up and down, especially the upper and lower sides of the edge can be ground. End corners are chamfered. Since the edge grinding tool 22 of this case is provided with a concave portion 222 with a slightly ">"-shaped cross section, using its two relatively preset slopes, it can be suitable for processing the edge grinding of circuit boards 9 of various thicknesses, especially suitable for In the processing of thin circuit boards. Compared with the thicker circuit board 9 in the third figure, and the relatively thinner circuit board 9 in the fourth figure, by using a single edging tool 22 in this case, it can be applied to thick plates and thin plates of different thicknesses, and the process of changing the tool is eliminated. The progress and advantages of this case are obvious.

利用本案之實施,雖將原本的加工工序一分為二,看似作業工序增加,事實上以整體的加工時間來說, 相較於習知者需頻頻更換刀具之停工時間,本案反而效率更好,稼動率與產能皆能大為提高;再加上本案不用配置多種不同規格的刀具,反而節省許多購置成本與空間;更且,本案同一機臺能就薄到極薄、厚到極厚之電路板進行加工,其差異可函蓋至少兩倍以上的厚度寬幅,大為提升處理能力。綜上所述,本案「適用於不同厚度之電路板裁切磨邊設備」,其技術內容完全符合新型專利之取得要件。本案在產業上確實得以利用,於申請前未曾見於刊物或公開使用,且非為公眾所知悉之技術。再者,本案有效解決先前技術中長期存在的問題並達成相關使用者與消費者長期的需求,得佐證本新型並非能輕易完成。本案富具專利法規定之「產業利用性」、「新穎性」與「進步性」等要件,爰依法提請專利,懇請 鈞局詳查,並儘早為准予專利之審定,以保護申請人之智慧財產權,俾勵創新。 With the implementation of this case, although the original processing process is divided into two, it seems that the operating process increases, but in fact, in terms of the overall processing time, Compared with conventional workers who need to frequently change the downtime of cutting tools, this case is more efficient, and the utilization rate and production capacity can be greatly improved; in addition, this case does not need to be equipped with a variety of different specifications of cutting tools, but saves a lot of purchase costs and space; What's more, the same machine in this case can process circuit boards from thin to extremely thin and thick to extremely thick, and the difference can cover at least twice the thickness and width, which greatly improves the processing capacity. To sum up, the technical content of this case "applicable to circuit board cutting and edging equipment of different thicknesses" fully meets the requirements for obtaining a new type patent. This case has indeed been used in the industry, and it has not been published or publicly used before the application, and it is not a technology known to the public. Furthermore, this case effectively solves the long-standing problems in the prior art and meets the long-term needs of relevant users and consumers, which proves that this new model cannot be easily completed. This case is full of the elements of "industrial utilization", "novelty" and "progressiveness" stipulated in the Patent Law. I would like to apply for a patent according to the law. I sincerely request the Bureau to conduct a detailed investigation and approve the approval of the patent as soon as possible to protect the applicant's wisdom. Property rights to encourage innovation.

本新型雖藉由前述實施例來描述,但仍可變化其形態與細節,於不脫離本新型之精神而達成,並由熟悉此項技藝之人士可了解。前述本案之較佳實施例,僅係藉本案原理可以具體實施的方式之一,但並不以此為限制,應依後附之申請專利範圍所界定為準。 Although the present invention is described by means of the foregoing embodiments, its shape and details can still be changed without departing from the spirit of the present invention, and can be understood by those familiar with the art. The above-mentioned preferred embodiment of this case is only one of the modes that can be implemented by the principle of this case, but it is not limited by this, and it should be defined by the scope of the appended patent application.

1:裁切裝置 1: Cutting device

10:第一本體 10: The first body

11:第一刀具 11: First Knife

111:第一刀刃 111: The first blade

12:第二刀具 12: Second knife

121:第二刀刃 121: Second Blade

13:第一調整元件 13: The first adjustment element

14:第二調整元件 14: Second adjustment element

2:磨邊裝置 2: Edging device

20:第二本體 20: Second body

21:動力元件 21: Power components

22:磨邊刀具 22: Edging tool

221:磨邊刀刃 221: edging blade

222:凹部 222: Concave

Claims (10)

一種適用於不同厚度之電路板裁切磨邊設備,包括: A circuit board cutting and edging equipment suitable for different thicknesses, including: 一裁切裝置,包括有一第一本體,該第一本體之側邊配置有一第一刀具與一第二刀具; A cutting device, including a first body, the side of the first body is equipped with a first cutter and a second cutter; 一磨邊裝置,該磨邊裝置係鄰接於該裁切裝置旁緣;該磨邊裝置包括有一第二本體,該第二本體中設置有一磨邊刀具;該磨邊刀具包括有複數磨邊刀刃,該磨邊刀刃中設置有一凹部。 An edging device, the edging device is adjacent to the edge of the cutting device; the edging device includes a second body, and an edging tool is arranged in the second body; the edging tool includes a plurality of edging blades , a concave portion is arranged in the edging blade. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該裁切裝置與該磨邊裝置係於一產線中呈相對前、後之連續關係。 As stated in Claim 1, it is suitable for circuit board cutting and edging equipment with different thicknesses, wherein the cutting device and the edging device are in a continuous relationship between the front and rear in a production line. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該第一本體內部配置有一動力機構,得以使該第一刀具與該第二刀具分別旋轉之功能。 According to claim 1, it is suitable for circuit board cutting and edging equipment with different thicknesses, wherein a power mechanism is arranged inside the first body to enable the function of rotating the first cutter and the second cutter separately. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該第一刀具與該第二刀具係呈一上、一下之對應組置關係,且該第一刀具與該第二刀具皆係呈圓鋸刀片狀結構。 As described in claim 1, it is suitable for cutting and edging equipment of circuit boards with different thicknesses, wherein the first cutter and the second cutter are in a corresponding arrangement relationship of one upper and one lower, and the first cutter and the second The knives are all in the shape of circular saw blades. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該第一刀具之緣邊設置有一第一刀刃,且該第二刀具之緣邊設置有一第二刀刃。 According to claim 1, the circuit board cutting and edging equipment with different thicknesses is applicable, wherein the edge of the first knife is provided with a first blade, and the edge of the second knife is provided with a second blade. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該第一刀具能藉由一位於該第一本體之一第一調整元件調變高度;且該第二刀具能藉由一位於該第一本體之一第二調整元件調變高度。 As described in claim 1, it is suitable for circuit board cutting and edging equipment with different thicknesses, wherein the first cutter can be adjusted in height by a first adjustment element located on the first body; and the second cutter can be adjusted by The height is adjusted by a second adjusting element located on the first body. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該磨邊刀具連設有一動力元件,該動力元件能驅使該磨邊刀具旋動,該動力元件係設於該第二本體上。 As described in claim 1, it is suitable for cutting and edging equipment of circuit boards with different thicknesses, wherein the edging tool is connected with a power element, which can drive the edging tool to rotate, and the power element is arranged on the second Two ontology. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該磨邊裝置具升降作用。 As stated in Claim 1, it is suitable for circuit board cutting and edging equipment with different thicknesses, wherein the edging device has a lifting function. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其中該磨邊刀具係採平置狀設置。 As described in Claim 1, it is suitable for cutting and edging equipment of circuit boards with different thicknesses, wherein the edging tool is arranged in a flat shape. 如請求項1所述適用於不同厚度之電路板裁切磨邊設備,其 中該凹部之斷面略呈「>」字狀。 As described in claim 1, it is suitable for circuit board cutting and edging equipment with different thicknesses, which The cross-section of the concave part in the middle is slightly ">"-shaped.
TW111207008U 2022-07-01 2022-07-01 Circuit board cutting and edging equipment for different thicknesses TWM634070U (en)

Priority Applications (1)

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TW111207008U TWM634070U (en) 2022-07-01 2022-07-01 Circuit board cutting and edging equipment for different thicknesses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111207008U TWM634070U (en) 2022-07-01 2022-07-01 Circuit board cutting and edging equipment for different thicknesses

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TWM634070U true TWM634070U (en) 2022-11-11

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