CN111958673A

CN111958673A - Board splitting method and device for circuit board

Info

Publication number: CN111958673A
Application number: CN201910416268.6A
Authority: CN
Inventors: 黄振澄
Original assignee: Quanheng Technology Co ltd
Current assignee: Quanheng Technology Co ltd
Priority date: 2019-05-20
Filing date: 2019-05-20
Publication date: 2020-11-20

Abstract

The board dividing method and the board dividing equipment for the circuit board can divide the board and cut edges of the multi-connected circuit board in an automatic mode. Especially when the multi-connected circuit board is in a field shape, the multi-connected circuit board can be divided into two parts and then turned and conveyed one by one so as to be conveniently divided; finally, the required single circuit board can be obtained by cutting edges twice. The invention effectively solves the problem of poor board splitting efficiency of the prior multi-connected circuit board and has advancement.

Description

Board splitting method and device for circuit board

Technical Field

The invention discloses a board dividing method and equipment for a circuit board, relates to an automation technology of a circuit board process, and particularly relates to the technical field of board dividing and edge cutting of a multi-connected circuit board in an automation mode.

Background

In one of the existing circuit board processes, a plurality of relatively small sub-circuit boards are designed on a mother circuit board, and the required sub-circuit boards can be obtained only by performing a plurality of processes such as board splitting, edge cutting and the like on the sub-circuit boards in the subsequent process of the multi-connected circuit board. When the existing industry carries out the process, multiple machines and tools are manually matched to carry out treatment one by one, the process is quite complicated, the efficiency is poor, the labor cost is high, and the reject ratio cannot be reduced all the time. Even if part of equipment can be carried out in a semi-automatic mode, if the multi-connected circuit board is in a shape like a Chinese character tian and derivative thereof, the multi-connected circuit board cannot be processed.

The inventor of the present invention has developed the present invention based on the accumulated experience of several decades in the industry, and aims to improve the existing disadvantages and improve the board dividing technology of the circuit board.

Disclosure of Invention

The board splitting technology based on the existing circuit board still depends on the defects of manpower, substation processing, poor efficiency and the like, and the invention mainly aims to: the invention provides a board dividing technology of a multi-connected circuit board, which can divide and cut edges of the multi-connected circuit board in an automatic mode, and particularly when the multi-connected circuit board is in a Chinese character Tian shape (2X2) and derivatives thereof (2X6 and 2X8), the multi-connected circuit board can still be subjected to turning and feeding one by one after the first board division by the method originally invented by the invention so as to be cut into single circuit boards, and finally, the edge cutting process is carried out twice to obtain the required single circuit board. Therefore, the invention can carry out and complete the board dividing cutting and edge cutting process of the multi-connected circuit board in a full-automatic mode, thereby achieving the purposes of improving the processing speed, reducing the personnel cost, improving the yield and the like.

To achieve the above object, a specific method of one preferred embodiment of the present invention comprises the following steps: feeding a circuit board, detecting the position of the circuit board, adjusting the position of the circuit board, cutting the circuit board in a splitting way, conveying and turning one by one, detecting the position of a secondary circuit board, adjusting the position of the circuit board in a secondary way, cutting the excess materials on two sides, turning the circuit board, cutting the excess materials on the other two sides and discharging. The method is suitable for the separated boards of the field-shaped multi-connected circuit board and the derivative multi-connected circuit board thereof, the single multi-connected circuit board is any combination of 2X2, 2X3, 2X4 or 2Xn, and n is any number.

The method of another preferred embodiment of the present invention only comprises the following steps: feeding a circuit board, detecting the position of the circuit board, adjusting the position of the circuit board, cutting the circuit board in a splitting way, cutting excess materials on two sides, turning the circuit board, cutting excess materials on the other two sides and discharging. The method is suitable for the split board of a Japanese-shaped multi-connected circuit board and a derivative multi-connected circuit board thereof, namely the multi-connected circuit board is any combination of 1X2, 1X3, 1X4 or 1Xn, and n is any number.

The invention provides a better board dividing device, which comprises the following components in series in sequence: a first plate dividing device, a turning and conveying device, a second plate dividing device, a first edge cutting device, a shifting and turning device and a first edge cutting device. The equipment is suitable for the branch boards of the field-shaped multi-connection circuit board and the derivative multi-connection circuit boards thereof, namely the multi-connection circuit boards are 2X2, 2X3 and 2X4 ….

In a preferred embodiment, the whole device is in an L shape by taking the steering conveying device as a rotation angle reference.

In a preferred embodiment, the first board dividing apparatus includes a front conveying unit, which is disposed horizontally and used for feeding and conveying the circuit board; a board dividing and cutting unit and a reading unit are suspended at the top of the rear end of the front conveying unit, the board dividing and cutting unit has a cutting function, and the reading unit can read relative to a target position of the circuit board in an X-RAY (X-RAY) mode and the like so as to know the position of the reading unit; and a displacement unit is arranged in the center of the rear end of the reading unit and can bear a circuit board for displacement, and a rear conveying unit is arranged on two sides of the displacement unit.

In a preferred embodiment, the steering conveyor comprises a feeding end and a discharging end which are adjacently arranged, the feeding end is connected to the tail end of the first board dividing device, and the steering conveyor can longitudinally feed the circuit board from the feeding end and then transversely feed the circuit board from the discharging end; this structure is prior art and will not be described in detail.

In a preferred embodiment, the second plate dividing device has the same structure as the first plate dividing device; the front conveying unit is in a flat shape and can be used for feeding and conveying a circuit board, and the front end of the front conveying unit is connected to the discharging end of the steering conveying device; a board dividing and cutting unit and a reading unit are suspended at the top of the rear end of the front conveying unit, the board dividing and cutting unit has a cutting function, and the reading unit can read relative to a target position of the circuit board in an X-RAY mode so as to know the position of the reading unit; and a displacement unit is arranged at the center of the rear end of the reading unit and can bear and move a circuit board, and a rear conveying unit is arranged beside the displacement unit.

In a preferred embodiment, the first trimming device is connected to the end of the second plate dividing device; the center of the first trimming device is provided with a first bearing platform, and proper positions at two sides of the first bearing platform are correspondingly provided with a first cutting knife unit.

In a preferred embodiment, the second edge cutting device is connected to the end of the first edge cutting device; the center of the second trimming device is provided with a second bearing platform, and the proper positions of the two sides of the second bearing platform are correspondingly provided with a second cutting knife unit.

In a preferred embodiment, a transfer and turning device is suspended in the center of the first edge cutting device and the second edge cutting device, and the transfer and turning device can pick up, move or rotate a circuit board between the first edge cutting device and the second edge cutting device in a vacuum suction manner.

Another preferred embodiment of the present invention only includes the following components connected in series: a second plate dividing device, a first edge cutting device and a first edge cutting device (i.e. not including the first plate dividing device and the turning conveying device). The device of the embodiment can be suitable for branch boards of a Chinese character 'ri' and derivative multi-connection circuit boards thereof, namely the multi-connection circuit boards are 1X2, 1X3 and 1X4 ….

In one preferred embodiment of the present invention, the trimming process can be eliminated as needed.

Drawings

FIG. 1 is a block diagram of a method of the present invention;

FIG. 2 is a schematic view of the overall apparatus of the present invention;

FIG. 3 is a schematic diagram of a first time splitting of the circuit board feeding according to the present invention;

FIG. 4 is another schematic view of the circuit board feeding of the present invention for the first time splitting;

FIG. 5 is another schematic view of the circuit board feeding of the present invention for the first time splitting;

FIG. 6 is a schematic diagram of the circuit boards of the present invention being conveyed one by one after the first board splitting and then being split for the second time;

FIG. 7 is a schematic diagram of the circuit board of the present invention performing two trimming operations;

FIG. 8 is another schematic diagram of the circuit board of the present invention performing two trimming operations.

Description of the reference numerals

10 Circuit Board feeding

11 plate position detection

12 adjusting the position of the circuit board

13 divide board to cut

14 turn to one by one conveying

15 Secondary plate position detection

16 secondary circuit board position adjustment

17 Secondary board cutting

Cutting excess material on 18 two sides

19 circuit board steering

20 cutting the excess materials on the other two sides

21 discharge of

3 first plate dividing device

31 front conveying unit

32 read unit

33 divide board cutting unit

34 displacement unit

35 rear conveying unit

4 turn to conveyor

41 feeding end

42 discharge end

5 second plate dividing device

51 front conveying unit

52 reading unit

53 divide board cutting unit

54 displacement unit

55 rear conveying unit

6 first trimming device

61 first bearing table

62 first cutter unit

7 move and carry steering gear

8 second edge cutting device

81 second bearing table

82 second cutter unit

9 Circuit Board

90 target site

91 sub-circuit board

92 sub-circuit board

93 sub-circuit board

94 daughter circuit boards.

Detailed Description

The technical solution in the embodiments of the present invention is clearly and completely described below with reference to the drawings in the embodiments of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

Referring to fig. 1, one of the board dividing methods of the circuit board of the present invention is applicable to the dividing of the field-shaped multi-connected circuit board and the derived multi-connected circuit boards, that is, the multi-connected circuit boards are 2X2, 2X3, and 2X4 …; the method comprises the following steps:

the method comprises the following steps: feeding a circuit board 10, namely feeding a multi-link circuit board;

step two: the board position detection 11 can utilize X-RAY to read and align the target position because each circuit board is preset with the target position; in addition, the position of the circuit board can also be obtained by adopting a CCD board edge positioning or linear scanning (Line Scan) mode;

step three: adjusting the position 12 of the circuit board, and correcting the position of the circuit board to be proper by using the result of the board position detection 11;

step four: performing board splitting and cutting 13, namely performing transverse cutting on the longitudinally fed multi-connected circuit boards one by one;

step five: the circuit boards which are left in one-way connection are conveyed and turned to 14 one by one, and the circuit boards are conveyed from the longitudinal direction to the transverse direction;

step six: secondary plate position detection 15, and reading and aligning the target position by using the X-RAY again; or the position of the circuit board is obtained by adopting a CCD board edge positioning or linear scanning (Line Scan) mode;

step seven: secondarily adjusting the position 16 of the circuit board, and correcting the position of the circuit board to be proper by using the result of the secondary board position detection 15;

step eight: secondary board cutting 17, transversely cutting the longitudinally fed multiple circuit boards one by one, and forming the circuit boards into a single circuit board in the step;

step nine: cutting excess materials on two sides 18, and cutting excess edge materials on two opposite sides of each circuit board by using two cutters;

step ten: the circuit board turns 19, making a ninety degree rotation of the circuit board;

step eleven: cutting excess materials on the other two sides by 20, and cutting the excess edge materials on the other two opposite sides of each circuit board by using another two cutters; at this moment, the four sides of the circuit board are all subjected to excess material cutting;

step twelve: and (6) discharging 21.

If the circuit board is a japanese-character-shaped circuit board and its derivative multi-connection circuit boards, i.e. the multi-connection circuit boards are 1X2, 1X3, 1X4 …, the specific method of another preferred embodiment of the present invention only includes the following steps: feeding a circuit board 10, detecting a board position 11, adjusting the position of the circuit board 12, dividing and cutting the circuit board 13, cutting excess materials on two sides 18, turning the circuit board 19, cutting excess materials on the other two sides 20 and discharging 21.

Referring to fig. 2 and fig. 3, a preferred board dividing apparatus of the present invention includes: a first plate dividing device 3, a turning and conveying device 4, a second plate dividing device 5, a first edge cutting device 6, a transfer and turning device 7 and a first edge cutting device 8. The equipment is suitable for the field-shaped and derivative multi-connected circuit boards, namely the multi-connected circuit boards are 2X2, 2X4 and 2X6 …, the steering conveying device 4 is taken as a corner reference, and the whole equipment is in an L shape.

The first board dividing device 3 comprises a front conveying unit 31, wherein the front conveying unit 31 is in a flat shape and can be used for feeding and conveying the circuit board 9; a board dividing and cutting unit 33 and a reading unit 32 are suspended at the top of the rear end of the front conveying unit 31, the board dividing and cutting unit 33 has a cutting function, and the reading unit 32 can read each target position 90 of the circuit board 9 by using an X-RAY mode so as to know the position of the target position; the reading unit 32 is provided with a displacement unit 34 at the center of the rear end thereof, which can carry a circuit board 9 for moving, and a rear conveying unit 35 is provided at both sides of the displacement unit 34.

The steering conveying device 4 comprises a feeding end 41 and a discharging end 42 which are adjacently arranged, the feeding end 41 is adjacent to the tail end of the first board dividing device 3, and the steering conveying device 4 can longitudinally feed the circuit board 9 from the feeding end 41 and then transversely feed the circuit board from the discharging end 42; this structure is prior art and will not be described in detail.

The second plate dividing device 5 has the same structure as the first plate dividing device 3; comprises a front conveying unit 51, the front conveying unit 51 is in a flat shape and can be used for feeding and conveying the circuit board 9, and the front end of the front conveying unit 51 is adjacent to the discharging end 42 of the steering conveying device 4; a board dividing and cutting unit 53 and a reading unit 52 are suspended at the top of the rear end of the front conveying unit 51, the board dividing and cutting unit 53 has a cutting function, and the reading unit 52 can read relative to a target position 90 of the circuit board 9 by using an X-RAY mode so as to know the position of the reading unit; the reading unit 52 is provided with a displacement unit 54 at the center of the rear end thereof, which can carry and move a circuit board 9, and a rear conveying unit 55 is provided at each side of the displacement unit 54.

The first trimming device 6 is connected to the tail end of the second plate dividing device 5; the center of the first trimming device 6 is provided with a first carrying platform 61, and the proper positions of the two sides of the first carrying platform 61 are correspondingly provided with a first cutting unit 62.

The second edge cutting device 8 is connected to the end of the first edge cutting device 6; a second carrying platform 81 is disposed at the center of the second trimming device 8, and a second cutting unit 82 is disposed at the appropriate position of the two sides of the second carrying platform 81.

A transfer and turning device 7 is suspended in the center of the first edge cutting device 6 and the second edge cutting device 8, and the transfer and turning device 7 can move and rotate a circuit board 9 at least between the first edge cutting device 6 and the second edge cutting device 8 in a vacuum suction manner.

As shown in FIG. 3, in the practice of the present invention, a circuit board 9 is taken and fed into the first board dividing apparatus 3. If the circuit board 9 is a multi-gang field-shaped structure, it includes a plurality of

sub-circuit boards

91, 92, 93, 94. The reading unit 32 of the first board dividing device 3 reads each target position 90 of the circuit board 9 in an X-RAY manner to know the position, and the displacement unit 34 adjusts the rotation to make the board dividing and cutting unit 33 operate to cut (referring to fig. 4 and 5 again), the circuit board 9 will form two sub-circuit boards 91 and 92 as a whole, and the other two sub-circuit boards 93 and 94 as a whole; then, the divided circuit boards 9 (fig. 6) are respectively conveyed one by the steering conveying device 4, are longitudinally conveyed from the feeding end 41 and then are transversely conveyed from the discharging end 42, and then enter the second board dividing device 5, and the reading unit 52 of the second board dividing device 5 reads each target position 90 of the circuit board 9 in an X-RAY mode so as to know the position of the circuit board, and is adjusted to be positive by the displacement unit 54, so that the board dividing and cutting unit 53 acts for cutting, and the two sub-circuit boards 91 and 92 can be also divided; then, the sub circuit board 91 is sent to the first trimming device 6 by the transfer and turning device 7, and the first cutting units 62 on both sides of the sub circuit board are used to cut off the excess material on both sides of the sub circuit board in cooperation with the first carrying stage 61 (fig. 7 and 8); then, the transfer and turning device 7 is used to transfer the sub circuit boards 91 to the second edge cutting device 8 in cooperation with the transfer and turning device 7, and the second cutting units 82 on two sides of the sub circuit boards are used to cut off the excess materials on the other two sides, so as to complete the board dividing and edge cutting process.

The apparatus of the present invention does not need to be L-shaped, and if the apparatus is to be linear, the steering conveyor 4 is simply changed to a structure capable of steering the circuit board 9 by ninety degrees.

In the present invention, the cutting modes of the board dividing and cutting unit 33, the board dividing and cutting unit 53, the first edge cutting device 6, the first cutter unit 62, the second edge cutting device 8, and the second cutter unit 82 at the time of implementation at least include a shearing cutter, a wheel cutter, a laser cutting, an ultrasonic cutting, and the like, and are not limited thereto.

In summary, the board dividing method and apparatus of the circuit board of the present invention can achieve the board dividing and edge cutting effects for the circuit board in an automatic manner, thereby increasing the processing speed, reducing the labor cost and increasing the yield.

It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Claims

1. A board splitting method of a circuit board is characterized by comprising the following steps:

the method comprises the following steps: feeding a circuit board, namely feeding a multi-link circuit board;

step two: detecting the position of the circuit board to obtain the position of the circuit board;

step three: adjusting the position of the circuit board;

step four: cutting the multi-connected circuit board in a board-by-board mode, and transversely cutting the multi-connected circuit board;

step five: conveying and turning one by one, and turning and sending out the remaining circuit boards which are connected in one direction;

step six: secondary board position detection is carried out, and the position of the circuit board is obtained again;

step seven: adjusting the position of the circuit board for the second time;

step eight: and secondary board cutting is carried out, and the multi-connected circuit board is transversely cut one by one.

2. The method for dividing a circuit board according to claim 1, wherein the single multi-gang circuit board comprises a plurality of sub-circuit boards in a form of a Chinese character 'tian' and derivatives thereof, at least comprising any one of 2X2, 2X3, 2X4 or 2Xn, where n is any number.

3. The board splitting method for the circuit board according to claim 1, further comprising after the step eight:

step nine: cutting excess materials on two side edges, and cutting the excess materials on the two opposite side edges of each circuit board by using two cutters;

step ten: turning the circuit board to rotate the circuit board by ninety degrees;

step eleven: and cutting excess materials on the other two sides, and cutting the excess materials on the other two opposite sides of the circuit board by using another two cutters.

4. A board splitting method of a circuit board is characterized by comprising the following steps:

step three: adjusting the position of the circuit board;

step five: cutting excess materials on two side edges, and cutting the excess materials on the two opposite side edges of each circuit board by using two cutters;

step six: turning the circuit board to rotate the circuit board by ninety degrees;

step seven: cutting excess materials on the other two sides, and cutting the excess materials on the other two opposite sides of the circuit board by using another two cutters;

step eight: and (6) discharging.

5. The board separation method of the circuit board according to claim 4, wherein the single multi-gang circuit board comprises a plurality of sub-circuit boards in a form of a Chinese character Tian and derivatives thereof, at least comprising any one combination of 2X2, 2X3, 2X4 or 2Xn, where n is any number.

6. The board separation method of the circuit board according to claim 1 or 4, wherein the board position detection of the second step at least comprises obtaining the board position by any one of X-RAY reading the target position of the circuit board, CCD board edge positioning or linear scanning.

7. A board separation apparatus of a circuit board, comprising:

the first board dividing device comprises a front conveying unit, a board dividing and cutting unit and a reading unit are suspended at the top of the rear end of the front conveying unit, the board dividing and cutting unit has a cutting function, and the reading unit can read the position of the circuit board so as to know the position of the circuit board; a displacement unit is arranged at the rear end of the reading unit, and a rear conveying unit is arranged at two sides of the displacement unit;

the steering conveying device comprises a feeding end and a discharging end, the feeding end is adjacent to the tail end of the first board dividing device, and the steering conveying device can be used for steering the circuit board to be sent out;

the second board dividing device is connected with the discharge end of the steering conveying device and comprises a front conveying unit, a board dividing and cutting unit and a reading unit are suspended at the top of the rear end of the front conveying unit, the board dividing and cutting unit has a cutting function, and the reading unit can read the position of the circuit board so as to know the position of the circuit board; a displacement unit is arranged at the rear end of the reading unit, and a rear conveying unit is arranged at two sides of the displacement unit;

the multi-connected circuit board cut by the first board dividing device and the second board dividing device can be cut and separated into single circuit boards.

8. The board dividing apparatus for circuit board according to claim 7, wherein the second board dividing device further comprises, at the rear end:

the first edge cutting device is provided with a first bearing table in the center, and proper positions at two sides of the first bearing table are correspondingly provided with a first cutter unit;

the second edge cutting device is connected to the tail end of the first edge cutting device; a second bearing table is arranged in the center of the second edge cutting device, and a second cutter unit is correspondingly arranged at the proper position of the two sides of the second bearing table;

the center of the first edge cutting device and the center of the second edge cutting device are provided with a transfer steering device in a suspending way, and the transfer steering device can move and rotate the circuit board at least between the first edge cutting device and the second edge cutting device.

9. The board dividing apparatus for circuit boards according to claim 7, wherein the first board dividing device, the turn conveyor and the second board dividing device are in an L-shaped relationship.

10. The board separation apparatus for circuit boards according to claim 8, wherein the transfer and turning device moves the circuit board by vacuum suction.