CN116454577A - Processing technology of circulator center conductor and circulator center conductor - Google Patents
Processing technology of circulator center conductor and circulator center conductor Download PDFInfo
- Publication number
- CN116454577A CN116454577A CN202310371215.3A CN202310371215A CN116454577A CN 116454577 A CN116454577 A CN 116454577A CN 202310371215 A CN202310371215 A CN 202310371215A CN 116454577 A CN116454577 A CN 116454577A
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- conductor
- imposition
- layers
- ferrite
- circulator
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- 239000004020 conductor Substances 0.000 title claims abstract description 267
- 238000005516 engineering process Methods 0.000 title claims abstract description 22
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 50
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 26
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 115
- 238000003475 lamination Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
The invention discloses a processing technology of a center conductor of an circulator, which relates to the field of circulator manufacturing and comprises the following steps: s1, stacking three conductor layers and three insulating layers alternately in turn to form a first stacked body, wherein any two conductor layers in the three conductor layers have included angles; pressing the first stack of stacked bodies to integrate the three conductor layers and the three insulating layers; s2, fixedly connecting the outermost conductor layer on the first pile of stacked bodies to ferrite. The invention discloses a circulator center conductor which comprises ferrite, three conductor layers and three insulating layers, wherein the three conductor layers and the three insulating layers are alternately and sequentially fixedly connected with each other to form a first stacked body, and the outermost conductor layer on the first stacked body is fixedly connected with the ferrite. The invention also discloses a circulator center conductor comprising ferrite, three conductor layers and three insulating layers. The processing technology is simple, and is beneficial to improving the processing efficiency; the ferrite can be prevented from being broken, and the product quality is ensured.
Description
Technical Field
The invention relates to the technical field of circulator manufacturing, in particular to a circulator center conductor processing technology and a circulator center conductor.
Background
The circulator is a multiport device which transmits incident waves entering any port of the circulator into the next port according to the direction determined by a static bias magnetic field, wherein the centralized circulator mainly comprises a central conductor and ferrite, the central conductor comprises three conductor layers and three insulating layers, the conductor layers and the insulating layers are alternately arranged, and two ends of each conductor layer extend out of the insulating layers to form pins.
The processing technology of the traditional circulator center conductor is as follows: firstly, placing ferrite on a main body part in the middle of a conductor layer and enabling the ferrite to be completely overlapped with the main body part, wherein the main body part of the conductor layer is outwards extended to form three pins, a first pin is wrapped on one side face of the ferrite along the side edge of the ferrite and folded to the upper surface of the ferrite, a polyimide substrate film (insulating layer) is adhered on the folded part of the first pin, and the polyimide substrate film is required to be overlapped with the ferrite; the second pin and the third pin are used for wrapping ferrite and pasting a polyimide substrate film corresponding to the ferrite in the same way, so that folded parts of the three pins are piled above the ferrite, and an insulating layer is arranged between any two of the folded parts of the three pins; and finally, completely melting the adhesive layer of the three polyimide substrate films by using a hot melting machine to completely fix the adhesive layer and the three conductor layers. This method has the following drawbacks: (1) Three conductor layers and three polyimide substrate films (insulating layers) are required to be assembled one by one, the steps are complicated, and the working time is long; (2) When the thermal melting machine is used for heating, in order to enable the three polyimide substrate films (insulating layers) to be completely adhered, downward pressure needs to be applied to the polyimide substrate film (insulating layer) on the uppermost layer, ferrite is prone to being broken, and the product performance has risk hidden trouble.
Disclosure of Invention
The invention aims to provide a processing technology of a center conductor of an circulator and the center conductor of the circulator, so as to solve the problems in the prior art, and the processing technology is simple and is beneficial to improving the processing efficiency; the ferrite can be prevented from being broken, and the product quality is ensured.
In order to achieve the above object, the present invention provides the following solutions:
the invention provides a processing technology of a circulator center conductor, which comprises the following steps:
s1, stacking three conductor layers and three insulating layers alternately in turn to form a first stacked body, wherein any two conductor layers in the three conductor layers have included angles; pressing the first stack of stacked bodies and integrating the three conductor layers and the three insulating layers;
s2, fixedly connecting the outermost conductor layer on the first stack of stacked bodies to ferrite.
Preferably, the method for obtaining the stacked body includes: obtaining at least one first imposition conductor, wherein a plurality of first conductor layers are regularly arranged on each first imposition conductor, obtaining at least one second imposition conductor, a plurality of second conductor layers are regularly arranged on each second imposition conductor, obtaining at least one third imposition conductor, a plurality of third conductor layers are regularly arranged on each third imposition conductor, obtaining a plurality of imposition insulating films, a plurality of insulating layers are regularly arranged on each imposition insulating film, one first imposition conductor, one second imposition conductor, one third imposition conductor and three imposition insulating films are folded to form a second imposition conductor, one imposition conductor and the third imposition conductor in the second imposition conductor are folded in a second imposition, one imposition insulating film is arranged between each third imposition conductor and the second imposition conductor, one imposition insulating film is arranged between each second imposition conductor and the third imposition conductor, and each third imposition conductor is folded in a second imposition conductor, and the second imposition conductor is folded in a second imposition conductor, and the third imposition conductor is formed between each imposition conductor and the third imposition conductor.
Preferably, the method for laminating the three conductor layers and the three insulating layers into a whole comprises the following steps: and pressing the second stacking body to integrate the first conductor layers on the first full-page conductor, the second conductor layers on the second full-page conductor, the third conductor layers on the third full-page conductor and the insulating layers on the three full-page insulating films.
Preferably, two ends of each conductor layer extend out of the insulating layer adjacent to the conductor layer to form exposed ends, the two exposed ends of each conductor layer are bent towards the direction pointing to the plane where the ferrite is located to form first bending parts, and the tail ends of the first bending parts are flush with the surface of the ferrite away from the first stack body.
Preferably, each first bending portion of each exposed end is bent towards a first direction to form a second bending portion, the first direction and the surface of the ferrite, which is far away from the first stacking body, are parallel to each other, the first direction points to one end, which is far away from the first stacking body, and the surface of the second bending portion, which is far away from the first stacking body, is flush with the surface, which is far away from the first stacking body, of the ferrite.
Preferably, the laminating machine is used for laminating the first stack of stacked bodies, the stamping process is used for bending the exposed ends towards the direction pointing to the plane where the ferrite is located, and the stamping process is used for bending the first bending parts of the exposed ends towards the first direction.
Preferably, the method for obtaining the first whole-version conductor comprises the following steps: obtaining a conductor substrate, and etching a plurality of first conductor layers on the conductor substrate;
the method for obtaining the second full-page conductor comprises the following steps: obtaining a conductor substrate, and etching a plurality of second conductor layers on the conductor substrate;
the method for obtaining the third full-page conductor comprises the following steps: and obtaining a conductor substrate, and etching a plurality of third conductor layers on the conductor substrate.
Preferably, the insulating layer is a polyimide substrate film.
The invention provides a circulator center conductor, which is manufactured by adopting the circulator center conductor processing technology.
Compared with the prior art, the invention has the following technical effects:
according to the processing technology of the central conductor of the circulator and the central conductor of the circulator, three conductor layers and three insulating layers are alternately stacked in turn to form a stacked body, and the stacked body is pressed to integrate each conductor layer with the adjacent insulating layer; the invention adopts lamination technology to simultaneously press three conductor layers and three insulating layers, and each conductor layer and each insulating layer are not required to be assembled for multiple times, so that the processing technology is simple, and the processing efficiency is improved; meanwhile, the processing technology of the center conductor of the circulator and the center conductor of the circulator provided by the invention are characterized in that three conductor layers and three insulating layers are pressed into a whole, and then the whole is arranged on the ferrite, so that the attachment of the insulating layers and the conductor layers on the ferrite can be avoided compared with the assembly of the whole on the ferrite layer by layer, the breakage of the ferrite is avoided, and the product quality is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the structure of the center conductor of the circulator provided in example 1 (without ferrite);
FIG. 2 is a schematic structural view of a center conductor of the circulator provided in embodiment 1;
FIG. 3 is an exploded view of the center conductor of the circulator provided in example 1;
FIG. 4 is a schematic circuit diagram of the center conductor of the circulator provided in example 1;
FIG. 5 is a schematic view of the structure of the first full-thickness conductor provided in example 1;
FIG. 6 is a schematic structural diagram of a second full-thickness conductor provided in example 1;
FIG. 7 is a schematic structural view of a third full-thickness conductor provided in example 1;
fig. 8 is a schematic structural diagram of a full-page press-fit of a center conductor of a circulator provided in embodiment 1;
in the figure: 1. a conductor layer; 2. an insulating layer; 3. a ferrite; 4. a bare end; 5. a first bending part; 6. a second bending part; 7. an adhesive; 8. a first full-page conductor; 801. a first conductor layer; 9. a second full-page conductor; 901. a second conductor layer; 10. a third full-page conductor; 1001. a third conductor layer; 11. and (3) a full-page insulating film.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a processing technology of a center conductor of an circulator and the center conductor of the circulator, so as to solve the problems in the prior art, and the processing technology is simple and is beneficial to improving the processing efficiency; the ferrite can be prevented from being broken, and the product quality is ensured.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Example 1
As shown in fig. 1-3, the present embodiment provides a processing technology of a center conductor of an circulator, including the following steps:
s1, alternately stacking three conductor layers 1 and three insulating layers 2 in turn to form a first stacked body, for example, placing one insulating layer 2 on one conductor layer 1, then placing one conductor layer 1 on the insulating layer 2, and so on to complete the alternate stacking of the three conductor layers 1 and the three insulating layers 2; and an included angle is formed between any two conductor layers 1 in the three conductor layers 1; the first stack is pressed and the three conductor layers 1 and the three insulation layers 2 are integrated.
S2, fixedly connecting the outermost conductor layer 1 on the first stack of stacked bodies to the ferrite 3. As a preferred embodiment, the conductor layer 1 and the ferrite 3 are bonded by an adhesive 7, and the conductor layer 1 is assembled to the ferrite 3 by a chip mounter.
The three conductor layers 1 and the three insulating layers 2 are simultaneously pressed by adopting the lamination technology, and each conductor layer 1 and each insulating layer 2 are not required to be assembled for multiple times, so that the processing technology is simple, and the processing efficiency is improved; meanwhile, the processing technology of the circulator center conductor provided by the invention is that three conductor layers 1 and three insulating layers 2 are pressed into a whole, and then the whole is installed on the ferrite 3, so that the attachment of the insulating layers 2 and the conductor layers 1 on the ferrite 3 can be avoided compared with the assembly on the ferrite 3 layer by layer, the breakage of the ferrite 3 is avoided, and the product quality is ensured.
As shown in fig. 5 to 8, the method for obtaining the stacked body includes: at least one first imposition conductor 8 is obtained, a plurality of first conductor layers 801 are regularly arranged on each first imposition conductor 8, at least one second imposition conductor 9 is obtained, a plurality of second conductor layers 901 are regularly arranged on each second imposition conductor 9, at least one third imposition conductor 10 is obtained, a plurality of third conductor layers 1001 are regularly arranged on each third imposition conductor 10, a plurality of imposition insulating films 11 are obtained, a plurality of insulating layers 2 are regularly arranged on each imposition insulating film 11, one first imposition conductor 8, one second imposition conductor 9, one third imposition conductor 10 and three imposition insulating films 11 are piled to form a second imposition conductor 9, an imposition insulating film 11 is arranged between the first imposition conductor 8 and the second imposition conductor 9 in the second imposition conductor 9, between the second imposition conductor 9 and the third imposition conductor 10 in the second imposition conductor, and an included angle between the first imposition conductor 801, the second imposition conductor 9, the third imposition conductor 10 and the third imposition conductor 10 in the second imposition conductor 8 is formed between the third imposition conductor 10 and the third imposition conductor 10 in the second imposition conductor 9 in the second imposition conductor stacking. The three conductor layers 1 are a first conductor layer 801, a second conductor layer 901, and a third conductor layer 1001, respectively.
As a preferred embodiment, the positioning marks or positioning holes are formed on the first imposition conductor 8, the second imposition conductor 9, the third imposition conductor 10 and the imposition insulating film 11, and alignment of the first imposition conductor 8, the second imposition conductor 9, the third imposition conductor 10 and the imposition insulating film 11 can be achieved by aligning the positioning marks or positioning holes on the first imposition conductor 8, the second imposition conductor 9, the third imposition conductor 10 and the imposition insulating film 11, and stacking of a plurality of first stacked bodies can be achieved simultaneously.
As a more preferred embodiment, the method for obtaining the first full-page conductor 8 comprises: obtaining a conductor substrate, and etching a plurality of first conductor layers 801 on the conductor substrate; the method for obtaining the second full-page conductor 9 comprises the following steps: obtaining a conductor substrate, and etching a plurality of second conductor layers 901 on the conductor substrate; the method for obtaining the third full-page conductor 10 comprises the following steps: a conductor substrate is obtained, and a plurality of third conductor layers 1001 are etched on the conductor substrate.
As a preferred embodiment, the method for laminating the three conductor layers 1 and the three insulating layers 2 into a whole includes: the second stack is pressed and the first conductor layers 801 on the first full-thickness conductor 8, the second conductor layers 901 on the second full-thickness conductor 9, the third conductor layers 1001 on the third full-thickness conductor 10, and the insulating layers 2 on the three full-thickness insulating films 11 are integrated. The center conductors of the circulators can be obtained through one-time alignment and one-time lamination by a whole plate stacking and whole plate lamination mode; meanwhile, because the size of the single central conductor of the circulator is small, the clamping and the positioning are not convenient to be carried out by adopting a clamp, and when the existing central conductor of the circulator is processed, the processing error is large due to the fact that manual positioning is adopted mostly, the positioning and the clamping are convenient to be carried out by adopting a full-page pressing mode, and the processing precision is further improved.
As a preferred embodiment, two ends of each conductor layer 1 extend out of the adjacent insulating layers 2 to form exposed ends 4, the two exposed ends 4 of each conductor layer 1 are bent towards the direction of the plane of the ferrite 3 to form first bending parts 5, and the tail ends of the first bending parts 5 are flush with the surface of the ferrite 3 away from the first stack body, so that the conductor layers are convenient to weld with a PCB. As shown In fig. 4, the exposed end 4 is a pin of the circulator, and one exposed end 4 of each of the three conductor layers 1 is grounded, and the other three exposed ends 4 of the three conductor layers 1 are respectively used for connection with a load port, an In port and an Out port.
As a more preferable embodiment, each first bending portion 5 of each exposed end 4 is bent towards a first direction and forms a second bending portion 6, the first direction is parallel to the surface of the ferrite 3 away from the first stack, and the first direction points to one end away from the first stack, and the surface of the second bending portion 6 away from the first stack is flush with the surface of the ferrite 3 away from the first stack. By processing the second bending part 6, the welding area of the exposed end 4 and the PCB can be increased, which is beneficial to improving the welding quality.
As a preferred embodiment, the first stack of stacked bodies is pressed by a laminator, the exposed ends 4 are bent in a direction pointing to the plane of the ferrite 3 by a punching process, and the first bending portions 5 of the exposed ends 4 are bent in the first direction by a punching process.
In a preferred embodiment, the insulating layer 2 is a polyimide base film. The shape of the three conductive layers can be set according to the frequency requirements.
Example 2
The embodiment provides a circulator center conductor, which comprises ferrite 3, three conductor layers 1 and three insulating layers 2, wherein the three conductor layers 1 and the three insulating layers 2 are alternately and sequentially fixedly connected with each other to form a first stacked body, and the outermost conductor layer 1 on the first stacked body is fixedly connected with the ferrite 3. Is convenient to process and manufacture. The circulator center conductor provided in this embodiment is manufactured by the circulator center conductor processing process in embodiment 1.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (9)
1. A processing technology of a circulator center conductor is characterized in that: the method comprises the following steps:
s1, stacking three conductor layers and three insulating layers alternately in turn to form a first stacked body, wherein any two conductor layers in the three conductor layers have included angles; pressing the first stack of stacked bodies and integrating the three conductor layers and the three insulating layers;
s2, fixedly connecting the outermost conductor layer on the first stack of stacked bodies to ferrite.
2. The circulator center conductor processing technique of claim 1, wherein:
the method for obtaining the stacked body comprises the following steps: obtaining at least one first imposition conductor, wherein a plurality of first conductor layers are regularly arranged on each first imposition conductor, obtaining at least one second imposition conductor, a plurality of second conductor layers are regularly arranged on each second imposition conductor, obtaining at least one third imposition conductor, a plurality of third conductor layers are regularly arranged on each third imposition conductor, obtaining a plurality of imposition insulating films, a plurality of insulating layers are regularly arranged on each imposition insulating film, one first imposition conductor, one second imposition conductor, one third imposition conductor and three imposition insulating films are folded to form a second imposition conductor, one imposition conductor and the third imposition conductor in the second imposition conductor are folded in a second imposition, one imposition insulating film is arranged between each third imposition conductor and the second imposition conductor, one imposition insulating film is arranged between each second imposition conductor and the third imposition conductor, and each third imposition conductor is folded in a second imposition conductor, and the second imposition conductor is folded in a second imposition conductor, and the third imposition conductor is formed between each imposition conductor and the third imposition conductor.
3. The circulator center conductor processing technique of claim 2, wherein:
the method for laminating the three conductor layers and the three insulating layers into a whole comprises the following steps: and pressing the second stacking body to integrate the first conductor layers on the first full-page conductor, the second conductor layers on the second full-page conductor, the third conductor layers on the third full-page conductor and the insulating layers on the three full-page insulating films.
4. The circulator center conductor processing technique of claim 1, wherein: the two ends of each conductor layer extend out of the adjacent insulating layers to form exposed ends, the two exposed ends of each conductor layer are bent towards the direction pointing to the plane where the ferrite is located to form first bending parts, and the tail ends of the first bending parts are flush with the surface of the ferrite away from the first stacking body.
5. The circulator center conductor processing technique of claim 4, wherein: and bending each first bending part of each exposed end towards a first direction to form a second bending part, wherein the first direction is parallel to the surface of the ferrite, which is far away from the first stacking body, and the first direction points to one end, which is far away from the first stacking body, and the surface of the second bending part, which is far away from the first stacking body, is flush with the surface of the ferrite, which is far away from the first stacking body.
6. The circulator center conductor processing technique of claim 5, wherein: laminating the first pile of stacked bodies by adopting a laminating machine, bending the exposed ends towards the direction pointing to the plane where the ferrite is located by adopting a stamping process, and bending the first bending parts of the exposed ends towards the first direction by adopting the stamping process.
7. The circulator center conductor processing technique of claim 2, wherein:
the method for obtaining the first full-page conductor comprises the following steps: obtaining a conductor substrate, and etching a plurality of first conductor layers on the conductor substrate;
the method for obtaining the second full-page conductor comprises the following steps: obtaining a conductor substrate, and etching a plurality of second conductor layers on the conductor substrate;
the method for obtaining the third full-page conductor comprises the following steps: and obtaining a conductor substrate, and etching a plurality of third conductor layers on the conductor substrate.
8. The circulator center conductor processing technique of claim 1, wherein: the insulating layer is a polyimide substrate film.
9. A circulator center conductor, characterized by: manufactured by the circulator center conductor processing technology of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310371215.3A CN116454577A (en) | 2023-04-07 | 2023-04-07 | Processing technology of circulator center conductor and circulator center conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310371215.3A CN116454577A (en) | 2023-04-07 | 2023-04-07 | Processing technology of circulator center conductor and circulator center conductor |
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| Publication Number | Publication Date |
|---|---|
| CN116454577A true CN116454577A (en) | 2023-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310371215.3A Pending CN116454577A (en) | 2023-04-07 | 2023-04-07 | Processing technology of circulator center conductor and circulator center conductor |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088612A (en) * | 1994-06-21 | 1996-01-12 | Tokin Corp | Irreversible circuit element |
| CN1120375A (en) * | 1994-04-28 | 1996-04-10 | 株式会社村田制作所 | Non-reciprocal circuit element for microwave |
| US20040021524A1 (en) * | 2002-02-19 | 2004-02-05 | Shinji Yamamoto | Non-reciprocal circuit device |
| JP2004247920A (en) * | 2003-02-13 | 2004-09-02 | Alps Electric Co Ltd | Irreversible circuit element |
| JP2008098867A (en) * | 2006-10-10 | 2008-04-24 | Tdk Corp | Non-reciprocal circuit element, communication device, and manufacturing method of center conductor assembly |
| CN103026621A (en) * | 2010-07-22 | 2013-04-03 | Tdk株式会社 | Method for producing laminated electronic component, and laminated electronic component |
| CN108307612A (en) * | 2017-01-13 | 2018-07-20 | 上海量子绘景电子股份有限公司 | A kind of the FCCL materials and its manufacturing method of ferrite base material |
-
2023
- 2023-04-07 CN CN202310371215.3A patent/CN116454577A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1120375A (en) * | 1994-04-28 | 1996-04-10 | 株式会社村田制作所 | Non-reciprocal circuit element for microwave |
| JPH088612A (en) * | 1994-06-21 | 1996-01-12 | Tokin Corp | Irreversible circuit element |
| US20040021524A1 (en) * | 2002-02-19 | 2004-02-05 | Shinji Yamamoto | Non-reciprocal circuit device |
| JP2004247920A (en) * | 2003-02-13 | 2004-09-02 | Alps Electric Co Ltd | Irreversible circuit element |
| JP2008098867A (en) * | 2006-10-10 | 2008-04-24 | Tdk Corp | Non-reciprocal circuit element, communication device, and manufacturing method of center conductor assembly |
| CN103026621A (en) * | 2010-07-22 | 2013-04-03 | Tdk株式会社 | Method for producing laminated electronic component, and laminated electronic component |
| CN108307612A (en) * | 2017-01-13 | 2018-07-20 | 上海量子绘景电子股份有限公司 | A kind of the FCCL materials and its manufacturing method of ferrite base material |
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