CN116438327A

CN116438327A - Roll-over protector for cathode and method for compensating roll-over of cathode

Info

Publication number: CN116438327A
Application number: CN202080105851.6A
Authority: CN
Inventors: 克里斯蒂安·沃尔夫冈·埃曼; 安德烈·布鲁宁; 拉尔夫·林登贝格
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2020-10-05
Filing date: 2020-10-05
Publication date: 2023-07-14
Also published as: KR20230074594A; WO2022073581A1

Abstract

A protector and method for compensating for tumbling of a cathode rotating about an axis of rotation is provided. The tumble protector may include a protector centering element configured to be mounted spaced apart from the cathode to provide a distance a between the protector centering element and the cathode.

Description

Roll-over protector for cathode and method for compensating roll-over of cathode

Technical Field

Various embodiments described herein relate to rotatable sputter cathodes, such as cylindrical sputter cathodes that are rotated during sputtering. Embodiments described herein further relate to a tumble protector for compensating for tumbling of a cathode rotating about an axis of rotation. In particular, embodiments of the present disclosure relate to a protector centering element configured to be mounted spaced apart from a cathode.

Background

Several methods for depositing material on a substrate are known. For example, the substrate may be coated by a Physical Vapor Deposition (PVD) process, a Chemical Vapor Deposition (CVD) process, a Plasma Enhanced Chemical Vapor Deposition (PECVD) process, or the like. The process is performed in a processing apparatus or processing chamber in which the substrate to be coated is positioned. The deposition material is disposed in the apparatus. A variety of materials, as well as their oxides, nitrides or carbides, may be used for deposition on a substrate.

For PVD processes, the deposition material may exist in a solid phase as a target. By bombarding the target with energetic particles, atoms of the target material (i.e., the material to be deposited) are knocked out of the target. Atoms of the target material are deposited on the substrate to be coated. In a PVD process, the sputtered material (i.e., the material to be deposited on the substrate) may be arranged in different ways. For example, a rotatable target may be used, wherein the target is connected to a rotating shaft, such as a rotating cathode.

The rotating shaft or rotating cathode and/or target may have a particular geometry, size and design. In particular, the cathode is typically long, having a length of approximately two meters or more. The cathode is further rotated by driving one end of the cathode (e.g., the driven end of the cathode) using a cathode driving unit. The other end (i.e. opposite the driven end of the cathode) may be free, e.g. not supported, carried or secured by e.g. mechanical fixing elements. This is because any contact (e.g., mechanical contact with the free end of the cathode) may cause abrasion and/or wear, for example, due to frictional forces acting between the two that may contaminate the material sputtering process (i.e., in the form of cross-particles). The particles may negatively impact the material deposition process. Contact with the free end of the cathode will be avoided or at least reduced.

However, another problem arises due to the length of the cathode. Since the free end of the cathode is not supported during rotation, the cathode may be subjected to or may encounter tumbling motions, such as tilting away from the axis of rotation. This tumbling motion of the cathode results in a non-uniform, non-uniform and/or irregular deposition process, resulting in different thicknesses on the substrate. Furthermore, this may cause contact with the anode, creating particles on the anode, which may negatively impact the material deposition process. Therefore, tumbling motion of the cathode may also negatively impact the sputtering process.

It would therefore be beneficial to provide an apparatus and method that reduces and/or counteracts the tumbling motion of the cathode during rotation.

Disclosure of Invention

In view of the above, a tumble protector, a material deposition apparatus and a method for compensating for a tumbling or tumbling motion of a cathode during rotation about a rotation axis are provided. Further aspects, advantages and features are apparent from the dependent claims, the description and the drawings.

According to one embodiment, a tumble protector for compensating for tumbling of a cathode rotating about an axis of rotation is provided. The tumble protector includes a protector centering element configured to be mounted spaced apart from the cathode. The protector centering element may be mounted to provide a distance between the protector centering element and the cathode.

According to one embodiment, a method for compensating for tumbling of a cathode rotating about an axis of rotation is provided. The method includes rotating the cathode about the axis of rotation. The method further includes centering the cathode at the axis of rotation with a protector centering element spaced apart from the cathode at least during a first period of time.

According to one embodiment, a deposition apparatus is provided. The deposition apparatus includes at least one cathode having: a first end, the first end being a free end of the cathode; and a second end opposite the first end, the second end being a driven end of the cathode. The deposition apparatus further includes: at least one cathode drive unit for rotating the at least one cathode about an axis of rotation; and a tumble protector for compensating for tumbling of the at least one cathode during rotation about the axis of rotation.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to various embodiments of the present disclosure and are described below:

FIG. 1 illustrates a schematic diagram of a deposition apparatus having at least one cathode, a cathode drive unit, and a tumble protector according to various embodiments described herein, according to various embodiments described herein;

FIG. 2A illustrates a schematic view of a portion of a rotatable cathode including a tumble protector in a non-tilted position according to various embodiments of the present disclosure;

FIG. 2B illustrates a schematic view of a portion of a rotatable cathode including a tumble protector in an inclined position according to various embodiments of the present disclosure;

FIG. 3 illustrates a schematic view of a portion of a rotatable cathode including another tumble protector according to various embodiments of the present disclosure;

FIG. 4 illustrates a flow chart of a method according to various embodiments described herein;

fig. 5 illustrates a flow chart of a method according to various embodiments described herein.

Detailed Description

Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in each figure. In the following description of the figures, like reference numerals refer to like parts. Generally, only differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not intended as a limitation of the disclosure. Additionally, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. The description is intended to include such modifications and variations.

The accompanying drawings are schematic drawings not to scale. Some elements in the figures may have exaggerated dimensions for purposes of highlighting aspects of the present disclosure and/or for purposes of clarity of presentation.

Various embodiments described herein relate to material deposition using a cathode and/or a target. For example, the cathode and/or the target is driven at one end of the cathode so as to cause a rotational movement about the axis of rotation (rotational movement). The end opposite the driven end may be free, e.g. not supported by a mechanical fixing element. Due to the length of the cathode, e.g. two meters or more or even three meters or more, the cathode may be subjected to or may encounter tumbling motions, e.g. tilting/swinging/pivoting away from the axis of rotation. This tumbling motion of the cathode results in a non-uniform, non-uniform and/or irregular deposition process, resulting in different thicknesses on the substrate. Furthermore, this may lead to contact with the anode, in particular particles on the anode, which may negatively affect the material deposition process.

As mentioned above, contact (e.g., mechanical contact with the free end of the cathode) results in friction (friction), wear (spar), and/or abrasion (abrasiona), thereby causing unwanted particles to contaminate the material deposition process. Furthermore, tumbling caused by a combination of both the rotational speed of the cathode and the length of the cathode may cause the material deposition process to be non-uniform, and/or irregular. This may cause the deposited material to vary in thickness.

It would therefore be beneficial to provide a system, apparatus and method for protection against such tumbling, particularly for compensating for tumbling of cathodes rotating about an axis of rotation. Furthermore, it is beneficial to provide roll protection in a non-contact manner, for example to avoid unnecessary friction, wear and/or abrasion contaminating the sputtering process. Additionally or alternatively, when the roller guide or the sliding guide provides roll protection, the roll protector may be provided in an encapsulated manner, such as by a labyrinth seal.

The deposition apparatus 100 according to various embodiments described herein may be configured for vacuum deposition and is exemplarily shown in fig. 1. The deposition apparatus 100 may include a processing chamber, such as a vacuum chamber 116 or enclosure, particularly a chamber configured to have a vacuum within the chamber. The chamber may be a vacuum chamber. At least one cathode 104 or at least a portion or section of a cathode as described herein may be disposed in a process chamber, such as a vacuum chamber 116.

Fig. 1 illustrates a cross-section of a deposition apparatus 100 according to various embodiments described herein. The cross section of the deposition apparatus 100 is shown in a direction parallel to the axis of rotation 101 of the cathode 104.

The deposition apparatus 100 according to various embodiments described herein may be a sputter deposition apparatus. At least one cathode 104 is provided. The at least one cathode 104 may be configured to receive a target. The cathode 104 may also be referred to as a cathode assembly to illustrate a target.

Throughout this disclosure, when referring to a "cathode", it should be understood that reference is also made to a cathode assembly, i.e., a cathode assembly that includes a target. Thus, the terms "cathode" and "cathode assembly including a target" are used interchangeably. The cathode and/or target may be rotatable about an axis of rotation 101. The cathode 104 may have a curved, e.g., substantially cylindrical, surface. The cathode assembly may include a magnet assembly (not shown) that may be disposed within the cathode.

According to some embodiments, the cathode may be a cantilever cathode. The cathode may have a free or unsupported end (e.g., a first end) and a driven end (e.g., a second end). The cathode drive unit 103 may be configured for powering the cathode 104 and for rotation of the cathode 104 about the rotation axis 101. If more than one cathode is used, a corresponding number of cathode drive units 103 may be used to drive each cathode 104 independently. The cathode drive unit may comprise or be connectable to a power source for supplying power to the cathode 104. Additionally or alternatively, the cathode drive unit 103 may be configured to supply water or coolant to the cathode and/or to the coolant receiving housing. The cathode drive unit 103 may comprise or be connectable to a water or coolant supply for supplying water or coolant to the cathode. As described above, the cathode drive unit 103 is configured to drive or rotate the cathode and/or the target at the second end 106 of the cathode 104 about the rotation axis 101. The cathode drive unit 103 as described herein may be referred to as an end block or cathode drive block that engages the driven end 106 of the cathode 104.

As indicated by arrow 11 in fig. 1, material from the target is sputtered toward the substrate. The substrate may be supported by a carrier 120. The carrier 120 may be moved into and out of the vacuum chamber 130 by a transport system 140. For example, the transport system 140 may be a roller stand transport system in which the carrier is supported by rollers in the vacuum chamber 116. As shown in fig. 1, the transport system 140 may be a magnetic levitation system having, for example, a levitation unit 118 and a drive unit 119 for moving the carrier 120 through the vacuum chamber. As shown in fig. 1, the transport system 140 may be arranged above the carrier and the drive unit may be arranged below the carrier. However, depending on the magnetic levitation system and further arrangements in the system, the levitation unit 118 can be above, below or at one side of the carrier. Additionally or alternatively, the drive unit 119 may be above, below or at one side of the carrier.

The deposition apparatus 100 of fig. 1 is described as a deposition apparatus for deposition on a vertically oriented substrate. The term "vertically oriented (vertically oriented)" may include substrates arranged with small deviations from fully vertical, e.g., there may be an angle of up to 10 ° or even 15 ° between the substrate and fully vertical. Deposition apparatus according to various embodiments described herein may be configured for deposition on large area substrates. According to some embodiments, which may be combined with other various embodiments described herein, the deposition apparatus may be configured to process vertically oriented substrates. Alternatively, the deposition apparatus may be configured to process horizontally oriented substrates.

The term "substrate" as used herein shall particularly include substantially inflexible substrates, e.g. wafers, slices of transparent crystals (such as sapphire or similar substances) or glass plates. In particular, the substrate may be a glass substrate and/or a transparent substrate. The present disclosure is not limited thereto, and the term "substrate" may also encompass flexible substrates (such as rolls or foils). The term "substantially inflexible (substantially inflexible)" should be understood as being distinguished from "flexible". In particular, the substantially inflexible substrate may have a degree of flexibility, such as a glass plate having a thickness of 0.5mm or less, wherein the flexibility of the substantially inflexible substrate is small compared to the flexible substrate.

In the example of fig. 1, the deposition apparatus 100 shows one cathode 104. However, deposition apparatus according to various embodiments described herein may include one or more cathodes 104, particularly a plurality of cathodes, adapted for use as cathodes in a coating process, such as a sputter deposition process. As can be seen in fig. 1, the cathode 104 is provided in a cantilever arrangement, i.e. extending vertically, supported at one end (e.g. the driven end 106 of the cathode 104) and unsupported at the end opposite to that end (i.e. the free end 102 of the cathode 104). In the case of using a plurality of cathodes, then each cathode may be arranged in a cantilever arrangement.

The material deposition apparatus according to various embodiments described herein may also include one or more anodes 108. The one or more anodes 108 may be arranged beside the one or more cathodes, in particular parallel to the cathodes with respect to the rotation axis 101. For example, one or more cathodes 104 may be arranged with a plurality of anodes 108 such that one cathode 104 is arranged between, e.g., adjacent, two anodes 108. The anode 108 shown in fig. 1 is shown "in front of" or spatially in front of the cathode for illustration purposes. However, another anode 108 may be spatially disposed behind the cathode 104 (not shown). The cathode 104, which is disposed between two anodes 108 as described above, is shown in more detail in the various embodiments of fig. 2A and 2B.

A deposition apparatus for a large area substrate may include a plurality of cathodes 104 and a plurality of anodes 108. For example, four or more, such as six or more or even 10 or more cathodes and/or anodes may be provided.

The material deposition apparatus 100 of fig. 1 includes a cathode driving unit 103. The cathode drive unit 103 is configured to rotate the cathode 104 about the rotation axis 101 at a second end of the cathode 104. The second end 106 may be referred to as the driven end 106 of the cathode 104.

The material deposition apparatus may further include

shields

112, 114 for limiting or restricting the sputtering area of the material. The material sputtering region may be considered as a spatial region between the first shield 112 and the second shield 114 or the first shield portion and the second shield portion, respectively. For example, the shield will prevent sputtering of material 11 from the target toward the substrate contaminating chamber components, such as the levitation unit 118 and the drive unit 119 of the transport system 140. The dimensions of the shield and the material sputtering area may depend on the type of material deposition apparatus and the number of cathodes used.

The material deposition apparatus 100 illustrated in fig. 1 may further include a tumble protector 110 configured to be mounted spaced apart from the cathode 104. As shown, the tumble protector 110 is mounted such that a gap, clearance, or distance is provided between the tumble protector 110 and the cathode 104. As shown, a spacing may be provided in the longitudinal direction of the cathode (e.g., axis of rotation 101). In this case, the tumble protector 110 may be considered to be spatially disposed "over" or "in front of" the cathode 104. As discussed further below, spacing may also be provided in the radial direction of the cathode (e.g., substantially perpendicular to the axis of rotation 101). The spacing may also be provided in a combination of radial and longitudinal directions.

The term "above … …" or "in front of … …" as used herein may be understood as the tumble protector 110 being arranged spaced apart from the cathode 104 in the direction of the rotation axis 101. For example, the cathode 104 of the material deposition apparatus 100 shown in fig. 1 is described as the material deposition apparatus 100, wherein the cathode 104 is arranged parallel to a cross section of the material deposition apparatus 100. However, for a material deposition apparatus 100 having a cathode 104 arranged substantially perpendicular to a cross-section of the material deposition apparatus 100, the term "above" or "in front of" the cathode 104 may be replaced by spatially "next to" or "adjacent to" the cathode 104. Whether vertically or horizontally arranged cathodes 104 are used, the tumble protector 110 should be arranged such that a distance, gap or spacing is provided between the cathode 104 and the tumble protector 110, i.e. in the longitudinal direction of the cathode and/or in the radial direction of the cathode, e.g. such that the cathode and the tumble protector 110 do not touch or touch each other.

Fig. 2A illustrates an enlarged portion of the free end 102 of the cathode 104 illustrated in fig. 1 and an example tumble protector 210 according to some embodiments. In fig. 2A, only a portion of the cathode 104 of fig. 1 is shown. The tumble protector 210 is disposed spaced apart from the free end 102 of the cathode 104. As shown in fig. 2A, a gap, spacing, or distance a is provided. In this non-limiting example, the pitch or distance a is disposed in the longitudinal direction of the cathode. In fig. 2A, the tumble protector 210 may be considered to be disposed "above" the cathode.

The tumble protector 210 includes a protector centering element 214. The term "protector centering element" as used throughout this disclosure may be understood as any device, element, unit, or means capable of providing centering of the cathode 104 at the axis of rotation 101. Centering may also be provided during rotation of the cathode 104.

The term "centering" or "centering" as used throughout this disclosure with respect to the cathode 104 may be understood to maintain the cathode 104 proximate to the axis of rotation of the cathode and in particular during rotation. For example, centering the cathode 104 at the axis of rotation may include rotation of the cathode within a small (e.g., spatial and/or angular) deviation from the axis of rotation. For example, the allowable deviation from the rotation axis 101 of the cathode may be an angular deviation of, for example, up to 0.05 ° or 0.1 °. For example, at a cathode length of 3000mm, the radial offset at the top of the cathode will be 3000mm x 0.05 ° =2.6 mm radial offset from the axis of rotation 101. Such deviations may be referred to as tumbling, tumbling motion, wobbling motion (tumbling motion) or at least asymmetric (e.g., elliptical) rotation of the cathode 104 relative to the axis of rotation 101. For example, a cathode 104 that is "centered" at the axis of rotation should be understood to be a cathode 104 that does not undergo tumbling motion (i.e., remains at the axis of rotation) or at least is a cathode 104 whose tumbling motion is within an allowable (e.g., spatial and/or angular) range/deviation from the axis of rotation 101.

As shown in the example of fig. 2A, tumble protector 210 further includes cathode centering element 204. The cathode centering element 204 is configured to be mounted at the first end 102 of the cathode 104, the first end 102 of the cathode 104 being the free end 102 of the cathode. The first end 102 is opposite the second end 106 of the cathode 104 shown in fig. 1. The second end 106 is the driven end of the cathode 104.

The term "cathode centering element" as used throughout this disclosure may be understood as any device, element, unit, or means capable of providing centering of the cathode 104 at the axis of rotation 101 during rotation.

For example, the cathode centering element 204 may be configured to interact, cooperate, and/or engage with the protector centering element 214 during rotation of the cathode 104 to counteract, reduce, and/or attenuate tumbling motion of the cathode such that rotational centering of the cathode is at the axis of rotation 101 and/or maintained at the axis of rotation 101. As can be seen in the example of fig. 2A, the protector centering element 214 and the cathode centering element 204 are arranged spaced apart from each other, e.g., by a distance a. In this non-limiting example, the protector centering element 214 is spaced apart from the cathode centering element 204 in the longitudinal direction of the cathode. The protector centering element 214 may also be arranged spaced apart from the cathode centering element 204 in a radial direction of the cathode (e.g., substantially perpendicular to the axis of rotation) or in a combination of longitudinal and radial directions, as described above.

The interaction between the protector centering element and the cathode centering element may include any interaction capable of centering the cathode 104 during rotation. For example, the interaction may be provided by a force such as a magnetic force and/or a mechanical force. As described further below, the force may be applied permanently or temporarily.

As shown in the example of fig. 2A, the cathode centering element 204 may include a first magnet assembly 206 having

poles

206A, 206B. The first magnet assembly provides a first magnetic field B1. The protector centering element 214 may include a second magnet assembly 216 having

poles

216A, 216B. The second magnet assembly provides a second magnetic field B2.

As shown in the example of fig. 2A, the cathode centering element 204 including the first magnet assembly 206 is spaced apart from the protector centering element 214 including the second magnet assembly 216 to provide a distance a therebetween. The distance a between the magnetic components is generally dependent on the number of magnets used and the strength of the magnetic field provided. As can be seen, the distance a is set in the direction of the rotation axis 101, for example in the longitudinal direction of the cathode, such that the protector centering element 214 is arranged directly "above" the cathode centering element 104, for example such that they share the same rotation axis 101. The distance a may also be arranged in a direction substantially perpendicular to the rotation axis 101, for example in a radial direction of the cathode 104, such that the protector centering element surrounds (enclosure), encases (enclasps) and/or embraces (embracies) the cathode centering element 204, for example radially. In this case, the protector centering element 214 may be formed with a substantially "U" shaped cross-section or profile to radially surround, encircle, encase, and/or encase the cathode centering element 204 to provide the spacing A. For example, the "U" shaped protector centering element 214 may include two magnets, e.g., disposed on opposite sides of the "U" shaped protector centering element 214, such that the cathode centering element 204 is located between the two magnets, e.g., of the protector centering element 214. For example, the magnets of the "U-shaped" protector centering element may radially surround the cathode centering element, e.g., concentrically. Alternatively, the magnets of the protector centering element may be annular, e.g. radially surrounding the cathode centering element, e.g. concentrically. The first distance A1 may be provided between the first magnet of the protector centering element and the cathode centering element, e.g. in the radial direction of the cathode, and the second distance A2 (e.g. opposite to the first distance A1) may be provided between the second magnet of the protector centering element and the cathode centering element, e.g. in the radial direction of the cathode.

For example, the distance a between the first magnet assembly and the second magnet assembly may be less than 20mm, preferably less than 10mm, and the magnetic field B1 provided by the first magnet assembly 206 may be at least 0.2T, and/or the magnetic field B2 provided by the second magnet assembly 216 may be at least 0.2T to provide sufficient centering of the cathode 104 at the axis of rotation 101 and/or to reduce tumbling motion of the cathode 104.

Fig. 2A also illustrates an exemplary installation of the roll protector 210 to provide a gap, spacing, and/or distance a. In particular, the protector centering element 214 may be mounted, attached, or affixed between two exemplary anodes 108 to provide a distance a above the free end 102 of the cathode 104 (e.g., in the longitudinal direction of the cathode 104). It should be understood that this installation of the protector centering element 214 is merely an example. In particular, different mounts may be selected so long as they are capable of providing at least a gap, spacing, and/or distance a between the protector centering element 214 and the cathode centering element 204. As mentioned above, it is also possible to provide the mounting such that the gap, the pitch and/or the distance a is arranged in the radial direction or in a combination of the longitudinal direction and the radial direction of the cathode. As can be seen in fig. 2A, a cathode centering element 204 may be mounted at the free end 102 of the cathode 104. The centering element 204 rotates together with the cathode 104, for example at the same rotational speed of, for example, 2rpm (revolutions per minute) or higher and/or 30rpm or lower, in particular 5rpm (revolutions per minute) or higher and/or 20rpm or lower.

The distance a between the protector centering element 214 and the cathode centering element 204 allows the protector element to remain stationary, e.g., not rotate and/or not move as the cathode 104 and/or the cathode centering element 204 rotate.

The interaction between the first magnetic field B1 and the second magnetic field B2 may center the cathode 104 at the rotation axis 101 via an attractive force. Since the protector centering element 214 is spaced from the cathode centering element 204 by a distance a, contact between these elements (e.g., mechanical friction) is avoided, which avoids friction, abrasion, and/or wear. Since the force is magnetically applied, i.e. non-contact, no further (mechanical) contact is provided which may cause abrasion or wear, thus avoiding negatively affecting the deposition process. The magnetic force may be provided permanently, constantly, and/or continuously, for example during rotation of the cathode 104. The magnetic force may also be controllably or adjustably provided, for example by using electromagnets or electro-permanent magnets to set, adjust and/or select specific or predefined magnetic field values. It will be appreciated that this applies to all elements capable of providing a magnetic field. The magnetic field B of each magnet and/or magnetic assembly may be adapted, adhered to, adjusted, set, updated, and/or otherwise customized. For example, where heat causes the target to expand, it may be useful to use an adjustable magnet, such as in a spatial direction, which causes the gap, spacing, and/or distance a to become smaller or shorter. In this case, the magnetic field may be readjusted, altered or modified to account for, for example, changes in length. The magnetic force causes the rotational movement of the cathode 104 to be more stable. The tumbling motion is counteracted, reduced, minimized, avoided or at least reduced.

The roll-over protector 210 shown in fig. 2A may further include at least one shield 220. The at least one shield may have a curved (e.g., substantially cylindrical) cross-section or surface that surrounds/encloses, for example, one or more of the protector centering elements 214 and at least a portion of the cathode centering element 204. The at least one shield allows for reduced material deposition on the tumble protector. Additionally or alternatively, the shield may be configured to shield the magnetic fields of the tumble protector, e.g., magnetic fields B1 and B2. Thus, the effect of the magnetic field of the tumble protector on the sputtering process (e.g., magnetron sputtering process) may be reduced or avoided.

Fig. 2A shows the tumble protector 210 in a non-tilted position at a distance a above the cathode. In particular, the protector centering element 214 according to various embodiments described herein is configured to be removably or tiltably mounted relative to the axis of rotation 101, the cathode 104, and/or the cathode centering element 204. The removable or tiltable mounting of the protector centering element 214 relative to the cathode 104 and/or the cathode centering element 204 allows or enables replacement of the cathode 104, the cathode centering element 204, and/or the protector centering element 214 alone and/or independently of each other. This also allows for providing further space/area for maintenance, e.g. replacement of the cathode or target after material utilization.

The terms "movable", "tiltable" or "tilting" as used throughout this disclosure may be understood as at least the protector centering element 214 being spatially remote from the axis of rotation 101, the cathode 104 and/or the cathode centering element 204, e.g., such that the protector centering element 214 is spatially moved out of or away from the axis of rotation 101. Tilting may include movement, e.g., spatial displacement, of the protector centering element 214 in a direction perpendicular to the axis of rotation (e.g., in a radial direction of the cathode 104, a direction parallel to the axis of rotation), and/or combinations thereof. In particular, any movement of at least the protector centering element 214 away from the rotational axis 101 may be considered a "tiltable" mount or a "movable mount".

The example of fig. 2B shows the roll protector 210 of fig. 2A in an inclined position. In particular, the protector centering element 214 is shown tilted, sideways (inclined), deflected (contained), or moved away from the rotational axis 101, e.g., clockwise, in direction D. This tilting movement of the protector centering element 214 provides access to the cathode 104, the cathode centering element 204, the magnet assembly 206, and the at least one shield 220, the second magnet assembly 216, and the protector centering element 214 for maintenance. This enables access to be provided for replacing one or more of these elements individually and/or independently of each other.

Fig. 3 illustrates an enlarged portion of the free end 102 of the cathode 104 of fig. 1, and an example tumble protector 310 according to some embodiments. The tumble protector is disposed in spaced relation to the free end 102 of the cathode 104 by a gap, space or distance a. Tumble protector 310 includes protector centering element 214.

As shown in the example of fig. 3, tumble protector 210 further includes cathode centering element 204. The cathode centering element 204 is configured to be mounted at the first end 102 of the cathode 104, the first end 102 of the cathode 104 being the free end of the cathode. The first end 102 is opposite the second end 106 of the cathode 104 as shown in fig. 1.

As shown in the example of fig. 3, the cathode centering element 204 and the protector centering element 214 define a pin and bushing combination. The pin 205 may have a first diameter D1 and the bushing may include an opening 215, the opening 215 having a second diameter D2. The pin and bushing combination is shown in fig. 3, i.e., pin 205 is located or mounted to cathode centering element 204, while bushing and/or bushing opening 215 is depicted as being located or mounted to protector centering element 214. However, the positions of the pin and bushing may also be interchanged, i.e., the protector centering element 214 may comprise a pin and the cathode centering element 204 may comprise a bushing.

The first diameter D1 of the pin 205 may be smaller than the second diameter D2 of the opening 215 of the bushing to enable the bushing to at least partially receive and/or at least surround or enclose the pin, e.g., concentrically. As can be seen in the example of fig. 3, the bushing is spatially mounted over the pin to provide a gap, spacing, or distance a. The mounting may be considered as non-contact. The bushing opening 215 at least partially surrounds or encloses the pin 205, e.g., concentrically, wherein another gap, spacing, or distance B is provided. This distance B, referred to as the turning gap, is concentrically disposed between the pin and bushing combination, and in particular between the pin 205 and the bushing opening 215. As can be seen in the example of fig. 3, the gap, pitch, or distance B of the turning gap is substantially perpendicular to the distance or spacing a between the protector centering element 214 and the cathode centering element 204. In particular, the distance B may be disposed in a radial direction from the cathode 104.

The term "swivel gap" as used throughout this disclosure may be understood as a gap, distance, clearance or clearance (B) between the openings of the pin and the bushing such that the pin and the bushing are spaced apart from each other, e.g., do not contact or touch each other.

In fig. 3, the swivel gap is arranged concentrically, as the openings of both the pin and the bushing may have a curved, e.g. substantially cylindrical cross-section or surface. However, other forms, dimensions, and/or cross-sections are also possible. For example, the opening 215 of the bushing need not have a cylindrical cross-section, e.g., the inner wall 217 of the opening 215 of the bushing may be discontinuous. Instead, the inner wall 217 of the opening 215 of the bushing may be interrupted, e.g., there may be one or more gaps in the inner wall 217. The number of gaps and their length or size depends on the opening 215 to be used. The gap in the inner wall 217 of the bushing may also be used to position or locate the tumble protector spaced from the cathode, for example by moving, pivoting or tilting the protector element in a radial direction from the cathode.

The distance B of the swivel gap allows the bushing and pin combination to remain non-contact as the cathode 104 rotates about the axis of rotation 101. That is, the pin and bushing do not contact each other, i.e., the pin and bushing avoid mechanical contact. As the cathode 104 undergoes tumbling or tumbling motion, the pitch or distance B provided by the turning gap B decreases as the cathode 104 or pin 205 approaches the bushing. Upon mechanical contact (e.g., touching), the bushing will interact or engage with the pin to center the cathode at the axis of rotation 101, i.e., when the tumbling motion of the cathode 104 exceeds the distance B defined by the turning gap. When distance B is exceeded, i.e., when the pin contacts the bushing, a mechanical force is provided that counteracts the tumbling motion of cathode 104. The tumbling motion is not only defined (limited), but also reduced. In particular, the cathode 104 is prevented or limited from moving further away from the axis of rotation 101. Thus, the distance B of the swivel gap defines a distance, such as a maximum distance, within which the cathode 104 is allowed to tumble and within which the non-contact interaction between the pin and the bushing is maintained. Once distance B is exceeded, mechanical interaction begins, wherein cathode 104 is centered at rotational axis 101, and wherein tumbling motion of cathode 104 is reduced, counteracted, minimized, avoided, and/or attenuated.

The distance B defined by the swivel gap is preferably less than 9mm, preferably less than 5mm or even may be less than 3mm. The spacing or distance a between the pin and the bush of the pin and bush combination is preferably less than 20mm, preferably less than 10mm. However, other values of the distances a and B may be selected, for example depending on the cross-section, size, form and/or shape of the pin and bushing combination, or depending on the length of the cathode. The distances a and B may also be selected according to, for example, the adjustable or controllable magnetic field value B used, and vice versa. In particular, the pin and the bushing or the opening of the pin and the bushing may not necessarily have a curved (e.g. substantially cylindrical) cross-section or surface. Instead, other shapes and forms are sufficient to achieve the effect of applying a mechanical force to counteract and/or reduce the tumbling of the cathode 104 when the distance of the turning gap B is exceeded.

As can be seen in the example of fig. 3, the roll protector may also include one or

more bearings

330, 332 to support the bushing. One or more bearings may be used to enable the bushing to rotate according to the rotation of the cathode 104, in particular around the rotation axis 101 at the same (rotational) speed as the cathode centering element 204.

Upon contact, i.e. when the distance B of the turning gap is minimized and the pin is engaged with the bushing, e.g. touching, further wear or abrasion of the bushing may be reduced due to the fact that it rotates at the same speed as the cathode 104. The mechanical contact counteracts the tumbling motion of the cathode 104, wherein the cathode 104 is forced to remain centered at the rotation axis 101. Mechanical contact, such as when the bushing touches the cathode, may impair the tumbling motion that causes the cathode 104 to move back again to the axis of rotation 101. The distance B of the swivel gap will again increase or enlarge, which will resume the non-contact interaction between the pin and the bushing. Thus, the mechanical contact between the bushings in the pin is established only for a short period of time, e.g., only temporarily or only when necessary, in order to counteract tumbling of the cathode 104. This allows to prevent abrasion and/or wear by applying a force only when the maximum distance B defined by the turning gap B is exceeded.

As can be further seen in the example of fig. 3, the tumble protector 310 is mounted at the housing or vacuum chamber 116 of the deposition apparatus 100. The mounting structure 340 enables the protector centering element 214 to pivot away from the rotational axis 101, e.g., in a direction perpendicular to the rotational axis 101 or in a radial direction of the cathode 104. This enables the protector centering element to be slidably, movably or jostly mounted at the housing, for example at the vacuum chamber 116. For example, the tumble protector may be mounted at the shield 112 shown in fig. 1. Thus, the protector element may be pushed, placed or inserted in a direction perpendicular to the rotation axis 101 (e.g. in a radial direction of the cathode 104), directly above the cathode centering element and/or the cathode 104, i.e. spaced apart from the cathode centering element and/or the cathode 104. As mentioned above, such fixation enables the protector centering element to be removed from the cathode centering element and/or the cathode to allow the cathode, the cathode centering element, and/or the protector centering element to be replaced individually and/or independently of each other. The mounting structure 340 may also be pivotable.

According to various embodiments, which may be combined with any of the other embodiments described herein, a method 400 for compensating for tumbling of a cathode rotating about an axis of rotation 101 is provided.

At operation 402, the cathode rotates about the axis of rotation 101. At operation 404, the cathode is centered at the axis of rotation 101 with the protector centering element 214 spaced apart from the cathode 104 at least during a first period of time. At operation 406, a non-contact force is applied between the protector centering element and a cathode centering element mounted at the free end of the cathode to center the cathode. The force may be applied permanently, continuously, and/or constantly during rotation of the cathode 104.

At operation 406, the cathode 104 is fixed, centered, or stabilized at the axis of rotation during rotation of the cathode by a non-contact force to counteract and/or reduce tumbling motion of the cathode, wherein the force is magnetically applied.

According to various embodiments, which may be combined with any of the other embodiments described herein, a method 500 for compensating for tumbling of a cathode rotating about an axis of rotation 101 is provided.

At operation 502, the cathode is rotated about the axis of rotation 101. At operation 504, the cathode is centered at the axis of rotation 101 with the protector centering element 214 spaced apart from the cathode 104 at least during a first period of time. At operation 506, a contact force is applied between the protector centering element and a cathode centering element mounted at the free end of the cathode to center the cathode. The force may be applied at least during a second period of time during which the protector centering element engages/interacts with the cathode centering element.

At operation 508, the cathode is fixed (fix), centered, or stabilized (stabilize) at the axis of rotation during rotation of the cathode by a contact force applied during a second period of time, wherein the force is mechanically applied to counteract and/or reduce tumbling motion of the cathode.

While the foregoing is directed to embodiments of the present disclosure, numerous other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A tumble protector for compensating for tumbling of a cathode rotating about an axis of rotation, comprising:

a protector centering element configured to be mounted spaced apart from the cathode to provide a distance between the protector centering element and the cathode.

2. The roll protector of claim 1, further comprising:

a cathode centering element configured to be mounted at a first end of the cathode, the first end being a free end of the cathode,

the first end is opposite a second end of the cathode, the second end being a driven end of the cathode.

3. The tumble protector of claim 2, wherein the protector centering element is configured to interact/engage with the cathode centering element during rotation of the cathode to counteract tumbling motion of the cathode such that the rotation of the cathode is centered at the axis of rotation.

4. A roll protector according to any one of claims 2 to 3 wherein

The cathode centering element includes a first magnet assembly having one or more magnets, the first magnet assembly providing a first magnetic field, and

the protector centering element includes a second magnet assembly having one or more magnets, the second magnet assembly providing a second magnetic field.

5. Tumble protector according to any one of claims 1-4, wherein the distance between the first magnet assembly and the second magnet assembly is less than 20mm, preferably less than 10mm,

the magnetic field provided by the first magnet assembly is at least 0.2T, and/or

The magnetic field provided by the second magnet assembly is at least 0.2T.

6. The tumble protector according to any one of claims 1-5, wherein

The protector centering element is configured to remain non-rotating during rotation of the cathode centering element and during rotation of the cathode about the axis of rotation, the protector centering element being configured to be tiltably mounted relative to the cathode centering element such that the cathode, the cathode centering element, and/or the protector centering element can be replaced individually and/or independently of each other.

7. A roll protector according to any one of claims 1 to 3 wherein the cathode centering element and the protector centering element are pin and bushing combinations,

the pin having a first diameter, and the bushing comprising an opening having a second diameter,

the first diameter of the pin is smaller than the second diameter of the opening of the bushing such that the bushing is capable of at least partially receiving and/or at least concentrically surrounding/enclosing the pin.

8. A roll protector as set forth in claim 7 wherein a swivel gap is disposed concentrically between said pin and bushing combination, said pin and bushing in said pin and bushing combination being spaced apart from each other.

9. The tumble protector according to any one of claims 7-8, wherein

The swivel gap defines a distance within which the cathode is allowed to tumble and within which a non-contact interaction between the pin and the bushing is maintained.

10. The tumble protector of claim 9, wherein when the tumbling motion of the cathode exceeds the distance defined by the swivel gap, the bushing is configured to engage with the pin so as to center the cathode at the axis of rotation.

11. A roll protector according to any one of claims 7 to 10 wherein the distance defined by the swivel gap is less than 7mm, preferably less than 5mm, and/or the spacing between the pin and the bushing of the pin and bushing combination is less than 20mm, preferably less than 10mm.

12. Tumble protector according to any one of claims 7 to 11, wherein the protector centring element further comprises one or more bearings to support the bushing or the pin and enable rotation of the bushing or the pin according to the rotation of the cathode, in particular around the rotation axis at the same speed as the cathode centring element.

13. A method for compensating for tumbling of a cathode rotating about an axis of rotation, comprising:

rotating the cathode about the axis of rotation,

the cathode is centered at the axis of rotation with a protector centering element spaced from the cathode at least during a first period of time.

14. The method of claim 13, further comprising:

a non-contact force is applied between the protector centering element and a cathode centering element mounted at the free end of the cathode to center the cathode, the force being continuously applied during rotation of the cathode.

15. The method of claim 14, further comprising

Centering the cathode at the axis of rotation during rotation of the cathode by the non-contact force so as to counteract and/or reduce the tumbling motion of the cathode, the force being applied magnetically.

16. The method of claim 13, further comprising

A contact force is applied between the protector centering element and a cathode centering element mounted at the free end of the cathode to center the cathode, the force being applied at least during a second period of time during which the protector centering element engages/interacts with the cathode centering element.

17. The method of claim 16, further comprising

The force is mechanically applied by the contact force applied during the second period of time centering the cathode at the axis of rotation during rotation of the cathode to counteract and/or reduce the tumbling motion of the cathode.

18. A deposition apparatus, comprising:

at least one cathode having: a first end, the first end being a free end of the cathode; and a second end opposite the first end, the second end being a driven end of the cathode,

a cathode drive unit for rotating the at least one cathode about an axis of rotation; and

a roll protector according to any one of claims 1 to 12.

19. The deposition apparatus of claim 18, wherein the at least one cathode is configured to receive a target configured to sputter material toward a substrate.

20. The deposition apparatus of claims 18 and 19, further comprising

Two or more cathodes including respective drive units, an

A corresponding number of anodes per cathode,

the cathodes are arranged in a cantilever arrangement.

21. The deposition apparatus of claim 20, the deposition apparatus being a sputter deposition apparatus.