CN116435739A - W-band waveguide-strip line packaging structure - Google Patents
W-band waveguide-strip line packaging structure Download PDFInfo
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- CN116435739A CN116435739A CN202310414936.8A CN202310414936A CN116435739A CN 116435739 A CN116435739 A CN 116435739A CN 202310414936 A CN202310414936 A CN 202310414936A CN 116435739 A CN116435739 A CN 116435739A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 97
- 239000002184 metal Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 230000008054 signal transmission Effects 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 31
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000012858 packaging process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 78
- 238000013461 design Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 7
- 238000004088 simulation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Waveguides (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a W-band waveguide-strip line packaging structure, in the signal transmission process, a signal reaches a waveguide reflection cavity through a packaging substrate, the waveguide reflection cavity feeds the signal into an intermediate metal circuit layer to complete the conversion from waveguide transmission to strip line transmission, and then the signal is transmitted through a signal transmission via hole, and the signal is transmitted from the intermediate metal circuit layer to an upper surface metal circuit layer and then is transmitted into a chip; the waveguide-strip line packaging structure realizes the conversion from waveguide transmission to metal circuit layer transmission, minimizes the whole packaging loss, ensures the chip transmission performance, reduces the packaging process by adopting a plastic packaging mode, and reduces the packaging cost.
Description
Technical Field
The invention relates to the technical field of microwave packaging, in particular to a W-band waveguide-strip line packaging design.
Background
In the microwave radio frequency field, with the continuous increase of signal frequency, the loss in the transmission process will be larger and larger, and how to reduce the transmission loss of high-frequency signals is a key problem of the whole link.
Based on the characteristic of small waveguide transmission loss, the design is applied to the technical field of microwave packaging, and compared with the traditional packaging such as BGA, QFN and the like, the overall loss is greatly reduced.
The invention patent with the publication number of CN109449550A is used for explaining the W-band waveguide-strip line, is applied to radar, security inspection equipment and other complete equipment, and transmits signals through the design of strip line-coupling hole-metal patch-waveguide, and has the structural design defect that a multilayer board at least needs to adopt 4 layers of designs, so that the requirement on the processing of the coupling hole is very high, the processing technology and the structure are relatively complex, and the manufacturing cost is increased.
The invention patent with publication number of CN113871368A is aimed at millimeter wave packaging, and designs an airtight packaging structure and method, and the patent is applied to the technical field of millimeter wave packaging, and the transmission of signals is carried out through the design of a microstrip line-waveguide, so that an opening design is needed for a waveguide reflecting cavity, and when the plastic packaging is carried out, the signal insertion loss is large, and in addition, the ceramic packaging is adopted, so that the biggest defects are that the whole packaging process is complex and the cost is high.
Disclosure of Invention
The invention aims to provide a W-band packaging structure which meets the requirement of reducing loss, reduces packaging technology and reduces packaging cost.
In order to achieve the above object, the present invention provides a W-band waveguide-strip line package structure, comprising: a package structure and a waveguide reflective cavity;
the packaging structure comprises a packaging substrate and a plastic packaging chip;
the packaging substrate comprises metal circuit layers which are arranged in a stacked mode and dielectric layers which are arranged between adjacent metal circuit layers;
the plastic package chip is arranged on the package substrate;
the input radio frequency signals reach the waveguide reflecting cavity through the packaging substrate, and the waveguide reflecting cavity feeds the signals into the packaging substrate and reaches the plastic packaging chip.
Optionally, the metal circuit layer includes an upper surface metal circuit layer, an intermediate metal circuit layer and a lower surface metal circuit layer, a first dielectric layer is included between the upper surface metal circuit layer and the intermediate metal circuit layer, and a second dielectric layer is included between the intermediate metal circuit layer and the lower surface metal circuit layer.
Optionally, the waveguide reflection cavity is disposed on the upper surface metal circuit layer, the intermediate metal circuit layer includes an intermediate layer signal transmission line, and the first dielectric layer includes a signal transmission via hole.
Optionally, the upper surface metal line layer further includes a chip bonding structure for connecting the upper surface metal line layer and the chip.
Optionally, the die bonding structure includes a ball bonding structure.
Optionally, the upper surface metal line layer further includes an upper surface signal transmission line.
Optionally, the semiconductor package further comprises a metal connecting piece, wherein the metal connecting piece is arranged in the first dielectric layer and the second dielectric layer and is used for connecting the upper surface metal circuit layer, the middle metal circuit layer and the lower surface metal circuit layer.
Optionally, the metal connector surrounds at least the waveguide reflective cavity.
Optionally, the materials of the upper surface metal circuit layer, the middle metal circuit layer and the lower surface metal circuit layer all comprise copper, and the thickness interval is 15-18 μm.
Optionally, the package substrate is hollowed out on the signal transmission path.
Optionally, the packaging structure further includes a plastic package shell, and the plastic package shell is disposed on the packaging substrate and is used for packaging the chip.
Optionally, the plastic package shell is made of plastic materials with low dielectric constant and low tangent loss angle.
Optionally, the waveguide reflecting cavity is made of aluminum, and the surface of the waveguide reflecting cavity is tin-plated.
Optionally, the package substrate further includes an organic dielectric substrate, where the organic dielectric substrate is an organic substrate with a low dielectric constant and a low tangent loss angle.
Compared with the prior art, in the signal transmission process, an input radio frequency signal passes through the packaging substrate to reach the waveguide reflection cavity, and the waveguide reflection cavity feeds the signal into the packaging substrate and reaches the plastic package chip; the waveguide-strip line packaging structure realizes the conversion from waveguide transmission to metal circuit layer transmission, minimizes the whole packaging loss, ensures the chip transmission performance, reduces the packaging process and reduces the packaging cost.
Drawings
FIG. 1 is an exploded view of a W-band waveguide-stripline package in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram of a W-band waveguide-stripline package in accordance with an embodiment of the present invention;
FIG. 3 is a schematic diagram of an interlayer metal circuit layer structure in an embodiment of the invention;
FIG. 4 is a cross-sectional view of a W-band waveguide-stripline package in accordance with an embodiment of the present invention;
FIG. 5 is a diagram of simulation data of a W-band waveguide-microstrip line package structure design in the prior art;
fig. 6 is a diagram of simulation data of a design of a W-band waveguide-stripline package according to an embodiment of the present invention.
Detailed Description
The present invention will be described in more detail below with reference to the drawings, in which preferred embodiments of the invention are shown, it being understood that one skilled in the art can modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Referring to fig. 1-4, in an embodiment of the present invention, a waveguide-stripline package structure is provided, including: a package structure and a waveguide reflective cavity 3; the packaging structure comprises a packaging substrate 2 and a plastic packaging chip 1.
The packaging substrate 2 comprises metal circuit layers which are arranged in a stacked mode and a dielectric layer which is arranged between the adjacent metal circuit layers, and the plastic packaging chip 1 is arranged on the packaging substrate 2.
The input radio frequency signal passes through the packaging substrate 2 to reach the waveguide reflection cavity 3, and the waveguide reflection cavity 3 feeds the signal into the packaging substrate 2 and reaches the plastic package chip 1.
Specifically, the package substrate 2 includes an upper surface metal circuit layer 211, an intermediate metal circuit layer 212, and a lower surface metal circuit layer 213, a first dielectric layer 221 is disposed between the upper surface metal circuit layer 211 and the intermediate metal circuit layer 212, and a second dielectric layer 222 is disposed between the intermediate metal circuit layer 212 and the lower surface metal circuit layer 213.
The waveguide reflection cavity 3 is disposed on the upper surface metal line layer 211, the intermediate metal line layer 212 includes an intermediate layer signal transmission line 2121, and the first dielectric layer 221 includes a signal transmission via 231 therein.
The packaging structure further comprises a plastic packaging shell 5, wherein the plastic packaging shell 5 is arranged on the packaging substrate 2 and used for packaging the plastic packaging chip 1, and the waveguide reflecting cavity 3 is also packaged in the plastic shell 5.
Through the design of the 'waveguide-strip line' packaging structure, in the signal transmission process, signals are input from an external waveguide port 6, reach a waveguide reflection cavity 3 after passing through a packaging substrate 2, the waveguide reflection cavity 3 feeds the signals into an intermediate layer signal transmission line, namely a 'waveguide-strip line' transmission line 2121, the conversion of the signals from waveguide transmission to strip line transmission is completed, the signals continue to pass through the transmission of a signal transmission through hole 231, reach the upper surface metal line layer 211 and then are transmitted into the plastic package chip 1, the signals are output through a transmission structure (not shown) arranged in a mirror image mode after being processed, and the whole packaging loss is kept to be the minimum through the design of the 'waveguide-strip line' packaging structure, so that the chip transmission performance is ensured.
Specifically, the upper surface metal circuit layer 211 further includes a chip bonding structure for connecting the upper surface metal circuit layer 211 with the plastic package chip 1.
The bonding structure comprises a chip ball 11, the plastic package chip 1 is connected with the chip ball 11, the upper surface metal circuit layer 211 is contacted with the chip ball 11, and signals reach the inside of the plastic package chip 1 through the chip ball 11 for signal processing.
Further, the upper surface metal circuit layer 211 further includes an upper surface signal transmission line 2111, after the signal is transmitted through the signal transmission via hole 231, the signal is transmitted to the inside of the plastic package chip 1 after reaching the upper surface metal circuit layer 211 through the upper surface signal transmission line 2111.
In addition, the "waveguide-stripline" package structure further includes a metal connection member, where the metal connection member includes a grounding metal post 232 disposed in the dielectric layer 221 and the dielectric layer 222, and the upper surface metal line layer 211, the middle metal line layer 212, and the lower surface metal line layer 213 are connected by the grounding metal post 232.
The grounding metal posts 232 at least surround the waveguide reflection cavity 3, and a plurality of grounding metal posts 232 are arranged around the waveguide reflection cavity 3.
The waveguide reflection cavity 3 is a metal cavity, in this embodiment, specifically, an aluminum product with a tin-plated surface is used, and is fixedly disposed on the upper surface metal layer 211.
Specifically, the waveguide reflection cavity 3 is welded on the upper surface metal layer 211.
The package substrate 2 is an organic medium substrate, specifically an ultrahigh frequency application signal carrier, the organic medium substrate adopts an organic composite substrate with low dielectric constant (Dk is less than or equal to 3.7) and low tangent loss angle (Df is less than or equal to 0.003), such as GHPL-970, the Dk value is 3.4, the Df value is 0.003, and the thickness of two medium layers is 120 μm.
The plastic package shell 5 is made of plastic materials with low dielectric constant (Dk is less than or equal to 3.7) and low tangent loss angle (Df is less than or equal to 0.003), for example, R4212 is 3.4 in Dk and 0.009 in Df.
The upper surface metal circuit layer 211, the middle metal circuit layer 212, the lower surface metal circuit layer 213 and the grounding metal posts 232 are all made of pure copper, and the thickness interval of the metal circuit layers is 15-18 μm, and in this embodiment, the thickness of the metal circuit layers is preferably 17 μm.
In addition, the metal circuit layer of each layer is hollowed on the path of the signal fed in by the waveguide reflection cavity 3, so that the barrier-free transmission of the signal is ensured.
The whole substrate comprises other direct current signal or low frequency signal interfaces, the output form is not the waveguide port output any more, and is the common output I/O port, such as BGA solder ball form.
With continued reference to fig. 3, in the embodiment of the present invention, the intermediate layer signal transmission line 2121 of the "waveguide-stripline" and the waveguide reflection cavity 3 form a transmission structure of the "waveguide-stripline", so as to complete the conversion of the signal from the external air waveguide 6 to the internal transmission line, the dimensions of the transmission line 2121 are matched according to different frequency bands, such as different line widths of 0.1mm,0.15mm,0.2mm, etc., and the specific dimensions of the branch length and width also need to be adapted according to different frequencies, such as 0.3 x 0.5mm,0.5 x 1.0mm, etc., and in the embodiment of the present invention, the preferred transmission length and width is 0.1 x 2mm, and the branch length and width is 0.45 x 0.9mm.
With continued reference to fig. 4, the waveguide reflection cavity 3 is hollowed, and the hollowed dimensions are designed according to different frequencies of the W-band.
Different frequency bands are hollowed out according to different sizes, in other embodiments, the sizes are changed according to the actual application frequency bands, the lengths and the widths correspond to the waveguide sizes of the corresponding frequency bands, and the heights are determined according to actual simulation.
In the embodiment of the invention, a 75-110 GHz wave band is applied, and preferably, the cavity hollowing size is 2.4 x 1.2 x 1mm, and the chamfer angle is 0.5mm, which is the minimum chamfer angle size for machining.
In addition, in the present invention, the upper, middle and lower metal circuit layers need to be hollowed out according to the projection size of the waveguide reflection cavity 3, and the middle metal circuit layer 212 not only includes the special structural design of the transmission line, but also needs to be hollowed out.
In the embodiment of the invention, the air waveguide size is not the standard waveguide size, the design can greatly improve the design efficiency of products, the air waveguide size is smaller than the standard waveguide size according to different product designs, the size can be customized, and the adaptation is carried out according to the practical application frequency band, in the embodiment of the invention, 75-110 GHz wave bands are applied, preferably, the waveguide size is 2.4 x 1.2mm, and the chamfer angle is 0.5mm. Other frequency bands, for example, 95 GHz-140 GHz bands, have waveguide dimensions of 2 x 1mm.
In addition, the packaged chip is welded in a Printed Circuit Board (PCB) through the packaging ball 4, and radio frequency signals of the PCB can be transmitted in the form of an external waveguide 6, so that loss brought by the whole product is further reduced.
Referring to fig. 5, fig. 5 shows simulation results of a "waveguide-microstrip line" design adopted in the existing design, and the difference between the simulation results and the scheme of the present invention is that the signal transmission line in the existing design is a metal line layer on the upper surface, the waveguide reflection cavity needs to avoid an opening design for the transmission line, and as can be seen from fig. 5, the S11 standing wave effect of the whole link is good, but the insertion loss S21 effect is poor, so that the signal transmission line cannot be used; the main reason for this result is that the molding compound is in direct contact with the transmission line, and the design of the opening left by the waveguide reflective cavity also fills the molding compound, so that the absorption of the signal by the molding compound causes the loss of the signal to be extremely large in the transmission process.
Referring to fig. 6, fig. 6 shows simulation results of a waveguide-stripline structure in the embodiment of the present invention, and simulation data shows that the standing wave S11 and the insertion loss S21 are very good, especially in the range of 75 GHz-81 GHz in the frequency band used in the embodiment of the present invention, the standing wave S11< -12dB and the insertion loss S21<0.8dB.
To sum up, in the embodiment of the present invention, the radio frequency signal is input from the external waveguide 6, reaches the waveguide reflection cavity 3 through the substrate 2, the waveguide reflection cavity 3 feeds the signal into the intermediate layer signal transmission line, that is, the "waveguide-strip line" transmission line 2121, the transition of the "waveguide-strip line" signal is completed, the signal continues to be transmitted to the upper surface signal transmission line 2111 through the signal transmission via 231, the upper surface metal line layer 211 contacts with the chip ball 11, the signal reaches the inside of the plastic package chip 1 through the chip ball 11 for signal processing, the signal output path is the same as the input path, and the signal is output through the mirror structure (not shown).
In addition, in the implementation of the invention, the plastic package chip 1 is connected with the upper surface metal circuit layer 211 through the pre-packaged chip ball 11, is connected with the middle layer waveguide-strip line transmission line 2121 through the signal transmission via hole 231, and the strip line probe and the waveguide reflection cavity form a special transmission structure to realize the signal transmission of the W wave band, and the scheme of the invention realizes the conversion of the signal transmission from the waveguide to the metal circuit layer transmission, and can realize the signal transmission of different frequency bands by changing the structural size of the waveguide reflection cavity and the size of the transmission line probe, and in the structures of the dielectric substrate and the plastic package, the dielectric substrate adopts an organic composite substrate, so the material cost is low, the process is simple, and the processing time is short; the plastic package shell is made of plastic, so that compared with metal package, the plastic package shell is low in material cost and short in processing time, package design and package technology are simplified, and the processing period and cost of the whole product are greatly improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (14)
1. A W-band waveguide-strip line package structure, comprising: a package structure and a waveguide reflective cavity;
the packaging structure comprises a packaging substrate and a plastic packaging chip;
the packaging substrate comprises metal circuit layers which are arranged in a stacked mode and dielectric layers which are arranged between adjacent metal circuit layers;
the plastic package chip is arranged on the package substrate;
the input radio frequency signals reach the waveguide reflecting cavity through the packaging substrate, and the waveguide reflecting cavity feeds the signals into the packaging substrate and reaches the plastic packaging chip.
2. The W-band waveguide-stripline package of claim 1, wherein the metal line layers comprise an upper surface metal line layer, an intermediate metal line layer, and a lower surface metal line layer, a first dielectric layer being included between the upper surface metal line layer and the intermediate metal line layer, and a second dielectric layer being included between the intermediate metal line layer and the lower surface metal line layer.
3. The W-band waveguide-stripline package of claim 2, wherein the waveguide reflective cavity is disposed on the upper surface metal line layer, the intermediate metal line layer comprising an intermediate layer signal transmission line, the first dielectric layer comprising a signal transmission via.
4. The W-band waveguide-stripline package of claim 2, wherein the upper surface metal line layer further comprises a die bonding structure for connecting the upper surface metal line layer with the die.
5. The W-band waveguide-stripline package of claim 4, wherein the die bond structure comprises a ball bond structure.
6. The W-band waveguide-stripline package of claim 2, wherein the upper surface metal line layer further comprises an upper surface signal transmission line.
7. The W-band waveguide-stripline package structure of claim 2, further comprising a metal connector disposed in the first dielectric layer and the second dielectric layer for connecting the upper surface metal line layer, the intermediate metal line layer and the lower surface metal line layer.
8. The W-band waveguide-stripline package of claim 7, wherein the metal connection surrounds at least the waveguide reflective cavity.
9. The W-band waveguide-stripline package of claim 2, wherein the upper surface metal wiring layer, the intermediate metal wiring layer and the lower surface metal wiring layer each comprise copper and have a thickness in the range of 15-18 μm.
10. The W-band waveguide-stripline package structure of claim 1, wherein the package substrate is hollowed out in a signal transmission path.
11. The W-band waveguide-stripline package structure of claim 1, further comprising a plastic package housing disposed on the package substrate for packaging a chip.
12. The W-band waveguide-stripline package of claim 11, wherein the plastic package housing is a low dielectric constant, low tan delta plastic material.
13. The W-band waveguide-stripline package of claim 1, wherein the waveguide reflective cavity is of aluminum material and has a surface tin-plated structure.
14. The W-band waveguide-stripline package structure of claim 1, wherein the package substrate further comprises an organic dielectric substrate, wherein the organic dielectric substrate is a low dielectric constant, low tangent loss organic substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2022113363525 | 2022-10-28 | ||
| CN202211336352 | 2022-10-28 |
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| Publication Number | Publication Date |
|---|---|
| CN116435739A true CN116435739A (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310414936.8A Pending CN116435739A (en) | 2022-10-28 | 2023-04-18 | W-band waveguide-strip line packaging structure |
| CN202310888902.2A Pending CN117031242A (en) | 2022-10-28 | 2023-07-19 | W-band waveguide port output chip testing system and testing method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310888902.2A Pending CN117031242A (en) | 2022-10-28 | 2023-07-19 | W-band waveguide port output chip testing system and testing method |
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| CN (2) | CN116435739A (en) |
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2023
- 2023-04-18 CN CN202310414936.8A patent/CN116435739A/en active Pending
- 2023-07-19 CN CN202310888902.2A patent/CN117031242A/en active Pending
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| CN117031242A (en) | 2023-11-10 |
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