CN116413574A - Probe plate, wafer test card, wafer test system and wafer test method - Google Patents

Abstract

A probe board, a wafer detection card, a wafer testing system and a wafer testing method, wherein a new probe board can be used to debug the relative positions of test probes and wafer solder balls, and the new probe board is used for Carrying out pin position detection on the wafer to be tested, including: one or more positioning holes, the positioning holes are used to determine the first preset pin position on the wafer to be tested; probes, the probes are used for It is connected with the second preset pin position on the wafer to be tested. In the new probe tray, the positioning hole is used to replace the existing virtual probe. The positioning hole is a through hole obtained after hollowing out. The positioning hole will not be displaced due to cleaning and other reasons, which can solve the problem of the existing virtual probe. The problem of inaccurate limit due to displacement.

Description

Probe plate, wafer test card, wafer test system and wafer test method

technical field

The invention relates to the field of wafer testing, in particular to a probe plate, a wafer testing card, a wafer testing system and a wafer testing method.

Background technique

Wafer test card, also known as wafer test card, probe card (probe card), probe test card, is the interface between the chip under test (chip) and the tester in wafer test (wafer test), It is mainly used in the preliminary measurement of the electrical performance of the chip before the chip is packaged in slices, and after screening out the bad chips, the subsequent packaging project is carried out.

Existing probe cards include probe discs, which can also be called integrated circuit (Integrated Circuit, IC for short) slots/sockets (sockets), which are test fixtures often used by test engineers. The quality of the chip is directly related to the progress of chip debugging, the cost of mass production testing and the efficiency of testing.

The probe board generally includes probes connected to one or more needle positions on the wafer, and also includes virtual probes for limiting the needle positions on the wafer. However, the virtual probes on the existing probe tray are easy to shift due to cleaning and other reasons, resulting in inaccurate limit positions and affecting wafer testing.

Contents of the invention

The technical problem solved by the present invention is how to provide a new probe disc to solve the displacement problem of the virtual probe in the existing probe disc.

In order to solve the above technical problems, an embodiment of the present invention provides a probe tray, which is used for needle position detection of the wafer to be tested, and includes: one or more positioning holes, the positioning holes are used to determine the position of the wafer to be tested. The first preset pin position on the wafer to be tested; the probe, the probe is used to connect with the second preset pin position on the wafer to be tested.

Optionally, the probe tray includes at least two sets of positioning holes, and different sets of positioning holes are used to determine the first preset pin positions at different positions on the wafer to be tested.

Optionally, the probe plate includes an observation board and a probe board, the positioning holes are located on the observation board, and the probes are located on the probe board; the observation board also includes an observation window, the The observation window is used to determine the observation information of the wafer to be tested.

Optionally, the probe tray includes at least two observation boards, and observation windows of different detection boards are used to determine observation information at different positions on the wafer to be tested.

Optionally, the observation plate is detachably connected to the probe tray, or the observation plate and the probe tray are integrally formed.

In order to solve the above-mentioned technical problems, an embodiment of the present invention also provides a wafer inspection card, including a substrate and a probe tray as described in any one of the above; the substrate is provided with a control module, a signal generation module and a signal acquisition module ; The control module is used to control the test of the wafer to be tested and the operation of the signal generation module and the signal acquisition module; the signal generation module is used to generate the required test signal for testing, and pass the test signal through the probe The needle is transmitted to the wafer to be tested; the signal acquisition module is used to collect the feedback signal of the wafer to be tested.

In order to solve the above technical problems, an embodiment of the present invention also provides a wafer test system, the wafer test system includes: the above-mentioned wafer test card; testing the wafer; a control terminal, the control terminal is connected to the wafer test bench, the control terminal is also connected to the wafer detection card, so as to control the test of the wafer detection card through the control module, And receive the feedback signal collected by the signal collection module.

Optionally, the wafer testing system further includes an image acquisition device, configured to acquire a first positional relationship between the positioning hole and the first preset needle position, and send the first positional relationship to The control terminal; the control terminal is also used to adjust the position of the wafer to be tested on the wafer test bench according to the first position relationship and the received feedback signal.

Optionally, the probe tray includes at least 2 sets of positioning holes, and the image acquisition device is used to capture the second positional relationship between different sets of positioning holes and the first preset pin positions at different positions on the wafer to be tested , and send the second positional relationship to the control terminal; the control terminal is also used to determine the angle between the wafer to be tested and the probe plate according to the second positional relationship, and adjusting the position of the wafer to be tested on the wafer testing platform according to the determined included angle.

Optionally, the probe tray includes at least two observation boards, and the image acquisition device is used to collect a third positional relationship between observation windows of different observation boards and observation information at different positions on the wafer to be tested , and send the third positional relationship to the control terminal; the control terminal is used to determine the angle between the wafer to be tested and the probe plate according to the third positional relationship, and according to The determined included angle adjusts the position of the wafer to be tested on the wafer testing platform.

In order to solve the above technical problems, an embodiment of the present invention also provides a wafer testing method based on any one of the wafer testing systems described above, the method comprising: placing the wafer to be tested on a wafer testing platform; Connect the control terminal to the wafer test bench, and connect the control terminal to the above-mentioned wafer detection card; the control terminal controls the wafer detection card through the control module on the wafer detection card Test, and receive the feedback signal collected by the signal acquisition module on the wafer detection card.

Optionally, the method further includes: connecting the control terminal to an image acquisition device; using the image acquisition device to acquire a first positional relationship between the positioning hole and the first preset needle position , and send the first positional relationship to the control terminal; adjust the wafer to be tested on the wafer test bench according to the first positional relationship and the received feedback signal through the control terminal position on the

Optionally, the probe tray includes at least two sets of positioning holes, and the method further includes: collecting different sets of positioning holes and first preset pin positions at different positions on the wafer to be tested by the image acquisition device The second positional relationship, and send the second positional relationship to the control terminal; determine the clamp between the wafer to be tested and the probe tray according to the second positional relationship through the control terminal angle, and adjust the position of the wafer to be tested on the wafer test bench according to the determined included angle.

Optionally, the probe tray includes at least two observation boards, and the method further includes: using the image acquisition device to collect the difference between the observation windows of different observation boards and the observation information of different positions on the wafer to be tested the third positional relationship, and send the third positional relationship to the control terminal; the control terminal is used to determine the distance between the wafer to be tested and the probe tray according to the third positional relationship angle, and adjust the position of the wafer to be tested on the wafer test bench according to the determined angle.

Compared with the prior art, the technical solutions of the embodiments of the present invention have the following beneficial effects:

The embodiment of the present invention provides a new probe plate, which is used for needle position detection of the wafer to be tested, including: one or more positioning holes, and the positioning holes are used to determine the position of the wafer to be tested. A first preset pin position on the wafer; a probe, and the probe is used to connect with a second preset pin position on the wafer to be tested. In the probe plate of the embodiment of the present invention, the positioning holes are used to replace the existing virtual probes, and the positioning holes are physical holes (for example, can be through holes obtained after hollowing out), compared with the existing virtual probes in the prior art The virtual probe, the positioning hole will not shift due to cleaning and other reasons, which can solve the problem of inaccurate limit caused by the displacement of the existing virtual probe.

Further, based on the new probe tray provided by the embodiment of the present invention, it can be applied to a wafer inspection card. In addition to the new probe tray, the wafer inspection card can also include a control module, a signal generation module and a The substrate of modules such as signal acquisition modules. The wafer testing card is connected with the wafer to be tested to perform wafer testing.

Furthermore, the wafer test card is a part of the wafer test system, which may also include a wafer test bench, a control terminal, etc., to execute the entire process of wafer test.

Further, an embodiment of the present invention also provides a wafer testing method, which is executed based on the above-mentioned wafer testing system.

Description of drawings

Fig. 1 is a top view of the surface of a probe disc in the prior art;

FIG. 2 is an enlarged schematic view of a region 102 of the probe plate of FIG. 1;

FIG. 3 is a top view of the surface of the first probe disc according to an embodiment of the present invention;

FIG. 4 is an enlarged schematic view of a region 302 of the probe disc 30 in FIG. 3;

5 is a top view of the surface of the second probe disc according to the embodiment of the present invention;

6 is a schematic diagram of a wafer detection card according to an embodiment of the present invention;

7 is a schematic diagram of a wafer testing system according to an embodiment of the present invention;

FIG. 8 is a flowchart of a wafer testing method according to an embodiment of the present invention.

Detailed ways

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a top view of the surface of a probe disc 10 in the prior art, and FIG. 2 is an enlarged schematic view of a region 102 of the probe disc 10 in FIG. 1 .

The probe pad 10 may include probes 101 and virtual probes for detecting the positions of pads (pads) or bumps (bumps) on the wafer (or chip) to be tested, and the virtual probes are located on the probe pad 10 in the area 102 of . Figure 1 shows a schematic diagram of multiple groups of probes 101, only two groups are marked in the figure, and the virtual probes can be one or more preset pads (pads) or bumps (bumps) on the wafer to be tested. ), the virtual probe corresponds to the pad/bump/solder ball it detects one by one. In FIG. 2, the area 102 includes 4 virtual probes, wherein the virtual probe 1021 is taken as an example for illustration, the tip of the virtual probe 1021 is in contact with the pad/bump/solder ball 20 on the wafer to be tested, At this time, the position of the pad/bump/solder ball 20 can be determined.

The probe tray 10 and the control circuit constitute a wafer inspection card. The principle of using the wafer inspection card is to use the virtual probe 1021 to determine the position of the pad/bump/solder ball on the wafer chip to be tested, and then connect the probe 101 to the pad/bump on the wafer chip to be tested. Bump/ball direct contact. An excitation signal is input to the wafer detection card through an automatic test equipment (ATE for short), and the wafer to be tested outputs a response based on the excitation signal as a measurement signal of the wafer to be tested. Cooperate with testing equipment and software control to realize the purpose of automatic measurement of the wafer to be tested based on the measurement signal.

In the field of chip testing, it is mainly divided into two parts of testing: the chip probe (ChipProbe, CP for short) test and the final test (Final Test, FT for short) performed after the chip is packaged. The probe discs mentioned in the present invention are used to perform FT tests. After the chip packaging is completed, a wafer level test (Wafer Level Test, WLT for short) is required.

As mentioned in the background art, the virtual probes on the existing probe tray are easy to shift due to reasons such as cleaning, which leads to inaccurate positioning and affects wafer testing.

In order to solve the above problems, the embodiment of the present invention provides a new probe plate, which is used for needle position detection of the wafer to be tested, including: one or more positioning holes, the positioning holes are used for Determining a first preset pin position on the wafer to be tested; a probe, the probe is used to connect to a second preset pin position on the wafer to be tested. In the new probe tray, the positioning hole is used to replace the virtual probe in the existing probe tray. The positioning hole is a through hole obtained after hollowing out. The positioning hole will not be displaced due to cleaning and other reasons, which can solve the existing problem. The problem of inaccurate limit of virtual probe due to displacement.

Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a top view of the surface of the first probe disc 30 according to the embodiment of the present invention, and FIG. 4 is an enlarged schematic view of a region 302 of the probe disc 30 in FIG. 3 .

The probe tray 30 is used for needle position detection on the wafer to be tested, and the probe tray 30 may include positioning holes 301 and probes 101 . in:

The probe plate 30 may include one or more positioning holes 301, and the multiple positioning holes 301 may be represented as 301(1),...,301(n), where n is a positive integer greater than or equal to 1, as shown in FIG. 4 16 positioning holes are provided, that is, n=16. One or more positioning holes 301 are located in a region 302 on the probe plate 30 .

Optionally, the single positioning hole 301 can be a circular or square, hexagonal or other through hole, which can be obtained by hollowing out one surface of the probe plate. The positioning hole 301 is used to determine a first preset pin position on the wafer to be tested. The probes 101 are used to connect with the second preset pin positions on the wafer to be tested. Wherein, the number of the probes 101 can be one or more. Optionally, the probes 101 are in one-to-one correspondence with the second preset needle positions.

Wherein, the pin position on the wafer to be tested refers to the solder pad/bump/solder ball, and the first preset pin position and the second preset pin position can be the same pin position or different pin positions .

Optionally, when the wafer to be tested is tested, the wafer to be tested is placed under the surface of the probe disc 30 in FIG. Alignment, at this time, the first preset needle position on the wafer to be tested can be seen through the positioning hole 301 from the direction overlooking the surface of the probe plate 30 . Optionally, the positioning holes 301 correspond to the first preset pin positions one by one, and a first preset pin position on the wafer to be tested is observed through each positioning hole 301. At this time, it can be determined that the probe 302 can Accurately connect with the second preset pin position on the wafer to be tested, so as to successfully derive the measurement signal of the wafer to be tested. Further, when it is observed through each positioning hole 301 that the corresponding first preset needle position on the wafer to be tested is in the center of the positioning hole 301, then determine the probe 302 and the second preset needle position on the wafer to be tested. The pin position is accurately connected.

For other structures and principles of the new probe disc (namely the probe disc 30 shown in FIG. 3 and FIG. 4 ), please refer to the relevant description of the probe disc 10 in FIG. 1 and FIG. 2 , which will not be repeated here.

In the new probe tray, the positioning hole is used to replace the existing virtual probe. The positioning hole is a through hole obtained after hollowing out. The positioning hole will not be displaced due to cleaning and other reasons, which can solve the problem of the existing virtual probe. The problem of inaccurate limit due to displacement.

In one embodiment, the probe tray 30 includes at least two sets of positioning holes 301 , and different sets of positioning holes 301 are used to determine the first preset pin positions at different positions on the wafer to be tested.

Please refer to FIG. 5. FIG. 5 is a top view of the surface of the second type of probe disc 50 according to the embodiment of the present invention. The probe disc 50 includes three sets of positioning holes, area 302(1), area 302(2) and area 302( 3) each includes a group of positioning holes, and each group of positioning holes can include one or more positioning holes, the area 302 (1), the area 302 (2) and the area 302 (3) are the same as the areas in Fig. 3 and Fig. 4 302 is the same. The detailed description of each set of positioning holes can be found in Fig. 3 and Fig. 4 .

In this embodiment, each group of positioning holes corresponds to the first preset pin position of a region on the wafer to be tested, and the distance between different groups of positioning holes can be increased. When the wafer to be tested is placed under the surface of the probe disc 50 in FIG. A preset pin position, thereby judging whether the plane where the pin position on the wafer to be tested is parallel to the surface of the probe plate 50 . Generally speaking, when the two are parallel, it can be determined that the probe can be accurately connected to the second preset pin position on the wafer to be tested, so as to successfully derive the measurement signal of the wafer to be tested. When the plane where the needle position on the wafer to be tested is not parallel to the surface of the probe plate 50, there is a certain angle between the two, and the first position of different regions on the wafer to be tested can be seen according to different groups of positioning holes. In the case of a preset pin position, determine the included angle, and adjust the position of the wafer to be tested or the probe disc based on the included angle, so that the plane where the pin position on the wafer to be tested is at the same level as the probe disc 50 The surface is parallel to meet the test requirements.

In one embodiment, the probe plate includes an observation board and a probe board, the positioning holes are located on the observation board, and the probes are located on the probe board; the observation board also includes an observation window , the observation window is used to determine the observation information of the wafer to be tested.

Optionally, the probe tray includes at least two observation boards, and observation windows of different detection boards are used to determine observation information at different positions on the wafer to be tested.

Please refer to Figures 3 to 5 again. The observation plate refers to the area where the positioning holes on the probe plate are located. The observation plate can correspond to the area 302 in Figures 3 and 4, and can also correspond to area 302(1) and area 302 in Figure 5 (2) and region 302(3). Multiple observation boards may be included in one probe tray, for example, for the probe tray 50 in FIG. Region 302(3). The probe plate is the other area on the probe plate except the observation plate.

Each observation plate may include an observation window, the observation window may refer to the area 303 in FIG. 4 , and the observation window may be used to observe the observation information of the wafer to be tested, and the observation information may include information such as brand or logo. The observation window can be a through hole obtained by hollowing out one surface of the probe plate. Optionally, the area of the through hole of the observation window can be larger than that of a single positioning hole.

It should be noted that when the probe tray contains more than one observation board, the distribution of probes on each observation board can be the same or different, and each observation board can have observation windows, or only one or several observation boards can have observation windows. Observation window.

In one embodiment, the observation board is detachably connected to the probe tray, or the observation board and the probe tray are integrally formed.

The probe plate 30 in FIG. 3 is taken as an example for illustration below: when the observation plate 302 and the probe plate 30 are integrally formed, the surface of the probe plate 30 in FIG. 3 can be produced at one time by injection molding process, saving installation cost. When the observation plate 302 is detachably connected to the probe plate 30, the observation plate 302 on the probe plate 30 can be replaced according to the test requirements, or when the observation plate 302 is damaged, only the observation plate can be replaced, which saves Maintenance costs.

Please refer to FIG. 6. FIG. 6 is a schematic diagram of a wafer inspection card 60 according to an embodiment of the present invention. The wafer inspection card 60 includes a substrate (not shown) and any one of the probe trays in FIGS. 3 to 5 ( That is, probe disc 30 or probe disc 50, represented by 30/50 in FIG. Control the test of the wafer to be tested and the operation of the signal generation module and the signal acquisition module; the signal generation module 6012 is used to generate the test signal required for the test, and transmit the test signal to the test signal through the probe. Testing the wafer; a signal collection module 6013, configured to collect the feedback signal of the wafer to be tested.

Specifically, the substrate is a shell structure for carrying modules such as the control module 6011 , the signal generating module 6012 and the signal collecting module 6013 . The probe plate 30/50 is connected to the substrate, so as to establish electrical connection with various modules connected to different positions on the substrate through the substrate.

Optionally, a power supply module 6014 and a communication module 6015 may also be provided on the substrate. The power supply module 6014 is used to connect an external power supply and supply power to the entire wafer detection card 60. The communication module 6015 may include an external communication interface through which the wafer detection card 60 can communicate with control terminals and other equipment. Control terminals can include computers, test instruments, mobile phones and other equipment.

In a specific embodiment, when the wafer to be tested is tested using the wafer inspection card 60 , the probes on the probe board 30 / 50 are connected to the second preset pin positions of the wafer to be tested. The control module 6011 controls the entire testing process. The signal generation module 6012 generates the test signal required for testing, and transmits the test signal to the wafer to be tested through the probe, and collects the feedback signal of the wafer to be tested through the signal acquisition module 6013 (also That is, the above-mentioned measurement signal). The communication module 6015 transmits the feedback signal to the control terminal, and the control terminal obtains the test result of the wafer to be tested based on the feedback signal.

For more details about the working principle and working mode of the wafer inspection card 60 , you can refer to the related descriptions in FIGS. 1 to 5 above, which will not be repeated here.

Please refer to FIG. 7, FIG. 7 is a schematic diagram of a wafer testing system 70 according to an embodiment of the present invention, and the wafer testing system 70 includes: the wafer testing card 60 in FIG. 6, a wafer testing platform 701, and a control terminal 702. Wherein, the wafer test bench 701 is used to carry the wafer to be tested; the control terminal 702 is connected with the wafer test bench 701, and the control terminal 702 is also connected with the wafer detection card 60 to pass through the control module (the control module 6011 in FIG. 6 ) controls the test of the wafer inspection card 60 and receives the feedback signal collected by the signal acquisition module (the signal acquisition module 6013 in FIG. 6 ).

In an embodiment of the wafer testing system 70, the wafer testing system 70 may also include an image acquisition device 703 for acquiring a first positional relationship between the positioning hole and the first preset needle position , and send the first positional relationship to the control terminal; the control terminal 702 is also used to adjust the position of the wafer to be tested on the wafer according to the first positional relationship and the received feedback signal. Position on circular test bench 701.

The image acquisition device 703 may include a camera or video camera and other devices capable of image acquisition. The image acquisition device 703 is used to collect the top view of the probe plate 30/50. Further, it is used to collect the top view of the area where the positioning hole is located. When the circle is placed under the surface of the probe disc 30 / 50 , the first positional relationship between the positioning hole and the first preset needle position can be acquired by the image acquisition device 703 . The image acquisition device 703 can send the collected image or video to the control terminal 702, and the control terminal 702 determines whether the probe on the probe disk 30/50 can be connected to the first position on the wafer to be tested according to the first positional relationship in the image. The two preset needle positions are connected accurately.

In another embodiment of the wafer testing system 70, the probe tray 30/50 includes at least 2 sets of positioning holes, and the image acquisition device 703 is used to capture different sets of positioning holes different from those on the wafer to be tested. The second positional relationship of the first preset needle position of the position, and send the second positional relationship to the control terminal 702; the control terminal 702 is also used to determine the to-be-tested position according to the second positional relationship the angle between the wafer and the probe plate, and adjust the position of the wafer to be tested on the wafer testing platform 701 according to the determined angle.

Wherein, the second positional relationship is the positional relationship between different groups of positioning holes recorded in the image or video captured by the image acquisition device 703 at a certain moment and the first preset pin positions at different positions on the wafer to be tested, The control terminal 702 can determine the angle between the wafer to be tested and the probe plate based on the second positional relationship, so as to determine whether the plane where the needle position on the wafer to be tested is located is parallel to the surface of the probe plate, if not parallel , the control terminal 702 can adjust the position of the wafer to be tested on the wafer test table 701 so that the plane where the pin positions on the wafer to be tested is parallel to the surface of the probe plate to meet the test requirements.

In yet another embodiment of the wafer testing system 70, the probe tray includes at least two observation boards, and the image acquisition device 703 is used to collect observation windows of different observation boards and different positions on the wafer to be tested. The third positional relationship between the observation information, and the third positional relationship is sent to the control terminal 702; the control terminal 702 is used to determine the wafer to be tested and the wafer to be tested according to the third positional relationship and adjust the position of the wafer to be tested on the wafer testing platform 701 according to the determined angle.

Wherein, the third positional relationship is the positional relationship between different observation windows recorded in images or videos collected by the image acquisition device 703 at a certain moment and observation information at different positions on the wafer to be tested, and the control terminal 702 can be based on The third positional relationship determines the angle between the wafer to be tested and the probe plate, to determine whether the plane where the needle position on the wafer to be tested is located is parallel to the surface of the probe plate, if not parallel, the control terminal 702 can By adjusting the position of the wafer to be tested on the wafer test platform 701 , the plane where the pins on the wafer to be tested are located is parallel to the surface of the probe plate, so as to meet the test requirements.

For more details about the working principle and working mode of the wafer testing system 70 , reference may be made to the relevant descriptions in FIGS. 3 to 6 above, and details will not be repeated here.

Please refer to FIG. 8. FIG. 8 is a flowchart of a wafer testing method according to an embodiment of the present invention. The wafer testing method is executed based on the wafer testing system 70 described in FIG. 7, and the method includes the following steps:

Step S801, placing the wafer to be tested on the wafer test bench;

Step S802, connecting the control terminal with the wafer test bench, and connecting the control terminal with the above-mentioned wafer test card;

Step S803, the control terminal controls the testing of the wafer testing card through the control module on the wafer testing card, and receives the feedback signal collected by the signal acquisition module on the wafer testing card.

In one embodiment, the wafer testing method may further include: connecting the control terminal with an image acquisition device; The first positional relationship among them, and send the first positional relationship to the control terminal; through the control terminal, adjust the position of the wafer to be tested according to the first positional relationship and the received feedback signal position on the wafer test bench.

In one embodiment, the probe tray includes at least 2 sets of positioning holes, and the wafer testing method may further include: collecting images of different sets of positioning holes and different positions on the wafer to be tested by the image acquisition device. The second positional relationship of the first preset needle position, and send the second positional relationship to the control terminal; determine the wafer to be tested and the probe according to the second positional relationship by the control terminal the angle between the dials, and adjust the position of the wafer to be tested on the wafer testing platform according to the determined angle.

In one embodiment, the probe tray includes at least two observation boards, and the wafer testing method may further include: collecting observation windows of different observation boards different from those on the wafer to be tested by the image acquisition device. The third position relationship between the observation information of the position, and the third position relationship is sent to the control terminal; the control terminal is used to determine the wafer to be tested and the wafer to be tested according to the third position relationship and adjusting the position of the wafer to be tested on the wafer testing platform according to the determined angle.

For more information about the working principle and working method of the wafer testing method in FIG. 8 , refer to the relevant description of the wafer testing system 70 in FIG. 7 above, and details will not be repeated here.

It should be understood that the term "and/or" in this article is only an association relationship describing associated objects, indicating that there may be three relationships, for example, A and/or B may mean: A exists alone, and A and B exist at the same time , there are three cases of B alone. In addition, the character "/" in this article indicates that the contextual objects are an "or" relationship.

"Multiple" appearing in the embodiments of the present application means two or more.

The first, second, etc. descriptions that appear in the embodiments of this application are only for illustration and to distinguish the description objects, and there is no order, nor does it represent a special limitation on the number of devices in the embodiments of this application, and cannot constitute a limitation on the number of devices in this application. Any limitations of the examples.

The "connection" in the embodiment of the present application refers to various connection modes such as direct connection or indirect connection to realize communication between devices, which is not limited in the embodiment of the present application.

Although the present invention is disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention should be based on the scope defined in the claims.

Claims (14)

1. a kind of probe plate, described probe plate is used for wafer to be tested to carry out needle position detection, is characterized in that, comprises: One or more positioning holes, the positioning holes are used to determine the first preset pin position on the wafer to be tested; Probes, the probes are used to connect with the second preset pin positions on the wafer to be tested. 2. The probe disc according to claim 1, wherein the probe disc comprises at least 2 sets of positioning holes, and different sets of positioning holes are used to determine the first predetermined position of different positions on the wafer to be tested. Set needle position. 3. The probe tray according to claim 1, wherein the probe tray includes an observation board and a probe board, the positioning holes are located on the observation board, and the probes are located on the probe board. board; The observation board further includes an observation window for determining observation information of the wafer to be tested. 4. The probe disk according to claim 3, wherein the probe disk comprises at least 2 observation boards, and the observation windows of different detection boards are used to determine the observation information of different positions on the wafer to be tested . 5. The probe plate according to claim 3 or 4, wherein the observation plate is detachably connected to the probe plate, or the observation plate and the probe plate are integrally formed. 6. A wafer inspection card, characterized in that it comprises a substrate and the probe plate according to any one of claims 1 to 5; The substrate is provided with a control module, a signal generation module and a signal acquisition module; The control module is used to control the test of the wafer to be tested and the operation of the signal generation module and the signal acquisition module; The signal generating module is used to generate test signals required for testing, and transmit the test signals to the wafer to be tested through the probes; The signal collection module is used to collect the feedback signal of the wafer to be tested. 7. A wafer testing system, characterized in that the wafer testing system comprises: The wafer detection card as claimed in claim 6; Wafer test bench, described wafer test bench is used for carrying the wafer to be tested; A control terminal, the control terminal is connected to the wafer test bench, and the control terminal is also connected to the wafer test card, so as to control the test of the wafer test card through the control module, and receive the The feedback signal collected by the signal collection module. 8. The wafer testing system according to claim 7, wherein the wafer testing system also includes an image acquisition device for acquiring the first position between the positioning hole and the first preset needle position. a position relationship, and sending the first position relationship to the control terminal; The control terminal is further configured to adjust the position of the wafer to be tested on the wafer testing platform according to the first position relationship and the received feedback signal. 9. The wafer testing system according to claim 8, wherein the probe plate includes at least 2 groups of positioning holes, and the image acquisition device is used to collect different groups of positioning holes and the wafer to be tested. a second positional relationship of the first preset needle positions at different positions, and sending the second positional relationship to the control terminal; The control terminal is also used to determine the angle between the wafer to be tested and the probe plate according to the second positional relationship, and adjust the wafer to be tested on the wafer according to the determined angle. Position on the round test bench. 10. The wafer testing system according to claim 8, wherein the probe tray includes at least 2 observation boards, and the image acquisition device is used to collect observation windows of different observation boards and the wafer to be tested. a third positional relationship between observation information at different positions on the circle, and sending the third positional relationship to the control terminal; The control terminal is used to determine the angle between the wafer to be tested and the probe plate according to the third positional relationship, and adjust the wafer to be tested on the wafer according to the determined angle. position on the test bench. 11. A wafer testing method performed based on the wafer testing system according to any one of claims 7 to 10, wherein the method comprises: placing the wafer to be tested on the wafer test bench; Connecting the control terminal to the wafer test bench, and connecting the control terminal to the wafer detection card as claimed in claim 6; The control terminal controls the test of the wafer test card through the control module on the wafer test card, and receives the feedback signal collected by the signal acquisition module on the wafer test card. 12. The method of claim 11, further comprising: Connect the control terminal with the image acquisition device; The image acquisition device is used to acquire a first positional relationship between the positioning hole and the first preset needle position, and send the first positional relationship to the control terminal; adjusting the position of the wafer to be tested on the wafer testing platform according to the first position relationship and the received feedback signal through the control terminal. 13. The method according to claim 12, wherein the probe disc comprises at least 2 sets of positioning holes, and the method further comprises: collecting a second positional relationship between different groups of positioning holes and first preset needle positions at different positions on the wafer to be tested by the image acquisition device, and sending the second positional relationship to the control terminal; The angle between the wafer to be tested and the probe plate is determined by the control terminal according to the second positional relationship, and the wafer to be tested is adjusted according to the determined angle during the wafer test. position on stage. 14. The method according to claim 12, wherein the probe tray comprises at least 2 observation plates, and the method further comprises: collecting a third positional relationship between observation windows of different observation boards and observation information at different positions on the wafer to be tested by the image acquisition device, and sending the third positional relationship to the control terminal; The control terminal is used to determine the angle between the wafer to be tested and the probe plate according to the third positional relationship, and adjust the wafer to be tested on the wafer according to the determined angle. Position on the round test bench.

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