CN116413574A

CN116413574A - Probe disc, wafer detection card, wafer test system and wafer test method

Info

Publication number: CN116413574A
Application number: CN202111679802.6A
Authority: CN
Inventors: 李建明; 郭乐
Original assignee: Geke Microelectronics Zhejiang Co ltd
Current assignee: Geke Microelectronics Zhejiang Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2023-07-11

Abstract

A probe disc, a wafer detection card, a wafer test system and a wafer test method, wherein a new probe disc can be adopted to debug and test the relative positions of a probe and a wafer tin ball, and the new probe disc is used for detecting the needle position of a wafer to be tested, and the wafer test method comprises the following steps: the positioning holes are used for determining a first preset needle position on the wafer to be tested; and the probe is used for being connected with a second preset needle position on the wafer to be tested. In the new probe disc, the positioning holes are used for replacing the existing virtual probes, the positioning holes are through holes obtained after hollowing, the positioning holes cannot be shifted due to cleaning and the like, and the problem that the existing virtual probes are limited inaccurately due to shifting can be solved.

Description

Probe disc, wafer detection card, wafer test system and wafer test method

Technical Field

The invention relates to the field of wafer testing, in particular to a probe disc, a wafer detection card, a wafer testing system and a wafer testing method.

Background

The wafer test card, which may also be referred to as a wafer test card, a probe card (probe card), or a probe test card, is an interface between a chip under test (chip) and a tester in wafer test (wafer test), and is mainly used for performing preliminary measurement on electrical properties of chips before chip dicing and packaging, screening out bad chips, and performing subsequent packaging engineering.

The existing probe card comprises a probe disc, and the probe disc can also be called an integrated circuit (Integrated Circuit, abbreviated as IC) slot/socket, which is a test fixture frequently used by a large number of test engineers, and the quality of the test fixture is directly related to the progress of chip debugging, the cost of mass production test and the efficiency of the test.

The probe plate typically includes probes that are connected to one or more pins on the wafer, and also includes virtual probes for spacing the pins on the wafer. However, the virtual probe on the existing probe disc is easy to shift due to cleaning and the like, so that the limit is inaccurate, and the wafer test is affected.

Disclosure of Invention

The invention solves the technical problem of how to provide a new probe disc and solve the problem of displacement of virtual probes in the existing probe disc.

In order to solve the above technical problems, an embodiment of the present invention provides a probe disc, where the probe disc is used for performing needle position detection on a wafer to be tested, and includes: the positioning holes are used for determining a first preset needle position on the wafer to be tested; and the probe is used for being connected with a second preset needle position on the wafer to be tested.

Optionally, the probe disc includes at least 2 groups of positioning holes, and different groups of positioning holes are used for determining first preset needle positions at different positions on the wafer to be tested.

Optionally, the probe disc includes an observation plate and a probe plate, the positioning hole is located on the observation plate, and the probe is located on the probe plate; the observation plate further comprises an observation window, and the observation window is used for determining observation information of the wafer to be tested.

Optionally, the probe disc includes at least 2 observation plates, and observation windows of different observation plates are used for determining observation information of different positions on the wafer to be tested.

Optionally, the observation plate is detachably connected to the probe disc, or the observation plate and the probe disc are integrally formed.

In order to solve the above technical problems, an embodiment of the present invention further provides a wafer inspection card, including a substrate and a probe disc as described in any one of the above; the substrate is provided with a control module, a signal generation module and a signal acquisition module; the control module is used for controlling the test of the wafer to be tested and the operation of the signal generating module and the signal collecting module; the signal generation module is used for generating a test signal required by the test and transmitting the test signal to the wafer to be tested through the probe; and the signal acquisition module is used for acquiring the feedback signal of the wafer to be tested.

In order to solve the above technical problems, an embodiment of the present invention further provides a wafer testing system, where the wafer testing system includes: a wafer inspection card as described above; the wafer test bench is used for bearing a wafer to be tested; the control terminal is connected with the wafer test bench, and is also connected with the wafer detection card, so that the test of the wafer detection card is controlled by the control module, and the feedback signal acquired by the signal acquisition module is received.

Optionally, the wafer test system further includes an image acquisition device, configured to acquire a first positional relationship between the positioning hole and the first preset needle position, and send the first positional relationship to the control terminal; the control terminal is also used for adjusting the position of the wafer to be tested on the wafer test table according to the first position relation and the received feedback signal.

Optionally, the probe disc includes at least 2 groups of positioning holes, and the image acquisition device is configured to acquire second positional relationships between different groups of positioning holes and first preset needle positions at different positions on the wafer to be tested, and send the second positional relationships to the control terminal; the control terminal is also used for determining an included angle between the wafer to be tested and the probe disc according to the second position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

Optionally, the probe disc includes at least 2 observation boards, and the image acquisition device is configured to acquire a third positional relationship between observation windows of different observation boards and observation information of different positions on the wafer to be tested, and send the third positional relationship to the control terminal; the control terminal is used for determining an included angle between the wafer to be tested and the probe disc according to the third position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

In order to solve the above technical problems, an embodiment of the present invention further provides a wafer testing method executed based on any one of the wafer testing systems, where the method includes: placing a wafer to be tested on a wafer test table; connecting a control terminal with the wafer test bench, and connecting the control terminal with the wafer test card; and the control terminal controls the test of the wafer detection card through a control module on the wafer detection card and receives the feedback signal acquired by a signal acquisition module on the wafer detection card.

Optionally, the method further comprises: connecting the control terminal with an image acquisition device; the image acquisition equipment is used for acquiring a first position relation between the positioning hole and the first preset needle position and sending the first position relation to the control terminal; and adjusting the position of the wafer to be tested on the wafer test bench according to the first position relation and the received feedback signal by the control terminal.

Optionally, the probe disc includes at least 2 sets of positioning holes, and the method further includes: acquiring second position relations between different groups of positioning holes and first preset needle positions at different positions on the wafer to be tested through the image acquisition equipment, and sending the second position relations to the control terminal; and determining an included angle between the wafer to be tested and the probe disc through the control terminal according to the second position relation, and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

Optionally, the probe tray includes at least 2 observation plates, and the method further includes: acquiring third position relations between observation windows of different observation plates and observation information of different positions on the wafer to be tested through the image acquisition equipment, and sending the third position relations to the control terminal; and the control terminal is used for determining an included angle between the wafer to be tested and the probe disc according to the third position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

the embodiment of the invention provides a novel probe disc, which is used for detecting the needle position of a wafer to be tested and comprises the following steps: the positioning holes are used for determining a first preset needle position on the wafer to be tested; and the probe is used for being connected with a second preset needle position on the wafer to be tested. In the probe disc provided by the embodiment of the invention, the existing virtual probe is replaced by the positioning hole, and the positioning hole is a physical hole (for example, the positioning hole can be a through hole obtained after hollowing), compared with the virtual probe in the prior art, the positioning hole cannot shift due to cleaning and other reasons, and the problem of inaccurate limit caused by shift of the existing virtual probe can be solved.

Further, the new probe disc provided by the embodiment of the invention can be applied to a wafer detection card, and the wafer detection card can also comprise a substrate carrying modules such as a control module, a signal generation module, a signal acquisition module and the like besides the new probe disc. The wafer detection card is connected with the wafer to be tested, and wafer testing is performed.

Further, the wafer inspection card is part of a wafer test system, which may also include a wafer test station, a control terminal, etc. to perform the entire flow of wafer testing.

Further, the embodiment of the invention also provides a wafer testing method which is executed based on the wafer testing system.

Drawings

FIG. 1 is a top view of a prior art probe disc surface;

FIG. 2 is an enlarged schematic view of one area 102 of the probe disc of FIG. 1;

FIG. 3 is a top view of a first probe disc surface according to an embodiment of the invention;

fig. 4 is an enlarged schematic view of an area 302 of the probe plate 30 of fig. 3;

FIG. 5 is a top view of a second probe disc surface according to an embodiment of the invention;

FIG. 6 is a schematic diagram of a wafer inspection card according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a wafer testing system according to an embodiment of the present invention;

fig. 8 is a flowchart of a wafer testing method according to an embodiment of the invention.

Detailed Description

Referring to fig. 1 and 2, fig. 1 is a top view of a surface of a probe disc 10 according to the prior art, and fig. 2 is an enlarged schematic view of a region 102 of the probe disc 10 of fig. 1.

The probe disc 10 may include probes 101 and virtual probes for detecting the positions of pads or bumps (bumps) on a wafer (or chip) to be tested, the virtual probes being located in an area 102 of the probe disc 10. Fig. 1 shows a schematic diagram of a plurality of groups of probes 101, only two groups are labeled, and the virtual probes can be used for detecting the positions of one or more preset pads (pads) or bumps (bumps) on a wafer to be tested, and the virtual probes are in one-to-one correspondence with the pads/bumps/solder balls detected by the virtual probes. In fig. 2, the area 102 includes 4 dummy probes, wherein the dummy probes 1021 are taken as an example, and the tips of the dummy probes 1021 are in contact with the pads/bumps/solder balls 20 on the wafer to be tested, and at this time, the positions of the pads/bumps/solder balls 20 can be determined.

The probe disc 10 and the control circuit form a wafer inspection card. The principle of using the wafer inspection card is that after the positions of the bonding pads/bumps/solder balls on the wafer chip to be tested are determined by the virtual probes 1021, the probes 101 are directly contacted with the bonding pads/bumps/solder balls on the wafer chip to be tested. An excitation signal is input to the wafer inspection card through automatic test equipment (Automatic Test Equipment, ATE for short), and the wafer to be tested outputs a response based on the excitation signal as a measurement signal of the wafer to be tested. And the purpose of automatically measuring the wafer to be tested based on the measurement signal is realized by matching with a testing instrument and software control.

In the field of chip testing, the method is mainly divided into two parts: testing of Chip Probes (CP) and Final Testing (FT) of chips after packaging is completed. The probe disc mentioned in the present invention is used to perform FT testing. After the chip package is completed, wafer Level Test (WLT) is required.

As described in the background art, the virtual probe on the existing probe disc is easy to shift due to cleaning, so that the limit is inaccurate, and the wafer test is affected.

In order to solve the above problems, an embodiment of the present invention provides a new probe disc, where the probe disc is used for performing needle position detection on a wafer to be tested, and the method includes: the positioning holes are used for determining a first preset needle position on the wafer to be tested; and the probe is used for being connected with a second preset needle position on the wafer to be tested. In the new probe disc, the positioning holes are used for replacing the virtual probes in the existing probe disc, the positioning holes are through holes obtained after hollowing, the positioning holes cannot be shifted due to cleaning and the like, and the problem that the existing virtual probes are inaccurate in limiting due to shifting can be solved.

Referring to fig. 3 and 4, fig. 3 is a top view of a surface of a first type of probe plate 30 according to an embodiment of the present invention, and fig. 4 is an enlarged schematic view of an area 302 of the probe plate 30 of fig. 3.

The probe disc 30 is used for performing needle position detection on a wafer to be tested, and the probe disc 30 may include positioning holes 301 and probes 101. Wherein:

the probe plate 30 may include one or more positioning holes 301, where the plurality of positioning holes 301 may be denoted as 301 (1), …,301 (n), where n is a positive integer greater than or equal to 1, and 16 positioning holes are shown in fig. 4, i.e., n=16. One or more locating holes 301 are located in an area 302 on the probe plate 30.

Alternatively, the single positioning hole 301 may be a circular or square, hexagonal, or other shaped through hole, which may be hollowed out of one face of the probe disc. The positioning hole 301 is used for determining a first preset needle position on the wafer to be tested. The probe 101 is used for connecting with a second preset needle position on the wafer to be tested. Wherein the number of probes 101 may be one or more. Optionally, the probes 101 are in one-to-one correspondence with the second preset needle positions.

The pins on the wafer to be tested are pads/bumps/solder balls, and the first preset pins and the second preset pins may be the same pins or different pins.

Optionally, when the wafer to be tested is tested, the wafer to be tested is placed under the surface of the probe disc 30 in fig. 3, and the positioning hole 301 is aligned with the first preset needle position on the wafer to be tested, at this time, the first preset needle position on the wafer to be tested can be seen from the direction of overlooking the surface of the probe disc 30 through the positioning hole 301. Optionally, the positioning holes 301 are in one-to-one correspondence with the first preset needle positions, and one first preset needle position on the wafer to be tested is observed through each positioning hole 301, and at this time, it may be determined that the probe 302 can be accurately connected with the second preset needle position on the wafer to be tested, so as to successfully derive the measurement signal of the wafer to be tested. Further, when the corresponding first preset needle position on the wafer to be tested is observed to be located at the center of the positioning hole 301 through each positioning hole 301, it is determined that the probe 302 is accurately connected with the second preset needle position on the wafer to be tested.

Other structures and principles in the new probe disc (i.e., probe disc 30 shown in fig. 3 and 4) may be found in the relevant description of probe disc 10 in fig. 1 and 2, and will not be described again here.

In the new probe disc, the positioning holes are used for replacing the existing virtual probes, the positioning holes are through holes obtained after hollowing, the positioning holes cannot be shifted due to cleaning and the like, and the problem that the existing virtual probes are limited inaccurately due to shifting can be solved.

In one embodiment, the probe disc 30 includes at least 2 sets of positioning holes 301, and different sets of positioning holes 301 are used to determine a first predetermined needle position at different positions on the wafer to be tested.

Referring to fig. 5, fig. 5 is a top view of a surface of a second probe plate 50 according to an embodiment of the present invention, the probe plate 50 includes 3 sets of positioning holes, and each of the areas 302 (1), 302 (2) and 302 (3) includes one or more positioning holes, and the areas 302 (1), 302 (2) and 302 (3) are the same as the areas 302 in fig. 3 and 4. A detailed description of each set of locating holes can be seen in fig. 3 and 4.

In this embodiment, each set of positioning holes corresponds to a first preset needle position of an area on the wafer to be tested, so that distances between different sets of positioning holes can be increased. When the wafer to be tested is placed below the surface of the probe disc 50 in fig. 5, the first preset needle positions of different areas on the wafer to be tested can be seen from the direction of overlooking the surface of the probe disc 50 through different groups of positioning holes, so as to determine whether the plane of the needle positions on the wafer to be tested is parallel to the surface of the probe disc 50. Generally, when the two are parallel, it can be determined that the probe can be accurately connected with the second predetermined needle position on the wafer to be tested, so as to successfully derive the measurement signal of the wafer to be tested. When the plane of the needle position on the wafer to be tested is not parallel to the surface of the probe disc 50, a certain included angle exists between the plane of the needle position on the wafer to be tested and the surface of the probe disc 50, the included angle can be determined according to the condition that the first preset needle positions of different areas on the wafer to be tested are seen by different groups of positioning holes, and the position of the wafer to be tested or the probe disc is adjusted based on the included angle, so that the plane of the needle position on the wafer to be tested is parallel to the surface of the probe disc 50, and the test requirement is met.

In one embodiment, the probe disc comprises an observation plate and a probe plate, the positioning holes are positioned on the observation plate, and the probes are positioned on the probe plate; the observation plate further comprises an observation window, and the observation window is used for determining observation information of the wafer to be tested.

Referring to fig. 3 to 5 again, the observation plate refers to the area where the positioning hole is located on the probe disc, and the observation plate may correspond to the area 302 in fig. 3 and 4, or may correspond to the area 302 (1), the area 302 (2) and the area 302 (3) in fig. 5. A plurality of observation plates may be included in one probe disc, such as for the probe disc 50 in fig. 5, on which 3 observation plates are provided, the 3 observation plates corresponding to the region 302 (1), the region 302 (2), and the region 302 (3), respectively. The probe card is the other area of the probe card than the observation plate.

Each observation plate may include an observation window, which may refer to the region 303 in fig. 4, where the observation window may be used to observe observation information of the wafer to be tested, and the observation information may include information such as branding or a logo. The observation window can be a through hole obtained by hollowing out one surface of the probe disc, and optionally, the through hole area of the observation window can be larger than that of a single positioning hole.

When the probe plate includes more than one observation plate, the probe distribution on each observation plate may be the same or different, each observation plate may have an observation window, or only one or several observation plates may have an observation window.

In one embodiment, the observation plate is detachably connected to the probe plate, or the observation plate is integrally formed with the probe plate.

The probe plate 30 of fig. 3 will be described as an example: when the observation plate 302 and the probe disc 30 are integrally formed, the surface of the probe disc 30 in fig. 3 can be produced at one time through an injection molding process, so that the installation cost is saved. When the observation plate 302 is detachably connected to the probe disc 30, the observation plate 302 on the probe disc 30 can be replaced according to the test requirement, or when the observation plate 302 is damaged, only the observation plate can be replaced, so that the maintenance cost is saved.

Referring to fig. 6, fig. 6 is a schematic diagram of a wafer inspection card 60 according to an embodiment of the present invention, the wafer inspection card 60 includes a substrate (not shown) and a probe disc (i.e. probe disc 30 or probe disc 50, indicated by 30/50 in fig. 6) of any one of fig. 3 to 5; the substrate is provided with a control module 6011, a signal generation module 6012 and a signal acquisition module 6013; the control module 6011 is used for controlling the test of the wafer to be tested and the operation of the signal generating module and the signal collecting module; the signal generating module 6012 is configured to generate a test signal required for testing, and transmit the test signal to the wafer to be tested through the probe; and the signal acquisition module 6013 is used for acquiring the feedback signal of the wafer to be tested.

Specifically, the substrate is a housing structure for carrying modules such as the control module 6011, the signal generation module 6012, and the signal acquisition module 6013. The probe plate 30/50 is connected to the substrate so as to establish electrical connection through the substrate with the various modules connected at different locations on the substrate.

Optionally, a power supply module 6014 and a communication module 6015 may also be disposed on the substrate. The power supply module 6014 is configured to switch on an external power source and supply power to the entire wafer inspection card 60, the communication module 6015 may include an external communication interface, and the wafer inspection card 60 may perform signal interaction with a control terminal or other devices through the external communication interface. The control terminal can comprise a computer, a test instrument, a mobile phone and other devices.

In one embodiment, when testing a wafer to be tested using wafer inspection card 60, probes on probe tray 30/50 are connected to a second predetermined pin location of the wafer to be tested. The control module 6011 controls the entire test flow. The signal generating module 6012 generates a test signal required for testing, and transmits the test signal to the wafer to be tested through the probe, and the signal collecting module 6013 collects a feedback signal (i.e. the above measurement signal) of the wafer to be tested. The communication module 6015 transmits the feedback signal to the control terminal, and the control terminal obtains a test result of the wafer to be tested based on the feedback signal.

For more details of the operation principle and the operation manner of the wafer inspection card 60, reference may be made to the descriptions related to fig. 1 to 5, and the description is omitted here.

Referring to fig. 7, fig. 7 is a schematic diagram of a wafer testing system 70 according to an embodiment of the invention, wherein the wafer testing system 70 includes: wafer test card 60, wafer test station 701, and control terminal 702 in fig. 6. The wafer test bench 701 is used for carrying a wafer to be tested; a control terminal 702 is connected to the wafer test bench 701, and the control terminal 702 is further connected to the wafer test card 60, so as to control the test of the wafer test card 60 by the control module (the control module 6011 in fig. 6) and receive the feedback signal collected by the signal collection module (the signal collection module 6013 in fig. 6).

In one embodiment of the wafer test system 70, the wafer test system 70 may further include an image capturing device 703 configured to capture a first positional relationship between the positioning hole and the first preset needle position, and send the first positional relationship to the control terminal; the control terminal 702 is further configured to adjust a position of the wafer to be tested on the wafer test bench 701 according to the first positional relationship and the received feedback signal.

The image capturing device 703 may include a device capable of capturing an image, such as a camera or a video camera, where the image capturing device 703 is configured to capture a top view of the probe disc 30/50, and further, is configured to capture a top view of an area where the positioning hole is located, and when the wafer to be tested is placed below the surface of the probe disc 30/50, a first positional relationship between the positioning hole and the first preset needle position may be captured by the image capturing device 703. The image acquisition device 703 may send the acquired image or video to the control terminal 702, where the control terminal 702 determines, according to the first positional relationship in the image, whether the probe on the probe disc 30/50 can be accurately connected to the second preset probe position on the wafer to be tested.

In another embodiment of the wafer test system 70, the probe disc 30/50 includes at least 2 sets of positioning holes, and the image capturing device 703 is configured to capture a second positional relationship between different sets of positioning holes and the first preset needle positions at different positions on the wafer to be tested, and send the second positional relationship to the control terminal 702; the control terminal 702 is further configured to determine an included angle between the wafer to be tested and the probe disc according to the second positional relationship, and adjust a position of the wafer to be tested on the wafer test bench 701 according to the determined included angle.

The second positional relationship is a positional relationship between different groups of positioning holes recorded in an image or video acquired by the image acquisition device 703 at a certain moment and a first preset needle position at different positions on a wafer to be tested, the control terminal 702 may determine an included angle between the wafer to be tested and the probe disc based on the second positional relationship, so as to determine whether a plane where the needle position on the wafer to be tested is parallel to the surface of the probe disc, and if not, the control terminal 702 may adjust the position of the wafer to be tested on the wafer test table 701, so that the plane where the needle position on the wafer to be tested is parallel to the surface of the probe disc, so as to meet the test requirement.

In yet another embodiment of the wafer test system 70, the probe disc includes at least 2 observation plates, and the image capturing device 703 is configured to capture a third positional relationship between observation windows of different observation plates and observation information of different positions on the wafer to be tested, and send the third positional relationship to the control terminal 702; the control terminal 702 is configured to determine an included angle between the wafer to be tested and the probe disc according to the third positional relationship, and adjust a position of the wafer to be tested on the wafer test table 701 according to the determined included angle.

The third positional relationship is a positional relationship between different observation windows recorded in an image or video acquired by the image acquisition device 703 at a certain moment and observation information of different positions on the wafer to be tested, the control terminal 702 may determine an included angle between the wafer to be tested and the probe disc based on the third positional relationship, so as to determine whether a plane where a needle position on the wafer to be tested is parallel to the surface of the probe disc, and if not, the control terminal 702 may adjust the position of the wafer to be tested on the wafer test table 701, so that the plane where the needle position on the wafer to be tested is parallel to the surface of the probe disc, so as to meet the test requirement.

For more details of the operation and manner of operation of the wafer test system 70, reference may be made to the descriptions related to fig. 3-6, which are not repeated herein.

Referring to fig. 8, fig. 8 is a flowchart of a wafer testing method according to an embodiment of the invention, which is performed based on the wafer testing system 70 shown in fig. 7, and includes the following steps:

step S801, placing a wafer to be tested on a wafer test bench;

step S802, connecting a control terminal with the wafer test bench, and connecting the control terminal with the wafer test card;

in step S803, the control terminal controls the test of the wafer detection card through the control module on the wafer detection card, and receives the feedback signal collected by the signal collection module on the wafer detection card.

In one embodiment, the wafer testing method may further include: connecting the control terminal with an image acquisition device; the image acquisition equipment is used for acquiring a first position relation between the positioning hole and the first preset needle position and sending the first position relation to the control terminal; and adjusting the position of the wafer to be tested on the wafer test bench according to the first position relation and the received feedback signal by the control terminal.

In one embodiment, the probe disc includes at least 2 sets of positioning holes, and the wafer testing method may further include: acquiring second position relations between different groups of positioning holes and first preset needle positions at different positions on the wafer to be tested through the image acquisition equipment, and sending the second position relations to the control terminal; and determining an included angle between the wafer to be tested and the probe disc through the control terminal according to the second position relation, and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

In one embodiment, the probe card includes at least 2 vision boards, and the wafer testing method may further include: acquiring third position relations between observation windows of different observation plates and observation information of different positions on the wafer to be tested through the image acquisition equipment, and sending the third position relations to the control terminal; and the control terminal is used for determining an included angle between the wafer to be tested and the probe disc according to the third position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

For more details of the operation principle and the operation manner of the wafer test method of fig. 8, reference may be made to the description related to the wafer test system 70 of fig. 7, which is not repeated herein.

It should be understood that the term "and/or" is merely an association relationship describing the associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In this context, the character "/" indicates that the front and rear associated objects are an "or" relationship.

The term "plurality" as used in the embodiments herein refers to two or more.

The first, second, etc. descriptions in the embodiments of the present application are only used for illustrating and distinguishing the description objects, and no order division is used, nor does it indicate that the number of the devices in the embodiments of the present application is particularly limited, and no limitation on the embodiments of the present application should be construed.

The "connection" in the embodiments of the present application refers to various connection manners such as direct connection or indirect connection, so as to implement communication between devices, which is not limited in any way in the embodiments of the present application.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims

1. A probe disc for performing needle position detection on a wafer to be tested, comprising:

the positioning holes are used for determining a first preset needle position on the wafer to be tested;

and the probe is used for being connected with a second preset needle position on the wafer to be tested.

2. The probe plate of claim 1, wherein the probe plate includes at least 2 sets of alignment holes, different sets of alignment holes being used to determine a first predetermined needle position at different locations on the wafer to be tested.

3. The probe disc of claim 1, wherein the probe disc comprises an observation plate and a probe plate, the locating holes being located on the observation plate, the probes being located on the probe plate;

the observation plate further comprises an observation window, and the observation window is used for determining observation information of the wafer to be tested.

4. A probe card according to claim 3, wherein the probe card comprises at least 2 observation plates, the observation windows of different ones of the observation plates being used to determine the observation information at different locations on the wafer to be tested.

5. The probe card of claim 3 or 4, wherein the observation plate is detachably connected to the probe card, or the observation plate is integrally formed with the probe card.

6. A wafer inspection card comprising a substrate and a probe disc according to any one of claims 1 to 5;

the substrate is provided with a control module, a signal generation module and a signal acquisition module;

the control module is used for controlling the test of the wafer to be tested and the operation of the signal generating module and the signal collecting module;

the signal generation module is used for generating a test signal required by the test and transmitting the test signal to the wafer to be tested through the probe;

and the signal acquisition module is used for acquiring the feedback signal of the wafer to be tested.

7. A wafer testing system, the wafer testing system comprising:

the wafer inspection card of claim 6;

the wafer test bench is used for bearing a wafer to be tested;

the control terminal is connected with the wafer test bench, and is also connected with the wafer detection card, so that the test of the wafer detection card is controlled by the control module, and the feedback signal acquired by the signal acquisition module is received.

8. The wafer test system of claim 7, further comprising an image acquisition device configured to acquire a first positional relationship between the positioning hole and the first preset needle position and send the first positional relationship to the control terminal;

the control terminal is also used for adjusting the position of the wafer to be tested on the wafer test table according to the first position relation and the received feedback signal.

9. The wafer test system of claim 8, wherein the probe disc comprises at least 2 sets of positioning holes, the image acquisition device is configured to acquire a second positional relationship between different sets of positioning holes and a first preset needle position at different positions on the wafer to be tested, and send the second positional relationship to the control terminal;

the control terminal is also used for determining an included angle between the wafer to be tested and the probe disc according to the second position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

10. The wafer test system of claim 8, wherein the probe tray comprises at least 2 observation plates, the image acquisition device is configured to acquire a third positional relationship between observation windows of different observation plates and observation information of different positions on the wafer to be tested, and send the third positional relationship to the control terminal;

the control terminal is used for determining an included angle between the wafer to be tested and the probe disc according to the third position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

11. A wafer testing method performed based on the wafer testing system of any of claims 7 to 10, the method comprising:

placing a wafer to be tested on a wafer test table;

connecting a control terminal with the wafer test station and connecting the control terminal with the wafer test card of claim 6;

and the control terminal controls the test of the wafer detection card through a control module on the wafer detection card and receives the feedback signal acquired by a signal acquisition module on the wafer detection card.

12. The method of claim 11, wherein the method further comprises:

connecting the control terminal with an image acquisition device;

the image acquisition equipment is used for acquiring a first position relation between the positioning hole and the first preset needle position and sending the first position relation to the control terminal;

and adjusting the position of the wafer to be tested on the wafer test bench according to the first position relation and the received feedback signal by the control terminal.

13. The method of claim 12, wherein the probe plate includes at least 2 sets of locating holes, the method further comprising:

acquiring second position relations between different groups of positioning holes and first preset needle positions at different positions on the wafer to be tested through the image acquisition equipment, and sending the second position relations to the control terminal;

and determining an included angle between the wafer to be tested and the probe disc through the control terminal according to the second position relation, and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.

14. The method of claim 12, wherein the probe tray comprises at least 2 vision panels, the method further comprising:

acquiring third position relations between observation windows of different observation plates and observation information of different positions on the wafer to be tested through the image acquisition equipment, and sending the third position relations to the control terminal;

and the control terminal is used for determining an included angle between the wafer to be tested and the probe disc according to the third position relation and adjusting the position of the wafer to be tested on the wafer test table according to the determined included angle.