CN116408851A - Copper foil stamping-free die-cutting piece and preparation process thereof - Google Patents
Copper foil stamping-free die-cutting piece and preparation process thereof Download PDFInfo
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- CN116408851A CN116408851A CN202111681554.9A CN202111681554A CN116408851A CN 116408851 A CN116408851 A CN 116408851A CN 202111681554 A CN202111681554 A CN 202111681554A CN 116408851 A CN116408851 A CN 116408851A
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- Prior art keywords
- die
- copper foil
- double
- film
- embossing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 239000011889 copper foil Substances 0.000 title claims abstract description 64
- 238000005520 cutting process Methods 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000010408 film Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000002699 waste material Substances 0.000 claims abstract description 33
- 238000004049 embossing Methods 0.000 claims abstract description 24
- 239000000047 product Substances 0.000 claims abstract description 24
- 238000007599 discharging Methods 0.000 claims abstract description 23
- 239000013039 cover film Substances 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 239000012043 crude product Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000005096 rolling process Methods 0.000 claims abstract description 7
- 239000013058 crude material Substances 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims abstract description 3
- 239000002390 adhesive tape Substances 0.000 claims description 32
- 238000010030 laminating Methods 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 239000012945 sealing adhesive Substances 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a die-cut piece without stamping of copper foil and a preparation process thereof, wherein the process comprises the following steps: (1) material tape lamination: sequentially attaching a cover film (1), a first double-sided adhesive (2), a copper foil (3), a second double-sided adhesive (4), a release film (5) and a protective film (6) to form a material belt; (2) a die cutting waste: carrying out one-punch die cutting on the material belt according to the shape of a cutting die on a one-punch die cutting machine, and discharging waste to obtain a first-level crude material belt; (3) cutting and discharging waste by a double die: carrying out secondary punching die cutting on the primary crude product material belt according to the shape of a cutting die on a secondary punching die cutting machine, and discharging waste to obtain a secondary crude product material belt; and (4) rolling a product: the protective film (6) on the secondary crude product material belt is discharged, the material belt film (7) is attached to the first double-sided adhesive (2) to obtain a die-cut piece product with copper foil without embossing, and the die-cut piece product is rolled.
Description
Technical Field
The invention relates to the field of die-cut piece preparation, in particular to a copper foil stamping-free die-cut piece and a preparation process thereof.
Background
The copper foil has low surface oxygen characteristic, can be attached to various base materials such as metal, insulating materials and the like, and has a wide temperature application range. The conductive copper foil is mainly applied to electromagnetic shielding and antistatic, is arranged on the substrate surface, is combined with a metal base material, has excellent conductivity, and provides an electromagnetic shielding effect. The method can be divided into: self-adhesive copper foil, double-conductor copper foil, single-conductor copper foil, etc. The electronic grade copper foil (the purity is more than 99.7 percent and the thickness is 5-105 mu m) is one of the basic materials of the electronic industry, the electronic grade copper foil is rapidly developed in the electronic information industry, the use amount of the electronic grade copper foil is larger and larger, and the product is widely applied to industrial calculators, communication equipment, QA equipment, lithium ion storage batteries, civil televisions, video recorders, CD players, copiers, telephones, cold and warm air conditioners, automobile electronic components, game machines and the like. The current state of the product or method involved.
The copper foil is softer, so that crease, scratch and the like are easily caused on the product in the using process, the copper foil is softer, embossing is easily caused on the product in the punching process because the product is frame-shaped, and the thicker the copper foil is, the more the embossing is. Mainly because the product is frame-shaped, the frame is cut at one time, and the product in the cutter can be extruded to cause embossing.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a die-cutting piece with low reject ratio, high quality and copper foil without embossing and a preparation process thereof.
The aim of the invention can be achieved by the following technical scheme:
the research and experiment show that: the embossing on the copper foil is caused by extrusion after the cutter line is removed, but the scrap area is found to be flat without embossing; attempts have therefore been made to study the scrap punched out by the knife, which remains the product, as shown in fig. 6: changing the waste area into a product, the product area being waste; the product is not cut and printed, and the specific scheme is as follows:
a process for preparing a die-cut piece of copper foil without embossing, comprising the steps of:
(1) And (3) material tape laminating: sequentially attaching the cover film, the first double-sided adhesive tape, the copper foil, the second double-sided adhesive tape, the release film and the protective film to form a material belt;
(2) A die cuts and discharges waste: carrying out one-punch die cutting on the material belt according to the shape of a cutting die on a one-punch die cutting machine, and discharging waste to obtain a first-level crude material belt;
(3) Cutting and discharging waste by a secondary die: carrying out secondary punching die cutting on the primary crude product material belt according to the shape of a cutting die on a secondary punching die cutting machine, and discharging waste to obtain a secondary crude product material belt;
(4) And (3) rolling a product: and discharging the protective film on the secondary crude product material belt, attaching a material belt film on the first double-sided adhesive to obtain a die-cut piece product with copper foil without embossing, and rolling.
Further, the specific steps of the material belt lamination are as follows: and (3) attaching the release film to the protective film, tearing off the base paper of the first double-sided adhesive tape, attaching the release film, attaching the copper foil to the first double-sided adhesive tape, tearing off the base paper of the second double-sided adhesive tape, attaching the copper foil, and finally attaching the cover film to the second double-sided adhesive tape.
Further, a cutter line a matched with the die cutting pattern is arranged on a cutter die on a die-cutting machine.
Further, the die cutting layer of the knife line a sequentially comprises a cover film, a first double faced adhesive tape, a copper foil and a second double faced adhesive tape from top to bottom.
Further, the specific steps of waste discharge after one-punch die cutting are as follows: and (3) attaching the silica gel belt to the copper foil scraps, pulling up the silica gel belt, and winding and discharging the silica gel belt and the copper foil scraps together.
Further, a cutter line b matched with the die cutting pattern is arranged on a cutter die on the two-die cutting machine.
Further, the die cutting layer of the knife line b sequentially comprises a cover film, a first double faced adhesive tape, a copper foil, a second double faced adhesive tape and a release film from top to bottom.
Further, when the cover film is used for discharging waste, the box sealing adhesive tape is attached to the cover film, and when the waste is discharged, the box sealing adhesive tape and the cover film are rolled together for discharging the waste.
The copper foil manufactured by the process has no embossed die-cut piece. Further, the die-cutting piece comprises a material belt film, a first double faced adhesive tape, a copper foil, a second double faced adhesive tape and a release film which are sequentially attached.
Compared with the prior art, the invention has the following advantages:
(1) The invention is found through research and experiments: the embossing on the copper foil is caused by extrusion after the cutter line is removed, but the scrap area is found to be flat without embossing; so the attempt is made to research that the cutter cuts out waste materials, products are reserved, a waste material area is changed into products, and the product area is waste materials; therefore, the product is not provided with a knife mark, and the prejudice in the prior art is overcome;
(2) The invention changes the defect caused by the imprinting of the copper foil, the rejection rate is reduced to almost 0 from 50% of the original rejection rate, and the reject rate is reduced to almost 0 from the previous nearly 100%, thus having breakthrough progress.
Drawings
FIG. 1 is a schematic view of a die cut piece made in accordance with the present invention;
FIG. 2 is a hierarchical view of die cut pieces made in accordance with the present invention;
FIG. 3 is a drawing of a one shot process of the present invention;
FIG. 4 is a drawing of a die cutter according to an embodiment;
FIG. 5 is a hierarchy diagram of an embodiment;
FIG. 6 is a drawing of a two-shot process of the present invention;
FIG. 7 is a diagram of a two-die cutter according to an embodiment;
FIG. 8 is a diagram showing a two-die cutter assembly according to an embodiment;
FIG. 9 is a two-stroke hierarchical diagram in an embodiment;
FIG. 10 is a drawing of a two die cutter in the comparative example;
the reference numerals in the figures indicate: cover film 1, first double faced adhesive tape 2, copper foil 3, second double faced adhesive tape 4, release film 5, protection film 6, material tape film 7.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples. The present embodiment is implemented on the premise of the technical scheme of the present invention, and a detailed implementation manner and a specific operation process are provided, but the protection scope of the present invention is not limited to the following embodiments.
Examples
A process for preparing a die-cut piece of copper foil without embossing, comprising the steps of:
(1) And (3) material tape laminating: as shown in fig. 3, a cover film 1, a first double-sided adhesive tape 2, a copper foil 3, a second double-sided adhesive tape 4, a release film 5 and a protective film 6 are sequentially attached to form a material belt; the method comprises the following specific steps: laminating release film 5 on protection film 6, then tearing the body paper of first double faced adhesive tape 2, laminating on release film 5, laminating copper foil 3 on first double faced adhesive tape 2 again, then tearing the body paper of second double faced adhesive tape 4, laminating on copper foil 3, laminating lid film 1 on second double faced adhesive tape 4 at last.
(2) A die cuts and discharges waste: carrying out one-punch die cutting on the material belt according to the shape of a cutting die on a one-punch die cutting machine, and discharging waste to obtain a first-level crude material belt; as shown in fig. 4-5, a knife line a matched with a die cutting pattern is arranged on a knife mold on a die cutting machine. The die cutting layer of the knife line a sequentially comprises a cover film 1, a first double faced adhesive tape 2, a copper foil 3 and a second double faced adhesive tape 4 from top to bottom. The specific steps of waste discharge after one-step die cutting are as follows: and (3) attaching the silica gel belt to the copper foil scraps, pulling up the silica gel belt, and winding and discharging the silica gel belt and the copper foil scraps together.
(3) Cutting and discharging waste by a secondary die: carrying out secondary punching die cutting on the primary crude product material belt according to the shape of a cutting die on a secondary punching die cutting machine, and discharging waste to obtain a secondary crude product material belt; as shown in fig. 6-9, a knife line b matched with the die cutting pattern is arranged on a knife die on the two-punch die cutting machine. The die cutting layer of the cutter line b sequentially comprises a cover film 1, a first double faced adhesive tape 2, a copper foil 3, a second double faced adhesive tape 4 and a release film 5 from top to bottom. When the cover film 1 discharges waste, the box sealing adhesive tape is attached to the cover film 1, and when the waste is discharged, the box sealing adhesive tape and the cover film 1 are rolled together for waste discharge.
(4) And (3) rolling a product: and discharging the protective film 6 on the secondary crude product material belt, attaching the material belt film 7 on the first double faced adhesive tape 2 to obtain a die-cut piece product with copper foil without embossing, and rolling. As shown in fig. 1-2, the die-cutting piece comprises a material tape film 7, a first double-sided adhesive tape 2, a copper foil 3, a second double-sided adhesive tape 4 and a release film 5 which are sequentially attached.
In this embodiment, the copper foil has a defect rate of almost 0 due to imprinting.
Comparative example
The difference from the embodiment is that, as shown in fig. 10, the comparative example is provided with a cutter line b' matching the die cutting pattern on the cutter die of the two-die cutting machine.
In this comparative example, the defective rate of the copper foil due to the embossing was almost close to 100%.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the invention in any way, and any person skilled in the art may make modifications or alterations to the disclosed technical content to the equivalent embodiments. However, any simple modification, equivalent variation and variation of the above embodiments according to the technical substance of the present invention still fall within the protection scope of the technical solution of the present invention.
Claims (10)
1. The preparation process of the die-cut piece without the stamping of the copper foil is characterized by comprising the following steps of:
(1) And (3) material tape laminating: sequentially attaching a cover film (1), a first double-sided adhesive (2), a copper foil (3), a second double-sided adhesive (4), a release film (5) and a protective film (6) to form a material belt;
(2) A die cuts and discharges waste: carrying out one-punch die cutting on the material belt according to the shape of a cutting die on a one-punch die cutting machine, and discharging waste to obtain a first-level crude material belt;
(3) Cutting and discharging waste by a secondary die: carrying out secondary punching die cutting on the primary crude product material belt according to the shape of a cutting die on a secondary punching die cutting machine, and discharging waste to obtain a secondary crude product material belt;
(4) And (3) rolling a product: and discharging the protective film (6) on the secondary crude product material belt, attaching the material belt film (7) on the first double-sided adhesive tape (2) to obtain a die-cut piece product with copper foil without embossing, and rolling.
2. The process for preparing the die-cut piece without embossing of the copper foil according to claim 1, wherein the specific steps of material tape lamination are as follows: laminating release film (5) on protection film (6), then tearing the body paper of first double faced adhesive tape (2), laminating on release film (5), laminating copper foil (3) on first double faced adhesive tape (2), then tearing the body paper of second double faced adhesive tape (4), laminating on copper foil (3), laminating lid film (1) on second double faced adhesive tape (4) at last.
3. The process for preparing a die-cut piece without embossing of copper foil according to claim 1, wherein a knife line a matched with a die-cut pattern is arranged on a knife die on a die-cutting machine.
4. The process for preparing the die-cut piece without embossing of the copper foil according to claim 3, wherein the die-cut layer of the knife line a sequentially comprises a cover film (1), a first double-sided adhesive (2), the copper foil (3) and a second double-sided adhesive (4) from top to bottom.
5. The process for preparing a die-cut piece without embossing of copper foil according to claim 1, wherein the specific steps of discharging waste after one-shot die-cutting are as follows: and (3) attaching the silica gel belt to the copper foil scraps, pulling up the silica gel belt, and winding and discharging the silica gel belt and the copper foil scraps together.
6. The process for preparing a die-cut piece without embossing of copper foil according to claim 1, wherein a cutter line b matched with a die-cut pattern is arranged on a cutter die on the two-punch die-cutting machine.
7. The process for preparing the die-cut piece without embossing of the copper foil according to claim 6, wherein the die-cut layer of the knife line b sequentially comprises a cover film (1), a first double-sided adhesive (2), a copper foil (3), a second double-sided adhesive (4) and a release film (5) from top to bottom.
8. The process for preparing the die-cut piece without embossing of the copper foil, which is characterized in that when the cover film (1) is used for discharging waste, the box sealing adhesive tape is attached to the cover film (1), and when the waste is discharged, the box sealing adhesive tape and the cover film (1) are rolled together for discharging the waste.
9. A die-cut article without embossing of copper foil produced by the process of any one of claims 1-8.
10. The die-cut piece without embossing of the copper foil according to claim 1, wherein the die-cut piece comprises a material tape film (7), a first double-sided adhesive (2), a copper foil (3), a second double-sided adhesive (4) and a release film (5) which are sequentially attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111681554.9A CN116408851A (en) | 2021-12-29 | 2021-12-29 | Copper foil stamping-free die-cutting piece and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111681554.9A CN116408851A (en) | 2021-12-29 | 2021-12-29 | Copper foil stamping-free die-cutting piece and preparation process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116408851A true CN116408851A (en) | 2023-07-11 |
Family
ID=87053703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111681554.9A Pending CN116408851A (en) | 2021-12-29 | 2021-12-29 | Copper foil stamping-free die-cutting piece and preparation process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116408851A (en) |
-
2021
- 2021-12-29 CN CN202111681554.9A patent/CN116408851A/en active Pending
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