CN116403918B - Packaging structure and packaging method - Google Patents
Packaging structure and packaging method Download PDFInfo
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- CN116403918B CN116403918B CN202310672632.1A CN202310672632A CN116403918B CN 116403918 B CN116403918 B CN 116403918B CN 202310672632 A CN202310672632 A CN 202310672632A CN 116403918 B CN116403918 B CN 116403918B
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- clearance groove
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- groove
- adapter plate
- filling
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 113
- 230000001681 protective effect Effects 0.000 claims abstract description 63
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 239000000084 colloidal system Substances 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000005336 cracking Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 239000010703 silicon Substances 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000009826 distribution Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- 238000012536 packaging technology Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Die Bonding (AREA)
Abstract
The embodiment of the disclosure provides a packaging structure and a packaging method, and relates to the technical field of semiconductor packaging. The packaging structure comprises an adapter plate, and a first device, a second device and a third device which are mounted on the adapter plate at intervals, wherein the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed at one side of the third device, which faces the first device and the second device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other to form a T-shaped channel; the width of the first clearance groove is reduced near the second clearance groove. Therefore, the glue amount of the bottom-filled protective glue at the position, close to the second clearance groove, of the first clearance groove is reduced, so that the glue stress at the position is reduced, and the phenomena of device hidden cracking and the like caused by overlarge glue stress are prevented.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method.
Background
With the rapid development of the semiconductor industry, new design modes of chiplet technology are developed, chiplets with different functions are packaged together to form a heterogeneous integrated chip packaging structure, and with the increasing input and output density of chips, the number of chips integrated in a single package is obviously increased. The existing 2.5D packaging technology is to package a plurality of small chips on an adapter plate as a multi-chip packaging scheme to connect adjacent chip bonding pad lines in a single package, so as to improve the packaging integration level, and mainly uses underfill colloid as a protective layer to protect welding spots of the flip chips after the plurality of flip chips are attached on the adapter plate. However, when the glue is cut along the edge of the chip, the bottom filling glue fills the bottoms of the chips by virtue of the capillary action of the glue, the T-shaped channels are also necessarily filled, the glue amount in the T-shaped channels is too small, the bottom of the chip is easy to generate a cavitation phenomenon, and if the glue amount is too much, the chip is easy to be hidden and cracked due to the stress generated by the glue.
Disclosure of Invention
The invention aims to provide a packaging structure and a packaging method, which can prevent the phenomenon of hidden cracking of a device caused by excessive colloid stress.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a package structure, including:
an adapter plate;
the first device is attached to the adapter plate;
the second device is attached to the adapter plate;
the third device is attached to the adapter plate;
the first device and the second device are arranged on one side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
the width of the first clearance groove near the second clearance groove is reduced.
In an alternative embodiment, the first device and the second device are arranged at intervals in the X direction, the first device and the third device are arranged at intervals in the Y direction, and the X direction and the Y direction are perpendicular to each other;
The axis of the third device is parallel to the X direction, and the axis of the first device and/or the axis of the second device forms an included angle with the X direction.
In an alternative embodiment, the first device and the second device are symmetrically arranged about the Y-direction.
In an alternative embodiment, the cross section of the first device is rectangular, and the projection area of the first device in the first area is s1=1/2 (l1·h1); wherein L1 is the projection length of the long side of the first device in the first area, and H1 is the projection length of the wide side of the first device in the first area; the volume occupied by the first device in the first region is V1, v1=s1·t1, wherein T1 is the height of the first device;
the first region is: and a rectangular area which takes the length L of the third device as a long side, takes the long side of the third device on the side facing the first device as a starting point, and extends a distance W towards the direction approaching the first device as a wide side.
In an alternative embodiment, the cross section of the second device is rectangular, and the shape and the size of the second device are the same as those of the first device; the volume occupied by the first device and the second device in the first region is 2V1.
In an alternative embodiment, a filling block is provided in the first clearance groove and/or the second clearance groove.
In a second aspect, the present invention provides a package structure, including:
an adapter plate;
the first device is attached to the adapter plate;
the second device is attached to the adapter plate;
the third device is attached to the adapter plate;
the first device and the second device are arranged on one side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
and filling blocks are arranged in the first clearance groove and/or the second clearance groove.
In an alternative embodiment, the distance from the bottom of the filling block to the surface of the adapter plate is 50% to 80% of the depth of the first clearance groove or the second clearance groove.
In an alternative embodiment, the first clearance groove and the second clearance groove are filled with protective glue, and the protective glue is located between the filling block and the adapter plate.
In an alternative embodiment, the filling block comprises an insertion part and a connecting part which are connected with each other, the insertion part is arranged in the first clearance groove and/or the second clearance groove, and the connecting part is positioned on the upper surface of at least one of the first device, the second device and the third device.
In an alternative embodiment, a gap is provided between at least one of the first, second and third devices and the insert.
In an alternative embodiment, a glue layer is provided between the connection portion and at least one of the first, second and third devices.
In an alternative embodiment, a heat dissipation groove is formed in one side, away from the adapter plate, of the connecting portion.
In an alternative embodiment, the first clearance groove and the second clearance groove are filled with protective glue, and the protective glue covers part of the heat dissipation groove.
In an alternative embodiment, the filling block is provided with a through hole, and the through hole is communicated with the first clearance groove and/or the second clearance groove.
In an alternative embodiment, the filling block is provided with a vent groove, and the vent groove is communicated with the through hole.
In an alternative embodiment, the filling block is provided with a heat dissipation groove.
In a third aspect, the present invention provides a packaging method, including:
attaching a first device, a second device and a third device on the adapter plate; the first device and the second device are arranged on one side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
filling protective glue in the first clearance groove and the second clearance groove;
at least one of the first device and the second device is arranged at an included angle relative to the third device, so that the glue amount of the protective glue at the junction of the first clearance groove and the second clearance groove is reduced.
In an alternative embodiment, the method further comprises:
before the step of filling the first clearance groove and the second clearance groove with protective glue, attaching filling blocks in the first clearance groove and/or the second clearance groove; and a space for filling the protective adhesive is reserved between the filling block and the adapter plate.
In a fourth aspect, the present invention provides a packaging method, including:
attaching a first device, a second device and a third device on the adapter plate; the first device and the second device are arranged on one side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
attaching filling blocks in the first clearance groove and/or the second clearance groove; wherein a preset space is reserved between the filling block and the adapter plate;
and filling protective glue in the preset space.
In an alternative embodiment, the step of attaching the filling block in the first clearance groove and/or the second clearance groove includes:
attaching a filling block in the first clearance groove and/or the second clearance groove, wherein the filling block comprises a connecting part and an inserting part which are connected with each other, the inserting part is arranged in the first clearance groove and/or the second clearance groove, and the connecting part is positioned on the upper surface of at least one of the first device, the second device and the third device;
And grinding to remove the connecting part.
The beneficial effects of the embodiment of the invention include, for example:
according to the packaging structure and the packaging method provided by the embodiment of the invention, the glue amount distribution of the protective glue in the T-shaped channel is controlled by adopting a mode of rotationally mounting the first device and the second device, or the glue amount of the protective glue in the T-shaped channel is reduced by adopting a mode of filling the T-shaped channel with the filling block, so that the glue stress is reduced, and the phenomena of hidden cracking of the device and the like caused by overlarge glue stress are prevented.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic top view of a conventional chip mounting structure;
fig. 2 is a schematic front view of a conventional chip mounting structure;
fig. 3 is a schematic top view of a package structure according to a first embodiment of the present invention;
Fig. 4 is a schematic structural diagram of a package structure according to a first embodiment of the present invention, in which the first device and the second device occupy a space volume of the first channel after being rotated;
fig. 5 is a schematic diagram of a first structure of a package structure according to a first embodiment of the present invention;
fig. 6 is a schematic diagram of a second structure of the package structure according to the first embodiment of the present invention;
fig. 7 is a schematic diagram of a third structure of the package structure according to the first embodiment of the present invention;
fig. 8 is a schematic diagram of a first structure of a package structure according to a second embodiment of the present invention;
fig. 9 is a schematic diagram of a second structure of a package structure according to a second embodiment of the present invention;
fig. 10 is a schematic diagram of a third structure of a package structure according to a second embodiment of the present invention;
fig. 11 is a schematic diagram of a fourth structure of a package structure according to a second embodiment of the present invention;
FIG. 12 is a schematic diagram illustrating a manufacturing process of a package structure according to an embodiment of the present invention;
fig. 13 is a schematic process diagram of an interposer of a package structure according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of a package structure and a substrate connection according to an embodiment of the present invention.
Icon: 10-chip; 11-a substrate; a 12-T channel; 13-a first channel; 14-a second channel; 15-filling colloid; 100-packaging structure; 110-an adapter plate; 121-a first device; 123-a second device; 125-a third device; 131-a first clearance groove; 133-a second clearance groove; 140, protecting glue; 150-filling blocks; 151-an insertion portion; 153-connection; 155-heat dissipation grooves; 161-through holes; 163-vent slots; 201-a carrier; 202-a substrate; 203-copper pillars; 210-a wiring layer; 220-bump pads; 230-solder balls; 240-substrate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1 and 2, in the prior art, a plurality of chips 10 are mounted on a substrate 11, T-shaped channels 12 exist between the chips 10 and the chips 10, and when the underfill 15 is dispensed along the edge chips 10, the bottoms of the plurality of chips 10 are filled by the capillary action of the underfill 15, and the T-shaped channels 12 are necessarily filled by the underfill 15. If the amount of glue in the T-shaped channel 12 is too small, it is easy to cause a void phenomenon at the bottom of the chip 10. If the amount of glue is too large, the chip 10 is prone to be broken by the stress generated by the filling glue 15.
In order to overcome at least one defect in the prior art, the present embodiment provides a packaging structure 100, which can control the glue amount in the T-shaped channel 12, so as to prevent the bottom of the device from generating a cavitation phenomenon and prevent the device from generating a hidden crack due to the glue stress.
First embodiment
Referring to fig. 3 to 5, the present embodiment provides a package structure 100, which includes an interposer 110, and a first device 121, a second device 123 and a third device 125 mounted on the interposer 110 at intervals, wherein the first device 121 and the second device 123 are disposed on one side of the third device 125, and the third device 125 has a larger size. And the first device 121, the second device 123 and the third device 125 are spaced apart from each other, so that a first gap groove 131 is formed at one side of the third device 125 facing the first device 121 and the second device 123, a second gap groove 133 is formed between the first device 121 and the second device 123, and the first gap groove 131 and the second gap groove 133 are communicated with each other to form a T-shaped channel; the width of the first clearance groove 131 near the second clearance groove 133 is reduced. Therefore, the glue amount of the underfill protective glue 140 at the position of the first clearance groove 131 close to the second clearance groove 133 is reduced, so that the glue stress at the position is reduced, and the phenomena of device hidden crack and the like caused by overlarge glue stress are prevented.
It is understood that at least one of the first device 121 and the second device 123 is disposed at an angle to the third device 125. For example, the axis of the first device 121 forms an angle with the axis of the third device 125. Alternatively, the axis of the second device 123 and the axis of the third device 125 form an angle. Alternatively, the axis of the first device 121 and the axis of the second device 123 each form an angle with the axis of the third device 125. By arranging the first device 121 and the second device 123 obliquely such that the width of the first clearance groove 131 near the second clearance groove 133 decreases, the notch width of the second clearance groove 133 gradually decreases in the direction in which the third device 125 is directed toward the first device 121, i.e., the notch at the end of the second clearance groove 133 near the first clearance groove 131 is larger than the notch at the end of the second clearance groove 133 away from the first clearance groove 131.
The first device 121 and the second device 123 are disposed at intervals in the X direction, the first device 121 and the third device 125 are disposed at intervals in the Y direction, the second device 123 and the third device 125 are disposed at intervals in the Y direction, and the X direction and the Y direction are perpendicular to each other. The axis of the third device 125 is parallel to the X-direction and the axis of the first device 121 and/or the axis of the second device 123 is at an angle to the X-direction.
It will be appreciated that in the prior art, the axis of the first device 121 and the axis of the second device 123 are co-linear and each is parallel to the axis of the third device 125, forming a T-channel 12 therebetween. The T-shaped channel 12 comprises a first channel 13 of constant width in the X-direction and a second channel 14 of constant width in the Y-direction.
In this embodiment, the first device 121 and the second device 123 are mounted by rotating a certain angle relative to the third device 125. After rotation, the widths of the first clearance grooves 131 are not equal in the X direction, and the widths of the middle parts close to the second clearance grooves 133 are smaller, and the widths of the two sides are larger. The second clearance groove 133 is wider near one end of the first clearance groove 131 and narrower at the other end thereof in the Y direction. In this way, the glue distribution of the underfill 140 may be changed, and the glue in the middle of the first clearance groove 131 may be less, so that the thermal expansion stress point of the device is changed by improving the glue distribution of the underfill 140, so as to avoid the occurrence of the hidden crack of the third device 125.
Through experimental analysis to the structure of the existing product, if the glue amount is excessive at the corner of the T-shaped channel 12, i.e. at the junction of the first channel 13 and the second channel 14, the glue stress is large, and the length of the first gap groove 131 is longer due to the larger size and longer length of the third device 125, so that the hidden crack phenomenon is more likely to occur on the long side of the third device 125. Therefore, in this embodiment, by rotating the first device 121 counterclockwise around the center of the first device 121 by a certain angle, the upper right corner of the first device 121 protrudes from the middle of the first channel 13, and occupies a part of the volume of the first channel 13, so that the amount of the protective glue 140 filled in the middle of the first channel 13 is reduced, so as to reduce the stress generated by the glue, and avoid the occurrence of hidden cracks in the third device 125. Further, in this embodiment, the second device 123 is further rotated clockwise around the center of the second device 123 by a certain angle, so that the upper left corner of the second device 123 protrudes into the first channel 13 and occupies a part of the volume of the first channel 13, so that the amount of the protective glue 140 filled in the middle of the first channel 13 is reduced, and thus, the occurrence of hidden crack of the third device 125 can be further prevented.
In some embodiments, only the first device 121 may be rotated, or only the second device 123 may be rotated, or the first device 121 and the second device 123 may be rotated, respectively, and the rotation angle may be flexibly set according to practical situations, which is not particularly limited herein, so long as the amount of the protective glue 140 in the middle of the first channel 13 can be reduced.
Alternatively, the first device 121 and the second device 123 are symmetrically disposed about the Y direction. I.e. the rotation angle of the first device 121 in the counter clockwise direction is the same as the rotation angle of the second device 123 in the clockwise direction. The glue is symmetrically arranged, and the stress of the glue can offset one part of the glue, so that the hidden cracking problem and the warping problem caused by the stress of the glue are reduced.
It will be appreciated that the first device 121 is rectangular in cross-section, the first region being: a rectangular region having a long side of the length L of the third device 125, a long side of the third device 125 facing the first device 121, and a wide side extending a distance W in a direction approaching the first device 121. I.e. the first region, is to be understood as the region forming the first channel 13. Thus, the projected area of the first device 121 in the first region is s1=1/2 (l1·h1); where L1 is the projected length of the long side of the first device 121 in the first area, and H1 is the projected length of the wide side of the first device 121 in the first area; the volume occupied by the first device 121 in the first region is V1, v1=s1·t1, where T1 is the height of the first device 121.
Similarly, the cross-section of the second device 123 is rectangular, and the shape and size of the second device 123 is the same as the shape and size of the first device 121. After the second device 123 rotates, the second device 123 occupies a volume V1 in the first region. The volume occupied by the first device 121 and the second device 123 in the first region is 2V1. In this way, the filling amount of the protective glue 140 in the middle of the first channel 13 can be reduced by 2V1, so as to reduce the glue stress and avoid the occurrence of the hidden crack of the third device 125.
It will be readily appreciated that as the first and second members 121, 123 rotate, the width of the central portion of the first channel 13 decreases and the volume of the central portion decreases by 2V1. The width of the two sides of the first channel 13 is increased, the corresponding volume increase amount after the single-side width is increased is V1, and the total volume increase amount of the two sides is 2V1. In this way, the volume of the first channel 13 formed before the first device 121 and the second device 123 are rotated and the volume of the first clearance groove 131 formed after the rotation are equal, and are l·w·t, the glue amount distribution of the protective glue 140 is changed although the total glue amount is unchanged, the glue amount distribution before the rotation is uniform, and the glue amount distribution after the rotation is more on both sides and less in the middle. By changing the glue amount distribution, the thermal expansion stress point of the third device 125 can be changed, so as to avoid the hidden crack of the third device 125. Accordingly, the first device 121 and the second device 123 can be prevented from being hidden.
It should be noted that, the symbol "·" in the text indicates a multiplication number, for example, s1·t1 is the product of S1 and T1.
In this embodiment, the first device 121, the second device 123, and the third device 125 may be chips, components, or other electronic devices, respectively. Alternatively, the first device 121 and the second device 123 use HBM chips, and the third device 125 uses ASIC chips, although other chips may be used, which is not particularly limited herein. The interposer 110 may be made of glass material, ceramic material, silicon substrate, germanium substrate, gallium arsenide, PCB board, lead frame or glass fiber cloth substrate, preferably glass material and silicon substrate.
For the second clearance groove 133, since the width of the notch of the second clearance groove 133 gradually changes in the Y direction, the distribution of the colloid is also changed, so that the thermal expansion stress point of the third device 125 is changed, and thus the occurrence of hidden cracks of the third device 125 is avoided. Accordingly, the first device 121 and the second device 123 can be prevented from being hidden.
In addition, in the embodiment, when the dispensing process is performed, the glue may be dispensed from the peripheral edge of the device, for example, from the left and right sides of the third device 125 along the Y direction, so that the openings of the first clearance groove 131 on the left and right sides are larger, which is more beneficial to the entry of the glue, ensures the filling of the bottoms of the first device 121, the second device 123 and the third device 125, prevents the bottom cavity phenomenon, and is beneficial to increasing the space for releasing stress of the devices. Meanwhile, the width of the middle part of the first gap groove 131 is smaller, and part of the colloid can be blocked, so that the colloid is promoted to flow to the middle bottom areas of the first device 121, the second device 123 and the third device 125, the filling effect is better, and the bottom cavity phenomenon is prevented.
It should be noted that, in the drawings of the present embodiment, only the first device 121 and the second device 123 are shown to be mounted on one side of the third device 125, and in other embodiments, the first device 121 and the second device 123 may be mounted on two sides, three sides or all around the third device 125, which is not limited herein. The number and distribution positions of the first device 121, the second device 123, and the third device 125 can be flexibly arranged. In actual mounting, the first device 121, the second device 123, and the third device 125 may be used as a module, and a plurality of modules may be mounted at intervals, for example, side-by-side, matrix, ring array, or other distributed mounting methods.
Referring to fig. 6, optionally, a filling block 150 is provided in the first clearance groove 131 and/or the second clearance groove 133. The filling block 150 may be provided in the first clearance groove 131, or in the second clearance groove 133, or the filling blocks 150 may be provided in the first clearance groove 131 and the second clearance groove 133, respectively. A predetermined space is left between the filling block 150 and the surface of the adapter plate 110, and the predetermined space is used for filling the bottom protective glue 140. It can be appreciated that after the filling block 150 is disposed, the filling block 150 occupies the space of the T-shaped channel formed by the first clearance groove 131 and the second clearance groove 133, so that the glue amount of the protective glue 140 is reduced, and further, the stress generated by the glue is reduced, thereby preventing the first device 121, the second device 123 and the third device 125 from being damaged.
Alternatively, the height of the preset space is 50% to 80% of the depth of the T-shaped channel, i.e., the distance from the bottom of the filling block 150 to the surface of the adapter plate 110 is 50% to 80% of the depth of the first clearance groove 131 or the second clearance groove 133. For example, the filling height of the filling block 150 is half the depth of the T-shaped channel, i.e., the height of the preset space is 50% of the depth of the T-shaped channel, and the filling height of the protective paste 140 is 50% of the depth of the T-shaped channel.
Optionally, the filling block 150 includes an insertion portion 151 and a connection portion 153 connected to each other, the insertion portion 151 being provided in the first clearance groove 131 and/or the second clearance groove 133, the connection portion 153 being located on an upper surface of at least one of the first device 121, the second device 123 and the third device 125. Of course, in some embodiments, the connection portion 153 may be omitted. The filling block 150 may be a silicon substrate, rubber, epoxy, ceramic, metal doped layer, polymer heat conductive particles, etc., which are not particularly limited herein. The polymer heat conductive particles can be alumina, etc. The filling block 150 may also be made of other materials with a thermal expansion coefficient lower than that of the protective glue 140, so that the stress of the glue is absorbed conveniently, and the glue stress acts on the filling block 150 to prevent the device from being hidden and cracked. Preferably, the filling block 150 is made of the same material as the device, for example, the device is a chip, and the filling block 150 can be made of a silicon material, so that the materials are consistent, the thermal expansion coefficients are consistent, the buffering effect is good, the structure warpage is prevented, and the structural stress is reduced. Alternatively, the material of the filler block 150 may be identical to that of the protective paste 140. It is easy to understand that the filling block 150 is mounted in a solid state in the T-shaped channel, the protective paste 140 is filled in a liquid state, and the solid filling block 150 can absorb the stress of the protective paste during the baking and curing process of the liquid protective paste 140.
The filling block 150 not only reduces the glue amount of the protective glue 140 and stress, but also plays a role in heat dissipation and protects the first device 121, the second device 123 and the third device 125.
In connection with fig. 7, the underfill 140 may alternatively cover the upper surfaces of the first device 121, the second device 123, and the third device 125, but may, of course, cover only the upper surfaces of one or both devices. The device is arranged in such a way, so that the device can be protected, damage caused by the influence of external force on the surface of the device is prevented, and the heat dissipation effect is improved. The protective paste 140 may employ, but is not limited to, epoxy resin, high molecular heat conductive particles, etc. The polymeric thermally conductive particles may be, for example, alumina or the like.
It should be noted that the manner of rotating the chip by a certain angle and the manner of disposing the filling block 150 in this embodiment may be applied to any structure having a T-shaped channel, and is not limited to the illustrated case. Also, the number of the first, second and third devices 121, 123 and 125 and the distribution position may be flexibly arranged.
Second embodiment
Referring to fig. 8, a package structure 100 provided in this embodiment includes an interposer 110, and a first device 121, a second device 123, and a third device 125 mounted on the interposer 110 at intervals, where the first device 121 and the second device 123 are disposed on one side of the third device 125, and the first device 121, the second device 123, and the third device 125 are disposed at intervals, so that a first gap groove 131 is formed on one side of the third device 125 facing the first device 121 and the second device 123, a second gap groove 133 is formed between the first device 121 and the second device 123, and the first gap groove 131 and the second gap groove 133 are mutually communicated. The first clearance groove 131 and/or the second clearance groove 133 are provided with filling blocks 150. In this embodiment, the filling block 150 is provided to reduce the glue amount in the T-shaped channel, so as to reduce the glue stress and avoid the occurrence of hidden cracks in the first device 121, the second device 123 and the third device 125.
The distance from the bottom of the filling block 150 to the surface of the adapter plate 110 is less than half the depth of the first clearance groove 131 or the second clearance groove 133. The first clearance groove 131 and the second clearance groove 133 are filled with protective glue 140, and the protective glue 140 is located between the filling block 150 and the adapter plate 110. I.e., a predetermined space is left between the filling block 150 and the surface of the adapter plate 110, which is used to fill the bottom protective paste 140. The height of the preset space is 50% to 80%, such as 50%, 55%, 60%, 65%, 70%, 75% or 80% of the depth of the T-shaped channel.
Optionally, the filling block 150 includes an insertion portion 151 and a connection portion 153 connected to each other, the insertion portion 151 being disposed in the first clearance groove 131 and/or the second clearance groove 133, and the connection portion 153 being located on an upper surface of at least one of the first device 121, the second device 123 and the third device 125. The insertion portion 151 may be provided in the first clearance groove 131, or in the second clearance groove 133, or the insertion portion 151 may be provided in each of the first clearance groove 131 and the second clearance groove 133. The connection 153 is located on the upper surface of the device.
In this embodiment, the filling block 150 is a silicon chip, and the silicon chip may be a silicon substrate, a germanium substrate, gallium arsenide, or the like. The silicon chip is the same as the first device 121, the second device 123 and the third device 125, and has the same thermal expansion coefficient, good buffering effect, structure warpage prevention and structure stress reduction. The height of the insert 151 in the silicon chip is 50% of the thickness of the first device 121, and in this embodiment, the thicknesses of the first device 121, the second device 123, and the third device 125 are all equal. The insertion part 151 occupies a part of the volume of the T-shaped channel, so that the colloid volume of the protective colloid 140 in the T-shaped channel is reduced, the colloid volume in the T-shaped channel is ensured to be less than 50% of the T-shaped channel volume, and the problem of chip hidden crack caused by overlarge volume in the T-shaped channel is prevented.
Referring to fig. 9, optionally, a gap N is provided between at least one of the first device 121, the second device 123, and the third device 125 and the insertion portion 151. By reserving the gap, the adhesive force between the filling block 150 and the device can be increased by the capillary action of the adhesive body when filling the bottom protective adhesive 140. In addition, after the gaps are reserved, a certain buffer expansion space is provided after the package structure 100 is heated and expanded.
Optionally, a glue layer is provided between the connection portion 153 and at least one of the first device 121, the second device 123 and the third device 125. That is, the filling block 150 may be adhered to the first device 121, the second device 123 or the third device 125 through an adhesive layer, or may be adhered to the first device 121, the second device 123 and the third device 125, respectively, so as to improve the bonding force and stability of the structure.
Referring to fig. 10, optionally, a heat dissipation groove 155 is disposed on a side of the connection portion 153 away from the interposer 110, so as to improve heat dissipation performance. Further, the first and second clearance grooves 131 and 133 are filled with a protective paste 140, and the protective paste 140 covers a portion of the heat dissipation groove 155. Namely, the protective glue 140 covers the upper surface of the chip or the upper surface of the filling block 150, so that the heat at the bottom of the chip can be conducted to the heat dissipation groove 155 at the top through the protective glue 140, and the heat dissipation effect is improved. Meanwhile, the chip is better protected, and the bonding force between the protective glue 140 and the filling block 150 and the bonding force between the filling block 150 and the chip are improved.
Referring to fig. 11, optionally, the filling block 150 is provided with a through hole 161, and the through hole 161 communicates with the first clearance groove 131 and/or the second clearance groove 133. That is, the through hole 161 communicates with the first clearance groove 131, or the through hole 161 communicates with the second clearance groove 133, or the through hole 161 communicates with the first clearance groove 131 and the second clearance groove 133, respectively. Like this, through-hole 161 can regard as the filling runner of protection glue 140, and when dividing the glue, a part of protection glue 140 gets into from the side of first clearance groove 131, second clearance groove 133, and a part gets into from through-hole 161, can promote the mobility of colloid, guarantees the volume of getting into of colloid, promotes the filling nature of chip bottom, prevents the phenomenon of bottom cavity. In addition, in the baking and curing process of the protective glue 140, the through holes 161 can also improve the water vapor drainage capability of the glue from liquid state to solid state, and have an exhaust function, so that the thermal expansion coefficient generated by the glue in curing is reduced, the problem of chip hidden cracking caused by overlarge thermal expansion coefficient is prevented, and the heat dissipation performance is improved.
Further, the filling block 150 is provided with an exhaust slot 163, and the exhaust slot 163 is communicated with the through hole 161, so that the exhaust function is further enhanced, and the heat dissipation function is also provided.
It will be appreciated that the filler block 150 is provided with a heat dissipation groove 155. The heat dissipation groove 155 may be provided at any position on the filler block 150, such as an upper surface or any side surface, which is not particularly limited herein. In this embodiment, the heat dissipation groove 155 is formed on a side surface of the connection portion 153, and may be penetrated or not penetrated. May be provided on the side surface of the insertion portion 151, and is not particularly limited herein.
In the package structure 100 provided in this embodiment, the filling block 150 occupies a portion of the T-shaped channel, so as to control the glue amount of the protective glue 140, and prevent the chip from being broken due to larger stress generated by the excessive glue amount. Meanwhile, the heat dissipation performance is improved, the filling property of the bottom protective glue 140 is ensured, and bottom cavities are prevented from occurring.
In this embodiment, the first device 121 and the second device 123 may be mounted obliquely after rotating by a certain angle, or may be mounted directly parallel to the third device 125 without rotating.
Other parts of the content not mentioned in this embodiment are similar to those of the first embodiment, and will not be described here again.
Third embodiment
Referring to fig. 12, a packaging method provided in this embodiment includes:
mounting a first device 121, a second device 123 and a third device 125 on the interposer 110; wherein the first device 121 and the second device 123 are disposed at one side of the third device 125, and the first device 121, the second device 123 and the third device 125 are disposed at intervals to form a first gap groove 131 at one side of the third device 125 facing the first device 121 and the second device 123, a second gap groove 133 is formed between the first device 121 and the second device 123, and the first gap groove 131 and the second gap groove 133 are communicated with each other. Optionally, the first device 121, the second device 123 and the third device 125 are flip chips, and the micro-bump on the bottom of the flip chip is soldered to the interposer 110 through a reflow process.
Optionally, the third device 125 is mounted first, and then the first device 121 and the second device 123 are mounted.
Filling the first and second clearance grooves 131 and 133 with a protective paste 140;
at least one of the first device 121 and the second device 123 is disposed at an angle with respect to the third chip, so as to reduce the amount of the protective adhesive 140 at the junction of the first clearance groove 131 and the second clearance groove 133. By rotating the first device 121 and the second device 123 by a certain angle, the first device 121 and the second device 123 occupy a part of the volume of the first channel 13, so as to reduce the glue amount in the middle of the first channel 13 and prevent the chip from being hidden and cracked due to larger stress generated by overlarge glue amount.
Of course, in some embodiments, only the first device 121 may be rotated by a certain angle, or only the second device 123 may be rotated by a certain angle, which is not particularly limited herein.
Optionally, before the step of filling the protective glue 140 in the first clearance groove 131 and the second clearance groove 133, a filling block 150 is attached in the first clearance groove 131 and/or the second clearance groove 133; a space for filling the protective adhesive 140 is reserved between the filling block 150 and the adapter plate 110. By arranging the filling block 150, the space of the T-shaped channel is further occupied, and the volume of the protective glue 140 in the space of the T-shaped channel is reduced, so that the glue amount in the T-shaped channel is reduced, and the chip hidden crack caused by larger stress generated by overlarge glue amount is prevented.
The embodiment also provides a packaging method, which includes:
mounting a first device 121, a second device 123 and a third device 125 on the interposer 110; wherein the first device 121 and the second device 123 are disposed at one side of the third device 125, and the first device 121, the second device 123 and the third device 125 are disposed at intervals to form a first gap groove 131 at one side of the third device 125 facing the first device 121 and the second device 123, a second gap groove 133 is formed between the first device 121 and the second device 123, and the first gap groove 131 and the second gap groove 133 are communicated with each other. Optionally, the first device 121, the second device 123, and the third device 125 are flip chips, and the micro-bump on the bottom of the flip chip is soldered to the interposer 110 through a reflow soldering process.
Filling blocks 150 are stuck in the first clearance groove 131 and/or the second clearance groove 133; wherein a predetermined space is left between the filler block 150 and the adapter plate 110. Optionally, the filling block 150 is a silicon chip, and glue layers are dispensed on the first device 121, the second device 123 and the third device 125, the silicon chip is attached again above the T-shaped channel, and the silicon chip is fixed above the T-shaped channel by using a baking process. Wherein the filling block 150 is provided with a vent groove 163 and a through hole 161.
The protective paste 140 is filled in the preset space. Optionally, the edges of the plurality of flip chips are scratched and filled with the protective glue 140, the glue layer thickness can reach to cover the surfaces of the flip chips and the silicon chips, and the exhaust grooves 163 and the through holes 161 on the silicon chips are used as flow channels, so that the mobility of the protective glue 140 on the surfaces of the plurality of flip chips is improved, and the surfaces of the plurality of flip chips are protected. In addition, the through holes 161 and the exhaust grooves 163 can exhaust air inside the T-shaped channel, thereby improving fluidity of the gel inside the T-shaped channel. The protective glue 140 is solidified by baking again, and the through holes 161 and the exhaust grooves 163 are utilized to improve the capability of the protective glue 140 for draining water vapor from liquid state to solid state, so that the thermal expansion coefficient generated by the glue during solidification is reduced, the problem of chip hidden cracking caused by overlarge thermal expansion coefficient is prevented, and the heat dissipation performance is improved.
Optionally, the step of attaching the filling block 150 in the first clearance groove 131 and/or the second clearance groove 133 includes:
the filling block 150 is attached to the first clearance groove 131 and/or the second clearance groove 133, the filling block 150 includes a connection portion 153 and an insertion portion 151 connected to each other, the insertion portion 151 is provided in the first clearance groove 131 and/or the second clearance groove 133, and the connection portion 153 is provided on an upper surface of at least one of the first device 121, the second device 123, and the third device 125. It is understood that the insertion portion 151 is provided in the first clearance groove 131, or in the second clearance groove 133, or the insertion portion 151 is provided in each of the first clearance groove 131 and the second clearance groove 133.
And then the connection portion 153 is removed by grinding. After the connection portion 153 is removed, heat dissipation performance can be improved, the overall volume of the package structure 100 can be reduced, the upper surface of the package structure 100 can be kept to be a flat surface and is flush with the surface of the chip, and the appearance of the product structure can be kept unchanged.
And implanting solder balls on the surface of the adapter plate 110, which is far away from the device, on the back surface of the adapter plate 110 by using a ball implantation process, and cutting the adapter plate 110 into single products by using a cutting process.
Alternatively, in connection with fig. 13, one method of manufacturing the interposer 110 is as follows:
s1: a carrier 201 is provided, and a substrate 202 is mounted on the carrier 201, wherein the substrate 202 is made of glass material, ceramic material, silicon substrate 240, germanium substrate 240, gallium arsenide, PCB board, lead frame or glass fiber cloth substrate. The substrate 202 is preferably a silicon base 240 or a glass material.
S2: a hole is opened in the substrate 202, and copper is electroplated in the hole to form a copper pillar 203. Optionally, the copper pillars 203 are polished, keeping the copper pillars 203 flush with the substrate 202.
S3: a dielectric layer is coated on the copper pillars 203, a patterned opening is formed by exposure and development, copper is electroplated in the patterned opening to form a wiring layer 210, and the wiring layer 210 and the copper pillars 203 are electrically connected. The wiring layer 210 may be one or more layers, and if the wiring layer is a plurality of layers, a first wiring layer is formed first. And then coating a dielectric layer, patterning an opening and electroplating copper on the first layer of wiring layer to form a second layer of wiring layer. The above steps are repeated, and a third layer, a fourth layer, or more wiring layers 210 may also be formed.
S4: a dielectric layer is further coated over the wiring layer 210, a trench is formed in the dielectric layer, copper is electroplated in the trench, and a bump pad 220 is formed, the bump pad 220 being electrically connected to the wiring layer 210.
The substrate 202 is flipped over and the carrier 201 is removed. The above steps S2 to S4 are repeated on the other side of the substrate 202 to form the wiring layer 210 and the bump pad 220. Thus, the double-sided wiring and double-sided pad arrangement of the interposer 110 are completed.
Referring to fig. 14, solder balls 230 are implanted on the bump pads 220 on one side of the interposer 110, and devices such as the first device 121, the second device 123, the third device 125, and the like are attached on the other side. The solder balls 230 are used for electrically connecting with the substrate 240 to realize a transfer function. The substrate 240 may be a circuit board, other interposer 110, or other electrical module.
Other parts of the content not mentioned in this embodiment are similar to those in the first embodiment and the second embodiment, and will not be described here again.
In summary, the embodiment of the invention provides a packaging structure 100 and a packaging method, which can control the glue amount of a protective glue 140 in a T-shaped channel and prevent the chip from being hidden and cracked due to larger stress generated by overlarge glue amount. Meanwhile, the heat dissipation performance is improved, the filling property of the bottom protective glue 140 is ensured, and bottom cavities are prevented from occurring.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (19)
1. A package structure, comprising:
an adapter plate;
the first device is attached to the adapter plate;
the second device is attached to the adapter plate;
the third device is attached to the adapter plate; the third device has a size greater than the first device and the second device, respectively;
the first device and the second device are arranged on one side of the long side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
The width of the first clearance groove close to the second clearance groove is reduced, and openings formed at two ends of the first clearance groove far away from the second clearance groove are larger, so that the entrance of colloid is facilitated;
the cross section of the first device is rectangular, and the projection area of the first device in the first area is S1=1/2 (L1.H2); wherein L1 is the projection length of the long side of the first device in the first area, and H1 is the projection length of the wide side of the first device in the first area; the volume occupied by the first device in the first region is V1, v1=s1·t1, wherein T1 is the height of the first device;
the first region is: and a rectangular area which takes the length L of the third device as a long side, takes the long side of the third device on the side facing the first device as a starting point, and extends a distance W towards the direction approaching the first device as a wide side.
2. The package structure of claim 1, wherein the first device and the second device are spaced apart in an X direction, the first device and the third device are spaced apart in a Y direction, and the X direction and the Y direction are perpendicular to each other;
the axis of the third device is parallel to the X direction, and the axis of the first device and/or the axis of the second device forms an included angle with the X direction.
3. The package structure of claim 1, wherein the first device and the second device are symmetrically disposed about a Y-direction.
4. The package structure of claim 1, wherein the cross section of the second device is rectangular, and the shape and size of the second device are the same as the shape and size of the first device; the volume occupied by the first device and the second device in the first region is 2V1.
5. The packaging structure according to claim 1, wherein a filling block is provided in the first clearance groove and/or the second clearance groove.
6. A package structure, comprising:
an adapter plate;
the first device is attached to the adapter plate;
the second device is attached to the adapter plate;
the third device is attached to the adapter plate; the third device has a size greater than the first device and the second device, respectively;
the first device and the second device are arranged on one side of the long side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
Filling blocks are arranged in the first clearance grooves and/or the second clearance grooves, and a preset space is reserved between the bottoms of the filling blocks and the surface of the adapter plate; the first clearance groove and the second clearance groove are filled with protective glue, and the protective glue is positioned between the filling block and the adapter plate;
the filling blocks are inserted into the first clearance grooves and/or the second clearance grooves, and then the protective glue is filled into the first clearance grooves and the second clearance grooves.
7. The package structure of claim 6, wherein a distance from a bottom of the filler block to a surface of the interposer is 50% to 80% of a depth of the first clearance groove or the second clearance groove.
8. The package structure according to claim 6, wherein the filler block includes an insertion portion and a connection portion connected to each other, the insertion portion being provided in the first clearance groove and/or the second clearance groove, the connection portion being located on an upper surface of at least one of the first device, the second device, and the third device.
9. The package structure of claim 8, wherein at least one of the first, second, and third devices has a gap between the insert.
10. The package structure of claim 8, wherein an adhesive layer is disposed between the connection portion and at least one of the first device, the second device, and the third device.
11. The package structure of claim 8, wherein a heat dissipation groove is formed on a side of the connection portion away from the interposer.
12. The package structure of claim 11, wherein the first clearance groove and the second clearance groove are filled with a protective glue, and the protective glue covers a portion of the heat dissipation groove.
13. The packaging structure according to claim 6, wherein the filling block is provided with a through hole, and the through hole is communicated with the first clearance groove and/or the second clearance groove.
14. The package structure of claim 13, wherein the filling block is provided with a vent slot, and the vent slot is communicated with the through hole.
15. The package structure according to any one of claims 6 to 14, wherein the filler block is provided with a heat dissipation groove.
16. A packaging method for preparing the packaging structure according to any one of claims 1 to 5, the method comprising:
Attaching a first device, a second device and a third device on the adapter plate; the first device and the second device are arranged on one side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
filling protective glue in the first clearance groove and the second clearance groove;
at least one of the first device and the second device is arranged at an included angle relative to the third device, so that the glue amount of the protective glue at the junction of the first clearance groove and the second clearance groove is reduced.
17. The packaging method of claim 16, further comprising:
before the step of filling the first clearance groove and the second clearance groove with protective glue, attaching filling blocks in the first clearance groove and/or the second clearance groove; and a space for filling the protective adhesive is reserved between the filling block and the adapter plate.
18. A packaging method for preparing the packaging structure of any one of claims 6 to 15, the method comprising:
attaching a first device, a second device and a third device on the adapter plate; the first device and the second device are arranged on one side of the third device, the first device, the second device and the third device are arranged at intervals, so that a first clearance groove is formed on one side, facing the first device and the second device, of the third device, a second clearance groove is formed between the first device and the second device, and the first clearance groove and the second clearance groove are communicated with each other;
attaching filling blocks in the first clearance groove and/or the second clearance groove; wherein a preset space is reserved between the filling block and the adapter plate;
and filling protective glue in the preset space.
19. The packaging method according to claim 18, wherein the step of attaching a filler block in the first clearance groove and/or the second clearance groove comprises:
attaching a filling block in the first clearance groove and/or the second clearance groove, wherein the filling block comprises a connecting part and an inserting part which are connected with each other, the inserting part is arranged in the first clearance groove and/or the second clearance groove, and the connecting part is positioned on the upper surface of at least one of the first device, the second device and the third device;
And grinding to remove the connecting part.
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| US20230060756A1 (en) * | 2021-08-31 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chip package structure with multiple gap-filling layers and fabricating method thereof |
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| JP2010050128A (en) * | 2008-08-19 | 2010-03-04 | Alps Electric Co Ltd | Semiconductor chip module |
| JP2011096865A (en) * | 2009-10-30 | 2011-05-12 | Sharp Corp | Substrate member, module, electric equipment, and manufacturing method of modules |
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| JP2015015546A (en) * | 2013-07-03 | 2015-01-22 | 株式会社村田製作所 | High frequency module |
| KR20220007192A (en) * | 2020-07-10 | 2022-01-18 | 삼성전자주식회사 | Semiconductor package including underfill and method for manufacturing the same |
| CN113725172A (en) * | 2021-08-03 | 2021-11-30 | 日月光半导体制造股份有限公司 | Semiconductor package device and method of manufacturing the same |
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