CN116382378A - Control method and device of temperature regulating equipment - Google Patents
Control method and device of temperature regulating equipment Download PDFInfo
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- CN116382378A CN116382378A CN202310574995.1A CN202310574995A CN116382378A CN 116382378 A CN116382378 A CN 116382378A CN 202310574995 A CN202310574995 A CN 202310574995A CN 116382378 A CN116382378 A CN 116382378A
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- 238000011217 control strategy Methods 0.000 claims abstract description 41
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims description 94
- 230000007613 environmental effect Effects 0.000 claims description 23
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a control method and a device of temperature regulating equipment. Wherein the method comprises the following steps: determining the current temperature of a chip of the domain controller and the temperature rise rate of the chip in a preset time interval; determining a current operating mode of the thermostat; under the current operation mode, determining a control strategy of the temperature regulating equipment according to the chip temperature and the temperature rise rate; and controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller. The invention solves the technical problem that the heat dissipation reliability is lower because the heat dissipation mode used for the domain controller in the related technology can not be well balanced with noise and energy consumption.
Description
Technical Field
The invention relates to the technical field of vehicle control, in particular to a control method and a device of temperature regulating equipment.
Background
At present, the middle-high-end vehicle types are all provided with an automatic driving technology with the L2 level or more, and with the upgrading of the intelligent driving technology, the power of the domain controller chip is increased, the heating is increased, and the normal work of the domain controller chip is easily influenced. Therefore, the domain controller chip needs to be subjected to heat dissipation treatment to dissipate the heat generated by the domain controller chip.
Air cooling is a commonly used heat dissipation mode at present. However, the fans selected at present have the function of controlling the rotating speed, and the fans have the advantages of higher rotating speed, strong heat radiation capability, high noise and high energy consumption; the fan has low rotating speed, weak heat dissipation capability, low noise and low energy consumption.
Aiming at the problem that the heat dissipation reliability is low because the heat dissipation efficiency, noise and energy consumption cannot be well balanced in the heat dissipation mode for the domain controller in the related art, no effective solution has been proposed at present.
Disclosure of Invention
The embodiment of the invention provides a control method and a control device of temperature regulating equipment, which at least solve the technical problem that the heat dissipation reliability is lower because the heat dissipation mode for the domain controller in the related art cannot be well balanced with the heat dissipation efficiency, noise and energy consumption.
According to an aspect of an embodiment of the present invention, there is provided a control method of a temperature adjustment device for performing heat dissipation processing on a chip of a domain controller, the domain controller being a controller provided on a vehicle, including: determining the current temperature of a chip of the domain controller and the temperature rise rate of the chip in a preset time interval; determining a current operating mode of the thermostat; under the current operation mode, determining a control strategy of the temperature regulating equipment according to the chip temperature and the temperature rise rate; and controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller.
Optionally, determining the current temperature of the chip of the domain controller includes: triggering a temperature sensing device to start after the vehicle is electrified so as to sense the ambient temperature of a chip of the domain controller in a preset range, wherein the preset range is an area taking the chip as a center and a preset distance as a radius; and determining the current temperature of the chip according to the ambient temperature.
Optionally, determining the current temperature of the chip according to the ambient temperature includes: searching in an environment temperature-chip temperature library by taking the environment temperature as an index to obtain a search result, wherein the environment temperature-chip temperature library is constructed according to a plurality of historical environment temperatures and a plurality of historical chip temperatures with corresponding relations; and determining a target temperature corresponding to the environmental temperature in the search result as the current temperature, wherein the plurality of historical environmental temperatures comprise a first historical environmental temperature with the same environmental temperature value, and the target temperature is a historical chip temperature corresponding to the first historical environmental temperature.
Optionally, determining the temperature rise rate of the chip of the domain controller in a preset time interval includes: determining a start temperature of the chip at a start time point of the preset time interval and an end temperature of the chip at an end time point of the preset time interval; determining a temperature difference between the starting temperature and the ending temperature; and determining the ratio of the time length corresponding to the temperature difference value and the preset time interval as the temperature rise rate.
Optionally, in the current operation mode, determining a control strategy of the temperature adjustment device according to the current temperature and the temperature rise rate includes: and determining the control strategy as: controlling the temperature regulating device to execute a downshift operation, wherein the downshift cooling mode is that the temperature regulating device is in a wind speed gear reduction stage and the temperature regulating device is in a cooling state; when the current operation mode is the upshift cooling mode and the current temperature is determined to be within a predetermined temperature range, if the temperature rise rate is within a temperature rise rate range corresponding to the predetermined temperature range, determining the control strategy as: and performing upshift operation on the temperature regulating device, wherein the upshift cooling mode is that the temperature regulating device is in a wind speed gear step-up stage and the temperature regulating device is in a cooling state.
Optionally, the control method of the temperature adjustment device further includes: and under the condition that the current temperature is determined to be in the preset temperature range, if the temperature rise rate is not in the temperature rise rate range corresponding to the preset temperature range, and the temperature rise rate is larger than the upper limit value of the temperature rise rate range, performing upshift operation on the temperature regulating equipment.
Optionally, controlling the temperature adjustment device to perform a downshift operation includes: under the condition that the current actual state is low-gear cooling, when the current temperature is less than 50 ℃ and the temperature rise rate is less than or equal to 0, controlling the temperature regulating equipment to close a cooling function; under the condition that the current actual state is middle gear cooling, when the current temperature is less than 60 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of the temperature regulating equipment to be reduced to a low gear; and when the current actual state is high-gear cooling, and the current temperature is less than 85 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of the temperature regulating equipment to be reduced to a middle gear.
Optionally, performing an upshift operation on the temperature adjustment device includes: when the current actual state is uncooled, controlling the temperature regulating equipment to rise to a low level when the current temperature is 56 ℃ or higher and the temperature rise rate is 0 or higher; under the condition that the current actual state is low-grade cooling, when the current temperature is more than or equal to 56 ℃ and less than or equal to 75 ℃ and the temperature rise rate is more than 2, controlling the temperature regulating equipment to rise to a middle grade; and under the condition that the current actual state is middle-grade cooling, when the current temperature is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1, controlling the temperature regulating equipment to be increased to a high grade.
Optionally, the temperature regulating device is a fan.
According to another aspect of the embodiment of the present invention, there is also provided a control apparatus of a temperature adjusting device for performing heat dissipation processing on a chip of a domain controller, the domain controller being a controller provided on a vehicle, including: a first determining unit, configured to determine a current temperature of a chip of the domain controller and a temperature rise rate of the chip within a preset time interval; a second determining unit configured to determine a current operation mode of the temperature adjustment device; a third determining unit, configured to determine, in the current operation mode, a control strategy of the temperature adjustment device according to the current temperature and the temperature rise rate; and the control unit is used for controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller.
Optionally, the first determining unit includes: the sensing module is used for triggering the temperature sensing equipment to start after the vehicle is electrified so as to sense the environment temperature of a chip of the domain controller in a preset range, wherein the preset range is an area taking the chip as a center and a preset distance as a radius; and the first determining module is used for determining the current temperature of the chip according to the ambient temperature.
Optionally, the first determining module includes: the searching sub-module is used for searching in an environment temperature-chip temperature library by taking the environment temperature as an index to obtain a search result, wherein the environment temperature-chip temperature library is constructed according to a plurality of historical environment temperatures and a plurality of historical chip temperatures with corresponding relations; and the determining submodule is used for determining that a target temperature corresponding to the environmental temperature in the search result is the current temperature, wherein the plurality of historical environmental temperatures comprise a first historical environmental temperature with the same environmental temperature value, and the target temperature is a historical chip temperature corresponding to the first historical environmental temperature.
Optionally, the first determining module includes: a second determining module, configured to determine a start temperature of the chip at a start time point of the preset time interval and an end temperature of the chip at an end time point of the preset time interval; a third determining module, configured to determine a temperature difference between the start temperature and the end temperature; and a fourth determining module, configured to determine that a ratio of the temperature difference to a duration corresponding to the preset time interval is the temperature rise rate.
Optionally, the third determining unit includes: a fifth determining module, configured to determine, when the current operation mode is a downshift cooling mode, that the current temperature reaches a first temperature threshold, and that the temperature rise rate reaches a temperature rise rate threshold, that the control strategy is: controlling the temperature regulating device to execute a downshift operation, wherein the downshift cooling mode is that the temperature regulating device is in a wind speed gear reduction stage and the temperature regulating device is in a cooling state; a sixth determining module, configured to determine, when the current operation mode is an upshift cooling mode and the current temperature is determined to be within a predetermined temperature range, if the temperature rise rate is within a temperature rise rate range corresponding to the predetermined temperature range, the control strategy as: and performing upshift operation on the temperature regulating device, wherein the upshift cooling mode is that the temperature regulating device is in a wind speed gear step-up stage and the temperature regulating device is in a cooling state.
Optionally, the control device of the temperature adjustment apparatus further includes: the sixth determining module is configured to perform an upshift operation on the temperature adjustment device if it is determined that the current temperature is within the predetermined temperature range, and if the temperature rise rate is not within a temperature rise rate range corresponding to the predetermined temperature range, and the temperature rise rate is greater than an upper limit value of the temperature rise rate range.
Optionally, the fifth determining module includes: the first control submodule is used for controlling the temperature regulating equipment to close a cooling function when the current temperature is less than 50 ℃ and the temperature rise rate is less than or equal to 0 under the condition that the current actual state is low-gear cooling; the second control sub-module is used for controlling the rotating speed of the temperature regulating equipment to be reduced to a low gear when the current temperature is less than 60 ℃ and the temperature rise rate is less than or equal to 0 under the condition that the current actual state is middle gear cooling; and the third control sub-module is used for controlling the rotating speed of the temperature regulating equipment to be reduced to a middle gear when the current temperature is less than 85 ℃ and the temperature rise rate is less than or equal to 0 under the condition that the current actual state is high-gear cooling.
Optionally, the sixth determining module includes: the fourth control sub-module is used for controlling the temperature regulating equipment to be increased to a low level when the current temperature is greater than or equal to 56 ℃ and the temperature rise rate is greater than or equal to 0 under the condition that the current actual state is uncooled; a fifth control sub-module, configured to control the temperature adjustment device to be in a low gear when the current temperature is 56 ℃ or higher and the temperature rise rate is 0 or higher in the case that the current actual state is uncooled; and the sixth control submodule is used for controlling the temperature regulating equipment to be increased to a high grade when the current temperature is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1 under the condition that the current actual state is middle-grade cooling.
Optionally, the temperature regulating device is a fan.
According to another aspect of the embodiments of the present invention, there is also provided a computer-readable storage medium including a stored program, wherein the program executes the control method of the temperature adjustment apparatus of any one of the above.
According to another aspect of the embodiments of the present invention, there is also provided a processor for executing a program, wherein the program executes the control method of the temperature adjustment device of any one of the above.
In the embodiment of the invention, the current temperature of the chip of the domain controller and the temperature rise rate of the chip in a preset time interval are determined; determining a current operating mode of the thermostat; under the current operation mode, determining a control strategy of the temperature regulating equipment according to the chip temperature and the temperature rise rate; and controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller. According to the control method of the temperature regulating device, the temperature regulating device is controlled according to the current temperature and the temperature rise rate of the chip to be cooled on the premise of the current operation mode of the temperature regulating device, so that the chip is reasonably cooled, the reliability of the temperature regulating device is improved, the temperature regulating device can better cool the chip, and the technical problems that the cooling efficiency, the noise and the energy consumption cannot be balanced well in a cooling mode for cooling a domain controller in the related technology are solved, and the cooling reliability is low are solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a flowchart of a control method of a temperature adjusting apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a domain controller according to an embodiment of the invention;
fig. 3 is a schematic view of a control device of the temperature adjusting apparatus according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
According to an embodiment of the present invention, there is provided a method embodiment of a control method of a temperature adjustment device for performing heat dissipation processing on a chip of a domain controller, which is a controller provided on a vehicle, the steps shown in the flowchart of the drawings may be performed in a computer system such as a set of computer executable instructions, and, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in an order different from that here.
Fig. 1 is a flowchart of a control method of a temperature adjusting apparatus according to an embodiment of the present invention, as shown in fig. 1, the method including the steps of:
step S102, determining the current temperature of the chip of the domain controller and the temperature rise rate of the chip in a preset time interval.
In this embodiment, the current temperature of the chip of the domain controller and the temperature rise rate of the chip within the preset time interval may be collected, the heat dissipation mode of the chip is determined according to the two factors, and the heat dissipation mode of the chip is determined by combining the two factors, so that the temperature adjusting device may be controlled more accurately, the heat dissipation efficiency may be improved, and the energy consumption may be reduced.
Step S104, determining a current operation mode of the temperature adjustment device.
In this embodiment, the current operation mode of the temperature adjusting device may be determined, and used as a precondition for controlling the temperature adjusting device, and the control strategy of the temperature adjusting device is determined in combination with the current temperature and the temperature rise rate in the step S102, so that the accuracy of controlling the temperature adjusting device is further improved, and the heat dissipation efficiency is improved while the energy consumption is reduced.
Step S106, under the current operation mode, determining a control strategy of the temperature regulating device according to the chip temperature and the temperature rise rate.
In this embodiment, the control strategy of the temperature regulation apparatus may be determined according to the chip temperature and the temperature rise rate in the current operation mode of the temperature regulation apparatus, so as to perform better control on the temperature regulation apparatus.
Step S108, controlling the temperature regulating device according to the control strategy so as to utilize the temperature regulating device to conduct heat dissipation treatment on the chip of the domain controller.
From the above, in the embodiment of the present invention, the current temperature of the chip of the domain controller and the temperature rise rate of the chip within the preset time interval may be determined first; then determining the current operation mode of the temperature regulating equipment; then under the current operation mode, determining a control strategy of the temperature regulating equipment according to the chip temperature and the temperature rise rate; and then according to the control strategy control temperature regulation equipment to utilize temperature regulation equipment to carry out the heat dissipation to the chip of domain controller and handle, realized under the prerequisite of the current mode of temperature regulation equipment, according to the current temperature and the temperature rise rate of waiting to dispel the heat chip control temperature regulation equipment, with the purpose of carrying out reasonable heat dissipation to the chip, improved temperature regulation equipment's reliability for temperature regulation equipment can dispel the heat to the chip betterly.
Therefore, by the technical scheme provided by the embodiment of the invention, the technical problem that the heat dissipation reliability is lower because the heat dissipation mode for the domain controller in the related art cannot be well balanced with noise and energy consumption is solved.
According to the above embodiment of the present invention, determining the current temperature of the chip of the domain controller may include: triggering the temperature sensing equipment to start after the vehicle is electrified, and sensing the ambient temperature of a chip of the domain controller in a preset range, wherein the preset range is an area taking the chip as a center and a preset distance as a radius; and determining the current temperature of the chip according to the ambient temperature.
In this embodiment, after the vehicle is powered on, a temperature sensing device for sensing an ambient temperature within a predetermined range of the chip, which is provided on the vehicle, may be triggered to start to sense the ambient temperature within the predetermined range of the chip of the domain controller, so that a current temperature of the chip may be determined according to the ambient temperature.
In an alternative embodiment, the temperature sensing device may also be disposed at a predetermined position of the chip to collect the current temperature of the chip, so as to obtain a relatively accurate current temperature of the chip, and provide a better premise for controlling the temperature adjusting device.
According to the above embodiment of the present invention, determining the current temperature of the chip according to the ambient temperature includes: searching in an environment temperature-chip temperature library by taking the environment temperature as an index to obtain a search result, wherein the environment temperature-chip temperature library is constructed according to a plurality of historical environment temperatures and a plurality of historical chip temperatures with corresponding relations; and determining the target temperature corresponding to the environment temperature in the search result as the current temperature, wherein the plurality of historical environment temperatures comprise a first historical environment temperature with the same value as the environment temperature, and the target temperature is the historical chip temperature corresponding to the first historical environment temperature.
In this embodiment, the ambient temperature may be used as an index, and a search may be performed in an ambient temperature-chip temperature library to obtain a chip temperature corresponding to the ambient temperature.
The environmental temperature-chip temperature library is constructed according to a plurality of historical environmental temperatures and a plurality of historical chip temperatures with corresponding relations, and the corresponding relations of the plurality of historical environmental temperatures and the plurality of historical chip temperatures can be obtained according to historical tests.
According to the above embodiment of the present invention, determining a temperature rise rate of a chip of a domain controller in a preset time interval includes: determining the initial temperature of the chip at the initial time point of the preset time interval and the end temperature of the chip at the end time point of the preset time interval; determining a temperature difference between the starting temperature and the end temperature; and determining the ratio of the time length corresponding to the temperature difference value and the preset time interval as the temperature rise rate.
In this embodiment, the chip temperatures, i.e., the start temperature and the end temperature, at the start time point and the end time point of the preset time interval may be determined. The temperature rise rate can then be determined from the ratio of the temperature difference between the starting temperature and the end temperature to the duration of the preset time interval.
For example, the difference between the current time temperature and the temperature 1 minute ago may be taken as the rate of temperature rise.
According to the above embodiment of the present invention, in the current operation mode, determining a control strategy of the temperature adjusting device according to the current temperature and the temperature rise rate includes: when the current operation mode is a downshift cooling mode, determining that the current temperature reaches a first temperature threshold and determining that the temperature rise rate reaches a temperature rise rate threshold, determining that the control strategy is: controlling the temperature regulating device to execute a downshift operation, wherein the downshift cooling mode is that the temperature regulating device is in a wind speed gear reduction stage and the temperature regulating device is in a cooling state; when the current operation mode is the upshift cooling mode, when the current temperature is determined to be within a predetermined temperature range, if the temperature rise rate is within a temperature rise rate range corresponding to the predetermined temperature range, determining a control strategy as: and performing upshift operation on the temperature regulating device, wherein the upshift cooling mode is that the temperature regulating device is in a wind speed gear step-up stage and the temperature regulating device is in a cooling state.
The air cooling structure is simple, the cost is low, and the air cooling structure is a common heat dissipation mode. The fan can be directly powered by the PCB of the domain controller, and no other external equipment is provided, so that the installation is convenient. In an embodiment of the present invention, the temperature adjusting device may be a fan. Fig. 2 is a schematic view of a domain controller according to an embodiment of the present invention, and as shown in fig. 2, a fan is provided at a predetermined position of the domain controller, and the fan is used to radiate heat from a chip of the domain controller.
In this embodiment, when the current operation mode of the temperature adjustment device is the down-shift cooling mode, the current temperature and the temperature rise rate are in a "and" relationship, the current temperature reaches the limit value and the temperature rise rate satisfies the requirement, and the down-shift action is taken. On the contrary, when the current operation mode of the temperature regulating device is an upshift cooling mode, the temperature is preferentially referred, different cooling gears are adopted according to the temperature of the chip, and upshift cooling is performed at a temperature rise rate which is satisfied in a corresponding temperature range, for example, in low-gear cooling, the temperature is less than 75 ℃, but the temperature rise rate n >2 is also increased to a middle-gear cooling, so that upshift is advanced according to the change of the temperature rate, and the air cooling structure with weaker heat dissipation capacity is safer.
According to the above embodiment of the present invention, the control method of the temperature adjustment apparatus further includes: and under the condition that the temperature of the chip is determined to be in the preset temperature range, if the temperature rise rate is not in the temperature rise rate range corresponding to the preset temperature range, and if the temperature rise rate is greater than the upper limit value of the temperature rise rate range, performing upshift operation on the temperature regulating equipment.
In this embodiment, as in the above-described embodiment, the temperature is preferentially referred to, different cooling steps are taken according to the chip temperature, and the temperature rise rate is satisfied in the corresponding temperature range, and upshift cooling is performed.
According to the above-described embodiment of the present invention, controlling the temperature adjustment device to perform the downshift operation includes: under the condition that the current actual state is low-gear cooling, when the current temperature is less than 50 ℃ and the temperature rise rate is less than or equal to 0, controlling the temperature regulating equipment to close the cooling function; under the condition that the current actual state is middle gear cooling, when the current temperature is less than 60 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of the temperature regulating equipment to be reduced to a low gear; in the case where the current actual state is the high-range cooling, when the current temperature is less than 85 ℃ and the temperature rise rate is 0 or less, the rotational speed of the temperature adjusting device is controlled to be reduced to the medium range.
Wherein table 1 shows the relationship among the current operation mode of the temperature adjusting device, the state of the temperature adjusting device, the chip temperature, the rate of temperature rise, and the actions that the temperature adjusting device needs to perform.
TABLE 1
As can be seen from table 1 above, when the temperature adjusting device is in the downshift cooling mode and the current actual state is the downshift cooling, when the current temperature of the chip is less than 50 ℃ and the temperature rise rate is 0 or less, the temperature adjusting device is controlled to turn off the cooling function; under the condition that the current actual state is middle gear cooling, when the current temperature of the chip is less than 60 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of temperature regulating equipment to be reduced to a low gear; under the condition that the current actual state is high-gear cooling, when the current temperature of the chip is less than 85 ℃ and the temperature rise rate is less than or equal to 0, the rotating speed of the temperature regulating equipment is controlled to be reduced to a middle gear.
According to the above embodiment of the present invention, an upshift operation is performed on a temperature adjustment device, including: under the condition that the current actual state is uncooled, when the current temperature of the chip is more than or equal to 56 ℃ and the temperature rise rate is more than or equal to 0, controlling the temperature regulating equipment to rise to a low grade; under the condition that the current actual state is low-grade cooling, when the current temperature of the chip is more than or equal to 56 ℃ and less than or equal to 75 ℃ and the temperature rise rate is more than 2, controlling the temperature regulating equipment to rise to a middle grade; under the condition that the current actual state is middle-grade cooling, when the current temperature of the chip is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1, controlling the temperature regulating equipment to rise to a high grade.
As is clear from the above table 1, when the temperature adjusting device is in the upshift cooling mode, in the case where the current actual state is uncooled, when the chip temperature is 56 ℃ or higher and the temperature rise rate is 0 or higher, the temperature adjusting device is controlled to be in a low gear; under the condition that the current actual state is low-grade cooling, when the temperature of the chip is more than or equal to 56 ℃ and less than or equal to 75 ℃ and the temperature rise rate is more than 2, controlling the temperature regulating equipment to rise to a middle grade; under the condition that the current actual state is middle-grade cooling, when the temperature of the chip is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1, the temperature regulating equipment is controlled to be increased to a high grade.
According to the control method of the temperature regulating device, which is provided by the embodiment of the invention, the fan control strategy is executed according to the chip temperature and the temperature rise rate. Specifically, (1) according to the current working mode, in order to ensure that the chip is not over-heated and the fan noise is as low as possible, the energy consumption is low and the chip is in a low-power state; (2) the air cooling heat dissipation capacity is weak, and the rotating speed of the fan is adjusted according to the temperature rise rate of the chip in order to cope with the rapid increase of the heat productivity of the chip; (3) the scheme is more comfortable and economical by implementing multi-stage cooling, namely, the fan is in a low-speed state as much as possible. Under the condition that the temperature regulating equipment is a fan, the rotating speed of the fan can be divided into three gears, and the control strategy of the fan is determined according to the current temperature and the temperature rise rate. Namely, the rotating speed of the fan is adjusted in real time according to the temperature of the chip, so that the fan is more energy-saving and has smaller noise, meanwhile, the temperature rise rate is combined for control, and the chip over-temperature risk of the air-cooled domain controller is reduced.
It should be noted that, for simplicity of description, the foregoing method embodiments are all expressed as a series of action combinations, but it should be understood by those skilled in the art that the present application is not limited by the order of actions described, as some steps may be performed in other order or simultaneously in accordance with the present application. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required in the present application.
From the description of the above embodiments, it will be clear to a person skilled in the art that the method according to the above embodiments may be implemented by means of software plus the necessary general hardware platform, but of course also by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk), comprising several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method described in the embodiments of the present application.
According to an embodiment of the present invention, there is also provided a control apparatus of a temperature adjustment device for implementing the control method of a temperature adjustment device, where the temperature adjustment device is used to perform heat dissipation processing on a chip of a domain controller, and the domain controller is a controller provided on a vehicle, and fig. 3 is a schematic diagram of the control apparatus of the temperature adjustment device according to the embodiment of the present invention, as shown in fig. 3, where the apparatus includes: a first determination unit 31, a second determination unit 33, a third determination unit 35, and a control unit 37. The control device of the temperature adjusting apparatus will be described below.
The first determining unit 31 is configured to determine a current temperature of the chip of the domain controller and a temperature rise rate of the chip within a preset time interval.
A second determining unit 33 for determining a current operation mode of the temperature regulating device.
And a third determining unit 35, configured to determine a control strategy of the temperature adjusting device according to the current temperature and the temperature rise rate in the current operation mode.
A control unit 37 for controlling the temperature adjusting device according to the control strategy to perform heat dissipation processing on the chip of the domain controller by using the temperature adjusting device.
Here, it should be noted that the first determining unit 31, the second determining unit 33, the third determining unit 35, and the control unit 37 described above correspond to steps S102 to S108 in the embodiment, and the four units are the same as examples and application scenarios implemented by the corresponding steps, but are not limited to those disclosed in the above embodiments.
As can be seen from the above, in the solution described in the above embodiment of the present invention, the current temperature of the chip of the domain controller and the temperature rise rate of the chip within the preset time interval may be determined by using the first determining unit; then determining a current operation mode of the temperature regulating device by using a second determining unit; then, a third determining unit is utilized to determine a control strategy of the temperature regulating device according to the current temperature and the temperature rise rate in the current operation mode; and the control unit is used for controlling the temperature regulating device according to a control strategy so as to utilize the temperature regulating device to perform heat dissipation treatment on the chip of the domain controller, so that the temperature regulating device is controlled according to the current temperature and the temperature rise rate of the chip to be cooled on the premise of the current operation mode of the temperature regulating device, the purpose of reasonably dissipating heat on the chip is achieved, the reliability of the temperature regulating device is improved, and the temperature regulating device can be used for better dissipating heat on the chip.
Therefore, by the technical scheme provided by the embodiment of the invention, the technical problem that the heat dissipation reliability is lower because the heat dissipation mode for the domain controller in the related art cannot be well balanced with noise and energy consumption is solved.
In an alternative embodiment, the first determining unit comprises: the sensing module is used for triggering the temperature sensing equipment to start after the vehicle is electrified so as to sense the ambient temperature of a chip of the domain controller in a preset range, wherein the preset range is an area taking the chip as a center and a preset distance as a radius; the first determining module is used for determining the current temperature of the chip according to the ambient temperature.
In an alternative embodiment, the first determining module includes: the searching sub-module is used for searching in an environment temperature-chip temperature library by taking the environment temperature as an index to obtain a searching result, wherein the environment temperature-chip temperature library is constructed according to a plurality of historical environment temperatures and a plurality of historical chip temperatures with corresponding relations; and the determining submodule is used for determining that the target temperature corresponding to the environmental temperature in the search result is the current temperature, wherein the plurality of historical environmental temperatures comprise first historical environmental temperatures with the same value as the environmental temperature, and the target temperature is the historical chip temperature corresponding to the first historical environmental temperatures.
In an alternative embodiment, the first determining module includes: the second determining module is used for determining the initial temperature of the chip at the initial time point of the preset time interval and the end temperature of the chip at the end time point of the preset time interval; the third determining module is used for determining a temperature difference value between the initial temperature and the end temperature; and the fourth determining module is used for determining that the ratio of the temperature difference to the duration corresponding to the preset time interval is the temperature rise rate.
In an alternative embodiment, the third determining unit comprises: a fifth determining module, configured to determine, when the current operation mode is a downshift cooling mode, that the current temperature reaches a first temperature threshold, and that the temperature rise rate reaches a temperature rise rate threshold, that the control strategy is: controlling the temperature regulating device to execute a downshift operation, wherein the downshift cooling mode is that the temperature regulating device is in a wind speed gear reduction stage and the temperature regulating device is in a cooling state; a sixth determining module, configured to determine, when the current operation mode is the upshift cooling mode and the current temperature is determined to be within a predetermined temperature range, if the temperature rise rate is within a temperature rise rate range corresponding to the predetermined temperature range, a control strategy as: and performing upshift operation on the temperature regulating device, wherein the upshift cooling mode is that the temperature regulating device is in a wind speed gear step-up stage and the temperature regulating device is in a cooling state.
In an alternative embodiment, the control device of the temperature adjusting apparatus further includes: and a sixth determining module, configured to perform an upshift operation on the temperature adjustment device if it is determined that the current temperature is within the predetermined temperature range, and if the temperature rise rate is not within the temperature rise rate range corresponding to the predetermined temperature range and the temperature rise rate is greater than an upper limit value of the temperature rise rate range.
In an alternative embodiment, the fifth determining module includes: the first control submodule is used for controlling the temperature regulating equipment to close the cooling function when the current temperature is less than 50 ℃ and the temperature rise rate is less than or equal to 0 under the condition that the current actual state is low-gear cooling; the second control sub-module is used for controlling the rotating speed of the temperature regulating equipment to be reduced to a low gear when the current temperature is less than 60 ℃ and the temperature rise rate is less than or equal to 0 under the condition that the current actual state is middle gear cooling; and the third control sub-module is used for controlling the rotating speed of the temperature regulating equipment to be reduced to a middle gear when the current temperature is less than 85 ℃ and the temperature rise rate is less than or equal to 0 under the condition that the current actual state is high-gear cooling.
In an alternative embodiment, the sixth determination module includes: the fourth control sub-module is used for controlling the temperature regulating equipment to be increased to a low level when the current temperature of the chip is more than or equal to 56 ℃ and the temperature rise rate is more than or equal to 0 under the condition that the current actual state is uncooled; a fifth control sub-module, configured to control the temperature adjusting device to be in a low gear when the current temperature of the chip is 56 ℃ or higher and the temperature rise rate is 0 or higher in the case that the current actual state is uncooled; and the sixth control submodule is used for controlling the temperature regulating equipment to be increased to a high grade when the current temperature of the chip is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1 under the condition that the current actual state is middle-grade cooling.
In an alternative embodiment, the temperature regulating device is a fan.
According to another aspect of the embodiments of the present invention, there is also provided a computer-readable storage medium including a stored program, wherein the program performs the control method of the temperature adjustment device of any one of the above.
Alternatively, in the present embodiment, the above-described computer-readable storage medium may be located in any one of a group of computer terminals in a computer network, or in any one of a group of communication devices.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: determining the current temperature of a chip of the domain controller and the temperature rise rate of the chip in a preset time interval; determining a current operating mode of the thermostat; under the current operation mode, determining a control strategy of the temperature regulating equipment according to the chip temperature and the temperature rise rate; and controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: triggering the temperature sensing equipment to start after the vehicle is electrified, and sensing the ambient temperature of a chip of the domain controller in a preset range, wherein the preset range is an area taking the chip as a center and a preset distance as a radius; and determining the current temperature of the chip according to the ambient temperature.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: searching in an environment temperature-chip temperature library by taking the environment temperature as an index to obtain a search result, wherein the environment temperature-chip temperature library is constructed according to a plurality of historical environment temperatures and a plurality of historical chip temperatures with corresponding relations; and determining the target temperature corresponding to the environment temperature in the search result as the current temperature, wherein the plurality of historical environment temperatures comprise a first historical environment temperature with the same value as the environment temperature, and the target temperature is the historical chip temperature corresponding to the first historical environment temperature.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: determining the initial temperature of the chip at the initial time point of the preset time interval and the end temperature of the chip at the end time point of the preset time interval; determining a temperature difference between the starting temperature and the end temperature; and determining the ratio of the time length corresponding to the temperature difference value and the preset time interval as the temperature rise rate.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: under the condition that the current operation mode is a downshift cooling mode, determining that the temperature of the chip reaches a first temperature threshold value and determining that the temperature rise rate reaches a temperature rise rate threshold value, determining that the control strategy is: controlling the temperature regulating device to execute a downshift operation, wherein the downshift cooling mode is that the temperature regulating device is in a wind speed gear reduction stage and the temperature regulating device is in a cooling state; when the current operation mode is the upshift cooling mode, when the chip temperature is determined to be within a predetermined temperature range, if the temperature rise rate is within a temperature rise rate range corresponding to the predetermined temperature range, determining a control strategy as: and performing upshift operation on the temperature regulating device, wherein the upshift cooling mode is that the temperature regulating device is in a wind speed gear step-up stage and the temperature regulating device is in a cooling state.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: and under the condition that the temperature of the chip is determined to be in the preset temperature range, if the temperature rise rate is not in the temperature rise rate range corresponding to the preset temperature range, and if the temperature rise rate is greater than the upper limit value of the temperature rise rate range, performing upshift operation on the temperature regulating equipment.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: under the condition that the current actual state is low-gear cooling, when the temperature of the chip is less than 50 ℃ and the temperature rise rate is less than or equal to 0, controlling the temperature regulating equipment to close the cooling function; under the condition that the current actual state is middle gear cooling, when the temperature of the chip is less than 60 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of temperature regulating equipment to be reduced to a low gear; in the case where the current actual state is the high-range cooling, when the chip temperature is less than 85 ℃ and the temperature rise rate is 0 or less, the rotational speed of the temperature adjusting device is controlled to be reduced to the medium range.
Optionally, in the present embodiment, the computer readable storage medium is configured to store program code for performing the steps of: when the current actual state is uncooled, controlling the temperature regulating equipment to be in a low grade when the temperature of the chip is more than or equal to 56 ℃ and the temperature rise rate is more than or equal to 0; under the condition that the current actual state is low-grade cooling, when the temperature of the chip is more than or equal to 56 ℃ and less than or equal to 75 ℃ and the temperature rise rate is more than 2, controlling the temperature regulating equipment to rise to a middle grade; under the condition that the current actual state is middle-grade cooling, when the temperature of the chip is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1, the temperature regulating equipment is controlled to be increased to a high grade.
According to another aspect of the embodiments of the present invention, there is also provided a processor for executing a program, wherein the program executes the control method of the temperature adjusting apparatus of any one of the above.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
In the foregoing embodiments of the present invention, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments.
In the several embodiments provided in the present application, it should be understood that the disclosed technology content may be implemented in other manners. The above-described embodiments of the apparatus are merely exemplary, and the division of the units, for example, may be a logic function division, and may be implemented in another manner, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interfaces, units or modules, or may be in electrical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied essentially or in part or all of the technical solution or in part in the form of a software product stored in a storage medium, including instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-only Memory (ROM), a random access Memory (RAM, random Access Memory), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The control method of the temperature regulating device is characterized in that the temperature regulating device is used for carrying out heat dissipation treatment on a chip of a domain controller, and the domain controller is a controller arranged on a vehicle and comprises the following steps:
determining the current temperature of a chip of the domain controller and the temperature rise rate of the chip in a preset time interval;
determining a current operating mode of the thermostat;
in the current operation mode, determining a control strategy of the temperature regulating device according to the current temperature and the temperature rise rate;
and controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller.
2. The control method of a temperature adjustment device according to claim 1, characterized in that determining a current temperature of a chip of the domain controller includes:
Triggering a temperature sensing device to start after the vehicle is electrified so as to sense the ambient temperature of a chip of the domain controller in a preset range, wherein the preset range is an area taking the chip as a center and a preset distance as a radius;
and determining the current temperature of the chip according to the ambient temperature.
3. The control method of a temperature adjustment device according to claim 2, characterized in that determining the current temperature of the chip from the ambient temperature includes:
searching in an environment temperature-chip temperature library by taking the environment temperature as an index to obtain a search result, wherein the environment temperature-chip temperature library is constructed according to a plurality of historical environment temperatures and a plurality of historical chip temperatures with corresponding relations;
and determining a target temperature corresponding to the environmental temperature in the search result as the current temperature, wherein the plurality of historical environmental temperatures comprise a first historical environmental temperature with the same environmental temperature value, and the target temperature is a historical chip temperature corresponding to the first historical environmental temperature.
4. The control method of a temperature adjustment device according to claim 1, wherein determining a rate of temperature rise of a chip of the domain controller in a preset time interval includes:
Determining a start temperature of the chip at a start time point of the preset time interval and an end temperature of the chip at an end time point of the preset time interval;
determining a temperature difference between the starting temperature and the ending temperature;
and determining the ratio of the time length corresponding to the temperature difference value and the preset time interval as the temperature rise rate.
5. The control method of a temperature adjustment device according to claim 1, characterized in that in the current operation mode, a control strategy of the temperature adjustment device is determined according to the current temperature and the rate of temperature rise, comprising:
and determining the control strategy as: controlling the temperature regulating device to execute a downshift operation, wherein the downshift cooling mode is that the temperature regulating device is in a wind speed gear reduction stage and the temperature regulating device is in a cooling state;
when the current operation mode is the upshift cooling mode and the current temperature is determined to be within a predetermined temperature range, if the temperature rise rate is within a temperature rise rate range corresponding to the predetermined temperature range, determining the control strategy as: and performing upshift operation on the temperature regulating device, wherein the upshift cooling mode is that the temperature regulating device is in a wind speed gear step-up stage and the temperature regulating device is in a cooling state.
6. The control method of a temperature adjustment device according to claim 5, characterized by further comprising:
and under the condition that the current temperature is determined to be in the preset temperature range, if the temperature rise rate is not in the temperature rise rate range corresponding to the preset temperature range, and the temperature rise rate is larger than the upper limit value of the temperature rise rate range, performing upshift operation on the temperature regulating equipment.
7. The control method of a temperature adjustment device according to claim 5, characterized by controlling the temperature adjustment device to perform a downshift operation, comprising:
under the condition that the current actual state is low-gear cooling, when the current temperature is less than 50 ℃ and the temperature rise rate is less than or equal to 0, controlling the temperature regulating equipment to close a cooling function;
under the condition that the current actual state is middle gear cooling, when the current temperature is less than 60 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of the temperature regulating equipment to be reduced to a low gear;
and when the current actual state is high-gear cooling, and the current temperature is less than 85 ℃ and the temperature rise rate is less than or equal to 0, controlling the rotating speed of the temperature regulating equipment to be reduced to a middle gear.
8. The control method of a temperature adjustment device according to claim 5, characterized in that performing an upshift operation on the temperature adjustment device includes:
when the current actual state is uncooled, controlling the temperature regulating equipment to rise to a low level when the current temperature is 56 ℃ or higher and the temperature rise rate is 0 or higher;
under the condition that the current actual state is low-grade cooling, when the current temperature is more than or equal to 56 ℃ and less than or equal to 75 ℃ and the temperature rise rate is more than 2, controlling the temperature regulating equipment to rise to a middle grade;
and under the condition that the current actual state is middle-grade cooling, when the current temperature is more than 75 ℃ and less than or equal to 90 ℃ and the temperature rise rate is more than 1, controlling the temperature regulating equipment to be increased to a high grade.
9. The utility model provides a controlling means of temperature regulation equipment, its characterized in that, temperature regulation equipment is used for carrying out the heat dissipation to the chip of domain controller, domain controller is the controller that sets up on the vehicle, includes:
a first determining unit, configured to determine a current temperature of a chip of the domain controller and a temperature rise rate of the chip within a preset time interval;
A second determining unit configured to determine a current operation mode of the temperature adjustment device;
a third determining unit, configured to determine, in the current operation mode, a control strategy of the temperature adjustment device according to the current temperature and the temperature rise rate;
and the control unit is used for controlling the temperature regulating equipment according to the control strategy so as to utilize the temperature regulating equipment to perform heat dissipation treatment on the chip of the domain controller.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium includes a stored program, wherein the program executes the control method of the temperature adjustment device according to any one of claims 1 to 8.
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| CN202310574995.1A CN116382378A (en) | 2023-05-19 | 2023-05-19 | Control method and device of temperature regulating equipment |
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| CN202310574995.1A CN116382378A (en) | 2023-05-19 | 2023-05-19 | Control method and device of temperature regulating equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117130408A (en) * | 2023-10-25 | 2023-11-28 | 合肥为国半导体有限公司 | Temperature-based control method and system for target chip and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117130408A (en) * | 2023-10-25 | 2023-11-28 | 合肥为国半导体有限公司 | Temperature-based control method and system for target chip and storage medium |
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