CN116381437A - Firm semiconductor product test fixture fixes a position - Google Patents
Firm semiconductor product test fixture fixes a position Download PDFInfo
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- CN116381437A CN116381437A CN202310109048.5A CN202310109048A CN116381437A CN 116381437 A CN116381437 A CN 116381437A CN 202310109048 A CN202310109048 A CN 202310109048A CN 116381437 A CN116381437 A CN 116381437A
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- 238000012360 testing method Methods 0.000 title claims abstract description 80
- 239000004065 semiconductor Substances 0.000 title claims abstract description 67
- 230000005540 biological transmission Effects 0.000 claims abstract description 37
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052742 iron Inorganic materials 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 34
- 238000001514 detection method Methods 0.000 claims description 10
- 230000000670 limiting effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 description 5
- 230000005389 magnetism Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor product testing jig with stable positioning, which comprises a base, wherein four corners of the top of the base are fixedly connected with a rack through bolts, the surface of the rack is provided with a transmission assembly, the surface of the transmission assembly is provided with a fixing assembly, the right rear of the top of the base is fixedly connected with a vertical plate through bolts, the surface of the vertical plate is provided with an adjusting assembly, the surface of the adjusting assembly is provided with a U-shaped rod, the surface of the U-shaped rod is provided with a testing assembly, and the right side of the top of the base is provided with a receiving and distributing assembly. According to the utility model, the semiconductor product can be stably positioned and fixed by the placement box, the square rod, the clamping plate, the first spring, the iron block, the connecting plate and the electromagnet, meanwhile, the semiconductor product can be conveniently and automatically discharged after the test is finished, the semiconductor product after the test is not required to be manually taken out, the test efficiency of the device is improved, and the working strength of operators is reduced.
Description
Technical Field
The utility model relates to the technical field of semiconductor product testing, in particular to a semiconductor product testing jig with stable positioning.
Background
The semiconductor component is an electronic component with conductivity between good conductor and insulator, and the semiconductor component is tested after production by utilizing the special electrical characteristics of semiconductor materials.
The utility model patent of patent application publication number CN216848016U discloses a test fixture for semiconductor components, which comprises a table top, a transmission belt and a bottom plate, wherein the table top is positioned above the transmission belt, the bottom plate is positioned below the transmission belt, a pair of transmission wheels which are distributed left and right are arranged on the inner side of the transmission belt in an inserted manner, transmission shafts are arranged on the circle centers of the two transmission wheels in an inserted manner, an electromagnet is electrified to enable a spring to push a clamping piece to clamp the semiconductor components to be tested, a motor drives a transmission box to drive the transmission belt, the transmission box enables the semiconductor components to be tested to be transmitted, a telescopic rod enables a strip piece to move up and down along the front of a supporting piece, and the problems that the conventional semiconductor components test fixture is inconvenient to clamp the semiconductor components, the semiconductor components are inconvenient to shift in the test process, and a metal rod is inconvenient to adjust, so that the test is inconvenient are solved.
However, the device still has some defects when in actual use, and more obviously, the electromagnet is arranged in the conveying box to magnetically attract the clamping piece and fix the semiconductor product under the action of the spring, because the electromagnet needs to be connected with the wire and can generate magnetism, the conveying box continuously rotates on the transmission belt to cause the wire to wind, the normal test is influenced to a certain extent, the use requirement cannot be met, and the semiconductor product which is qualified or unqualified in test cannot be shunted and discharged, so that the operation needs to be performed manually, and the step is complicated and the strength is high.
Therefore, it is necessary to provide a firmly positioned semiconductor product testing fixture to solve the above problems.
Disclosure of Invention
The utility model aims to provide a semiconductor product testing jig with stable positioning, which has the advantages of stable positioning, convenience in blanking and shunting and discharging, and solves the problems that the electromagnet needs to be connected with a wire to generate magnetism, the wire is wound due to the fact that a conveying box continuously rotates on a driving belt, the using requirement cannot be met, and the semiconductor product which is qualified or unqualified in testing cannot be shunted and discharged.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a fix a position firm semiconductor product test fixture, includes the base, the four corners at base top all is through bolt fixedly connected with frame, the surface mounting of frame has transmission unit, transmission unit's surface mounting has fixed subassembly, the right rear at base top is through bolt fixedly connected with riser, the surface mounting of riser has adjusting part, adjusting part's surface mounting has U type pole, the surface mounting of U type pole has test unit, connect the material reposition of redundant personnel subassembly is installed on the right side at base top, and bolt fixedly connected with connecting plate is passed through on the right side of frame on right side, the electro-magnet is installed to the inner wall of connecting plate, detection assembly is installed in the front of riser.
Preferably, the transmission assembly comprises a roller, two ends of the roller are movably embedded on one side of the frame through bearings, a transmission belt is connected to the surface of the roller in a transmission mode, a first motor is fixedly connected to the back face of the frame on the left rear side through bolts, and a rotating shaft of the first motor is fixedly connected with the rear end of the roller on the left side.
Preferably, the fixed subassembly is including placing the box, one side of placing the box is slided and is run through and be provided with the square pole, the one end fixedly connected with splint that the square pole is located the box inner chamber are placed to the square pole, the square pole is located the outside one end fixedly connected with iron plate of placing the box, the surperficial movable sleeve of square pole one end is equipped with spring one, the both ends of spring one respectively with one side of splint and the inner wall fixed connection of placing the box.
Preferably, the adjusting component comprises a first hydraulic cylinder, one side of the first hydraulic cylinder is fixedly connected with the back of the vertical plate through a bolt, the output end of the first hydraulic cylinder penetrates through the vertical plate and is fixedly connected with a supporting plate through the bolt, the top of the front face of the vertical plate is slidably penetrated through and is provided with a first guide rod, the front end of the first guide rod is welded with the back of the supporting plate, the top of the supporting plate is fixedly connected with a second hydraulic cylinder through the bolt, the output end of the second hydraulic cylinder penetrates through the supporting plate and is fixedly connected with the top of the U-shaped rod, the top of the supporting plate is slidably penetrated through and is provided with a second guide rod, and the bottom of the second guide rod is welded with the top of the U-shaped rod.
Preferably, the test assembly comprises a sliding sleeve, the surface at the U type pole is established to the sliding sleeve slip cap, the positive screw thread of sliding sleeve is inlayed and is connected with fastening bolt, the bottom of sliding sleeve is through the electronic telescopic link of bolt fixedly connected with, the bottom of electronic telescopic link is through bolt fixedly connected with casing, the bottom slip of casing runs through and is provided with the test head, the top fixedly connected with square of test head, the top movable sleeve on test head surface is equipped with spring two, the both ends of spring two respectively with one side of square and the inner wall fixed connection of casing.
Preferably, connect material reposition of redundant personnel subassembly includes the L template, the right side fixed connection at the bottom of L template through bolt and base top, the top slip of L template runs through and is provided with the slide bar, the top of slide bar passes through bolt fixedly connected with and connects the material frame, the surface movable sleeve of slide bar is equipped with the spring III, the both ends of spring III respectively with one side fixed connection of L template and material frame, connect the bottom of material frame to pass through bolt fixedly connected with vibration motor, connect the right side of material frame bottom to pass through bolt fixedly connected with motor two, the pivot of motor two runs through and connects the material frame and fixedly connected with baffle.
Preferably, the detection assembly comprises a first short plate, the back surface of the first short plate is fixedly connected with the front surface of the vertical plate through a bolt, the bottom of the first short plate is fixedly provided with a transmitter, the front surface of the vertical plate is fixedly connected with a second short plate through a bolt, and the top of the second short plate is fixedly provided with a receiver.
Preferably, the bottom of receiving the material frame inner chamber fixedly connected with blotter, the bottom fixedly connected with limiting plate of slide bar.
Compared with the prior art, the utility model has the following beneficial effects:
1. the utility model has the advantages of being capable of stably positioning and fixing the semiconductor products through the cooperation of the placement box, the square rod, the clamping plate, the first spring, the iron block, the connecting plate and the electromagnet, and simultaneously, the semiconductor products are convenient to automatically discharge after the test is finished, the semiconductor products after the test are not required to be manually taken out, the test efficiency of the device is improved, and the working strength of operators is reduced.
2. The utility model has the advantages of testing the semiconductor products after fixed transmission through the matching of the sliding sleeve, the fastening bolt, the electric telescopic rod, the shell, the testing head, the square block, the spring II, the adjusting component and the U-shaped rod, can adjust the number of the testing heads according to the specific conditions of the semiconductor products, can adjust the longitudinal position of the testing head, is adapted according to the concave-convex conditions of the semiconductor products, and improves the flexibility of device testing.
3. According to the utility model, through the matching of the L-shaped plate, the slide bar, the material receiving frame, the spring III, the vibration motor, the motor II and the guide plate, the semiconductor product discharging device has the advantages of being capable of receiving and distributing the semiconductor product after the test is completed, and the qualified and unqualified semiconductor products are discharged separately, so that the separation and collection are convenient, and the labor intensity of operators is reduced.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a rear perspective view of the present utility model;
FIG. 3 is a partially cut-away schematic perspective view of the present utility model;
FIG. 4 is an enlarged schematic view of FIG. 3A in accordance with the present utility model;
FIG. 5 is a schematic perspective view of an adjustment assembly and a detection assembly of the present utility model;
fig. 6 is a schematic perspective view of the material receiving and distributing assembly of the present utility model.
In the figure: 1 base, 2 frame, 3 transmission assembly, 31 roller, 32 conveyer belt, 33 motor one, 4 fixed subassembly, 41 place box, 42 square pole, 43 splint, 44 spring one, 45 iron block, 5 riser, 6 adjustment subassembly, 61 pneumatic cylinder one, 62 backup pad, 63 guide arm one, 64 pneumatic cylinder two, 65 guide arm two, 7U type pole, 8 test subassembly, 81 sliding sleeve, 82 fastening bolt, 83 electric telescopic handle, 84 casing, 85 test head, 86 square, 87 spring two, 9 connect material reposition of redundant personnel subassembly, 91L template, 92 slide bar, 93 connect the material frame, 94 spring three, 95 vibrating motor, 96 motor two, 97 baffle, 10 connecting plate, 11 electro-magnet, 12 detection subassembly, 121 short plate one, 122 transmitter, 123 short plate two, 124 receiver, 13 blotter.
Detailed Description
Referring to fig. 1-6, a semiconductor product testing jig with stable positioning comprises a base 1, wherein four corners of the top of the base 1 are fixedly connected with a frame 2 through bolts, a transmission assembly 3 is arranged on the surface of the frame 2, a fixing assembly 4 is arranged on the surface of the transmission assembly 3, a vertical plate 5 is fixedly connected to the right rear side of the top of the base 1 through bolts, an adjusting assembly 6 is arranged on the surface of the vertical plate 5, a U-shaped rod 7 is arranged on the surface of the adjusting assembly 6, a testing assembly 8 is arranged on the surface of the U-shaped rod 7, a material receiving and distributing assembly 9 is arranged on the right side of the top of the base 1, a connecting plate 10 is fixedly connected to the right side of the frame 2 on the right side through bolts, an electromagnet 11 is arranged on the inner wall of the connecting plate 10, and a detection assembly 12 is arranged on the front side of the vertical plate 5;
the transmission assembly 3 comprises a roller 31, two ends of the roller 31 are movably embedded on one side of the frame 2 through bearings, a transmission belt 32 is connected to the surface of the roller 31 in a transmission way, a motor I33 is fixedly connected to the back surface of the frame 2 on the left rear side through bolts, a rotating shaft of the motor I33 is fixedly connected with the rear end of the roller 31 on the left side, the transmission of a plurality of fixed assemblies 4 is realized through arranging the roller 31, the transmission belt 32 and the motor I33, undetected semiconductor products are transmitted to the bottom of the test assembly 8, and the tested semiconductor products are moved out of the bottom of the test assembly 8;
the fixed component 4 comprises a placing box 41, one side of the placing box 41 is provided with a square rod 42 in a sliding penetrating mode, one end of the square rod 42, which is positioned at the inner cavity of the placing box 41, is fixedly connected with a clamping plate 43, one end of the square rod 42, which is positioned at the outer part of the placing box 41, is fixedly connected with an iron block 45, a spring I44 is movably sleeved on the surface of one end of the square rod 42, two ends of the spring I44 are respectively fixedly connected with one side of the clamping plate 43 and the inner wall of the placing box 41, one side of the placing box 41 is fixedly connected with the surface of the conveying belt 32, and through the iron block 45, when the fixed component 4 moves to the right end of the device, the electrified electromagnet 11 pulls the square rod to generate suction force, so that the clamping plate 43 moves, and an inclined semiconductor product falls onto the material receiving and distributing component 9;
the adjusting component 6 comprises a first hydraulic cylinder 61, one side of the first hydraulic cylinder 61 is fixedly connected with the back of the vertical plate 5 through a bolt, the output end of the first hydraulic cylinder 61 penetrates through the vertical plate 5 and is fixedly connected with a supporting plate 62 through the bolt, the top of the front of the vertical plate 5 is slidably penetrated through a first guide rod 63, the front end of the first guide rod 63 is welded with the back of the supporting plate 62, the top of the supporting plate 62 is fixedly connected with a second hydraulic cylinder 64 through the bolt, the output end of the second hydraulic cylinder 64 penetrates through the supporting plate 62 and is fixedly connected with the top of the U-shaped rod 7, the top of the supporting plate 62 is slidably penetrated through a second guide rod 65, the bottom of the second guide rod 65 is welded with the top of the U-shaped rod 7, and the front and back movement and the up and down movement of the U-shaped rod 7 and the testing component 8 are realized through the arrangement of the first hydraulic cylinder 61, the second guide rod 63 and the second guide rod 65, so that a testing head 85 on the testing component 8 can be contacted with a semiconductor product for testing;
the test assembly 8 comprises a sliding sleeve 81, the sliding sleeve 81 is arranged on the surface of the U-shaped rod 7 in a sliding sleeved mode, a fastening bolt 82 is embedded and connected on the front thread of the sliding sleeve 81, an electric telescopic rod 83 is fixedly connected to the bottom of the sliding sleeve 81 through the bolt, a shell 84 is fixedly connected to the bottom of the electric telescopic rod 83 through the bolt, a test head 85 is arranged in a sliding penetrating mode at the bottom of the shell 84, a square 86 is fixedly connected to the top of the test head 85, a second spring 87 is movably sleeved on the top of the surface of the test head 85, two ends of the second spring 87 are fixedly connected with one side of the square 86 and the inner wall of the shell 84 respectively, and a certain buffer space is reserved after the test head 85 is contacted with pins on a semiconductor product through the second spring 87, meanwhile the test head 85 cannot be separated from the pins, and damage to the semiconductor product caused by the test assembly 8 which moves down excessively is prevented;
the material receiving and distributing assembly 9 comprises an L-shaped plate 91, the bottom of the L-shaped plate 91 is fixedly connected with the right side of the top of the base 1 through bolts, a sliding rod 92 is arranged at the top of the L-shaped plate 91 in a sliding penetrating mode, a material receiving frame 93 is fixedly connected to the top of the sliding rod 92 through bolts, a spring III 94 is movably sleeved on the surface of the sliding rod 92, two ends of the spring III 94 are respectively fixedly connected with one side of the L-shaped plate 91 and one side of the material receiving frame 93, a vibration motor 95 is fixedly connected to the bottom of the material receiving frame 93 through bolts, a motor II 96 is fixedly connected to the right side of the bottom of the material receiving frame 93 through bolts, a rotating shaft of the motor II 96 penetrates through the material receiving frame 93 and is fixedly connected with a guide plate 97, the vibration motor 95 is arranged, so that the material receiving frame 93 can vibrate, a semiconductor product falling onto the cushion 13 can be slowly vibrated, and the semiconductor product is prevented from being accumulated on the cushion 13 and cannot fall down to affect normal use;
the detection assembly 12 comprises a first short plate 121, the back surface of the first short plate 121 is fixedly connected with the front surface of the vertical plate 5 through a bolt, a transmitter 122 is fixedly arranged at the bottom of the first short plate 121, the front surface of the vertical plate 5 is fixedly connected with a second short plate 123 through a bolt, a receiver 124 is fixedly arranged at the top of the second short plate 123, and detection feedback is realized when a semiconductor product in the fixed assembly 4 moves to the lower part of the test assembly 8 through arranging the first short plate 121, the transmitter 122, the second short plate 123 and the receiver 124, and the stop of the transmission assembly 3 is controlled under the action of the peripheral controller, and then the semiconductor product is tested;
the bottom fixedly connected with blotter 13 of receiving the material frame 93 inner chamber, the bottom fixedly connected with limiting plate of slide bar 92 through setting up blotter 13, carries out buffer protection to the semiconductor product that the unloading was accomplished in the test drops receiving the material frame 93, prevents that the semiconductor product from damaging, through setting up the limiting plate, carries out spacingly to slide bar 92, avoids its in-process that reciprocates to break away from L template 91.
The application method of the semiconductor product testing jig with stable positioning comprises the following steps:
a) The device is externally connected with a power supply and a controller through a wire, an iron block 45 on a left fixed component 4 at the top of the transmission belt 32 is pulled to enable a square rod 42 and a clamping plate 43 to move, a first spring 44 is compressed to place a semiconductor product in a placing box 41, the clamping plate 43 is tightly contacted with the semiconductor product under the resilience force of the first spring 44 by loosening the iron block 45, so that the semiconductor product is stably positioned, the operation of a first motor 33 is controlled to enable a roller 31 connected with the motor to rotate, the transmission belt 32 is further enabled to rotate, and the fixed semiconductor product is conveyed to the lower part of a testing component 8;
b) When the light beam emitted by the emitter 122 passes through the through hole on the transmission belt 32 and is received by the receiver 124, the semiconductor product is just transmitted and moved to the testing position, the first motor 33 is controlled to be closed, the second hydraulic cylinder 64 is controlled to be stretched, the U-shaped rod 7 and the testing component 8 are moved downwards under the guiding and limiting action of the second guide rod 65, the testing head 85 can be contacted with pins of the semiconductor product for testing, and a certain buffer space is reserved after the testing head 85 is contacted with the pins on the semiconductor product under the action of the second spring 87, meanwhile, the testing head 85 cannot be separated from the pins, and the damage to the semiconductor product caused by the excessive downward movement of the testing component 8 is prevented;
c) After the test is finished, controlling the operation of the first motor 33 to move out of the lower part of the test assembly 8 so as to perform continuity test, controlling the electromagnet 11 to be electrified, when the fixed assembly 4 moves to the right end of the device, generating suction force by the electrified electromagnet 11 to pull the iron block 45, enabling the clamping plate 43 to move, enabling the inclined semiconductor product to drop onto the receiving and distributing assembly 9, discharging the qualified product from the rear side on the right side of the receiving frame 93, and controlling the operation of the second motor 96 to enable the guide plate 97 to rotate when the unqualified product is detected, and discharging the unqualified product falling onto the receiving frame 93 from the front side on the right side;
d) Through the operation of control vibrating motor 95, under the effect of spring three 94 and slide bar 92 buffering direction, make connect material frame 93 shake, will fall the semiconductor product on the blotter 13 and shake slowly, prevent that semiconductor product from piling up unable whereabouts on the blotter 13 and influencing normal use.
To sum up: this firm semiconductor product test fixture of location cooperates through transmission subassembly 3, fixed subassembly 4, riser 5, adjusting part 6, U type pole 7, test subassembly 8, material receiving reposition of redundant personnel subassembly 9, connecting plate 10, electro-magnet 11 and detection subassembly 12, has solved because the electro-magnet needs to be connected the circular telegram side with the wire and can produce magnetism, and the conveyer box constantly rotates on the drive belt can lead to the wire to twine, can't satisfy the demand of use, can not shunt the problem of discharging the semiconductor product that tests qualified or unqualified.
Claims (8)
1. The utility model provides a fix a position firm semiconductor product test fixture, includes base (1), its characterized in that: four corners at base (1) top all is through bolt fixedly connected with frame (2), the surface mounting of frame (2) has transmission subassembly (3), the surface mounting of transmission subassembly (3) has fixed subassembly (4), the right rear at base (1) top is through bolt fixedly connected with riser (5), the surface mounting of riser (5) has adjusting part (6), the surface mounting of adjusting part (6) has U type pole (7), the surface mounting of U type pole (7) has test subassembly (8), connect material reposition of redundant personnel subassembly (9) are installed on the right side at base (1) top, the right side of frame (2) on right side is through bolt fixedly connected with connecting plate (10), electro-magnet (11) are installed to the inner wall of connecting plate (10), detection subassembly (12) are installed in the front of riser (5).
2. The firmly positioned semiconductor product testing jig according to claim 1, wherein: the transmission assembly (3) comprises a roller (31), two ends of the roller (31) are movably embedded on one side of the frame (2) through bearings, a transmission belt (32) is connected to the surface of the roller (31) in a transmission mode, a motor (33) is fixedly connected to the back face of the frame (2) on the left rear side through bolts, and a rotating shaft of the motor (33) is fixedly connected with the rear end of the roller (31) on the left side.
3. The firmly positioned semiconductor product testing jig according to claim 1, wherein: the fixed subassembly (4) is including placing box (41), one side slip of placing box (41) runs through and is provided with square pole (42), one end fixedly connected with splint (43) that square pole (42) are located the inner chamber of placing box (41), one end fixedly connected with iron plate (45) that square pole (42) are located the outside of placing box (41), the surface activity cover of square pole (42) one end is equipped with spring one (44), the both ends of spring one (44) respectively with one side of splint (43) and the inner wall fixed connection of placing box (41).
4. The firmly positioned semiconductor product testing jig according to claim 1, wherein: the adjusting component (6) comprises a first hydraulic cylinder (61), one side of the first hydraulic cylinder (61) is fixedly connected with the back of the vertical plate (5) through a bolt, the output end of the first hydraulic cylinder (61) penetrates through the vertical plate (5) and is fixedly connected with a supporting plate (62) through the bolt, the front top of the vertical plate (5) is slidably penetrated and provided with a first guide rod (63), the front end of the first guide rod (63) is welded with the back of the supporting plate (62), the top of the supporting plate (62) is fixedly connected with a second hydraulic cylinder (64) through the bolt, the output end of the second hydraulic cylinder (64) penetrates through the supporting plate (62) and is fixedly connected with the top of the U-shaped rod (7), the top of the supporting plate (62) is slidably penetrated and provided with a second guide rod (65), and the bottom of the second guide rod (65) is welded with the top of the U-shaped rod (7).
5. The firmly positioned semiconductor product testing jig according to claim 1, wherein: the testing assembly (8) comprises a sliding sleeve (81), the sliding sleeve (81) is sleeved on the surface of the U-shaped rod (7) in a sliding manner, a fastening bolt (82) is embedded and connected on the front thread of the sliding sleeve (81), an electric telescopic rod (83) is fixedly connected to the bottom of the sliding sleeve (81) through a bolt, a shell (84) is fixedly connected to the bottom of the electric telescopic rod (83) through the bolt, a testing head (85) is arranged at the bottom of the shell (84) in a sliding manner, a square block (86) is fixedly connected to the top of the testing head (85), a spring II (87) is movably sleeved on the top of the surface of the testing head (85), and two ends of the spring II (87) are fixedly connected with one side of the square block (86) and the inner wall of the shell (84) respectively.
6. The firmly positioned semiconductor product testing jig according to claim 1, wherein: connect material reposition of redundant personnel subassembly (9) include L template (91), the right side fixed connection at the bottom of L template (91) through bolt and base (1) top, the top slip of L template (91) runs through and is provided with slide bar (92), the top of slide bar (92) is through bolt fixedly connected with material frame (93), the surface activity cover of slide bar (92) is equipped with spring three (94), the both ends of spring three (94) respectively with one side fixed connection of L template (91) and material frame (93), the bottom of material frame (93) is through bolt fixedly connected with vibrating motor (95), the right side of material frame (93) bottom is through bolt fixedly connected with motor two (96), the pivot of motor two (96) is through material frame (93) and fixedly connected with baffle (97).
7. The firmly positioned semiconductor product testing jig according to claim 1, wherein: the detection assembly (12) comprises a first short plate (121), the back of the first short plate (121) is fixedly connected with the front of the vertical plate (5) through a bolt, a transmitter (122) is fixedly arranged at the bottom of the first short plate (121), a second short plate (123) is fixedly connected with the front of the vertical plate (5) through a bolt, and a receiver (124) is fixedly arranged at the top of the second short plate (123).
8. The firmly positioned semiconductor product testing jig according to claim 6, wherein: the bottom of the inner cavity of the material receiving frame (93) is fixedly connected with a buffer pad (13), and the bottom of the sliding rod (92) is fixedly connected with a limiting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310109048.5A CN116381437A (en) | 2023-02-14 | 2023-02-14 | Firm semiconductor product test fixture fixes a position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310109048.5A CN116381437A (en) | 2023-02-14 | 2023-02-14 | Firm semiconductor product test fixture fixes a position |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116381437A true CN116381437A (en) | 2023-07-04 |
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ID=86977699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310109048.5A Pending CN116381437A (en) | 2023-02-14 | 2023-02-14 | Firm semiconductor product test fixture fixes a position |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116381437A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117983560A (en) * | 2024-04-07 | 2024-05-07 | 江阴矽捷电子有限公司 | Automatic go up semiconductor test equipment of unloading |
| CN118392751A (en) * | 2024-05-10 | 2024-07-26 | 泰州市建科工程检测有限公司 | Wall body infiltration capability test appearance |
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2023
- 2023-02-14 CN CN202310109048.5A patent/CN116381437A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117983560A (en) * | 2024-04-07 | 2024-05-07 | 江阴矽捷电子有限公司 | Automatic go up semiconductor test equipment of unloading |
| CN117983560B (en) * | 2024-04-07 | 2024-05-28 | 江阴矽捷电子有限公司 | Automatic go up semiconductor test equipment of unloading |
| CN118392751A (en) * | 2024-05-10 | 2024-07-26 | 泰州市建科工程检测有限公司 | Wall body infiltration capability test appearance |
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