CN116343700A - Array substrate and driving method thereof - Google Patents
Array substrate and driving method thereof Download PDFInfo
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- CN116343700A CN116343700A CN202310289860.0A CN202310289860A CN116343700A CN 116343700 A CN116343700 A CN 116343700A CN 202310289860 A CN202310289860 A CN 202310289860A CN 116343700 A CN116343700 A CN 116343700A
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- 239000000758 substrate Substances 0.000 title claims abstract description 188
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 126
- 238000001514 detection method Methods 0.000 claims abstract description 42
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 6
- 230000002238 attenuated effect Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 201000005569 Gout Diseases 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3674—Details of drivers for scan electrodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2320/00—Control of display operating conditions
- G09G2320/04—Maintaining the quality of display appearance
- G09G2320/041—Temperature compensation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Theoretical Computer Science (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
The application discloses array substrate and a driving method thereof relates to the technical field of display, the array substrate adopts GOA design, and comprises a temperature compensation circuit, wherein the temperature compensation circuit comprises a detection component, a heating component and a central control component, the detection component is connected with the array substrate row driving circuit and detects whether the voltage of a scanning signal output by the array substrate row driving circuit is reduced, the heating component is arranged between the substrate and the array substrate row driving circuit, the central control component is connected with the detection component and the heating component, and when the detection component detects that the voltage of the scanning signal output by the array substrate row driving circuit is reduced, the central control component controls the heating component to heat the array substrate row driving circuit. Through the design, the display effect of the product at low temperature can be ensured, so that the reliability of the array substrate row driving circuit and the array substrate at low temperature operation is improved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to an array substrate and a driving method thereof.
Background
With the development of flat panel display technology, high resolution, high contrast, high refresh rate, narrow frame and thinning have become the development trend of flat panel display, and liquid crystal display is still a mainstream product of flat panel display at present; in order to achieve a narrow frame, a slim profile, and a low cost of the liquid crystal panel, GOA (Gate driver On Array, array substrate row driving) technology is widely applied to the display panel.
For some liquid crystal display products of application scenes such as vehicle-mounted industrial control, the liquid crystal display products have higher reliability specifications, and the starting current of a thin film transistor (Thin Film Transistor, TFT) device in a GOA circuit can be reduced at low temperature, so that the voltage of a grid output signal of an array substrate row driving circuit is attenuated and cannot be transmitted step by step, and the display effect is affected.
Disclosure of Invention
The invention aims to provide an array substrate and a driving method thereof, so that the array substrate can work normally under a low-temperature condition, and the reliability of a row driving circuit of the array substrate in low-temperature work is improved.
The application discloses array substrate, array substrate includes the substrate and sets up array substrate row drive circuit on the substrate, array substrate still includes temperature compensating circuit, temperature compensating circuit includes detection component, heating element and well accuse subassembly, detection component with array substrate row drive circuit connects, and detects the voltage of the scanning signal of array substrate row drive circuit output reduces, heating element sets up the substrate with between the array substrate row drive circuit, well accuse subassembly with detection component with heating element connects, works as detection component detects when array substrate row drive circuit output's scanning signal's voltage reduces, well accuse subassembly control heating element heats array substrate row drive circuit.
Optionally, the array substrate row driving circuit includes a driving switch, a source electrode of the driving switch receives a clock signal, a gate electrode of the driving switch receives an input signal, and a drain electrode of the driving switch outputs a scanning signal; the detection assembly comprises an isolating switch and a temperature sensor, wherein the source electrode of the isolating switch is connected with the source electrode of the driving switch, and the grid electrode of the isolating switch is connected with the grid electrode of the driving switch; the grid electrode of the temperature sensor is connected with the drain electrode of the isolating switch, the source electrode of the temperature sensor is connected with the power end of the central control component, the drain electrode of the temperature sensor is connected with one end of the heating component, the other end of the heating component is connected with the judging end of the central control component, and when the judging end detects that the received current or voltage is smaller than the current or voltage of a first threshold signal, the voltage output by the power end is increased; the first threshold signal is the current or voltage received by the determining terminal at a preset temperature.
Optionally, the central control component includes a first comparator and an analog-to-digital converter, a first input end of the first comparator is used as the determining end to receive the current passing through the heating component, a second input end of the first comparator is used for receiving the first threshold signal, and an output end of the first comparator outputs a comparison signal; one end of the analog-to-digital converter is connected with the output end of the first comparator, the other end of the analog-to-digital converter is connected with the power end, and the voltage and the working time increased by the power end are calculated according to the comparison signal.
Optionally, the array substrate further includes an insulating layer, the heating component is disposed on the substrate, the insulating layer is disposed on the heating component, the array substrate row driving circuit, the isolating switch and the temperature sensor are all disposed on the insulating layer, and a drain electrode of the temperature sensor penetrates through the insulating layer and is connected with the heating component.
Optionally, the detection component includes a second comparator, a first input end of the second comparator is connected with an output end of the array substrate row driving circuit, receives a scanning signal, and a second input end of the second comparator receives a second threshold signal; the central control assembly comprises a starting switch, a source electrode of the starting switch is connected with a power line, a grid electrode of the starting switch is connected with the output end of the second comparator, and a drain electrode of the starting switch is connected with the heating assembly; when the voltage of the scanning signal is smaller than that of the second threshold signal, the signal output by the output end of the second comparator controls the starting switch to be opened; the second threshold signal is a scanning signal output by the array substrate row driving circuit at a preset temperature.
Optionally, the array substrate row driving circuit includes a plurality of GOA units, the detection assembly includes a plurality of detection units, the detection units are connected with the GOA units in a one-to-one correspondence manner, and respectively detect whether the voltage of the scanning signal output by each GOA unit is reduced; the detection units are connected with the heating assembly, and the orthographic projection of the array substrate row driving circuit on the substrate is positioned in a range surrounded by orthographic projection of the heating assembly on the substrate; when the voltage reduction of the scanning signals output by at least one GOA unit is detected, the central control component controls the heating component to heat the array substrate row driving circuit.
Optionally, the array substrate row driving circuit includes a plurality of GOA units, the detection assembly includes a plurality of detection units, the detection units are connected with the GOA units in a one-to-one correspondence manner, and respectively detect whether the voltage of the scanning signal output by each GOA unit is reduced; the heating assembly comprises a plurality of heating units, the heating units are connected with the detection units in a one-to-one correspondence manner, and the orthographic projection of the heating units on the substrate is overlapped with the orthographic projection of the corresponding GOA units on the substrate; when the voltage of the scanning signal output by the GOA unit is reduced, the central control component controls the corresponding heating unit to heat the array substrate row driving circuit.
Optionally, the heating component comprises heating resistors, and the heating resistors are arranged in an arcuate shape.
The application also discloses a driving method of the array substrate, which is used for driving the array substrate, and comprises the following steps:
the array substrate row driving circuit outputs scanning signals;
detecting whether the voltage of a scanning signal output by the array substrate row driving circuit is reduced or not; and
when the voltage of the scanning signal output by the array substrate row driving circuit is detected to be reduced, the central control component controls the heating component to heat the array substrate row driving circuit.
Optionally, the step of detecting whether the voltage of the scanning signal output by the array substrate row driving circuit is reduced includes:
isolating an independent signal synchronous with the scanning signal through the isolating switch; and
and continuously receiving a power supply signal through a source electrode of the temperature sensor, enabling a grid electrode of the temperature sensor to receive the independent signal, enabling a drain electrode of the temperature sensor to output a heating signal to a heating component below the array substrate row driving circuit, and detecting the power supply signal and the heating signal.
According to the array substrate, the temperature compensation circuit is additionally arranged in the array substrate, when the temperature is low, so that the starting current of the thin film transistor in the array substrate row driving circuit is reduced, and the voltage of a scanning signal output by the array substrate row driving circuit is reduced, a central control component in the temperature compensation circuit can control a heating component between the array substrate row driving circuit and the substrate to heat the array substrate row driving circuit, so that the starting current of the thin film transistor is improved, the voltage of the scanning signal output by the array substrate row driving circuit is increased, the display effect of a product at low temperature is ensured, and the reliability of the array substrate row driving circuit and the array substrate at low temperature is improved; in addition, the heating component is directly arranged between the substrate and the array substrate row driving circuit, namely below the array substrate row driving circuit, so that the array substrate row driving circuit can be directly heated, and a good heating effect can be ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. In the drawings:
FIG. 1 is a schematic block diagram of an array substrate provided herein;
fig. 2 is a schematic circuit diagram of an array substrate according to a first embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an array substrate according to a first embodiment of the present disclosure;
fig. 4 is a schematic plan view of an array substrate according to a first embodiment of the present disclosure;
FIG. 5 is a schematic diagram of an array substrate according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of an array substrate according to another embodiment of the present disclosure;
fig. 7 is a flowchart of a driving method of an array substrate according to a first embodiment of the present disclosure;
FIG. 8 is a detailed flow chart based on FIG. 7;
fig. 9 is a schematic circuit diagram of an array substrate according to a second embodiment of the present disclosure;
fig. 10 is a circuit schematic diagram of an array substrate according to a third embodiment of the present application.
10, an array substrate; 100. a substrate; 200. an insulating layer; 300. an array substrate row driving circuit; 310. a drive switch; 320. a GOA unit; 400. a temperature compensation circuit; 410. a detection assembly; 411. an isolating switch; 412. a temperature sensor; 413. a second comparator; 420. a heating assembly; 421. a heating unit; 430. a central control assembly; 431. a power supply terminal; 432. a determination terminal; 433. a first comparator; 434. an analog-to-digital converter; 435. starting a switch; 440. and a power supply line.
Detailed Description
It should be understood that the terminology, specific structural and functional details disclosed herein are merely representative for purposes of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. In addition, terms of the azimuth or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are described based on the azimuth or relative positional relationship shown in the drawings, are merely for convenience of description of the present application, and do not indicate that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application.
The present application is described in detail below with reference to the attached drawings and alternative embodiments.
As shown in fig. 1, the present application provides an array substrate 10, where the array substrate 10 is a part of a display panel, and adopts a GOA design, specifically includes a substrate 100 and an array substrate row driving circuit 300 disposed on the substrate 100, where the array substrate row driving circuit 300 includes a driving switch 310, a source electrode of the driving switch 310 receives a clock signal, a gate electrode of the driving switch 310 receives an input signal, and a drain electrode of the driving switch 310 outputs a scan signal with a scan line on the array substrate 10 to drive a corresponding scan line.
The array substrate 10 further includes a temperature compensation circuit 400, the temperature compensation circuit 400 includes a detection component 410, a heating component 420, and a central control component 430, the detection component 410 is connected to the array substrate row driving circuit 300 and detects whether the voltage of the scanning signal output by the array substrate row driving circuit 300 is reduced, the heating component 420 is disposed between the substrate 100 and the array substrate row driving circuit 300, the central control component 430 is connected to the detection component 410 and the heating component 420, and when the detection component 410 detects that the voltage of the scanning signal output by the array substrate row driving circuit 300 is reduced, the central control component 430 controls the heating component 420 to heat the array substrate row driving circuit 300.
According to the array substrate, the temperature compensation circuit 400 is additionally arranged in the array substrate 10, when the temperature is low, so that the starting current of the thin film transistor in the array substrate row driving circuit 300 is reduced, and the voltage of the scanning signal output by the array substrate row driving circuit 300 is reduced, the central control component 430 in the temperature compensation circuit 400 can control the heating component 420 between the array substrate row driving circuit 300 and the substrate 100 to heat the array substrate row driving circuit 300, so that the starting current of the thin film transistor is improved, the voltage of the scanning signal output by the array substrate row driving circuit 300 is increased, the display effect of a product at low temperature is ensured, and the reliability of the array substrate row driving circuit 300 and the array substrate 10 at low temperature is improved; in addition, the heating component 420 is directly arranged between the substrate 100 and the array substrate row driving circuit 300, that is, below the array substrate row driving circuit 300, so that the array substrate row driving circuit 300 can be directly heated, and a good heating effect can be ensured.
For a specific design of the temperature compensation circuit 400, the present application provides the following embodiments:
embodiment one:
as shown in fig. 2, fig. 2 is a circuit schematic diagram of an array substrate provided in the first embodiment of the present application, and it should be noted that the array substrate row driving circuit 300 in fig. 2 is an exemplary GOA structure, and may be replaced by a 4T1C structure, which does not affect the normal use of the temperature compensation circuit 400 in the present application.
As a first embodiment of the present application, the detection component 410 provided in the embodiment of the present application includes an isolating switch 411 and a temperature sensor 412, where a source of the isolating switch 411 is connected to a source of the driving switch 310, and a gate of the isolating switch 411 is connected to a gate of the driving switch 310, so that a drain of the isolating switch 411 outputs a synchronous signal with a drain of the driving switch 310. The source of the driving switch 310 is connected to the CLK signal line, and receives a clock signal. The isolating switch 411 is isolated from the signal output by the driving switch 310, so as to avoid increasing the output load of the corresponding line scanning signal and prevent the display effect from being affected when the heating circuit fails. The isolating switch 411 may be connected to the same clock signal as the driving switch 310, or may be connected to a different clock signal, or by adjusting the size of the isolating switch 411, the isolating switch 411 is prevented from increasing the load of the clock signal.
The temperature sensor 412 is a general IC temperature sensor 412, a gate of the temperature sensor 412 is connected to a drain of the isolating switch 411, when the driving switch 310 outputs a signal, the isolating switch 411 synchronously outputs a voltage signal to the temperature sensor 412, and a source of the temperature sensor 412 is connected to a power supply end 431 of the central control component 430. The central control component 430 can be combined on a hard brush circuit board of the display product, and can also be independently used as an independent driving chip to realize the display product; the power supply 431 continuously outputs a voltage signal to the source of the temperature sensor 412, and the power supply 431 may be connected to a standby power supply additionally provided in the display product or to an original power supply of the display product.
The temperature sensor 412 may change the opening degree according to the fluctuation of the voltage signal received by the gate thereof, for example, when the signal output by the isolating switch 411 is attenuated, the opening degree of the temperature sensor 412 may be reduced, so that the voltage output by the temperature sensor 412 may be reduced, i.e., the output voltage is smaller than the received voltage.
The drain electrode of the temperature sensor 412 is connected to one end of the heating component 420, the other end of the heating component 420 is connected to the determining end 432 of the central control component 430, and when the determining end 432 detects that the received current or voltage is smaller than the current or voltage of the first threshold signal, the voltage output by the power supply end 431 is increased; the first threshold signal is the magnitude of the current or the voltage received by the determining terminal 432 at the preset temperature. Wherein the preset temperature is normal temperature, generally within the range of 10-30 ℃,
specifically, the central control component 430 includes a first comparator 433 and an analog-to-digital converter 434, where a first input end of the first comparator 433 is used as the determining end 432 to receive the current signal a passing through the heating component 420, a second input end of the first comparator 433 is used to receive the first threshold signal b, and an output end of the first comparator 433 outputs a comparison signal c; one end of the analog-to-digital converter 434 is connected to the output end of the first comparator 433, and the other end is connected to the power supply 431, and calculates the voltage magnitude and the operating time increased by the power supply 431 according to the comparison signal.
The operation module in the central control unit 430 controls the voltage output by the power supply 431 and the time for the power supply 431 to continuously output the voltage according to the calculation result of the analog-to-digital converter 434, so as to increase the current passing through the heating unit 420, so that the heating unit 420 heats up until the heating unit 420 heats up the array substrate row driving circuit 300 to be able to be driven normally, and at this time, the scanning signal Gout is recovered to be normal; then, the temperature sensor 412 does not decrease the opening degree, the first comparator 433 determines that the received current signal a is approximately equal to the first threshold signal b, and the feedback is sent to the analog-to-digital converter 434 to restore the normal voltage of the power source 431, so that the heating component 420 stops heating to save power consumption.
It should be noted that, when the array substrate row driving circuit 300 is heated to the normal driving, the voltage output from the power source terminal 431 is very small, and the heating element 420 is hardly heated.
As shown in fig. 3, for the heating element 420, the heating element 420 is disposed directly under the array substrate row driving circuit 300, specifically, the array substrate 10 further includes an insulating layer 200, the heating element 420 is disposed on the substrate 100, the insulating layer 200 is disposed on the heating element 420, the array substrate row driving circuit 300, the isolating switch 411 and the temperature sensor 412 are all disposed on the insulating layer 200, and a drain electrode of the temperature sensor 412 penetrates through the insulating layer 200 and is connected with the heating element 420.
The heating element 420 may be a plate-shaped heating resistor, a wire-shaped heating resistor, or other patterns.
As a specific embodiment, as shown in fig. 4, the heating resistors are arranged in an arcuate shape, so that not only the uniform heating effect on the array substrate row driving circuit 300 can be ensured, but also the phenomenon that the normal operation of other devices is affected due to the excessively high temperature of the heating assembly 420 after operation can be avoided.
In addition, the heating unit 420 may be formed as a whole, and the heating unit 420 heats the range of the entire array substrate row driving circuit 300 at the same time; the heating unit 420 may be formed as a plurality of separate parts, and may individually heat the partial array substrate row driving circuit 300.
As one embodiment, as shown in fig. 5, the array substrate row driving circuit 300 includes a plurality of GOA units 320, and each GOA unit 320 may drive at least one row of scan lines; the detecting assembly 410 includes a plurality of detecting units, which are connected to the GOA units 320 in a one-to-one correspondence, and respectively detect whether the voltage of the scanning signal output by each GOA unit 320 is reduced; the detection units are connected with the heating assembly 420, and the orthographic projection of the array substrate row driving circuit 300 on the substrate 100 is positioned in a range surrounded by the orthographic projection of the heating assembly 420 on the substrate 100; when detecting that the voltage of the scanning signal outputted from at least one GOA unit 320 is reduced, the central control unit 430 controls the heating unit 420 to heat the array substrate row driving circuit 300.
When the heating elements 420 are arranged in the present state, the range enclosed by the heating elements 420 is the area where the extension lines of the outermost wires of the heating elements 420 are connected.
In this embodiment, since the scan lines are scanned line by line, when the external temperature is low, and the on current of the driving switch 310 in the array substrate line driving circuit 300 is reduced, each detection unit detects the reduction of the scan signal voltage output by the corresponding GOA unit 320, so that the heating element 420 needs to maintain the heating state no matter which line of scan line is scanned, so as to continuously heat the array substrate line driving circuit 300, ensure the heating efficiency, and avoid the situation that the state of the heating element 420 needs to be frequently switched when scanning different lines of scan lines.
As another embodiment, as shown in fig. 6, the array substrate row driving circuit 300 includes a plurality of GOA units 320, and each GOA unit 320 may drive at least one row of scan lines; the detecting assembly 410 includes a plurality of detecting units, which are connected to the GOA units 320 in a one-to-one correspondence, and respectively detect whether the voltage of the scanning signal output by each GOA unit 320 is reduced; the heating assembly 420 includes a plurality of heating units 421, the heating units 421 are connected to the detecting units in a one-to-one correspondence, and the front projection of the heating units 421 on the substrate 100 overlaps with the front projection of the corresponding GOA units 320 on the substrate 100; when the voltage of the scanning signal output by the GOA unit 320 decreases, the central control unit 430 controls the corresponding heating unit 421 to heat the corresponding GOA unit 320 in the array substrate row driving circuit 300.
In this embodiment, each heating unit 421 individually heats the area where the GOA unit 320 is located, when the driving switch 310 in a part of GOA units 320 in the array substrate row driving circuit 300 is cooled to reduce the on current, only the corresponding heating unit 421 needs to be started, and all the heating units 421 do not need to be started, so that the problem that the service life of the device is affected by overheating due to heating the unnecessary GOA unit 320 area is avoided, and by adopting the targeted heating mode of this embodiment, energy consumption can be saved.
Correspondingly, as shown in fig. 7, the embodiment of the present application further discloses a driving method of the array substrate, which is used for driving the above-mentioned array substrate 10, and the driving method includes the steps of:
s1: the array substrate row driving circuit outputs scanning signals;
s2: detecting whether the voltage of a scanning signal output by the array substrate row driving circuit is reduced or not;
s3: when the voltage of the scanning signal output by the array substrate row driving circuit is detected to be reduced, the central control component controls the heating component to heat the array substrate row driving circuit.
As shown in fig. 8, in step S2, specifically, the method includes:
s21: isolating an independent signal synchronous with the scanning signal through the isolating switch;
s22: and continuously receiving a power supply signal through a source electrode of the temperature sensor, enabling a grid electrode of the temperature sensor to receive the independent signal, enabling a drain electrode of the temperature sensor to output a heating signal to a heating component below the array substrate row driving circuit, and detecting the power supply signal and the heating signal.
Wherein the heating signal and the power signal are current or voltage signals, and when the heating signal is detected to be smaller than the power signal, it is determined that the voltage of the scanning signal output by the array substrate row driving circuit 300 is reduced, so that the opening degree of the temperature sensor 412 is reduced.
Embodiment two:
as shown in fig. 9, as a second embodiment provided in the present application, in this embodiment, the detection component 410 includes a disconnecting switch 411 and a second comparator 413, and in this embodiment, the specific design of the disconnecting switch 411 is the same as the design of the disconnecting switch 411 in the first embodiment, and will not be repeated herein. A first input end of the second comparator 413 is connected with the drain electrode of the isolating switch 411, and receives a scanning signal m, and a second input end of the second comparator 413 receives a second threshold signal n; the central control assembly 430 comprises a start switch 435, a source electrode of the start switch 435 is connected with a power line 440, a gate electrode of the start switch 435 is connected with an output end of the second comparator 413, a drain electrode of the start switch 435 is connected with the heating assembly 420, and the other end of the heating assembly 420 is grounded; when the voltage of the scan signal is smaller than the voltage of the second threshold signal, the signal output by the output end of the second comparator 413 controls the start switch 435 to be turned on; the second threshold signal is a scan signal output by the array substrate row driving circuit 300 at a preset temperature.
In this embodiment, when the external temperature is low, resulting in a decrease of the on current in the array substrate row driving circuit 300, so that the signal output by the array substrate row driving circuit 300 is attenuated, the second comparator 413 determines that the scanning signal is smaller than the second threshold signal, and further the start switch 435 is turned on, at this time, the heating component 420 turns on the voltage provided by the power line 440, and starts to perform the heating operation to heat the array substrate row driving circuit 300. Compared to the first embodiment, in the embodiment of the present application, the second comparator 413 determines whether the scan signal is smaller than the second threshold signal, and only when the scan signal output by the array substrate row driving circuit 300 is attenuated, the heating element 420 is turned on, so as to increase the service lives of the start switch 435 and the heating element 420, and facilitate improving the safety performance of the array substrate 10.
For the matching manner of the heating element 420 and the GOA unit 320 in the array substrate row driving circuit 300, reference may be made to the specific design in the first embodiment. The types of the second comparator 413 and the start switch 435 are subject to the above functions, and are not described in detail herein.
Embodiment III:
as shown in fig. 10, as a third embodiment provided in the present application, in the present application embodiment, the array substrate row driving circuit 300 includes a plurality of GOA units 320, each GOA unit 320 is correspondingly provided with a disconnecting switch 411 and a temperature sensor 412, the connection between the disconnecting switch 411 and the temperature sensor 412, and the connection between the disconnecting switch 411 and the GOA unit 320 are described with reference to the first embodiment. Wherein a plurality of the temperature sensors 412 are arranged in parallel, and share a heating resistor 420 and a central control component 430; the design of the heating resistor 420 and the central control component 430 refers to the description in the first embodiment. With the above design, the local GOA units 320 can be continuously detected, and the heating resistor 420 can be continuously heated during the continuous multi-line scanning, so as to further improve the heating effect of the array substrate.
In addition, the inventive concept of the present application may form a very large number of embodiments, but the application documents are limited in size and cannot be listed one by one, so that on the premise of no conflict, the above-described embodiments or technical features can be arbitrarily combined to form new embodiments, and after the embodiments or technical features are combined, the original technical effects will be enhanced.
The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.
Claims (10)
1. An array substrate, includes the substrate and sets up array substrate row drive circuit on the substrate, its characterized in that, array substrate still includes temperature compensation circuit, temperature compensation circuit includes:
the detection component is connected with the array substrate row driving circuit and detects whether the voltage of the scanning signal output by the array substrate row driving circuit is reduced or not;
the heating component is arranged between the substrate and the array substrate row driving circuit; and
and the central control component is connected with the detection component and the heating component, and when the detection component detects that the voltage of the scanning signal output by the array substrate row driving circuit is reduced, the central control component controls the heating component to heat the array substrate row driving circuit.
2. The array substrate of claim 1, wherein the array substrate row driving circuit comprises a driving switch, a source of the driving switch receives a clock signal, a gate of the driving switch receives an input signal, and a drain of the driving switch outputs a scan signal;
the detection assembly includes:
the source electrode of the isolating switch is connected with the source electrode of the driving switch, and the grid electrode of the isolating switch is connected with the grid electrode of the driving switch; and
the grid electrode of the temperature sensor is connected with the drain electrode of the isolating switch, the source electrode of the temperature sensor is connected with the power end of the central control component, the drain electrode of the temperature sensor is connected with one end of the heating component, the other end of the heating component is connected with the judging end of the central control component, and when the judging end detects that the received current or voltage is smaller than the current or voltage of a first threshold signal, the voltage output by the power end is increased;
the first threshold signal is the current or voltage received by the determining terminal at a preset temperature.
3. The array substrate of claim 2, wherein the central control assembly comprises a first comparator and an analog-to-digital converter, a first input of the first comparator receiving the current through the heating assembly as the determination terminal, a second input of the first comparator receiving the first threshold signal, an output of the first comparator outputting a comparison signal;
one end of the analog-to-digital converter is connected with the output end of the first comparator, the other end of the analog-to-digital converter is connected with the power end, and the voltage and the working time increased by the power end are calculated according to the comparison signal.
4. The array substrate of claim 2, further comprising an insulating layer disposed on the substrate, the insulating layer disposed on the heating element, the array substrate row driving circuit, the isolation switch, and the temperature sensor disposed on the insulating layer, a drain of the temperature sensor penetrating through the insulating layer to connect with the heating element.
5. The array substrate of claim 1, wherein the detection assembly comprises a second comparator, a first input of the second comparator is connected with an output of the array substrate row driving circuit, receives a scan signal, and a second input of the second comparator receives a second threshold signal;
the central control assembly comprises a starting switch, a source electrode of the starting switch is connected with a power line, a grid electrode of the starting switch is connected with the output end of the second comparator, and a drain electrode of the starting switch is connected with the heating assembly;
when the voltage of the scanning signal is smaller than that of the second threshold signal, the signal output by the output end of the second comparator controls the starting switch to be opened;
the second threshold signal is a scanning signal output by the array substrate row driving circuit at a preset temperature.
6. The array substrate of claim 1, wherein the array substrate row driving circuit comprises a plurality of GOA units, the detection assembly comprises a plurality of detection units, the detection units are connected with the GOA units in a one-to-one correspondence manner, and the detection units respectively detect whether the voltage of the scanning signal output by each GOA unit is reduced;
the detection units are connected with the heating assembly, and the orthographic projection of the array substrate row driving circuit on the substrate is positioned in a range surrounded by orthographic projection of the heating assembly on the substrate;
when the voltage reduction of the scanning signals output by at least one GOA unit is detected, the central control component controls the heating component to heat the array substrate row driving circuit.
7. The array substrate of claim 1, wherein the array substrate row driving circuit comprises a plurality of GOA units, the detection assembly comprises a plurality of detection units, the detection units are connected with the GOA units in a one-to-one correspondence manner, and the detection units respectively detect whether the voltage of the scanning signal output by each GOA unit is reduced;
the heating assembly comprises a plurality of heating units, the heating units are connected with the detection units in a one-to-one correspondence manner, and the orthographic projection of the heating units on the substrate is overlapped with the orthographic projection of the corresponding GOA units on the substrate;
when the voltage of the scanning signal output by the GOA unit is reduced, the central control component controls the corresponding heating unit to heat the array substrate row driving circuit.
8. The array substrate of claim 6 or 7, wherein the heating assembly comprises heating resistors arranged in an arcuate line.
9. A driving method of an array substrate for driving the array substrate according to any one of claims 1 to 8, comprising the steps of:
the array substrate row driving circuit outputs scanning signals;
detecting whether the voltage of a scanning signal output by the array substrate row driving circuit is reduced or not; and
when the voltage of the scanning signal output by the array substrate row driving circuit is detected to be reduced, the central control component controls the heating component to heat the array substrate row driving circuit.
10. The method of driving an array substrate according to claim 9, wherein the step of detecting whether the voltage of the scan signal output from the array substrate row driving circuit is reduced, comprises:
isolating an independent signal synchronous with the scanning signal through the isolating switch; and
and continuously receiving a power supply signal through a source electrode of the temperature sensor, enabling a grid electrode of the temperature sensor to receive the independent signal, enabling a drain electrode of the temperature sensor to output a heating signal to a heating component below the array substrate row driving circuit, and detecting the power supply signal and the heating signal.
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